Crystal oscillator test method, system, and computer-readable storage medium

Abstract

The embodiment of the application discloses a crystal oscillator testing method, system and computer readable storage medium, which can cope with the testing of various types of crystal oscillators, has high compatibility, and has simple system architecture and low implementation difficulty. The crystal oscillator testing system comprises a control device, a first electrically controlled switch, an oscillator chip and a crystal resonator. The control device is connected with the first end of the first electrically controlled switch and also connected with the oscillator chip. The oscillator chip is connected with the second end of the first electrically controlled switch. The crystal resonator is connected with the third end of the first electrically controlled switch. When the first electrically controlled switch is turned off, the first end and the second end are turned on, and the second end is disconnected with the third end. When the first electrically controlled switch is turned on, the first end and the second end are disconnected, and the second end is turned on with the third end. The control device can control the first electrically controlled switch to be turned on, control the pin corresponding to the test item in the oscillator chip, and obtain the test data corresponding to the test item according to each test item.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor integrated circuit testing technology, and in particular relates to a crystal oscillator testing method, system, and computer-readable storage medium. Background Art

[0002] A crystal oscillator is a device that generates precise and stable clock signals, which can provide stable clock signals for the normal operation of equipment and systems in various fields.

[0003] A crystal oscillator primarily consists of a crystal resonator, an amplifier, and a feedback network. A resonator made of quartz crystal or other crystalline materials experiences a piezoelectric effect under the influence of an electric field, causing the crystal to vibrate. A crystal oscillator utilizes this characteristic to amplify the tiny vibrations caused by the piezoelectric effect within the oscillation circuit, generating a stable frequency output signal. The feedback network then feeds this amplified signal back to the resonator to maintain stable oscillation.

[0004] To ensure the performance and reliability of crystal oscillators, it is usually necessary to test the crystal oscillators to verify whether they meet the design requirements. However, there is currently no effective testing solution for crystal oscillators. Summary of the Invention

[0005] The embodiments of the present application provide a crystal oscillator testing method, system, and computer-readable storage medium, which can handle the testing of various types of crystal oscillators, have high compatibility, and are relatively easy to implement.

[0006] In a first aspect, an embodiment of the present application provides a crystal oscillator testing system, comprising a control device, a first electrically controlled switch, at least one oscillator chip, and a crystal resonator;

[0007] The control device is connected to the first end of the first electronically controlled switch and is also connected to the oscillator chip;

[0008] The oscillator chip is connected to the second end of the first electronically controlled switch;

[0009] The crystal resonator is connected to the third terminal of the first electronically controlled switch;

[0010] When the first electronically controlled switch is turned off, the first end and the second end are connected, and the second end and the third end are disconnected; when the first electronically controlled switch is turned on, the first end and the second end are disconnected, and the second end and the third end are connected;

[0011] The control device is used to: according to each test item, control the pin corresponding to the test item in the oscillator chip, or control the first electronically controlled switch to be closed and control the pin corresponding to the test item in the oscillator chip to obtain test data corresponding to the test item.

[0012] The embodiment of the present application connects the control device to the first end of the first electrically controlled switch, the oscillator chip to the second end of the first electrically controlled switch, and the crystal resonator to the third end of the first electrically controlled switch, thereby controlling the opening and closing of the first electrically controlled switch to control the connection and disconnection of the crystal resonator. In this way, the crystal resonator can be connected or disconnected according to the needs of each test item, and the pins of the oscillator chip can be controlled accordingly to complete the test of each test item of the oscillator chip. In this way, it can cope with the testing of various types of crystal oscillators with high compatibility; and the system architecture is relatively simple and the implementation difficulty is relatively low.

[0013] In some possible implementations of the first aspect, the control device is specifically configured to:

[0014] Perform open and short circuit test control on the pins of the oscillator chip to obtain open and short circuit test data;

[0015] Controlling the oscillator chip to power on, and controlling the enable pin and output pin of the oscillator chip to be in a floating state, to obtain a first leakage current of the signal input pin of the oscillator chip and a second leakage current of the signal output pin of the oscillator chip;

[0016] Control the enable pin to be in a closed state to obtain the third leakage current of the output pin;

[0017] Applying a first voltage between the signal input pin and the signal output pin to obtain a first current between the signal input pin and the signal output pin, and obtaining an equivalent resistance based on the first voltage and the first current;

[0018] Applying a second voltage to the enable pin to obtain a second current of the enable pin, and obtaining a pull-up resistor of the enable pin according to the second voltage and the second current;

[0019] The various test items include pin open and short circuit test, signal input pin and signal output pin leakage current test, output pin leakage current test, equivalent resistance test and pull-up resistance test.

[0020] In this implementation, the control device can control the chip pins corresponding to the test items according to the requirements of the test items to complete the test of the corresponding test items.

[0021] In some possible implementations of the first aspect, the control device is specifically configured to:

[0022] Controlling the first electronically controlled switch to close and enabling the enable pin of the oscillator chip to obtain the dynamic current of the oscillator chip;

[0023] Controlling the first electronically controlled switch to close, and controlling the enable pin of the oscillator chip to put the oscillator chip into sleep mode, and obtaining a sleep current of the oscillator chip;

[0024] Controlling the first electronically controlled switch to be closed, and controlling the signal input pin of the oscillator chip to be at a high level and a low level respectively, to obtain a first voltage of the signal output pin when the signal input pin is at a high voltage, and a second voltage when the signal input pin is at a low voltage;

[0025] Controlling the first electronically controlled switch to close, and enabling the enable pin of the oscillator chip, to obtain the frequency value of the output pin of the oscillator chip;

[0026] The various test items include dynamic current test, sleep current test, signal output pin voltage test and pin frequency value test.

[0027] In this implementation, the control device can control the chip pins corresponding to the test items according to the needs of the test items, and also control the first electrically controlled switch to access the crystal resonator to complete the test of the corresponding test items.

[0028] In some possible implementations of the first aspect, the system further includes an output module corresponding to at least two output signal types; the output module includes a second electronically controlled switch and an output circuit;

[0029] The control device is connected to the fourth terminal of the second electronically controlled switch; the oscillator chip is connected to the fifth terminal of the second electronically controlled switch; and the output circuit is connected to the sixth terminal of the second electronically controlled switch;

[0030] When the second electronically controlled switch is off, the fifth terminal and the fourth terminal are connected, and the fifth terminal and the sixth terminal are disconnected; when the second electronically controlled switch is closed, the fifth terminal and the sixth terminal are connected, and the fifth terminal and the sixth terminal are disconnected;

[0031] When the test item is a dynamic current test, a dormant current test, a signal output pin voltage test, or a pin frequency value test, the control device is also used to:

[0032] The second electronically controlled switch in the target output module is controlled to be closed, where the target output module is an output module determined according to the output signal type of the oscillator chip.

[0033] In this implementation, the test system provided by the embodiments of the present application can select and connect a corresponding output circuit from among a variety of output circuits with output signal types, depending on the output signal type of the oscillator chip. This allows for testing crystal oscillators with various output signal types, further improving system compatibility. Furthermore, the system hardware architecture is simple, making implementation relatively easy.

[0034] In some possible implementations of the first aspect, at least one oscillator chip is on a same wafer, and the wafer is disposed on a probe station;

[0035] Before testing each test item, the control device is also used to: control the probe station to be at a preset temperature.

[0036] In this implementation, the control device can test multiple oscillator chips on the same wafer, enabling wafer-level testing of crystal oscillators. Furthermore, the probe station's three-temperature capability enables three-temperature testing of crystal oscillators.

[0037] In a second aspect, an embodiment of the present application provides a crystal oscillator testing method, which is applied to a control device in a crystal oscillator testing system; the crystal oscillator testing system further includes a first electrically controlled switch, at least one oscillator chip, and a crystal resonator;

[0038] The control device is connected to the first end of the first electrically controlled switch and is also connected to the oscillator chip; the oscillator chip is connected to the second end of the first electrically controlled switch; and the crystal resonator is connected to the third end of the first electrically controlled switch;

[0039] When the first electronically controlled switch is turned off, the first end and the second end are connected, and the second end and the third end are disconnected; when the first electronically controlled switch is turned on, the first end and the second end are disconnected, and the second end and the third end are connected;

[0040] The method includes:

[0041] According to each test item, the pin corresponding to the test item in the oscillator chip is controlled, or the first electronically controlled switch is controlled to be closed and the pin corresponding to the test item in the oscillator chip is controlled to obtain test data corresponding to the test item.

[0042] In some possible implementations of the second aspect, according to each test item, controlling a pin corresponding to the test item in the oscillator chip to obtain test data corresponding to the test item includes:

[0043] Perform open and short circuit test control on the pins of the oscillator chip to obtain open and short circuit test data;

[0044] Controlling the oscillator chip to power on, and controlling the enable pin and output pin of the oscillator chip to be in a floating state, to obtain a first leakage current of the signal input pin of the oscillator chip and a second leakage current of the signal output pin of the oscillator chip;

[0045] Control the enable pin to be in a closed state to obtain the third leakage current of the output pin;

[0046] Applying a first voltage between the signal input pin and the signal output pin to obtain a first current between the signal input pin and the signal output pin, and obtaining an equivalent resistance based on the first voltage and the first current;

[0047] Applying a second voltage to the enable pin to obtain a second current of the enable pin, and obtaining a pull-up resistor of the enable pin according to the second voltage and the second current;

[0048] The various test items include pin open and short circuit test, signal input pin and signal output pin leakage current test, output pin leakage current test, equivalent resistance test and pull-up resistance test.

[0049] In some possible implementations of the second aspect, according to each test item, controlling the first electronically controlled switch to close and controlling the pin corresponding to the test item in the oscillator chip to obtain test data corresponding to the test item includes:

[0050] Controlling the first electronically controlled switch to close and enabling the enable pin of the oscillator chip to obtain the dynamic current of the oscillator chip;

[0051] Controlling the first electronically controlled switch to close, and controlling the enable pin of the oscillator chip to put the oscillator chip into sleep mode, and obtaining a sleep current of the oscillator chip;

[0052] Controlling the first electronically controlled switch to be closed, and controlling the signal input pin of the oscillator chip to be at a high level and a low level respectively, to obtain a first voltage of the signal output pin when the signal input pin is at a high voltage, and a second voltage when the signal input pin is at a low voltage;

[0053] Controlling the first electronically controlled switch to close, and enabling the enable pin of the oscillator chip, to obtain the frequency value of the output pin of the oscillator chip;

[0054] The various test items include dynamic current test, sleep current test, signal output pin voltage test and pin frequency value test.

[0055] In some possible implementations of the second aspect, the crystal oscillator test system further includes an output module corresponding to at least two output signal types; the output module includes a second electronically controlled switch and an output circuit;

[0056] The control device is connected to the fourth terminal of the second electronically controlled switch; the oscillator chip is connected to the fifth terminal of the second electronically controlled switch; and the output circuit is connected to the sixth terminal of the second electronically controlled switch;

[0057] When the second electronically controlled switch is off, the fifth terminal and the fourth terminal are connected, and the fifth terminal and the sixth terminal are disconnected; when the second electronically controlled switch is closed, the fifth terminal and the sixth terminal are connected, and the fifth terminal and the sixth terminal are disconnected;

[0058] When the test item is a dynamic current test, a sleep current test, a signal output pin voltage test, or a pin frequency value test, the method further includes:

[0059] The second electronically controlled switch in the target output module is controlled to be closed, where the target output module is an output module determined according to the output signal type of the oscillator chip.

[0060] In a third aspect, an embodiment of the present application provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements any of the methods of the second aspect described above when executing the computer program.

[0061] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method of any one of the above-mentioned second aspects is implemented.

[0062] In a fifth aspect, an embodiment of the present application provides a computer program product, which, when executed on an electronic device, enables the electronic device to execute any one of the methods described in the second aspect above.

[0063] It can be understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0065] Figure 1 A schematic block diagram of a crystal oscillator testing system provided in an embodiment of the present application;

[0066] Figure 2 A pin diagram of a differential oscillator chip provided in an embodiment of the present application;

[0067] Figure 3 A schematic diagram showing the connection between the relay and the crystal resonator provided in an embodiment of the present application;

[0068] Figure 4 A pin diagram of the oscillator chip provided in an embodiment of the present application;

[0069] Figure 5 Another schematic block diagram of a crystal oscillator testing system provided in an embodiment of the present application;

[0070] Figure 6 An output circuit corresponding to the differential output signal type provided in the embodiment of the present application;

[0071] Figure 7An output circuit corresponding to the differential output signal type provided in the embodiment of the present application;

[0072] Figure 8 An output circuit corresponding to the differential output signal type provided in the embodiment of the present application;

[0073] Figure 9 A schematic block diagram of the test process provided in the embodiment of the present application;

[0074] Figure 10 A schematic block diagram of another test process provided in an embodiment of the present application;

[0075] Figure 11 This is a schematic block diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0076] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0077] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0078] It will also be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0079] As used in this specification and the appended claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0080] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0081] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0082] See also Figure 1 A schematic block diagram of a crystal oscillator testing system provided in an embodiment of the present application is shown. The system may include a control device 11, a first electrically controlled switch 12, at least one oscillator chip 13 and a crystal resonator 14.

[0083] The control device 11 is connected to a first terminal of the first electrically controlled switch 12 and to an oscillator chip 13 . The oscillator chip 13 is connected to a second terminal of the first electrically controlled switch 12 ; and the crystal resonator 14 is connected to a third terminal of the first electrically controlled switch 12 .

[0084] When the first electronically controlled switch 11 is turned off, the first terminal and the second terminal are connected, and the second terminal and the third terminal are disconnected. At this time, the oscillator chip 13 is connected to the control device 11, but the crystal resonator 14 is not connected to the oscillator chip 13, that is, the crystal resonator 14 is not connected and is in a disconnected state.

[0085] When the first electronically controlled switch 11 is closed, the first and second terminals are disconnected, and the second and third terminals are connected. At this time, the crystal resonator 14 is connected to the oscillator chip 13, that is, the crystal resonator 14 is connected. It can be understood that in addition to being connected to the oscillator chip 13 through the first electronically controlled switch 12, the control device 11 is also additionally connected to the oscillator chip 13 to implement relevant control of the oscillator chip 13 (such as enable control, etc.).

[0086] The first electrically controlled switch 11 is opened by default. The control device 11 can control the first electrically controlled switch 11 to close, as required by the test item, so that the first electrically controlled switch 11 changes from an open state to a closed state. When the test item requires access to the crystal resonator 14, the first electrically controlled switch 11 is controlled to close. When the test item does not require access to the crystal resonator 14, the first electrically controlled switch 11 is in the default state, i.e., the open state.

[0087] It should be noted that the crystal oscillator includes a crystal resonator and an oscillator chip. By controlling the first electronically controlled switch 11 to be closed, the crystal resonator 14 and the oscillator chip 13 are connected, and the vibration generated by the crystal resonator 14 can be output through the oscillator chip 13.

[0088] The control device 11 may be an automated test equipment (ATE) or a host computer device that implements similar control functions, which is not limited here.

[0089] The types of crystal oscillators may include baseband oscillators, differential output oscillators, triple overtone oscillators, and voltage controlled oscillators. Depending on the type of crystal oscillator, the oscillator chip 13 may be different accordingly. For example, for a differential output oscillator, the pin diagram of the oscillator chip may be as follows: Figure 2 shown. Figure 2 In the oscillator chip pin diagram shown, the oscillator chip includes pins such as OE, XOUT, XIN, OUTN, OUTP, GND, and VDD. Among them, OE is the enable pin, XOUT is the signal output pin, XIN is the signal input pin, OUTN and OUTP are the differential signal output pins, and GND is the ground pin.

[0090] When the crystal oscillator is not a differential output oscillator but other types of oscillators, the pin diagram of the oscillator chip can be as follows: Figure 2 Similar, still includes OE, XOUT, XIN, GND and VDD pins. But different from Figure 2 , Figure 2 It includes two differential output pins, OUTN and OUTP, while other types of oscillator chips may only have one output pin.

[0091] The first electronically controlled switch 12 may be a relay, or other switching devices capable of achieving similar functions, which is not limited here.

[0092] For example, see Figure 3 This diagram shows the connection diagram of a relay and a crystal resonator provided by an embodiment of the present application. K1 is a certain type of relay, and U1 is a crystal resonator. K1 includes pins 1 through 8. When K1 is open, pins 2 and 3 are connected, and pins 7 and 6 are connected. When K1 is closed, pins 3 and 4 are connected, and pins 5 and 6 are connected. When U1 is connected, K1 is controlled to close; when K1 is open, U1 is not connected.

[0093] When the oscillator chip 13 to be tested is Figure 2 The chip shown in FIG. 1 has a first electrically controlled switch 12. Figure 3 K1, crystal resonator 14 is Figure 3 When U1 is Figure 2 The XOUT and XIN pins in Figure 3 Connect pin 3 and pin 6 of K1, Figure 3 Pins 2 and 7 of K1 are connected to the ATE equipment.

[0094] At this time, K1 is disconnected by default, that is, K1's pins 3 and 4 are not conducting, and pins 5 and 6 are not conducting. When the ATE device needs to be connected to U1, K1 is controlled to close to make pins 3 and 4 conducting, and pins 5 and 6 conducting, so that U1 and Figure 2 The oscillator chip is connected.

[0095] In this case, the first end of the first electronically controlled switch 12 may refer to pins 2 and 7 of K1 , the second end may refer to pins 3 and 6 of K1 , and the third end may refer to pins 4 and 5 of K1 .

[0096] The crystal oscillator test may include multiple test items. For example, it may include one or more of the following test items: pin open and short circuit test, signal input pin and signal output pin leakage current test, output pin leakage current test, equivalent resistance test, pull-up resistance test, dynamic current test, sleep current test, signal output pin voltage test, and pin frequency value test.

[0097] The control device 11 controls the pins corresponding to the test items in the oscillator chip according to each test item, or controls the first electronically controlled switch to be closed and controls the pins corresponding to the test items in the oscillator chip to obtain test data corresponding to the test items.

[0098] That is to say, the control device 11 can control the pins in the oscillator chip accordingly according to the needs of each test item to obtain corresponding test data; or control the first electronically controlled switch to close, and control the pins in the oscillator chip corresponding to the test item to obtain corresponding test data.

[0099] As can be seen above, by connecting the control device to the first end of the first electrically controlled switch, the oscillator chip to the second end of the first electrically controlled switch, and the crystal resonator to the third end of the first electrically controlled switch, the crystal resonator can be controlled to be connected and disconnected by controlling the opening and closing of the first electrically controlled switch. In this way, the crystal resonator can be connected or disconnected as required by each test item, and the pins of the oscillator chip can be controlled accordingly to complete the testing of each test item of the oscillator chip.

[0100] The embodiments of the present application can replace the crystal resonator and / or oscillator chip accordingly according to the test requirements to implement the test of the corresponding type of crystal oscillator. For example, when it is necessary to test a certain type of crystal oscillator, at least one of the crystal resonator and / or oscillator chip can be replaced to form the corresponding type of crystal oscillator, thereby completing the test of the crystal oscillator of that type. In this way, the test system provided by the embodiments of the present application can handle the testing of multiple types of crystal oscillators and has high compatibility; the test system architecture is relatively simple and the implementation difficulty is relatively low.

[0101] Based on the above embodiments, the control device 11 can control the closing of the first electronically controlled switch and control the pin corresponding to the test item in the oscillator chip to obtain the test data corresponding to the test item according to the needs of each test item; or control the pin corresponding to the test item in the oscillator chip to obtain the test data corresponding to the test item.

[0102] Normally, the test items such as pin open and short circuit test, signal input pin and signal output pin leakage current test, output pin leakage current test, equivalent resistance test and pull-up resistance test only need to control the corresponding pins without connecting to the crystal resonator 14.

[0103] At this time, for the test item of the pin open-short circuit test, the control device 11 can perform open-short circuit test control on the pins of the oscillator chip to obtain open-short circuit test data.

[0104] For the test item of leakage current test of signal input pin and signal output pin, the control device 11 can control the oscillator chip to power on, and control the enable pin and output pin of the oscillator chip to be in a floating state, to obtain the first leakage current of the signal input pin of the oscillator chip and the second leakage current of the signal output pin of the oscillator chip.

[0105] For example, in Figure 2 and Figure 3 In the test scenario, Figure 2 After the oscillator chip is powered on, the OE, OUTN, and OUTP pins are left floating, and the leakage current of XIN and XOUT is tested. At this time, the output pins include OUTP and OUTN, XIN is the signal input pin, and XOUT is the signal output pin.

[0106] For the test item of the output pin leakage current test, the control device 11 may control the enable pin to be in a closed state to obtain a third leakage current of the output pin.

[0107] For example, in Figure 2 and Figure 3 In the test scenario, the OE pin is controlled to be closed, and the leakage current of the two output pins OUTP and OUTN is tested.

[0108] For the equivalent resistance test, the control device 11 can apply a first voltage between the signal input pin and the signal output pin, obtain a first current between the signal input pin and the signal output pin, and obtain the equivalent resistance based on the first voltage and the first current.

[0109] The first voltage is a small voltage, that is, the first voltage is a voltage lower than a certain threshold.

[0110] For example, in Figure 2 and Figure 3 In the test scenario, a small voltage is applied between the XIN and XOUT pins, and the current between the two pins is measured. Based on the applied voltage and the measured current, the equivalent resistance can be calculated using R=U / I.

[0111] For the pull-up resistance test, the control device 11 may apply a second voltage to the enable pin to obtain a second current of the enable pin, and obtain the pull-up resistance of the enable pin according to the second voltage and the second current.

[0112] For example, in Figure 2 and Figure 3 In the test scenario, a voltage is applied to the OE pin and the current is measured. Based on the applied voltage and the measured current, the pull-up resistance of the OE pin can be calculated using R=U / I.

[0113] For some test items, it is necessary not only to control the pins of the oscillator chip to be tested, but also to control the first electronically controlled switch 12 to be closed to access the crystal resonator 14. In this case, the control device 11 not only needs to control the corresponding pins of the oscillator chip, but also controls the first electronically controlled switch 12 to be closed accordingly.

[0114] Exemplarily, the test items that need to control the pins of the oscillator chip and the first electronically controlled switch 12 may include: a dynamic current test, a sleep current test, a signal output pin voltage test, and a pin frequency value test.

[0115] At this time, for the test item of dynamic current test, the control device 11 can control the first electronically controlled switch to be closed, and enable the enable pin of the oscillator chip to obtain the dynamic current of the oscillator chip.

[0116] For the sleep current test, the control device 11 may control the first electronically controlled switch to be closed, and control the enable pin of the oscillator chip to put the oscillator chip into sleep mode, thereby obtaining the sleep current of the oscillator chip.

[0117] Among them, the current test can be performed on the VDD pin of the oscillator chip to obtain the dynamic current and sleep current.

[0118] For the test item of the signal output pin voltage test, the control device 11 can control the first electronically controlled switch to be closed, and control the signal input pin of the oscillator chip to be at a high level and a low level respectively, to obtain the first voltage of the signal output pin when the signal input pin is at a high voltage, and the second voltage when the signal input pin is at a low voltage.

[0119] For example, the XIN pin is controlled to be a high voltage, and the first voltage VOH on the XOUT pin is tested at this time; the XIN pin is controlled to be a low voltage, and the second voltage VOL on the XIN pin is tested.

[0120] For the pin frequency value test, the control device 11 can control the first electronically controlled switch to close and enable the enable pin of the oscillator chip to obtain the frequency value of the output pin (such as the OUTN and OUTP pins) of the oscillator chip.

[0121] As can be seen from the above, through the test system provided in the embodiment of the present application, the control device can control the chip pins corresponding to the test items according to the needs of the test items, and also control the first electrically controlled switch to access the crystal resonator to complete the test of the corresponding test items.

[0122] Some types of crystal oscillators may include at least two output signal types. For example, a differential output oscillator may include three output signal types: LVPECL, HCSL, and LVDS. Some types of crystal oscillators may only have one output signal type.

[0123] For crystal oscillators with only one type of output signal, there is no need to connect to the output circuit. The test of each test item can be completed directly based on the pins of the oscillator chip.

[0124] For crystal oscillators with at least two types of output signals, it is necessary to select the corresponding type of output circuit according to the output signal type of the oscillator chip, and connect the output pin of the oscillator chip to the corresponding type of output circuit before completing the test of certain test items.

[0125] For example, see Figure 4 The pin diagram of an oscillator chip shown in FIG. 1 shows a pin diagram of an oscillator chip, which has only one OUT pin (output pin). Figure 2 The differential oscillator chip includes two output pins, OUTP and OUTN.

[0126] against Figure 4 The oscillator chip shown can complete the test of each test item without connecting to the output current. Figure 2The differential oscillator chip shown in the figure needs to be connected to the corresponding type of output circuit to complete the test of dynamic current test, sleep current test, signal output pin voltage test or pin frequency value test when testing these test items. Figure 2 When the output signal type of the differential oscillator chip is LVPECL, it is necessary to connect to the differential output circuit corresponding to LVPECL; when the output signal type of the differential oscillator chip is HCSL, it is necessary to connect to the differential output circuit corresponding to HCSL.

[0127] In order to further improve the compatibility of the test system provided in the embodiment of the present application, the test system in the embodiment of the present application can provide output circuits with multiple output signal types. The control device 11 can automatically connect to the corresponding type of output circuit according to the output signal type of the oscillator chip to be tested to cope with crystal oscillator tests with multiple output signal types, with higher compatibility.

[0128] That is, in some embodiments, see Figure 5 Another schematic block diagram of a crystal oscillator testing system provided by an embodiment of the present application is shown. The system may include a control device 11, a first electrically controlled switch 12, at least one oscillator chip 13 and a crystal resonator 14.

[0129] In addition, the system may further include at least two output modules corresponding to the output signal types; each output module may include a second electronically controlled switch 15 and an output circuit 16 .

[0130] It is understandable that Figure 5 Only one output module is shown, and the connection relationship of other output modules is similar. The second electronically controlled switch 15 is disconnected by default, and the control device 11 can control the second electronically controlled switch 15 of the corresponding output module to close according to test requirements to connect the corresponding type of output circuit.

[0131] At this time, the control device 11 is connected to the fourth terminal of the second electronically controlled switch 15; the oscillator chip 13 is connected to the fifth terminal of the second electronically controlled switch 15; and the output circuit 16 is connected to the sixth terminal of the second electronically controlled switch 15;

[0132] When the second electronically controlled switch 15 is turned off, the fifth terminal and the fourth terminal are connected, and the fifth terminal and the sixth terminal are disconnected. At this time, the output circuit 16 is not connected to the oscillator chip 13, that is, the output circuit is not connected.

[0133] When the second electronically controlled switch 15 is closed, the fifth terminal and the sixth terminal are connected, and the fifth terminal and the sixth terminal are disconnected. At this time, the output circuit 16 is connected to the oscillator chip 13, that is, the output circuit is connected.

[0134] Taking a differential output oscillator as an example, it may include three output signal types, namely LVPECL, HCSL, and LVDS, and correspondingly has three output modules.

[0135] For example, Figure 6 、 Figure 7 and 8 The output circuit corresponding to a differential output signal type is shown in FIG. Figure 6 As shown, K2 is a certain type of relay, which is an electrically controlled switch. R1 and R2 are connected in series to form an output circuit. The resistance values ​​of R1 and R2 can both be, for example, 50 ohms, which is not limited here.

[0136] K2 includes pins 1 through 8. When K2 is open, pins 2 and 3 are conductive, and pins 7 and 6 are conductive. When K2 is closed, pins 3 and 4 are conductive, and pins 5 and 6 are conductive. When a specific output circuit is required, K2 is closed; when K2 is open, the output circuit is not connected.

[0137] In this case, the fourth end of the second electronically controlled switch 15 may refer to pins 2 and 7 of K2, the fifth end may refer to pins 3 and 6 of K2, and the sixth end may refer to pins 4 and 5 of K2.

[0138] Combine Figure 2 、 Figure 3 and Figure 6 , it is possible to implement a test of a certain differential output signal type of the differential output oscillator. At this time, the oscillator chip 13 to be tested is Figure 2 The chip shown in FIG. 1 has a first electrically controlled switch 12. Figure 3 K1, crystal resonator 14 is Figure 3 In U1, the second electronically controlled switch 15 is K2.

[0139] Figure 2 The XOUT and XIN pins in Figure 3 Connect pins 3 and 6 of K1; Figure 3 Pins 2 and 7 of K1 are connected to the ATE equipment. Figure 6 Pins 3 and 6 of K2 are connected to Figure 2 The OUTN and OUTP pins of K1 are connected to the ATE device, and the pins 2 and 7 of K2 are connected to the ATE device.

[0140] When access is required Figure 6 When the output circuit of is tested, the test process can be as follows: the control device 11 controls Figure 3 The K1 relay is closed, VDD is powered, and the control Figure 6 The K2 relay in the Figure 2The oscillator chip in the ATE device works; after the oscillator chip works, the ATE device Figure 2 The OE pin is enabled; after enabling, Figure 2 The OUTN and OUTP pins in the circuit will output the corresponding differential signals; the differential signals output by the OUTN and OUTP pins pass through Figure 6 The output circuit shown can then be tested to obtain corresponding test data.

[0141] like Figure 7 As shown, K3 is a certain type of relay, which is an electrically controlled switch. R3 forms the output circuit. The resistance value of R3 can be, for example, 100 ohms, which is not limited here.

[0142] K3 includes pins 1 through 8. When K3 is open, pins 2 and 3 are conductive, and pins 7 and 6 are conductive. When K3 is closed, pins 3 and 4 are conductive, and pins 5 and 6 are conductive. When a specific output circuit is required, K3 is closed; when K3 is open, the output circuit is not connected.

[0143] In this case, the fourth end of the second electronically controlled switch 15 may refer to pins 2 and 7 of K3, the fifth end may refer to pins 3 and 6 of K3, and the sixth end may refer to pins 4 and 5 of K3.

[0144] Figure 7 Pins 3 and 6 of K3 can be connected to Figure 2 The OUTN and OUTP pins of K3 are connected to the ATE device, and the pins 2 and 7 of K3 are connected to the ATE device.

[0145] When access is required Figure 7 When testing the output circuit, the test process is the same as Figure 6 The testing process is similar and will not be described here.

[0146] like Figure 8 As shown, K4 is a certain type of relay, an electrically controlled switch. R4, R5, R6, and R7 form the output circuit. For example, the resistance of R4 can be 33 ohms, the resistance of R5 can be 33 ohms, the resistance of R6 can be 50 ohms, and the resistance of R7 can be 50 ohms, without limitation.

[0147] K4 includes pins 1 through 8. When K4 is open, pins 2 and 3 are conductive, and pins 7 and 6 are conductive. When K4 is closed, pins 3 and 4 are conductive, and pins 5 and 6 are conductive. When a specific output circuit is required, K4 is closed; when K4 is open, the output circuit is not connected.

[0148] In this case, the fourth end of the second electronically controlled switch 15 may refer to pins 2 and 7 of K4, the fifth end may refer to pins 3 and 6 of K4, and the sixth end may refer to pins 4 and 5 of K4.

[0149] Figure 8 Pin 3 and pin 6K of K4 can be connected to Figure 2 The OUTN and OUTP pins of K3 are connected to the ATE device, and the pins 2 and 7 of K3 are connected to the ATE device.

[0150] When access is required Figure 8 When testing the output circuit, the test process is the same as Figure 6 The testing process is similar and will not be described here.

[0151] For test items such as pin open and short circuit test, signal input pin and signal output pin leakage current test, output pin leakage current test, equivalent resistance test and pull-up resistance test, it is only necessary to control the corresponding pins of the oscillator chip without connecting to the output circuit.

[0152] For crystal oscillators with multiple output signal types, tests such as dynamic current testing, sleep current testing, signal output pin voltage testing, and pin frequency testing require not only controlling the oscillator chip's pins and first electrically controlled switch 12, but also controlling the second electrically controlled switch in the target output module to close. The target output module is determined based on the oscillator chip's output signal type. That is, the target output module corresponds to the same output signal type as the oscillator chip. For example, if the output signal type of the differential oscillator chip to be tested is LVPECL, the target output module is an output module corresponding to LVPECL.

[0153] At this time, for the dynamic current test item, the control device 11 can control the first electrically controlled switch to close, enable the enable pin of the oscillator chip, and control the second electrically controlled switch of the target output module to close to obtain the dynamic current of the oscillator chip.

[0154] For the sleep current test, the control device 11 can control the first electrically controlled switch to close, control the enable pin of the oscillator chip to put the oscillator chip into sleep mode, and control the second electrically controlled switch of the target output module to close to obtain the sleep current of the oscillator chip.

[0155] For the test item of the signal output pin voltage test, the control device 11 can control the first electronically controlled switch to be closed, control the second electronically controlled switch of the target output module to be closed, and control the signal input pin of the oscillator chip to be at a high level and a low level respectively, to obtain the first voltage of the signal output pin when the signal input pin is at a high voltage, and the second voltage when the signal input pin is at a low voltage.

[0156] For the pin frequency value test, the control device 11 can control the first electrically controlled switch to close, control the second electrically controlled switch of the target output module to close, and enable the enable pin of the oscillator chip to obtain the frequency value of the output pin of the oscillator chip (such as the OUTN and OUTP pins).

[0157] As can be seen from the foregoing, the test system provided by the embodiments of the present application can select and connect a corresponding output circuit from a variety of output circuits with output signal types, depending on the output signal type of the oscillator chip. This allows for testing crystal oscillators with various output signal types, further improving system compatibility. Furthermore, the system hardware architecture is simple, making implementation relatively easy.

[0158] Based on the above embodiments, in some embodiments, at least one oscillator chip is on the same wafer, and the wafer is arranged on a probe station. At this time, the three-temperature function of the probe station can be used to perform a three-temperature test on the crystal oscillator. Therefore, before testing each test item, the control device is also used to control the probe station to be at a preset temperature. For example, when a low-temperature environment test is required, the control device controls the probe station to be at a preset temperature, which is the temperature under a low-temperature environment; after completing the test of each test item under a low-temperature environment, the next temperature environment (such as a high-temperature environment) is tested. Three temperatures refer to low temperature, normal temperature and high temperature.

[0159] This allows the control equipment to test multiple oscillator chips on the same wafer, achieving wafer-level testing of crystal oscillators. High-reliability testing can be completed at the wafer stage, effectively reducing the cost of subsequent packaging and testing. Furthermore, the probe station's three-temperature capability enables three-temperature testing of crystal oscillators.

[0160] It should be noted that the test solution of the embodiment of the present application can perform electrical performance testing on the amplifier and feedback network of the crystal oscillator. However, the crystal resonator is mainly composed of quartz crystal, and the physical characteristic parameters of the quartz crystal cannot be tested.

[0161] The following describes the process on the control device side. The control device can control the pins corresponding to the test items in the oscillator chip, or control the first electronically controlled switch to close and control the pins corresponding to the test items in the oscillator chip to obtain test data corresponding to the test items.

[0162] In some possible implementations, see Figure 9 The test flow diagram provided in the embodiment of the present application is shown. The process of controlling the pins corresponding to the test items in the oscillator chip and obtaining the test data corresponding to the test items according to the test items may include the following steps:

[0163] Step S901: Perform open-short circuit test control on the pins of the oscillator chip to obtain open-short circuit test data.

[0164] Step S902 : Control the oscillator chip to be powered on, and control the enable pin and output pin of the oscillator chip to be in a floating state, and obtain a first leakage current of the signal input pin of the oscillator chip and a second leakage current of the signal output pin of the oscillator chip.

[0165] Step S903: Control the enable pin to be in a closed state to obtain a third leakage current of the output pin.

[0166] Step S904: applying a first voltage between the signal input pin and the signal output pin, obtaining a first current between the signal input pin and the signal output pin, and obtaining an equivalent resistance according to the first voltage and the first current.

[0167] Step S905 : applying a second voltage to the enable pin to obtain a second current of the enable pin, and obtaining a pull-up resistor of the enable pin according to the second voltage and the second current.

[0168] In some possible implementations, see Figure 10 Another test flow diagram provided by an embodiment of the present application, wherein the first electrically controlled switch is controlled to be closed according to each test item, and the pin corresponding to the test item in the oscillator chip is controlled to obtain test data corresponding to the test item, may include the following steps:

[0169] Step S1001: Control the first electronically controlled switch to be closed, and enable the enable pin of the oscillator chip to obtain the dynamic current of the oscillator chip.

[0170] Step S1002 : Control the first electronically controlled switch to be closed, and control the enable pin of the oscillator chip to put the oscillator chip into sleep mode, thereby obtaining the sleep current of the oscillator chip.

[0171] Step S1003, control the first electronically controlled switch to be closed, and control the signal input pin of the oscillator chip to be at a high level and a low level respectively, to obtain a first voltage of the signal output pin when the signal input pin is at a high voltage, and a second voltage when the signal input pin is at a low voltage.

[0172] Step S1004 : Control the first electronically controlled switch to be closed, and enable the enable pin of the oscillator chip to obtain the frequency value of the output pin of the oscillator chip.

[0173] In some possible implementations, the crystal oscillator test system further includes an output module corresponding to at least two output signal types; the output module includes a second electronically controlled switch and an output circuit;

[0174] At this time, when the test item is dynamic current test, sleep current test, signal output pin voltage test or pin frequency value test, the control module also needs to control the second electronically controlled switch in the target output module to close. The target output module is an output module determined according to the output signal type of the oscillator chip.

[0175] In some possible implementations, at least one oscillator chip is on a same wafer, and the wafer is placed on a probe station; before testing each test item, the method further includes: controlling the probe station to be at a preset temperature.

[0176] It should be noted that the relevant processes on the control device side can be found in the relevant introduction on the system side above, and will not be repeated here.

[0177] After obtaining the test data of each test item, it can be determined whether it fails according to each test data. When failure is determined, BIN classification is performed to distinguish in which mode the chip fails.

[0178] For example, for test values ​​such as dynamic current, sleep current, leakage current, resistance, voltage and frequency, it can be determined whether the test value obtained is greater than or less than a certain threshold. If so, it fails; if not, it does not fail.

[0179] It is understandable that the test order of each test item can be arbitrary. For example, the embodiment of the present application provides a more reasonable and efficient test order (from front to back): pin open and short circuit test, dynamic current test, sleep current test, signal output pin voltage test, pin frequency value test, signal input pin and signal output pin leakage current test, output pin leakage current test, equivalent resistance test, pull-up resistance test.

[0180] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0181] Figure 11 This is a schematic block diagram of the structure of the electronic device provided in the embodiment of the present application. Figure 11 As shown, the electronic device 11 of this embodiment includes: at least one processor 110 ( Figure 11 Only one is shown in the figure), a memory 111, and a computer program 112 stored in the memory 111 and executable on the at least one processor 110. When the processor 110 executes the computer program 112, the steps of any of the above-mentioned method embodiments are implemented. The electronic device may be the control device described above.

[0182] The electronic device may include, but is not limited to, a processor 110 and a memory 111. Those skilled in the art will understand that Figure 11 This is merely an example of the electronic device 11 and does not constitute a limitation on the electronic device 11 . The electronic device 11 may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access devices, etc.

[0183] The processor 110 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. A general-purpose processor may be a microprocessor or any conventional processor.

[0184] In some embodiments, the memory 111 may be an internal storage unit of the electronic device 11, such as a hard disk or memory of the electronic device 11. In other embodiments, the memory 111 may also be an external storage device of the electronic device 11, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the electronic device 11. Furthermore, the memory 111 may also include both an internal storage unit of the electronic device 11 and an external storage device. The memory 111 is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as the program code of the computer program. The memory 111 may also be used to temporarily store data that has been output or is to be output.

[0185] Those skilled in the art will clearly understand that for the sake of convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.

[0186] In addition, the specific names of the functional units and modules are only for the purpose of distinguishing them from each other and are not intended to limit the scope of protection of this application. The specific working processes of the units and modules in the above system can refer to the corresponding processes in the above method embodiments and will not be repeated here.

[0187] An embodiment of the present application also provides an electronic device, which includes: at least one processor, a memory, and a computer program stored in the memory and executable on the at least one processor, wherein the processor implements the steps of any of the above-mentioned method embodiments when executing the computer program.

[0188] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the above-mentioned various method embodiments can be implemented.

[0189] An embodiment of the present application provides a computer program product. When the computer program product is run on an electronic device, the electronic device can implement the steps in the above-mentioned method embodiments when executing the computer program product.

[0190] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the process of the above-mentioned method embodiment by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, it can implement the steps of each of the above-mentioned method embodiments. The computer program includes computer program code, which can be in source code form, object code form, executable file, or some intermediate form. The computer-readable medium can at least include: any entity or device capable of carrying computer program code to the camera / terminal device, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal, and software distribution medium. For example, a USB flash drive, mobile hard drive, magnetic disk, or optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals or telecommunication signals.

[0191] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0192] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0193] In the embodiments provided in this application, it should be understood that the disclosed devices, electronic devices and methods can be implemented in other ways. For example, the device / electronic device embodiments described above are merely schematic. For example, the division of the modules or units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0194] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0195] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A crystal oscillator test system, characterized in that: comprising a control device, a first electrically controlled switch, at least one oscillator chip and a crystal resonator; The control device is connected to the first end of the first electronically controlled switch and is also connected to the oscillator chip; The oscillator chip is connected to the second end of the first electronically controlled switch; The crystal resonator is connected to the third end of the first electronically controlled switch; When the first electronically controlled switch is off, the first end and the second end are connected, and the second end and the third end are disconnected; when the first electronically controlled switch is closed, the first end and the second end are disconnected, and the second end and the third end are connected; The control device is used to: according to each test item, control the pin in the oscillator chip corresponding to the test item, or control the first electronically controlled switch to be closed and control the pin in the oscillator chip corresponding to the test item to obtain test data corresponding to the test item.

2. The system according to claim 1, wherein The control device is specifically used for: Performing open-circuit and short-circuit test control on the pins of the oscillator chip to obtain open-circuit and short-circuit test data; Controlling the oscillator chip to power on, and controlling the enable pin and the output pin of the oscillator chip to be in a floating state, to obtain a first leakage current of the signal input pin of the oscillator chip and a second leakage current of the signal output pin of the oscillator chip; controlling the enable pin to be in an off state to obtain a third leakage current of the output pin; Applying a first voltage between the signal input pin and the signal output pin to obtain a first current between the signal input pin and the signal output pin, and obtaining an equivalent resistance according to the first voltage and the first current; Applying a second voltage to the enable pin to obtain a second current of the enable pin, and obtaining a pull-up resistor of the enable pin according to the second voltage and the second current; The test items include pin open and short circuit test, signal input pin and signal output pin leakage current test, output pin leakage current test, equivalent resistance test and pull-up resistance test.

3. The system according to claim 1 or 2, characterized in that The control device is specifically used for: controlling the first electronically controlled switch to close, and enabling the enable pin of the oscillator chip to obtain a dynamic current of the oscillator chip; controlling the first electronically controlled switch to be closed, and controlling the enable pin of the oscillator chip to put the oscillator chip into sleep mode, and obtaining a sleep current of the oscillator chip; controlling the first electronically controlled switch to be closed, and controlling the signal input pin of the oscillator chip to be at a high level and a low level respectively, to obtain a first voltage of the signal output pin when the signal input pin is at the high level, and a second voltage of the signal output pin when the signal input pin is at the low level; controlling the first electronically controlled switch to close, and enabling the enable pin of the oscillator chip, to obtain a frequency value of an output pin of the oscillator chip; The test items include dynamic current test, sleep current test, signal output pin voltage test and pin frequency value test.

4. The system according to claim 3, wherein: The system further comprises an output module corresponding to at least two output signal types; the output module comprises a second electronically controlled switch and an output circuit; The control device is connected to the fourth terminal of the second electronically controlled switch; the oscillator chip is connected to the fifth terminal of the second electronically controlled switch; and the output circuit is connected to the sixth terminal of the second electronically controlled switch; When the second electronically controlled switch is off, the fifth terminal and the fourth terminal are connected, and the fifth terminal and the sixth terminal are disconnected; when the second electronically controlled switch is closed, the fifth terminal and the sixth terminal are connected, and the fifth terminal and the sixth terminal are disconnected; When the test item is a dynamic current test, a sleep current test, a signal output pin voltage test, or a pin frequency value test, the control device is further configured to: The second electronically controlled switch in a target output module is controlled to be closed, and the target output module is an output module determined according to the output signal type of the oscillator chip.

5. The system according to claim 1, wherein: The at least one oscillator chip is on a same wafer, and the wafer is disposed on a probe station; Before testing each of the test items, the control device is further used to control the probe station to be at a preset temperature.

6. A crystal oscillator testing method, characterized in that: Used in a control device in a crystal oscillator test system; the crystal oscillator test system also includes a first electrically controlled switch, at least one oscillator chip and a crystal resonator; The control device is connected to the first end of the first electronically controlled switch and is also connected to the oscillator chip; the oscillator chip is connected to the second end of the first electronically controlled switch; and the crystal resonator is connected to the third end of the first electronically controlled switch. When the first electronically controlled switch is off, the first end and the second end are connected, and the second end and the third end are disconnected; when the first electronically controlled switch is closed, the first end and the second end are disconnected, and the second end and the third end are connected; The method comprises: According to each test item, the pin corresponding to the test item in the oscillator chip is controlled, or the first electronically controlled switch is controlled to be closed and the pin corresponding to the test item in the oscillator chip is controlled to obtain test data corresponding to the test item.

7. The method according to claim 6, wherein According to each test item, controlling the pin corresponding to the test item in the oscillator chip to obtain test data corresponding to the test item includes: Performing open-circuit and short-circuit test control on the pins of the oscillator chip to obtain open-circuit and short-circuit test data; Controlling the oscillator chip to power on, and controlling the enable pin and the output pin of the oscillator chip to be in a floating state, to obtain a first leakage current of the signal input pin of the oscillator chip and a second leakage current of the signal output pin of the oscillator chip; controlling the enable pin to be in an off state to obtain a third leakage current of the output pin; Applying a first voltage between the signal input pin and the signal output pin to obtain a first current between the signal input pin and the signal output pin, and obtaining an equivalent resistance according to the first voltage and the first current; Applying a second voltage to the enable pin to obtain a second current of the enable pin, and obtaining a pull-up resistor of the enable pin according to the second voltage and the second current; The test items include pin open and short circuit test, signal input pin and signal output pin leakage current test, output pin leakage current test, equivalent resistance test and pull-up resistance test.

8. The method according to claim 6 or 7, wherein: According to each test item, controlling the first electronically controlled switch to close, and controlling the pin of the oscillator chip corresponding to the test item to obtain test data corresponding to the test item, includes: controlling the first electronically controlled switch to close, and enabling the enable pin of the oscillator chip to obtain a dynamic current of the oscillator chip; controlling the first electronically controlled switch to be closed, and controlling the enable pin of the oscillator chip to put the oscillator chip into sleep mode, and obtaining a sleep current of the oscillator chip; controlling the first electronically controlled switch to be closed, and controlling the signal input pin of the oscillator chip to be at a high level and a low level respectively, to obtain a first voltage of the signal output pin when the signal input pin is at the high level, and a second voltage of the signal output pin when the signal input pin is at the low level; controlling the first electronically controlled switch to close, and enabling the enable pin of the oscillator chip, to obtain a frequency value of an output pin of the oscillator chip; The test items include dynamic current test, sleep current test, signal output pin voltage test and pin frequency value test.

9. The method according to claim 8, wherein The crystal oscillator test system further comprises an output module corresponding to at least two output signal types; the output module comprises a second electrically controlled switch and an output circuit; The control device is connected to the fourth terminal of the second electronically controlled switch; the oscillator chip is connected to the fifth terminal of the second electronically controlled switch; and the output circuit is connected to the sixth terminal of the second electronically controlled switch; When the second electronically controlled switch is off, the fifth terminal and the fourth terminal are connected, and the fifth terminal and the sixth terminal are disconnected; when the second electronically controlled switch is closed, the fifth terminal and the sixth terminal are connected, and the fifth terminal and the sixth terminal are disconnected; When the test item is a dynamic current test, a sleep current test, a signal output pin voltage test, or a pin frequency value test, the method further includes: The second electronically controlled switch in a target output module is controlled to be closed, and the target output module is an output module determined according to the output signal type of the oscillator chip.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 6 to 9 is implemented.

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