Anti-oxidation silver-filled glass millet bead UV glue applying intelligent monitoring control system

Abstract

The invention belongs to the technical field of anti-oxidation silver-filled glass millet bead UV glue application monitoring, and discloses an anti-oxidation silver-filled glass millet bead UV glue application intelligent monitoring control system. Comprising a sizing process data acquisition module, a sizing process anomaly analysis module, a sizing anomaly reason identification module, a curing process data acquisition module, a curing process anomaly analysis module and a curing anomaly condition judgment module. According to the method, UV glue applying is divided into the glue applying process and the curing process, then quality analysis is conducted respectively, the quality problem can be accurately positioned through the analysis mode, and accurate quality standards can be formulated according to the glue applying link and the curing link respectively. Meanwhile, from the perspective of production efficiency and cost, the defective rate and the rework rate are greatly reduced, and equipment troubleshooting and productivity planning are more accurate, so that the production efficiency is effectively improved, the cost is reduced, and comprehensive improvement and remarkable benefits are brought to the gluing process of the anti-oxidation silver-filled glass millet beads.

Description

Technical Field

[0001] The invention belongs to the technical field of UV glue application monitoring for anti-oxidation silver-filled glass millet beads, and relates to an intelligent monitoring and control system for UV glue application for anti-oxidation silver-filled glass millet beads. Background Art

[0002] Antioxidant silver-filled glass millet beads are a special type of glass beads. They are commonly used materials for DIY jewelry and can be matched with other beads, gemstones, metal accessories, etc. to make various personalized jewelry. Through UV glue application, a protective film can be formed on the surface of the antioxidant silver-filled glass millet beads, thereby preventing silver from directly contacting harmful factors in the external environment (such as oxygen, moisture, corrosive gases, etc.) and reducing silver oxidation. The gluing process generally includes two main steps: gluing and curing. The analysis and monitoring of this process is an important prerequisite for ensuring that the gluing effect meets the requirements. Therefore, the research on intelligent monitoring and control of UV glue gluing of antioxidant silver-filled glass millet beads is of great significance.

[0003] Existing gluing process analysis usually monitors the products or gluing parameters, but ignores the process data analysis of specific steps such as gluing and curing. This analysis method cannot accurately determine the specific cause, and it is difficult to take targeted solutions. Without analyzing the gluing and curing process data, it is impossible to detect small changes in the process in time. For example, small fluctuations in gluing speed or slight changes in curing temperature may gradually accumulate, causing fluctuations in product quality. Summary of the invention

[0004] In view of this, in order to solve the problems raised in the above background technology, an intelligent monitoring and control system for applying UV glue to anti-oxidation silver-filled glass millet beads is proposed.

[0005] The purpose of the present invention can be achieved through the following technical solutions: an intelligent monitoring and control system for the UV glue application of antioxidant silver-filled glass millet beads, including: a glue process data acquisition module, which is used to record each oxidized silver-filled glass millet bead corresponding to each glue head in the current production batch as a monitoring object, and obtain the glue process data of each glue head corresponding to each monitoring object, the glue process data including the glue application amount and the glue application time, and at the same time use a high-definition camera to collect the glue-application image of each glue head corresponding to each monitoring object.

[0006] The gluing process abnormality analysis module is used to analyze the glue liquid quality evaluation, equipment quality evaluation and process quality evaluation of each gluing head corresponding to each monitoring object based on the gluing process data of each gluing head corresponding to each monitoring object and the images after gluing.

[0007] The module for identifying the cause of glue application abnormality is used to determine whether there is glue application abnormality at each glue application head based on the glue liquid quality evaluation, equipment quality evaluation and process quality evaluation of each monitoring object corresponding to each glue application head. If so, the specific cause of the abnormality is further identified, and the abnormal cause specifically includes glue liquid abnormality, equipment abnormality and process abnormality.

[0008] The curing process data collection module is used to obtain the curing process quality data of each monitoring object corresponding to each glue head, including gloss and transparency, and collect the curing temperature and curing humidity of the curing process corresponding to the current batch of products.

[0009] The curing process abnormality analysis module is used to analyze the curing quality of each monitoring object corresponding to each gluing head based on the curing process quality data of each monitoring object corresponding to each gluing head, and then determine whether each monitoring object corresponding to each gluing head is qualified, record the unqualified monitoring objects as abnormal monitoring objects, and further analyze the curing quality of the current production batch.

[0010] The curing abnormality judgment module is used to judge whether the curing quality of the current production batch is abnormal based on the curing quality of the current production batch, and issue an early warning if there is an abnormality.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The present invention divides UV sizing into a sizing process and a curing process, and then conducts quality analysis separately. This analysis method can accurately locate quality problems and formulate accurate quality standards for the sizing and curing links. At the same time, from the perspective of production efficiency and cost, the defective rate and rework rate are greatly reduced, and equipment fault troubleshooting and production capacity planning are more accurate, thereby effectively improving production efficiency and reducing costs, bringing comprehensive improvement and significant benefits to the sizing process of antioxidant silver-filled glass millet beads.

[0012] (2) The present invention conducts a comprehensive analysis of the glue liquid quality evaluation, equipment quality evaluation and process quality evaluation during the glue application process analysis, and further identifies the specific abnormal causes. This analysis method can comprehensively and accurately locate the problem, cover multiple factors and accurately determine the root cause. It can effectively optimize the glue application process and formulate targeted improvement measures to promote overall process improvement. It can also ensure production stability and efficiency, reduce production interruptions and reduce production costs.

[0013] (3) When analyzing the curing process, the present invention determines whether each gluing head corresponding to each monitoring object is qualified based on the curing quality of each gluing head corresponding to each monitoring object, and then further analyzes the curing quality of the current production batch. This analysis method can timely discover and solve problems, optimize production batch management, and promote continuous process optimization, thereby effectively improving the quality and efficiency of the curing process, providing strong guarantees for production and helping the continuous development and improvement of the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0015] Figure 1 It is a schematic diagram of the connection of each module of the system of the present invention.

[0016] Figure 2 This is a schematic diagram of a process quality evaluation analysis process provided by the present invention.

[0017] Figure 3 A judgment flow chart corresponding to an embodiment of identifying the cause of abnormal gluing provided by the present invention.

[0018] Figure numerals: 1 - center point of millet bead, 2 - monitoring line segment, 3 - millet bead, 4 - colloid boundary line. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] See also Figure 1 As shown, the present invention provides an intelligent monitoring and control system for the application of UV glue to anti-oxidation silver-filled glass millet beads, comprising a glue process data acquisition module, a glue process abnormality analysis module, a glue abnormality cause identification module, a curing process data acquisition module, a curing process abnormality analysis module and a curing abnormality situation judgment module, wherein the glue process data acquisition module is connected to the glue process abnormality analysis module, the glue process abnormality analysis module is connected to the glue abnormality cause identification module, the glue abnormality cause identification module is connected to the curing process data acquisition module, the curing process data acquisition module is connected to the curing process abnormality analysis module, and the curing process abnormality analysis module is connected to the curing abnormality situation judgment module.

[0021] The gluing process data acquisition module is used to record each oxidized silver-filled glass millet bead corresponding to each gluing head in the current production batch as a monitoring object, and obtain the gluing process data of each gluing head corresponding to each monitoring object, wherein the gluing process data includes the gluing amount and the gluing time, and at the same time, use a high-definition camera to collect the post-gluing image of each gluing head corresponding to each monitoring object.

[0022] It should be explained that the reason for analyzing the sizing process corresponding to the UV sizing of anti-oxidation silver-filled glass millet beads is that the sizing process directly affects the adhesion amount of glue on the surface of millet beads, the uniformity of distribution, and the shape of glue droplets. Analyzing this process can ensure the precise control of the glue amount to avoid affecting the product performance and appearance due to too much or too little glue. At the same time, it can promptly discover potential problems in the sizing equipment and process, such as glue pump accuracy deviation, glue head blockage or improper parameter setting, to ensure the stability and efficiency of the sizing process.

[0023] The gluing process abnormality analysis module is used to analyze the glue liquid quality evaluation, equipment quality evaluation and process quality evaluation of each gluing head corresponding to each monitoring object based on the gluing process data of each gluing head corresponding to each monitoring object and the post-gluing image.

[0024] It should be explained that the reasons for analyzing the evaluation of the glue liquid quality, equipment quality and process quality of each monitoring object for each glue head are as follows: 1. The quality of the glue liquid is one of the core elements of glue application. Its viscosity, component stability, purity, etc. directly determine the flow characteristics of the glue, the curing effect and the performance of the final product. By evaluating the quality of the glue liquid, it can be ensured that it meets the requirements of glue application and timely discover possible deterioration and impurity mixing of the glue liquid. 2. Equipment quality plays a key role in the accuracy and stability of glue application. Analyzing the quality of equipment can ensure that the equipment is in good operating condition and avoid uneven glue application quality due to equipment failure or deviation. 3. Appropriate process parameters are a necessary condition for achieving high-quality glue application. Their evaluation helps to determine the optimal process combination, improve production efficiency and reduce quality defects such as uneven glue layer thickness and irregular glue drop shape caused by unreasonable processes.

[0025] In a preferred embodiment of the present invention, the analysis of the glue liquid quality evaluation situation requires constructing a glue liquid quality evaluation index for each monitoring object corresponding to each glue applicator head, and the specific method is as follows: extract the post-gluing image of each glue applicator head corresponding to each monitoring object, obtain the glue liquid area of ​​each glue applicator head corresponding to each monitoring object, and then calculate the glue liquid area deviation value of each glue applicator head corresponding to each monitoring object by taking the absolute value after subtracting it from the preset reference glue liquid area, and then calculate the ratio with the reference glue liquid area to obtain the glue liquid viscosity abnormality index of each glue applicator head corresponding to each monitoring object.

[0026] Extract the glue-applied images of each glue-applying head corresponding to each monitoring object, and then obtain the number of defects of each glue-applying head corresponding to each monitoring object and the defect area corresponding to each defect, which are recorded as X ij , S ijk, wherein i represents the number of each glue application head, i=1, 2...I, I represents the number of glue application heads, j represents the number of each monitored object, j=1, 2...J, J represents the number of monitored objects, k represents the number of each defect, k=1, 2...K, K represents the number of defects.

[0027] Exemplarily, the defects may be bubbles and impurities.

[0028] Using the formula The analysis results show that the glue purity abnormality index Gspai of each glue head corresponding to each monitoring object is ij , where X0 represents the preset reference defect quantity, S0 represents the preset reference defect area, and α1 and α2 represent the influence weight factors corresponding to the preset defect quantity and defect area, respectively.

[0029] Exemplarily, α1=0.6, α2=0.4.

[0030] Substitute the glue viscosity abnormality index and glue purity abnormality index of each monitoring object corresponding to each glue head into the formula The glue quality evaluation index Gqei of each glue head corresponding to each monitoring object is obtained by analysis. ij , where Gsvai ij It indicates the abnormal viscosity index of the glue liquid corresponding to each monitoring object of each glue application head.

[0031] It should be noted that the reasons for selecting the abnormal index of glue viscosity and the abnormal index of glue purity as the influencing factors of glue quality evaluation index are as follows: 1. The viscosity of the glue directly affects its fluidity. During the gluing process, the appropriate viscosity can ensure that the glue flows out of the gluing head in a stable flow rate and shape. If the viscosity is abnormal, such as too high viscosity, the glue may not pass through the needle smoothly, resulting in uneven glue droplets and even clogging of the gluing head. This will seriously affect the gluing accuracy, making it difficult to control the amount of glue on the glass millet beads, resulting in excessive glue on some beads and too little glue on some beads. 2. The purity of the glue directly determines the appearance quality of the glue layer. If the glue contains impurities, such as dust, fibers or other particles, the impurities may have a negative impact on the performance of the glue layer. Some impurities may absorb ultraviolet rays, reduce the efficiency of the photoinitiator, and cause incomplete curing of the glue. At the same time, impurities may also become stress concentration points. When the glue layer is subjected to external forces, cracks or shedding are likely to occur around the impurities, affecting the adhesion and overall strength of the glue layer.

[0032] In a preferred embodiment of the present invention, the analysis of the equipment quality evaluation situation requires the construction of an equipment quality evaluation index for each glue dispensing head corresponding to each monitoring object, and the specific method is as follows: extract the glue application amount of each glue dispensing head corresponding to each monitoring object, recorded as M ij, using the formula The glue quantity stability abnormality index Gmsai of each glue application head corresponding to each monitoring object is obtained by analysis. ij , where M0 represents the preset reference glue amount.

[0033] Exemplarily, M0=0.5 ml.

[0034] Extract the glue-applied images of each glue-applied head corresponding to each monitored object, obtain the uncoated glue area of ​​each glue-applied head corresponding to each monitored object, and then calculate the ratio with the preset reference glass millet bead area to obtain the positioning accuracy anomaly index Paai of each glue-applied head corresponding to each monitored object. ij .

[0035] Substitute the glue quantity stability abnormality index and positioning accuracy abnormality index of each glue head corresponding to each monitoring object into the formula The equipment quality evaluation index Eqei corresponding to each monitoring object of each glue head is obtained by analysis. ij .

[0036] It is necessary to explain that the reasons for selecting the glue quantity stability abnormality index and the positioning accuracy abnormality index as the influencing factors of the equipment quality evaluation index are as follows: 1. Glue quantity stability is an important indicator to measure the performance of the glue supply system (such as glue pumps, hoses and other equipment). The accuracy of the glue pump and the patency of the hose will affect the stability of the glue quantity. 2. Positioning accuracy reflects the working status of the glue application equipment (such as the moving device of the glue application head, the positioning sensor, etc.). If the positioning system fails, such as the sensor accuracy decreases, the transmission parts of the moving device wear, etc., it will cause abnormal positioning accuracy. By monitoring the positioning accuracy abnormality index, these equipment problems can be discovered in time, and the equipment can be repaired and adjusted to ensure the normal operation of the equipment and the accuracy of glue application.

[0037] In a preferred embodiment of the present invention, please refer to Figure 2 As shown, the analysis of the process quality evaluation situation requires the construction of a process quality evaluation index for each monitoring object corresponding to each gluing head, and the specific method is as follows: extract the post-gluing image of each monitoring object corresponding to each gluing head, locate the center point of the millet bead of each monitoring object corresponding to each gluing head, and then emit a number of monitoring rays at equal intervals around the center point as the starting point, and then intersect with the corresponding colloid boundary line to obtain a number of monitoring line segments, and obtain the length of the monitoring line segment corresponding to each monitoring object of each gluing head.

[0038] It needs to be explained that the millet beads described in the present invention are the abbreviation of antioxidant silver-filled glass millet beads.

[0039] The lengths of the monitoring line segments of each glue head corresponding to each monitoring object are compared to obtain the maximum length and minimum length of the monitoring line segments of each glue head corresponding to each monitoring object, which are recorded as maxLij 、minL ij .

[0040] Using the formula The process quality evaluation index Pqei of each glue head corresponding to each monitoring object is obtained by analysis. ij , where L0 represents the preset reference line segment length.

[0041] The module for identifying the cause of glue application abnormality is used to determine whether there is glue application abnormality in each glue application head based on the glue liquid quality evaluation, equipment quality evaluation and process quality evaluation of each monitoring object corresponding to each glue application head. If so, the specific cause of the abnormality is further identified, and the abnormal cause specifically includes glue liquid abnormality, equipment abnormality and process abnormality.

[0042] In a preferred embodiment of the present invention, the specific process of determining whether there is glue application abnormality in each glue application head is as follows: extract the glue liquid quality evaluation index, equipment quality evaluation index and process quality evaluation index of each glue application head corresponding to each monitoring object, and then sum them up according to the weight to obtain the glue application process quality evaluation index of each glue application head corresponding to each monitoring object.

[0043] Exemplarily, the corresponding weights of the glue quality evaluation index, the equipment quality evaluation index and the process quality evaluation index are 0.3, 0.4 and 0.3 respectively.

[0044] The average glue application process quality evaluation index of each glue application head corresponding to each monitoring object is calculated by averaging to obtain the average glue application process quality evaluation index of each glue application head.

[0045] The average gluing process quality evaluation index of each gluing head is compared with the pre-set gluing process quality evaluation index threshold. If the average gluing process quality evaluation index of a gluing head is greater than the gluing process quality evaluation index threshold, it is judged that there is no gluing abnormality in the gluing head. Otherwise, it is judged that there is gluing abnormality in the gluing head.

[0046] Exemplarily, the gluing process quality evaluation index threshold is 0.8.

[0047] In a preferred embodiment of the present invention, please refer to Figure 3 As shown, the specific method of identifying the specific abnormal cause is as follows: the gluing head judged to have gluing abnormality is recorded as an abnormal gluing head, and the glue liquid quality evaluation index, equipment quality evaluation index and process quality evaluation index of each abnormal gluing head corresponding to each monitoring object are extracted, and then the average value is calculated to obtain the average glue liquid quality evaluation index, average equipment quality evaluation index and average process quality evaluation index of each abnormal gluing head.

[0048] The average glue liquid quality evaluation index, average equipment quality evaluation index and average process quality evaluation index of each abnormal glue dispensing head are compared with the pre-set glue liquid quality evaluation index threshold, equipment quality evaluation index threshold and process quality evaluation index threshold respectively to obtain the specific abnormal cause of the corresponding abnormal glue dispensing head.

[0049] It should be supplemented that the method for obtaining the specific abnormal cause of the corresponding abnormal gluing head is as follows: the average glue liquid quality evaluation index, average equipment quality evaluation index and average process quality evaluation index of each abnormal gluing head are compared with the pre-set glue liquid quality evaluation index threshold, equipment quality evaluation index threshold and process quality evaluation index threshold respectively.

[0050] Exemplarily, the glue quality evaluation index threshold, the equipment quality evaluation index threshold, and the process quality evaluation index threshold are 0.75, 0.8, and 0.85, respectively.

[0051] If the average glue liquid quality evaluation index of a certain abnormal glue dispensing head is less than the glue liquid quality evaluation index threshold, it is determined that the abnormal cause of the abnormal glue dispensing head is abnormal glue liquid.

[0052] If the average equipment quality evaluation index of a certain abnormal glue dispensing head is less than the equipment quality evaluation index threshold, it is determined that the abnormal cause of the abnormal glue dispensing head is equipment abnormality.

[0053] If the average process quality evaluation index of an abnormal glue dispensing head is less than the process quality evaluation index threshold, it is determined that the abnormal cause of the abnormal glue dispensing head is process abnormality.

[0054] It should be noted that the present invention conducts a comprehensive analysis of the glue liquid quality evaluation, equipment quality evaluation and process quality evaluation during the gluing process analysis, and further identifies the specific abnormal causes. This analysis method can comprehensively and accurately locate the problem, covering multiple factors to investigate and accurately determine the root cause. It can effectively optimize the gluing process, formulate targeted improvement measures to promote overall process improvement. It can also ensure production stability and efficiency, reduce production interruptions and reduce production costs.

[0055] The curing process data acquisition module is used to obtain the curing process quality data of each monitoring object corresponding to each glue head, specifically including gloss and transparency, and to collect the curing temperature and curing humidity of the curing process corresponding to the current batch of products.

[0056] It should be explained that the reason for analyzing the curing process corresponding to the UV glue application of anti-oxidation silver-filled glass millet beads is: the curing process is related to whether the glue can be fully cross-linked to form an ideal glue layer, ensuring that the glue is completely cured, so that the glue layer has good physical properties such as hardness, adhesion, elasticity and toughness, as well as chemical properties such as chemical resistance and oxidation resistance. It can also avoid problems such as glue layer defects and product quality decline caused by poor curing, thereby improving the product quality and production efficiency of anti-oxidation silver-filled glass millet beads as a whole, and providing key basis and guarantee for the optimization of the production process and quality control.

[0057] It should be explained that the reasons for choosing gloss and transparency as the quality data of the curing process are: 1. Gloss is a key indicator of the appearance quality of the glue layer after curing. For antioxidant silver-filled glass millet beads, good gloss can make the product more visually attractive. A glue layer with high gloss will make the millet beads look brighter and more delicate, which is especially important when used for decorative purposes (such as making accessories). 2. Transparency can well reflect problems in the curing process. During the curing process, factors such as the generation of bubbles, the mixing of impurities, or incomplete curing of the glue will reduce transparency. For example, when the glue contains unreacted monomers or solvents, the glue layer may appear turbid and reduce transparency. If air is mixed in to form bubbles during the curing process, the glue layer will also become opaque.

[0058] It should be noted that the reasons for selecting curing temperature and curing humidity as influencing factors for analysis are: 1. Different UV glues have specific curing temperature range requirements. If the temperature is too low, the curing speed of the glue will slow down, and it may not even reach a fully cured state. On the contrary, too high a temperature may cause the glue to have problems such as thermal deformation and bubbles during the curing process. 2. Curing humidity will interfere with the curing process of the glue. A high humidity environment may cause the glue to absorb moisture and affect the performance of the glue. For example, moisture may react with some active groups in the glue, consume the free radicals generated by the photoinitiator, and result in incomplete curing reaction.

[0059] The curing process abnormality analysis module is used to analyze the curing quality of each monitoring object corresponding to each gluing head based on the curing process quality data of each monitoring object corresponding to each gluing head, and then determine whether each monitoring object corresponding to each gluing head is qualified, record the unqualified monitoring objects as abnormal monitoring objects, and further analyze the curing quality of the current production batch.

[0060] In a preferred embodiment of the present invention, the analysis of the curing quality of each glue head corresponding to each monitoring object requires the construction of a curing quality index of each glue head corresponding to each monitoring object, and the specific method is as follows: extract the glossiness and transparency of each glue head corresponding to each monitoring object, and record them as GZ ij ,TMij .

[0061] Using the formula The curing quality index Cqi of each glue head corresponding to each monitoring object is obtained by analysis. ij , where GZ0 represents the preset reference gloss, TM0 represents the preset reference transparency, e represents the natural constant, T represents the curing temperature of the current batch of products corresponding to the curing process, H represents the curing humidity of the current batch of products corresponding to the curing process, T0 represents the preset suitable curing temperature, and H0 represents the preset suitable curing humidity.

[0062] In a preferred embodiment of the present invention, the specific method of judging whether each glue applicator head corresponding to each monitored object is qualified is as follows: extract the curing quality index of each glue applicator head corresponding to each monitored object, and then compare them with the preset curing quality index thresholds respectively; if the curing quality index of a certain glue applicator head corresponding to a certain monitored object is greater than or equal to the preset curing quality index threshold, it is judged that the glue applicator head is qualified for the monitored object; otherwise, it is judged that the glue applicator head is unqualified for the monitored object.

[0063] Exemplarily, the cure quality index threshold is 0.85.

[0064] In a preferred embodiment of the present invention, the analysis of the curing quality of the current production batch requires constructing a curing quality index for the current production batch, and the specific method is as follows: the qualified monitoring objects judged as the current production batch are recorded as qualified monitoring objects, and the number of qualified monitoring objects and the number of monitoring objects of the current production batch are obtained by statistics, and then the proportion calculation is performed to obtain the curing quality index of the current production batch.

[0065] The curing abnormality judgment module is used to judge whether the curing quality of the current production batch is abnormal based on the curing quality of the current production batch, and issue an early warning if an abnormality exists.

[0066] In a preferred embodiment of the present invention, the specific method of judging whether the curing quality abnormality occurs in the current production batch is as follows: extracting the curing quality index of the current production batch, and then comparing it with a preset reference curing quality index threshold; if the curing quality index of the current production batch is greater than or equal to the preset reference curing quality index threshold, it is judged that the current production batch does not have curing quality abnormality; otherwise, it is judged that the current production batch has curing quality abnormality.

[0067] It should be noted that when analyzing the curing process, the present invention determines whether each gluing head corresponding to each monitoring object is qualified based on the curing quality of each gluing head corresponding to each monitoring object, and then further analyzes the curing quality of the current production batch. This analysis method can timely discover and solve problems, optimize production batch management, and promote continuous process optimization, thereby effectively improving the quality and efficiency of the curing process, providing strong guarantees for production and helping the continuous development and improvement of the process.

[0068] It should be noted that the present invention divides UV sizing into a sizing process and a curing process, and then conducts quality analysis separately. This analysis method can accurately locate quality problems and formulate accurate quality standards for the sizing and curing links. At the same time, from the perspective of production efficiency and cost, the defective rate and rework rate are greatly reduced, and equipment fault troubleshooting and production capacity planning are more accurate, thereby effectively improving production efficiency and reducing costs, bringing comprehensive improvement and significant benefits to the sizing process of antioxidant silver-filled glass millet beads.

[0069] The above contents are merely examples and explanations of the concept of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention or exceed the scope defined by the present invention, they shall all fall within the protection scope of the present invention.

Claims

1. An intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads, characterized in that: include: The gluing process data acquisition module is used to record each oxidized silver-filled glass millet bead corresponding to each gluing head of the current production batch as a monitoring object, obtain the gluing process data of each gluing head corresponding to each monitoring object, the gluing process data includes the gluing amount and the gluing time, and use a high-definition camera to collect the images of each monitoring object after gluing by each gluing head; The glue application process abnormality analysis module is used to analyze the glue liquid quality evaluation, equipment quality evaluation and process quality evaluation of each glue application head corresponding to each monitoring object based on the glue application process data of each glue application head corresponding to each monitoring object and the images after glue application; The glue application abnormality cause identification module is used to determine whether each glue application head has glue application abnormality based on the glue liquid quality evaluation, equipment quality evaluation and process quality evaluation of each glue application head corresponding to each monitoring object, and if so, further identify the specific abnormal cause, which specifically includes glue liquid abnormality, equipment abnormality and process abnormality; The curing process data collection module is used to obtain the curing process quality data of each monitoring object corresponding to each glue head, including glossiness and transparency, and collect the curing temperature and curing humidity of the curing process corresponding to the current batch of products; The curing process abnormality analysis module is used to analyze the curing quality of each monitoring object corresponding to each gluing head based on the curing process quality data of each monitoring object corresponding to each gluing head, and then judge whether each monitoring object corresponding to each gluing head is qualified, record the unqualified monitoring object as an abnormal monitoring object, and further analyze the curing quality of the current production batch; The curing abnormality judgment module is used to judge whether the curing quality of the current production batch is abnormal based on the curing quality of the current production batch, and issue an early warning if there is an abnormality.

2. The intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 1, characterized in that: The analysis of the glue liquid quality evaluation situation requires the construction of a glue liquid quality evaluation index for each glue application head corresponding to each monitoring object, and the specific method is as follows: Extract the glue application images of each glue application head corresponding to each monitoring object, obtain the glue liquid area of ​​each glue application head corresponding to each monitoring object, and then calculate the glue liquid area deviation value of each glue application head corresponding to each monitoring object by taking the absolute value after subtracting it from the preset reference glue liquid area, and then calculate the glue liquid viscosity abnormality index of each glue application head corresponding to each monitoring object by taking the ratio with the reference glue liquid area; Extract the glue-applied images of each glue-applying head corresponding to each monitoring object, and then obtain the number of defects of each glue-applying head corresponding to each monitoring object and the defect area corresponding to each defect, which are recorded as X ij , S ijk , where i represents the number of each glue application head, i=1, 2...I, I represents the number of glue application heads, j represents the number of each monitoring object, j=1, 2...J, J represents the number of monitoring objects, k represents the number of each defect, k=1, 2...K, K represents the number of defects; Using the formula The analysis results show that the glue purity abnormality index Gspai of each glue head corresponding to each monitoring object is ij , where X0 represents the preset reference defect quantity, S0 represents the preset reference defect area, α1 and α2 represent the influence weight factors corresponding to the preset defect quantity and defect area, respectively; Substitute the glue viscosity abnormality index and glue purity abnormality index of each monitoring object corresponding to each glue head into the formula The glue quality evaluation index Gqei of each glue head corresponding to each monitoring object is obtained by analysis. ij , where Gsvai ij It indicates the abnormal viscosity index of the glue liquid corresponding to each monitoring object of each glue application head.

3. An anti-oxidation silver-filled glass millet bead UV glue gluing intelligent monitoring and control system as claimed in claim 2, characterized in that: The analysis of the equipment quality evaluation situation requires the construction of an equipment quality evaluation index for each glue dispensing head corresponding to each monitoring object, and the specific method is as follows: Extract the glue application amount of each glue application head corresponding to each monitoring object, recorded as M ij , using the formula The glue quantity stability abnormality index Gmsai of each glue application head corresponding to each monitoring object is obtained by analysis. ij , where M0 represents the preset reference glue application amount; Extract the glue-applied images of each glue-applied head corresponding to each monitored object, obtain the uncoated glue area of ​​each glue-applied head corresponding to each monitored object, and then calculate the ratio with the preset reference glass millet bead area to obtain the positioning accuracy anomaly index Paai of each glue-applied head corresponding to each monitored object. ij ; Substitute the glue quantity stability abnormality index and positioning accuracy abnormality index of each glue head corresponding to each monitoring object into the formula The equipment quality evaluation index Eqei corresponding to each monitoring object of each glue head is obtained by analysis. ij .

4. The intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 3, characterized in that: The analysis of the process quality evaluation situation requires the construction of a process quality evaluation index for each sizing head corresponding to each monitoring object, and the specific method is as follows: Extract the glue-applied image of each monitoring object corresponding to each glue-applying head, locate the center point of the millet bead corresponding to each monitoring object of each glue-applying head, and then emit a number of monitoring rays at equal intervals around the center point as the starting point, and then intersect with the corresponding colloid boundary line to obtain a number of monitoring line segments, and obtain the length of the monitoring line segment corresponding to each monitoring object of each glue-applying head; The lengths of the monitoring line segments of each glue head corresponding to each monitoring object are compared to obtain the maximum length and minimum length of the monitoring line segments of each glue head corresponding to each monitoring object, which are recorded as maxL ij 、minL ij ; Using the formula The process quality evaluation index Pqei of each glue head corresponding to each monitoring object is obtained by analysis. ij , where L0 represents the preset reference line segment length.

5. An intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 4, characterized in that: The specific process of judging whether each glue dispensing head has glue dispensing abnormality is as follows: Extract the glue liquid quality evaluation index, equipment quality evaluation index and process quality evaluation index of each monitoring object corresponding to each glue dispensing head, and then sum and calculate according to the weight to obtain the glue dispensing process quality evaluation index of each monitoring object corresponding to each glue dispensing head; The gluing process quality evaluation index of each gluing head corresponding to each monitoring object is averaged to obtain the average gluing process quality evaluation index of each gluing head; The average gluing process quality evaluation index of each gluing head is compared with the pre-set gluing process quality evaluation index threshold. If the average gluing process quality evaluation index of a gluing head is greater than the gluing process quality evaluation index threshold, it is judged that there is no gluing abnormality in the gluing head. Otherwise, it is judged that there is gluing abnormality in the gluing head.

6. An intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 5, characterized in that: The specific method of identifying the specific abnormal cause is as follows: The glue heads that are judged to have glue application abnormalities are recorded as abnormal glue heads, and the glue liquid quality evaluation index, equipment quality evaluation index and process quality evaluation index corresponding to each monitoring object of each abnormal glue head are extracted, and then the average glue liquid quality evaluation index, average equipment quality evaluation index and average process quality evaluation index of each abnormal glue head are obtained by respectively calculating the average value; The average glue liquid quality evaluation index, average equipment quality evaluation index and average process quality evaluation index of each abnormal glue dispensing head are compared with the pre-set glue liquid quality evaluation index threshold, equipment quality evaluation index threshold and process quality evaluation index threshold respectively to obtain the specific abnormal cause of the corresponding abnormal glue dispensing head.

7. The intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 1, characterized in that: The analysis of the curing quality of each glue dispensing head corresponding to each monitoring object requires the construction of a curing quality index of each glue dispensing head corresponding to each monitoring object, and the specific method is as follows: Extract the gloss and transparency of each monitoring object corresponding to each glue head, and record them as GZ ij ,TM ij ; Using the formula The curing quality index Cqi of each glue head corresponding to each monitoring object is obtained by analysis. ij , where GZ0 represents the preset reference gloss, TM0 represents the preset reference transparency, e represents the natural constant, T represents the curing temperature of the current batch of products corresponding to the curing process, H represents the curing humidity of the current batch of products corresponding to the curing process, T0 represents the preset suitable curing temperature, and H0 represents the preset suitable curing humidity.

8. An anti-oxidation silver-filled glass millet bead UV glue application intelligent monitoring and control system as claimed in claim 7, characterized in that: The specific method of judging whether each glue dispensing head is qualified for each monitoring object is as follows: The curing quality index of each glue head corresponding to each monitored object is extracted, and then compared with the preset curing quality index threshold. If the curing quality index of a glue head corresponding to a monitored object is greater than or equal to the preset curing quality index threshold, the glue head is judged to be qualified for the monitored object; otherwise, the glue head is judged to be unqualified for the monitored object.

9. The intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 1, characterized in that: The analysis of the curing quality of the current production batch requires the construction of a curing quality index of the current production batch, and the specific method is as follows: The qualified monitoring objects judged in the current production batch are recorded as qualified monitoring objects, and the number of qualified monitoring objects and the number of monitoring objects in the current production batch are obtained by statistics, and then the proportion is calculated to obtain the curing quality index of the current production batch.

10. The intelligent monitoring and control system for UV glue application of anti-oxidation silver-filled glass millet beads as claimed in claim 9, characterized in that: The specific method for determining whether the curing quality of the current production batch is abnormal is as follows: The curing quality index of the current production batch is extracted, and then compared with the preset reference curing quality index threshold. If the curing quality index of the current production batch is greater than or equal to the preset reference curing quality index threshold, it is judged that the current production batch has no curing quality abnormality. Otherwise, it is judged that the current production batch has curing quality abnormality.

Images