Quantum bit protecting and packaging device

Abstract

The invention relates to a quantum bit protection and packaging device, and the device comprises a packaging device which is used for bearing a quantum chip; the shielding barrel is arranged outside the packaging device, and the shielding barrel is used for shielding a magnetic field outside the quantum chip; the infrared filter is arranged outside the shielding barrel and connected with the packaging device through an adapter, and the infrared filter is used for reducing external interference on the quantum chip. According to the quantum chip protection device provided by the embodiment of the invention, the infrared filter and the shielding barrel are arranged, so that the interference of an external magnetic field and other environmental noise on quantum bits is effectively reduced, and the fidelity of the quantum bits is greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of quantum packaging, and in particular to a quantum bit protection and packaging device. Background Art

[0002] The research on quantum technology, especially quantum computers, has become a hot topic in the global science and technology field. As a cutting-edge computing platform, quantum computers have great potential by using quantum bits (qubits) for information processing, and can solve complex problems that traditional computers cannot handle efficiently. However, to give full play to the advantages of quantum computers and improve their computing power and accuracy, there are many technical challenges. Among them, the number and quality of quantum bits are the key factors that determine the performance of quantum computers. With the continuous increase in the number of quantum bits, how to effectively integrate these quantum bits into quantum chips and ensure that they can perform calculations stably and accurately during operation has become a research focus. Especially in high-precision quantum computing tasks, quantum bits are extremely susceptible to factors such as environmental noise, temperature changes, and electromagnetic interference, which lead to decoherence of quantum information or calculation errors, seriously affecting the reliability and accuracy of calculations.

[0003] Although traditional packaging technology can provide protection to a certain extent, it still has many shortcomings in terms of anti-interference ability. Summary of the invention

[0004] In view of this, the present application proposes a quantum bit protection and packaging device, which effectively reduces the interference of external magnetic fields and other environmental noises on quantum bits by setting up infrared filters and shielding barrels, thereby greatly improving the fidelity of quantum bits.

[0005] An embodiment of the present invention provides a quantum bit protection and packaging device, including: a packaging device, which is used to carry a quantum chip; a shielding barrel, which is arranged outside the packaging device, and is used to shield the magnetic field outside the quantum chip; an infrared filter, which is arranged outside the shielding barrel and connected to the packaging device through an adapter, and is used to reduce external interference to the quantum chip.

[0006] In a possible implementation, the shielding barrel includes a first barrel body, a second barrel body and a third barrel body, the first barrel body, the second barrel body and the third barrel body are cylindrical in structure, and a gap is provided between two adjacent barrel bodies, and the distance of the gap is 1.5-2 mm.

[0007] In a possible implementation, the first barrel body is made of Permalloy, the second barrel body is made of copper, and the third barrel body is made of aluminum. The heights of the first barrel body, the second barrel body, and the third barrel body decrease successively, and the height difference between two adjacent barrel bodies is 5 mm.

[0008] In a possible implementation, the shielding barrel further includes a shielding barrel cover plate, the shielding barrel cover plate is connected to the shielding barrel, and the shielding barrel cover plate is used to seal the opening of the shielding barrel.

[0009] In one possible implementation, the shielding barrel cover is provided with a sealing strip that seals the first barrel body, the second barrel body and the third barrel body in sequence, and a plurality of adapter holes are evenly arranged on the surface of the shielding barrel cover, and the adapter holes penetrate the shielding barrel cover, and the adapter holes are used to fix the adapter.

[0010] In a possible implementation, the packaging device includes a packaging base, a plurality of through holes are evenly arranged on the side wall of the packaging base, threaded holes are symmetrically arranged on both sides of the through holes, the through holes are used to plug in the connector, and the threaded holes are used to fix the connector and the packaging base.

[0011] In a possible implementation manner, a groove is further provided at the center of the packaging base, a square groove is provided at the center of the groove, and the square groove is used to place the quantum chip.

[0012] In a possible implementation, the square groove and the through hole are interconnected, and the interconnected portion is used to place the wiring of the PCB board. After the connector is inserted into the through hole, the PCB board and the quantum chip are bonded with gold wires.

[0013] In a possible implementation, the packaging device further includes a packaging cover plate, the packaging cover plate is threadedly connected to the packaging base, and a cylinder is further provided on a side wall of the packaging cover plate, and the cylinder is used to connect to the groove.

[0014] In a possible implementation, one end of the infrared filter is connected to the dilution refrigerant, and the other end of the infrared filter is connected to a connector disposed outside the packaging device through a cable.

[0015] Beneficial effects of this application:

[0016] A quantum chip protection device according to an embodiment of the present invention includes three components: a shielding barrel, a packaging device, and an infrared filter. The components cooperate with each other to form an effective protection barrier, which effectively reduces the interference of external magnetic fields and other environmental noises on quantum bits, thereby greatly improving the fidelity of quantum bits. The infrared filter can block the invasion of external infrared radiation and prevent it from causing thermal noise and photon interference to quantum bits; the shielding barrel is made of high magnetic permeability materials, which can effectively shield the external magnetic field and reduce the influence of magnetic field fluctuations on the coherence and superconducting state of quantum bits.

[0017] Other features and aspects of the present application will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the present application and, together with the description, serve to explain the principles of the present application.

[0019] Figure 1 A schematic diagram showing the structure of a quantum bit protection and packaging device according to an embodiment of the present application;

[0020] Figure 2 A schematic diagram showing the structure of the interior of a shielding barrel in a quantum bit protection and packaging device according to an embodiment of the present application;

[0021] Figure 3 A schematic diagram showing the structure of a packaging device in a quantum bit protection and packaging device according to an embodiment of the present application;

[0022] Figure 4 A schematic diagram showing the structure of a packaging base in a quantum bit protection and packaging device according to an embodiment of the present application;

[0023] Figure 5 A schematic diagram showing the structure of one side of a packaging cover plate in a quantum bit protection and packaging device according to an embodiment of the present application;

[0024] Figure 6 A schematic diagram showing the structure of the other side of the packaging cover in the quantum bit protection and packaging device of an embodiment of the present application;

[0025] Figure 7 A schematic diagram showing the structure of one side of the shielding barrel cover plate in the quantum bit protection and packaging device of an embodiment of the present application;

[0026] Figure 8 A schematic diagram showing the structure of the other side of the shielding barrel cover plate in the quantum bit protection and packaging device of an embodiment of the present application;

[0027] Fig. 9A schematic diagram showing the structure of a shielding barrel body in a quantum bit protection and packaging device according to an embodiment of the present application is shown.

[0028] Reference numerals:

[0029] 1-packaging device; 101-packaging base; 102-packaging cover; 103-chip; 104-PCB board;

[0030] 2-connector; 201, 301, 303-through hole; 202, 205-threaded hole; 206, 207-groove; 203, 204, 205-square groove; 302, 304-cylinder,

[0031] 3, 7-cables; 4, 6, 8-adapters; 5-shielding barrel; 801-first barrel body; 802-second barrel body; 803-third barrel body; 701, 702, 703-shielding barrel cover plate;

[0032] 9-infrared filter; 10-diluted refrigerant. DETAILED DESCRIPTION

[0033] Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0034] Among them, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application or simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0037] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0038] Figure 1 The schematic diagram of the structure of the quantum bit protection and packaging device of the embodiment of the present application is shown. The embodiment of the present invention provides a quantum bit protection and packaging device 1, including: a packaging device 1, the packaging device 1 is used to carry a quantum chip; a shielding barrel 5, the shielding barrel 5 is arranged outside the packaging device 1, and the shielding barrel 5 is used to shield the magnetic field outside the quantum chip; an infrared filter 9, the infrared filter 9 is arranged outside the shielding barrel 5, and is connected to the packaging device 1 through an adapter, and the infrared filter 9 is used to reduce external interference to the quantum chip.

[0039] Specifically, by setting up the three major components of the shielding barrel 5, the packaging device 1 and the infrared filter 9, the various components cooperate with each other to form an effective protective barrier, effectively reducing the interference of the external magnetic field and other environmental noise on the quantum bit, thereby greatly improving the fidelity of the quantum bit. The infrared filter 9 can block the invasion of external infrared radiation and prevent it from causing thermal noise and photon interference to the quantum bit; the shielding barrel 5 is made of high magnetic permeability material, which can effectively shield the external magnetic field and reduce the influence of magnetic field fluctuations on the coherence and superconducting state of the quantum bit.

[0040] Figure 2 A schematic diagram of the structure inside the shielding barrel in the quantum bit protection and packaging device of the embodiment of the present application is shown. In a possible implementation, the shielding barrel 5 includes a first barrel body 801, a second barrel body 802 and a third barrel body 803. The structures of the first barrel body 801, the second barrel body 802 and the third barrel body 803 are cylindrical, and a gap is set between two adjacent barrel bodies, and the distance of the gap is 1.5-2mm. The circular structure can avoid interference from sharp angles and edge effects, ensure that the shielding effect from the external magnetic field is uniform and stable, thereby minimizing the impact of the magnetic field on the performance of the quantum chip.

[0041] Specifically, a connection hole for fixing the adapter is provided on the cover plate 701 of the shield barrel 5, and a connection hole for fixing the adapter is provided under the cover plate 703. The shield barrel bodies 801, 802, and 803 are cylindrical structures, and the outer diameter of the outer wall 801 is greater than the outer diameter of the inner wall 802, and the outer diameter of the inner wall 802 is greater than the outer diameter of the inner wall 803. The outer diameter of the outer wall 801 is set to the same size as the outer diameter of the outer wall of the cover plate 701, the outer diameter of the outer wall 802 is set to the same size as the outer diameter of the outer wall of the cover plate 702, and the outer diameter of the outer wall 803 is set to the same size as the outer diameter of the outer wall of the cover plate 703. The packaging device 1, the connector 2, the adapter 4, and the cable 3 are all contained inside the shield barrel 5, and the adapter 4 is an SMA-KK adapter.

[0042] In one possible implementation, the first barrel body 801 is made of Permalloy, the second barrel body 802 is made of copper, and the third barrel body 803 is made of aluminum, and the barrel heights of the first barrel body 801, the second barrel body 802, and the third barrel body 803 are successively reduced. Multiple barrel bodies can form a multi-layer shielding barrier, and each layer can effectively shield external interference sources such as magnetic fields and thermal radiation. The gaps between each layer of barrel bodies help avoid mutual interference of shielding materials. The interference of external magnetic fields and other environmental factors will be gradually weakened at different levels, thereby effectively protecting the stability and performance of the quantum chip. The gaps between layers also play a role in reducing heat conduction. Since quantum chips are extremely sensitive to temperature changes, the designed multi-layer gaps help to isolate external heat sources and reduce heat transfer by shielding layer by layer, thereby keeping the quantum chip within a suitable temperature range and avoiding overheating that affects chip performance.

[0043] Specifically, the shielding barrel cover plate 703 and the barrel body 801 are made of magnetic shielding material Permalloy, the shielding barrel cover plate 703 and the barrel body 802 are made of copper, and the shielding barrel cover plate 703 and the barrel body 803 are made of aluminum. The material of the third barrel body 803 is aluminum, which is lightweight, corrosion-resistant and has good thermal conductivity, can effectively reduce the total weight of the device, and provide excellent heat dissipation performance. The corrosion resistance of aluminum ensures that the equipment will not be damaged by environmental changes during long-term use. The material of the second barrel body 802 is copper, which has excellent electrical and thermal conductivity, and can achieve efficient power transmission and heat dissipation. The material of the first barrel body 801 is Permalloy, which has excellent anti-magnetic, high temperature resistance and corrosion resistance. Permalloy can provide additional stability in extreme environments, especially suitable for high temperature and high magnetic field requirements.

[0044] Figure 7 A schematic diagram of the structure of one side of the shielding barrel cover plate in the quantum bit protection and packaging device of an embodiment of the present application is shown. Figure 8 A schematic diagram of the structure of the other side of the shielding barrel cover plate in the quantum bit protection and packaging device of an embodiment of the present application is shown. Fig. 9The schematic diagram of the structure of the shielding barrel body in the quantum bit protection and packaging device of the embodiment of the present application is shown. In a possible implementation, the shielding barrel 5 also includes a shielding barrel cover plate 703, which is connected to the shielding barrel 5, and the shielding barrel cover plate 703 is used to seal the opening of the shielding barrel 5. The shielding barrel cover plate is provided with a sealing strip that seals the first barrel body 801, the second barrel body 802 and the third barrel body 803 in sequence, and the surface of the shielding barrel cover plate 703 is evenly provided with a plurality of adapter holes, which penetrate the shielding barrel cover plate 703, and the adapter holes are used to fix the adapter.

[0045] In a specific embodiment, the height difference between two adjacent shielding barrels is 5 mm.

[0046] Figure 3 A schematic diagram of the structure of a packaging device in a quantum bit protection and packaging device according to an embodiment of the present application is shown. Figure 4 A schematic diagram showing the structure of a packaging base in a quantum bit protection and packaging device according to an embodiment of the present application is shown. Figure 5 A schematic diagram of the structure of one side of the packaging cover plate in the quantum bit protection and packaging device of an embodiment of the present application is shown. Figure 6 The schematic diagram of the structure of the other side of the package cover plate in the quantum bit protection and packaging device of the embodiment of the present application is shown. In a possible implementation, the packaging device 1 includes a packaging base 101, and a plurality of through holes 201 are evenly arranged on the side wall of the packaging base 101. The two sides of the through hole 201 are also symmetrically provided with threaded holes 201, and the through hole 201 is used to plug the connector, and the threaded hole 202 is used to fix the connector and the packaging base 101. A groove 206 is also provided in the center of the packaging base 1, and a square groove 203 is provided in the center of the groove 206, and the square groove 203 is used to place the quantum chip. The square groove 203 and the through hole 201 are mutually connected, and the mutually connected part is used to place the wiring of the PCB board 104. After the connector is inserted into the through hole, the PCB board 104 is bonded with the quantum chip by gold wire. The packaging device 1 also includes a packaging cover plate 102, and the packaging cover plate 102 is threadedly connected to the packaging base 101. The side wall of the packaging cover plate 102 is also provided with a cylinder 304, and the cylinder 304 is used to connect the groove 206.

[0047] Specifically, the side wall of the package base 101 is provided with a circular through hole 201 and a circular threaded hole 202. The through hole 201 and the threaded hole 202 are used to place and fix the connector 2. The connector 2 is a SMA-K connector, and the connector 2 is threadedly connected to the package base 101. A cylindrical groove 206 is provided in the middle of the package base 101. The package base 101 is provided with a square groove 203. The square groove 203 is located at the center of the package base 101 and is used to place the chip 103. The size of the square groove 203 matches the size of the chip 103. Square grooves 204 are provided around the square groove 203. The square groove 204 extends to the through hole 201 with the square groove 203 as the center, and is used to place the wiring of the PCB board 104. The PCB board 104 and the chip 103 are gold-wire bonded. The packaging cover plate 102 is provided with a through hole 301, and the packaging cover plate is threadedly connected to the packaging base. The threaded hole 205 is arranged corresponding to the position of the through hole 301. The lower wall of the packaging cover plate 102 is provided with a protruding cylinder 304, and the cylinder 304 is installed in the groove 206. The size of the cylinder 304 matches the groove 206, which effectively prevents misalignment during the installation process and ensures the positioning accuracy of the component. A square groove 302 is provided at the bottom of the packaging cover plate 102, and the square groove 302 and the square groove 204 are arranged correspondingly to ensure the firm connection between the two components and avoid loosening due to vibration or external force. The packaging device 1 is a cylindrical structure, and a pipeline interface is provided on the circumference, and is placed vertically along the circumference. Multiple pipelines extend upward around the packaging base 101 and are connected to the shielding barrel cover plate 703. The main body of the package base 101 is cylindrical, and the outer wall of the package base 101 is provided with 12 circular through holes 201. The side wall position corresponding to each circular through hole 201 is a plane structure, and each circular through hole 201 is installed with a connector 2. Each circular through hole 201 is arranged at the center position of each plane, and is also arranged at the center position of the circular ring of the main body of the package base 101. The interior of the package base 101 is hollow, and a platform facing the center of the circular ring is arranged at the bottom, and a square mounting groove is arranged in the hollow middle of the platform. The connector 2 includes a fixing plate matching the outer wall plane of the main body of the package base 101, one end of the fixing plate is provided with a cylindrical channel, and the cylindrical channel is used to connect the PCB board, and the other end of the fixing plate is provided with a connecting part, which is also hollow inside, and the outer peripheral surface of the connecting part is provided with an external thread, and the connecting part is also a cylindrical structure, and the diameter of the connecting part is larger than the diameter of the cylindrical channel on the other side of the connecting plate.

[0048] In a possible implementation, one end of the infrared filter 9 is connected to the dilution refrigerant, and the other end of the infrared filter 9 is connected to a connector provided outside the packaging device through the cable 3 and the cable 7. The infrared filter 9 can reduce the impact of infrared radiation on the system, ensure that the device works in a more stable and controlled environment, and avoid performance fluctuations caused by external heat sources.

[0049] In a possible implementation, a hanger is further included. The hanger is arranged outside the shielding barrel 5 . The hanger is used to fix the packaging device 1 . The hanger provides support for the packaging device 1 .

[0050] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A quantum bit protection and packaging device, characterized in that: include: A packaging device, the packaging device is used to carry the quantum chip; A shielding barrel, the shielding barrel is arranged outside the packaging device, and the shielding barrel is used to shield the magnetic field outside the quantum chip; An infrared filter is arranged outside the shielding barrel and connected to the packaging device through an adapter, and the infrared filter is used to reduce external interference to the quantum chip.

2. The quantum bit protection and packaging device according to claim 1, characterized in that: The shielding barrel includes a first barrel body, a second barrel body and a third barrel body. The structures of the first barrel body, the second barrel body and the third barrel body are cylindrical, and a gap is set between two adjacent barrel bodies. The distance of the gap is 1.5-2mm.

3. The quantum bit protection and packaging device according to claim 2, characterized in that: The first barrel body is made of Permalloy, the second barrel body is made of copper, the third barrel body is made of aluminum, and the barrel body heights of the first barrel body, the second barrel body and the third barrel body decrease in sequence.

4. The quantum bit protection and packaging device according to claim 2, characterized in that: The shielding barrel further comprises a shielding barrel cover plate, the shielding barrel cover plate is connected to the shielding barrel, and the shielding barrel cover plate is used to seal the opening of the shielding barrel.

5. The quantum bit protection and packaging device according to claim 4, characterized in that: The shielding barrel cover plate is provided with sealing strips for sealing the first barrel body, the second barrel body and the third barrel body in sequence, and a plurality of adapter holes are evenly arranged on the surface of the shielding barrel cover plate, the adapter holes penetrate the shielding barrel cover plate, and the adapter holes are used to fix the adapter.

6. The quantum bit protection and packaging device according to claim 1, characterized in that: The packaging device comprises a packaging base, a plurality of through holes are evenly arranged on the side wall of the packaging base, threaded holes are symmetrically arranged on both sides of the through holes, the through holes are used to plug the connector, and the threaded holes are used to fix the connector and the packaging base.

7. The quantum bit protection and packaging device according to claim 6, characterized in that: A groove is also provided at the center of the packaging base, and a square groove is provided at the center of the groove, and the square groove is used to place the quantum chip.

8. The quantum bit protection and packaging device according to claim 7, characterized in that: The square groove and the through hole are interconnected, and the interconnected portion is used to place the wiring of the PCB board. After the connector is inserted into the through hole, the PCB board and the quantum chip are bonded with gold wires.

9. The quantum bit protection and packaging device according to claim 8, characterized in that: The packaging device further comprises a packaging cover plate, which is threadedly connected to the packaging base. A cylinder is further provided on the side wall of the packaging cover plate, and the cylinder is used to connect to the groove.

10. The quantum bit protection and packaging device according to claim 1, characterized in that: One end of the infrared filter is connected to the dilution refrigerant, and the other end of the infrared filter is connected to a connector arranged outside the packaging device through a cable.

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