Silicon wafer detection control method and device, control equipment, program product and medium

Abstract

The invention provides a silicon wafer detection control method and device, control equipment, a program product and a medium, and belongs to the technical field of semiconductors. Comprising the steps of judging whether at least one silicon wafer meets a detection condition or not according to silicon wafer information corresponding to an abnormal discharging opening of detection equipment under the condition that a carrier loaded with at least one silicon wafer reaches a feeding opening of the detection equipment; under the condition that the at least one silicon wafer meets the detection condition, detecting the at least one silicon wafer to obtain a detection result; and processing the at least one silicon wafer according to the detection result. According to the technical scheme, the abnormal silicon wafers can be automatically processed in time, and the problem that the detection efficiency is low due to the fact that the abnormal silicon wafers need to be further manually classified is solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a detection and control method, device, control equipment, program product and medium for a silicon wafer. Background Art

[0002] Currently, during the wafer inspection process, the device can classify normal wafers and abnormal wafers and store them in different ports (or carriers) of the device. After that, users are required to further classify different types of abnormal wafers according to logical fields such as product type or work order of abnormal wafers to achieve classification management of abnormal wafers.

[0003] However, in the prior art, abnormal wafers need to be further classified manually, resulting in low detection efficiency. Summary of the invention

[0004] The present invention provides a silicon wafer detection control method, device, control equipment, program product and medium, which solves the problem in the prior art that abnormal wafers need to be manually classified, resulting in low detection efficiency.

[0005] In order to achieve the above object, the technical solution adopted by the embodiment of the present invention is:

[0006] A silicon wafer detection and control method, comprising:

[0007] When a carrier carrying at least one silicon wafer arrives at a loading port of a testing device, judging whether the at least one silicon wafer meets a testing condition according to silicon wafer information corresponding to an abnormal unloading port of the testing device;

[0008] In the case where it is determined that the at least one silicon wafer meets the detection condition, detecting the at least one silicon wafer to obtain a detection result;

[0009] The at least one silicon wafer is processed according to the detection result.

[0010] In some embodiments, judging whether the at least one silicon wafer meets the detection condition according to the silicon wafer information corresponding to the abnormal feeding port of the detection device includes:

[0011] According to the silicon wafer information, determining whether there is a silicon wafer at the abnormal feeding port;

[0012] When it is determined that there are silicon wafers in the abnormal material discharge port, first batch information of the at least one silicon wafer and second batch information of the silicon wafers in the abnormal material discharge port are obtained;

[0013] Determining whether a first product identifier in the first batch of information is consistent with a second product identifier in the second batch of information;

[0014] When the first product identification and the second product identification are consistent, it is determined that the at least one silicon wafer meets the detection condition.

[0015] In some embodiments, the method further comprises:

[0016] When it is determined that there is no silicon wafer at the abnormal discharge port, it is determined that the at least one silicon wafer meets the detection condition.

[0017] In some embodiments, the method further comprises:

[0018] When the first product identification and the second product identification are inconsistent, the silicon wafers at the abnormal discharge port are discharged from the detection device;

[0019] It is determined that the at least one silicon wafer meets a detection condition.

[0020] In some embodiments, when the detection result indicates that there is an abnormal silicon wafer in the at least one silicon wafer and the number of the loading ports is 1, processing the at least one silicon wafer according to the detection result includes:

[0021] The abnormal silicon wafer is transferred to the abnormal unloading port.

[0022] In some embodiments, when the detection result indicates that there is an abnormal silicon wafer in the at least one silicon wafer and the number of the loading ports is greater than or equal to 2, processing the at least one silicon wafer according to the detection result includes:

[0023] Obtaining target batch information of silicon wafers corresponding to a target loading port, wherein the target loading port is other loading ports except the loading port where the carrier is located;

[0024] Determining whether the target product identifier in the target batch information is consistent with the third product identifier of the abnormal silicon wafer;

[0025] When the target product identification is inconsistent with the third product identification, the abnormal silicon wafer and the silicon wafer at the abnormal discharge port are both discharged from the detection equipment. When the target product identification is consistent with the third product identification, the abnormal silicon wafer is transferred to the abnormal discharge port.

[0026] In some embodiments, the method further comprises:

[0027] An abnormal flag is set for the batch information of the abnormal silicon wafer.

[0028] The embodiment of the present invention further provides a silicon wafer detection and control device, comprising:

[0029] A first judgment module is used to judge whether the at least one silicon wafer meets the detection condition according to the silicon wafer information corresponding to the abnormal unloading port of the detection device when the carrier carrying the at least one silicon wafer arrives at the loading port of the detection device;

[0030] A silicon wafer detection module, configured to detect the at least one silicon wafer and obtain a detection result when it is determined that the at least one silicon wafer meets the detection condition;

[0031] A silicon wafer processing module is used to process the at least one silicon wafer according to the detection result.

[0032] In some embodiments, the first determination module includes:

[0033] A first judgment unit is used to judge whether there is a silicon wafer at the abnormal feeding port according to the silicon wafer information;

[0034] A first acquisition unit is used to acquire first batch information of the at least one silicon wafer and second batch information of the silicon wafers at the abnormal feeding port when it is determined that there are silicon wafers at the abnormal feeding port;

[0035] a second determination unit, configured to determine whether the first product identifier in the first batch information and the second product identifier in the second batch information are consistent;

[0036] The first processing unit is configured to determine that the at least one silicon wafer meets a detection condition when the first product identification and the second product identification are consistent.

[0037] In some embodiments, the device further comprises:

[0038] The second processing unit is used to determine that the at least one silicon wafer meets the detection condition when it is determined that there is no silicon wafer at the abnormal discharge port.

[0039] In some embodiments, the device further comprises:

[0040] a third processing unit, configured to discharge the silicon wafers from the abnormal discharge port out of the detection device when the first product identification and the second product identification are inconsistent;

[0041] The fourth processing unit is used to determine whether the at least one silicon wafer meets the detection condition.

[0042] In some embodiments, when the detection result indicates that there is an abnormal silicon wafer in the at least one silicon wafer and the number of the loading ports is 1, the silicon wafer processing module includes:

[0043] The fifth processing unit is used to transfer the abnormal silicon wafer to the abnormal unloading port.

[0044] In some embodiments, when the detection result indicates that there is an abnormal silicon wafer in the at least one silicon wafer, and the number of the loading ports is greater than or equal to 2, the silicon wafer processing module includes:

[0045] A second acquisition unit is used to acquire target batch information of silicon wafers corresponding to a target loading port, wherein the target loading port is other loading ports except the loading port where the carrier is located;

[0046] A third judgment unit is used to judge whether the target product identification in the target batch information is consistent with the third product identification of the abnormal silicon wafer;

[0047] The sixth processing unit is used to discharge the abnormal silicon wafers and the silicon wafers at the abnormal discharge port from the detection equipment when the target product identification is inconsistent with the third product identification, and to transfer the abnormal silicon wafers to the abnormal discharge port when the target product identification is consistent with the third product identification.

[0048] In some embodiments, the device further comprises:

[0049] The seventh processing unit is used to set an abnormal flag bit for the batch information of the abnormal silicon wafer.

[0050] An embodiment of the present invention further provides a control device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor; when the processor executes the computer program, the detection and control method of the silicon wafer as described above is implemented.

[0051] An embodiment of the present invention further provides a computer program product, including computer instructions, which, when executed by a processor, implement the steps of the above silicon wafer detection and control method.

[0052] To achieve the above objectives, an embodiment of the present invention provides a readable storage medium having a program or instruction stored thereon, wherein the program or instruction, when executed by a processor, implements the steps in the above silicon wafer detection and control method.

[0053] The beneficial effects of the present invention are:

[0054] In this embodiment, when a carrier carrying at least one silicon wafer arrives at the loading port of the detection device, first determine whether these silicon wafers meet the detection conditions based on the silicon wafer information corresponding to the abnormal unloading port of the detection device, and then detect these silicon wafers if it is determined that these silicon wafers meet the detection conditions, and then automatically process these silicon wafers according to the detection results. In this way, it is possible to avoid the situation where different types of abnormal silicon wafers are mixed at the abnormal unloading port due to the detection of silicon wafers by the detection equipment, thereby avoiding the problem of low detection efficiency caused by the need for manual further classification of the mixed abnormal silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 A schematic diagram showing a flow chart of a method for controlling a silicon wafer according to an embodiment of the present invention;

[0056] Figure 2 A second flow chart showing a method for controlling a silicon wafer according to an embodiment of the present invention;

[0057] Figure 3 A schematic diagram showing the structure of a silicon wafer detection and control device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0058] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0059] In order to solve the above technical problems, the embodiments of the present invention provide a silicon wafer detection and control method, device, control equipment, program product and medium, which can automatically classify abnormal silicon wafers.

[0060] like Figure 1 As shown, an embodiment of the present invention provides a detection and control method for a silicon wafer, comprising:

[0061] Step 101, when a carrier carrying at least one silicon wafer arrives at a loading port of a testing device, determine whether the at least one silicon wafer meets a testing condition based on silicon wafer information corresponding to an abnormal unloading port of the testing device.

[0062] It should be noted that the above detection equipment can detect the silicon wafers in the carrier (i.e., the carrier) to determine whether there are abnormal silicon wafers among these silicon wafers. The detection equipment includes one or more loading ports (i.e., Figure 2The normal PORT in the test port is used to receive the carrier, which contains the silicon wafer to be tested; the test equipment also includes an abnormal unloading port (i.e. Figure 2 It should be noted that after the detection equipment detects the silicon wafers in the carrier, if abnormal silicon wafers (also known as NG wafers) are detected, the abnormal silicon wafers will be transported to the abnormal discharge port, and the normal silicon wafers will be taken away and subsequently put into other production processes.

[0063] In this step, the purpose of judging whether the detection conditions are met when the carrier arrives at the loading port is to ensure that abnormal silicon wafers are not mixed at the abnormal unloading port due to the detection of silicon wafers by the detection equipment according to the specific situation of the abnormal unloading port.

[0064] Step 102: When it is determined that the at least one silicon wafer meets the detection condition, the at least one silicon wafer is detected to obtain a detection result.

[0065] In this step, the detection device can be controlled to detect the silicon wafers in the carrier to determine whether there are abnormal silicon wafers among the silicon wafers.

[0066] Step 103: Process the at least one silicon wafer according to the detection result.

[0067] It should be noted that the silicon wafer detection control method provided by the present invention can be specifically executed by equipment automation programming (Equipment Automation Programming, EAP). EAP can realize real-time monitoring of the machines on the production line (such as the detection equipment in the embodiment of the present invention) to achieve the purpose of controlling the production of the machines.

[0068] In this embodiment, when a carrier carrying at least one silicon wafer arrives at the loading port of the detection device, first determine whether these silicon wafers meet the detection conditions based on the silicon wafer information corresponding to the abnormal unloading port of the detection device, and then detect these silicon wafers if it is determined that these silicon wafers meet the detection conditions, and then automatically process these silicon wafers according to the detection results. In this way, it is possible to avoid the situation where different types of abnormal silicon wafers are mixed at the abnormal unloading port due to the detection of silicon wafers by the detection device, thereby avoiding the problem of low detection efficiency caused by the need for manual further classification of the mixed abnormal silicon wafers.

[0069] In some embodiments, step 101, judging whether the at least one silicon wafer meets the detection condition according to the silicon wafer information corresponding to the abnormal feeding port of the detection device, includes:

[0070] Step 1011, judging whether there are silicon wafers in the abnormal feeding port according to the silicon wafer information.

[0071] Here, it can be determined whether there are silicon wafers at the abnormal discharge port by determining whether there is batch information (i.e., LOT) with an abnormal flag in the silicon wafer information. If there is batch information with an abnormal flag in the silicon wafer information, it means that there are silicon wafers at the abnormal discharge port (specifically, abnormal silicon wafers detected by the detection equipment).

[0072] Step 1012: When it is determined that there are silicon wafers at the abnormal material discharge port, first batch information of the at least one silicon wafer and second batch information of the silicon wafers at the abnormal material discharge port are obtained.

[0073] It should be noted that if there are silicon wafers at the abnormal feeding port, when the detection equipment detects the silicon wafers again, if abnormal silicon wafers of a different type from those at the abnormal feeding port are detected, abnormal silicon wafers may be mixed at the abnormal feeding port. Therefore, it is necessary to obtain the first batch information of at least one silicon wafer (that is, the silicon wafer to be detected by the detection equipment) to determine whether it is possible to start inspecting these silicon wafers.

[0074] In some embodiments, the method further includes: in a case where it is determined that no silicon wafer exists at the abnormal discharge port, determining that the at least one silicon wafer satisfies a detection condition.

[0075] That is to say, if there are no silicon wafers at the abnormal unloading port, when the detection equipment detects the silicon wafers again, the abnormal silicon wafers will not be mixed at the abnormal unloading port. Therefore, the silicon wafers in the carrier at the loading port can be checked immediately, which means that it can be determined that at least one silicon wafer has met the detection conditions and detection can begin.

[0076] Step 1013: determine whether the first product identifier in the first batch information and the second product identifier in the second batch information are consistent.

[0077] It should be noted that the batch information of silicon wafers includes the product identification of the silicon wafers (ie, ProductID), which is used to indicate the product type of the silicon wafers. Silicon wafers of different product types have different product identifications, and the product types correspond to the product identifications one by one.

[0078] Step 1014: When the first product identification and the second product identification are consistent, determine that the at least one silicon wafer meets the detection condition.

[0079] In some embodiments, the method further includes: when the first product identification and the second product identification are inconsistent, discharging the silicon wafers from the abnormal discharge port from the detection device; and determining that at least one silicon wafer meets the detection conditions.

[0080] It should be noted that if the first product identification and the second product identification are consistent, then when the detection equipment detects the silicon wafers again, abnormal silicon wafers will not be mixed at the abnormal feeding port. Therefore, the silicon wafers in the carrier at the loading port can be checked immediately, which means that it can be determined that at least one silicon wafer has met the detection conditions and the detection can be started; if they are inconsistent, the silicon wafers at the abnormal feeding port need to be discharged from the detection equipment first. In this way, it can be avoided that when the detection equipment detects the silicon wafers again, abnormal silicon wafers of a different type from the silicon wafers at the abnormal feeding port are detected, which causes abnormal silicon wafers to be mixed at the abnormal feeding port. It can be determined that at least one silicon wafer has met the detection conditions and the detection can be started.

[0081] In this embodiment, various situations that may cause abnormal silicon wafers to be mixed at an abnormal feeding port are judged to avoid the situation of abnormal silicon wafers being mixed, thereby avoiding the problem of further manual classification due to the mixing of abnormal silicon wafers, thereby improving the detection efficiency.

[0082] In some embodiments, when the detection result indicates that there is an abnormal silicon wafer in the at least one silicon wafer and the number of the loading ports is 1, the above step 103, that is, processing the at least one silicon wafer according to the detection result, includes: transferring the abnormal silicon wafer to the abnormal unloading port.

[0083] In some embodiments, when the detection result indicates that there is an abnormal silicon wafer in the at least one silicon wafer and the number of the loading ports is greater than or equal to 2, the above step 103, i.e., processing the at least one silicon wafer according to the detection result, may specifically include the following steps:

[0084] Step 1031, obtaining target batch information of silicon wafers corresponding to a target loading port, wherein the target loading port is other loading ports except the loading port where the carrier is located.

[0085] It should be noted that the silicon wafer corresponding to the target loading port refers to the silicon wafer that the target loading port is detecting or is about to detect.

[0086] Step 1032, determining whether the target product identifier in the target batch information is consistent with the third product identifier of the abnormal silicon wafer.

[0087] It should be noted that if the detection equipment has multiple loading ports, it is possible that different loading ports may perform silicon wafer detection at the same time. Therefore, it is necessary to determine whether the types of silicon wafers detected by different loading ports are consistent, so as to avoid the situation where abnormal silicon wafers are mixed at the abnormal unloading port due to different loading ports transmitting different types of abnormal silicon wafers to the abnormal unloading port.

[0088] Step 1033, when the target product identification is inconsistent with the third product identification, the abnormal silicon wafer and the silicon wafer at the abnormal discharge port are discharged from the detection equipment, and when the target product identification is consistent with the third product identification, the abnormal silicon wafer is transferred to the abnormal discharge port.

[0089] It should be noted that in step 1033, if they are consistent, abnormal silicon wafers will not be mixed, so the abnormal silicon wafers detected by the detection equipment can be directly transferred to the abnormal unloading port; if they are inconsistent, the abnormal silicon wafers detected by the detection equipment and the silicon wafers at the abnormal unloading port need to be discharged from the detection equipment to avoid the situation where abnormal silicon wafers are detected at the target loading port and different types of abnormal silicon wafers are transferred to the abnormal unloading port, resulting in the mixing of abnormal silicon wafers.

[0090] In some embodiments, the method further includes: setting an abnormal flag bit for batch information of the abnormal silicon wafer.

[0091] It should be noted that after the detection equipment detects abnormal silicon wafers, it can update the silicon wafer information corresponding to the abnormal feeding port. Specifically, it can set an abnormal flag (such as NG_Wafer_FLAG) for the batch information of the abnormal silicon wafers, and add the batch information with the abnormal flag to the silicon wafer information corresponding to the abnormal feeding port.

[0092] It is understandable that after the silicon wafers at the abnormal discharge port are discharged from the detection device, the silicon wafer information corresponding to the abnormal discharge port can also be updated, that is, the silicon wafer information corresponding to the abnormal discharge port can be cleared. In this way, it can be determined whether there are silicon wafers at the abnormal discharge port based on the silicon wafer information corresponding to the abnormal discharge port.

[0093] The following is a specific example of the silicon wafer detection and control method according to the embodiment of the present invention.

[0094] S201: Start.

[0095] S202: When the carrier arrives at any normal port (i.e., the loading port of the testing equipment), is it determined whether the LOT of the abnormal port (i.e., the abnormal unloading port) is empty? In other words, is it determined whether there is batch information with an abnormal flag in the silicon wafer information corresponding to the abnormal unloading port?

[0096] If so, that is, it exists, then execute S204; if it is not empty, that is, it does not exist, then execute S203.

[0097] S203: Are the ProductIDs (i.e., product identifiers) of the normal PORT and the abnormal PORT consistent? In other words, is it determined whether the first product identifier in the first batch information of the silicon wafers of the normal PORT is consistent with the second product identifier in the second batch information of the silicon wafers of the abnormal PORT?

[0098] If they are consistent, execute S204; if they are inconsistent, execute S205.

[0099] S204: Detect the silicon wafers in the carrier in the normal PORT.

[0100] S205: Eject the NG wafer of the abnormal port from the equipment.

[0101] S206: Determine whether there is a NG wafer? In other words, after the inspection equipment inspects the silicon wafers in the carrier, has an abnormal silicon wafer been detected?

[0102] If yes, that is, a NG wafer is detected, then S207 is executed; if no, that is, a NG wafer is not detected this time, then S208 is executed.

[0103] S207: Check whether the ProductID in other normal PORTs is consistent with the ProductID of the NG wafer (that is, the NG wafer detected this time).

[0104] If they are consistent, execute S209; if they are inconsistent, execute S210.

[0105] S208: Put an abnormal tag on the LOT of the NG wafer (that is, set the abnormal flag bit), and transport the NG wafer to the abnormal PORT.

[0106] S209: Put an abnormal label on the LOT of NG wafer, and discharge both the NG wafer and the NG wafer of abnormal PORT from the inspection equipment.

[0107] The detection and control method of silicon wafers in this embodiment determines how to handle abnormal silicon wafers by judging whether there is a possibility that each processing node of the detection equipment will cause different product identifications to be mixed together at the abnormal unloading port: if there is a possibility, the abnormal silicon wafers at the abnormal unloading port will be discharged from the equipment in a timely manner; if there is no possibility, the processing of the abnormal silicon wafers in the abnormal unloading port can be temporarily suspended and not discharged temporarily, and these abnormal silicon wafers will be discharged after the abnormal silicon wafers at the abnormal unloading port reach a certain number or according to actual production needs. In this way, by controlling the process of detecting and processing silicon wafers by the detection equipment, the situation of abnormal silicon wafers with different product identifications being mixed at the abnormal unloading port is avoided, thereby avoiding the problem of low detection efficiency caused by the need for manual further classification of the mixed abnormal silicon wafers.

[0108] like Figure 3 As shown, an embodiment of the present invention further provides a detection and control device for a silicon wafer, comprising:

[0109] A first judgment module 31 is used to judge whether the at least one silicon wafer meets the detection condition according to the silicon wafer information corresponding to the abnormal unloading port of the detection device when the carrier carrying the at least one silicon wafer arrives at the loading port of the detection device;

[0110] A silicon wafer detection module 32, configured to detect the at least one silicon wafer and obtain a detection result when it is determined that the at least one silicon wafer meets the detection condition;

[0111] The silicon wafer processing module 33 is used to process the at least one silicon wafer according to the detection result.

[0112] In this embodiment, when a carrier carrying at least one silicon wafer arrives at the loading port of the detection device, first determine whether these silicon wafers meet the detection conditions based on the silicon wafer information corresponding to the abnormal unloading port of the detection device, and then detect these silicon wafers if it is determined that these silicon wafers meet the detection conditions, and then automatically process these silicon wafers according to the detection results. In this way, it is possible to avoid the situation where different types of abnormal silicon wafers are mixed at the abnormal unloading port due to the detection of silicon wafers by the detection device, thereby avoiding the problem of low detection efficiency caused by the need for manual further classification of the mixed abnormal silicon wafers.

[0113] In some embodiments, the first determining module 31 includes:

[0114] A first judgment unit is used to judge whether there is a silicon wafer at the abnormal feeding port according to the silicon wafer information;

[0115] A first acquisition unit is used to acquire first batch information of the at least one silicon wafer and second batch information of the silicon wafers at the abnormal feeding port when it is determined that there are silicon wafers at the abnormal feeding port;

[0116] a second determination unit, configured to determine whether the first product identifier in the first batch information and the second product identifier in the second batch information are consistent;

[0117] The first processing unit is configured to determine that the at least one silicon wafer meets a detection condition when the first product identification and the second product identification are consistent.

[0118] In some embodiments, the device further comprises:

[0119] The second processing unit is used to determine that the at least one silicon wafer meets the detection condition when it is determined that there is no silicon wafer at the abnormal discharge port.

[0120] In some embodiments, the device further comprises:

[0121] a third processing unit, configured to discharge the silicon wafers from the abnormal discharge port out of the detection device when the first product identification and the second product identification are inconsistent;

[0122] The fourth processing unit is used to determine whether the at least one silicon wafer meets the detection condition.

[0123] In some embodiments, when the detection result indicates that there is an abnormal silicon wafer in the at least one silicon wafer and the number of the loading ports is 1, the silicon wafer processing module 33 includes:

[0124] The fifth processing unit is used to transfer the abnormal silicon wafer to the abnormal unloading port.

[0125] In some embodiments, when the detection result indicates that there is an abnormal silicon wafer in the at least one silicon wafer, and the number of the loading ports is greater than or equal to 2, the silicon wafer processing module 33 includes:

[0126] A second acquisition unit is used to acquire target batch information of silicon wafers corresponding to a target loading port, wherein the target loading port is other loading ports except the loading port where the carrier is located;

[0127] A third judgment unit is used to judge whether the target product identification in the target batch information is consistent with the third product identification of the abnormal silicon wafer;

[0128] The sixth processing unit is used to discharge the abnormal silicon wafers and the silicon wafers at the abnormal discharge port from the detection equipment when the target product identification is inconsistent with the third product identification, and to transfer the abnormal silicon wafers to the abnormal discharge port when the target product identification is consistent with the third product identification.

[0129] In some embodiments, the device further comprises:

[0130] The seventh processing unit is used to set an abnormal flag bit for the batch information of the abnormal silicon wafer.

[0131] An embodiment of the present invention further provides a control device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor; when the processor executes the computer program, the silicon wafer detection and control method as described above is implemented.

[0132] The present application also provides a computer program product, including computer instructions, which, when executed by a processor, implement the above Figure 1 The various processes of the method embodiment shown can achieve the same technical effect, and will not be described again here to avoid repetition.

[0133] An embodiment of the present application also provides a readable storage medium on which a program or instruction is stored. When the program or instruction is executed by a processor, the steps in the above-mentioned silicon wafer detection and control method are implemented.

[0134] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiments.

[0135] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0136] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0137] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0138] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A silicon wafer detection and control method, characterized in that: include: When a carrier carrying at least one silicon wafer arrives at a loading port of a testing device, judging whether the at least one silicon wafer meets a testing condition according to silicon wafer information corresponding to an abnormal unloading port of the testing device; In the case where it is determined that the at least one silicon wafer meets the detection condition, detecting the at least one silicon wafer to obtain a detection result; The at least one silicon wafer is processed according to the detection result.

2. The method according to claim 1, characterized in that The determining, based on the silicon wafer information corresponding to the abnormal unloading port of the detection device, whether the at least one silicon wafer meets the detection condition includes: According to the silicon wafer information, determining whether there is a silicon wafer at the abnormal feeding port; When it is determined that there are silicon wafers in the abnormal material discharge port, first batch information of the at least one silicon wafer and second batch information of the silicon wafers in the abnormal material discharge port are obtained; Determining whether a first product identifier in the first batch of information is consistent with a second product identifier in the second batch of information; When the first product identification and the second product identification are consistent, it is determined that the at least one silicon wafer meets the detection condition.

3. The method according to claim 2, characterized in that The method further comprises: When it is determined that there is no silicon wafer at the abnormal discharge port, it is determined that the at least one silicon wafer meets the detection condition.

4. The method according to claim 2, characterized in that: The method further comprises: When the first product identification and the second product identification are inconsistent, the silicon wafers at the abnormal discharge port are discharged from the detection device; It is determined that the at least one silicon wafer meets a detection condition.

5. The method according to claim 1, characterized in that When the detection result indicates that there is an abnormal silicon wafer in the at least one silicon wafer and the number of the loading ports is 1, processing the at least one silicon wafer according to the detection result includes: The abnormal silicon wafer is transferred to the abnormal unloading port.

6. The method according to claim 1, characterized in that When the detection result indicates that there is an abnormal silicon wafer in the at least one silicon wafer and the number of the loading ports is greater than or equal to 2, processing the at least one silicon wafer according to the detection result includes: Obtaining target batch information of silicon wafers corresponding to a target loading port, wherein the target loading port is other loading ports except the loading port where the carrier is located; Determining whether the target product identifier in the target batch information is consistent with the third product identifier of the abnormal silicon wafer; When the target product identification is inconsistent with the third product identification, the abnormal silicon wafer and the silicon wafer at the abnormal discharge port are both discharged from the detection equipment. When the target product identification is consistent with the third product identification, the abnormal silicon wafer is transferred to the abnormal discharge port.

7. The method according to claim 5 or 6, characterized in that: The method further comprises: An abnormal flag is set for the batch information of the abnormal silicon wafer.

8. A silicon wafer detection and control device, characterized in that: include: A first judgment module is used to judge whether the at least one silicon wafer meets the detection condition according to the silicon wafer information corresponding to the abnormal unloading port of the detection device when the carrier carrying the at least one silicon wafer arrives at the loading port of the detection device; A silicon wafer detection module, configured to detect the at least one silicon wafer and obtain a detection result when it is determined that the at least one silicon wafer meets the detection condition; A silicon wafer processing module is used to process the at least one silicon wafer according to the detection result.

9. A control device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor; characterized in that: When the processor executes the computer program, the silicon wafer detection and control method according to any one of claims 1 to 7 is implemented.

10. A computer program product, characterized in that The method comprises computer instructions, which, when executed by a processor, implement the steps of the silicon wafer detection and control method as described in any one of claims 1 to 7.

11. A readable storage medium having a program or instruction stored thereon, characterized in that: When the program or instruction is executed by the processor, the steps in the silicon wafer detection and control method as described in any one of claims 1 to 7 are implemented.

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