UV peptizing device and girdling method

Abstract

The invention provides a UV dispergation device and a ring cutting method.The UV dispergation device is used for conducting UV dispergation on a ring cutting part at the edge of a workpiece, and the UV dispergation device comprises a seat body, a UV dispergation device, a UV dispergation device, a UV dispergation device, a UV dispergation device, a UV dispergation device and a UV dispergation device, and the seat body is internally provided with a mounting cavity with an opening in the upper portion; the shading plate is arranged at the top of the seat body and covers the mounting cavity, at least one workpiece bearing area matched with the workpiece in shape is arranged on the shading plate, an annular peptizing groove is formed in the peripheral side of the workpiece bearing area in a surrounding mode, and supporting ribs for supporting the workpiece bearing area are arranged in the peptizing groove; the UV light source is arranged in the mounting cavity; when the workpiece is positioned on the workpiece bearing area, the girdling part of the workpiece is positioned above the peptizing groove, and the UV light source irradiates the girdling part of the workpiece, so that the girdling part of the workpiece is peptized with the UV adhesive film below the girdling part of the workpiece. According to the UV dispergation device, dispergation of the girdling part of the workpiece and the UV adhesive film below the girdling part is achieved, the girdling part can be easily taken away from the circumferential side of the workpiece subsequently, and the UV film is prevented from being broken.

Description

Technical Field

[0001] The present application relates to the field of semiconductor device production, and in particular to a UV debonding device and a ring cutting method. Background Art

[0002] In the semiconductor production process, it is sometimes necessary to perform ring cutting on the workpiece (such as a wafer or chip) to remove the material at its peripheral edge. Figure 1 to Figure 2 As shown, the operation process of the ring cutting is to first use a dicing machine to perform a ring cutting operation on the workpiece 100 carried on the UV film 200 (tightened on the tension frame 300) to form a ring-shaped ring cutting portion 101 at the peripheral edge of the workpiece 100. Subsequently, the ring cutting portion 101 is manually removed with tweezers.

[0003] The problem with this operation mode is that since the ring-cut portion 101 is still adhered to the UV film, it is time-consuming and laborious to directly remove the ring-cut portion 101, and it is easy to cause the UV film to break, which affects the subsequent processing of the workpiece. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides a UV degumming device, which adopts the following technical solutions:

[0005] A UV debonding device is used for performing UV debonding on the ring-cut part at the edge of a workpiece, wherein the workpiece is supported on a UV adhesive film, and the UV adhesive film is stretched on a stretching frame. The UV debonding device comprises:

[0006] A seat body, wherein a mounting cavity with an upper opening is provided in the seat body;

[0007] A shading plate, which is arranged on the top of the seat body and covers the mounting cavity, and is provided with at least one workpiece bearing area matching the shape of the workpiece, and an annular debonding groove is arranged around the circumference of the workpiece bearing area, and a supporting rib supporting the workpiece bearing area is arranged in the debonding groove;

[0008] A UV light source, the UV light source is arranged in the installation cavity;

[0009] When the workpiece is positioned on the workpiece bearing area, the annular cut portion of the workpiece is located above the debonding groove, and the UV light source irradiates the annular cut portion of the workpiece to debond the annular cut portion of the workpiece with the UV adhesive film below.

[0010] The workpiece carried on the UV film is cut by a dicing machine. After the cut portion is cut out on the peripheral edge of the workpiece, the workpiece is placed on the workpiece carrying area of ​​the shading plate, and the position and angle of the workpiece are adjusted so that the cut portion of the workpiece is located above the debonding groove. Subsequently, the cut portion of the workpiece is irradiated with a UV light source to debond the cut portion of the workpiece from the UV adhesive film below.

[0011] Since the bonding between the annular cut portion of the workpiece and the underlying UV adhesive film is released, the annular cut portion can be easily removed from the peripheral side of the workpiece without causing the UV film to break.

[0012] In some embodiments, the workpiece bearing area is rectangular, and a supporting rib is provided at the middle position of each of the four sides of the debonding groove.

[0013] For rectangular workpieces (such as wafers), the workpiece bearing area is set to be rectangular, and the workpiece can be carried to ensure that the annular cut portion of the workpiece is located above the debonding groove. By setting a supporting rib at the middle position of each of the four sides of the rectangular debonding groove, the support strength of the workpiece bearing area can be increased.

[0014] In some embodiments, the shading plate is provided with two workpiece carrying areas arranged side by side, and the two workpiece carrying areas are of the same shape and size.

[0015] By providing two workpiece carrying areas arranged side by side on the shading plate, the UV debonding device of the present application can simultaneously perform debonding on two workpieces carried on the UV film, thereby improving the debonding efficiency.

[0016] In some embodiments, slots are provided at opposite side edges of the opening of the installation cavity, and two opposite side edges of the sunshade are plugged into the top of the seat body through the slots.

[0017] Since the shading plate is plugged into the top of the base, the shading plate can be replaced according to different debonding requirements (shape, size and quantity of workpieces to be debonded), thereby improving the compatibility of the present application.

[0018] In some optional embodiments, an operating portion for inserting and withdrawing the shading plate is provided at the end of the shading plate, and the operating portion is a groove or a protrusion.

[0019] By arranging a groove or a protrusion at the end of the shading plate, the insertion and withdrawal operation of the shading plate is facilitated.

[0020] In some embodiments, when the workpiece is placed on the workpiece supporting area, the inner edge of the annular cut portion is located on the upper side of the workpiece supporting area.

[0021] Since the inner edge of the circular cut part is located on the upper side of the workpiece bearing area, after the circular cut part is removed, the new edge of the workpiece will not be debonded and will remain bonded to the UV film. This can prevent the edge of the workpiece from warping and causing the knife to break when the workpiece is subsequently cut.

[0022] In some embodiments, the UV debonding device further includes a positioning mechanism, and the positioning mechanism is used to fix the frame on the shading plate to position the workpiece on the workpiece carrying area.

[0023] By setting the positioning mechanism, the fixed positioning of the stretcher is achieved, ensuring that the workpiece is fixedly held on the workpiece bearing area after being adjusted into place, ultimately ensuring accurate debonding of the annular cut portion of the workpiece.

[0024] In some embodiments, the UV light source includes a circuit board and UV lamp beads evenly arranged on the circuit board, and the light emission wavelength of the UV lamp beads is 360-370 nm.

[0025] The uniformity of the UV light source irradiating the annular cut part of the workpiece is improved, and finally the annular cut part is uniformly debonded.

[0026] The present application also provides a circumcision method, which comprises:

[0027] A dicing machine is used to perform circular cutting on the workpiece carried on the UV film, so as to cut out a circular cutting portion at the peripheral edge of the workpiece;

[0028] Using any of the above-mentioned UV debonding devices to perform UV debonding on the ring-cut part of the workpiece;

[0029] The debonded ring-cut portion is removed from the workpiece.

[0030] The circular cutting method provided by the present application uses a dicing machine to cut out a circular cutting portion on the peripheral edge of a workpiece, and then irradiates the circular cutting portion of the workpiece with a UV light source to achieve debonding of the circular cutting portion of the workpiece and the UV adhesive film underneath. Since the bonding between the circular cutting portion of the workpiece and the UV adhesive film underneath is released, the circular cutting portion can be easily removed from the peripheral side of the workpiece without causing the UV film to break.

[0031] In some embodiments, removing the debonded ring-cut portion from the workpiece includes: pressing the middle of the workpiece upward from the lower side of the UV film to separate the ring-cut portion from the workpiece; and removing the ring-cut portion from the UV film using a clamp.

[0032] A simple method for removing the ring-cut portion is provided, which can quickly remove the ring-cut portion without damaging the UV film. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram of a workpiece after the circular cutting is completed;

[0034] Figure 2 A schematic diagram of removing the ring-cut portion from a workpiece using tweezers;

[0035] Figure 3 It is a three-dimensional schematic diagram of a workpiece having completed circumcision placed thereon in an embodiment of the present application;

[0036] Figure 4 is a schematic structural diagram of a sunshade in an embodiment of the present application;

[0037] Figure 5 A schematic diagram of a light shielding plate carrying a workpiece that has been circumcised in an embodiment of the present application;

[0038] Figure 6 A cross-sectional view of a workpiece having completed circumferential cutting placed thereon in an embodiment of the present application;

[0039] Figure 7 for Figure 6 A partial enlarged view of area A.

[0040] Figures 1 to 7 Included:

[0041] base body 1;

[0042] Light shield 2: workpiece bearing area 21, dissolving groove 22, supporting ribs 23, operating part 24;

[0043] UV light source 3;

[0044] Workpiece 100 , ring-cut portion 101 , UV film 200 , and stretcher 300 . DETAILED DESCRIPTION

[0045] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0046] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0047] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0048] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0049] As described in the background technology section, in the existing ring cutting operation mode, when removing the ring cutting part, since the ring cutting part is still adhered to the UV film, it is time-consuming and laborious to directly remove the ring cutting part 1, and it is easy to cause the UV film to break, which affects the subsequent processing of the workpiece.

[0050] To this end, the present application provides a UV adhesive dissolving device, which can implement UV adhesive dissolving of the ring-cut portion at the edge of the workpiece, so as to release the adhesive between the ring-cut portion and the UV film below. The workpiece is supported on the UV adhesive film, and the UV adhesive film is stretched on a stretching frame.

[0051] like Figures 3 to 7 As shown, the UV degumming device in the embodiment of the present application includes:

[0052] The base body 1 has a mounting cavity with an upper opening.

[0053] The shading plate 2 is arranged on the top of the base 1 and covers the installation cavity. The shading plate 2 is provided with at least one workpiece bearing area 21 matching the shape of the workpiece. An annular debonding groove 22 is arranged around the circumference of the workpiece bearing area 21. The debonding groove 22 is provided with supporting ribs 23 for supporting the workpiece bearing area 21, that is, the workpiece bearing area 21 is connected to other parts of the shading plate 2 through the supporting ribs 23.

[0054] The UV light source 3 is arranged in the installation cavity.

[0055] When the workpiece is positioned on the workpiece supporting area 21 , the annular portion of the workpiece is located above the debonding groove 22 , and the UV light source 3 irradiates the annular portion of the workpiece through the debonding groove 22 , thereby debonding the annular portion of the workpiece from the UV adhesive film below.

[0056] The workpiece carried on the UV film is cut by a dicing machine. After the cut portion is cut out from the peripheral edge of the workpiece, the workpiece is placed on the workpiece carrying area 21 of the light shielding plate 2, and the position and angle of the workpiece are adjusted so that the cut portion of the workpiece is located above the debonding groove 22. Subsequently, the cut portion of the workpiece is irradiated with a UV light source, so that the cut portion of the workpiece and the UV film below can be debonded. Since the bonding between the cut portion of the workpiece and the UV film below is released, the cut portion can be easily removed from the peripheral side of the workpiece later without causing the UV film to break.

[0057] In some application examples, the UV debonding device in the embodiment of the present application needs to implement the debonding operation on a rectangular workpiece (e.g., a rectangular wafer). Correspondingly, the workpiece bearing area 21 is rectangular, and a support rib 23 is provided at the middle position of each of the four sides of the debonding groove 22. By providing a support rib 23 at the middle position of each of the four sides of the rectangular debonding groove 22, the support strength of the workpiece bearing area 21 can be increased.

[0058] Figures 3 to 7 In the illustrated embodiment, two workpiece bearing areas 21 arranged side by side are provided on the shading plate 2, and the two workpiece bearing areas 21 have the same shape and size. By providing two workpiece bearing areas 21 arranged side by side on the shading plate 2, the UV degumming device in the embodiment of the present application can simultaneously degumming two workpieces carried on the UV film, thereby improving the degumming efficiency. Of course, in other embodiments, three, four or other numbers of workpiece bearing areas 21 can be provided on the shading plate 2 according to the number of workpieces on the UV film, and of course, a degumming groove 22 is correspondingly provided on the circumference of each workpiece bearing area 21.

[0059] Optionally, slots are provided at opposite side edges of the opening of the mounting cavity of the seat body 1, and two opposite side edges of the shading plate 2 are plugged into the top of the seat body 1 through the slots. Since the shading plate 2 is plugged into the top of the seat body, the shading plate 2 can be replaced with a suitable one according to different debonding needs (for example, the debonding needs include the shape, size and quantity of the workpieces to be debonded), thereby improving the compatibility of the UV debonding device of the present application.

[0060] In order to facilitate the replacement of the shading plate 2, optionally, an operating portion 24 for inserting and removing the shading plate 2 is provided at the end of the shading plate 2, and the operating portion 24 is a groove or a protrusion.

[0061] like Figures 5 and 6 As shown, optionally, when the workpiece 100 is placed on the workpiece bearing area 21, the inner edge of the ring-cut portion 101 is located on the upper side of the workpiece bearing area 21. Since the inner edge of the ring-cut portion 101 is located on the upper side of the workpiece bearing area 21, when the ring-cut portion 101 is removed, the new edge of the workpiece 100 will not be debonded, that is, the new edge of the workpiece 100 remains bonded to the UV film 200. In this way, the new edge of the workpiece 100 can be prevented from warping, which may cause the knife to break when the workpiece is subsequently cut.

[0062] Optionally, the UV degumming device in the embodiment of the present application further includes a positioning mechanism, which is used to fix the frame 300 on the shading plate 2 to position the workpiece 100 on the workpiece bearing area 21 .

[0063] After placing the frame 300 on the shading plate 2, adjust the position and angle of the frame 300 so that the workpiece 100 is accurately aligned on the corresponding workpiece bearing area 21. Then, the frame 300 can be locked on the shading plate 2 by the positioning mechanism, so that the workpiece 100 can be fixedly held on the workpiece bearing area 21, and finally the ring-cut portion 101 of the workpiece 100 can be accurately debonded. The positioning mechanism can adopt various existing locking structures that can lock the frame 300 to the shading plate 2.

[0064] like Figure 6 As shown, optionally, the UV light source 3 includes a circuit board 31 and UV lamp beads 32 evenly arranged on the circuit board 31, and the light emission wavelength of the UV lamp beads 32 is 360-370nm. The UV light source 3 is configured as the UV lamp beads 32 evenly arranged on the circuit board 31, which improves the irradiation uniformity of the UV light source 3 on the ring-cut portion 101 of the workpiece 100, and finally enables the ring-cut portion 101 to achieve uniform debonding.

[0065] Based on the same inventive concept, the present application also provides a circumcision method, which comprises the following steps:

[0066] S1. A dicing machine is used to perform circular cutting on a workpiece carried on a UV film, so as to cut out a circular cutting portion at a peripheral edge of the workpiece.

[0067] S2. Use the UV debonding device provided in any of the above embodiments of the present application to perform UV debonding on the annular cut part of the workpiece.

[0068] S3, removing the debonded annular cut portion from the workpiece.

[0069] The ring cutting method provided in the embodiment of the present application first uses a dicing machine to cut out a ring cutting portion on the peripheral edge of the workpiece, and then irradiates the ring cutting portion of the workpiece with a UV light source, thereby achieving the debonding of the ring cutting portion of the workpiece and the UV adhesive film underneath.

[0070] Since the bonding between the annular cut portion of the workpiece and the underlying UV adhesive film is released, the annular cut portion can be easily removed from the peripheral side of the workpiece without causing the UV film to break.

[0071] Optionally, in step S3, the middle part of the workpiece is pressed upward from the lower side of the UV film so that the ring-cut portion is separated from the workpiece. Specifically, the ring-cut portion is removed from the UV film using a clamping member, such as tweezers.

[0072] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.

Claims

1. A UV degumming device, characterized in that: Used to perform UV debonding on the ring-cut part at the edge of the workpiece, wherein the workpiece is supported on a UV adhesive film, and the UV adhesive film is stretched on a stretching frame, and the UV debonding device includes: A seat body, wherein the seat body is provided with a mounting cavity with an upper opening; A light shielding plate, the light shielding plate is arranged on the top of the seat body and covers the installation cavity, the light shielding plate is provided with at least one workpiece bearing area matching the shape of the workpiece, an annular debonding groove is arranged around the circumference of the workpiece bearing area, and a supporting rib supporting the workpiece bearing area is arranged in the debonding groove; A UV light source, wherein the UV light source is arranged in the mounting cavity; When the workpiece is positioned on the workpiece carrying area, the annular cut portion of the workpiece is located above the debonding groove, and the UV light source irradiates the annular cut portion of the workpiece to debond the annular cut portion of the workpiece with the UV adhesive film below.

2. The UV degumming device according to claim 1, characterized in that: The workpiece bearing area is rectangular, and a supporting rib is arranged at the middle position of each of the four sides of the debonding groove.

3. The UV degumming device according to claim 1, characterized in that: The shading plate is provided with two workpiece bearing areas arranged side by side, and the two workpiece bearing areas have the same shape and size.

4. The UV degumming device according to claim 1, characterized in that: Slots are arranged at opposite side edges of the opening of the installation cavity, and two opposite side edges of the shading plate are plugged into the top of the seat body through the slots.

5. The UV degumming device according to claim 4, characterized in that: An operating portion for inserting and withdrawing the shading plate is arranged at the end of the shading plate, and the operating portion is a groove or a convex block.

6. The UV degumming device according to claim 1, characterized in that: When the workpiece is placed on the workpiece carrying area, the inner edge of the annular cut portion is located on the upper side of the workpiece carrying area.

7. The UV degumming device according to claim 1, characterized in that: The UV degumming device further comprises a positioning mechanism, and the positioning mechanism is used to fix the frame on the shading plate so as to position the workpiece on the workpiece bearing area.

8. The UV degumming device according to claim 1, characterized in that: The UV light source includes a circuit board and UV lamp beads evenly arranged on the circuit board, and the light emission wavelength of the UV lamp beads is 360-370nm.

9. A circumcision method, characterized in that: The circumcision method comprises: A dicing machine is used to perform circular cutting on the workpiece carried on the UV film, so as to cut out a circular cutting portion at the peripheral edge of the workpiece; Using the UV debonding device described in any one of claims 1 to 8 to perform UV debonding on the ring-cut part of the workpiece; The debonded ring-cut portion is removed from the workpiece.

10. The circumcision method according to claim 9, characterized in that: The step of removing the debonded ring-cut portion from the workpiece comprises: Press the middle of the workpiece upward from the bottom of the UV film to separate the ring-cut part from the workpiece; Use the clips to remove the ring-cut section from the UV film.

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