Water tank and silicon wafer taking and placing method, device and equipment

Abstract

The invention provides a water tank and a silicon wafer taking and placing method, device and equipment. The water tank comprises a water tank main body; the wafer box positioning piece is arranged in the water tank main body, and the wafer box positioning piece comprises a first side and a second side which are opposite to each other in the horizontal direction; on the first side, the bottom of the wafer box positioning piece is hinged with the bottom surface of the water tank main body; on the second side, a lifting assembly is arranged on the bottom face of the water tank body, the bottom end of the lifting assembly is installed on the bottom face of the water tank body, the top end of the lifting assembly can ascend and descend in the vertical direction relative to the bottom face of the water tank body, and the top end of the lifting assembly abuts against the bottom of the wafer box positioning piece. And the second side of the bottom of the wafer box positioning piece can be lifted to different heights. The water tank, the silicon wafer taking and placing method, the silicon wafer taking and placing device and the silicon wafer taking and placing equipment can reduce silicon wafer damage and improve productivity.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a water tank and a silicon wafer taking and placing method, device and equipment. Background Art

[0002] In semiconductor manufacturing, wet processing equipment is used for chemical etching, cleaning, oxide layer removal and other processes. Wet processing equipment usually uses liquid chemicals to process silicon wafers. Compared with dry processing (such as plasma etching), wet processing can provide more uniform etching effects in some applications.

[0003] At the unload end (unloading end) of the wet processing device, the silicon wafers in the unload tray are transferred to the water tank by a robotic arm, and then the water tank is manually transported to the tank cleaning machine for cleaning.

[0004] When the robot transfers the silicon wafers from the unload tray to the water tank, the water tank has a gasket at the bottom to make the inclination angle of the water tank match the robot arm so that the silicon wafers can be smoothly transferred to the water tank. However, the gasket at the bottom of the water tank will wear out as the water tank is used for a long time, and even move relative to it, causing the water tank to tilt too much. After the unload end robot clamps the silicon wafer and moves to a fixed point, when placing the silicon wafer into the water tank along the original set path, mechanical interference may occur between the silicon wafer clamped by the robot and the silicon wafer in the water tank, which seriously affects the quality of the silicon wafer. Summary of the invention

[0005] In order to solve at least one technical problem in the above-mentioned prior art, the embodiments of the present disclosure provide a water tank and a silicon wafer taking and placing method, device and equipment.

[0006] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0007] In a first aspect, an embodiment of the present disclosure provides a water tank, comprising:

[0008] sink body;

[0009] The film box positioning member is arranged inside the water tank body, and the film box positioning member includes a first side and a second side opposite to each other in the horizontal direction; wherein,

[0010] On the first side, the bottom of the film box positioning member is hinged to the bottom surface of the water tank body;

[0011] On the second side, a lifting component is provided on the bottom surface of the water tank body, and the bottom end of the lifting component is installed on the bottom surface of the water tank body. The top end of the lifting component can be lifted and lowered in a vertical direction relative to the bottom surface of the water tank body, and the top end of the lifting component abuts against the bottom of the film box positioning member, so that the second side of the bottom of the film box positioning member can be lifted and lowered to different heights.

[0012] Exemplarily, on the second side, an elastic buffer is disposed at the bottom of the film box positioning member, and the top end of the lifting assembly abuts against the elastic buffer.

[0013] Exemplarily, the elastic buffer has a contact surface for contacting the top of the lifting component, and the contact surface is constructed as a hemispherical surface; wherein, when the top of the lifting component is lifted or lowered to different heights relative to the bottom surface of the sink body, the contact point position between the top of the lifting component and the hemispherical surface is different.

[0014] Exemplarily, a first sensor is provided on the side wall of the water tank body, and the first sensor is used to sense whether there is a target obstacle within its detection range.

[0015] Exemplarily, the water tank body includes a second side wall located on the second side, and a second sensor is provided on the second side wall, and the second sensor is used to sense the lifting height of the top end of the lifting assembly.

[0016] In a second aspect, an embodiment of the present disclosure provides a method for placing and taking a silicon wafer, which is used to place a silicon wafer in the water tank as described above; the method comprises:

[0017] Lifting the second side of the bottom of the cassette positioning member by the lifting assembly so that the second side of the cassette positioning member rotates around a hinge point between the first side and the water tank body until the second side of the bottom of the cassette positioning member rises from an initial height to a target height;

[0018] depositing silicon wafers into the water tank by means of a silicon wafer taking and placing mechanism;

[0019] When the number of silicon wafers stored in the water tank by the silicon wafer taking and placing mechanism reaches a target value, the top end of the lifting assembly is controlled to start descending until it reaches the initial height.

[0020] Exemplarily, when applied to the water tank as described above, the lifting assembly lifts up the second side of the bottom of the film box positioning member so that the second side of the film box positioning member rotates around the hinge point between the first side and the water tank body until the second side of the bottom of the film box positioning member rises from an initial height to a target height, specifically including:

[0021] When the first sensor detects that there is a target obstacle within its detection range, the lifting assembly starts to rise from the initial position.

[0022] Exemplarily, the second side of the bottom of the cassette positioning member is lifted up by the lifting assembly so that the second side of the cassette positioning member rotates around a hinge point between the first side and the water tank body until the second side of the bottom of the cassette positioning member rises from an initial height to a target height, specifically comprising:

[0023] When the second sensor senses that the top end of the lifting component rises from the initial height to the target height, the top end of the lifting component is controlled to stop moving and remain at the target height;

[0024] When the number of silicon wafers stored in the water tank by the silicon wafer taking and placing mechanism reaches a target value, the top end of the lifting assembly is controlled to start descending until it reaches the initial height, which specifically includes:

[0025] When the second sensor senses that the top end of the lifting component drops from the target height to the initial height, the top end of the lifting component is controlled to stop moving and remain at the initial height.

[0026] In a third aspect, an embodiment of the present disclosure provides a wet processing device, comprising:

[0027] A wet etching unit, comprising a loading end and a discharging end;

[0028] The water tank as described above, wherein the water tank is arranged at the discharge end;

[0029] A silicon wafer loading and unloading mechanism for transferring the silicon wafer from the wet etching unit to the silicon wafer in the water tank;

[0030] A control unit, the control unit is used to:

[0031] Controlling the lifting assembly to lift the second side of the bottom of the cassette positioning member, so that the second side of the cassette positioning member rotates around a hinge point between the first side and the water tank body, until the second side of the bottom of the cassette positioning member rises from an initial height to a target height;

[0032] When the second side of the bottom of the wafer box positioning member is at the target height, controlling the silicon wafer taking and placing mechanism to deposit the silicon wafer into the water tank;

[0033] When the number of silicon wafers stored in the water tank by the silicon wafer taking and placing mechanism reaches a target value, the top end of the lifting assembly is controlled to start descending until it reaches the initial height.

[0034] In a fourth aspect, an embodiment of the present disclosure provides an electronic device, comprising a memory, a processor, and one or more programs stored in the memory and executable on the processor, wherein when the one or more programs are executed by the processor, the electronic device executes the silicon wafer placement method as described above.

[0035] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0036] In the water tank and silicon wafer loading and unloading method, device and equipment provided by the embodiments of the present disclosure, the water tank includes a water tank body and a wafer box positioning member arranged inside the water tank body, wherein the wafer box positioning member includes a first side and a second side opposite to each other in a horizontal direction, on the first side, the bottom of the wafer box positioning member is hinged to the bottom of the water tank body, and on the second side, a lifting component is arranged between the bottom of the wafer box positioning member and the bottom surface of the water tank body, and the bottom end of the lifting component is installed on the bottom surface of the water tank body, the top end of the lifting component abuts against the bottom of the wafer box positioning member, and the top end of the lifting component can be lifted and lowered in a vertical direction to drive the bottom second side of the wafer box positioning member to lift and lower to different heights. In this way, when it is necessary to place silicon wafers into the water tank, after the wafer box is placed on the wafer box positioning member, the second side of the bottom of the wafer box positioning member is lifted up by the lifting assembly, and at this time, the second side of the wafer box positioning member rotates around the hinge point between the first side and the water tank body until the second side of the bottom of the wafer box positioning member rises from the initial height to the target height. In this way, by accurately controlling the lifting height of the lifting assembly, the purpose of tilting the bottom of the wafer box positioning member to a preset angle can be achieved. Therefore, when the silicon wafer is placed in the wafer box in the water tank by the silicon wafer picking and placing mechanism, since the inclination angle of the wafer box positioning member is a preset angle adapted to the silicon wafer picking and placing mechanism, mechanical interference between the silicon wafer in the wafer box and the silicon wafer picking and placing mechanism can be avoided, thereby avoiding damage to the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A schematic diagram showing the structure of a water tank in an embodiment of the present disclosure;

[0038] Figure 2 An enlarged view of a local area between the bottom of the water tank body and the bottom of the film box positioning member in the embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0040] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0041] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0042] In addition, in this document, unless otherwise defined, the terms "substantially", "substantially", "approximately" and "about" are used to describe and explain small changes. When used with an event or situation, these terms can cover situations where the event or situation occurs exactly, and can also cover situations where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being arranged along the same plane in the micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0043] like Figure 1 and Figure 2 As shown, an embodiment of the present disclosure provides a water tank, including a water tank body 100 and a film box positioning member 200.

[0044] The water tank body 100 has a chamber inside, and the water tank body 100 is constructed to be open at the top and closed at the bottom; the wafer box positioning member 200 is arranged inside the water tank body 100, and a wafer box (Cassette) 10 for storing silicon wafers can be placed on the wafer box positioning member 200. The film box positioning member 200 includes a first side 200A and a second side 200B which are opposite to each other in the horizontal direction; wherein, on the first side 200A, the bottom of the film box positioning member 200 is hinged to the bottom surface of the water tank body 100 through a hinge assembly 300; on the second side 200B, a lifting assembly 400 is provided on the bottom surface of the water tank body 100, and the bottom end of the lifting assembly 400 is installed on the bottom surface of the water tank body 100, and the top end of the lifting assembly 400 can be lifted and lowered relative to the bottom surface of the water tank body 100 along the vertical direction Y, and the top end of the lifting assembly 400 abuts against the bottom of the film box positioning member 200, so that the bottom second side 200B of the film box positioning member 200 can be lifted and lowered to different heights.

[0045] When it is necessary to place silicon wafers into the water tank, after placing the wafer box 10 on the wafer box positioning member 200, the second side 200B of the bottom of the wafer box positioning member 200 can be lifted up by the lifting assembly 400, and at this time, the second side 200B of the wafer box positioning member 200 rotates around the hinge point between the first side 200A and the water tank body 100 until the second side 200B of the bottom of the wafer box positioning member 200 rises from the initial height to the target height.

[0046] In this way, by precisely controlling the lifting height of the lifting assembly 400, the purpose of tilting the bottom of the wafer box positioning member 200 to a preset angle can be achieved. Therefore, when the silicon wafers are stored in the wafer box 10 in the water tank through the silicon wafer picking and placing mechanism, since the tilt angle of the wafer box positioning member 200 is a preset angle, mechanical interference between the silicon wafers in the wafer box 10 and the silicon wafer picking and placing mechanism can be avoided, thereby avoiding damage to the silicon wafers, effectively improving production capacity, and saving raw material costs and reducing labor costs while ensuring the quality of the silicon wafers.

[0047] In some embodiments, the hinge assembly 300 may include a rotating shaft, a first mounting member mounted on the first side 200A of the bottom of the film box positioning member 200, and a second mounting member disposed at the bottom of the water tank body 100. The first mounting member and the second mounting member are provided with mounting holes, and the rotating shaft is passed through the mounting holes. It is understood that the specific structure of the hinge assembly 300 is not limited thereto.

[0048] In some embodiments, the lifting assembly 400 may include a driving member and a lifting member that can be lifted and lowered along the vertical direction Y under the drive of the driving member. For example, the driving member may include a cylinder, etc., and the lifting member may include a lifting rod that can be lifted and lowered by the cylinder. Alternatively, the driving member may include a driving motor, etc., and the lifting member may include a lead screw that can be lifted and lowered by the driving motor. The specific structure of the lifting assembly 400 is not limited thereto.

[0049] In some embodiments, Figure 1 and Figure 2 As shown, on the second side 200B, an elastic buffer 500 is disposed at the bottom of the film box positioning member 200 , and the top end of the lifting assembly 400 abuts against the elastic buffer 500 .

[0050] By adopting the above scheme, the elastic buffer member 500 is provided to come into contact with the lifting assembly 400. The elastic buffer member 500 provides a structure for the film box positioning member 200 to come into contact with the top end of the lifting assembly 400, and can also play a buffering role to resist vibration and impact to a certain extent.

[0051] In some embodiments, Figure 1 and Figure 2 As shown, the elastic buffer 500 has a contact surface for contacting the top end of the lifting component 400, and the contact surface is constructed as a hemispherical surface; wherein, when the top end of the lifting component 400 is lifted or lowered to different heights relative to the bottom surface of the sink body 100, the contact point position between the top end of the lifting component 400 and the hemispherical surface is different.

[0052] During the lifting and lowering of the top end of the lifting component 400, the top to the bottom are kept in a vertical state, and during the lifting and lowering of the top end of the lifting component 400, the bottom inclination angle of the film box positioning member 200 gradually changes, that is, the angle between the top end of the lifting component 400 and the film box positioning member 200 changes. Therefore, if the contact surface 510 of the elastic buffer 500 is constructed as a plane, the top end of the lifting component 400 and the contact surface 510 of the elastic buffer 500 cannot be adaptively aligned, which may cause the structure to be unstable.

[0053] If the contact surface 510 of the spring buffer is constructed as a hemispherical surface, the top of the lifting assembly 400 contacts the hemispherical surface with a self-aligning characteristic during the lifting process of the top of the lifting assembly 400, which helps to improve the stability and durability of the entire structure, and the hemispherical contact can reduce the contact surface 510 area, reduce friction, and reduce wear. In addition, the hemispherical shape can distribute the load more evenly, reduce stress concentration, and thus improve the load-bearing capacity and service life of the component.

[0054] In some embodiments, as shown in the figure, the hemispherical surface is convex toward the direction of the lifting assembly 400. In other embodiments, the hemispherical surface can also be a concave surface provided on the elastic buffer 500.

[0055] Exemplarily, the elastic buffer 500 can be made of any suitable material such as rubber.

[0056] It should be noted that the above is only an example. In other embodiments, the contact or connection mode between the top of the lifting assembly 400 and the bottom of the film box positioning member 200 may not be limited to this. For example, the top of the lifting assembly 400 may also be hinged to the bottom of the film box positioning member 200. Compared with other modes such as hinge, the contact mode between the elastic buffer member 500 and the top of the lifting assembly 400 has less wear.

[0057] Furthermore, in some exemplary embodiments, Figure 1 and Figure 2 As shown, a first sensor 600 is provided on the side wall of the water tank body 100, and the first sensor 600 is used to sense whether there is a target obstacle within its detection range. For example, the water tank body 100 includes a first side wall 110 located at the first side 00A. The first sensor 600 can be installed outside the first side wall 110.

[0058] The target obstacle may be an object that can reflect that the water tank has reached the target position and that silicon wafers can be stored in the water tank. For example, the wet processing device includes a wet processing unit, which is mainly used to wet etch silicon wafers, etc. The wet processing unit may include a loading end (Load) and an unloading end (Unload). After the silicon wafers are processed by the wet processing unit, they are sent out from the unloading end and need to be stored in the water tank. The water tank can be pushed to the unloading end by a water pusher, so the target obstacle may be a position that reflects that the water tank has been pushed to the unloading end, and the target obstacle may be an object around the unloading end of the wet processing unit.

[0059] Therefore, when the first sensor 600 detects that there is a target obstacle within its detection range, the lifting assembly 400 can be controlled to rise from the initial position until the top end of the lifting assembly 400 reaches the target height.

[0060] As shown in the figure, in some embodiments, the sink body 100 includes a second side wall 120 located on the second side 200B, and a second sensor 700 is provided on the second side wall 120 , and the second sensor 700 is used to sense the lifting height of the top end of the lifting assembly 400 .

[0061] By adopting the above scheme, the lifting height of the top end of the lifting component 400 can be detected in real time by the second sensor 700. When the second sensor 700 senses that the top end of the lifting component 400 rises from the initial height to the target height, the top end of the lifting component 400 is controlled to stop moving and remain at the target height.

[0062] In addition, when the number of silicon wafers stored in the water tank by the silicon wafer picking and placing mechanism reaches the target value, it means that the silicon wafers have completed the storage operation in the water tank. At this time, the top of the lifting component 400 can be controlled to start descending until it reaches the initial height.

[0063] The lifting assembly 400 may be controlled to descend to the initial height based on the sensing signal of the second sensor 700. Specifically, when the second sensor 700 senses that the top of the lifting assembly 400 has descended from the target height to the initial height, the top of the lifting assembly 400 is controlled to stop moving and remain at the initial height.

[0064] Exemplarily, the target height of the top of the lifting assembly 400 is adapted to the position of the wafer pick-and-place mechanism (e.g., a robotic arm). For example, when the top of the lifting assembly 400 is at the target height, the bottom inclination angle of the wafer box positioning member 200 may be 0 to 20°. However, this is not limited thereto.

[0065] For example, the initial height may be a height that enables the bottom of the cassette positioning member 200 to remain horizontal.

[0066] In the wet processing process, when the top of the lifting assembly 400 descends to the initial height, the unloading of the silicon wafer from the wet processing unit is completed. At this time, the entire water tank can be sent to the cleaning machine for the next cleaning step by pushing a water cart.

[0067] Exemplarily, any one of the first sensor 600 and the second sensor 700 can be any suitable sensor such as an ultrasonic sensor, a laser sensor, an infrared sensor, a radar sensor, a photoelectric sensor, a contact sensor, a capacitive sensor, a magnetic sensor or a visual sensor.

[0068] Among them, ultrasonic sensors detect the distance of obstacles by emitting ultrasonic waves and measuring their return time. Infrared sensors detect obstacles using infrared light. Laser sensors measure the distance to obstacles using laser beams, with high accuracy and long measurement range. Photoelectric sensors detect obstacles by blocking the light beam. Radar sensors detect obstacles using electromagnetic waves. Contact sensors detect obstacles through physical contact, such as limit switches and touch sensors. Capacitive sensors detect the presence of objects by measuring changes in capacitance. Magnetic sensors identify obstacles by detecting changes in magnetic fields. Vision sensors (cameras) use image processing technology to identify obstacles.

[0069] In addition, it should be noted that the water tank in the embodiment of the present disclosure is not only suitable for unloading wet-treated silicon wafers in a wet processing process, but can also be used in other process equipment. According to the requirements of different process equipment, the lifting height of the lifting assembly 400 can be adaptively adjusted to meet production needs.

[0070] In addition, the embodiment of the present disclosure further provides a method for placing and taking a silicon wafer, which is used to place a silicon wafer in a water tank in the embodiment of the present disclosure; the method comprises the following steps:

[0071] Step S01, lift up the second side 200B of the bottom of the film box positioning member 200 by the lifting assembly 400, so that the second side 200B of the film box positioning member 200 rotates around the hinge point between the first side 200A and the water tank body 100, until the second side 200B of the bottom of the film box positioning member 200 rises from the initial height to the target height;

[0072] Step S02, placing the silicon wafer 30 in the water tank through the silicon wafer placing and taking mechanism 20;

[0073] Step S03: When the number of silicon wafers 30 stored in the water tank by the silicon wafer placing and retrieving mechanism 20 reaches a target value, the top end of the lifting assembly 400 is controlled to start descending until it reaches the initial height.

[0074] In the above scheme, when it is necessary to place the silicon wafer 30 into the water tank, after the wafer box 10 is placed on the wafer box positioning member 200, the second side 200B of the bottom of the wafer box positioning member 200 can be lifted up by the lifting component 400, and at this time, the second side 200B of the wafer box positioning member 200 rotates around the hinge point between the first side 200A and the water tank body 100 until the second side 200B of the bottom of the wafer box positioning member 200 rises from the initial height to the target height. In this way, by accurately controlling the lifting height of the lifting component 400, the purpose of tilting the bottom of the wafer box positioning member 200 to a preset angle can be achieved. Therefore, when the silicon wafer 30 is placed in the wafer box 10 in the water tank by the silicon wafer placement mechanism 20, since the tilt angle of the wafer box positioning member 20 is the preset angle, mechanical interference between the silicon wafer 30 in the wafer box 10 and the silicon wafer placement mechanism 20 can be avoided, thereby avoiding damage to the silicon wafer 30.

[0075] In some exemplary embodiments, the above step S01 specifically includes: when the first sensor 600 detects that there is a target obstacle within its detection range, the lifting assembly 400 starts to rise from the initial position.

[0076] In some exemplary embodiments, the above step S02 specifically includes: when the second sensor 700 senses that the top end of the lifting assembly 400 rises from the initial height to the target height, the top end of the lifting assembly 400 is controlled to stop moving and remain at the target height; the above step S03 specifically includes: when the second sensor 700 senses that the top end of the lifting assembly 400 drops from the target height to the initial height, the top end of the lifting assembly 400 is controlled to stop moving and remain at the initial height.

[0077] In addition, the present disclosure provides a wet processing device, including:

[0078] A wet etching unit, comprising a loading end and a discharging end;

[0079] The water tank in the disclosed embodiment is provided at the discharge end;

[0080] For transferring the silicon wafer 30 from the wet etching unit to the silicon wafer loading and unloading mechanism 20 in the water tank;

[0081] A control unit, the control unit is used to:

[0082] Control the lifting assembly 400 to lift the second side 200B of the bottom of the film box positioning member 200, so that the second side 200B of the film box positioning member 200 rotates around the hinge point between the first side 200A and the water tank body 100, until the second side 200B of the bottom of the film box positioning member 200 rises from the initial height to the target height;

[0083] When the second bottom side 200B of the wafer box positioning member 200 is at the target height, the silicon wafer taking and placing mechanism 20 is controlled to place the silicon wafer 30 in the water tank;

[0084] When the number of silicon wafers 30 stored in the water tank by the silicon wafer taking and placing mechanism reaches the target value, the top end of the lifting assembly 400 is controlled to start descending until it reaches the initial height.

[0085] The control unit may be a control system in the entire wet processing device.

[0086] In addition, an embodiment of the present disclosure provides an electronic device, including a memory, a processor, and one or more programs stored in the memory and executable on the processor. When the one or more programs are executed by the processor, the electronic device executes the silicon wafer placement method as described above.

[0087] In one embodiment, the present disclosure further provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0088] The above-mentioned computer-readable storage medium implements the steps in the above-mentioned method embodiments when the computer program stored in its memory is executed by the processor. Similarly, it can also bring about the beneficial effects brought by the above-mentioned silicon wafer placement method, which will not be repeated here.

[0089] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0090] There are a few points to note:

[0091] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0092] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0093] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0094] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A water tank, characterized in that: include: sink body; The film box positioning member is arranged inside the water tank body, and the film box positioning member includes a first side and a second side opposite to each other in the horizontal direction; wherein, On the first side, the bottom of the film box positioning member is hinged to the bottom surface of the water tank body; On the second side, a lifting component is provided on the bottom surface of the water tank body, and the bottom end of the lifting component is installed on the bottom surface of the water tank body. The top end of the lifting component can be lifted and lowered in a vertical direction relative to the bottom surface of the water tank body, and the top end of the lifting component abuts against the bottom of the film box positioning member, so that the second side of the bottom of the film box positioning member can be lifted and lowered to different heights.

2. The water tank according to claim 1, characterized in that: On the second side, an elastic buffer is disposed at the bottom of the film box positioning member, and the top end of the lifting assembly abuts against the elastic buffer.

3. The water tank according to claim 2, characterized in that: The elastic buffer has a contact surface for contacting the top end of the lifting assembly, and the contact surface is configured as a hemispherical surface.

4. The water tank according to claim 1, characterized in that: A first sensor is disposed on the side wall of the water tank body, and the first sensor is used to sense whether there is a target obstacle within its detection range.

5. The water tank according to claim 1, characterized in that: The water tank body includes a second side wall located on the second side, and a second sensor is provided on the second side wall. The second sensor is used to sense the lifting height of the top end of the lifting assembly.

6. A method for picking up and placing a silicon wafer, characterized in that: Used for storing silicon wafers in a water tank as claimed in any one of claims 1 to 5; the method comprising: Lifting the second side of the bottom of the cassette positioning member by the lifting assembly so that the second side of the cassette positioning member rotates around a hinge point between the first side and the water tank body until the second side of the bottom of the cassette positioning member rises from an initial height to a target height; depositing silicon wafers into the water tank by means of a silicon wafer taking and placing mechanism; When the number of silicon wafers stored in the water tank by the silicon wafer taking and placing mechanism reaches a target value, the top end of the lifting assembly is controlled to start descending until it reaches the initial height.

7. The silicon wafer placing method according to claim 6, characterized in that: When applied to the water tank as claimed in claim 4, the second side of the bottom of the film box positioning member is lifted up by the lifting assembly so that the second side of the film box positioning member rotates around the hinge point between the first side and the water tank body until the second side of the bottom of the film box positioning member rises from an initial height to a target height, specifically comprising: When the first sensor detects that there is a target obstacle within its detection range, the lifting assembly starts to rise from the initial position.

8. The silicon wafer placing method according to claim 6, characterized in that: When applied to the water tank as claimed in claim 5, the second side of the bottom of the film box positioning member is lifted up by the lifting assembly so that the second side of the film box positioning member rotates around the hinge point between the first side and the water tank body until the second side of the bottom of the film box positioning member rises from an initial height to a target height, specifically comprising: When the second sensor senses that the top end of the lifting component rises from the initial height to the target height, the top end of the lifting component is controlled to stop moving and remain at the target height; When the number of silicon wafers stored in the water tank by the silicon wafer taking and placing mechanism reaches a target value, the top end of the lifting assembly is controlled to start descending until it reaches the initial height, which specifically includes: When the second sensor senses that the top end of the lifting component drops from the target height to the initial height, the top end of the lifting component is controlled to stop moving and remain at the initial height.

9. A wet processing device, characterized in that: include: A wet etching unit, comprising a loading end and a discharging end; The water tank according to any one of claims 1 to 5, wherein the water tank is arranged at the discharge end; A silicon wafer loading and unloading mechanism for transferring the silicon wafer from the wet etching unit to the silicon wafer in the water tank; A control unit, the control unit is used for: Controlling the lifting assembly to lift the second side of the bottom of the cassette positioning member, so that the second side of the cassette positioning member rotates around a hinge point between the first side and the water tank body, until the second side of the bottom of the cassette positioning member rises from an initial height to a target height; When the second side of the bottom of the wafer box positioning member is at the target height, controlling the silicon wafer taking and placing mechanism to deposit the silicon wafer into the water tank; When the number of silicon wafers stored in the water tank by the silicon wafer taking and placing mechanism reaches a target value, the top end of the lifting assembly is controlled to start descending until it reaches the initial height.

10. An electronic device, characterized in that: The electronic device comprises a memory, a processor and one or more programs stored in the memory and executable on the processor. When the one or more programs are executed by the processor, the electronic device executes the silicon wafer placement method as described in any one of claims 6 to 8.

Images