Spinneret plate surface treatment method

Abstract

The invention provides a spinneret plate surface treatment method which comprises the following steps: S1, grinding the plate surface of a spinneret plate by adopting a grinding head, and polishing spinneret orifices of the spinneret plate by adopting abrasive flow; and S2, the step S1 is repeated at least once, and the mesh number of the grinding head and the mesh number of the abrasive flow are gradually increased when the step S1 is repeated every time. Due to the fact that the mesh number of the grinding head and the mesh number of the abrasive flow are gradually increased when the step S1 is repeated every time, the plate face and the spinneret orifices of the spinneret plate can be gradually ground from coarse to fine, and the grinding effect on the plate face and the spinneret orifices of the spinneret plate can be improved.

Description

Technical Field

[0001] The invention belongs to the technical field of spinneret surface treatment, and in particular relates to a spinneret surface treatment method. Background Art

[0002] After being used for a period of time, the spinneret for polyacrylonitrile-based carbon fiber precursor is prone to produce an oxide film (also called passivation film) or pits after corrosion due to factors such as cleaning and use, which seriously increases the roughness of the spinneret surface, changes the surface tension of the spinneret, and is prone to overflow, etc., affecting the spinning effect; in addition, the spinneret has slight surface scratches during transportation and installation, which can seriously affect the surface tension of the spinneret, affecting the spinning stability and production operation of the spinneret. For this reason, the surface of the spinneret that has been used for a period of time needs to be mirror-polished to improve the spinning stability and stabilize the production operation.

[0003] Existing spinneret grinding devices and technologies all focus on the equipment itself, with little research on the grinding method and the use effect and parameter changes of the spinneret after grinding. The spinneret after grinding has a greater impact on the spinning effect due to the large changes in equipment parameters, and scratches on the edge of the spinneret hole after grinding can easily cause overflow, further affecting the spinning stability and production stability. Summary of the invention

[0004] Therefore, the present invention provides a method for treating the surface of a spinneret, and the main technical problem to be solved is: how to improve the surface treatment quality of the spinneret.

[0005] In order to solve the above problems, the present invention provides a spinneret surface treatment method, which comprises:

[0006] Step S1: grinding the plate surface of the spinneret with a grinding head, and polishing the spinneret holes of the spinneret with an abrasive flow;

[0007] Step S2: Repeat the above step S1 at least once, and the mesh size of the grinding head and the mesh size of the abrasive flow are gradually increased each time step S1 is repeated.

[0008] In some embodiments, the rotation speed of the grinding head and the speed of the abrasive flow are gradually reduced each time step S1 is repeated.

[0009] In some embodiments, step S0 is performed before step S1, and step S0 is: determining the qualified rate a of the spinneret; wherein, if the qualified rate a of the spinneret is lower than a preset value, the above steps S1 and S2 are performed.

[0010] In some embodiments, when step S1 is performed for the first time, the mesh number b1 of the grinding head, the rotation speed c1 of the grinding head, and the grinding time d1 satisfy the formula (1) with the qualified rate a of the spinneret in step S0. The formula (1) is: a=k1+b1*c1*d1*10 -8 ; Wherein, k1 is the correction coefficient, and -1.5≤k1≤0.5, b1=2000~5000 mesh, c1=1000~2000r / min, d1 is less than 20 minutes;

[0011] And / or, when the step S1 is implemented for the second time, the mesh number b2 of the grinding head, the rotation speed c2 of the grinding head and the grinding time d2 and the qualified rate a of the spinneret in the step S0 satisfy the formula (2), which is: a=k2+b2*c2*d2*10 -8 ; Among them, k2 is the correction coefficient, and -1.0≤k2≤0.7, b2=5000~8000 mesh, c2=500~1000r / min, d2 is less than 20min.

[0012] In some embodiments, when step S1 is performed for the first time, the mesh size b3 of the abrasive flow, the speed c3 of the abrasive flow, and the polishing time d3 satisfy the formula (3) with the qualified rate a of the spinneret in step S0. The formula (3) is: a=k3+b3*c3*d3*10 -4 ; Wherein, k3 is the correction coefficient, and -0.1≤k3≤0.5, b3=2000~5000 mesh, c3≤0.05r / min, d3 is less than 40 minutes;

[0013] And / or, when the step S1 is implemented for the second time, the mesh size b4 of the abrasive flow, the speed c4 of the abrasive flow, and the polishing time d4 and the qualified rate a of the spinneret in the step S0 satisfy the formula (4), which is: a=k4+b4*c4*d4*10 -4 ; Among them, k4 is the correction coefficient, and -0.1≤k4≤0.5, b4=5000~8000 mesh, c4≤0.02r / min, d4 is less than 40 minutes.

[0014] In some embodiments, before step S1, the thickness of the spinneret is H0, and the diameter of the spinneret hole is R0; after the above step S2, the thickness loss of the spinneret is H, and the diameter loss of the spinneret hole is R; wherein,

[0015] R0 / H0=(R0-R) / (H0-H); and / or, H≤0.06mm; and / or, R≤0.02mm.

[0016] In some embodiments, after the first implementation of step S1, the thickness loss of the spinneret is H1; after the second implementation of step S1, the thickness loss of the spinneret is H2; wherein H1:H2≤3:1;

[0017] And / or, after the first implementation of step S1, the diameter loss of the spinneret hole is R1; after the second implementation of step S1, the diameter loss of the spinneret hole is R2; wherein R1:R2≤3:1.

[0018] In some embodiments, before step S1, the diameter of the spinneret hole is R0; after the above step S2, the diameter loss of the spinneret hole is R, and the diameter of the spinneret hole is R3; wherein,

[0019]

[0020] Among them, m2-10≦m1≦m2+10, m2 is the linear density of the raw silk after the polymer liquid is sprayed out from the spinneret and then solidified, washed and hot drawn, oiled, dried, steam stretched and then rolled into a shaft; m3 is the winding speed of the raw silk after steam stretching, m4 is the density of the polymer liquid flowing out of the spinneret, m5 is the solute content of the polymer liquid flowing out of the spinneret, m6 is the speed at which the polymer liquid is sprayed through the spinneret, m7 is the number of spinneret holes on the spinneret, and m8 is the number of plies.

[0021] In some embodiments, the spinneret is a circular plate; in step S1, when the surface of the spinneret is ground by a grinding head, the spinneret rotates around its own center line, the rotation center line of the grinding head is perpendicular to the rotation center line of the spinneret, and the grinding head also moves radially along the spinneret.

[0022] In some embodiments, after step S2, the method further includes:

[0023] Step S3: cleaning the spinneret.

[0024] The surface treatment method of a spinneret provided by the present invention has the following beneficial effects:

[0025] 1. Since the mesh size of the grinding head and the mesh size of the abrasive flow are gradually increased each time step S1 is repeated, the plate surface and the spinneret holes of the spinneret can be gradually ground from coarse to fine, which can improve the grinding effect of the plate surface and the spinneret holes of the spinneret.

[0026] 2. The present invention uniformly rough-grinds the plate surface and spinneret holes of the spinneret first, and then uniformly fine-grinds the plate surface and spinneret holes after the plate surface and spinneret holes have been rough-ground. This can avoid interference caused by the cross-grinding and fine-grinding of the plate surface and the spinneret holes. For example, if the spinneret holes are rough-grinded after the plate surface is fine-ground, the rough-grinding process of the spinneret holes will affect the quality of the plate surface that has been fine-ground; similarly, if the plate surface is rough-grinded after the spinneret holes are fine-ground, the rough-grinding process of the plate surface will also affect the quality of the spinneret holes that have been fine-ground.

[0027] 3. The shallow scratches and passivation layer on the surface of the spinneret are eliminated after grinding and polishing, and the spinning effect and fiber quality of the spinneret are not affected. The service life of the spinneret is extended and the spinning effect is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. The drawings described below are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0029] Figure 1 is a flow chart of the spinneret surface treatment method of the present invention;

[0030] Figure 2 This is a picture showing the effect of treating the surface of the spinneret using the existing conventional grinding scheme;

[0031] Figure 3 The figure is a diagram showing the effect of treating the surface of a spinneret by using the solution of the present invention. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0034] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0035] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0036] See also Figure 1 As shown, according to an embodiment of the present invention, a method for treating a spinneret surface is provided, which comprises:

[0037] Step S1: grinding the plate surface of the spinneret with a grinding head, and polishing the spinneret holes of the spinneret with an abrasive flow.

[0038] Step S2: Repeat the above step S1 at least once, and the mesh size of the grinding head and the mesh size of the abrasive flow are gradually increased each time step S1 is repeated.

[0039] In the above example, since the mesh size of the grinding head and the mesh size of the abrasive flow are gradually increased each time step S1 is repeated, the plate surface and the spinneret holes of the spinneret can be gradually ground from coarse to fine, which can improve the grinding effect of the plate surface and the spinneret holes of the spinneret.

[0040] In addition, the present invention uniformly rough-grinds the plate surface and spinneret holes of the spinneret first, and then uniformly fine-grinds the plate surface and spinneret holes of the spinneret after the plate surface and spinneret holes of the spinneret have been rough-ground. This can avoid interference caused by the rough grinding and fine grinding of the plate surface and the spinneret holes. For example, if the spinneret holes are rough-ground after the plate surface is fine-ground, the rough grinding process of the spinneret holes will affect the quality of the plate surface that has been fine-ground; similarly, if the plate surface is rough-ground after the spinneret holes are fine-ground, the rough grinding process of the plate surface will also affect the quality of the spinneret holes that have been fine-ground.

[0041] In some embodiments, each time step S1 is repeated, the rotation speed of the grinding head and the speed of the abrasive flow are gradually reduced, so that fine grinding can be achieved and the grinding quality can be improved.

[0042] In some embodiments, step S0 is performed before step S1, and step S0 is: determining the qualified rate a of the spinneret. If the qualified rate a of the spinneret is lower than a preset value, the above steps S1 and S2 are performed.

[0043] In the above example, if the qualified rate of the spinneret meets the requirements, grinding is not required. Only when the qualified rate of the spinneret is lower than the preset value, the above steps S1 and S2 are used for grinding, which can improve production efficiency.

[0044] In some embodiments, the qualified rate of the aforementioned spinneret can be determined by the following method: first, the parameters of each spinneret hole on the spinneret are measured; if the parameters of the spinneret hole are within the preset range, the spinneret hole is a qualified hole; if the parameters of the spinneret hole are not within the preset range, the spinneret hole is an unqualified hole. Wherein, the qualified rate of the spinneret = the number of qualified holes / the total number of spinneret holes on the spinneret.

[0045] In some embodiments, the parameters of the spinneret include at least one parameter index of a maximum diameter parameter index, a minimum diameter parameter index, a roundness parameter index, a hole area parameter index, and a hole cleanliness parameter index. Wherein, each parameter index corresponds to a corresponding preset index range. When the parameters of the spinneret include more than two parameter indexes, the parameters of the spinneret are within the preset range, which means that each parameter index of the spinneret is within the corresponding preset index range, and the parameters of the spinneret are not within the preset range, which means that at least one parameter index of the spinneret is not within the corresponding preset index range.

[0046] It should be noted here that the parameter indicators of the spinneret hole can be measured by taking pictures with optical instruments.

[0047] In some embodiments, when step S1 is implemented for the first time, the mesh number b1 of the grinding head, the rotation speed c1 of the grinding head, and the grinding time d1 satisfy the formula (1) with the qualified rate a of the spinneret in step S0. The formula (1) is: a=k1+b1*c1*d1*10 -8 ; Wherein, k1 is the correction coefficient, and -1.5≤k1≤0.5, b1=2000~5000 mesh, c1=1000~2000r / min, d1 is less than 20 minutes.

[0048] In the above example, after the qualified rate of the spinneret in step S0 is determined, the operator can quickly determine the mesh size b1 of the grinding head, the rotation speed c1 of the grinding head and the grinding time d1 required during grinding according to the above formula (1), thereby reducing the grinding parameter selection time of the grinding head and improving the grinding efficiency.

[0049] In some embodiments, when step S1 is performed for the second time, the mesh number b2 of the grinding head, the rotation speed c2 of the grinding head, and the grinding time d2 satisfy the formula (2) with the qualified rate a of the spinneret in step S0. The formula (2) is: a=k2+b2*c2*d2*10 -8 Among them, k2 is the correction coefficient, and -1.0≤k2≤0.7, b2=5000~8000 mesh, c2=500~1000r / min, d2 is less than 20min.

[0050] In the above example, after the qualified rate of the spinneret in step S0 is determined, the operator can quickly determine the mesh size b2 of the grinding head, the rotation speed c2 of the grinding head and the grinding time d2 required during grinding according to the above formula (2), thereby reducing the grinding parameter selection time of the grinding head and improving the grinding efficiency.

[0051] In some embodiments, the surface of the spinneret is ground using the aforementioned formula (1) when step S1 is implemented for the first time, and the surface of the spinneret is ground using the aforementioned formula (2) when step S2 is implemented for the second time. The combination of the two can improve the grinding quality of the spinneret surface, making the surface roughness Ra of the spinneret ≤0.1, and the flatness of the surface of the spinneret ≤0.2 / 100mm.

[0052] In some embodiments, when step S1 is performed for the first time, the mesh size b3 of the abrasive flow, the speed c3 of the abrasive flow, and the polishing time d3 satisfy the formula (3) with the qualified rate a of the spinneret in step S0. The formula (3) is: a=k3+b3*c3*d3*10 -4 ; Among them, k3 is the correction coefficient, and -0.1≤k3≤0.5, b3=2000~5000 mesh, c3≤0.05r / min, d3 is less than 40 minutes.

[0053] In the above example, after the qualified rate of the spinneret in step S0 is determined, the operator can quickly determine the mesh size b3 of the abrasive flow, the speed c3 of the abrasive flow and the polishing time d3 required during polishing according to the above formula (3), thereby reducing the polishing parameter selection time of the abrasive flow and improving the polishing efficiency.

[0054] In some embodiments, when step S1 is performed for the second time, the mesh size b4 of the abrasive flow, the speed c4 of the abrasive flow, and the polishing time d4 satisfy the formula (4) with the qualified rate a of the spinneret in step S0. The formula (4) is: a=k4+b4*c4*d4*10 -4 ; Among them, k4 is the correction coefficient, and -0.1≤k4≤0.5, b4=5000~8000 mesh, c4≤0.02r / min, d4 is less than 40 minutes.

[0055] In the above example, after the qualified rate of the spinneret in step S0 is determined, the operator can quickly determine the mesh size b4 of the abrasive flow, the speed c4 of the abrasive flow and the polishing time d4 required during polishing according to the above formula (4), thereby reducing the polishing parameter selection time of the abrasive flow and improving the polishing efficiency.

[0056] In some embodiments, the spinneret holes are polished using the aforementioned formula (3) when step S1 is implemented for the first time, and the spinneret holes are polished using the aforementioned formula (4) when step S2 is implemented for the second time. The combination of the two can improve the polishing quality of the spinneret holes of the spinneret plate, so that the qualified rate of the spinneret plate is ≥99.8%.

[0057] In some embodiments, before step S1, the thickness of the spinneret is H0, and the diameter of the spinneret hole is R0. After the above step S2, the thickness loss of the spinneret is H, and the diameter loss of the spinneret hole is R. Wherein, R0 / H0=(R0-R) / (H0-H).

[0058] In the above example, by making R0 / H0=(R0-R) / (H0-H), it can be ensured that the aspect ratio of the spinneret hole (the ratio of the length of the spinneret hole to the diameter of the spinneret hole) does not change after grinding, thereby avoiding the extrusion expansion effect of the solution flow, and further affecting indicators such as the coagulation effect and linear density.

[0059] In some embodiments, the aforementioned H is ≤ 0.06 mm, so as to avoid excessive length change after grinding, which may affect the extrusion swelling effect and process of the solution stream, and further affect the coagulation effect and linear density and other indicators.

[0060] In some embodiments, the aforementioned R is ≤ 0.02 mm, so as to avoid excessive diameter change after grinding, which may affect the extrusion swelling effect and process of the solution stream, and further affect the coagulation effect and linear density and other indicators.

[0061] In some embodiments, after the first implementation of step S1, the thickness loss of the spinneret is H1. After the second implementation of step S1, the thickness loss of the spinneret is H2. Wherein, H1:H2≤3:1.

[0062] In the above example, the grinding quality of the spinneret surface can be improved by making H1:H2≤3:1. If H1:H2 is too large, the plate surface is prone to excessively deep barbs after the first grinding, and the plate surface is prone to incomplete treatment after the second grinding and correction, which can easily cause wire breakage after the spinneret is put on line. If H1:H2 is too small, the plate surface is not thoroughly ground for the first time, the plate surface problem cannot be effectively handled, and the second grinding increases the difficulty. After the second grinding, the plate surface is prone to excessive thickness loss.

[0063] In some embodiments, after the first implementation of step S1, the diameter loss of the spinneret hole is R1. After the second implementation of step S1, the diameter loss of the spinneret hole is R2. Wherein, R1:R2≤3:1.

[0064] In the above example, by making R1:R2≤3:1, the polishing quality of the spinneret hole can be improved. If H1:H2 is too large, the spinneret hole is prone to excessive diameter loss after the first polishing, which increases the difficulty of the second polishing correction, causing the spinneret hole diameter loss to exceed the standard after the second polishing, and the key indicators such as line density are prone to exceed the process range after the spinneret is put on line. If R1:R2 is too small, the spinneret hole is not polished thoroughly for the first time, the spinneret hole problem cannot be effectively handled, and the difficulty of the second polishing is increased. After the second polishing of the spinneret hole, it is easy to cause new damage to the plate surface, increase the number of grinding and polishing, and may cause the spinneret to be scrapped and unusable.

[0065] In some embodiments, the diameter of the spinneret before step S1 is R0. After the above step S2, the diameter loss of the spinneret is R, and the diameter of the spinneret is R3.

[0066]

[0067] Among them, m2-10≦m1≦m2+10, m2 is the linear density of the raw silk after the polymer liquid is sprayed out from the spinneret, solidified, washed, hot drawn, oiled, dried, steam-drawn, and then rolled into a shaft; m3 is the winding speed of the raw silk after steam drawing, m4 is the density of the polymer liquid flowing out of the spinneret, m5 is the solute content of the polymer liquid flowing out of the spinneret, m6 is the speed of the polymer liquid spraying through the spinneret, m7 is the number of spinneret holes on the spinneret, and m8 is the number of strands. Among them, the number of strands m8 = the number of K of the wound raw silk / the number of K of the spinneret. For example, if the wound raw silk is 24K and the spinneret uses 3K, then the number of strands m8 = 24K / 3K = 8.

[0068] It should be noted that the unit of the aforementioned linear density m2 is kg / m, the unit of the winding speed m3 is m / min, and the unit of the polymer solution density m4 is kg / m 3 The unit of spinning speed m6 is m / min.

[0069] In the above example, by using The diameter of the spinneret holes of the ground spinneret meets the requirements, and the indicators such as the linear density of the prepared fibers, i.e. the raw fibers, are within the range of process requirements.

[0070] In some embodiments, the spinneret is a circular plate. In step S1, when the grinding head is used to grind the plate surface of the spinneret, the spinneret rotates around its own center line, the rotation center line of the grinding head is perpendicular to the rotation center line of the spinneret, and the grinding head also moves along the radial direction of the spinneret, so that the grinding head can grind the plate surface of the spinneret in three dimensions, and the grinding effect is better.

[0071] In some embodiments, after step S2, step S3 is further included, and step S3 is: cleaning the spinneret. Specifically, sulfoxide ultrasonic + sulfoxide spin washing, hot water high pressure spin washing, alkali solution ultrasonic + alkali solution spin washing, hot water high pressure spin washing, hot water ultrasonic cleaning and hot water spin washing can be used in sequence. After cleaning the spinneret, compressed air blowing is used. The duration of each step is 20-100 minutes.

[0072] It should be noted that: each time after the step S1 is implemented, the spinneret is cleaned before proceeding to the next step.

[0073] Among them, after the surface of the spinneret is processed by the conventional grinding scheme, the surface roughness of the spinneret is Ra=0.2, the surface flatness is 0.5 / 100mm, and the thickness loss of the spinneret is 0.4mm. The effect diagram after grinding can be seen in Figure 2 ,from Figure 2 It can be seen from the figure that the spinneret hole is damaged, which leads to overflow and broken wires during the spinning process.

[0074] When the surface of the spinneret is treated by the above-mentioned scheme of the present invention, R0 / H0=(R0-R) / (H0-H); H≤0.06mm, R≤0.02mm; H1:H2≤3:1; R1:R2≤3:1, and The surface roughness of the spinneret can be made Ra≤0.1, and the surface flatness ≤0.2 / 100mm, and the qualified rate of the spinneret holes ≥99.8%, meeting the performance index requirements of the original silk. The effect diagram after treatment can be seen in Figure 3 ,from Figure 3 It can be seen that the spinneret holes are not damaged, thus improving the spinneret quality.

[0075] It is easy for those skilled in the art to understand that, without conflict, the advantageous technical features of the above-mentioned methods can be freely combined and superimposed.

[0076] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. The above description is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present invention. These improvements and variations should also be regarded as the protection scope of the present invention.

Claims

1. A method for treating a spinneret surface, characterized in that: include: Step S1: grinding the plate surface of the spinneret with a grinding head, and polishing the spinneret holes of the spinneret with an abrasive flow; Step S2: Repeat the above step S1 at least once, and the mesh size of the grinding head and the mesh size of the abrasive flow are gradually increased each time step S1 is repeated.

2. The spinneret surface treatment method according to claim 1, characterized in that: Each time step S1 is repeated, the rotation speed of the grinding head and the speed of the abrasive flow are gradually reduced.

3. The spinneret surface treatment method according to claim 1 or 2, characterized in that: Before step S1, step S0 is first performed, and step S0 is: measuring the qualified rate a of the spinneret; if the qualified rate a of the spinneret is lower than a preset value, the above steps S1 and S2 are performed.

4. The spinneret surface treatment method according to claim 3, characterized in that: When step S1 is implemented for the first time, the mesh number b1 of the grinding head, the rotation speed c1 of the grinding head, and the grinding time d1 satisfy the formula (1) with the qualified rate a of the spinneret in step S0. The formula (1) is: a=k1+b1*c1*d1*10 -8 ; Wherein, k1 is the correction coefficient, and -1.5≤k1≤0.5, b1=2000~5000 mesh, c1=1000~2000r / min, d1 is less than 20 minutes; And / or, when the step S1 is implemented for the second time, the mesh number b2 of the grinding head, the rotation speed c2 of the grinding head and the grinding time d2 and the qualified rate a of the spinneret in the step S0 satisfy the formula (2), which is: a=k2+b2*c2*d2*10 -8 ; Among them, k2 is the correction coefficient, and -1.0≤k2≤0.7, b2=5000~8000 mesh, c2=500~1000r / min, d2 is less than 20min.

5. The spinneret surface treatment method according to claim 3, characterized in that: When step S1 is implemented for the first time, the mesh size b3 of the abrasive flow, the speed c3 of the abrasive flow, and the polishing time d3 satisfy the formula (3) with the qualified rate a of the spinneret in step S0. The formula (3) is: a=k3+b3*c3*d3*10 -4 ; Wherein, k3 is the correction coefficient, and -0.1≤k3≤0.5, b3=2000~5000 mesh, c3≤0.05r / min, d3 is less than 40 minutes; And / or, when the step S1 is implemented for the second time, the mesh size b4 of the abrasive flow, the speed c4 of the abrasive flow, and the polishing time d4 and the qualified rate a of the spinneret in the step S0 satisfy the formula (4), which is: a=k4+b4*c4*d4*10 -4 ; Among them, k4 is the correction coefficient, and -0.1≤k4≤0.5, b4=5000~8000 mesh, c4≤0.02r / min, d4 is less than 40 minutes.

6. The method for treating the spinneret surface according to any one of claims 1-2 and 4-5, characterized in that: Before step S1, the thickness of the spinneret is H0, and the diameter of the spinneret hole is R0; after the above step S2, the thickness loss of the spinneret is H, and the diameter loss of the spinneret hole is R; wherein, R0 / H0=(R0-R) / (H0-H); and / or, H≤0.06mm; and / or, R≤0.02mm.

7. The method for treating the spinneret surface according to any one of claims 1-2 and 4-5, characterized in that: After the first implementation of step S1, the thickness loss of the spinneret is H1; after the second implementation of step S1, the thickness loss of the spinneret is H2; wherein H1:H2≤3:1; And / or, after the first implementation of step S1, the diameter loss of the spinneret hole is R1; after the second implementation of step S1, the diameter loss of the spinneret hole is R2; wherein R1:R2≤3:

1.

8. The method for treating the spinneret surface according to any one of claims 1-2 and 4-5, characterized in that: Before step S1, the diameter of the spinneret hole is R0; after the above step S2, the diameter loss of the spinneret hole is R, and the diameter of the spinneret hole is R3; wherein, Among them, m2-10≦m1≦m2+10, m2 is the linear density of the raw silk after the polymer liquid is sprayed out from the spinneret and then solidified, washed and hot drawn, oiled, dried, steam stretched and then rolled into a shaft; m3 is the winding speed of the raw silk after steam stretching, m4 is the density of the polymer liquid flowing out of the spinneret, m5 is the solute content of the polymer liquid flowing out of the spinneret, m6 is the speed at which the polymer liquid is sprayed through the spinneret, m7 is the number of spinneret holes on the spinneret, and m8 is the number of plies.

9. The method for treating the spinneret surface according to any one of claims 1-2 and 4-5, characterized in that: The spinneret is a circular plate; in step S1, when the grinding head is used to grind the plate surface of the spinneret, the spinneret rotates around its own center line, the rotation center line of the grinding head is perpendicular to the rotation center line of the spinneret, and the grinding head also moves along the radial direction of the spinneret.

10. The method for treating the spinneret surface according to any one of claims 1-2, 4-5, characterized in that: After step S2, the method further includes: Step S3: cleaning the spinneret.

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