Method, system, equipment and medium for enhancing performance of cutting fluid in silicon rod cutting process

Abstract

According to the method for enhancing the performance of the cutting fluid in the silicon rod cutting process, after the first volume of the cutting fluid is injected into the container, the silicon rod is cut by the slicing machine, and the cutting depth of the cutting line to the silicon rod is detected by the detection device; when the cutting depth reaches the first preset depth and the mortar concentration reaches the first preset concentration, a second volume of cutting liquid is injected into the container, so that the mortar in the cutting liquid is lower than the set concentration value; wherein the sum of the first volume and the second volume is matched with the total volume of the cutting fluid corresponding to the silicon rod cutting parameters. The method comprises the following steps: adding cutting fluid in batches, namely dividing the cutting fluid in an original cutting process into two parts, firstly adding the first part of cutting fluid to start cutting processing, and adding the second part of cutting fluid when the cutting depth of a silicon rod and mortar in the cutting fluid reach critical values, so that the concentration of the mortar in the cutting fluid is kept below the critical values; the cutting performance of the cutting fluid is improved, the service life of a cutting line is prolonged, and the good cutting quality of a silicon rod is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of silicon rod cutting, and in particular to a method, system, device and medium for enhancing the performance of a cutting fluid in a silicon rod cutting process. Background Art

[0002] At present, the photovoltaic industry uses an internal circulation method to reuse the mortar liquid during the silicon rod cutting process. The mortar liquid can only be replaced after each silicon rod is cut. Each time the mortar liquid is replaced, the drain valve needs to be opened manually and the equipment control interface needs to be operated to drain the waste liquid, add water, add cutting fluid, etc.

[0003] In the process of cutting silicon rods, as the cutting time increases and the cutting depth increases, the heat dissipation inside the silicon rods becomes worse and worse, the silicon powder in the mortar liquid accumulates more and more, and the dependence on the performance of the mortar liquid becomes stronger and stronger. As the cutting time progresses, the content of silicon powder and various impurities in the mortar liquid increases, and the concentration of the mortar liquid gradually increases, resulting in a gradual decline in the cooling, lubrication, fluidity and other properties of the cutting fluid, thereby aggravating the loss of the diamond wire, and easily causing problems such as wire mesh breakage and reduced steel wire cutting force. Summary of the invention

[0004] The object of the present invention is to provide a method, system, device and medium for enhancing the performance of cutting fluid in the silicon rod cutting process, which can keep the mortar concentration in the cutting fluid at a set concentration during the cutting process, ensure the cutting performance of the cutting line, and improve the cutting quality of the cutting line for the silicon rod.

[0005] The embodiment of the present invention is achieved as follows:

[0006] In a first aspect, a method for enhancing the performance of a cutting fluid in a silicon rod cutting process according to an embodiment of the present application is applied to a control device of a silicon rod cutting system, wherein the silicon rod cutting system further comprises a container, a slicer, a liquid injection device, and a detection device; the container is filled with cutting fluid through the liquid injection device, the cutting line of the slicer is used to cut the silicon rod immersed in the cutting fluid, the detection device is used to detect the cutting depth of the silicon rod and the mortar concentration in the cutting fluid, and the control device is electrically connected to the detection device and the liquid injection device respectively; the method comprises:

[0007] After the first volume of the cutting liquid is injected into the container by the liquid injection device, the slicer cuts the silicon rod through the cutting line, and the detection device detects the cutting depth of the silicon rod by the cutting line in real time;

[0008] When the cutting depth reaches a first preset depth and the mortar concentration reaches a first preset concentration, a second volume of the cutting fluid is injected into the container through the liquid injection device to make the mortar inside the cutting fluid lower than the set concentration value; wherein the sum of the first volume and the second volume matches the total volume of the cutting fluid corresponding to the silicon rod cutting parameters.

[0009] In a possible implementation manner, the cutting parameters include the length and weight of the silicon rod, the groove pitch of the cutting grooves, and the wire diameter of the cutting wire.

[0010] In a possible implementation manner, when the length of the silicon rod is 830 mm, the weight is 85.3 g, the slot pitch is 0.227 mm, and the wire diameter is 40 mm, the corresponding first volume, the second volume, and the total volume are 2.5 L, 0.5 L, and 3 L, respectively.

[0011] In a possible implementation, the liquid injection device includes a liquid injection pipeline and a control valve body; the liquid injection pipeline is connected to the container, the control valve body is arranged on the liquid injection pipeline, and the control valve body is electrically connected to the control device;

[0012] After the first volume of the cutting liquid is injected into the container through the liquid injection device, the slicer cuts the silicon rod through the cutting line, and the detection device detects the cutting depth of the silicon rod by the cutting line in real time, including the control device controlling the control valve body to open and injecting the first volume of the cutting liquid into the container through the liquid injection pipeline;

[0013] When the cutting depth reaches a first preset depth, a second volume of the cutting fluid is injected into the container through the liquid injection device to make the mortar inside the cutting fluid lower than a set concentration value; wherein the sum of the first volume and the second volume matches the total volume of the cutting fluid corresponding to the silicon rod cutting parameter, including the control device controlling the control valve body to open, and injecting the second volume of the cutting fluid into the container through the liquid injection pipe.

[0014] In a possible embodiment, the detection device includes a first detector and a second detector, the first detector is arranged on the slicer to detect the cutting depth of the silicon rod; the second detector is arranged in the container to detect the mortar concentration inside the cutting fluid; the first detector and the second detector are electrically connected to the control device respectively; the method includes, the first detector detects the cutting depth in real time, the second detector detects the mortar concentration in real time, when the cutting depth reaches a first preset depth and the mortar concentration reaches a first preset concentration, the control device controls the control valve body to open, so as to inject the second volume of the cutting fluid into the container.

[0015] In a second aspect, a silicon rod cutting system according to an embodiment of the present application comprises: a control device, a container, a slicer, a liquid injection device and a detection device; a cutting liquid is injected into the container through the liquid injection device, a cutting line of the slicer is used to cut the silicon rod immersed in the cutting liquid, the detection device is used to detect the cutting depth of the silicon rod and the mortar concentration in the cutting liquid, and the control device is electrically connected to the detection device and the liquid injection device respectively;

[0016] The control device is used to control the liquid injection device to inject a first volume of the cutting fluid into the container, and when the cutting depth reaches a first preset depth and the mortar concentration reaches a first preset concentration, the control device also controls the liquid injection device to inject a second volume of the cutting fluid into the container so that the mortar inside the cutting fluid is lower than a set concentration value; wherein the sum of the first volume and the second volume matches the total volume of the cutting fluid corresponding to the silicon rod cutting parameters.

[0017] In a possible embodiment, the injection device includes an injection pipe and a control valve body; the injection pipe is connected to the container and is used to inject the first volume and the second volume of the cutting liquid into the interior of the container in sequence, and the control valve body is arranged on the injection pipe, and the control valve body is electrically connected to the control device.

[0018] In a possible embodiment, the detection device includes a first detector and a second detector, the first detector is arranged on the slicer to detect the cutting depth of the silicon rod; the second detector is arranged in the container to detect the mortar concentration inside the cutting fluid; the first detector and the second detector are electrically connected to the control device respectively; when the cutting depth reaches a first preset depth and the mortar concentration reaches a first preset concentration, the control device controls the control valve body to open so as to inject the second volume of the cutting fluid into the container.

[0019] In a third aspect, a computer device according to an embodiment of the present application comprises a processor and a memory, wherein the memory stores a computer program, and the processor is used to execute the computer program to implement the above-mentioned method for enhancing the performance of cutting fluid in the silicon rod cutting process.

[0020] In a fourth aspect, a computer storage medium according to an embodiment of the present application stores a computer program, which, when executed on a processor, implements the above-mentioned method for enhancing the performance of a cutting fluid in a silicon rod cutting process.

[0021] The embodiments of the present application have the following beneficial effects:

[0022] The method, system, device and medium for enhancing the performance of the cutting fluid in the silicon rod cutting process of the present application are to add the cutting fluid in batches (twice), that is, to divide the cutting fluid in the original cutting process into two parts, first add the first part of the cutting fluid to start the cutting process, and when the cutting depth of the silicon rod and the mortar inside the cutting fluid reach a critical value, add the second part of the cutting fluid to keep the mortar concentration inside the cutting fluid below the critical value, thereby improving the cutting performance of the cutting fluid (such as cooling, lubrication, fluidity, etc.), which not only extends the service life of the cutting line, but also ensures the good cutting quality of the silicon rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present application and should not be regarded as limiting the scope of protection of the present application. For ordinary technicians in this field, other related drawings can also be obtained based on these drawings without creative work.

[0024] Figure 1 The process of the method for enhancing the performance of the cutting fluid in the silicon rod cutting process of the present application is shown Figure 1 ;

[0025] Figure 2 The process of the method for enhancing the performance of the cutting fluid in the silicon rod cutting process of the present application is shown Figure 2 . DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0027] The components of the embodiments of the present application generally described and shown in the drawings herein may be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0028] Hereinafter, the terms "including", "having" and their cognates, which may be used in various embodiments of the present application, are intended only to indicate specific features, numbers, steps, operations, elements, components, or combinations of the foregoing items, and should not be understood as first excluding the existence of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing items or adding the possibility of one or more features, numbers, steps, operations, elements, components, or combinations of the foregoing items.

[0029] Furthermore, the terms “first”, “second”, “third”, etc. are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0030] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as those generally understood by those skilled in the art to which the various embodiments of the present application belong. The terms (such as those defined in generally used dictionaries) will be interpreted as having the same meanings as the contextual meanings in the relevant technical field and will not be interpreted as having idealized meanings or overly formal meanings unless clearly defined in the various embodiments of the present application.

[0031] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0032] The cutting fluid of the existing silicon rod cutting process adopts an internal circulation method, and the new cutting fluid can only be replaced after a silicon rod is cut. However, as the cutting depth of the silicon rod increases, the silicon powder and various impurities in the cutting fluid increase, and the concentration of the mortar liquid gradually increases, resulting in the cooling, lubrication, fluidity and other properties of the cutting fluid gradually decreasing, which in turn aggravates the loss of the cutting wire and is also very likely to cause problems such as wire breakage and decreased steel wire cutting force. In addition, as the cutting depth increases, the heat dissipation inside the silicon rod becomes worse and worse, and the heat dissipation performance of the cutting fluid also decreases, resulting in a decrease in the quality of silicon rod cutting.

[0033] The method, system, device and medium for enhancing the performance of the cutting fluid in the silicon rod cutting process of the present application are to add the cutting fluid in batches (twice), that is, to divide the cutting fluid in the original cutting process into two parts, first add the first part of the cutting fluid to start the cutting process, and when the cutting depth of the silicon rod and the mortar inside the cutting fluid reach a critical value, add the second part of the cutting fluid to keep the mortar concentration inside the cutting fluid below the critical value, thereby improving the cutting performance of the cutting fluid (such as cooling, lubrication, fluidity, etc.), which not only extends the service life of the cutting line, but also ensures the good cutting quality of the silicon rod.

[0034] refer to Figure 1 and Figure 2 As shown, a method for enhancing the performance of cutting fluid in the silicon rod cutting process of an embodiment of the present application is applied to a control device of a silicon rod cutting system, and the silicon rod cutting system also includes a container, a slicer, a liquid injection device and a detection device; the container is filled with cutting fluid through the liquid injection device, the cutting line of the slicer is used to cut the silicon rod immersed in the cutting fluid, the detection device is used to detect the cutting depth of the silicon rod and the mortar concentration inside the cutting fluid, and the control device is electrically connected to the detection device and the liquid injection device respectively. The method includes:

[0035] Step S101, after a first volume of cutting liquid is injected into the container through a liquid injection device, a slicer cuts the silicon rod through a cutting line, and a detection device detects the cutting depth of the silicon rod by the cutting line in real time;

[0036] Step S102: When the cutting depth reaches a first preset depth and the mortar concentration reaches a first preset concentration, a second volume of cutting fluid is injected into the container through a liquid injection device to make the mortar inside the cutting fluid lower than the set concentration value; wherein the sum of the first volume and the second volume matches the total volume of the cutting fluid corresponding to the silicon rod cutting parameters.

[0037] In combination with the above embodiment, the cutting liquid is added twice, that is, the cutting liquid in the original cutting process is divided into two parts. First, the first part of the cutting liquid is added to start the cutting process. When the cutting depth of the silicon rod and the mortar inside the cutting liquid reach a critical value, the second part of the cutting liquid is added to keep the mortar concentration inside the cutting liquid below the critical value, thereby improving the cutting performance of the cutting liquid (such as cooling, lubrication, fluidity, etc.), which not only extends the service life of the cutting line, but also ensures the good cutting quality of the silicon rod.

[0038] In the method for enhancing the performance of the cutting fluid in the silicon rod cutting process of the present application, the cutting parameters include the length, weight, groove pitch of the cutting groove and wire diameter of the silicon rod. Taking the silicon rod length of 830 mm, weight of 85.3 g, groove pitch of 0.227 mm and wire diameter of 40 mm as an example, the corresponding first volume, second volume and total volume are 2.5 L, 0.5 L and 3 L respectively.

[0039] Combined with the above embodiments, after experimental verification: as shown in the following table, when the mortar concentration in the cutting fluid is lower than 3%, the cutting efficiency and cutting quality of the cutting line are optimal. However, as the cutting time progresses, the silicon powder and various impurities in the cutting fluid increase, and the cooling, lubrication, fluidity and other properties of the cutting fluid are gradually declining. When the silicon rod is cut to a depth of more than 130mm (critical depth), the mortar concentration reaches the critical point of 3%, and the cutting fluid performance continues to decline. If the cutting is continued to exceed 130mm, the cutting line will be broken and the cutting force will be insufficient due to the decline in the cutting fluid performance, affecting the cutting quality of the silicon wafer. At this time, the second volume of cutting fluid is automatically added through the injection device, and the cutting force of the cutting line is enhanced by adding new cutting fluid, the cutting performance of the cutting fluid is improved, the service life of the cutting line is extended, and the cutting quality of the silicon rod is improved.

[0040] In other words, when the silicon rod is cut to a depth of more than 130mm, the mortar concentration reaches the critical point of 3%. Therefore, in the actual cutting process, a total of 3L of cutting fluid is added before the original cutting until the cutting is completed. In this application, 2.5L of cutting fluid is added in the early stage of cutting, and 0.5L of cutting fluid is added when cutting to 120mm. The total amount of liquid added remains unchanged, and the cost of cutting fluid is not increased. After cutting to 130mm, the mortar concentration ratio is maintained below 3%.

[0041] Cutting depth (mm) Silica powder weight (g) Mortar concentration (g / L) Concentration percentage 10 929 2.3 0.2％ 20 1858 4.6 0.5％ 30 2787 6.9 0.7％ 40 3716 9.2 0.9％ 50 4645 11.6 1.2％ 60 5574 13.9 1.4％ 70 6503 16.2 1.6％ 80 7432 18.5 1.8％ 90 8361 20.8 2.1％ 100 9290 23.1 2.3％ 110 10219 25.4 2.5％ 120 11148 27.7 2.8％ 130 12077 30.0 3.0％ 140 13006 32.4 3.2％ 150 13935 34.7 3.5％ 160 14864 37.0 3.7％ 170 15793 39.3 3.9％ 180 16722 41.6 4.2％ 190 17651 43.9 4.4％ 200 18580 46.2 4.6％ 210 19509 48.5 4.9％

[0042] The method for enhancing the performance of the cutting fluid in the silicon rod cutting process of the present application comprises a liquid injection device including a liquid injection pipeline and a control valve body; the liquid injection pipeline is connected to the container, the control valve body is arranged on the liquid injection pipeline, and the control valve body is electrically connected to the control device;

[0043] After a first volume of cutting liquid is injected into the container through the liquid injection device, the slicer cuts the silicon rod through the cutting line, and the detection device detects the cutting depth of the silicon rod by the cutting line in real time, including a control device controlling the control valve body to open, and injecting the first volume of cutting liquid into the container through the liquid injection pipeline;

[0044] When the cutting depth reaches a first preset depth, a second volume of cutting fluid is injected into the container through the liquid injection device to make the mortar inside the cutting fluid lower than the set concentration value; wherein the sum of the first volume and the second volume matches the total volume of the cutting fluid corresponding to the silicon rod cutting parameters, including a control device controlling the control valve body to open, and injecting the second volume of cutting fluid into the container through the liquid injection pipe.

[0045] The method of enhancing the performance of cutting fluid in the silicon rod cutting process of the present application comprises a detection device including a first detector and a second detector, the first detector is arranged on the slicer for detecting the cutting depth of the silicon rod; the second detector is arranged in the container for detecting the mortar concentration inside the cutting fluid; the first detector and the second detector are electrically connected to the control device respectively; the method comprises: the first detector detects the cutting depth in real time, the second detector detects the mortar concentration in real time, when the cutting depth reaches a first preset depth and the mortar concentration reaches a first preset concentration, the control device controls the control valve body to open, so as to inject the second volume of cutting fluid into the container.

[0046] Based on the same inventive concept, an embodiment of the present application also provides a silicon rod cutting system. Since the implementation principle of a silicon rod cutting system of the present application is the same as or similar to the method for enhancing the performance of cutting fluid in the silicon rod cutting process of the present application, the specific implementation method of a silicon rod cutting system of the present application can refer to a method for enhancing the performance of cutting fluid in the silicon rod cutting process, and the repeated parts will not be repeated.

[0047] The present application discloses a silicon rod cutting system, comprising: a control device, a container, a slicer, a liquid injection device and a detection device; a cutting liquid is injected into the container through the liquid injection device, a cutting line of the slicer is used to cut the silicon rod immersed in the cutting liquid, the detection device is used to detect the cutting depth of the silicon rod and the mortar concentration in the cutting liquid, and the control device is electrically connected to the detection device and the liquid injection device respectively;

[0048] The control device is used to control the liquid injection device to inject a first volume of cutting fluid into the container, and when the cutting depth reaches a first preset depth and the mortar concentration reaches a first preset concentration, the control device also controls the liquid injection device to inject a second volume of cutting fluid into the container, so that the mortar inside the cutting fluid is lower than the set concentration value; wherein the sum of the first volume and the second volume matches the total volume of the cutting fluid corresponding to the silicon rod cutting parameters.

[0049] In the silicon rod cutting system of the embodiment of the present application, the liquid injection device includes a liquid injection pipeline and a control valve body; the liquid injection pipeline is connected to the container and is used to inject a first volume and a second volume of cutting liquid into the container in sequence, the control valve body is arranged on the liquid injection pipeline, and the control valve body is electrically connected to the control device.

[0050] The silicon rod cutting system of the embodiment of the present application, the detection device includes a first detector and a second detector, the first detector is arranged on the slicer to detect the cutting depth of the silicon rod; the second detector is arranged in the container, and is used to detect the mortar concentration inside the cutting fluid; the first detector and the second detector are electrically connected to the control device respectively; when the cutting depth reaches the first preset depth and the mortar concentration reaches the first preset concentration, the control device controls the control valve body to open, so as to inject the second volume of cutting fluid into the container.

[0051] The present application also provides a computer device. Exemplarily, the computer device includes a processor and a memory, wherein the memory stores a computer program, and the processor runs the computer program to enable the computer device to execute the above-mentioned method for enhancing the performance of cutting fluid in the silicon rod cutting process or the functions of each module in the above-mentioned silicon rod cutting system.

[0052] Among them, the processor can be an integrated circuit chip with signal processing capabilities. The processor can be a general-purpose processor, including a central processing unit (CPU), a graphics processing unit (GPU) and a network processor (NP), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or at least one of other programmable logic devices, discrete gates or transistor logic devices, and discrete hardware components. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc., which can implement or execute the disclosed methods, steps and logic block diagrams in the embodiments of the present application.

[0053] The memory may be, but is not limited to, a random access memory (RAM), a read only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), etc. The memory is used to store a computer program, and the processor may execute the computer program accordingly after receiving an execution instruction.

[0054] The present application also provides a computer-readable storage medium for storing the computer program used in the above-mentioned computer device. For example, the computer-readable storage medium may include, but is not limited to, various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0055] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and structure diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to multiple embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of a code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in an alternative implementation, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the structure diagram and / or the flow diagram, and the combination of boxes in the structure diagram and / or the flow diagram, can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0056] In addition, the functional modules or units in the various embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0057] If the function is implemented in the form of a software function module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art, and the computer software product is stored in a storage medium, including several instructions for a computer device (which can be a smart phone, a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk.

[0058] The above description is only a specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application.

Claims

1. A method for enhancing the performance of a cutting fluid in a silicon rod cutting process, characterized in that: A control device applied to a silicon rod cutting system, the silicon rod cutting system further comprising a container, a slicer, a liquid injection device and a detection device; a cutting liquid is injected into the container through the liquid injection device, a cutting line of the slicer is used to cut the silicon rods immersed in the cutting liquid, the detection device is used to detect the cutting depth of the silicon rods and the mortar concentration in the cutting liquid, and the control device is electrically connected to the detection device and the liquid injection device respectively; the method comprises: After the first volume of the cutting liquid is injected into the container by the liquid injection device, the slicer cuts the silicon rod through the cutting line, and the detection device detects the cutting depth of the silicon rod by the cutting line in real time; When the cutting depth reaches a first preset depth and the mortar concentration reaches a first preset concentration, a second volume of the cutting fluid is injected into the container through the liquid injection device to make the mortar inside the cutting fluid lower than the set concentration value; wherein the sum of the first volume and the second volume matches the total volume of the cutting fluid corresponding to the silicon rod cutting parameters.

2. The method for enhancing the performance of cutting fluid in the silicon rod cutting process according to claim 1, characterized in that: The cutting parameters include the length and weight of the silicon rod, the groove pitch of the cutting grooves and the wire diameter of the cutting wire.

3. The method for enhancing the performance of cutting fluid in the silicon rod cutting process according to claim 2, characterized in that: When the length of the silicon rod is 830 mm, the weight is 85.3 g, the slot pitch is 0.227 mm and the wire diameter is 40 mm, the corresponding first volume, the second volume and the total volume are 2.5 L, 0.5 L and 3 L respectively.

4. The method for enhancing the performance of cutting fluid in the silicon rod cutting process according to claim 1, characterized in that: The liquid injection device comprises a liquid injection pipeline and a control valve body; the liquid injection pipeline is connected to the container, the control valve body is arranged on the liquid injection pipeline, and the control valve body is electrically connected to the control device; After the first volume of the cutting liquid is injected into the container through the liquid injection device, the slicer cuts the silicon rod through the cutting line, and the detection device detects the cutting depth of the silicon rod by the cutting line in real time, including the control device controlling the control valve body to open and injecting the first volume of the cutting liquid into the container through the liquid injection pipeline; When the cutting depth reaches a first preset depth, a second volume of the cutting fluid is injected into the container through the liquid injection device to make the mortar inside the cutting fluid lower than a set concentration value; wherein the sum of the first volume and the second volume matches the total volume of the cutting fluid corresponding to the silicon rod cutting parameter, including the control device controlling the control valve body to open, and injecting the second volume of the cutting fluid into the container through the liquid injection pipe.

5. The method for enhancing the performance of cutting fluid in the silicon rod cutting process according to claim 4, characterized in that: The detection device includes a first detector and a second detector, wherein the first detector is arranged on the slicer to detect the cutting depth of the silicon rod; the second detector is arranged in the container to detect the mortar concentration inside the cutting fluid; The first detector and the second detector are electrically connected to the control device respectively; the method includes, the first detector detecting the cutting depth in real time, the second detector detecting the mortar concentration in real time, when the cutting depth reaches a first preset depth and the mortar concentration reaches a first preset concentration, the control device controls the control valve body to open so as to inject the second volume of the cutting fluid into the container.

6. A silicon rod cutting system, characterized in that: include: A control device, a container, a slicer, a liquid injection device and a detection device; the container is filled with cutting liquid through the liquid injection device, the cutting line of the slicer is used to cut the silicon rods immersed in the cutting liquid, the detection device is used to detect the cutting depth of the silicon rods and the mortar concentration in the cutting liquid, and the control device is electrically connected to the detection device and the liquid injection device respectively; The control device is used to control the liquid injection device to inject a first volume of the cutting fluid into the container, and when the cutting depth reaches a first preset depth and the mortar concentration reaches a first preset concentration, the control device also controls the liquid injection device to inject a second volume of the cutting fluid into the container so that the mortar inside the cutting fluid is lower than a set concentration value; wherein the sum of the first volume and the second volume matches the total volume of the cutting fluid corresponding to the silicon rod cutting parameters.

7. The silicon rod cutting system according to claim 6, characterized in that: The injection device includes an injection pipe and a control valve body; the injection pipe is connected to the container and is used to inject the first volume and the second volume of the cutting liquid into the container in sequence, and the control valve body is arranged on the injection pipe, and the control valve body is electrically connected to the control device.

8. The silicon rod cutting system according to claim 7, characterized in that: The detection device includes a first detector and a second detector, the first detector is arranged on the slicer to detect the cutting depth of the silicon rod; the second detector is arranged in the container to detect the mortar concentration inside the cutting fluid; the first detector and the second detector are electrically connected to the control device respectively; when the cutting depth reaches a first preset depth and the mortar concentration reaches a first preset concentration, the control device controls the control valve body to open so as to inject the second volume of the cutting fluid into the container.

9. A computer device, characterized in that: The computer device comprises a processor and a memory, wherein the memory stores a computer program, and the processor is configured to execute the computer program to implement the method for enhancing the performance of a cutting fluid in a silicon rod cutting process according to any one of claims 1 to 5.

10. A computer storage medium, characterized in that: The device stores a computer program, which, when executed on a processor, implements the method for enhancing the performance of a cutting fluid in a silicon rod cutting process according to any one of claims 1 to 5.

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