Preparation method and device of medical high-reflectivity light source plate

Abstract

The invention relates to the technical field of light source plates, and provides a preparation method and device for a medical high-reflectivity light source plate, and the method comprises the steps: carrying out plasma cleaning treatment on the surface of a solder mask layer, coating the cleaned surface of the solder mask layer with a coating containing a nanoscale high-reflectivity material, and carrying out heat treatment. And carrying out ultraviolet light curing treatment on the surface of the coated solder mask layer, carrying out heat treatment on the surface of the cured solder mask layer, and coating a transparent protective film on the high-reflectivity reflective layer in a thermocompression bonding manner to obtain the medical high-reflectivity light source plate. The surface of the solder mask layer is subjected to plasma cleaning treatment, so that pollutants on the surface of the solder mask layer are effectively removed, and the adhesive force of the coating is increased; the surface of the cleaned solder mask layer is coated with the coating containing the nanoscale high-reflectivity material, so that the light reflecting effect is remarkably improved, and the problems of low reflectivity, insufficient reflecting layer adhesion and poor durability still existing in practical application are solved.

Description

Technical Field

[0001] The present application relates to the technical field of light source panels, and in particular to a method and device for preparing a high-reflectivity light source panel for medical use. Background Art

[0002] In modern medical equipment, high reflectivity light source boards play a vital role in surgical lighting, diagnostic equipment, phototherapy equipment and other fields. The main function of high reflectivity light source boards is to provide efficient and uniform light sources to ensure the accuracy and safety of medical operations. With the continuous advancement of medical technology, the quality and performance requirements of high reflectivity light source boards are also getting higher and higher.

[0003] Among the related technical means, the traditional light source board preparation technology is used, including coating a layer of reflective material on the surface of the light source board to improve its reflectivity. In addition, some technologies also use specific cleaning and coating processes to ensure a good combination of the reflective material and the light source board, which to a certain extent achieves the effect of improving the reflectivity of the light source board, enabling it to provide a brighter and more uniform light source in medical applications.

[0004] Regarding the above technical solution, although the reflectivity of the light source panel can be improved through traditional coating and cleaning processes, in actual applications, there are still problems such as low reflectivity, insufficient adhesion of the reflective layer, and poor durability. Summary of the invention

[0005] In order to improve the problems of low reflectivity, insufficient adhesion of the reflective layer and poor durability that still exist in practical applications, the present application provides a method and device for preparing a high-reflectivity light source plate for medical use. By introducing nano-scale high-reflectivity materials and specific ultraviolet light curing and heat treatment processes, the adhesion and durability of the reflective layer are significantly improved, thereby obtaining a high-reflectivity light source plate for medical use with better performance.

[0006] The present invention provides a preparation method of a high-reflectivity light source board for medical use, which is applied to the preparation of the light source board. The preparation method comprises: providing a light source board with a solder resist layer on its surface, performing plasma cleaning treatment on the surface of the solder resist layer to obtain a cleaned solder resist layer; coating a coating layer containing nano-scale high-reflectivity material on the cleaned solder resist layer surface to obtain a coated solder resist layer surface; performing ultraviolet light curing treatment on the coated solder resist layer surface, and performing heat treatment on the cured solder resist layer surface to obtain a high-reflectivity reflective layer; and laminating a transparent protective film on the high-reflectivity reflective layer by heat pressing to obtain a high-reflectivity light source board for medical use.

[0007] As a preferred embodiment, the step of providing a light source board having a solder resist layer on its surface, performing plasma cleaning on the surface of the solder resist layer to obtain a cleaned solder resist layer includes: providing a substrate having a conductive pattern, forming a solder resist layer on the surface of the substrate, cleaning the surface of the solder resist layer with an organic solvent to remove oil stains and impurities, and obtaining a cleaned solder resist layer surface; performing micro-etching on the cleaned solder resist layer surface to increase surface roughness and activity, rinsing the cleaned solder resist layer surface with deionized water to remove residual etching solution, and obtaining a rinsed solder resist layer surface; drying the rinsed solder resist layer surface with dust-free hot air to obtain a dried solder resist layer surface; performing plasma cleaning on the dried solder resist layer surface under a vacuum environment to decompose organic matter on the dried solder resist layer surface and activate the surface to obtain a cleaned solder resist layer.

[0008] As a preferred embodiment, the step of coating a layer of coating containing nanometer-level high reflectivity material on the surface of the cleaned solder resist layer to obtain the coated solder resist layer surface includes: mixing the nanometer-level high reflectivity material with nanometer metal oxide particles with antibacterial properties in a preset ratio to prepare a nanocomposite material; adding a film-forming agent and a dispersant to the nanocomposite material to form a coating solution, ultrasonically treating the coating solution to uniformly disperse the nanoparticles to obtain a treated coating solution; applying the treated coating solution to the cleaned solder resist layer surface by spin coating, adjusting the spin coating speed and time to control the coating thickness, and drying the coated substrate under constant temperature conditions to obtain the coated solder resist layer surface.

[0009] As a preferred embodiment, the step of subjecting the coated solder resist layer surface to ultraviolet curing treatment, the cured solder resist layer surface, and heat treating the cured solder resist layer surface to obtain a high reflectivity reflective layer includes: spraying an ultraviolet photosensitive initiator solution on the coated solder resist layer surface to obtain a sprayed solder resist layer surface, exposing the sprayed solder resist layer surface to an ultraviolet light source to excite the photosensitive initiator to obtain an excited solder resist layer surface; continuing ultraviolet light irradiation at a specific wavelength to cause a cross-linking reaction of the nanomaterials in the excited solder resist layer surface, controlling the exposure time and light intensity to uniformly cure the cured solder resist layer surface; heat treating the cured solder resist layer surface to eliminate internal stress and then cool it to obtain a dense high reflectivity reflective layer.

[0010] As a preferred embodiment, the step of laminating a transparent protective film on the high-reflectivity reflective layer by heat pressing to obtain a high-reflectivity light source board for medical use includes: preparing a transparent polyethylene terephthalate protective film, plasma treating the surface of the polyethylene terephthalate protective film to enhance adhesion and obtain a treated polyethylene terephthalate protective film; coating a layer of hot-melt adhesive on the surface of the high-reflectivity reflective layer to obtain a reflective layer coated with the adhesive, aligning the treated polyethylene terephthalate protective film with the reflective layer coated with the adhesive and then performing heat pressing to obtain a high-reflectivity light source board for medical use.

[0011] As a preferred solution, the nano-scale high reflectivity material is any one of the following: titanium dioxide, zinc oxide.

[0012] As a preferred solution, the protective film is a transparent polymer film, and the polymer film is selected from any one of the following materials: polyethylene terephthalate, polycarbonate, polymethyl methacrylate, polyethylene, polypropylene, polyvinyl chloride, and polyvinylidene chloride.

[0013] The present application also provides a preparation device for a high-reflectivity light source board for medical use, comprising: a cleaning module, used to provide a light source board with a solder resist layer on its surface, and perform plasma cleaning treatment on the surface of the solder resist layer to obtain a cleaned solder resist layer; a coating module, used to coat a layer of coating containing nano-scale high-reflectivity material on the surface of the cleaned solder resist layer to obtain a coated solder resist layer surface; a curing module, used to perform ultraviolet light curing treatment on the coated solder resist layer surface, and perform heat treatment on the cured solder resist layer surface to obtain a high-reflectivity reflective layer; a hot pressing module, used to coat a layer of transparent protective film on the high-reflectivity reflective layer by hot pressing to obtain a high-reflectivity light source board for medical use.

[0014] Compared with the prior art, the present application has the following beneficial effects: strong adhesion and good durability. By plasma cleaning the surface of the solder mask layer, the pollutants on the surface of the solder mask layer are effectively removed, and the adhesion of the coating is increased; a layer of coating containing nano-scale high reflectivity material is coated on the surface of the cleaned solder mask layer, which significantly improves the reflective effect, and the surface of the coated solder mask layer is UV-cured and heat-treated to enhance the hardness and durability of the coating; by laminating a transparent protective film on the high-reflectivity reflective layer, effective protection is provided to prevent the reflective layer from being affected by wear and environmental factors during use, and improve the actual application. There are still problems such as low reflectivity, insufficient adhesion of the reflective layer, and poor durability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0017] Figure 1 It is a schematic flow chart of a method for preparing a medical high-reflectivity light source plate provided by an embodiment of the present invention; Figure 2 It is a schematic block diagram of the structure of a device for preparing a high-reflectivity light source plate for medical use provided in an embodiment of the present invention.

[0018] Description of reference numerals: 10. A device for preparing a high-reflectivity light source plate for medical use; 11. A cleaning module; 12. A coating module; 13. A curing module; 14. A hot pressing module. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0021] It should also be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0022] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0023] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0024] Embodiment 1:

[0025] like Figure 1 As shown, a method for preparing a high-reflectivity light source board for medical use provided in an embodiment of the present application is applied to the preparation of a light source board, and the preparation method includes steps S100 to S400.

[0026] Step S100: providing a light source board having a solder resist layer on its surface, and performing plasma cleaning on the surface of the solder resist layer to obtain a cleaned solder resist layer.

[0027] In this step, plasma cleaning can effectively remove pollutants and tiny particles on the surface of the solder mask, increase the surface energy of the solder mask, and improve the adhesion of subsequent coatings. Specifically, plasma cleaning is to bombard the surface of the solder mask with plasma under low temperature conditions to remove organic matter and oxides.

[0028] For example, oxygen plasma is used to clean the surface of the solder mask layer, with a cleaning time of 60 seconds and a power of 100W.

[0029] Step S200: coating a layer of coating containing nanometer-level high reflectivity material on the cleaned surface of the solder resist layer to obtain a coated surface of the solder resist layer.

[0030] In this step, by coating the surface of the cleaned solder mask with a coating of nanometer-level high reflectivity material, the reflectivity of the light source board can be significantly improved. Specifically, the coating containing the nanometer-level high reflectivity material is evenly coated on the surface of the cleaned solder mask by spraying, the coating thickness is 10 microns, and a reflective coating containing nano-silver particles is used. During the spraying process, the room temperature is maintained at 25°C and the relative humidity is maintained at 60%.

[0031] Step S300, performing UV curing treatment on the surface of the coated solder resist layer, and performing heat treatment on the surface of the cured solder resist layer to obtain a high reflectivity reflective layer.

[0032] In this step, the hardness and adhesion of the coating can be improved through UV curing and heat treatment, and the durability of the reflective layer can be increased. Specifically, the UV curing treatment uses ultraviolet light with a wavelength of 365nm to irradiate the coating surface for 120 seconds; the heat treatment is carried out at 150°C for 30 minutes, and the surface hardness of the cured coating reaches 4H, which improves the wear resistance of the reflective layer.

[0033] Step S400: Laminating a transparent protective film on the high-reflectivity reflective layer by heat pressing to obtain a high-reflectivity light source board for medical use.

[0034] In this step, by laminating a transparent protective film on the high reflectivity reflective layer, the reflective layer can be protected from the influence of the external environment and the service life of the light source board can be extended. Specifically, the transparent protective film is made of PET material, the hot pressing temperature is 120°C, the pressure is 0.5MPa, and the time is 60 seconds. After hot pressing, the light transmittance of the light source board reaches 95%, and the thickness of the protective film is 50 microns.

[0035] In this embodiment, a light source board having a solder resist layer on the surface is provided, and the surface of the solder resist layer is plasma cleaned to obtain a cleaned solder resist layer; then, a coating containing nano-scale high reflectivity material is coated on the cleaned solder resist layer surface to obtain a coated solder resist layer surface; then, the coated solder resist layer surface is UV-cured to cure the cured solder resist layer surface, and then the cured solder resist layer surface is heat-treated to obtain a high reflectivity reflective layer; finally, a transparent protective film is laminated on the high reflectivity reflective layer by hot pressing to obtain a medical high reflectivity light source board; the reflectivity and durability of the light source board are significantly improved. The coating of nano-scale high reflectivity material enhances the uniformity and reflection effect of the reflective layer, while the UV-curing treatment and heat treatment further enhance the adhesion and stability of the reflective layer, improving the problem of low reflectivity, insufficient adhesion of the reflective layer, and poor durability in practical applications.

[0036] Embodiment 2:

[0037] In step S100, a substrate having a conductive pattern is provided, a solder resist layer is formed on the surface of the substrate, and the surface of the solder resist layer is cleaned by an organic solvent to remove oil stains and impurities to obtain a cleaned surface of the solder resist layer.

[0038] By using an organic solvent to clean the surface of the solder mask, the oil and impurities on the surface can be effectively removed to ensure the cleanliness of the solder mask. Specifically, the organic solvent can be ethanol or acetone, the cleaning time is 5 minutes, and the deionized water is used after cleaning.

[0039] For example, clean the solder mask surface with acetone for 5 minutes and then rinse with deionized water.

[0040] The cleaned solder mask surface is micro-etched to increase the surface roughness and activity, and the cleaned solder mask surface is rinsed with deionized water to remove the residual etching solution to obtain the rinsed solder mask surface.

[0041] The roughness and activity of the solder mask surface can be increased by micro-etching, thereby improving the adhesion of the subsequent coating. Specifically, the etching liquid can be a sulfuric acid solution, the etching time is 2 minutes, and then rinsed with deionized water.

[0042] For example, use a 10% sulfuric acid solution to etch the surface of the solder mask for 2 minutes and then rinse with deionized water.

[0043] The rinsed solder resist surface is dried by dust-free hot air to obtain a dried solder resist surface.

[0044] The dust-free hot air drying process can quickly and effectively dry the surface of the solder mask to avoid water stains and contamination. Specifically, the temperature of the dust-free hot air is 80°C and the drying time is 10 minutes.

[0045] For example, use dust-free hot air at 80°C to dry the surface of the solder resist after rinsing for 10 minutes.

[0046] The surface of the dried solder mask layer is subjected to plasma cleaning treatment in a vacuum environment to decompose organic matter on the surface of the dried solder mask layer and activate the surface to obtain a cleaned solder mask layer.

[0047] The plasma cleaning process can decompose organic matter on the surface of the solder mask layer, activate the surface, and improve the adhesion of the coating. Specifically, the plasma cleaning process is carried out in a vacuum environment, with a gas flow rate of 50 sccm and a processing time of 3 minutes.

[0048] For example, the surface of the dried solder mask layer is plasma cleaned using 50 sccm of argon gas for 3 minutes in a vacuum environment.

[0049] In step S200, nano-scale high reflectivity material and nano-metal oxide particles with antibacterial properties are mixed in a preset ratio to prepare a nano-composite material.

[0050] By mixing nanometer-scale high reflectivity material with nanometer metal oxide particles, a nanometer-scale composite material with high reflectivity and antibacterial properties can be prepared. Specifically, the ratio of nanometer-scale high reflectivity material to nanometer metal oxide particles is 9:1, and they are mixed evenly and set aside.

[0051] For example, 90% titanium dioxide and 10% nanosilver are mixed to prepare a nanocomposite material.

[0052] A film former and a dispersant are added to the nano composite material to form a coating solution, and the coating solution is subjected to ultrasonic treatment to uniformly disperse the nano particles to obtain a treated coating solution.

[0053] By adding a film former and a dispersant, the film forming performance and stability of the coating solution can be improved. Specifically, the mass ratio of the film former and the dispersant is 1:1, the ultrasonic treatment time is 30 minutes, and the frequency is 40 kHz.

[0054] For example, the film former and the dispersant were added into the nanocomposite in a ratio of 1:1 and subjected to 40 kHz ultrasonic treatment for 30 min.

[0055] The treated coating solution is applied to the cleaned solder mask surface by spin coating, and the spin coating speed and time are adjusted to control the coating thickness. The coated substrate is dried under constant temperature conditions to obtain the coated solder mask surface.

[0056] By adopting the spin coating method, the coating solution can be evenly coated, the coating thickness can be controlled, and the coating quality can be improved. Specifically, the spin coating speed is 3000 rpm, the time is 60 seconds, the drying temperature is 100° C., and the drying time is 10 minutes.

[0057] For example, a spin coating speed of 3000 rpm was used, the coating time was 60 seconds, and then dried at 100° C. for 10 minutes.

[0058] In step S300, a UV photoinitiator solution is sprayed on the surface of the coated solder resist layer to obtain a sprayed solder resist layer surface, and the sprayed solder resist layer surface is exposed by a UV light source to excite the photoinitiator to obtain an excited solder resist layer surface.

[0059] The UV curing efficiency can be improved by spraying the UV photoinitiator solution. Specifically, the concentration of the UV photoinitiator solution is 5%, the spraying amount is 5 ml / m², and the exposure time is 5 minutes.

[0060] For example, use a 5% UV photoinitiator solution, spray at 5 ml / m², and expose for 5 minutes.

[0061] Continue to irradiate with ultraviolet light at a specific wavelength to cause a cross-linking reaction of the nanomaterials on the surface of the solder mask layer after excitation, control the exposure time and light intensity for uniform curing, and the surface of the cured solder mask layer.

[0062] By continuing to irradiate with UV light at a specific wavelength, the nanomaterials undergo cross-linking reactions, enhancing the mechanical properties and durability of the coating. Specifically, the UV light wavelength is 365 nm, the exposure time is 10 minutes, and the light intensity is 20 mW / cm².

[0063] For example, using 365 nm UV light and an exposure time of 10 minutes gives a light intensity of 20 mW / cm².

[0064] The surface of the cured solder mask layer is heat treated, and after eliminating the internal stress, it is cooled to obtain a dense reflective layer with high reflectivity.

[0065] The internal stress can be eliminated by heat treatment, and the compactness and stability of the reflective layer can be improved. Specifically, the heat treatment temperature is 150° C., the time is 30 minutes, and then naturally cooled to room temperature.

[0066] For example, a dense high-reflectivity reflective layer can be obtained by heat treating at 150° C. for 30 minutes and cooling to room temperature.

[0067] In step S400, a transparent polyethylene terephthalate protective film is prepared, and a surface of the polyethylene terephthalate protective film is plasma treated to enhance adhesion, thereby obtaining a treated polyethylene terephthalate protective film.

[0068] The surface energy of the polyethylene terephthalate protective film can be increased by plasma treatment, thereby enhancing its adhesion. Specifically, the plasma treatment is performed in a vacuum environment, with a gas flow rate of 50 sccm and a treatment time of 3 minutes.

[0069] For example, the polyethylene terephthalate protective film is plasma treated using 50 sccm of argon gas for 3 minutes in a vacuum environment.

[0070] A layer of hot melt adhesive is coated on the surface of the high reflectivity reflective layer to obtain an adhesive-coated reflective layer, and the treated polyethylene terephthalate protective film is aligned with the adhesive-coated reflective layer and then subjected to heat pressing to obtain a high reflectivity light source board for medical use.

[0071] The adhesion of the protective film can be enhanced by coating the surface of the reflective layer with a hot melt adhesive, specifically, the coating amount of the hot melt adhesive is 10 g / m², the hot pressing temperature is 120°C, the pressure is 0.5 MPa, and the time is 60 seconds.

[0072] For example, apply 10 g / m² of hot melt adhesive and heat press for 60 seconds at 120°C and 0.5 MPa.

[0073] Wherein, the nanometer-scale high reflectivity material is any one of the following: titanium dioxide, zinc oxide.

[0074] By using titanium dioxide or zinc oxide as nano-scale high reflectivity materials, excellent reflective performance can be provided. Specifically, the titanium dioxide particle size is 20 nm and the zinc oxide particle size is 30 nm.

[0075] For example, titanium dioxide with a particle size of 20 nm is selected as a high reflectivity material.

[0076] Wherein, the protective film is a transparent polymer film, and the polymer film is selected from any one of the following materials: polyethylene terephthalate, polycarbonate, polymethyl methacrylate, polyethylene, polypropylene, polyvinyl chloride, and polyvinylidene chloride.

[0077] By using different types of transparent polymer films, it is possible to provide selection diversity and relevant diversity, and provide reliable protection effects in different application environments. Specifically, the thickness of the polymer film ranges from 20 to 100 microns, which is selected according to specific application requirements.

[0078] For example, using a polyethylene terephthalate film with a thickness of 50 microns can provide good light transmittance and protection performance.

[0079] In this embodiment, the surface of the solder mask layer is cleaned with an organic solvent to effectively remove oil and impurities, ensuring the cleanliness of the initial surface. Next, the surface roughness and activity of the solder mask layer are increased by micro-etching and rinsing, further improving the adhesion of the coating. Dust-free hot air drying quickly and effectively removes surface moisture, avoiding the effects of water stains and contamination.

[0080] In the subsequent plasma cleaning process, the organic matter on the surface of the solder mask layer was effectively decomposed and the surface was activated, significantly improving the adhesion of the subsequent coating. The preparation of the nanocomposite material is achieved by mixing the nanoscale high reflectivity material with the nano-metal oxide particles with antibacterial properties in a preset ratio, so that the final material not only has high reflectivity but also has certain antibacterial properties. The application of ultrasonic treatment and spin coating technology ensures the uniform dispersion of nanoparticles in the coating solution, and the thickness of the coating is controlled by adjusting the spin coating parameters to ensure the coating quality.

[0081] In the curing step, the photoinitiator is stimulated by spraying the UV photosensitive initiator solution and UV exposure treatment, and the nanomaterial undergoes a cross-linking reaction, which enhances the mechanical properties and durability of the coating. Finally, the internal stress is eliminated by heat treatment, and a hot melt adhesive is applied on the surface of the high reflectivity reflective layer, which is then heat-pressed with the treated transparent protective film, further improving the protection effect and service life of the light source board. Example

[0082] like Figure 2 As shown, the present application also provides a device 10 for preparing a high-reflectivity light source plate for medical use, comprising a cleaning module 11 , a coating module 12 , a curing module 13 and a hot pressing module 14 .

[0083] The cleaning module 11 is mainly used to provide a light source board with a solder resist layer on its surface, and perform plasma cleaning on the surface of the solder resist layer to obtain a cleaned solder resist layer.

[0084] The coating module 12 is mainly used to coat a layer of coating containing nanometer-level high reflectivity material on the surface of the cleaned solder resist layer to obtain a coated solder resist layer surface.

[0085] The curing module 13 is mainly used to perform ultraviolet curing treatment on the surface of the coated solder resist layer, and perform heat treatment on the surface of the cured solder resist layer to obtain a high reflectivity reflective layer.

[0086] The heat pressing module 14 is mainly used to laminate a transparent protective film on the high reflectivity reflective layer by heat pressing to obtain a high reflectivity light source board for medical use.

[0087] In this embodiment, by integrating a cleaning module 11, a coating module 12, a curing module 13 and a hot pressing module 14, an efficient and reliable preparation device 10 for a high-reflectivity light source board for medical use is provided. The cleaning module 11 first provides a light source board with a solder mask layer on the surface, and effectively removes pollutants on the surface of the solder mask layer through plasma cleaning treatment, thereby improving the adhesion of subsequent coatings. The coating module 12 then coats a coating containing nano-scale high-reflectivity materials on the surface of the cleaned solder mask layer, and ensures the uniformity and high reflectivity of the coating by finely controlling the coating process. The curing module 13 uses ultraviolet light curing technology to quickly cure the coating, and further improves the hardness and stability of the coating through heat treatment to form a high-reflectivity reflective layer. The hot pressing module 14 coats a transparent protective film on the high-reflectivity reflective layer, and enhances the wear resistance and durability of the reflective layer through hot pressing. Through the coordinated work of the above modules, the prepared medical high-reflectivity light source board has excellent optical properties and a long service life, which can meet the needs of modern medical equipment for high-performance light source boards.

[0088] It should be noted that technicians in the relevant technical field can clearly understand that for the convenience and conciseness of description, the specific working process of the above-described device and each module can refer to the corresponding process in the aforementioned embodiment of a method for preparing a high-reflectivity light source board for medical use, and will not be repeated here.

[0089] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for preparing a high-reflectivity light source board for medical use, which is applied to the preparation of a light source board, characterized in that: The preparation method comprises: Providing a light source board having a solder resist layer on its surface, and performing plasma cleaning on the surface of the solder resist layer to obtain a cleaned solder resist layer; Coating a layer of coating containing nanometer-level high reflectivity material on the surface of the cleaned solder resist layer to obtain a coated solder resist layer surface; The surface of the solder resist layer after coating is subjected to ultraviolet curing treatment, and the surface of the cured solder resist layer is subjected to heat treatment to obtain a high reflectivity reflective layer; A layer of transparent protective film is laminated on the high-reflectivity reflective layer by heat pressing to obtain a high-reflectivity light source plate for medical use.

2. The method for preparing a high reflectivity light source plate for medical use according to claim 1, characterized in that: The step of providing a light source board having a solder resist layer on its surface, and performing plasma cleaning on the surface of the solder resist layer to obtain the cleaned solder resist layer comprises: Providing a substrate having a conductive pattern, forming a solder resist layer on the surface of the substrate, cleaning the surface of the solder resist layer with an organic solvent to remove oil stains and impurities, and obtaining a cleaned solder resist layer surface; Performing micro-etching treatment on the cleaned surface of the solder resist layer to increase surface roughness and activity, rinsing the cleaned surface of the solder resist layer with deionized water to remove residual etching solution, and obtaining a rinsed surface of the solder resist layer; Drying the rinsed solder resist layer surface by dust-free hot air to obtain a dried solder resist layer surface; The surface of the dried solder resist layer is subjected to plasma cleaning treatment in a vacuum environment so as to decompose organic matter on the surface of the dried solder resist layer and activate the surface to obtain a cleaned solder resist layer.

3. The method for preparing a medical high reflectivity light source plate according to claim 1, characterized in that: The step of coating a layer of a coating containing a nanometer-level high reflectivity material on the surface of the cleaned solder resist layer to obtain a coated solder resist layer surface comprises: The nano-scale high reflectivity material and the nano-metal oxide particles having antibacterial properties are mixed in a preset ratio to prepare a nano-composite material; Adding a film-forming agent and a dispersant to the nanocomposite material to form a coating solution, and subjecting the coating solution to ultrasonic treatment to uniformly disperse the nanoparticles to obtain a treated coating solution; The treated coating solution is applied to the cleaned solder resist surface by spin coating, and the spin coating speed and time are adjusted to control the coating thickness. The coated substrate is dried under constant temperature conditions to obtain a coated solder resist surface.

4. The method for preparing a medical high reflectivity light source plate according to claim 1, characterized in that: The step of subjecting the coated solder resist layer surface to ultraviolet curing treatment, subjecting the cured solder resist layer surface to heat treatment to obtain a high reflectivity reflective layer comprises: Spraying an ultraviolet photosensitive initiator solution on the surface of the solder resist layer after the coating to obtain a sprayed solder resist layer surface, and exposing the sprayed solder resist layer surface to an ultraviolet light source to excite the photosensitive initiator to obtain an excited solder resist layer surface; Continue to irradiate with ultraviolet light at a specific wavelength to cause a cross-linking reaction of the nanomaterials on the surface of the excited solder resist layer, and control the exposure time and light intensity to uniformly cure the surface of the cured solder resist layer; The surface of the solidified solder resist layer is heat treated, and after eliminating the internal stress, the layer is cooled to obtain a dense reflective layer with high reflectivity.

5. The method for preparing a medical light source plate with high reflectivity according to claim 1, characterized in that: The step of laminating a transparent protective film on the high-reflectivity reflective layer by heat pressing to obtain a high-reflectivity light source plate for medical use comprises: Preparing a transparent polyethylene terephthalate protective film, and performing plasma treatment on the surface of the polyethylene terephthalate protective film to enhance adhesion, thereby obtaining a treated polyethylene terephthalate protective film; A layer of hot melt adhesive is coated on the surface of the high reflectivity reflective layer to obtain an adhesive-coated reflective layer, and the treated polyethylene terephthalate protective film is aligned with the adhesive-coated reflective layer and then subjected to heat pressing to obtain a high reflectivity light source board for medical use.

6. The method for preparing a high reflectivity light source plate for medical use according to claim 1, characterized in that: The nanometer-level high reflectivity material is any one of the following: titanium dioxide and zinc oxide.

7. The method for preparing a high reflectivity light source plate for medical use according to claim 1, characterized in that: The protective film is a transparent polymer film, and the polymer film is selected from any one of the following materials: polyethylene terephthalate, polycarbonate, polymethyl methacrylate, polyethylene, polypropylene, polyvinyl chloride, and polyvinylidene chloride.

8. A device for preparing a high reflectivity light source plate for medical use, characterized in that: include: A cleaning module is used to provide a light source board having a solder resist layer on its surface, and perform plasma cleaning on the surface of the solder resist layer to obtain a cleaned solder resist layer; A coating module is used to coat a layer of coating containing nano-scale high reflectivity material on the surface of the cleaned solder resist layer to obtain a coated solder resist layer surface; A curing module, used for performing UV curing treatment on the surface of the solder resist layer after coating, and performing heat treatment on the surface of the cured solder resist layer to obtain a high reflectivity reflective layer; The hot pressing module is used to laminate a transparent protective film on the high-reflectivity reflective layer by hot pressing to obtain a high-reflectivity light source board for medical use.

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