Laser synergistic glow plasma magnetron sputtering equipment and method

Abstract

The invention relates to the technical field of target sputtering, in particular to laser and glow plasma magnetron sputtering equipment and method.The laser and glow plasma magnetron sputtering equipment is characterized in that a target is in a hollow cylindrical shape and transversely connected to a target support in a sleeving mode, a base frame is transmission shafts arranged in the width direction in a sputtering cavity, and a base material is conveyed along the multiple sets of transmission shafts; a magnet assembly is arranged at the top end in the target support and used for forming a glow plasma area on the outer side of a target material, laser beams emitted by the laser irradiation assembly irradiate the reflector assembly, the reflector assembly rotates in different directions so that the laser beams can be reflected to the glow plasma area, cooperative sputter coating is achieved, and the target material is coated with the glow plasma area. Different forms of coating effects are achieved through mutual influence and interaction of laser beams and glow plasmas or sputtered target material atoms, the laser and the magnetic field are coupled, the sputtering voltage can be reduced, the temperature of a base material can be reduced, damage of sputtering ions to a substrate film layer can be reduced, the battery efficiency can be improved, and the film forming quality can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of target material sputtering, and in particular to a laser-coordinated glow plasma magnetron sputtering device and method. Background Art

[0002] The magnetron sputtering cathode in the PVD (physical vapor deposition) equipment forms a glow plasma near the target material, sputters the target material, and forms a coating on the substrate. It is suitable for various semiconductor stacking industries such as the HJT (heterojunction solar cell) industry, the LOW-E (low-emissivity coated glass) industry, and the perovskite solar thin film battery industry. For this, existing magnetron sputtering equipment and methods, such as the magnetron sputtering coating machine disclosed in the Chinese patent document CN104805410B, include a film feeding chamber, a coating chamber, a transition chamber, a film discharging chamber, and a substrate rack for carrying the coated substrate. Each coating chamber performs traditional magnetron sputtering coating on the substrate on the substrate rack. However, since the microcrystalline film layer is relatively fragile and the sputtering energy is high, the film layer of the substrate is easily damaged. Once the film layer is damaged, it will affect the efficiency of the battery and reduce the efficiency. The relatively low-temperature sputtering often easily leads to problems such as poor density of the film layer and reduced film quality. For example, low-temperature sputtering is required in perovskite coating, and the temperature is generally lower than 75°C to avoid damage to the film layer. Therefore, there is still a lack of a method and equipment that can solve the low temperature of magnetron sputtering coating and have good film density quality. Summary of the invention

[0003] In view of this, the purpose of the present invention is to propose a laser-synergistic glow plasma magnetron sputtering equipment and method to solve the problem that the film layer of the substrate is easily damaged by the traditional coating method in the existing magnetron sputtering coating equipment and method, and the low-temperature coating easily leads to a decrease in film quality.

[0004] Based on the above purpose, the present invention provides a laser-coordinated glow plasma magnetron sputtering device, including a sputtering chamber, a target holder for placing a target material, and a base frame for placing a substrate. The target support is arranged along the width direction of the sputtering chamber, the target material is in the shape of a hollow cylinder and is laterally sleeved on the target support, and a magnet assembly is arranged in the target support for forming a glow plasma region outside the target material; The base frame is a transmission shaft arranged along the width direction of the sputtering chamber, and a plurality of transmission shafts are arranged at intervals along the length direction of the sputtering chamber. The substrate includes a flat substrate and a layer to be coated attached to the substrate. A laser irradiation component is provided on the sputtering chamber, and a reflector component is movably provided on the inner wall of the sputtering chamber. The laser beam emitted by the laser irradiation component is irradiated to the reflector component and rotated in different directions through the reflector component to reflect the laser beam to the glow plasma area, thereby realizing coordinated sputtering coating.

[0005] Preferably, a fixing groove is provided on the outer wall of the sputtering chamber, the laser irradiation assembly includes a linear laser generator, a pressing plate for fixing the linear laser generator is provided in the fixing groove, and a quartz glass is provided at the light output end of the linear laser generator.

[0006] Preferably, a plurality of vertical partitions are provided in the sputtering chamber to divide the sputtering chamber into a plurality of independent sputtering zones, wherein the target support in at least one sputtering zone is located below the base frame, and the target support in at least one sputtering zone is located above the base frame, and the layers to be coated are respectively attached to the upper and lower surfaces of the substrate.

[0007] Preferably, the reflector assembly includes a reflector body and a rotating shaft connected to the reflector body, both ends of the rotating shaft are rotatably connected to the side walls of the sputtering chamber, and an elastic member is provided at the rotating connection, one end of the reflector body is connected to a pull rope, a guide wheel group is provided in the side wall of the sputtering chamber, a take-up reel is rotatably connected in the side wall of the sputtering chamber, one end of the pull rope is guided by the guide wheel group and is wound around the take-up reel, and is used to pull the pull rope by rotating the take-up reel to control the rotation angle of the reflector body.

[0008] Preferably, the wire take-up drum is located in the middle position of adjacent sputtering zones, and is used to simultaneously reel up the pull ropes of adjacent sputtering zones. The two sides of the wire take-up drum are respectively rotatably connected to adjustment shafts, and the outer sides of the adjustment shafts are connected to limiting protrusions. By rotating the adjustment shafts alone, the limiting protrusions can press the pull ropes to different degrees, so as to individually adjust the rotation angle of the reflecting mirror body in each sputtering zone.

[0009] Preferably, an outer cover frame covering the reflector assembly is fixedly provided on the vertical partition, and a through groove for the laser beam to enter and emit is opened on the outer cover frame.

[0010] Preferably, the back cover of the reflector body is provided with a blocking cloth, one end of the blocking cloth is fixedly connected to the reflector body, and the other end is connected to a pull rope, and the pull rope is rolled up by a take-up drum until the reflector body is rotated 180° so that the back of the reflector body covered by the blocking cloth faces the laser beam.

[0011] The present invention also provides a laser-coordinated glow plasma magnetron sputtering method, comprising the following steps: The target material is in a hollow cylindrical shape and is laterally sleeved on a target support. The base frame is a transmission shaft arranged along the width direction of the sputtering chamber, and the substrate is transported along multiple sets of transmission shafts. A magnet assembly is provided at the top position of the target bracket, which is used to form a glow plasma area outside the target material. The laser beam emitted by the laser irradiation assembly is irradiated to the reflector assembly, and the reflector assembly is rotated in different directions to reflect the laser beam to the glow plasma area, thereby realizing coordinated sputtering coating.

[0012] Preferably, a plurality of vertical partitions are provided in the sputtering chamber to divide the sputtering chamber into a plurality of independent sputtering zones. A take-up drum is provided in the middle of adjacent sputtering zones to wind up a pull rope. The pull rope is transmission-connected to the reflector assemblies of adjacent sputtering zones to uniformly adjust the rotation angles of the reflector assemblies of adjacent sputtering zones. Adjustment shafts are rotationally connected to the two sides of the take-up drum respectively, and a limiting protrusion is connected to the outer side of the adjustment shaft. By rotating the adjustment shaft alone, the limiting protrusion can press the pull rope to different degrees, thereby driving the pull rope to be retracted and released, so as to fine-tune the rotation angle of the reflector body in each sputtering zone individually.

[0013] Preferably, the outer cover of the reflector assembly is provided with an outer cover frame, and the outer cover frame is only provided with a through groove for the laser beam to enter and emit. The back of the reflector body is covered with a blocking cloth, and the pull rope is rolled up by the take-up reel until the reflector body is rotated 180°, so that the back of the reflector body initially covered by the blocking cloth faces the laser beam and reflects the laser beam.

[0014] The beneficial effects of the present invention are as follows: the target bracket is arranged along the width direction of the sputtering chamber, the target material is in the shape of a hollow cylinder and is laterally sleeved on the target bracket, the base bracket is a transmission shaft arranged along the width direction of the sputtering chamber, the substrate is transmitted along multiple groups of transmission shafts, a magnet assembly is arranged at the top position in the target bracket, which is used to form a glow plasma area outside the target material, the laser beam emitted by the laser irradiation assembly is irradiated to the reflector assembly, and the reflector assembly is rotated in different directions to make the laser beam reflect to the glow plasma area, so as to achieve coordinated sputtering coating, and the laser beam is introduced into the glow plasma area or the sputtering path, and the laser beam and the glow plasma or the sputtered target atoms influence and interact with each other, so as to achieve different forms of coating effects, and the laser is coupled with the magnetic field to enhance the overall magnetic field, so as to reduce the sputtering voltage, reduce the temperature of the substrate, reduce the damage of the sputtering ions to the substrate film layer, improve the battery efficiency, increase the coating rate, and increase the density of the film layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a schematic diagram of the structure of the sputtering chamber without the pull rope, the take-up drum and the outer cover frame in the present invention; Figure 2 For the present invention Figure 1 The enlarged schematic diagram of point A in the middle; Figure 3 It is a schematic structural diagram of the target support of the present invention; Figure 4 It is a schematic diagram of the top view of the sputtering chamber of the present invention; Figure 5 It is a schematic diagram of the structure of the sputtering chamber with a pull rope, a take-up drum, and an outer cover frame in the present invention; Figure 6 It is a schematic diagram of the structure of the pull rope, guide wheel group and take-up drum of the present invention; Figure 7 For the present invention Figure 5 The enlarged schematic diagram of point B in the middle; Figure 8 For the present invention Figure 5 The enlarged schematic diagram of the center C; Fig. 9 For the present invention Figure 5 The enlarged schematic diagram of point D in the middle; Fig.10 It is a schematic structural diagram of the reflector body of the present invention when the back side of the reflector body initially covered by the blocking cloth faces the laser beam; Fig.11 It is a schematic diagram of the structure of the target material of the present invention when it is sputtered downward; Fig.12 It is a schematic side view of the structure of the downward sputtering target of the present invention; Fig.13 It is a schematic diagram of the upward structure of the downward sputtering target of the present invention.

[0017] The markings in the figure are: 100, sputtering chamber; 101, vacuum assembly; 102, fixing groove; 103, vertical partition; 200, target material; 201, glow plasma area; 300, target bracket; 400, substrate; 500, base frame; 1, magnet assembly; 2, laser irradiation assembly; 20, laser beam; 21, linear laser generator; 22, pressure plate; 23, quartz glass; 3, reflector assembly; 31, reflector body; 32, rotating shaft; 4, pull rope; 5, guide wheel group; 6, take-up drum; 7, adjustment shaft; 8, limit protrusion; 9, outer cover frame; 10, through groove; 11, blocking cloth. DETAILED DESCRIPTION

[0018] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.

[0019] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0020] A laser-coordinated glow plasma magnetron sputtering device, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, the sputtering chamber 100 includes a target support 300 for placing a target material 200 and a base frame 500 for placing a substrate 400. The target support 300 is arranged along the width direction of the sputtering chamber 100. The target material 200 is in a hollow cylindrical shape and is laterally sleeved on the target support 300. The target support 300 is provided with a magnet assembly 1 for forming a glow plasma region 201 outside the target material 200. The base frame 500 is arranged along the width direction of the sputtering chamber 100. A transmission shaft is provided, and a plurality of transmission shafts are arranged at intervals along the length direction of the sputtering chamber 100. The substrate 400 includes a flat substrate and a layer to be coated attached to the substrate. A laser irradiation component 2 is provided on the sputtering chamber 100. A reflector component 3 is movably provided on the inner wall of the sputtering chamber 100. The laser beam 20 emitted by the laser irradiation component 2 is irradiated to the reflector component 3 and rotated in different directions through the reflector component 3 so that the laser beam 20 is reflected to the glow plasma region 201 to achieve coordinated sputtering coating.

[0021] The present invention is based on the principles of the existing traditional magnetron sputtering coating equipment and method, including a sputtering chamber 100, wherein a target holder 300 for placing a target material 200 and a base frame 500 for placing a substrate 400 are provided in the sputtering chamber 100. In particular, the target holder 300 is arranged along the width direction of the sputtering chamber 100, and the target material 200 is in the shape of a hollow cylinder and is laterally sleeved on the target holder 300. The sputtering chamber 100 is provided with a vacuum component 101 such as a molecular pump component for maintaining the required working vacuum degree in the sputtering chamber 100. In addition, a gas supply system is used to introduce a working gas (such as argon) into the sputtering chamber 100 and maintain a stable gas flow rate to ensure the smooth progress of the sputtering process. The top position of the target holder 300 is provided with The magnet assembly 1 is used to confine the electrons near the outer top of the target material 200 through the magnetic field to form a glow plasma region 201. The ions bombard the target material 200 under the guidance of the magnetic field, so that the atoms of the target material 200 are deposited on the substrate 400. The base frame 500 is a transmission shaft arranged along the width direction of the sputtering chamber 100. The transmission shaft can specifically adopt the existing conventional mechanical transmission shaft or magnetic fluid transmission shaft. The transmission shaft is arranged in multiple groups along the length direction of the sputtering chamber 100. The substrate 400 includes a flat substrate and a layer to be coated attached to the substrate. The sputtering chamber 100 is provided with a laser irradiation assembly 2, and a reflector assembly 3 is movably provided on the inner wall of the sputtering chamber 100. The outer wall of the sputtering chamber 100 is provided with a fixing groove 102. The fixing groove 102 is designed along the width direction of the sputtering chamber 100. The laser irradiation component 2 includes a linear laser generator 21. A pressure plate 22 for fixing the linear laser generator 21 is provided in the fixing groove 102. A quartz glass 23 is provided at the light-emitting end of the linear laser generator 21. The laser beam 20 emitted by the laser irradiation component 2 is irradiated to the reflector component 3 through the quartz glass 23, and the reflector component 3 is rotated in different directions to make the laser beam 20 reflect to the glow plasma region 201, so as to realize the coordinated sputtering coating. In normal magnetron sputtering, the glow plasma region 201 is formed near the target material 200, and then the sputtering coating is directly performed. In the present invention, the laser beam 20 is introduced into the glow plasma region 201 or the sputtering path, and the laser beam 20 and the glow plasma are combined to form a co-sputtering coating. The atoms of the daughter body or sputtered target 200 influence and interact with each other to achieve different forms of coating effects. The laser is coupled with the magnetic field to enhance the overall magnetic field, thereby reducing the sputtering voltage, reducing the temperature of the substrate 400, reducing the damage of the sputtering ions to the substrate film layer, improving the battery efficiency, increasing the coating rate, and increasing the density of the film layer. Through linear laser beams 20 of different wavelengths, the intensity of the laser can be changed to achieve the minimum damage to the film layer on the substrate after the plasma formed on the target 200 interacts with the plasma of the original magnetic field and the battery efficiency is optimized. Specifically, according to the material of the target, lasers of different bands are used. It is more appropriate to use near-infrared or visible light for metals. Ultraviolet light will bombard the metal target 200 and overheat it, and the effect is worse.Ultraviolet is more suitable for ceramics. Lasers in other bands will also have an impact on plasma, but the effect on the film layer is not optimal.

[0022] In an embodiment of the present invention, Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, a plurality of vertical partitions 103 are arranged in the sputtering chamber 100 to divide the sputtering chamber 100 into a plurality of independent sputtering zones, wherein the target support 300 in at least one sputtering zone is located below the base frame 500, and the target support 300 in at least one sputtering zone is located above the base frame 500, and the layers to be coated are respectively attached to the upper and lower surfaces of the substrate, and correspondingly, the fixing grooves 102 are located in the width direction of the bottom and top ends of the sputtering chamber 100, and the fixing grooves 102 and the target support 300 are arranged in a plurality of groups corresponding to each other, for example, in a sputtering zone, the target support 300 is arranged below the base frame 500, and the target support 300 is arranged above the base frame 500, and ... There are two left and right target supports 300, and two corresponding left and right laser irradiation components 2 and reflector components 3 in the area. The position of the top magnet component 1 in the target support 300 does not move, but the target material 200 is clamped and driven to rotate axially through the mechanical structures such as the clamping claws and rollers at both ends of the target support 300 or inside the target support 300. The linear laser beam 20 can ensure the uniformity of the axis direction of the target material 200 and ensure that the uniform area of ​​the entire plasma zone can be irradiated. The substrate 400 can be transmitted unidirectionally or reciprocally, and double-sided coating can be achieved. The light intensity of a certain wavelength laser can be adjusted to minimize damage to the substrate 400 and maximize battery efficiency. At the same time, the introduction of laser participation in sputtering helps to improve the coating rate, density and film quality. The laser beam 20 can realize the change of the laser light path through the reflector component 3, which is conducive to irradiating different positions of the target material 200 to achieve the best effect. The upward sputtering is the same as the downward sputtering.

[0023] For example, Fig.11 , Fig.12 , Fig.13 As shown, the target material 200 is sputtered downward, and forms Fig.11 , Fig.12 , Fig.13 The glow plasma region 201 shown in the figure can be irradiated with the laser beam 20 by adjusting the rotation angle of the reflector assembly 3, so as to reduce the sputtering voltage and reduce the damage of the sputtering ions to the substrate film layer. It can also be irradiated on the sputtering path to further enhance the energy splitting of the particles on the sputtering path and improve the density of the coating film layer. Or it can also be irradiated on the non-glow area beside the edge of the glow plasma region 201 to further improve the sputtering coating rate. When the laser beam 20 is irradiated on the glow plasma region 201, the rotation angle of the reflector assembly 3 can be adjusted to make the laser beam 20 focus on the glow plasma region 201 as shown in the figure. Fig.13The straight line segment (glow uniform area) of the glow plasma region 201 shown in FIG. Fig.13 The arc segment (glow inhomogeneous area) of the glow plasma region 201 shown in the figure takes into account that during actual sputtering coating, the target material 200 is consumed more in the arc segment (glow inhomogeneous area) of the glow plasma region 201, which usually causes both sides of the target material 200 to be sputtered while a lot of target material 200 remains in the middle, resulting in low utilization of the target material 200. This situation can be improved by introducing the laser beam 20.

[0024] In an embodiment of the present invention, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 8 As shown, the reflector assembly 3 includes a reflector body 31 and a rotating shaft 32 connected to the reflector body 31. Both ends of the rotating shaft 32 are rotatably connected to the side walls of the sputtering chamber 100, and an elastic member is provided at the rotating connection. The elastic member can adopt an existing conventional elastic member such as a torsion spring, wherein the rotating shaft 32 can be driven to rotate by a separate driving unit. As another embodiment, optionally, as Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 As shown, a pull rope 4 is connected to one end of the reflector body 31, and the reflector body 31 is designed to be a long plate parallel to the length direction of the target material 200 and the target bracket 300. The pull rope 4 is respectively located at the two ends of the length direction of the reflector body 31, and a guide wheel group 5 is provided in the side wall of the sputtering chamber 100. A take-up drum 6 is rotatably connected in the side wall of the sputtering chamber 100. One end of the pull rope 4 is guided by the guide wheel group 5 and wound around the take-up drum 6, so that the take-up drum 6 can be controlled to rotate to pull the pull rope 4 to tighten, thereby realizing synchronous control of the rotation angle of multiple groups of reflector bodies 31. For example, the take-up drum 6 further rotates the reel-in pull rope 4, driving the reflector body 31 to rotate in the direction of further tightening the elastic member, and the take-up drum 6 further rotates the unwinding pull rope 4, which drives the reflector body 31 to rotate in the direction of further loosening the elastic member.

[0025] In an embodiment of the present invention, Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10As shown, optionally, the take-up reel 6 is located in the middle position of adjacent sputtering zones, and is used for simultaneously reeling in the pull ropes 4 of adjacent sputtering zones. Since the reflector assemblies 3 of adjacent sputtering zones are symmetrically arranged, the take-up reel 6 is controlled to rotate to reel in and release the pull rope 4, so as to achieve the effect of uniformly adjusting the rotation angle of the reflector assemblies 3 of adjacent sputtering zones. In actual use, taking into account the slight deviation of adjacent sputtering zones, adjustment shafts 7 are rotatably connected to the two sides of the take-up reel 6, and the outer side of the adjustment shaft 7 is connected to a limiting protrusion 8. Therefore, after the rotation angle of the reflector assemblies 3 of adjacent sputtering zones is uniformly adjusted, when it is necessary to fine-tune the rotation angle of the reflector assemblies 3 of each sputtering zone, the adjustment shaft 7 is rotated separately so that the limiting protrusion 8 presses the pull rope 4 to different degrees, thereby driving the pull rope 4 to be retracted and released, so as to fine-tune the rotation angle of the reflector body 31 in each sputtering zone separately.

[0026] Among them, the wire take-up reel 6 and the adjustment shaft 7 can be driven to rotate by a driving component such as a rotating cylinder in the sputtering chamber 100, or a rotating handle can be connected to the end of the wire take-up reel 6 and the adjustment shaft 7 passing through the outside of the sputtering chamber 100, and the adjustment can be achieved by manually turning the rotating handle. The adjustment shaft 7 can also be arranged on the path of the pull rope 4 connected to each reflector body 31 to achieve separate control of each reflector body 31. In this way, even if there is a slight difference in the glow of the rotating cathodes on both sides, independent minor adjustments can be completed.

[0027] In an embodiment of the present invention, Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 As shown, optionally, considering that a small amount of particles may be deposited on the reflector body 31 synchronously, the reflector body 31 needs to be replaced regularly. In actual use, it is often necessary to open the cavity and replace the reflector body 31 before the target material 200 is consumed, which affects the production efficiency. An outer cover frame 9 covering the reflector assembly 3 is fixed on the vertical partition 103, and only a through groove 10 for the laser beam 20 to enter and emit is opened on the outer cover frame 9, so that the particles can only flow into the outer cover frame 9 along the tiny through groove 10 and be deposited on the reflector assembly 3, thereby extending the replacement and maintenance cycle of the reflector body 31, basically ensuring that when the cavity is opened to replace the target material 200, the reflector body 31 can be replaced and maintained synchronously.

[0028] In an embodiment of the present invention, optionally, Figure 5 , Figure 8 , Fig. 9 As shown, the back cover of the reflector body 31 is provided with a blocking cloth 11. At this time, the front of the reflector body 31 is used to reflect the laser beam 20. One end of the blocking cloth 11 is fixedly connected to the reflector body 31, and the other end is connected to the pull rope 4. After a certain period of use, the pull rope 4 is rolled up by the take-up drum 6 until the reflector body 31 rotates 180°. Fig.10As shown, the back side of the reflector body 31 initially covered by the blocking cloth 11 faces the laser beam 20. Since the back side of the reflector body 31 initially covered by the blocking cloth 11 is not affected by the deposition, it is used to reflect the laser beam 20 instead of the initial front side, thereby further fully utilizing the reflector body 31 and extending the maintenance period of the reflector body 31.

[0029] Among them, the front and back surfaces of the reflector body 31 are both mirror-designed, or the mirror surface of the reflector body 31 is designed at one end of the front side and the opposite end of the back side for double-sided use, and an avoidance groove is designed on the vertical partition 103 to provide space for the reflector body 31 to rotate 180°.

[0030] The present invention also provides a laser-coordinated glow plasma magnetron sputtering method, comprising the following steps: The target material 200 is in a hollow cylindrical shape and is laterally sleeved on the target support 300. The base frame 500 is a transmission shaft arranged along the width direction of the sputtering chamber 100. The substrate 400 is transported along multiple sets of transmission shafts. A magnet assembly 1 is provided at the top position of the target holder 300, which is used to form a glow plasma region 201 outside the target material 200. The laser beam 20 emitted by the laser irradiation assembly 2 is irradiated to the reflector assembly 3, and the reflector assembly 3 is rotated in different directions to reflect the laser beam 20 to the glow plasma region 201, thereby realizing coordinated sputtering coating.

[0031] More preferably, a plurality of vertical partitions 103 are provided in the sputtering chamber 100 to divide the sputtering chamber 100 into a plurality of independent sputtering zones, a take-up drum 6 is provided in the middle of adjacent sputtering zones to wind up the pull rope 4, the pull rope 4 is transmission-connected to the reflector assembly 3 of the adjacent sputtering zones to uniformly adjust the rotation angle of the reflector assembly 3 of the adjacent sputtering zones, adjustment shafts 7 are rotationally connected to the two sides of the take-up drum 6 respectively, a limiting protrusion 8 is connected to the outer side of the adjustment shaft 7, and the adjustment shaft 7 is rotated separately to make the limiting protrusion 8 press against the pull rope 4 to different degrees, thereby driving the pull rope 4 to be retracted and released, so as to fine-tune the rotation angle of the reflector body 31 in each sputtering zone separately.

[0032] More preferably, the outer cover of the reflector assembly 3 is provided with an outer cover frame 9, and the outer cover frame 9 is only provided with a through groove 10 for the laser beam 20 to enter and emit, and the back of the reflector body 31 is covered with a blocking cloth 11, and the pull rope 4 is rolled up by the take-up reel 6 until the reflector body 31 is rotated 180°, so that the back of the reflector body 31 initially covered by the blocking cloth 11 faces the laser beam 20 and reflects the laser beam 20.

[0033] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present invention is limited to these examples. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.

Claims

1. A laser-coordinated glow plasma magnetron sputtering device, comprising a sputtering chamber (100), wherein a target support (300) for placing a target material (200) and a base frame (500) for placing a substrate (400) are provided in the sputtering chamber (100), characterized in that: The target support (300) is arranged along the width direction of the sputtering chamber (100); the target material (200) is in a hollow cylindrical shape and is laterally sleeved on the target support (300); a magnet assembly (1) is arranged in the target support (300) for forming a glow plasma region (201) outside the target material (200); The base frame (500) is a transmission shaft arranged along the width direction of the sputtering chamber (100), and a plurality of transmission shafts are arranged at intervals along the length direction of the sputtering chamber (100). The substrate (400) comprises a flattened substrate and a layer to be coated attached to the substrate. The sputtering chamber (100) is provided with a laser irradiation component (2), and a reflector component (3) is movably provided on the inner wall of the sputtering chamber (100); a laser beam (20) emitted by the laser irradiation component (2) is irradiated toward the reflector component (3), and the reflector component (3) is rotated in different directions so that the laser beam (20) is reflected toward the glow plasma region (201), thereby realizing coordinated sputtering coating.

2. The laser-coordinated glow plasma magnetron sputtering device according to claim 1, characterized in that: A fixing groove (102) is provided on the outer wall of the sputtering chamber (100), the laser irradiation assembly (2) comprises a linear laser generator (21), a pressing plate (22) for fixing the linear laser generator (21) is provided in the fixing groove (102), and a quartz glass (23) is provided at the light output end of the linear laser generator (21).

3. The laser-coordinated glow plasma magnetron sputtering device according to claim 1, characterized in that: A plurality of vertical partitions (103) are arranged in the sputtering chamber (100) to divide the sputtering chamber (100) into a plurality of independent sputtering zones, wherein the target support (300) in at least one sputtering zone is located below the base frame (500), and the target support (300) in at least one sputtering zone is located above the base frame (500), and the layers to be coated are respectively attached to the upper and lower surfaces of the substrate.

4. The laser-coordinated glow plasma magnetron sputtering device according to claim 3, characterized in that: The reflector assembly (3) comprises a reflector body (31) and a rotating shaft (32) connected to the reflector body (31); both ends of the rotating shaft (32) are rotatably connected to the side wall of the sputtering chamber (100), and an elastic member is provided at the rotatable connection; one end of the reflector body (31) is connected to a pull rope (4); a guide wheel group (5) is provided inside the side wall of the sputtering chamber (100); a wire reel (6) is rotatably connected inside the side wall of the sputtering chamber (100); one end of the pull rope (4) is guided by the guide wheel group (5) and is wound around the wire reel (6); the wire reel (6) is rotated to pull the pull rope (4) to achieve control of the rotation angle of the reflector body (31).

5. The laser-coordinated glow plasma magnetron sputtering device according to claim 4, characterized in that: The wire take-up drum (6) is located in the middle of adjacent sputtering zones and is used to simultaneously take up the pull ropes (4) of adjacent sputtering zones. Adjustment shafts (7) are rotatably connected to the two sides of the wire take-up drum (6). The outer side of the adjustment shaft (7) is connected to a limiting protrusion (8). By rotating the adjustment shaft (7) alone, the limiting protrusion (8) presses the pull rope (4) to different degrees, so as to adjust the rotation angle of the reflector body (31) in each sputtering zone alone.

6. The laser-coordinated glow plasma magnetron sputtering device according to claim 4, characterized in that: An outer cover frame (9) covering the reflector assembly (3) is fixedly provided on the vertical partition plate (103), and a through slot (10) for the laser beam (20) to be injected into and emitted from the outer cover frame (9) is provided.

7. The laser-coordinated glow plasma magnetron sputtering device according to claim 6, characterized in that: The back cover of the reflector body (31) is provided with a blocking cloth (11), one end of the blocking cloth (11) is fixedly connected to the reflector body (31), and the other end is connected to a pull rope (4), and the pull rope (4) is rolled up by a take-up drum (6) until the reflector body (31) is rotated 180 degrees, so that the back of the reflector body (31) covered by the blocking cloth (11) faces the laser beam (20).

8. A laser-coordinated glow plasma magnetron sputtering method, the method using the laser-coordinated glow plasma magnetron sputtering device as claimed in any one of claims 1 to 7 for sputtering, characterized in that: The steps include: The target material (200) is in a hollow cylindrical shape and is laterally sleeved on a target support (300); the base frame (500) is a transmission shaft arranged along the width direction of the sputtering chamber (100); and the substrate (400) is transported along multiple sets of transmission shafts; A magnet assembly (1) is provided at the top end of the target support (300) for forming a glow plasma region (201) outside the target material (200). A laser beam (20) emitted by a laser irradiation assembly (2) is irradiated toward a reflector assembly (3), and the reflector assembly (3) is rotated in different directions so that the laser beam (20) is reflected toward the glow plasma region (201), thereby realizing coordinated sputtering coating.

9. The laser-coordinated glow plasma magnetron sputtering method according to claim 8, characterized in that: A plurality of vertical partitions (103) are arranged at intervals in the sputtering chamber (100) for dividing the sputtering chamber (100) into a plurality of independent sputtering zones. A take-up drum (6) is arranged at the middle position of adjacent sputtering zones for winding up a pull rope (4). The pull rope (4) is in driving connection with the reflector assembly (3) of the adjacent sputtering zones for uniformly adjusting the rotation angle of the reflector assembly (3) of the adjacent sputtering zones. Adjustment shafts (7) are rotatably connected at both sides of the take-up drum (6). The outer side of the adjustment shaft (7) is connected to a limiting protrusion (8). By rotating the adjustment shaft (7) alone, the limiting protrusion (8) presses the pull rope (4) to different degrees, driving the pull rope (4) to be retracted and released, for individually fine-tuning the rotation angle of the reflector body (31) in each sputtering zone.

10. The laser-coordinated glow plasma magnetron sputtering method according to claim 9, characterized in that: The reflector assembly (3) is provided with an outer cover frame (9), the outer cover frame (9) is only provided with a through slot (10) for the laser beam (20) to enter and exit, the back cover of the reflector body (31) is provided with a blocking cloth (11), and the pull rope (4) is wound up by a take-up drum (6) until the reflector body (31) is rotated 180 degrees, so that the back of the reflector body (31) initially covered by the blocking cloth (11) faces the laser beam (20), and reflects the laser beam (20).

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