Integrated electronic copper foil production equipment and preparation method

Abstract

The invention provides integrated electronic copper foil production equipment and a preparation method, and relates to the technical field of electronic copper foil preparation. The integrated electronic copper foil production equipment comprises a foil generating device, a coarsening device, a dielectric layer generating device and a conveying roller set, and the foil generating device is used for generating a copper foil layer; the roughening device is used for roughening the preset surface of the copper foil layer; the dielectric layer generation device is arranged on the rear side of the coarsening device and is used for preparing a dielectric layer on the coarsened side of the copper foil layer; the conveying roller group is connected between the crude foil device and the coarsening device and is used for transferring a copper foil layer to the coarsening device within preset time; when the electronic copper foil is a blackened copper foil, the dielectric layer is a blackened layer; and when the electronic copper foil is a buried resistance copper foil, the dielectric layer is a resistance layer. The technical scheme provided by the invention can be used for preparing a blackened copper foil product with extremely low surface profile tolerance.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic copper foil preparation, and in particular to an integrated electronic copper foil production device and a preparation method. Background Art

[0002] Blackened copper foil and buried copper foil are two common electronic copper foils. Among them, blackened copper foil, also known as black copper foil or black copper foil, forms a black oxide film or other type of black covering layer on the surface of the copper foil through a specific chemical or electrochemical treatment method, thereby improving the corrosion resistance, adhesion, conductivity, oxidation resistance, thermal stability and other properties of the copper foil. Buried copper foil is a copper foil with built-in resistor material, mainly used for high-performance printed circuit boards, etc.

[0003] In the related art, since there is a large difference between the generation speed of the copper foil layer and the processing speed of the post-processing equipment, when producing low-profile blackened copper foil, the copper foil layer is first generated at a first speed on the foil production device and rolled up, and then the rolled-up copper foil layer is moved to the post-processing equipment for subsequent processing at a second speed to obtain the blackened copper foil.

[0004] However, since the copper foil layer needs to wait for the winding to be completed before anti-oxidation or passivation treatment can be carried out, the surface of the copper foil layer often changes its crystal profile due to oxidation during this period. Even if it is optimized later, it is difficult to restore the surface crystal state to the optimal state. As a result, the copper foil has a high profile and irregular grain profile, which cannot meet the application requirements of high-end blackened copper foil.

[0005] In addition, the blackened copper foil and buried copper foil in the present disclosure are mainly used as electronic copper foil. Compared with lithium battery copper foil, electronic copper foil usually has a wider thickness range and higher surface flatness, and requires additional surface treatment to enhance solderability and adhesion. Electronic copper foil is mainly used in electronic information technology, such as the manufacture of printed circuit boards, while lithium battery copper foil is mainly used in the manufacture of lithium-ion batteries to adapt to the space limitations and lightweight requirements inside lithium batteries.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0007] The purpose of the embodiments of the present disclosure is to provide an integrated electronic copper foil production device and preparation method, which can be used to prepare electronic copper foil products with extremely low surface profile, and can roughen the copper foil layer and generate the dielectric layer in the shortest time. Furthermore, the surface profile and grain particle profile uniformity of the electronic copper foil can be reduced at least to a certain extent.

[0008] Additional aspects and advantages of the disclosure will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the disclosure.

[0009] According to a first aspect of the present disclosure, an integrated electronic copper foil production device is provided, wherein the electronic copper foil includes a blackened copper foil and a buried barrier copper foil, and the integrated electronic copper foil production device includes: a foil production device, a roughening device, a dielectric layer generating device and a conveying roller group, wherein the foil production device is used to generate a copper foil layer; the roughening device is used to roughen a preset surface of the copper foil layer; the dielectric layer generating device is arranged on the rear side of the roughening device, and is used to prepare a dielectric layer on a side of the copper foil layer that has been roughened; the conveying roller group is connected between the foil production device and the roughening device, and is used to transfer the copper foil layer to the roughening device within a predetermined time, wherein when the electronic copper foil is a blackened copper foil, the dielectric layer is a blackened layer; when the electronic copper foil is a buried barrier copper foil, the dielectric layer is a resistor layer.

[0010] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the conveying roller group includes a connecting roller, and the connecting roller is a feeding roller of the roughening device; or, the connecting roller is a peeling roller of the foil production device.

[0011] In an exemplary embodiment of the present disclosure, based on the above scheme, the dielectric layer generating device includes a roller group, a tension control component and an electroplating component. The roller group is used to transfer the foil delivered by the roughening device, and the transfer speed of the roller group to the foil is consistent with the copper foil layer generating speed of the foil generating device; the tension control component is electrically connected to the roller group and is used to control the tension of the roller group on the foil; the electroplating component is used to prepare the dielectric layer on the side of the copper foil layer that has been roughened by the electroplating method.

[0012] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the roller group includes an active roller and a tension roller, wherein the active roller is used to control the transfer speed of the foil material; and the tension roller is used to maintain the tension of the foil material during the transfer process.

[0013] In an exemplary embodiment of the present disclosure, based on the above scheme, the tension control assembly includes a pressure sensor and a drive unit. The pressure sensor is arranged on the tension roller to detect the pressure of the foil material to obtain pressure data; the drive unit is used to adjust the rotation speed of the active roller according to the pressure data to dynamically compensate for the tension of the foil material during the transmission process.

[0014] In an exemplary embodiment of the present disclosure, based on the above scheme, the electroplating assembly includes two conductive rollers and an electroplating tank. The two conductive rollers are respectively arranged on both sides of the foil to provide a symmetrical cathode circuit connection distance for the foil, so as to improve the current uniformity and current controllability of different regions during the blackening process of the foil; the electroplating tank includes a dielectric solution, which is used to uniformly deposit metal ions in the dielectric solution onto the side of the copper foil layer that has undergone the roughening process to form a dielectric layer.

[0015] In an exemplary embodiment of the present disclosure, based on the aforementioned solution, the above-mentioned integrated electronic copper foil production equipment further includes a high-temperature anti-oxidation component, which is connected to the conveying roller group and is used to perform anti-oxidation treatment on the copper foil layer transferred by the conveying roller group.

[0016] In an exemplary embodiment of the present disclosure, based on the aforementioned scheme, the above-mentioned dielectric layer generating device includes an electro-deposited copper grain size processing component, which uses the copper foil layer as a cathode, and forms crystal nuclei on the side of the copper foil layer away from the dielectric layer by adjusting the current density in different areas of the anode, and the generation speed of the crystal nuclei is greater than the growth speed of the crystal nuclei.

[0017] In an exemplary embodiment of the present disclosure, based on the above scheme, the above foil production device includes an electrodeposition tank, a titanium cathode roller and a stripping roller. The electrodeposition tank is used to place the electrolyte; the titanium cathode roller is used to deposit the metal ions in the electrolysis process of the electrolyte to generate the copper foil layer; and the stripping roller is used to strip the copper foil layer from the cathode roller.

[0018] In an exemplary embodiment of the present disclosure, based on the aforementioned solution, the above-mentioned integrated electronic copper foil production equipment further includes a passivation treatment device, which is arranged at the rear side of the dielectric layer generating device and is used to passivate the foil material transferred from the dielectric layer generating device.

[0019] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the medium layer generating device includes at least one exhaust hood for extracting and discharging harmful volatiles during the surface treatment and medium layer generating process.

[0020] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the operating width of the roughening device and the medium layer generating device is greater than 1.4 meters.

[0021] According to a second aspect of the present disclosure, there is provided an integrated electronic copper foil preparation method, wherein the electronic copper foil comprises a blackened copper foil and a buried barrier copper foil, and the integrated electronic copper foil preparation method comprises: performing surface treatment on a raw foil surface of a raw foil device to obtain a raw foil surface with preset copper foil metallographic structure parameters; preparing a copper foil layer based on the raw foil surface of the raw foil device; after the copper foil layer is generated, performing surface anti-oxidation treatment on the copper foil layer within a preset time; performing roughening treatment on a preset surface of the copper foil layer after the surface anti-oxidation treatment; performing electrodeposition treatment on the roughened foil material to prepare a dielectric layer on a side of the copper foil layer after the roughening treatment to obtain an electronic copper foil; when the electronic copper foil is a blackened copper foil, the dielectric layer is a blackened layer; when the electronic copper foil is a buried barrier copper foil, the dielectric layer is a resistor layer.

[0022] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the production speed of the foil production device is between 0.6 meters per minute and 5 meters per minute.

[0023] It can be seen from the above technical solution that the present disclosure has at least one of the following advantages and positive effects:

[0024] The integrated electronic copper foil production equipment disclosed in the present invention includes a foil production device, a roughening device, a dielectric layer production device and a conveying roller group, wherein the conveying roller group is connected between the foil production device and the roughening device, and is used to transfer the copper foil layer to the roughening device within a predetermined time. On the one hand, the copper foil layer can be quickly surface treated by the conveying roller group after it is produced, which reduces the time the copper foil layer is exposed to the air, thereby reducing the risk of oxidation, ensuring the stability of the surface crystal state of the electronic copper foil, and making it easier to meet the requirements of extremely low contour. On the other hand, the copper foil layer production step, the roughening treatment step and the dielectric layer production step are integrated into one production device, which simplifies the production process, reduces the investment of manpower and material resources, and reduces the production cost. On the other hand, the copper foil layer does not need to be rolled up and transferred after it is produced, avoiding the risk of foreign matter inclusion in the copper foil. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other features and advantages of the present disclosure will become more apparent by describing in detail example embodiments thereof with reference to the attached drawings.

[0026] Figure 1 It is a structural schematic diagram of an integrated electronic copper foil production device in an embodiment of the present disclosure.

[0027] Figure 2 It is a structural schematic diagram of another integrated electronic copper foil production equipment in an embodiment of the present disclosure.

[0028] Figure 3 It is a schematic structural diagram of a third processing tank in an embodiment of the present disclosure.

[0029] Figure 4 It is a schematic diagram of the structure of a blackened copper foil in an embodiment of the present disclosure.

[0030] Figure 5 It is a schematic diagram of the structure of a buried barrier copper foil in an embodiment of the present disclosure.

[0031] Figure 6 It is a schematic diagram of a process for preparing an integrated electronic copper foil in an embodiment of the present disclosure.

[0032] The main components in the figure are described as follows:

[0033] 1. Foil production device; 11. Electrodeposition tank; 12. Titanium cathode roller; 13. Copper foil layer; 131. Roughened surface; 14. Polisher; 15. Blackened layer; 16. Resistor layer;

[0034] 2. Roughening device; 3. Dielectric layer generating device; 4. Conveying roller set; 5. End treatment device;

[0035] 211, first active roller; 212, second active roller; 213, third active roller; 214, fourth active roller; 215, fifth active roller; 216, sixth active roller;

[0036] 221, a first tension roller; 222, a second tension roller; 223, a third tension roller; 224, a fourth tension roller; 225, a fifth tension roller;

[0037] 2301, a first conductive roller; 2302, a second conductive roller; 2303, a third conductive roller; 2304, a fourth conductive roller; 2305, a fifth conductive roller; 2306, a sixth conductive roller; 2307, a seventh conductive roller; 2308, an eighth conductive roller;

[0038] 2401, first pressing roller; 2402, second pressing roller; 2403, third pressing roller; 2404, fourth pressing roller; 2405, fifth pressing roller; 2406, sixth pressing roller; 2407, seventh pressing roller; 2408, eighth pressing roller; 2409, ninth pressing roller;

[0039] 251, first tension control assembly; 252, second tension control assembly; 253, third tension control assembly; 254, fourth tension control assembly; 255, fifth tension control assembly;

[0040] 2601, first processing tank; 2602, second processing tank; 2603, third processing tank; 2604, fourth processing tank; 2605, fifth processing tank; 2606, sixth processing tank; 2607, seventh processing tank; 2608, eighth processing tank; 2609, ninth processing tank; 2610, tenth processing tank; 2611, eleventh processing tank;

[0041] 271, first guide roller; 272, second guide roller;

[0042] 28. Drying box;

[0043] 291, first exhaust hood; 292, second exhaust hood;

[0044] 2121. A first positive electrode plate; 2122. A second positive electrode plate. DETAILED DESCRIPTION

[0045] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0046] The features, structures or characteristics described above may be combined in one or more embodiments in any suitable manner, and if possible, the features discussed in each embodiment are interchangeable. In the above description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or other methods, components, materials, etc. may be adopted. In other cases, known structures, materials or operations are not shown or described in detail to avoid blurring the various aspects of the present disclosure.

[0047] Although relative terms such as "upper" and "lower" are used in this disclosure to describe the relative relationship of one component of the illustration to another component, these terms are used in this disclosure only for convenience, such as the orientation of the examples described in the drawings. It is understood that if the device of the illustration is turned over so that it is upside down, the component described as being "upper" will become the component "lower". Other relative terms, such as "high", "low", "top", "bottom", "front", "back", "left", "right", etc., are also used to have similar meanings. When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0048] In the present disclosure, the terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising", "including" and "having" are used to express an open-ended inclusion and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used merely as labels and are not intended to limit the quantity of their objects.

[0049] In the relevant electronic copper foil production process, due to the mismatch between the speed of copper foil layer generation and the speed of post-processing equipment, when producing electronic copper foil, the foil production device continuously generates and reels the copper foil layer at a first speed, while the subsequent processing equipment performs surface treatment on the copper foil layer at a second speed. However, before the copper foil layer is rolled up, its surface may be oxidized due to exposure to air, thereby affecting the crystalline structure of the copper foil. Even if the oxidation is optimized, the crystalline state of the copper foil surface generated subsequently is difficult to restore to the ideal state, which results in a high profile of the copper foil, which cannot meet the strict requirements of certain application fields.

[0050] In addition, since the production and post-processing of the copper foil layer are divided into different sections, the transfer process of the copper foil layer requires a lot of manpower and material resources, and the operation of winding and unwinding increases the risk of surface oxidation of the copper foil layer, and may also cause foreign matter inclusions, affecting the overall quality and performance of the copper foil.

[0051] In order to solve all or part of the technical problems in the above-mentioned related technologies, the embodiments of the present disclosure provide an integrated electronic copper foil production device. Figure 1 As shown, the integrated electronic copper foil production equipment includes a foil production device 1, a roughening device 2, a dielectric layer generation device 3 and a conveying roller group 4. Among them, the foil production device is used to generate a copper foil layer; the roughening device is used to roughen a preset surface of the copper foil layer; the dielectric layer generation device is arranged at the rear side of the roughening device, and is used to prepare a dielectric layer on the side of the copper foil layer that has been roughened; the conveying roller group is connected between the foil production device and the roughening device, and is used to transfer the copper foil layer to the roughening device within a predetermined time; when the electronic copper foil is a blackened copper foil, the dielectric layer is a blackened layer; when the electronic copper foil is a buried resistive copper foil, the dielectric layer is a resistive layer.

[0052] Specifically, the foil-producing device may refer to a device for depositing a copper foil layer on the cathode surface through an electrochemical deposition process. The roughening device may refer to a component for physically or chemically treating the surface of the copper foil layer to increase its surface roughness, thereby improving the adhesion of the subsequent dielectric layer or other coating. The dielectric layer generating device may refer to a device for forming a dielectric layer on a preset surface of the copper foil layer by electroplating or electrodeposition. The conveying roller group may refer to a component connecting the foil-producing device and the roughening device, which is used to transfer the copper foil layer from the foil-producing device to the roughening device within a predetermined time, thereby reducing the pause and waiting time in the production process.

[0053] In addition, the conveying roller group transfers the copper foil layer to the roughening device within a predetermined time, wherein the predetermined time does not exceed 20 minutes. Exemplarily, the predetermined time may be between 1 minute and 5 minutes, and the production line distance between the discharge port of the raw foil device and the feed port of the roughening device does not exceed 3 meters. Exemplarily, the production line distance between the discharge port of the raw foil device and the feed port of the roughening device may be between 1 meter and 2 meters.

[0054] Exemplarily, the integrated electronic copper foil production equipment further includes an end processing device 5. The end processing device is located at the end of the foil production line. Exemplarily, the end processing device may be a winding mechanism for neatly winding the continuously produced electronic copper foil into a roll for storage, transportation and subsequent use. Exemplarily, the end processing device may be a transition roller for transferring the foil delivered by the dielectric layer generating device to a subsequent processing device for processing.

[0055] Blackened copper foil refers to a copper foil product obtained by forming a black coating on the surface of the copper foil through a specific chemical or electrochemical treatment method. This black coating is usually composed of copper oxide or other compounds, which is used to improve the corrosion resistance, adhesion, oxidation resistance and conductivity of the copper foil. In the actual production process, the raw foil device generates a copper foil layer at a preset current density and speed, and then transfers the generated copper foil layer to the conveyor roller group, which transfers the copper foil layer from the raw foil device to the roughening device. In the roughening device, the preset surface of the copper foil layer will be roughened to increase the surface area and surface roughness of the copper foil. Then, after subsequent water washing, blackening treatment and other operations, a blackened layer is formed on the roughened surface of the copper foil layer. The buried copper foil is a copper foil containing a built-in resistor material. After the preset surface of the copper foil layer is roughened, the dielectric layer generation device will prepare a resistor layer on the roughened side of the copper foil layer to form a buried copper foil.

[0056] The integrated electronic copper foil production equipment disclosed in the present invention, on the one hand, enables the copper foil layer to be quickly surface treated after being generated through the conveying roller group, thereby reducing the time the copper foil layer is exposed to the air, thereby reducing the risk of oxidation, ensuring the stability of the surface crystal state of the electronic copper foil, and making it easier to meet the requirements of extremely low profile. On the other hand, the copper foil layer generation step, the roughening treatment step and the dielectric layer generation step are integrated into one production equipment, which simplifies the production process, reduces the investment of manpower and material resources, and reduces production costs. On the other hand, the copper foil layer does not need to be rolled up and transferred after it is generated, avoiding the risk of foreign matter inclusions in the copper foil.

[0057] The various parts of the above-mentioned integrated electronic copper foil production equipment are described in detail below.

[0058] In some embodiments, the conveying roller group includes a connecting roller, which can be a feed roller of a roughening device or a stripping roller of a raw foil device. Among them, the feed roller can refer to a component located between the raw foil device and the roughening device, which is used to receive the copper foil layer generated by the raw foil device and convey it to the roughening device. The stripping roller can refer to a component located at the end of the raw foil device, which is used to strip the copper foil layer from the raw foil device. Using the feed roller of the roughening device or the stripping roller of the raw foil device as the connecting roller of the conveying roller group can reduce the number of components of the equipment, simplify the equipment structure, reduce production costs, and reduce the time and distance of material transfer, thereby improving the continuity and efficiency of the production line. In addition, since the connecting roller directly connects the raw foil device and the roughening device, the exposure time of the copper foil layer during the transfer process is reduced, thereby reducing the risk of oxidation and contamination of the copper foil layer surface. Further, the design and operation of the connecting roller can ensure the stability and integrity of the copper foil layer during the transfer process, reduce the damage of the copper foil layer during the transfer process, thereby improving the quality and performance of electronic copper foil products.

[0059] Exemplarily, the roughening device can chemically roughen the preset surface of the copper foil layer by means of a roughening solution, the roughening solution can be an acidic solution (such as sulfuric acid, nitric acid) or an alkaline solution (such as sodium hydroxide), the roughening solution is applied to the preset surface of the copper foil layer, and the temperature and coating time of the roughening solution are controlled to ensure the desired roughening effect. The roughening device can also electrochemically roughen the preset surface of the copper foil layer by means of electrolysis, the copper foil layer is used as a cathode, immersed in an electrolyte, and after power is applied, the degree of roughening is controlled by adjusting the current density and the electrolysis time. The roughening device can also physically remove the material on the surface of the copper foil layer by means of sandblasting, brushing, grinding, etc., so as to mechanically roughen it.

[0060] In some embodiments, the dielectric layer generating device includes a roller group, a tension control component and an electroplating component. The roller group can be used to transfer the foil delivered by the roughening device, and the transfer speed of the roller group to the foil is consistent with the copper foil layer generating speed of the foil generating device; the tension control component is electrically connected to the roller group to control the tension of the roller group on the foil; the electroplating component is used to prepare the dielectric layer on the roughened side of the copper foil layer by electro-deposition.

[0061] Among them, the foil can represent the intermediate material form of the electronic copper foil during the preparation process. The roller group is a part of the integrated electronic copper foil production equipment, which includes a series of rollers for transferring the foil during the production process, ensuring the stability of the foil during the transfer process, and reducing the damage to the foil caused by vibration or impact. The transfer speed of the roller group to the foil is consistent with the copper foil layer generation speed of the foil production device, which can ensure the continuity and consistency of the copper foil layer generation and the dielectric layer generation. The tension control component is a component in the integrated electronic copper foil production equipment for controlling the tension of the roller group on the foil. The tension control component can ensure uniform tension of the foil during the transfer process, prevent the foil from being relaxed or over-tightened during the processing process, which helps to maintain the flatness of the foil and reduce the change of the profile, thereby improving the quality and performance of the foil. The electroplating component is a component in the integrated electronic copper foil production equipment for generating a dielectric layer on the surface of the foil transferred by the roller group by electroplating.

[0062] In some embodiments, the roller group includes an active roller and a tension roller, wherein the active roller can be used to control the transfer speed of the foil; and the tension roller can be used to maintain the tension of the foil during the transfer process. The active roller can ensure that the foil is transferred at a constant speed during the production process by adjusting its rotation speed, which helps to maintain the continuity and efficiency of the production line, and reduce the damage of the foil during the transfer process, thereby ensuring the quality and integrity of the foil. The tension roller can ensure that the foil maintains appropriate tension during the transfer process by adjusting its contact force on the foil. Appropriate tension helps to maintain the flatness of the foil and reduce the change of the profile, thereby improving the quality and performance of the copper foil.

[0063] In some embodiments, the tension control assembly includes a pressure sensor and a drive unit. The pressure sensor can be set on the tension roller to detect the pressure of the foil to obtain pressure data; the drive unit can be used to adjust the rotation speed of the active roller according to the pressure data to dynamically compensate for the tension of the foil during the transmission process.

[0064] Specifically, the pressure sensor can monitor the tension state of the foil in the transmission process in real time. By detecting the pressure data, the tension of the foil can be understood in time to ensure that the tension remains stable during the production process. The drive unit can automatically adjust the rotation speed of the active roller according to the pressure data to dynamically compensate for the tension of the foil during the transmission process. This dynamic compensation mechanism helps to maintain the stability of the foil tension, reduce the damage to the foil caused by tension changes, and ensure the quality and integrity of the foil.

[0065] In some embodiments, the electroplating assembly includes two conductive rollers and an electroplating tank, wherein the two conductive rollers are respectively arranged on both sides of the foil to provide a symmetrical cathode circuit connection distance for the foil, so as to improve the current uniformity and current controllability in different areas during the blackening process of the foil; the electroplating tank includes a dielectric solution, which is used to uniformly deposit the metal ions in the dielectric solution onto the side of the copper foil layer that has been roughened to form a dielectric layer.

[0066] Specifically, the two conductive rollers provide a symmetrical cathode connection distance for the foil, which can ensure that the foil is subjected to uniform current distribution during the electrodeposition process, thereby improving the uniformity and quality of the electrodeposited layer, and also help reduce the uneven distribution of current density on the surface of the foil, thereby reducing possible electrodeposition defects, such as uneven deposition layer, holes, etc. The electrodeposition tank can be used to ensure that metal ions are uniformly deposited on the surface of the copper foil layer during the electrodeposition process to form a uniform dielectric layer with controllable thickness. By precisely controlling parameters such as current density, temperature, pH value, etc. in the electrodeposition tank, electronic copper foil products that meet different application requirements can be produced.

[0067] In some embodiments, the conductive roller includes a temperature sensor and a cooling channel, wherein the temperature sensor is used to monitor the temperature of the conductive roller; the cooling channel includes a coolant and a solenoid valve, the cooling channel is connected to a coolant storage tank, and the solenoid valve controls the opening according to the data of the temperature sensor, thereby adjusting the flow of the coolant.

[0068] Specifically, the temperature sensor is installed on the conductive roller to monitor the real-time temperature of the conductive roller. The cooling fluid inside the cooling channel helps the conductive roller to dissipate heat and maintain a suitable temperature range. The solenoid valve is installed on the pipeline between the cooling channel and the coolant storage tank to automatically adjust the flow of the coolant according to the data of the temperature sensor. During actual operation, the temperature sensor continuously monitors the temperature of the conductive roller and sends the temperature data to the control system. The control system compares the received temperature data with the preset temperature threshold. If the temperature of the conductive roller exceeds the set threshold, the control system triggers the solenoid valve to increase the flow of the coolant, otherwise it reduces the flow of the coolant. Through the above closed-loop control system, it can be ensured that the temperature of the conductive roller is always within the optimal working range, avoiding the problem of unstable electroplating process or reduced copper foil quality due to excessive temperature. In the copper foil production process, if the temperature of the conductive roller is too high, it is easy to cause holes or black spots on the surface of the foil, and copper powder is easy to deposit on the conductive roller. Therefore, by accurately controlling the temperature of the conductive roller and effectively preventing overheating, it can ensure that the current distribution during the electroplating process is more uniform, thereby improving the flatness and consistency of the copper foil surface.

[0069] In some embodiments, the integrated electronic copper foil production equipment also includes a high-temperature anti-oxidation component, which is connected to the conveying roller group and is used to perform anti-oxidation treatment on the copper foil layer transferred by the conveying roller group. Among them, high-temperature anti-oxidation treatment is a treatment method that prevents metal materials from reacting with oxygen in the air during the production process, thereby preventing oxidation and pollution. Through anti-oxidation treatment, the oxidation risk of the foil during transportation can be reduced, and the surface quality and performance of the foil can be ensured. This helps to improve the corrosion resistance of the foil, extend its service life, and maintain the stability of the foil in subsequent processing and application. Exemplarily, the anti-oxidation component can also brush a layer of anti-oxidation coating on the top and bottom of the copper foil layer, or provide anti-oxidation gas protection during transportation, or form an anti-oxidation oil film on the surface of the copper foil layer.

[0070] In some embodiments, the dielectric layer generating device includes an electrodeposited copper grain size processing component, which uses the copper foil layer as a cathode, and forms crystal nuclei on the side of the copper foil layer away from the dielectric layer by adjusting the current density of different regions of the anode, and the generation speed of the crystal nuclei is greater than the growth speed of the crystal nuclei. The electrodeposited copper grain size processing component can achieve precise control of the surface roughness of the copper foil layer, and a large number of fine crystal nuclei can be formed on the surface of the copper foil layer by adjusting the current density of different regions of the anode. Since the generation speed of the crystal nuclei is greater than the growth speed of the crystal nuclei, the roughness of the foil surface can be reduced, thereby obtaining a foil with low profile.

[0071] In some embodiments, the foil production device includes an electrodeposition tank, a titanium cathode roller, and a stripping roller. The electrodeposition tank can be used to place an electrolyte; the titanium cathode roller can be used to deposit copper ions in the electrolysis process of the electrolyte to generate a copper foil layer; and the stripping roller can be used to strip the copper foil layer from the titanium cathode roller. Exemplarily, the electrolyte can be a copper sulfate solution.

[0072] In some embodiments, the integrated electronic copper foil production equipment further includes a passivation treatment device, which is arranged at the rear side of the dielectric layer generating device, and is used to passivate the foil delivered by the dielectric layer generating device. Among them, the passivation treatment can refer to the process of forming a protective oxide film on the metal surface to enhance the corrosion resistance and other surface properties of the metal. Exemplarily, the foil can be chemically passivated using a passivator, which can be chromic acid, phosphate, nitric acid, citric acid, etc., and the foil is immersed in a passivator solution for passivation treatment. The foil can also be electrically passivated by an electrochemical reaction.

[0073] In some embodiments, the integrated electronic copper foil production equipment includes at least one exhaust hood, which can be used to extract and treat the harmful volatiles in the surface treatment and dielectric layer generation process. By controlling the emission of harmful volatiles, the impact on the surface quality of the copper foil can be reduced, thereby improving the quality and performance of the copper foil, and reducing the health impact of harmful volatiles on operators, and protecting the equipment from corrosion and pollution by harmful volatiles, thereby extending the service life of the equipment.

[0074] In some embodiments, the roughening device and the dielectric layer generating device have an operating width greater than 1.4 meters. By setting the operating width of the roughening device and the dielectric layer generating device to be greater than 1.4 meters, a wide electronic copper foil can be obtained, and production efficiency is also improved.

[0075] In some practical examples, the roughening device can be grounded to electrically isolate the foil production device from the roughening device, so that there is no electrical connection between the foil production device and the roughening device, thereby reducing foil surface defects caused by electrical interference, thereby improving product quality. It can also prevent operators from getting electric shocks due to equipment failures, thereby improving production safety.

[0076] The integrated electronic copper foil production equipment disclosed in the present invention, on the one hand, enables the copper foil layer to be quickly surface treated after being generated through the conveying roller group, thereby reducing the time the copper foil layer is exposed to the air, thereby reducing the risk of oxidation, ensuring the stability of the surface crystal state of the electronic copper foil, and making it easier to meet the requirements of extremely low profile. On the other hand, the copper foil layer generation step, the roughening treatment step and the dielectric layer generation step are integrated into one production equipment, which simplifies the production process, reduces the investment of manpower and material resources, and reduces production costs. On the other hand, the copper foil layer does not need to be rolled up and transferred after it is generated, avoiding the risk of foreign matter inclusions in the copper foil.

[0077] Furthermore, by integrating the foil production device, the roughening device, the dielectric layer generation device and the conveying roller group, the continuous production of electronic copper foil is realized, and the production efficiency is significantly improved; the use of the conveying roller group and the tension control component ensures the stability of the foil during the transmission process, reduces wrinkles and stretching, and thus improves the flatness and quality of the copper foil; by arranging two conductive rollers on both sides of the foil, a symmetrical cathode circuit connection distance is provided for the foil, the current uniformity is improved, the uniform deposition of the dielectric layer is achieved, and the consistency of the thickness and conductivity of the copper foil is ensured; the use of the high-temperature anti-oxidation component effectively prevents the oxidation of the copper foil layer in a high temperature environment, and ensures the quality and performance of the copper foil; the electrodeposited copper grain size processing component adjusts the current density to form a uniform crystal nucleus on the surface of the copper foil layer, improves the metallographic structure of the copper foil, and enhances its mechanical properties.

[0078] Figure 2 The schematic diagram of the structure of an integrated electronic copper foil production device in the embodiment of the present disclosure is shown schematically. Specifically, the integrated electronic copper foil production device is mainly used to produce blackened copper foil or buried copper foil, and mainly includes: a foil production device, a roughening device, a dielectric layer generation device, a conveying roller group and a terminal processing device.

[0079] The foil production device may be composed of an electrodeposition tank 11, a titanium cathode roller 12, a copper foil layer 13 and a polisher 14. The polisher may be used to polish the titanium cathode roller to reduce the surface roughness of the titanium cathode roller and make the surface of the copper foil layer more uniform and smooth.

[0080] The roughening device and the medium layer generating device may be composed of a plurality of active rollers, a plurality of tension rollers, a plurality of conductive rollers, a plurality of pressure rollers, a plurality of tension control components, a plurality of processing tanks, a plurality of guide rollers, a drying box 28 and a plurality of exhaust hoods.

[0081] Specifically, the active rollers may include a first active roller 211, a second active roller 212, a third active roller 213, a fourth active roller 214, a fifth active roller 215 and a sixth active roller 216. The active rollers may be used to control the transfer speed of the foil.

[0082] The tension rollers may include a first tension roller 221, a second tension roller 222, a third tension roller 223, a fourth tension roller 224 and a fifth tension roller 225. The tension rollers can ensure that the foil maintains appropriate tension during the transfer process by adjusting their contact force on the foil, and appropriate tension helps to maintain the flatness of the foil and reduce the change of the profile.

[0083] The conductive rollers may include a first conductive roller 2301, a second conductive roller 2302, a third conductive roller 2303, a fourth conductive roller 2304, a fifth conductive roller 2305, a sixth conductive roller 2306, a seventh conductive roller 2307, and an eighth conductive roller 2308. The conductive rollers are arranged on both sides of the foil to supply power to the conductive medium and provide a symmetrical cathode circuit connection distance for the foil to improve the current uniformity and current controllability in different areas during the electroplating process of the foil.

[0084] The pressing rollers may include a first pressing roller 2401, a second pressing roller 2402, a third pressing roller 2403, a fourth pressing roller 2404, a fifth pressing roller 2405, a sixth pressing roller 2406, a seventh pressing roller 2407, an eighth pressing roller 2408, and a ninth pressing roller 2409. The pressing rollers ensure that the foil material maintains a certain degree of compactness and stability during the transfer process by applying uniform pressure, and can also control the uniformity of stretching to prevent the material from being overstretched or torn.

[0085] The tension control assembly may include a first tension control assembly 251, a second tension control assembly 252, a third tension control assembly 253, a fourth tension control assembly 254, and a fifth tension control assembly 255. Each group of tension control assemblies includes a pressure sensor and a drive unit. The pressure sensor may be disposed on a corresponding tension roller to detect the pressure of the foil material to obtain pressure data. The drive unit may be used to adjust the rotation speed of the corresponding active roller according to the pressure data to dynamically compensate for the tension of the foil material during the transmission process.

[0086] The processing tanks may include a first processing tank 2601, a second processing tank 2602, a third processing tank 2603, a fourth processing tank 2604, a fifth processing tank 2605, a sixth processing tank 2606, a seventh processing tank 2607, an eighth processing tank 2608, a ninth processing tank 2609, a tenth processing tank 2610, and an eleventh processing tank 2611.

[0087] In this embodiment, when Figure 2When the integrated electronic copper foil production equipment shown is used to produce blackened copper foil, the first treatment tank 2601 can be used for roughening treatment, and a roughening solution is provided in the first treatment tank 2601, and the roughening solution can be copper sulfate, sodium nitrate, etc. The electrode plate in the first treatment tank is energized to roughen the surface of the copper foil layer passing through the first treatment tank. The second treatment tank 2602 can be used for water washing treatment, for cleaning the roughening solution, or for anti-oxidation treatment of the copper foil layer. The third treatment tank 2603 and the fourth treatment tank 2604 can be used for blackening treatment, and a blackening liquid is provided in the third treatment tank and the fourth treatment tank, and the blackening liquid contains a blackening medium, such as copper oxide, etc. Through electrodeposition, the metal ions in the blackening medium can be uniformly deposited on the side of the copper foil layer that has been roughened to form a blackening layer. The fifth treatment tank 2605 can be used for water washing treatment, for cleaning the blackening medium and metal impurities. The sixth treatment tank 2606 can be used for blackening treatment. The seventh treatment tank 2607 can be used for electro-deposited copper grain size treatment. Specifically, the copper foil layer is used as the cathode. By adjusting the current density in different areas of the anode, a crystal nucleus is formed on the side of the copper foil layer away from the blackened layer, and the generation rate of the crystal nucleus is greater than the growth rate of the crystal nucleus. The eighth treatment tank 2608 can be used for water washing treatment to filter out the blackening liquid or blackening medium. The ninth treatment tank 2609 can be used for passivation treatment to form a protective film to enhance the corrosion resistance and durability of the foil. The tenth treatment tank 2610 can be used for water washing treatment. The eleventh treatment tank 2611 can be used for cutting the foil to cut the foil based on a preset size. Finally, a blackened copper foil consisting of a copper foil layer and a blackened layer is obtained.

[0088] In this embodiment, when Figure 2When the integrated electronic copper foil production equipment shown is used to produce buried copper foil, the first treatment tank 2601 can be used for roughening treatment, and a roughening solution is provided in the first treatment tank 2601, and the roughening solution can be copper sulfate, sodium nitrate, etc. The electrode plate in the first treatment tank is energized to roughen the surface of the copper foil layer passing through the first treatment tank. The second treatment tank 2602 can be used for water washing treatment, for cleaning the roughening solution, or for anti-oxidation treatment of the copper foil layer. The third treatment tank 2603 and the fourth treatment tank 2604 can be used for buried resistance treatment, and buried resistance liquid is provided in the third treatment tank and the fourth treatment tank, and the buried resistance liquid contains buried resistance medium, such as nickel sulfate, sodium phosphite, etc. Through electrodeposition, the metal ions in the buried resistance medium can be uniformly deposited on the side of the copper foil layer after roughening treatment to form a buried resistance layer. The fifth treatment tank 2605 can be used for water washing treatment, for cleaning the buried resistance medium and metal impurities. The sixth treatment tank 2606 can be used for buried resistance treatment. The seventh treatment tank 2607 can be used for electro-deposited copper grain size treatment. Specifically, the copper foil layer is used as the cathode. By adjusting the current density in different areas of the anode, a crystal nucleus is formed on the side of the copper foil layer away from the buried barrier layer, and the generation rate of the crystal nucleus is greater than the growth rate of the crystal nucleus. The eighth treatment tank 2608 can be used for water washing treatment to filter out the buried barrier liquid or buried barrier medium. The ninth treatment tank 2609 can be used for passivation treatment to form a protective film to enhance the corrosion resistance and durability of the foil. The tenth treatment tank 2610 can be used for water washing treatment. The eleventh treatment tank 2611 can be used for cutting the foil to cut the foil based on a preset size. Finally, a buried barrier copper foil consisting of a copper foil layer and a buried barrier layer is obtained.

[0089] The guide rollers may include a first guide roller 271 and a second guide roller 272. The guide rollers may be used to guide the foil to move along a specific path, ensuring that the foil does not deviate from a predetermined track during processing, while helping to maintain the straightness and alignment of the foil during transportation, reducing skew and wrinkles.

[0090] The air drying box 28 can be used to air dry the foil material to eliminate the liquid on its surface.

[0091] The exhaust hood may include a first exhaust hood 291 and a second exhaust hood 292, which are used to extract and discharge harmful volatiles during the surface treatment and the medium layer generation process.

[0092] Figure 3The schematic diagram of the structure of a third treatment tank in the embodiment of the present disclosure is schematically shown. Among them, the third treatment tank 2603 includes a second active roller 212, a first positive plate 2121 and a second positive plate 2122. A dielectric solution is arranged in the third treatment tank. For example, when blackened copper foil is produced, the dielectric solution may include components such as zinc sulfate, sodium citrate, boric acid, zinc sulfate and nickel sulfate; when buried copper foil is produced, the dielectric solution may include components such as nickel sulfate and sodium phosphate. Among them, when the roughened surface of the foil needs to be blackened or buried, the above two plates can be energized at the same time, and the metal ions in the dielectric solution are evenly deposited on the side of the copper foil layer that has been roughened to form a blackened layer or a resistance layer.

[0093] Figure 4 The schematic diagram of the structure of a blackened copper foil in the embodiment of the present disclosure is shown, which specifically includes a copper foil layer 13 and a blackened layer 15. The copper foil layer has a roughened surface 131 on the side close to the blackened layer. The thickness of the blackened copper foil can be 18 μm, 35 μm, 50 μm, 70 μm or other suitable values. When the thickness of the blackened copper foil is 18 μm, the unit area weight of the blackened copper foil can be 149 g / m 2 Up to 157g / m 2 Within the range, the peel strength at room temperature is not less than 5g / cm, and the peel strength at 288 degrees Celsius and 3 times of soldering for 10 seconds is not less than 4.5g / cm; when the thickness of the blackened copper foil is 35μm, the unit area weight of the blackened copper foil can be 277g / m 2 Up to 293g / m 2 Within the range, the peel strength at room temperature is not less than 5g / cm, and the peel strength at 288 degrees Celsius and immersion in solder for 10 seconds 3 times is not less than 4.5g / cm; when the thickness of the blackened copper foil is 50μm, the unit area weight of the blackened copper foil can be 406g / m 2 Up to 424g / m 2 Within the range, the peel strength at room temperature is not less than 6g / cm, and the peel strength at 288 degrees Celsius and immersion in solder for 10 seconds 3 times is not less than 5.5g / cm; when the thickness of the blackened copper foil is 70μm, the unit area weight of the blackened copper foil can be 600g / m 2 Up to 620g / m 2The peel strength at room temperature is not less than 6g / cm, and the peel strength at 288 degrees Celsius and 10 seconds 3 times of solder immersion is not less than 5.5g / cm; of course, in other embodiments of the present disclosure, the unit area weight of the blackened copper foil can also be other suitable values. Exemplarily, the roughness of the blackened copper foil is less than 2μm, and the elongation at room temperature and 180 degrees Celsius is not less than 16%. The blackened copper foil has the characteristics of low roughness, high peel strength, high bending resistance and good etching performance, and is suitable for other suitable application scenarios such as flexible printed circuit boards and high-density interconnect technology boards. Figure 5 The schematic diagram of the structure of a buried copper foil in an embodiment of the present disclosure is schematically shown, which specifically includes a copper foil layer 13 and a resistor layer 16, and a side of the copper foil layer close to the resistor layer has a roughened surface 131.

[0094] The present disclosure also provides a method for preparing an integrated electronic copper foil. Figure 6 As shown, the electronic copper foil includes a blackened copper foil and a buried barrier copper foil. The integrated electronic copper foil preparation method specifically includes the following steps:

[0095] Step S610, performing surface treatment on the raw foil surface of the foil production device to obtain the raw foil surface with preset copper foil metallographic structure parameters.

[0096] Step S620: preparing a copper foil layer based on the foil surface of the foil producing device.

[0097] Step S630: After the copper foil layer is generated, the surface of the copper foil layer is subjected to an anti-oxidation treatment within a preset time.

[0098] Step S640, roughening the predetermined surface of the copper foil layer after the surface anti-oxidation treatment.

[0099] Step S650, performing an electroplating treatment on the roughened foil material to prepare a dielectric layer on the roughened side of the copper foil layer to obtain an electronic copper foil.

[0100] Among them, the raw foil surface can represent the surface of the cathode roller in the raw foil device, which can be made of titanium material and is used to provide an attachment surface for metal ions on the cathode by electrolysis or other chemical deposition methods. The preset parameters can be preset roughness, cleanliness, crystallinity, etc. The copper foil metallographic structure parameters can represent a series of parameters describing the internal microstructure and organizational characteristics of the copper foil, such as grain shape and size, dislocation density, porosity, etc. By obtaining the raw foil surface with preset copper foil metallographic structure parameters, the generated copper foil layer can meet the performance requirements thereof. In addition, after the electronic copper foil is generated, the electronic copper foil can also be rolled up.

[0101] Exemplarily, the surface treatment of the raw foil surface of the raw foil device can be performed by using deionized water, diluted acid or alkaline solution to clean the surface of the cathode roller to remove grease, dust and other pollutants. The surface of the cathode roller can also be ground and polished using abrasives (such as sandpaper, polishing paste), polishing machines, etc. to obtain a preset roughness.

[0102] In some embodiments, the production speed of the foil production device is between 0.6 meters per minute and 5 meters per minute. By controlling the production speed of the foil production device, the processing effect in the subsequent dielectric layer generation and roughening, washing and passivation processes can be guaranteed, and the quality of the foil can be improved.

[0103] In some embodiments, when the electronic copper foil is a blackened copper foil, the dielectric layer is an alloy plating layer. Exemplarily, the alloy plating layer may be composed of three elements: sulfur, zinc, and nickel.

[0104] In some embodiments, when the electronic copper foil is a buried copper foil, the dielectric layer is a nickel-phosphorus alloy.

[0105] It should be understood that the present disclosure does not limit its application to the detailed structure and arrangement of the components proposed in the present disclosure. The present disclosure can have other embodiments and can be implemented and executed in a variety of ways. The aforementioned variations and modifications fall within the scope of the present disclosure. It should be understood that the present disclosure and the limited present disclosure extend to all alternative combinations of two or more individual features mentioned or evident in the text and / or the drawings. All of these different combinations constitute multiple alternative aspects of the present disclosure. The embodiments described in the present disclosure illustrate the best modes known for implementing the present disclosure and will enable those skilled in the art to utilize the present disclosure.

Claims

1. An integrated electronic copper foil production device, the electronic copper foil comprising a blackened copper foil and a buried barrier copper foil, characterized in that: The integrated electronic copper foil production equipment comprises: A foil production device, used for producing a copper foil layer; A roughening device, used for roughening a preset surface of the copper foil layer; A dielectric layer generating device, arranged at the rear side of the roughening device, for preparing a dielectric layer on the side of the copper foil layer that has been roughened; A conveying roller group, connected between the foil production device and the roughening device, for transferring the copper foil layer to the roughening device within a predetermined time; Wherein, when the electronic copper foil is a blackened copper foil, the dielectric layer is a blackened layer; when the electronic copper foil is a buried barrier copper foil, the dielectric layer is a resistance layer.

2. The integrated electronic copper foil production equipment according to claim 1, characterized in that: The conveying roller group includes a connecting roller, and the connecting roller is a feeding roller of the roughening device; or The connecting roller is a stripping roller of the foil production device.

3. The integrated electronic copper foil production equipment according to claim 1, characterized in that: The dielectric layer generating device comprises: A roller group, used for conveying the foil delivered by the roughening device, and the conveying speed of the foil by the roller group is consistent with the generating speed of the copper foil layer by the foil producing device; A tension control component, electrically connected to the roller group, and used to control the tension of the roller group on the foil; The electroplating assembly is used for preparing a dielectric layer on the side of the copper foil layer that has been roughened by electro-deposition.

4. The integrated electronic copper foil production equipment according to claim 3, characterized in that: The roller set comprises: An active roller, used for controlling the transfer speed of the foil; The tension roller is used to maintain the tension of the foil during the transfer process.

5. The integrated electronic copper foil production equipment according to claim 4, characterized in that: The tension control assembly comprises: A pressure sensor is arranged on the tension roller and is used to detect the pressure of the foil to obtain pressure data; The driving unit is used to adjust the rotation speed of the active roller according to the pressure data so as to dynamically compensate for the tension of the foil during the transmission process.

6. The integrated electronic copper foil production equipment according to claim 4, characterized in that: The electroplating assembly comprises: Two conductive rollers are respectively arranged on both sides of the foil to provide a symmetrical cathode circuit connection distance for the foil, so as to improve the current uniformity and current controllability of different areas during the blackening process of the foil; The electrodeposition tank includes a dielectric solution and is used to uniformly deposit the metal ions in the blackening solution onto the side of the copper foil layer that has undergone the roughening treatment to form a dielectric layer.

7. The integrated electronic copper foil production equipment according to claim 1, characterized in that: Also includes: The high temperature anti-oxidation component is connected to the conveying roller group and is used for performing anti-oxidation treatment on the copper foil layer transferred by the conveying roller group.

8. The integrated electronic copper foil production equipment according to claim 1, characterized in that: The dielectric layer generating device comprises: The electrodeposited copper grain size processing component uses the copper foil layer as a cathode and adjusts the current density in different areas of the anode to form crystal nuclei on the side of the copper foil layer away from the dielectric layer, and the generation speed of the crystal nuclei is greater than the growth speed of the crystal nuclei.

9. The integrated electronic copper foil production equipment according to claim 1, characterized in that: Also includes: The passivation treatment device is arranged at the rear side of the dielectric layer generating device and is used for performing passivation treatment on the foil material transferred from the dielectric layer generating device.

10. A method for preparing an integrated electronic copper foil, the electronic copper foil comprising a blackened copper foil and a buried barrier copper foil, characterized in that: The integrated electronic copper foil preparation method comprises: Performing surface treatment on the raw foil surface of the raw foil device to obtain the raw foil surface with preset copper foil metallographic structure parameters; preparing a copper foil layer based on the raw foil surface of the foil producing device; After the copper foil layer is generated, performing surface anti-oxidation treatment on the copper foil layer within a preset time; Roughening the preset surface of the copper foil layer after the surface anti-oxidation treatment; Performing an electroplating treatment on the roughened foil material to prepare a dielectric layer on the side of the copper foil layer that has undergone the roughening treatment, thereby obtaining an electronic copper foil; Wherein, when the electronic copper foil is a blackened copper foil, the dielectric layer is a blackened layer; when the electronic copper foil is a buried barrier copper foil, the dielectric layer is a resistance layer.

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