Temperature sensor

Abstract

The temperature sensor includes: a temperature sensing element; and a housing that houses the temperature sensing element, and that includes a first region and a second region different from the first region on an outer surface. The case includes: a case portion including a surface including a first region and having a first thermal conductivity, and made of a resin; and a housing portion including a substrate including a surface including a second region and having a second thermal conductivity greater than the first thermal conductivity, and a back surface opposite the surface. The temperature sensing element is mounted on the back surface of the substrate.

Description

Technical Field

[0001] The invention relates to a temperature sensor. Background Art

[0002] A known temperature sensor includes a temperature sensing element, a housing that accommodates the temperature sensing element and is made of metal, and a filler that is filled in the housing and is made of resin (for example, refer to Japanese Patent No. 6371002). Summary of the invention

[0003] When detecting the temperature of an object, in the above-mentioned temperature sensor, the housing is in contact with the object. The heat conduction path from the object to the temperature sensing element includes the housing and the filling material. Generally, resin has a lower thermal conductivity than metal. Therefore, the above-mentioned temperature sensor has room for improvement in terms of thermal responsiveness.

[0004] An object of one embodiment of the present invention is to provide a temperature sensor capable of improving thermal responsiveness.

[0005] A temperature sensor according to one embodiment comprises: at least one temperature sensing element; and a housing that accommodates the at least one temperature sensing element and includes a first region and a second region different from the first region on an outer surface. The housing includes a first housing portion and a second housing portion. The first housing portion includes a surface that includes the first region and has a first thermal conductivity and is made of resin. The second housing portion includes a substrate that includes a surface that includes the second region and has a second thermal conductivity greater than the first thermal conductivity, and a back surface opposite to the surface. At least one temperature sensing element is mounted on the back surface of the substrate.

[0006] In one of the above-mentioned embodiments, the substrate included in the second shell portion includes a surface including a second area of ​​the outer surface of the shell and a back surface opposite to the surface. At least one temperature sensing element is mounted on the back surface of the substrate. The heat transfer path from the surface of the substrate to the at least one temperature sensing element includes the substrate, but it is difficult to include the first shell portion made of resin. The surface of the substrate has a second thermal conductivity greater than the first thermal conductivity of the surface of the first area including the outer surface. In one of the above-mentioned embodiments, when the temperature of the object is detected, the heat of the object is easily transferred to the at least one temperature sensing element by making the surface of the substrate contact with the object without making the first shell portion. Therefore, one of the above-mentioned embodiments can improve thermal responsiveness.

[0007] In order to improve the accuracy of temperature detection by the temperature sensor, it is necessary to maintain the state in which the object and the temperature sensor are in contact with each other. Therefore, when the temperature sensor is brought into contact with the object, a holder is sometimes used to hold the temperature sensor on the object. The holder is in contact with the object and the housing. The structure in which the housing can be deformed according to the shape of the portion of the holder that is in contact with the temperature sensor tends to reliably maintain the state in which the object and the housing are in contact with each other.

[0008] In one of the above methods, the first shell part is made of resin. For example, when the retainer abuts against the first shell part, the first shell part can be deformed according to the shape of the portion of the retainer that abuts against the first shell part. Therefore, the above method can reliably maintain the state in which the object and the first shell part abut against each other. The above method can improve the accuracy of temperature detection.

[0009] In the above-described aspect, an engaging portion that engages with a holder that holds the temperature sensor may be formed on the first housing portion.

[0010] The structure in which the engaging portion is formed on the first housing portion can further reliably maintain the state in which the object and the first housing portion abut against each other. Therefore, this structure can further improve the accuracy of temperature detection.

[0011] In one of the above embodiments, the substrate may include a side surface connecting the front surface and the back surface. The first housing portion may include a plurality of wall portions that are opposite to the side surface and separated from each other along the side surface. A portion of the side surface may be exposed between adjacent wall portions among the plurality of wall portions.

[0012] The structure in which the first shell portion includes the above-mentioned multiple wall portions improves the connection strength between the first shell portion and the second shell portion. Therefore, the first shell portion and the second shell portion are difficult to be separated from each other. The structure in which a part of the side surface is exposed between mutually adjacent wall portions among the multiple wall portions can improve the heat collection property in the substrate. Therefore, this structure can further improve the thermal responsiveness.

[0013] In the above-described aspect, the substrate may include a metal plate including a first main surface including a surface and a second main surface opposite to the first main surface.

[0014] The structure in which the substrate includes the above-mentioned metal plate can simply and reliably realize a surface having a second thermal conductivity greater than the first thermal conductivity.

[0015] In the above embodiment, the substrate may include an insulating layer disposed on the second main surface of the metal plate. At least one temperature sensing element may be disposed on the insulating layer.

[0016] The structure in which at least one temperature sensing element is disposed on the insulating layer reliably maintains electrical insulation between the at least one temperature sensing element and the metal plate.

[0017] In the above embodiment, the substrate may include a conductive layer disposed on the insulating layer. At least one temperature sensing element may be mounted on the conductive layer.

[0018] The structure in which at least one temperature sensing element is mounted on the conductor layer can easily and reliably realize the structure in which at least one temperature sensing element is electrically mounted on the substrate even in a structure in which the insulating layer is disposed on the metal plate.

[0019] The above-mentioned one embodiment may also include a conductive wire, wherein the conductive wire includes a first end located in the housing and electrically connected to the at least one temperature sensing element, and a second end exposed from the housing.

[0020] The structure including the above-mentioned wires can simply and reliably realize the structure of leading the signal line electrically connected to at least one temperature sensing element to the outside of the housing including the first housing part and the second housing part.

[0021] In the above embodiment, the at least one temperature sensing element may include a plurality of temperature sensing elements. The plurality of temperature sensing elements may be mounted on the back side of the substrate.

[0022] The present invention will become more fully understood from the following detailed description and the accompanying drawings which are presented by way of illustration only and therefore should not be considered as limiting the present invention.

[0023] According to the detailed description shown below, the further applicable scope of the present invention will become apparent. However, it should be understood that, because various changes and modifications within the scope of the present invention will become apparent to those skilled in the art through the detailed description, while indicating embodiments of the present invention, the detailed description and specific examples are shown only by way of illustration. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a perspective view showing a temperature sensor according to one embodiment.

[0025] Figure 2 It is a perspective view showing the temperature sensor according to the present embodiment.

[0026] Figure 3 It is a perspective view showing the structure of a substrate and a temperature sensing element.

[0027] Figure 4 It is a diagram showing a cross-sectional structure of the temperature sensor according to the present embodiment.

[0028] Figure 5 It is a diagram showing a cross-sectional structure of the temperature sensor according to the present embodiment.

[0029] Figure 6 It is a perspective view showing the structure of the temperature sensor, the holder, and the object according to the present embodiment.

[0030] Figure 7 It is a plan view showing the structure of the temperature sensor and the holder according to the present embodiment.

[0031] Figure 8 It is a perspective view showing a temperature sensor according to a modified example of the present embodiment.

[0032] Fig. 9 It is a plan view showing the structure of a temperature sensor and a holder according to a modification of the present embodiment.

[0033] Fig.10 It is a top view showing the structure of a substrate and a temperature sensing element.

[0034] Fig.11 It is a top view showing the structure of a substrate and a temperature sensing element.

[0035] Fig.12 It is a top view showing the structure of a substrate and a temperature sensing element. DETAILED DESCRIPTION

[0036] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same elements or elements having the same functions are represented by the same symbols, and repeated descriptions are omitted.

[0037] Reference Figure 1 to Figure 5 The structure of the temperature sensor 1 according to the present embodiment will be described. Figure 1 and Figure 2 It is a perspective view showing the temperature sensor according to the present embodiment. Figure 3 It is a perspective view showing the structure of a substrate and a temperature sensing element. Figure 4 and Figure 5 is a diagram showing a cross-sectional structure of a temperature sensor according to this embodiment. Figure 1 to Figure 3 As shown, the temperature sensor 1 includes a housing 2 , a temperature sensing element 3 , and a lead wire 4 .

[0038] The housing 2 accommodates the temperature sensing element 3. When the temperature sensor 1 detects the temperature of an object, the housing 2 faces the object. When the temperature sensor 1 detects the temperature of an object, the housing 2 may abut against the object. When the temperature of an object is detected, when a holder for holding the temperature sensor 1 on the object is used, the housing 2 abuts against the holder. The housing 2 is in the shape of a rectangular parallelepiped. The rectangular parallelepiped shape includes, for example, a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

[0039] The housing 2 includes a pair of side surfaces 2a, 2b, a pair of side surfaces 2c, and a pair of end surfaces 2d. The pair of side surfaces 2a, 2b are opposite to each other in a first direction D1. The pair of side surfaces 2c are opposite to each other in a second direction D2. The pair of end surfaces 2d are opposite to each other in a third direction D3. In the present embodiment, the first direction D1, the second direction D2, and the third direction D3 are orthogonal to each other. In the housing 2, any one of the pair of side surfaces 2a, 2b and the pair of side surfaces 2c is opposite to an object, and the other side surfaces different from the side surfaces are in contact with a retaining member. In the present embodiment, the side surface 2b is opposite to the object, and the side surface 2a is in contact with the retaining member. An opening is formed on one end surface 2d of the pair of end surfaces 2d, and a wire 4 is inserted into the opening.

[0040] The outer surface of the housing 2 includes a pair of side surfaces 2a, 2b, a pair of side surfaces 2c, and a pair of end surfaces 2d. The outer surface of the housing 2 is divided into a region R1 and a region R2 different from the region R1. That is, the housing 2 includes an outer surface including the region R1 and the region R2. In the present embodiment, the side surface 2a, the pair of side surfaces 2c, and the pair of end surfaces 2d constitute the region R1, and the side surface 2b constitutes the region R2.

[0041] In the temperature sensor 1, the housing 2 is composed of the housing portion 21 and the housing portion 22. That is, the housing 2 includes the housing portion 21 and the housing portion 22. In the present embodiment, the housing portion 21 and the housing portion 22 are formed integrally.

[0042] The housing portion 21 includes a surface 21a, a pair of side surfaces 21b facing each other, and a pair of end surfaces 21c facing each other. The surface 21a is perpendicular to the first direction D1. The pair of side surfaces 21b face each other in the second direction D2. The pair of end surfaces 21c face each other in the third direction D3.

[0043] The surface 21a has a pair of long sides and a pair of short sides. The surface 21a is in a rectangular shape having a pair of long sides and a pair of short sides. That is, when viewed from above, the housing portion 21 is in a rectangular shape having a pair of long sides and a pair of short sides. The rectangular shape includes, for example, a shape in which each corner is chamfered and a shape in which each corner is rounded. In this embodiment, the long side direction of the surface 21a is the third direction D3, and the short side direction of the surface 21a is the second direction D2.

[0044] The surface 21a may also have four sides, and the four sides have the same length. That is, the surface 21a may also be square. When viewed from above, the housing portion 21 is square. The surface 21a may also be circular. When viewed from above, the housing portion 21 may also be circular. The circular shape includes, for example, a perfect circle, an oblong shape, and an ellipse.

[0045] The pair of side surfaces 21b extend from the corresponding long sides of the pair of long sides of the surface 21a along the first direction D1. The pair of side surfaces 21b also extend along the third direction D3. The pair of end surfaces 21c extend from the corresponding short sides of the pair of short sides of the surface 21a along the first direction D1. The pair of end surfaces 21c also extend along the second direction D2.

[0046] The housing portion 21 further includes a plurality of wall portions W1 and a plurality of wall portions W2. The plurality of wall portions W1 are disposed on a pair of side surfaces 21b. The plurality of wall portions W1 are disposed, for example, at one end of the side surface 21b opposite to the surface 21a in the first direction D1 and approximately at the center in the third direction D3. In the present embodiment, two wall portions W1 are disposed on a pair of side surfaces 21b, respectively. Each wall portion W1 extends along the first direction D1. The two wall portions W1 are separated from each other in the third direction D3.

[0047] A plurality of wall portions W2 are provided on a pair of end surfaces 21c. For example, the plurality of wall portions W2 are provided at one end of the end surface 21c on the opposite side of the surface 21a in the first direction D1 and approximately at the center in the second direction D2. In the present embodiment, two wall portions W2 are provided on one end surface 21c of the pair of end surfaces 21c. Each wall portion W2 extends along the first direction D1. The two wall portions W2 are separated from each other in the second direction D2.

[0048] The surface of the housing portion 21 includes a surface 21a, a pair of side surfaces 21b, and a pair of end surfaces 21c. The surface of the housing portion 21 constitutes a portion of the outer surface of the housing 2. In the present embodiment, the surface 21a constitutes the side surface 2a of the housing 2, the pair of side surfaces 21b constitutes the pair of side surfaces 2c of the housing 2, and the pair of end surfaces 21c constitutes the pair of end surfaces 2d of the housing 2. That is, in the present embodiment, the surface 21a, the pair of side surfaces 21b, and the pair of end surfaces 21c of the housing portion 21 constitute a region R1 included in the outer surface of the housing 2. Therefore, in the present embodiment, the surface 21a, the pair of side surfaces 21b, and the pair of end surfaces 21c include the region R1.

[0049] The shell part 21 is made of resin. The resin includes, for example, polypropylene resin or polyphenylene sulfide resin. The thermal conductivity of the resin is, for example, 0.3 W / (m·K) or more and 1 W / (m·K) or less. In the present embodiment, the shell part 21 is made of polypropylene resin. The thermal conductivity of polypropylene resin is, for example, 0.5 W / (m·K). The surface of the shell part 21, that is, the surface 21a, the pair of side surfaces 21b, and the pair of end surfaces 21c each have a thermal conductivity of, for example, 0.3 W / (m·K) or more and 1 W / (m·K) or less. The thermal conductivity of the surface of the shell part 21 made of polypropylene resin is, for example, 0.5 W / (m·K).

[0050] The housing portion 22 includes a substrate 23. Figure 3 and Figure 4 As shown, the substrate 23 includes a surface 23a, a back surface 23b, a side surface 23c, and a side surface 23d. In this embodiment, the substrate 23 includes a pair of side surfaces 23c and a pair of side surfaces 23d.

[0051] The surface 23a and the back surface 23b have a pair of long sides and a pair of short sides. The surface 23a and the back surface 23b are rectangular in shape with a pair of long sides and a pair of short sides. That is, when viewed from above, the housing portion 22 is rectangular in shape with a pair of long sides and a pair of short sides. In this embodiment, the long side direction of the surface 23a and the back surface 23b is the third direction D3, and the short side direction of the surface 23a and the back surface 23b is the second direction D2.

[0052] The surface 23a and the back surface 23b may also have four sides, and the four sides have the same length. That is, the surface 23a and the back surface 23b may also be square. When viewed from above, the housing portion 22 may also be square. The surface 23a and the back surface 23b may also be circular. When viewed from above, the housing portion 22 may also be circular. The circular shape includes, for example, a perfect circle, an oblong shape, and an elliptical shape.

[0053] The back surface 23b is opposite to the front surface 23a. In the present embodiment, the back surface 23b is opposite to the front surface 23a in the first direction D1. The back surface 23b is covered by the housing portion 21. In the present embodiment, the back surface 23b is connected to the housing portion 21, and the entire back surface 23b is covered by the housing portion 21.

[0054] The side surface 23c extends along the first direction D1 in a manner connecting the surface 23a and the back surface 23b. The side surface 23c connects the surface 23a and the back surface 23b. The side surface 23c also extends along the third direction D3. The side surface 23c is covered by the shell portion 21. In the present embodiment, the side surface 23c includes a portion covered by the shell portion 21 and a portion not covered by the shell portion 21. The portion of the side surface 23c that is not covered by the shell portion 21 is exposed between the adjacent wall portions W1. That is, in the present embodiment, a portion of the side surface 23c is exposed between the adjacent wall portions W1. As described above, the side surface 23c also extends along the third direction D3. Therefore, it can be said that the plurality of wall portions W1 separated from each other in the third direction D3 are opposite to the side surface 23c and are separated from each other along the side surface 23c.

[0055] The side surface 23d extends along the first direction D1 in a manner that connects the surface 23a and the back surface 23b. The side surface 23d also connects the surface 23a and the back surface 23b. The side surface 23d also extends along the second direction D2. The side surface 23d is also covered by the shell portion 21. The side surface 23d may not be covered by the shell portion 21. In the present embodiment, one side surface 23d of a pair of side surfaces 23d is covered by the shell portion 21. The above-mentioned one side surface 23d includes a portion covered by the shell portion 21 and a portion not covered by the shell portion 21. The portion of the above-mentioned one side surface 23d that is not covered by the shell portion 21 is exposed between the mutually adjacent wall portions W2. That is, in the present embodiment, a portion of the above-mentioned one side surface 23d is exposed between the mutually adjacent wall portions W2. As described above, the side surface 23d also extends along the second direction D2. Therefore, it can be said that a plurality of wall portions W2 separated from each other in the second direction D2 are opposite to the side surface 23d and separated from each other along the side surface 23d.

[0056] In this embodiment, the other side 23d of the pair of side surfaces 23d is not covered by the case portion 21. The entirety of the other side surface 23d is exposed from the case portion 21. The other side surface 23d may also be covered by the case portion 21, similarly to the one side surface 23d.

[0057] The surface of the shell portion 22 includes a surface 23a and a side surface 23d of a pair of side surfaces 23d that is not covered by the shell portion 21. The surface of the shell portion 22 is the same as the surface of the shell portion 21, and constitutes a part of the outer surface of the shell 2. In the present embodiment, the surface 23a constitutes the side surface 2b of the shell 2, and the other side surface 23d constitutes the corresponding end surface 2d of the pair of end surfaces 2d of the shell 2 together with the end surface 21c. That is, in the present embodiment, the surface 23a constitutes a region R2 included in the outer surface of the shell 2, and the side surface 23d that is not covered by the shell portion 21, together with the surface 21a, the pair of side surfaces 21b, and the pair of end surfaces 21c, constitutes a region R1 included in the outer surface of the shell 2. Therefore, in the present embodiment, the surface 23a includes the region R2, and the other side surface 23d includes the region R1 together with the surface 21a, the pair of side surfaces 21b, and the pair of end surfaces 21c.

[0058] For example, in the case where the housing portion 21 includes a first housing portion, the housing portion 22 includes a second housing portion.

[0059] In the present embodiment, the substrate 23 further includes a metal plate 24, an insulating layer 25, conductor layers 26, 27, and an insulating layer 28. The metal plate 24 includes a main surface 24a, a main surface 24b, a pair of side surfaces 24c, and a pair of side surfaces 24d. In the present embodiment, the main surface 24a constitutes the surface 23a. That is, in the present embodiment, the main surface 24a includes the surface 23a of the substrate 23. As described above, the surface 23a constitutes the region R2 and the side surface 2b, so in the present embodiment, it can be said that the main surface 24a constitutes the region R2 and the side surface 2b. In the present embodiment, it can also be said that the main surface 24a includes the region R2. As described above, in the present embodiment, when the temperature sensor 1 detects the temperature of the object, the side surface 2b is opposite to the object. Therefore, in the present embodiment, when the temperature sensor 1 detects the temperature of the object, the surface 23a is opposite to the object. When the temperature sensor 1 detects the temperature of the object, the surface 23a may also abut against the object.

[0060] The main surface 24b is opposite to the main surface 24a. In the present embodiment, the main surface 24b is opposite to the main surface 24a in the first direction D1. The main surface 24b is covered by the casing portion 21. For example, when the main surface 24a includes the first main surface, the main surface 24b includes the second main surface.

[0061] Each main surface 24a, 24b has a pair of long sides and a pair of short sides. Each main surface 24a, 24b is in a rectangular shape having a pair of long sides and a pair of short sides. That is, when viewed from above, the metal plate 24 is in a rectangular shape. In this embodiment, the long side direction of each main surface 24a, 24b is the third direction D3, and the short side direction of each main surface 24a, 24b is the second direction D2.

[0062] Each main surface 24a, 24b may also have four sides, and the four sides have the same length. That is, each main surface 24a, 24b may also be square. When viewed from above, the metal plate 24 may also be square. Alternatively, each main surface 24a, 24b may also be circular. When viewed from above, the metal plate 24 may also be circular.

[0063] A pair of side surfaces 24c extend along the first direction D1 in a manner connecting the main surface 24a and the main surface 24b. Each side surface 24c also extends along the third direction D3. In the present embodiment, a pair of side surfaces 24c constitute a pair of side surfaces 23c. That is, in the present embodiment, a pair of side surfaces 24c includes a pair of side surfaces 23c of the substrate 23. In the present embodiment, a portion of the side surfaces 24c is exposed between the adjacent wall portions W1.

[0064] A pair of side surfaces 24d extend along the first direction D1 in a manner connecting the main surface 24a and the main surface 24b. Each side surface 24d also extends along the second direction D2. In the present embodiment, a pair of side surfaces 24d constitute a pair of side surfaces 23d. That is, in the present embodiment, a pair of side surfaces 24d includes a pair of side surfaces 23d of the substrate 23. As described above, the side surfaces 23d not covered by the shell portion 21 in the pair of side surfaces 23d constitute the region R1 and the end surface 2d. Therefore, in the present embodiment, it can be said that the side surfaces 24d constituting the side surfaces 23d not covered by the shell portion 21 in the pair of side surfaces 24d constitute the region R2 and the end surface 2d. In the present embodiment, it can also be said that the corresponding side surfaces 24d in the pair of side surfaces 24d include the region R1. In the present embodiment, a portion of the side surfaces 24d is exposed between the mutually adjacent wall portions W2.

[0065] In the present embodiment, the metal plate 24 is made of aluminum. Aluminum has a thermal conductivity of, for example, 239 W / (m·K). The main surface 24a of the metal plate 24 made of aluminum has a thermal conductivity of, for example, 239 W / (m·K). As described above, the main surface 24a includes the surface 23a of the substrate 23. Therefore, the surface 23a has a thermal conductivity of, for example, 239 W / (m·K). The thermal conductivity of the surface 23a is higher than the thermal conductivity of the surface of the housing portion 21.

[0066] For example, in the case where the surface of the case portion 21 has a thermal conductivity of a first thermal conductivity, the surface 23 a has a thermal conductivity of a second thermal conductivity.

[0067] In the present embodiment, the thickness of the shell portion 21 is greater than the thickness of the metal plate 24. The thickness of the shell portion 21 is, for example, more than twice the thickness of the metal plate 24. The thickness of the shell portion 21 is, for example, specified by the length from the back surface 23b to the surface 21a in the first direction D1. The thickness of the shell portion 21 is, for example, more than twice and less than ten times the thickness of the metal plate 24. In the present embodiment, the thickness of the shell portion 21 is 3.8 times the thickness of the metal plate 24. The thickness of the metal plate 24 is, for example, more than 0.5 mm and less than 2.0 mm. In the present embodiment, the thickness of the metal plate 24 is 1.0 mm.

[0068] like Figure 4 and Figure 5As shown, the insulating layer 25 is arranged on the main surface 24b. The insulating layer 25 is in contact with the main surface 24b. The insulating layer 25 covers the entire main surface 24b. The main surface 24a, a pair of side surfaces 24c, and a pair of side surfaces 24d of the metal plate 24 are exposed from the insulating layer 25. The insulating layer 25 is, for example, composed of an organic insulating material or an inorganic insulating material. The insulating layer 25 is, for example, composed of an epoxy resin. The insulating layer 25 can also be composed of, for example, an acrylic resin or a polyimide resin. The thickness of the insulating layer 25 is less than the thickness of the metal plate 24. The thickness of the insulating layer 25 is, for example, not less than 50μm and not more than 200μm. In the present embodiment, the thickness of the insulating layer 25 is 100μm.

[0069] The conductor layers 26 and 27 are arranged on the insulating layer 25. The conductor layers 26 and 27 are in contact with the insulating layer 25. The insulating layer 25 electrically insulates the metal plate 24 from the conductor layers 26 and 27. The conductor layer 26 is separated from the conductor layer 27. In the present embodiment, the conductor layer 26 and the conductor layer 27 are separated in the second direction D2. The thickness of the conductor layers 26 and 27 is, for example, not less than 10 μm and not more than 100 μm. In the present embodiment, the thickness of the conductor layers 26 and 27 is 35 μm. The shape of the conductor layer 26 and the shape of the conductor layer 27 are substantially the same when viewed from above the substrate 23.

[0070] In the present embodiment, the conductor layers 26 and 27 are made of copper. The thermal conductivity of copper is, for example, 393 W / (m·K). The thermal conductivity of the conductor layers 26 and 27 made of copper is, for example, 393 W / (m·K). In the present embodiment, the thermal conductivity of the conductor layers 26 and 27 is greater than the thermal conductivity of the surface 23a.

[0071] like Figure 3 As shown, the conductor layer 26 includes a pair of pads 26a, 26b and a connecting line 26c. In the present embodiment, the conductor layer 26 only includes a pair of pads 26a, 26b and a connecting line 26c. The pair of pads 26a, 26b are separated in the third direction D3. The connecting line 26c connects the pad 26a and the pad 26b. The connecting line 26c is located between the pad 26a and the pad 26b in the third direction D3. The pad 26a and the pad 26b are electrically connected by the connecting line 26c. The pair of pads 26a, 26b and the connecting line 26c are formed integrally.

[0072] Each pad 26a, 26b is rectangular. Each pad 26a, 26b has a pair of sides facing each other and a pair of sides facing each other. In the present embodiment, the pad 26a is square, and the pad 26b is rectangular. The long side direction of the pad 26b is the third direction D3, and the short side direction of the pad 26b is the second direction D2. The pad 26a may also be rectangular, and the pad 26b may also be square.

[0073] The connection line 26c extends linearly between the pad 26a and the pad 26b. In the present embodiment, in the connection line 26c, two portions extending obliquely relative to the second direction D2 and the third direction D3 and a portion extending along the third direction D3 are alternately positioned. The two portions oblique relative to the second direction D2 and the third direction D3 are directly connected to the corresponding pads 26a and 26b.

[0074] The conductor layer 27 includes a pair of pads 27a, 27b and a connecting wire 27c. In the present embodiment, the conductor layer 27 includes only a pair of pads 27a, 27b and a connecting wire 27c. The pair of pads 27a, 27b are separated in the third direction D3. The connecting wire 27c connects the pad 27a and the pad 27b. The connecting wire 27c is located between the pad 27a and the pad 27b in the third direction D3. The pad 27a and the pad 27b are electrically connected by the connecting wire 27c. The pair of pads 27a, 27b and the connecting wire 27c are formed integrally.

[0075] Each pad 27a, 27b is rectangular. Each pad 27a, 27b has a pair of sides facing each other and a pair of sides facing each other. In the present embodiment, the pad 27a is square, and the pad 27b is rectangular. The long side direction of the pad 27b is the third direction D3, and the short side direction of the pad 27b is the second direction D2. The pad 27a may also be rectangular, and the pad 27b may also be square.

[0076] The connection line 27c extends linearly between the pad 27a and the pad 27b. In the present embodiment, the two portions extending obliquely relative to the second direction D2 and the third direction D3 and the portion extending along the third direction D3 are alternately positioned in the connection line 27c. The two portions oblique relative to the second direction D2 and the third direction D3 are directly connected to the corresponding pads 27a and 27b.

[0077] The insulating layer 28 is arranged on the insulating layer 25 and on the connecting wires 26c and 27c. The insulating layer 28 is in contact with the insulating layer 25 and the connecting wires 26c and 27c. The insulating layer 28 covers the region of the insulating layer 25 exposed from the conductor layer 26 and the conductor layer 27 and the connecting wires 26c and 27c. The insulating layer 28 has openings formed at positions corresponding to the respective pads 26a, 26b, 27a, and 27b. That is, the insulating layer 28 has four openings formed. The respective pads 26a, 26b, 27a, and 27b are exposed from the insulating layer 28. In the present embodiment, the conductor layers 26 and 27, the respective pads 26a, 26b, 27a, and 27b, and the insulating layer 28 constitute the back surface 23b of the substrate 23. That is, in the present embodiment, the conductor layers 26 and 27 and the insulating layer 28 include the back surface 23b.

[0078] The insulating layer 28 is made of an organic insulating material or an inorganic insulating material. The insulating layer 28 is made of, for example, a resist material. The insulating layer 28 has a thickness of, for example, 5 μm to 40 μm. In the present embodiment, the insulating layer 28 has a thickness of 10 μm.

[0079] In this embodiment, the temperature sensing element 3 is a laminated chip thermistor. Figure 3 to Figure 5 As shown, the temperature sensing element 3 includes a body 31, a pair of external electrodes 32, and internal electrodes 33 and 34. The body 31 is, for example, in a rectangular parallelepiped shape. In the present embodiment, the long side direction of the body 31 is the second direction D2, and the short side direction of the body 31 is the third direction D3. The pair of external electrodes 32 are formed at both ends of the body 31 in the second direction D2. The internal electrode 33 is connected to one of the pair of external electrodes 32. The internal electrode 34 is connected to the other of the pair of external electrodes 32. The internal electrode 33 and the internal electrode 34 are arranged in the body 31. The internal electrode 33 and the internal electrode 34 are opposite to each other in the first direction D1 in the body 31. The body 31 includes a region sandwiched by the internal electrode 33 and the internal electrode 34. This region mainly exerts the characteristics of the temperature sensing element 3. The temperature sensing element 3 functions as a thermistor by utilizing the temperature change of the resistance value of the above region. The temperature sensing element 3 is well known in the technical field, and the above detailed description is omitted.

[0080] The temperature sensing element 3 is mounted on the conductor layers 26 and 27. In the present embodiment, the temperature sensing element 3 is mounted on the pad 26a of the conductor layer 26 and the pad 27a of the conductor layer 27 by solder 50. That is, in the present embodiment, the temperature sensing element 3 is mounted on the pads 26a and 27a by solder. One external electrode 32 is connected to the pad 26a by solder 50, and the other external electrode 32 is connected to the pad 27a by solder 50. The temperature sensing element 3 is connected between the conductor layers 26 and 27. One external electrode 32 is electrically connected to the pad 26b by the pad 26a and the connecting wire 26c. The other external electrode 32 is electrically connected to the pad 27b by the pad 27a and the connecting wire 27c.

[0081] As described above, the pads 26a, 26b, 27a, and 27b of the conductor layers 26 and 27 together with the insulating layer 28 constitute the back surface 23b of the substrate 23. Therefore, it can be said that the temperature sensing element 3 mounted on the pads 26a and 27a is mounted on the back surface 23b of the substrate 23.

[0082] In this embodiment, the wire 4 includes a wire 41 and a wire 42. Figure 3As shown, the wire 41 is connected to the pad 26b. The wire 41 includes an end 41a and an end 41b. The end 41a is located in the housing 2 and is connected to the pad 26b. In the present embodiment, the end 41a is connected to the pad 26b using solder 60. Thus, the wire 41 is connected to the temperature sensing element 3 through the connecting wire 26c and the pad 26a. The end 41b is exposed from the housing 2, for example, and is connected to an external device that obtains a signal from the temperature sensing element 3. For example, in the wire 41, when the end 41a includes a first end, the end 41b includes a second end.

[0083] The wire 42 is connected to the pad 27b. The wire 42 includes an end 42a and an end 42b. The end 42a is located in the housing 2 and is connected to the pad 27b. In the present embodiment, the end 42a is also connected to the pad 27b using solder 60. Thus, the wire 42 is connected to the temperature sensing element 3 via the connecting wire 27c and the pad 27a. The end 42b is exposed from the housing 2 and is connected to the above-mentioned external device for obtaining a signal from the temperature sensing element 3. For example, in the wire 42, when the end 42a includes a first end, the end 42b includes a second end.

[0084] exist Figure 4 and Figure 5 In the figure, the solders 50 and 60 are omitted.

[0085] Next, refer to Figure 6 and Figure 7 A state where the temperature sensor 1 is attached to the object 100 will be described. Figure 6 It is a perspective view showing the structure of the temperature sensor, the holder, and the object according to the present embodiment. Figure 7 It is a plan view showing the structure of the temperature sensor and the holder according to the present embodiment.

[0086] In this embodiment, if Figure 6 As shown, the temperature sensor 1 detects the temperature of the object 100 in a state of contact with the object 100. The temperature sensor 1 may also detect the temperature of the object 100 in a state of facing the object 100. The object 100 is, for example, in a cylindrical shape. In this case, the object 100 includes, for example, a pipe for piping. The object 100 may also be in a shape other than a cylindrical shape.

[0087] In the present embodiment, when the temperature sensor 1 is brought into contact with the object 100, a holder 200 is used to hold the temperature sensor 1 on the object 100. The holder 200 can also be used when the temperature sensor 1 is brought into contact with the object 100. The holder 200 includes a portion 210 and a portion 220 that face each other and hold the temperature sensor 1, and a portion 230 that connects the portion 210 and the portion 220. When the holder 200 holds the temperature sensor 1, the portion 210 and the portion 220 are brought into contact with the temperature sensor 1.

[0088] like Figure 6 and Figure 7 As shown, in the present embodiment, the portion 210 includes an area 210a and an area 210b. The area 210a is bent into an arc shape in a direction in which the portions 210 and 220 are opposite to each other so as to be away from the portion 220. The area 210b is bent into an arc shape in a direction in which the portions 210 and 220 are opposite to each other so as to be toward the portion 220. That is, when viewed from a direction orthogonal to the direction in which the portions 210 and 220 are opposite to each other, the portion 210 is substantially S-shaped. In the present embodiment, when the retaining member 200 retains the temperature sensor 1, the area 210b in the portion 210 abuts against the temperature sensor 1.

[0089] In the present embodiment, the portion 220 includes a region 220a and a region 220b. The region 220a extends substantially perpendicularly to the portion 230 from one end of the portion 230 in the direction in which the portions 210 and 220 are opposite to each other. The region 220b is bent in the direction in which the portions 210 and 220 are opposite to each other so as to be separated from the portion 210. In the present embodiment, when the holder 200 holds the temperature sensor 1, the region 220a in the portion 220 abuts against the temperature sensor 1.

[0090] The portion 230 has a rectangular shape. The portion 210 is connected to one of the two ends of the portion 230 , and the portion 220 is connected to the other end.

[0091] Part 210 and part 220 have spring properties. Part 210 and part 220 can be elastically deformed. For example, when part 210 and part 220 are pressed in a direction away from each other, part 210 and part 220 are elastically deformed in a manner away from each other. In this case, a reaction force accompanying the elastic deformation of part 210 and a reaction force accompanying the elastic deformation of part 220 act on the object pressing part 210 and part 220. That is, a force in a direction in which part 210 and part 220 face each other acts on the object pressing part 210 and part 220 from part 210 and part 220.

[0092] The holder 200 further includes a portion 240 extending from one end of the portion 230 close to the portion 210 and separated from the portion 210, and a portion 250 in contact with the object 100. In the present embodiment, the holder 200 includes two portions 240. The two portions 240 sandwich the portion 210 and are separated from each other. The portion 250 is opposite to the portion 230. The shape of the portion 250 corresponds to the shape of the object 100. As described above, the object 100 is cylindrical. Therefore, in the present embodiment, the portion 250 is substantially arc-shaped.

[0093] In the present embodiment, the portion 250 also has a spring property. Therefore, the portion 250 can also be elastically deformed. For example, when the portion 250 is pressed in a direction away from the portion 230, the portion 250 is also elastically deformed in a direction away from the portion 230. In this case, a reaction force accompanying the elastic deformation of the portion 250 acts on the object that presses the portion 250. That is, a force in a direction from the portion 250 toward the portion 230 acts on the object that presses the portion 250.

[0094] When the temperature sensor 1 is mounted on the object 100, first, the temperature sensor 1 is pressed between the portion 210 and the portion 220. In the present embodiment, the housing portion 21 is pressed between the portion 210 and the portion 220 in such a manner that the surface 21a of the housing portion 21 abuts against the portion 230. In this state, the direction in which the portion 210 and the portion 220 are opposite to each other is the second direction D2, and the direction orthogonal to the direction in which the portion 210 and the portion 220 are opposite to each other is the third direction D3.

[0095] When the housing portion 21 is pressed between the portion 210 and the portion 220, the portion 210 and the portion 220 are elastically deformed so as to separate from each other. In this case, the region 210b of the portion 210 and the region 220a of the portion 220 abut against the side surface 21b of the housing portion 21, and the reaction force accompanying the elastic deformation of the portion 210 and the elastic deformation of the portion 220 acts on the housing portion 21. That is, a force from the portion 210 toward the portion 220 and a force from the portion 220 toward the portion 210 act on the temperature sensor 1. As a result, the temperature sensor 1 is held between the portion 210 and the portion 220.

[0096] As described above, the shell portion 21 is made of resin. Therefore, in a state where the temperature sensor 1 is held on the holder 200, the shape of the shell portion 21 is deformed according to the shape of the portion 210 or the portion 220 that abuts against the temperature sensor 1. In the present embodiment, the side 21b of the shell portion 21 abuts against the region 210b of the portion 210 and the region 220a of the portion 220. As described above, the region 210b is bent in a manner toward the portion 220 in the second direction D2, and the region 220a extends along the third direction D3. Therefore, in a state where the temperature sensor 1 is held on the holder 200, the shape of the side 21b abutting against the region 210b is deformed according to the region 210b. In the present embodiment, as Figure 7 As shown, the shape of the side surface 21 b is deformed in such a manner as to be recessed in the second direction D2 from the side surface 21 b toward the inner side of the housing portion 21 according to the region 210 b .

[0097] Next, the temperature sensor 1 is brought into contact with the object 100 while the temperature sensor 1 is held by the holder 200. When the temperature sensor 1 is brought into contact with the object 100, for example, the object 100 is pressed in between the region 220b and the front end of the portion 250. When the object 100 is pressed in between the region 220b and the front end of the portion 250, the portion 250 is elastically deformed so as to be separated from the portion 230. In this case, a reaction force accompanying the elastic deformation of the portion 250 acts on the object 100. That is, a force acting in a direction from the portion 250 toward the portion 230 acts on the object 100. As a result, the surface 23a of the substrate 23 is brought into contact with the object 100. In this state, the portion 230 is brought into contact with the surface 21a of the housing portion 21, and the portion 250 is brought into contact with the object 100. Therefore, when the temperature sensor 1 is brought into contact with the object 100, the holder 200 is brought into contact with the temperature sensor 1 and the object 100.

[0098] As described above, in the temperature sensor 1, the substrate 23 included in the housing portion 22 includes the surface 23a including the region R2 of the outer surface of the housing 2, and the back surface 23b opposite to the surface 23a. The temperature sensing element 3 is mounted on the back surface 23b of the substrate 23. The heat transfer path from the surface 23a of the substrate 23 to the temperature sensing element 3 includes the substrate 23, but it is difficult to include the housing portion 21 made of resin. The surface 23a of the substrate 23 has a thermal conductivity greater than the thermal conductivity of the surface 21a, the pair of side surfaces 21b, and the pair of end surfaces 21c including the region R1 of the outer surface of the housing 2. In the temperature sensor 1, when the temperature of the object 100 is detected, the heat of the object 100 is easily transferred to the temperature sensing element 3 by making the surface 23a of the substrate 23 contact the object 100 without the housing portion 21. Therefore, the temperature sensor 1 can improve the thermal responsiveness.

[0099] In order to improve the accuracy of temperature detection by the temperature sensor 1, it is necessary to maintain the state in which the object 100 and the temperature sensor 1 are in contact with each other. Therefore, when the temperature sensor 1 is brought into contact with the object 100, a holder 200 for holding the temperature sensor 1 on the object 100 is sometimes used. The holder 200 is in contact with the object 100 and the housing 2. The structure in which the housing 2 can be deformed according to the shape of the portion of the holder 200 that is in contact with the temperature sensor 1 tends to reliably maintain the state in which the object 100 and the housing 2 are in contact with each other.

[0100] In the temperature sensor 1, the housing portion 21 is made of resin. In the temperature sensor 1, the holder 200 abuts against the housing portion 21, so the housing portion 21 is deformed according to the shape of the portion of the holder 200 that abuts against the housing portion 21, that is, the region 210b. Therefore, the temperature sensor 1 can reliably maintain the state in which the object 100 and the housing portion 21 abut against each other. The temperature sensor 1 can improve the accuracy of temperature detection.

[0101] In the temperature sensor 1, the substrate 23 includes side surfaces 23c and 23d connecting the surface 23a and the back surface 23b. The housing portion 21 includes a plurality of wall portions W1 that are opposite to the side surface 23c and separated from each other along the side surface 23c, and a plurality of wall portions W2 that are opposite to the side surface 23d and separated from each other along the side surface 23d. A portion of the side surface 23c is exposed between the wall portions W1 that are adjacent to each other among the plurality of wall portions W1. A portion of the side surface 23d is exposed between the wall portions W2 that are adjacent to each other among the plurality of wall portions W2.

[0102] The temperature sensor 1 improves the connection strength between the housing portion 21 and the housing portion 22. Therefore, the housing portion 21 and the housing portion 22 are difficult to be separated from each other. The temperature sensor 1 in which a part of the side surface 23c is exposed between the mutually adjacent wall portions W1 among the plurality of wall portions W1, and a part of the side surface 23d is exposed between the mutually adjacent wall portions W2 among the plurality of wall portions W2 can improve the heat collection property in the substrate. Therefore, the temperature sensor 1 can further improve the thermal responsiveness.

[0103] In the temperature sensor 1 , the substrate 23 includes a metal plate 24 including a main surface 24 a including the surface 23 a and a main surface 24 b opposite to the main surface 24 a .

[0104] The temperature sensor 1 simply and reliably realizes the surface 23 a having a higher thermal conductivity than the surface 21 a , the pair of side surfaces 21 b , and the pair of end surfaces 21 c of the case portion 21 .

[0105] In the temperature sensor 1 , the substrate 23 includes an insulating layer 25 disposed on the main surface 24 b of the metal plate 24 . The temperature sensing element 3 is disposed on the insulating layer 25 .

[0106] The temperature sensor 1 reliably maintains electrical insulation between the temperature sensing element 3 and the metal plate 24 .

[0107] In the temperature sensor 1 , the substrate 23 includes conductive layers 26 and 27 disposed on the insulating layer 25 . The temperature sensing element 3 is mounted on the conductive layers 26 and 27 .

[0108] Even in the structure in which the insulating layer 25 is disposed on the metal plate 24 , the temperature sensor 1 can easily and reliably realize the structure in which the temperature sensing element 3 is electrically mounted on the substrate 23 .

[0109] The temperature sensor 1 includes wires 41 and 42 . The wires 41 and 42 include ends 41 a and 42 a located in the housing 2 and electrically connected to the temperature sensing element 3 , and ends 41 b and 42 b exposed from the housing 2 .

[0110] The temperature sensor 1 has a structure that simply and reliably realizes the structure of leading the signal line electrically connected to the temperature sensing element 3 to the outside of the housing 2 including the housing portion 21 and the housing portion 22 .

[0111] Next, refer to Figure 8 and Fig. 9 The structure of the temperature sensor 1 according to a modified example of the present embodiment will be described. Figure 8 It is a perspective view showing the temperature sensor according to this modification. Fig. 9 1 is a plan view showing the structure of the temperature sensor and the holder of this modification. In this modification, the structure of the housing portion 21 is different from that of the above-mentioned embodiment. The following mainly describes the differences between the above-mentioned embodiment and this modification.

[0112] In this modified example, the housing portion 21 is formed with an engaging portion 21d that engages with the retainer 200. Figure 8 As shown, the engaging portion 21d is formed on the side surface 21b of the housing portion 21. In this modified example, the engaging portion 21d is formed on one side surface 21b of the pair of side surfaces 21b. The engaging portion 21d is formed on the one side surface 21b so as to extend along the third direction D3. In this modified example, the engaging portion 21d is recessed in the second direction D2 from the side surface 21b toward the inner side of the housing portion 21, corresponding to the shape of the region 210b in the retainer 200 that abuts against the housing portion 21. Therefore, the engaging portion 21d in this modified example can also be said to be a recess formed on the side surface 21b.

[0113] When the temperature sensor 1 is held in the holder 200, Fig. 9 As shown, the engaging portion 21d engages with the region 210b. In this modification, with respect to the shape of the housing portion 21, the shape of the side surface 21b is also deformed according to the region 210b when the temperature sensor 1 is held in the holder 200. That is, in this modification, the engaging portion 21d is deformed in such a manner that it is further recessed from the side surface 21b toward the inner side of the housing portion 21 according to the region 210b.

[0114] In this modification, the housing portion 21 is provided with an engaging portion 21 d that engages with the holder 200 that holds the temperature sensor 1 .

[0115] This modification can more reliably maintain the state in which the object 100 and the housing portion 21 are in contact with each other. Therefore, this modification can further improve the accuracy of temperature detection.

[0116] Next, refer to Fig.10 , a structure of a temperature sensor 1 according to a modified example of the present embodiment will be described. Fig.10 1 is a top view showing the structure of the substrate and the temperature sensing element. In this modification, the structure of the temperature sensing element is different from that of the above-mentioned embodiment. The following mainly describes the differences between the above-mentioned embodiment and this modification.

[0117] In this modification, the temperature sensor 1 includes a temperature sensing element 3A and a temperature sensing element 3B instead of the temperature sensing element 3. That is, in this modification, the temperature sensor 1 includes a plurality of temperature sensing elements 3A and 3B. The temperature sensing element 3A and the temperature sensing element 3B have the same structure as the temperature sensing element 3 described above. Therefore, the temperature sensing element 3A includes a body 31A and a pair of external electrodes 32A, and the temperature sensing element 3B includes a body 31B and a pair of external electrodes 32B. Although not shown in the figure, the temperature sensing element 3A also includes a pair of internal electrodes facing each other in the body 31A, and the temperature sensing element 3B also includes a pair of internal electrodes facing each other in the body 31B.

[0118] In this modification, the temperature sensing element 3A and the temperature sensing element 3B are electrically connected in series. In this modification, in order to realize the above structure, the substrate 23 further includes a conductor layer 29. The conductor layer 29 is arranged on the insulating layer 25 like the conductor layers 26 and 27. The conductor layer 29 is in contact with the insulating layer 25. The conductor layer 29 is separated from the conductor layers 26 and 27. In this modification, the conductor layer 29 is separated from the conductor layers 26 and 27 in the second direction D2. The thickness of the conductor layer 29 is, for example, not less than 10 μm and not more than 100 μm. In this embodiment, the thickness of the conductor layer 29 is 35 μm.

[0119] In this modification, the conductor layer 29 is made of copper, similar to the conductor layers 26 and 27. As described above, the thermal conductivity of copper is, for example, 393 W / (m·K). The thermal conductivity of the conductor layer 29 made of copper is, for example, 393 W / (m·K). In this modification, the thermal conductivity of the conductor layer 29 is greater than the thermal conductivity of the surface 23a.

[0120] In this variation, the conductor layer 29 includes a pad 29a. The pad 29a is located between the pad 26a and the pad 27a in the second direction D2. The pad 29a has a pair of sides that are opposite to each other in the second direction D2, and a pair of sides that are opposite to each other in the third direction D3. In this variation, the pad 29a is square. The pad 29a may also be rectangular.

[0121] In this modification, openings are also formed in the insulating layer 28 at positions corresponding to the pads 29a. That is, five openings are formed in the insulating layer 28. The pads 29a are exposed from the insulating layer 28. In this modification, the pads 29a of the conductor layer 29, the pads 26a, 26b, 27a, 27b of the conductor layers 26 and 27, and the insulating layer 28 together constitute the back surface 23b of the substrate 23. That is, in this embodiment, the conductor layers 26, 27, 29 and the insulating layer 28 include the back surface 23b.

[0122] In this modification, the temperature sensing elements 3A and 3B are mounted on the conductor layer 29 in addition to the conductor layers 26 and 27. One external electrode 32A of the temperature sensing element 3A is mounted on the pad 26a using solder 50, and the other external electrode 32A of the temperature sensing element 3A is mounted on the pad 29a using solder 70. One external electrode 32B of the temperature sensing element 3B is mounted on the pad 27a using solder 50, and the other external electrode 32B of the temperature sensing element 3B is mounted on the pad 29a using solder 70.

[0123] The one external electrode 32A is electrically connected to the pad 26b via the pad 26a and the connection line 26c. The one external electrode 32B is electrically connected to the pad 27a and the connection line 27c. The other external electrode 32A and the other external electrode 32B are electrically connected via the pad 29a. Thus, a structure in which the temperature sensing element 3A and the temperature sensing element 3B are electrically connected in series is realized.

[0124] As described above, the pad 29a of the conductor layer 29, the pads 26a, 26b, 27a, 27b of the conductor layers 26 and 27, and the insulating layer 28 constitute the back surface 23b of the substrate 23. Therefore, it can be said that the temperature sensing elements 3A and 3B mounted on the pads 26a, 27a, and 29a are mounted on the back surface 23b of the substrate 23.

[0125] Next, refer to Fig.11 , a structure of a temperature sensor 1 according to a modified example of the present embodiment will be described. Fig.11 1 is a top view showing the structure of the substrate and the temperature sensing element. In this modification, the electrical connection relationship between the temperature sensing element 3A and the temperature sensing element 3B is different from the above-mentioned modification. The following mainly describes the differences between the above-mentioned modification and this modification.

[0126] In this modification, the temperature sensing element 3A and the temperature sensing element 3B are electrically connected in parallel. In this modification, in order to realize the above structure, the conductor layer 29 includes a pad 29b and a pad 29c instead of the pad 29a. The pads 29b and 29c are located between the connecting line 26c and the connecting line 27c in the second direction D2. The pad 29b and the pad 29c are separated from each other in the second direction D2. The pad 29b is electrically connected to the connecting line 26c. The pad 29b is also electrically connected to the pads 26a and 26b through the connecting line 26c. The pad 29c is also electrically connected to the connecting line 27c. The pad 29c is also electrically connected to the pads 27a and 27b through the connecting line 27c.

[0127] The pads 29b and 29c have a pair of sides facing each other in the second direction D2 and a pair of sides facing each other in the third direction D3. In this modification, the pads 29b and 29c are square in shape. The pads 29b and 29c may also be rectangular in shape.

[0128] In this modification, openings are also formed in the insulating layer 28 at positions corresponding to the pads 29b and 29c. That is, six openings are formed in the insulating layer 28. The pads 29b and 29c are exposed from the insulating layer 28. In this modification, the pads 29b and 29c of the conductor layer 29, the pads 26a, 26b, 27a, 27b of the conductor layers 26 and 27, and the insulating layer 28 together constitute the back surface 23b of the substrate 23. That is, in this embodiment, the conductor layers 26, 27, 29 and the insulating layer 28 include the back surface 23b.

[0129] In this modification, the temperature sensing element 3A is mounted on the conductor layers 26 and 27. The temperature sensing element 3A is mounted on the pads 26a and 27a using solder 50. Fig.10 As shown, one external electrode 32A of the temperature sensing element 3A is connected to the pad 26 a by means of solder 50 , and the other external electrode 32A of the temperature sensing element 3A is connected to the pad 27 a by means of solder 50 .

[0130] The temperature sensing element 3B is mounted on the conductor layer 29. The temperature sensing element 3B is mounted on the pads 29b and 29c by solder 80. One external electrode 32B of the temperature sensing element 3B is connected to the pad 29a by solder 80, and the other external electrode 32B of the temperature sensing element 3B is connected to the pad 29b by solder 80.

[0131] As described above, pad 29a is electrically connected to pad 26a via connection line 26c, and pad 29b is electrically connected to pad 27a via connection line 27c. Thus, a structure in which temperature sensing element 3A and temperature sensing element 3B are electrically connected in parallel is realized.

[0132] As described above, the pads 29b and 29c of the conductor layer 29, the pads 26a, 26b, 27a, and 27b of the conductor layers 26 and 27, and the insulating layer 28 constitute the back surface 23b of the substrate 23. Therefore, it can be said that the temperature sensing element 3A mounted on the pads 26a and 27a and the temperature sensing element 3B mounted on the pads 29b and 29c are mounted on the back surface 23b of the substrate 23.

[0133] Next, refer to Fig.12 , a structure of a temperature sensor 1 according to a modified example of the present embodiment will be described. Fig.12 1 is a top view showing the structure of the substrate and the temperature sensing element. In this modification, the structure of the temperature sensing element, the structure of the conductor layer, and the structure of the wire are different from those of the above-mentioned embodiment. The following mainly describes the differences between the above-mentioned embodiment and this modification.

[0134] In this modification, the temperature sensor 1 includes a temperature sensing element 3C in addition to the temperature sensing element 3. That is, in this modification, the temperature sensor 1 includes a plurality of temperature sensing elements 3 and 3C. The temperature sensing element 3C has the same structure as that of the temperature sensing element 3. Therefore, the temperature sensing element 3C includes an element body 31C, a pair of external electrodes 32C, and a pair of internal electrodes facing each other in the element body 31C.

[0135] In this modification, the temperature sensing element 3 and the temperature sensing element 3C are not electrically connected. In this modification, in order to realize the above structure, the substrate 23 further includes conductor layers 26C and 27C. The conductor layer 26C has the same structure as the conductor layer 26, and is not electrically connected to the conductor layers 26 and 27. The conductor layer 26C includes a pair of pads 26Ca and 26Cb and a connecting wire 26Cc. The conductor layer 27C has the same structure as the conductor layer 27, and is not electrically connected to the conductor layers 26 and 27. The conductor layer 27C includes a pair of pads 27Ca and 27Cb and a connecting wire 27Cc.

[0136] In this modification, openings are also formed in the insulating layer 28 at positions corresponding to the pads 26Ca, 26Cb, 27Ca, and 27Cb. That is, eight openings are formed in the insulating layer 28. The pads 26Ca, 26Cb, 27Ca, and 27Cb are exposed from the insulating layer 28. In this modification, the pads 26Ca, 26Cb, 27Ca, and 27Cb of the conductor layers 26C and 27C, the pads 26a, 26b, 27a, and 27b of the conductor layers 26 and 27, and the insulating layer 28 constitute the back surface 23b of the substrate 23. That is, in this embodiment, the conductor layers 26, 27, 26C, and 27C and the insulating layer 28 include the back surface 23b.

[0137] The temperature sensing element 3C is mounted on the conductor layers 26C and 27C. In this modification, the temperature sensing element 3C is mounted on the pad 26Ca of the conductor layer 26C and the pad 27Ca of the conductor layer 27C by solder 50C. One external electrode 32C is connected to the pad 26Ca by solder 50C, and the other external electrode 32C is connected to the pad 27Ca by solder 50C. The temperature sensing element 3C is connected between the conductor layer 26C and the conductor layer 27C. One external electrode 32C is electrically connected to the pad 26Cb through the pad 26Ca and the connecting wire 26Cc. The other external electrode 32C is electrically connected to the pad 27Cb through the pad 27Ca and the connecting wire 27Cc.

[0138] As described above, the pads 26Ca, 26Cb, 27Ca, and 27Cb of the conductor layers 26C and 27C also constitute the back surface 23b of the substrate 23 together with the pads 26a, 26b, 27a, and 27b of the conductor layers 26 and 27 and the insulating layer 28. Therefore, it can be said that the temperature sensing element 3C mounted on the pads 26Ca and the pads 27Ca is also mounted on the back surface 23b of the substrate 23.

[0139] Furthermore, in this modified example, the wire 4 further includes a wire 41C and a wire 42C. The wire 41C has the same structure as the wire 41, and the wire 42C has the same structure as the wire 42. That is, the wire 41C includes an end 41Ca located in the housing 2 and connected to the pad 26Cb, and an end exposed from the housing 2. Similarly, the wire 42C includes an end 42Ca located in the housing 2 and connected to the pad 27Cb, and an end exposed from the housing 2. Thus, the wire 41C is connected to the temperature sensing element 3C via the connecting wire 26Cc and the pad 26Ca, and the wire 42C is connected to the temperature sensing element 3C via the connecting wire 27Cc and the pad 27Ca.

[0140] Although the embodiment of the present invention has been described above, the present invention is not necessarily limited to the embodiment, and various changes can be made to the embodiment without departing from the scope of the present invention.

[0141] In the temperature sensor 1, the engaging portion 21d that engages with the holder 200 may not be formed in the housing portion 21. As described above, the temperature sensor 1 having the engaging portion 21d formed in the housing portion 21 can further improve the accuracy of temperature detection.

[0142] In the temperature sensor 1, the shell portion 21 may not include the plurality of wall portions W1, W2. A portion of the side 23c may not be exposed between the mutually adjacent wall portions W1 among the plurality of wall portions W1. A portion of the side 23d may not be exposed between the mutually adjacent wall portions W2 among the plurality of wall portions W2. As described above, the temperature sensor 1 in which a portion of the side 23c is exposed between the mutually adjacent wall portions W1 among the plurality of wall portions W1, and a portion of the side 23d is exposed between the mutually adjacent wall portions W2 among the plurality of wall portions W2 as described above can further improve thermal responsiveness.

Claims

1. A temperature sensor, wherein: have: at least one temperature sensing element; and a housing that accommodates the at least one temperature sensing element and includes a first area and a second area different from the first area on an outer surface thereof, The housing comprises: A first case portion including a surface including the first region and having a first thermal conductivity, and composed of a resin; and a second housing portion including a substrate including a surface including the second region and having a second thermal conductivity greater than the first thermal conductivity, and a back surface opposite to the surface, The at least one temperature sensing element is mounted on the back side of the substrate.

2. The temperature sensor according to claim 1, wherein: An engaging portion that engages with a holder that holds the temperature sensor is formed on the first housing portion.

3. The temperature sensor according to claim 1 or 2, wherein: The substrate includes a side surface connecting the front surface and the back surface, The first housing portion includes a plurality of wall portions opposite to the side surface and separated from each other along the side surface, A portion of the side surface is exposed between mutually adjacent wall portions among the plurality of wall portions.

4. The temperature sensor according to any one of claims 1 to 3, wherein: The substrate includes a metal plate including a first main surface including the surface and a second main surface opposite to the first main surface.

5. The temperature sensor according to claim 4, wherein: The substrate includes an insulating layer disposed on the second main surface of the metal plate, The at least one temperature sensing element is disposed on the insulating layer.

6. The temperature sensor according to claim 5, wherein: The substrate includes a conductor layer disposed on the insulating layer. The at least one temperature sensing element is mounted on the conductor layer.

7. The temperature sensor according to any one of claims 1 to 6, wherein: A lead wire is further provided, the lead wire including a first end located in the housing and electrically connected to the at least one temperature sensing element, and a second end exposed from the housing.

8. The temperature sensor according to any one of claims 1 to 7, wherein: The at least one temperature sensing element comprises a plurality of temperature sensing elements, The plurality of temperature sensing elements are mounted on the back side of the substrate.

Images