Method and System for Synchronously Heating and Separating Upper and Lower Modules of a Thermal Plastic Optical Module Mold

Abstract

The present invention relates to the field of optical communication technology, and discloses a method and system for synchronous temperature rise and separation of the upper and lower modules of a hot shaping optical module mold, including: first, obtaining the material characteristic data of the optical module mold, analyzing the heating application scenario based on this, configuring the temperature rise power parameters of the upper and lower modules, constructing a synchronous temperature rise simulation environment, then analyzing the temperature change data in the simulation environment, calculating the temperature rise rate parameter and temperature equilibrium degree, so as to explore the synchronous temperature rise effect under different initial temperature differences, and querying the thermal stress change situation, then adjusting the separation guiding device according to the thermal stress, planning the operation process of synchronous temperature rise and separation, and finally, constructing a synchronous control system, monitoring the control state, analyzing the execution data, so as to formulate a mold maintenance plan. The present invention can improve the synchronous control quality of the hot shaping optical module mold.

Description

Technical Field

[0001] The present invention relates to a method and system for synchronous temperature rise and separation of the upper and lower modules of a hot shaping optical module mold, belonging to the field of optical communication technology. Background Art

[0002] At present, with the booming development of the optical communication industry, as a core component in the optical communication system, the manufacturing process fineness of the optical module directly affects the performance and reliability of the entire communication system. The hot shaping optical module mold plays a crucial role in the production process of the optical module, especially for ensuring the precise forming and fitting degree of the precision components inside the optical module.

[0003] Currently, there are still defects in the operation methods of traditional hot shaping optical module molds. On the one hand, during the temperature rise process, the upper and lower modules often adopt an asynchronous temperature rise method. This method is extremely likely to cause uneven thermal stress in the mold due to the temperature difference between the upper and lower modules, and then lead to problems such as internal structural stress concentration and warping deformation in the formed optical module, seriously affecting the optical and electrical performance of the optical module, and significantly increasing the failure rate of the product in subsequent communication tests. On the other hand, after the mold is processed, the separation operation of the upper and lower modules lacks precise synchronous control, which is prone to mechanical pulling during demolding, scratching and damaging the precision surface of the formed optical module, thus reducing the yield rate of the product. Therefore, a method for synchronous temperature rise and separation of the upper and lower modules of a hot shaping optical module mold is needed to improve the synchronous control quality of the hot shaping optical module mold. Summary of the Invention

[0004] The present invention provides a method and system for synchronous temperature rise and separation of the upper and lower modules of a hot shaping optical module mold, and its main purpose is to improve the synchronous control quality of the hot shaping optical module mold.

[0005] To achieve the above purpose, a method for synchronous temperature rise and separation of the upper and lower modules of a hot shaping optical module mold provided by the present invention includes:

[0006] Obtain the material property data corresponding to the optical module mold to be processed. Based on the material property data, analyze the heating application scenario corresponding to the optical module mold to be processed. According to the heating application scenario, configure the temperature rise power parameters of the upper and lower modules corresponding to the optical module mold to be processed. Based on the temperature rise power parameters, construct a synchronous temperature rise simulation environment corresponding to the optical module mold to be processed;

[0007] Analyze the temperature change data corresponding to the upper and lower modules in the synchronous temperature rise simulation environment, query the temperature rise rate parameter in the temperature change data, and based on the temperature rise rate parameter, calculate the temperature balance degree of the upper and lower modules during the temperature rise process;

[0008] Based on the temperature equilibrium degree, analyze the synchronous heating effect of the optical module mold to be processed under different initial temperature differences. Based on the synchronous heating effect, query the thermal stress change of the optical module mold to be processed during the test;

[0009] Based on the thermal stress change, adjust the separation guiding device corresponding to the upper and lower modules. Based on the adjusted separation guiding device, query the interference factors during the synchronous heating and separation of the upper and lower modules. Based on the interference factors, plan the operation process of the synchronous heating and separation of the upper and lower modules;

[0010] Based on the operation process, construct a synchronous control system for the heating and separation of the optical module mold to be processed. Based on the synchronous control system, monitor the synchronous control state of the optical module mold to be processed, and analyze the control execution data in the synchronous control state. Based on the control execution data, formulate a mold maintenance plan for the heating and separation of the optical module mold to be processed.

[0011] Optionally, the analysis of the heating application scenario corresponding to the optical module mold to be processed based on the material characteristic data includes:

[0012] Perform hierarchical analysis on the material characteristic data to obtain a hierarchical data group;

[0013] Identify the sensitive attribute elements corresponding to each layer of data in the hierarchical data group;

[0014] Based on the sensitive attribute elements, calculate the temperature adaptation values of the optical module mold to be processed under different heating methods;

[0015] Based on the temperature adaptation values, analyze the internal heat transfer curve corresponding to the optical module mold to be processed;

[0016] Extract the key temperature nodes from the internal heat transfer curve;

[0017] Based on the key temperature nodes, construct the heating application scenario corresponding to the optical module mold to be processed.

[0018] Optionally, the calculation of the temperature adaptation values of the optical module mold to be processed under different heating methods based on the sensitive attribute elements includes:

[0019] Use the following formula to calculate the temperature adaptation values of the optical module mold to be processed under different heating methods:

[0020]

[0021] Among them, TA represents the temperature adaptation value of the optical module mold to be processed under different heating methods, n represents the number of elements corresponding to the sensitive attribute elements, i represents the quantity index corresponding to the sensitive attribute elements, represents the standard value of the i-th sensitive attribute element under a specific heating method, represents the measured value of the i-th sensitive attribute element during the actual heating process, represents the measurement error value of the i-th sensitive attribute element, and t represents the heating time, represents the number of methods corresponding to different heating methods, and j represents the quantity index corresponding to different heating methods, represents the heating power value corresponding to the j-th heating method, represents the temperature state ratio corresponding to the j-th heating method.

[0022] Optionally, constructing the synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameter includes:

[0023] Performing spectrum analysis on the heating power parameter to obtain power spectrum data;

[0024] Performing filtering processing on the power spectrum data to obtain filtered spectrum data;

[0025] Performing feature extraction on the filtered spectrum data to obtain a spectrum feature vector;

[0026] Based on the spectrum feature vector, setting the initial heating conditions corresponding to the optical module mold to be processed;

[0027] Based on the initial heating conditions, constructing the synchronous heating simulation environment corresponding to the optical module mold to be processed.

[0028] Optionally, analyzing the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment includes:

[0029] Performing discretization processing on the data in the synchronous heating simulation environment to obtain a discrete temperature sequence;

[0030] Performing trend fitting on the discrete temperature sequence to obtain a temperature trend curve;

[0031] Identifying the temperature mutation points in the temperature trend curve;

[0032] Based on the temperature mutation points, dividing the temperature stages corresponding to the upper and lower modules;

[0033] Analyzing the temperature change data corresponding to the temperature stages.

[0034] Optionally, calculating the temperature balance degree of the upper and lower modules during the heating process based on the heating rate parameter includes:

[0035] Calculating the temperature balance degree of the upper and lower modules during the heating process by using the following formula:

[0036]

[0037] where TE represents the temperature balance degree of the upper and lower modules during the heating process, q represents the total number of temperature sampling points corresponding during the heating process, k represents the number index corresponding to the temperature sampling point, represents the heating rate corresponding to the upper module at the k-th sampling point, represents the heating rate of the lower module at the k-th sampling point, c represents the number of influencing factors corresponding to the heating rate parameter, v represents the number index corresponding to the influencing factor, represents the factor weight value corresponding to the v-th influencing factor.

[0038] Optionally, querying the thermal stress change of the optical module mold to be processed during the test based on the synchronous heating effect includes:

[0039] Quantitatively evaluating the synchronous heating effect to obtain a heating quantization index;

[0040] Dividing the temperature-sensitive area corresponding to the optical module mold to be processed based on the heating quantization index;

[0041] Arranging strain gauges in the temperature-sensitive area to obtain a strain gauge arrangement scheme;

[0042] Collecting the temperature strain data set in the strain gauge arrangement scheme;

[0043] Querying the thermal stress change of the optical module mold to be processed during the test based on the temperature strain data set.

[0044] Optionally, planning the operation process of synchronous heating and separation corresponding to the upper and lower modules based on the interference factor includes:

[0045] Querying the factor source corresponding to the interference factor;

[0046] Identifying the existing operation characteristics corresponding to the upper and lower modules based on the factor source;

[0047] Marking the key operation identifiers corresponding to the existing operation characteristics;

[0048] Analyzing the optimizable links corresponding to the key operation identifiers;

[0049] Based on the optimizable link, plan the operation process of the upper and lower modules corresponding to synchronous heating and separation.

[0050] Optionally, based on the operation process, construct a synchronous control system for the heating and separation of the to-be-processed optical module mold, including:

[0051] Determine the key parameters in the heating and separation operations of the to-be-processed optical module mold;

[0052] Sort out the mutual influence relationships corresponding to the key parameters;

[0053] Collect the initial synchronous data corresponding to the to-be-processed optical module mold;

[0054] Based on the mutual influence relationships and the initial synchronous data, determine the synchronous set value corresponding to the to-be-processed optical module mold;

[0055] Based on the synchronous set value, construct a synchronous control system for the heating and separation of the to-be-processed optical module mold.

[0056] To solve the above problems, the present invention also provides a system for synchronous heating and separation of the upper and lower modules of a thermoformed optical module mold, and the system includes:

[0057] An environment construction module, configured to obtain the material property data corresponding to the to-be-processed optical module mold, analyze the heating application scenario corresponding to the to-be-processed optical module mold based on the material property data, configure the heating power parameters of the upper and lower modules corresponding to the to-be-processed optical module mold according to the heating application scenario, and construct a synchronous heating simulation environment corresponding to the to-be-processed optical module mold based on the heating power parameters;

[0058] An equilibrium degree calculation module, configured to analyze the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment, query the heating rate parameter in the temperature change data, and calculate the temperature equilibrium degree of the upper and lower modules during the heating process based on the heating rate parameter;

[0059] A thermal stress calculation module, configured to analyze the synchronous heating effect of the to-be-processed optical module mold under different initial temperature difference conditions based on the temperature equilibrium degree, and query the thermal stress change situation of the to-be-processed optical module mold in the test based on the synchronous heating effect;

[0060] A process planning module, configured to adjust the separation guiding device corresponding to the upper and lower modules based on the thermal stress change situation, query the interference factors of the upper and lower modules during the synchronous heating and separation process based on the adjusted separation guiding device, and plan the operation process of the upper and lower modules corresponding to synchronous heating and separation based on the interference factors;

[0061] A solution formulation module, configured to construct a synchronous control system for the corresponding heating and separation of the optical module mold to be processed based on the operation process, monitor the synchronous control state corresponding to the optical module mold to be processed based on the synchronous control system, analyze the control execution data in the synchronous control state, and formulate a mold maintenance plan for the corresponding heating and separation of the optical module mold to be processed based on the control execution data.

[0062] Compared with the problems described in the background art, the present invention can accurately plan the processing technology by obtaining the material characteristic data corresponding to the optical module mold to be processed, select appropriate cutting, grinding and other methods according to the characteristics of the material such as hardness and toughness, and improve the production efficiency. Secondly, it helps to optimize the mold design. Understanding the thermal expansion coefficient of the material can avoid problems such as deformation caused by temperature changes and improve the mold quality. By analyzing the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment, the present invention can intuitively understand the dynamic process of the upper and lower modules heating up, accurately grasp the rate and trend of temperature rise, timely discover possible temperature differences, and take measures in advance to avoid thermal stress problems caused by temperature differences. Further, based on the temperature equilibrium degree, the present invention analyzes the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions, can accurately control the heating consistency of the mold under various initial temperature differences, ensure the stable quality of the optical module molding, can predict in advance the influence of different initial temperature differences on the heating effect, provide a basis for optimizing the heating process, and reduce mold damage and product defects caused by temperature differences. Further, based on the thermal stress change situation, the present invention adjusts the separation guiding device corresponding to the upper and lower modules, can make the performance of the separation guiding device match the thermal stress situation, avoid device deformation or damage caused by thermal stress, help to optimize the separation process of the upper and lower modules, reduce the jamming or deviation phenomena caused by uneven thermal stress, and improve the accuracy and efficiency of separation. Finally, based on the operation process, the present invention constructs a synchronous control system for the corresponding heating and separation of the optical module mold to be processed, can ensure the accuracy and stability of the heating and separation operations, strictly execute according to the planned operation process, can effectively improve the production efficiency, reduce unnecessary waiting time and error correction time by synchronously controlling each link, and make the whole production process more smooth. Therefore, the method and system for synchronous heating and separation of the upper and lower modules of the thermoformed optical module mold provided by the embodiments of the present invention can improve the synchronous control quality of the thermoformed optical module mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Figure 1 It is a schematic flow chart of the method for synchronous heating and separation of the upper and lower modules of the thermoformed optical module mold provided by an embodiment of the present invention;

[0064] Figure 2It is a schematic diagram of a module for implementing the system for synchronously heating and separating the upper and lower modules of the hot shaping optical module mold provided by an embodiment of the present invention.

[0065] The implementation, functional features and advantages of the present invention will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0066] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0067] An embodiment of the present application provides a method for synchronously heating and separating the upper and lower modules of a hot shaping optical module mold. The execution subject of the method for synchronously heating and separating the upper and lower modules of the hot shaping optical module mold includes but is not limited to at least one of electronic devices such as a server, a terminal, etc. that can be configured to execute the method provided by the embodiment of the present application. In other words, the method for synchronously heating and separating the upper and lower modules of the hot shaping optical module mold can be executed by software or hardware installed on a terminal device or a server device. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc.

[0068] Embodiment 1:

[0069] Refer to Figure 1 As shown, it is a flowchart of a method for synchronously heating and separating the upper and lower modules of a hot shaping optical module mold provided by an embodiment of the present invention. In this embodiment, the method for synchronously heating and separating the upper and lower modules of the hot shaping optical module mold includes:

[0070] S1. Obtain the material characteristic data corresponding to the optical module mold to be processed, analyze the heating application scenario corresponding to the optical module mold to be processed based on the material characteristic data, configure the heating power parameters of the corresponding upper and lower modules of the optical module mold to be processed according to the heating application scenario, and construct a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameters.

[0071] By obtaining the material characteristic data corresponding to the optical module mold to be processed, the present invention can accurately plan the processing technology, select appropriate cutting, grinding and other methods according to the hardness, toughness and other characteristics of the material, improve production efficiency. Secondly, it helps to optimize the mold design. Understanding the thermal expansion coefficient and other properties of the material can avoid problems such as deformation caused by temperature changes and improve the mold quality.

[0072] Among them, the mold of the optical module to be processed refers to the mold for manufacturing the optical module that will undergo a specific synchronous heating and separation process in the optical module production process. It is a mold used for thermal shaping of the precision components inside the optical module. This mold includes an upper module and a lower module. In the traditional operation mode, there are problems such as uneven thermal stress caused by asynchronous heating of the upper and lower modules and lack of precise synchronous control during separation; the material property data refers to various attribute information related to the material of the mold of the optical module to be processed, including but not limited to the thermal conductivity of the material, which determines the ability of the material to conduct heat and has a key impact on the heat transfer between the upper and lower modules of the mold during the heating process; the coefficient of thermal expansion, which is related to the change in the size of the mold when the temperature changes and helps to estimate the deformation of the mold caused by heating; and data such as the melting point and specific heat capacity of the material. Optionally, the acquisition of the material property data corresponding to the mold of the optical module to be processed can be achieved through experimental testing methods, such as tensile tests, thermal analysis experiments, etc.

[0073] Furthermore, based on the material property data, the present invention analyzes the heating application scenario corresponding to the mold of the optical module to be processed, can accurately adapt the heating power, determines the appropriate heating rate and power according to the thermal properties of the material, and avoids mold damage or optical module forming defects caused by improper heating.

[0074] Among them, the heating application scenario refers to a comprehensive consideration of key temperature nodes, material properties and other factors, and depicts a comprehensive and specific mold heating implementation plan covering heating equipment selection, heating rate setting, heating duration control, and temperature monitoring methods.

[0075] As an embodiment of the present invention, the analysis of the heating application scenario corresponding to the mold of the optical module to be processed based on the material property data includes: performing hierarchical analysis on the material property data to obtain a hierarchical data group; identifying sensitive attribute elements corresponding to each layer of data in the hierarchical data group; calculating the temperature adaptation values of the mold of the optical module to be processed under different heating methods based on the sensitive attribute elements; analyzing the internal heat transfer curve corresponding to the mold of the optical module to be processed based on the temperature adaptation values; extracting key temperature nodes from the internal heat transfer curve; and constructing the heating application scenario corresponding to the mold of the optical module to be processed based on the key temperature nodes.

[0076] Among them, the hierarchical data group refers to a set of hierarchical structured data formed by carefully dividing material property data according to criteria such as different property categories, influence degrees, or data sources. For example, it can be stratified by major categories such as thermophysical properties and mechanical properties. Under thermophysical properties, it is further subdivided into minor categories such as thermal conductivity and specific heat capacity. Each minor category contains corresponding data, which together constitute the hierarchical data group; the sensitive attribute element refers to the characteristic element represented by the key data in the hierarchical data group that is extremely sensitive to temperature changes and the heating process and can significantly affect the mold performance, molding quality, and the effects of heating and separation operations; the temperature adaptation value refers to the quantified value of the ideal temperature range and change rate that the optical module mold to be processed can withstand and adapt to under different heating methods such as conduction heating, radiation heating, and convection heating, in combination with material properties, through a specific algorithm or model; the internal heat transfer curve refers to a curve plotted with time as the horizontal axis and the temperature difference or heat transfer rate between different positions inside the mold as the vertical axis; the key temperature node refers to the temperature value corresponding to a special time point in the internal heat transfer curve that corresponds to key physical changes in the mold (such as the start of material phase change, sudden change in thermal stress, etc.), has a significant impact on the molding quality, or marks the conversion of the heating stage.

[0077] Furthermore, the hierarchical analysis of the material property data can be achieved through a classification method based on data characteristics. For example, by classifying and stratifying according to characteristics such as the physical meaning of the material property data and the influence degree on the heating process, the hierarchical data group can be obtained; the identification of the sensitive attribute elements corresponding to the data in each layer of the hierarchical data group can be achieved through the principal component analysis method. For example, the principal component analysis method can help find the principal components that contribute more to the data variance, and the material property elements corresponding to these principal components can be used as sensitive attribute elements; the calculation of the temperature adaptation value of the optical module mold to be processed under different heating methods can be achieved through the following calculation formula; the analysis of the internal heat transfer curve corresponding to the optical module mold to be processed can be achieved through the finite volume method. For example, the optical module mold to be processed is divided into multiple control volumes, and the finite volume method is used to calculate the temperature changes in each control volume, and then the internal heat transfer curve of the entire mold can be obtained; the extraction of the key temperature nodes in the internal heat transfer curve can be achieved through the peak detection algorithm. For example, when the material reaches the melting point in the heat transfer curve, the temperature will remain unchanged temporarily, forming a plateau, and the peak detection algorithm can be used to find the temperature value corresponding to this plateau, which is the key temperature node; the construction of the heating application scenario corresponding to the optical module mold to be processed can be achieved through optimization algorithms. For example, algorithms such as genetic algorithms and particle swarm optimization algorithms.

[0078] As an embodiment of the present invention, calculating the temperature adaptation value of the optical module mold to be processed under different heating methods based on the sensitive attribute elements includes:

[0079] Calculating the temperature adaptation value of the optical module mold to be processed under different heating methods by using the following formula:

[0080]

[0081] Wherein, TA represents the temperature adaptation value of the optical module mold to be processed under different heating methods, n represents the number of elements corresponding to the sensitive attribute elements, i represents the quantity index corresponding to the sensitive attribute elements, represents the standard value of the i-th sensitive attribute element under a specific heating method, represents the measured value of the i-th sensitive attribute element during the actual heating process, represents the measurement error value of the i-th sensitive attribute element, t represents the heating time, represents the number of heating methods corresponding to different heating methods, j represents the quantity index corresponding to different heating methods, represents the heating power value corresponding to the j-th heating method, represents the temperature state ratio corresponding to the j-th heating method.

[0082] Specifically, the temperature adaptation value is a comprehensive consideration index used to evaluate the adaptability and tolerance of the optical module mold to be processed to temperature changes under different heating methods, as well as the impact of this adaptability on the mold performance and the molding quality of the optical module. It synthesizes the performance of various sensitive attribute elements of the mold material under different heating conditions and is a quantitative value that can reflect the overall temperature adaptability of the mold; the standard value refers to the ideal numerical range or specific value determined based on a large amount of experimental data, theoretical research, and industry experience, etc., for each sensitive attribute element under a specific heating method. It represents the target value that the sensitive attribute element should possess in order to enable the mold to achieve the best performance and the molding quality of the optical module under this heating method; the measurement error value refers to the deviation degree between the measurement result and the true value during the actual measurement of the sensitive attribute element due to reasons such as the accuracy limitation of the measuring instrument, the interference of the measurement environment (such as temperature fluctuations, electromagnetic interference, etc.), and operation factors, etc.; the heating time refers to the time length experienced from the start of the heating operation on the optical module mold to reaching a certain specific heating stage (such as the mold reaching the preset molding temperature, completing a certain heat treatment process step, etc.) or the end of the entire heating process; the heating power value refers to the power magnitude of the heating device providing heat to the optical module mold under a specific heating method. It determines the amount of energy input into the mold per unit time and directly affects the heating rate, temperature uniformity, and the final temperature level of the mold, etc. Different heating methods (such as resistance heating, induction heating, infrared heating, etc.) can have different heating power values; the temperature state ratio refers to the ratio of the time when the mold is in different temperature ranges or temperature states to the total heating time under a certain heating method. It is used to describe the relative duration distribution of each temperature stage during the entire heating process of the mold and can reflect the temperature change rhythm of the heating process and the influence weight of different temperature stages on the temperature adaptability of the mold.

[0083] According to the heating application scenario, the present invention configures the heating power parameters of the upper and lower modules corresponding to the optical module mold to be processed, which can ensure that the heating rhythms of the upper and lower modules are adapted, accurately reduce the temperature difference, greatly reduce the risk of uneven thermal stress, avoid structural defects in the optical module after molding, and ensure the stability of optical and electrical performance.

[0084] Among them, the upper and lower modules refer to two key parts in the hot shaping optical module mold structure that cooperate with each other to achieve hot pressing forming of the optical module components. The upper module is usually located above, responsible for applying a certain pressure and coordinating heat transfer. The lower module is located at the bottom, playing a role in supporting and jointly constructing a closed hot shaping space with the upper module. The two are closely fitted and linked to ensure that the optical module is precisely formed under precise thermal environment and pressure conditions. The heating power parameter refers to the energy supply index set to drive the upper and lower modules to achieve the expected heating effect, specifically covering the electric power value provided to each module per unit time, which is determined in detail based on material characteristics and heating application scenarios. For example, for mold materials with low thermal conductivity, a relatively high heating power can be configured to ensure that the module is heated to the appropriate temperature range within the specified time, so as to precisely control the hot shaping process. Optionally, configuring the heating power parameters of the upper and lower modules corresponding to the optical module mold to be processed can be achieved through finite element analysis tools, such as tools like ANSYS and COMSOL.

[0085] Furthermore, based on the heating power parameter, the present invention constructs a synchronous heating simulation environment corresponding to the optical module mold to be processed, which can predict in advance the temperature distribution during the heating process. Through simulation, the heating trajectories of the upper and lower modules at different powers can be visually seen, which helps to optimize the setting of the heating power parameter and avoid temperature non-uniformity caused by improper power in actual operation.

[0086] Among them, the synchronous heating simulation environment refers to a virtual environment constructed by simulation means for simulating the synchronous heating process of the optical module mold to be processed under the given heating power parameter. This environment considers various factors such as the material properties, geometric shape, heat conduction characteristics, and boundary conditions of the mold, and can real-time simulate the temperature changes of each part of the mold during the heating process, as well as the transfer and distribution of temperature inside the mold.

[0087] As an embodiment of the present invention, constructing the synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameter includes: performing spectral analysis on the heating power parameter to obtain power spectral data; performing filtering processing on the power spectral data to obtain filtered spectral data; performing feature extraction on the filtered spectral data to obtain spectral feature vectors; setting the initial heating conditions corresponding to the optical module mold to be processed based on the spectral feature vectors; and constructing the synchronous heating simulation environment corresponding to the optical module mold to be processed based on the initial heating conditions.

[0088] Among them, the power spectrum data refers to the result obtained by performing spectrum analysis on the heating power parameter, which shows the distribution of the heating power at different frequencies. Specifically, the signal of the heating power changing with time is converted into a frequency-domain representation through methods such as Fourier transform, which contains information such as various frequency components and their corresponding power amplitudes; the filtered spectrum data refers to the spectrum data obtained after filtering the power spectrum data. The purpose of the filtering process is to remove noise or unwanted frequency components in the power spectrum data, so that the obtained data can better reflect the key information and main characteristics during the mold heating process; the spectrum feature vector refers to a vector composed of key features extracted from the filtered spectrum data that can characterize the mold heating characteristics. These features can include main frequency components, spectrum peak positions, spectrum bandwidths, power spectral densities, etc.; the initial heating condition refers to the temperature state of the optical module mold to be processed at the beginning of the synchronous heating simulation environment set based on the spectrum feature vector, which covers factors such as the thermal inertia of the mold. A suitable initial temperature is determined according to the mold heating characteristics reflected by the spectrum feature vector to more accurately simulate the actual heating process of the mold.

[0089] Furthermore, the spectrum analysis of the heating power parameter can be achieved through the fast Fourier transform method. For example, it can convert the heating power parameter signal in the time domain into power spectrum data in the frequency domain; the filtering process of the power spectrum data can be achieved through filtering algorithms. For example, algorithms such as median filtering and low-pass filtering; the feature extraction of the filtered spectrum data can be achieved through feature extraction models. For example, models such as Word2Vec and GloVe; the setting of the initial heating condition corresponding to the optical module mold to be processed can be achieved through a regression analysis model. For example, models such as linear regression models and neural networks; the construction of the synchronous heating simulation environment corresponding to the optical module mold to be processed can be achieved through environment construction tools. For example, tools such as ABAQUS and OpenFOAM.

[0090] S2. Analyze the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment, query the heating rate parameter in the temperature change data, and calculate the temperature equilibrium degree of the upper and lower modules during the heating process based on the heating rate parameter.

[0091] By analyzing the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment, the present invention can intuitively understand the dynamic process of the upper and lower modules heating, accurately grasp the rate and trend of temperature rise, timely discover possible temperature differences, and take measures in advance to avoid thermal stress problems caused by temperature differences.

[0092] Among them, the temperature change data refers to the detailed information covering the temperatures of the upper and lower modules within each temperature stage, including quantitative indicators such as the starting temperature, the ending temperature, the heating rate, the temperature fluctuation range, etc., as well as the temperature connection and change conditions between different stages.

[0093] As an embodiment of the present invention, analyzing the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment includes: discretizing the data in the synchronous heating simulation environment to obtain a discrete temperature sequence; performing trend fitting on the discrete temperature sequence to obtain a temperature trend curve; identifying temperature mutation points in the temperature trend curve; dividing the temperature stages corresponding to the upper and lower modules based on the temperature mutation points; and analyzing the temperature change data corresponding to the temperature stages.

[0094] Among them, the discrete temperature sequence refers to the temperature data of the upper and lower modules continuously recorded in the synchronous heating simulation environment, which is extracted according to a specific time interval or sampling rule to form a set of discrete and time-ordered temperature values; the temperature trend curve refers to a smooth curve with time as the horizontal axis, which outlines the general trend of temperature by applying a fitting algorithm (such as least squares fitting of a straight line or a polynomial curve) to the discrete temperature sequence; the temperature mutation points refer to the special points on the temperature trend curve where the slope suddenly changes greatly, the temperature value jumps sharply, and deviates from the normal change range of adjacent points. These points usually indicate abnormal situations during the heating process, such as instantaneous fluctuations in heating power, sudden changes in the heat conduction characteristics of the mold material, etc.; the temperature stage refers to the different time periods into which the entire heating process of the upper and lower modules is divided based on the temperature mutation points, and the temperature changes within each stage show relatively unified characteristics, such as the initial slow heating stage, the stable and rapid heating stage, the fine-tuning stage near the target temperature, etc.

[0095] Furthermore, the discretization of the data in the synchronous heating simulation environment can be achieved by the equidistant sampling method. For example, set to record the temperature values of the upper and lower modules every 10 seconds, so that the continuous temperature data in the simulation process is converted into a series of discrete data sequences; the trend fitting of the discrete temperature sequence can be achieved by a trend fitting algorithm, such as linear fitting, polynomial fitting, etc.; the identification of the temperature mutation points in the temperature trend curve can be achieved by the sliding window method, such as calculating the standard deviation within each window and marking it as a mutation point when it exceeds the threshold; the division of the temperature stages corresponding to the upper and lower modules can be achieved by a clustering algorithm, such as the K-means, DBSCAN, etc. algorithms; the analysis of the temperature change data corresponding to the temperature stages can be achieved by a data analysis tool, such as Python, R language, etc. tools.

[0096] By querying the heating rate parameter in the temperature change data, the present invention helps to precisely control the heating process of the optical module mold, adjusts the heating power according to the accurate heating rate, and avoids affecting the molding quality of the precision components in the mold due to too fast or too slow heating.

[0097] Among them, the heating rate parameter refers to the value of the mold temperature increase per unit time during the heating process of the optical module mold, usually expressed in the form of °C / min, etc., which reflects the speed of the mold temperature rise. Optionally, querying the heating rate parameter in the temperature change data can be achieved through parameter query tools, such as tools like Origin, SigmaPlot, etc.

[0098] Furthermore, based on the heating rate parameter, the present invention calculates the temperature equilibrium degree of the upper and lower modules during the heating process, can monitor the temperature difference change between the upper and lower modules in real time, accurately control the overall heat distribution of the mold, avoid local overheating or overcooling, ensure the structural stability of the optical module mold, and reduce deformation caused by uneven thermal stress.

[0099] Among them, the temperature equilibrium degree is a comprehensive index used to measure the corresponding uniformity of the temperature distribution of the upper and lower modules during the heating process. It is calculated by considering the differences in the heating rates of the upper and lower modules at multiple temperature sampling points and combining the influencing factors and their weights of the heating rate parameter. The smaller this value, the better the temperature equilibrium of the upper and lower modules during the heating process, and vice versa.

[0100] As an embodiment of the present invention, calculating the temperature equilibrium degree of the upper and lower modules during the heating process based on the heating rate parameter includes:

[0101] Use the following formula to calculate the temperature equilibrium degree of the upper and lower modules during the heating process:

[0102]

[0103] Among them, TE represents the temperature equilibrium degree of the upper and lower modules during the heating process, q represents the total number of temperature sampling points corresponding during the heating process, k represents the number index corresponding to the temperature sampling point, represents the heating rate corresponding to the upper module at the kth sampling point, represents the heating rate of the lower module at the kth sampling point, c represents the number of influencing factors corresponding to the heating rate parameter, v represents the number index corresponding to the influencing factor, represents the factor weight value corresponding to the vth influencing factor.

[0104] Specifically, the temperature sampling points refer to specific moments or position points selected during the heating-up process for measuring and recording temperatures. These points are usually selected at regular time intervals or set at key parts of the mold to comprehensively and accurately reflect the temperature changes during the entire heating-up process. The heating rate refers to the value of the temperature increase per unit time, which reflects the speed of the object's temperature rise. For the upper and lower modules, the heating rate is the speed at which the temperature of the upper module or the lower module changes with time at specific temperature sampling points. The influencing factors refer to various factors that can affect the heating rates of the upper and lower modules and thus affect the temperature equilibrium. These factors can include the material properties of the mold (such as thermal conductivity, specific heat capacity, etc.), the structural design of the mold (such as the thickness and shape of the upper and lower modules), the heating method (such as the position and power distribution of the heat source), and the surrounding environmental conditions (such as air flow and heat dissipation). The factor weight value refers to the value assigned to reflect the degree of influence of each influencing factor on the temperature equilibrium. The larger the weight value, the more significant the influence of the influencing factor on the temperature equilibrium, and vice versa.

[0105] S3. Based on the temperature equilibrium, analyze the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions, and based on the synchronous heating effect, query the thermal stress change situation of the optical module mold to be processed during the test.

[0106] Based on the temperature equilibrium, the present invention analyzes the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions, can accurately control the heating consistency of the mold under various initial temperature differences, ensure the stable forming quality of the optical module, can predict in advance the influence of different initial temperature differences on the heating effect, provide a basis for optimizing the heating process, and reduce the mold damage and product defects caused by temperature differences.

[0107] Among them, different initial temperature difference conditions refer to the temperature difference situations of the upper and lower modules or different parts of the optical module mold to be processed at the beginning of heating. These differences can be various different numerical combinations. For example, the initial temperature of the upper module is 20°C and the initial temperature of the lower module is 25°C. This is an initial temperature difference condition; or the initial temperature of the center part of the mold is 30°C and the initial temperature of the edge part is 28°C. This is also a different initial temperature difference condition. The synchronous heating effect refers to the synchronous degree and consistency performance of the temperature rise of each part of the mold (such as the upper and lower modules or different regions) during the heating process, which includes aspects such as whether the temperature rise rates are similar, whether the times to reach the target temperature are basically the same, and the change situation of the temperature difference between each part during the heating process. Optionally, analyzing the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions can be achieved by multiple sets of comparative experiments. For example, by comparing the times when each part reaches the same target temperature under different initial temperature difference conditions, the change curves of the temperature difference during the heating process, etc., to analyze the synchronous heating effect.

[0108] Furthermore, based on the synchronous heating effect, the present invention queries the thermal stress change situation of the optical module mold to be processed during the test, can accurately control the thermal stress distribution caused by uneven heating of the mold, timely discover potential stress concentration points, prevent mold deformation and damage, optimize the heating strategy according to the thermal stress change, improve the service life and stability of the mold, and ensure the production quality of the optical module.

[0109] Among them, the thermal stress change situation refers to the change of the magnitude and direction of the thermal stress of each part of the optical module mold to be processed with time during the test heating stage. Through the conversion and analysis of the temperature strain data set, the distribution of the thermal stress at different times and different positions can be obtained, and the stress concentration points and their change trends can be clarified.

[0110] As an embodiment of the present invention, querying the thermal stress change situation of the optical module mold to be processed during the test based on the synchronous heating effect includes: quantitatively evaluating the synchronous heating effect to obtain a heating quantization index; dividing the temperature-sensitive area corresponding to the optical module mold to be processed based on the heating quantization index; arranging strain gauges in the temperature-sensitive area to obtain a strain gauge arrangement plan; collecting the temperature strain data set in the strain gauge arrangement plan; and querying the thermal stress change situation of the optical module mold to be processed during the test based on the temperature strain data set.

[0111] Among them, the temperature increase quantification index refers to the digital representation of the synchronous temperature increase effect, which is calculated by comprehensively considering factors such as temperature difference and temperature increase rate difference. For example, calculating the standard deviation of the temperature increase rates at different positions, or the sum of the absolute values of the temperature differences between each position and the average temperature at a specific time point, etc.; the temperature-sensitive area refers to the area on the optical module mold to be processed that is significantly responsive to temperature changes, usually at the uneven temperature increase locations, such as where the temperature gradient is large and the temperature increase rate difference is obvious, like the corners of the mold, the combined parts of different materials, etc.; the strain gauge layout plan refers to the specific plan for reasonably arranging strain gauges within the temperature-sensitive area, which determines the number, position, and pasting direction of the strain gauges. For example, at the stress concentration points or key connection parts in the temperature-sensitive area, the strain gauges are pasted along the main stress direction to ensure accurate measurement of the mold deformation caused by temperature changes; the temperature-strain data set refers to the set of strain data collected by the strain gauges during the mold test, which changes with temperature. These data reflect the small deformations generated in the temperature-sensitive area due to temperature changes, covering the strain values of the strain gauges at different times and positions.

[0112] Furthermore, the quantitative evaluation of the synchronous temperature increase effect can be achieved through a quantitative evaluation tool, such as the built-in functions AVERAGE, STDEV, etc. in Excel; the division of the temperature-sensitive area corresponding to the optical module mold to be processed can be achieved through a method based on temperature gradient, such as measuring the temperatures at different positions of the mold and calculating the temperature differences between adjacent positions. The areas with larger temperature differences are often the temperature-sensitive areas; the arrangement of strain gauges in the temperature-sensitive area can be achieved through the equal-spacing arrangement method. For example, when the overall strain situation of the temperature-sensitive area is required, the method of arranging strain gauges at equal intervals can be adopted; the collection of the temperature-strain data set in the strain gauge layout plan can be achieved through the multi-round collection method. For example, each time the temperature is raised to the same termination temperature, the data of the strain gauges are collected, and a more comprehensive temperature-strain data set can be obtained under different initial conditions; the query of the thermal stress change situation of the optical module mold to be processed during the test can be achieved through a finite element analysis tool, such as tools like ANSYS, ABAQUS, etc.

[0113] S4. Based on the thermal stress change situation, adjust the separation guiding device corresponding to the upper and lower modules. Based on the adjusted separation guiding device, query the interference factors during the synchronous temperature increase and separation of the upper and lower modules. Based on the interference factors, plan the operation process of the synchronous temperature increase and separation corresponding to the upper and lower modules.

[0114] Based on the thermal stress change situation, the present invention adjusts the separation guiding device corresponding to the upper and lower modules, enabling the performance of the separation guiding device to match the thermal stress condition, avoiding device deformation or damage caused by thermal stress, helping to optimize the separation process of the upper and lower modules, reducing jamming or deviation phenomena caused by uneven thermal stress, and improving the accuracy and efficiency of separation.

[0115] Among them, the separation guiding device refers to a key component in the optical module mold, usually composed of guide posts, guide sleeves, and related positioning structures. After the optical module is produced, the upper and lower modules need to be separated to take out the product. The role of the separation guiding device is to provide a precise guiding path for the relative movement of the upper and lower modules during the module separation process, ensuring that they smoothly separate along a predetermined trajectory. Optionally, the adjustment of the separation guiding device corresponding to the upper and lower modules can be achieved through a genetic algorithm. For example, through the iterative process of the genetic algorithm, the optimal design scheme is searched to obtain a separation guiding device adapted to the thermal stress change.

[0116] Furthermore, based on the adjusted separation guiding device, the present invention queries the interference factors during the synchronous heating and separation process of the upper and lower modules, enabling potential problems to be detected in advance, such as the collision risk or guiding deviation caused by the difference in thermal expansion, thereby avoiding failures in actual production and reducing the scrap rate.

[0117] Among them, the interference factors refer to all elements that can have a negative impact on the process and results of adjusting the separation guiding device of the upper and lower modules based on the thermal stress change situation, covering temperature, humidity fluctuations, and impurity mixing at the environmental level, the non-uniformity of the mold material properties, dimensional and installation errors occurring during the manufacturing process, changes in material properties caused by thermal cycling, and vibrations of external equipment. Optionally, the query of the interference factors during the synchronous heating and separation process of the upper and lower modules can be achieved through non-destructive testing equipment. For example, tools such as ultrasonic flaw detectors and X-ray detectors.

[0118] Furthermore, based on the interference factors, the present invention plans the operation process for the synchronous heating and separation of the upper and lower modules, enabling risks to be avoided in advance. By considering interference factors such as temperature fluctuations and non-uniform material properties, more targeted measures can be formulated to avoid problems such as collisions and jamming during the operation process, thereby reducing equipment damage and production delays.

[0119] Among them, the operation process refers to a set of detailed operation steps and specifications for the synchronous heating and separation of the upper and lower modules based on the optimizable links, which clarifies each action, each parameter setting, and the operation sequence from the start of heating to the final separation of the modules.

[0120] As an embodiment of the present invention, the operation process of planning the corresponding synchronous heating and separation of the upper and lower modules based on the interference factors includes: querying the source of the factors corresponding to the interference factors; identifying the existing operation characteristics corresponding to the upper and lower modules based on the source of the factors; marking the key operation identifiers corresponding to the existing operation characteristics; analyzing the optimizable links corresponding to the key operation identifiers; and planning the operation process of the corresponding synchronous heating and separation of the upper and lower modules based on the optimizable links.

[0121] Among them, the source of the factors refers to the origin of various factors that interfere with the synchronous heating and separation process of the upper and lower modules, which can cover multiple aspects. For example, equipment failures are due to equipment aging and improper maintenance; environmental factors may come from unstable temperature and humidity in the workshop and strong electromagnetic interference around; material property differences may be due to different raw material batches and lax quality control, etc.; the existing operation characteristics refer to the characteristics and manifestation forms presented in the current synchronous heating and separation operation of the upper and lower modules. For example, the heating rate, heating method, mechanical action characteristics during separation, and contact state between modules, etc.; the key operation identifiers refer to the marks made on those parts of the existing operation characteristics that have a greater impact on the synchronous heating and separation process and are more critical. These identifiers can be specific operation steps, operation parameters, or operation actions, etc. For example, a certain key temperature control point during the heating process, a specific mechanical movement trajectory during separation, etc.; the optimizable links refer to the operation steps or process parts that can be improved and enhanced by in-depth analysis of the key operation identifiers. For example, if it is found that the heating rate is too fast resulting in uneven thermal stress, then adjusting the heating rate is an optimizable link; or if it is found that there is a jam in the mechanical action during separation, optimizing the mechanical structure or adjusting the operation method is an optimizable link.

[0122] Further, the querying of the source of the factors corresponding to the interference factors can be achieved through an association rule mining algorithm. For example, the FP-Growth algorithm is used to mine the association relationships between different variables in the data, and find those factors that are closely related to the interference phenomenon to determine the source of the factors; the identification of the existing operation characteristics corresponding to the upper and lower modules can be achieved through a feature recognition tool. For example, tools such as Splunk and ELK Stack; the marking of the key operation identifiers corresponding to the existing operation characteristics can be achieved through a rule engine tool. For example, tools such as Drools and CLIPS; the analysis of the optimizable links corresponding to the key operation identifiers can be achieved through a particle swarm optimization algorithm. For example, the particle swarm optimization algorithm is used to continuously adjust the positions of the particles to search for the optimal parameter combination to determine the optimizable links; the planning of the operation process of the corresponding synchronous heating and separation of the upper and lower modules can be achieved through a process planning tool. For example, tools such as Visio and VSM.

[0123] S5. Based on the above operation process, construct a synchronous control system for the temperature rise and separation of the to-be-processed optical module mold. Based on this synchronous control system, monitor the synchronous control status corresponding to the to-be-processed optical module mold, and analyze the control execution data in this synchronous control status. Based on the control execution data, formulate a mold maintenance plan for the temperature rise and separation of the to-be-processed optical module mold.

[0124] Based on the above operation process, the present invention constructs a synchronous control system for the temperature rise and separation of the to-be-processed optical module mold, which can ensure the accuracy and stability of the temperature rise and separation operations. It is strictly executed according to the planned operation process, which can effectively improve production efficiency. By synchronously controlling each link, unnecessary waiting time and error correction time are reduced, making the entire production process smoother.

[0125] Among them, the synchronous control system refers to a comprehensive system integrating hardware devices, control algorithms, and software programs, aiming to precisely and coordinately control the temperature rise and separation processes of the to-be-processed optical module mold according to the synchronous set value. This system uses sensors to continuously monitor the actual values of key parameters, compares them with the synchronous set value, and then the controller adjusts the actions of the actuators according to the preset control algorithm to ensure that the temperature rise and separation operations always maintain the best synchronous state.

[0126] As an embodiment of the present invention, constructing the synchronous control system for the temperature rise and separation of the to-be-processed optical module mold based on the above operation process includes: determining various key parameters in the temperature rise and separation operations of the to-be-processed optical module mold; sorting out the corresponding mutual influence relationships between these key parameters; collecting the initial synchronous data corresponding to the to-be-processed optical module mold; determining the synchronous set value corresponding to the to-be-processed optical module mold according to the mutual influence relationships and the initial synchronous data; and constructing the synchronous control system for the temperature rise and separation of the to-be-processed optical module mold based on the synchronous set value.

[0127] Among them, the key parameters refer to the variables that play a decisive role in the stability, accuracy and product quality of the whole process during the heating and separation operations of the optical module mold to be processed, such as heating power, heating rate, target temperature in the heating stage; separation speed, separation force, relative displacement between modules in the separation stage; the mutual influence relationship refers to the internal connection of interaction and mutual restriction between the key parameters, such as the size of the heating power will affect the heating rate, and the heating rate will affect the thermal stress distribution inside the mold, thereby affecting the separation force required for separation; too fast a separation speed may cause vibration of the mold, which in turn affects the temperature uniformity during the heating process; the initial The step data refers to the basic data related to the heating and separation of the optical module mold to be processed, which is collected before the construction of the synchronous control system, including the initial temperature distribution of the mold, the initial position of each component, the current operating status of the equipment, etc.; the synchronization setting value refers to the target value used to guide the synchronization of heating and separation operations based on the mutual influence relationship between various key parameters and the initial synchronization data. For example, according to the initial temperature of the mold, the expected heating rate and the optimal temperature conditions required for separation, the heating power setting values ​​at different stages of the heating process are determined; combined with the mold structure and material properties, as well as the initial position data, the optimal separation speed and separation force setting values ​​during separation are determined.

[0128] Furthermore, the determination of the key parameters in the heating and separation operations of the optical module mold to be processed can be achieved through an experimental design method, such as: using the response surface method (RSM) to conduct experiments to obtain the key parameters; the sorting out of the corresponding mutual influence relationships between the key parameters can be achieved through a structural equation model, such as: (and examples of the methods, tools or algorithms that can be implemented therein are given, and it is important to remember that the mutual influence relationships are finally obtained); the collection of the initial synchronization data corresponding to the optical module mold to be processed can be achieved through a sensor network, such as: using temperature sensors and pressure sensors for real-time data collection to obtain initial synchronization data; the determination of the synchronization set value corresponding to the optical module mold to be processed can be achieved through an optimization algorithm, such as: using a genetic algorithm (GA) to optimize parameters to obtain the synchronization set value; the construction of a synchronization control system corresponding to the heating and separation of the optical module mold to be processed can be achieved through a PID control algorithm, such as: using a PID controller to design a control strategy to obtain a synchronization control system.

[0129] The present invention is based on the synchronous control system, monitors the synchronous control state corresponding to the optical module mold to be processed, and analyzes the control execution data under the synchronous control state, so as to timely discover abnormal conditions in the control process, such as the heating rate deviating from the set value or the separation action being uncoordinated, so as to make rapid adjustments and ensure the accuracy and stability of mold processing.

[0130] Among them, the synchronous control state refers to the real-time working situation presented by the mutual cooperation and coordinated operation of various links in the process of heating up and separating the optical module mold to be processed according to the setting of the synchronous control system. It covers whether the current heating rate of the mold meets expectations, whether the temperature is stable in the set range, and whether the speed, force, displacement, etc. of the separation action are accurately matched with the heating process. For example, when the temperature rises to a specific stage, whether the separation device can be started at the predetermined time and method, and whether the dynamic changes of various parameters in the whole process are within the controllable range, all of which reflect the synchronous control state; the control execution data refers to the various sensors and execution data generated when the synchronous control system is running. The actual working data fed back by the actuator include the real-time temperature value of the mold collected by the temperature sensor, the pressure applied during the separation process measured by the pressure sensor, the module movement distance and speed recorded by the displacement sensor, etc. At the same time, it also involves the actual action response data after the actuator receives the control instruction, such as the actual power output of the heating element, the speed change of the drive motor, etc. Optionally, the monitoring of the synchronous control state corresponding to the optical module mold to be processed can be achieved through a state monitoring tool, such as: SPSS, MATLAB and other tools; the analysis of the control execution data under the synchronous control state can be achieved through a data analysis tool, such as: SAS, R language and other tools.

[0131] Furthermore, based on the control execution data, the present invention formulates a mold maintenance plan corresponding to the heating and separation of the optical module mold to be processed, which can accurately locate the abnormal parts of the mold during the heating and separation links, and carry out targeted maintenance work according to the actual wear and aging degree, etc., to avoid excessive maintenance or insufficient maintenance. This not only extends the service life of the mold and reduces the replacement frequency, but also ensures the continuity of production, thereby reducing the downtime caused by mold failure.

[0132] Among them, the mold maintenance plan refers to a comprehensive plan formulated to ensure the long-term stable and efficient operation of the optical module mold to be processed. The plan covers aspects such as daily inspection, regular maintenance, fault repair, and replacement strategies for key components of the mold. The plan formulated based on the control execution data will clarify the specific content and time nodes of maintenance according to the actual performance of the mold during the heating and separation process. For example, for heating areas where high temperature abnormalities frequently occur, more frequent temperature sensor calibration and heating element inspection are arranged; if there is a jam in the separation link, determine whether the guide device needs to be lubricated or the worn parts need to be replaced based on relevant force data. Optionally, the mold maintenance plan corresponding to the heating and separation of the optical module mold to be processed can be achieved through a plan generation tool, such as: AutoCAD, SolidWorks and other tools.

[0133] Compared with the problems described in the background art, the present invention can accurately plan the processing technology by obtaining the material property data corresponding to the optical module mold to be processed, select appropriate cutting, grinding and other methods according to the properties of the material such as hardness and toughness, and improve the production efficiency. Secondly, it helps to optimize the mold design. Understanding the coefficient of thermal expansion of the material can avoid problems such as deformation caused by temperature changes and improve the mold quality. By analyzing the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment, the present invention can intuitively understand the dynamic process of the upper and lower modules heating up, accurately grasp the rate and trend of temperature rise, timely discover possible temperature differences, and take measures in advance to avoid thermal stress problems caused by temperature differences. Further, based on the temperature balance degree, the present invention analyzes the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions, can accurately control the heating consistency of the mold under various initial temperature differences, ensure the stable forming quality of the optical module, can predict in advance the influence of different initial temperature differences on the heating effect, provide a basis for optimizing the heating process, and reduce mold damage and product defects caused by temperature differences. Further, based on the change of thermal stress, the present invention adjusts the separation guiding device corresponding to the upper and lower modules, can make the performance of the separation guiding device match the thermal stress condition, avoid device deformation or damage caused by thermal stress, help to optimize the separation process of the upper and lower modules, reduce jamming or deviation phenomena caused by uneven thermal stress, and improve the accuracy and efficiency of separation. Finally, based on the operation process, the present invention constructs a synchronous control system for the heating and separation of the optical module mold to be processed, can ensure the accuracy and stability of the heating and separation operations, strictly execute according to the planned operation process, can effectively improve the production efficiency, reduce unnecessary waiting time and error correction time by synchronously controlling each link, and make the whole production process more smooth. Therefore, the method and system for synchronous heating and separation of the upper and lower modules of the thermoformed optical module mold provided by the embodiments of the present invention can improve the synchronous control quality of the thermoformed optical module mold.

[0134] Embodiment 2:

[0135] As Figure 2 shown, it is a functional module diagram of a system for synchronous heating and separation of the upper and lower modules of a thermoformed optical module mold of the present invention.

[0136] The synchronous heating and separation system 200 of the upper and lower modules of the hot shaping optical module mold according to the present invention can be installed in an electronic device. According to the functions achieved, the synchronous heating and separation system of the upper and lower modules of the hot shaping optical module mold can include an environment construction module 201, an equilibrium degree calculation module 202, a thermal stress calculation module 203, a process planning module 204, and a solution formulation module 205. The modules in the present invention can also be referred to as units, which refer to a series of computer program segments that can be executed by the processor of an electronic device and can complete fixed functions, and are stored in the memory of the electronic device.

[0137] In the embodiments of the present invention, the functions of each module / unit are as follows:

[0138] The environment construction module 201 is configured to obtain the material property data corresponding to the optical module mold to be processed, analyze the heating application scenario corresponding to the optical module mold to be processed based on the material property data, configure the heating power parameters of the upper and lower modules corresponding to the optical module mold to be processed according to the heating application scenario, and construct a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameters;

[0139] The equilibrium degree calculation module 202 is configured to analyze the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment, query the heating rate parameters in the temperature change data, and calculate the temperature equilibrium degree of the upper and lower modules during the heating process based on the heating rate parameters;

[0140] The thermal stress calculation module 203 is configured to analyze the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions based on the temperature equilibrium degree, and query the thermal stress change situation of the optical module mold to be processed during the test based on the synchronous heating effect;

[0141] The process planning module 204 is configured to adjust the separation guiding device corresponding to the upper and lower modules based on the thermal stress change situation, query the interference factors of the upper and lower modules during the synchronous heating and separation process based on the adjusted separation guiding device, and plan the operation process of the synchronous heating and separation of the upper and lower modules based on the interference factors;

[0142] The solution formulation module 205 is configured to construct a synchronous control system for the heating and separation of the optical module mold to be processed based on the operation process, monitor the synchronous control state corresponding to the optical module mold to be processed based on the synchronous control system, analyze the control execution data in the synchronous control state, and formulate a mold maintenance plan for the heating and separation of the optical module mold to be processed based on the control execution data.

[0143] Specifically, when the modules in the upper and lower module synchronous heating and separation system 200 of the hot shaping optical module mold in the embodiments of the present invention are used, the same technical means as those in the Figure 1 hot shaping optical module mold upper and lower module synchronous heating and separation method described above are adopted, and the same technical effects can be produced, which will not be elaborated here.

[0144] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms.

[0145] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A method for synchronously heating and separating the upper and lower modules of a heat-shaping optical module mold, characterized in that: The method comprises: Obtain material property data corresponding to the optical module mold to be processed, analyze the heating application scenario corresponding to the optical module mold to be processed based on the material property data, configure heating power parameters of the upper and lower modules corresponding to the optical module mold to be processed according to the heating application scenario, and construct a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameters; Analyze the temperature change data corresponding to the upper and lower modules in the synchronous temperature rise simulation environment, query the temperature rise rate parameters in the temperature change data, and calculate the temperature balance of the upper and lower modules during the temperature rise process based on the temperature rise rate parameters; Based on the temperature balance, analyzing the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions, and based on the synchronous heating effect, querying the thermal stress change of the optical module mold to be processed during the test; Based on the change of the thermal stress, the separation guide device corresponding to the upper and lower modules is adjusted, based on the adjusted separation guide device, the interference factors of the upper and lower modules in the synchronous heating and separation process are queried, and based on the interference factors, the operation process corresponding to the synchronous heating and separation of the upper and lower modules is planned; Based on the operation process, a synchronous control system corresponding to the heating and separation of the optical module mold to be processed is constructed; based on the synchronous control system, the synchronous control state corresponding to the optical module mold to be processed is monitored, and the control execution data under the synchronous control state is analyzed; based on the control execution data, a mold maintenance plan corresponding to the heating and separation of the optical module mold to be processed is formulated.

2. The method for synchronously heating and separating the upper and lower modules of the heat-shaping optical module mold according to claim 1, characterized in that: The step of analyzing the heating application scenario corresponding to the optical module mold to be processed based on the material characteristic data includes: Performing hierarchical analysis on the material characteristic data to obtain a hierarchical data group; Identify sensitive attribute elements corresponding to each layer of data in the hierarchical data group; Based on the sensitive attribute elements, calculating the temperature adaptability value of the optical module mold to be processed under different heating methods; Based on the temperature adaptation value, analyzing the internal heat transfer curve corresponding to the optical module mold to be processed; extracting key temperature nodes in the internal heat transfer curve; Based on the key temperature nodes, a heating application scenario corresponding to the optical module mold to be processed is constructed.

3. The method for synchronously heating and separating the upper and lower modules of the heat-shaping optical module mold according to claim 2, characterized in that: The step of calculating the temperature adaptability value of the optical module mold to be processed under different heating modes based on the sensitive attribute element includes: The temperature adaptability value of the optical module mold to be processed under different heating methods is calculated using the following formula: in, Indicates the temperature adaptability value of the optical module mold to be processed under different heating methods. Indicates the number of elements corresponding to the sensitive attribute element, Indicates the quantity index corresponding to the sensitive attribute element, Indicates The standard value of a sensitive attribute element under a specific heating method, Indicates The measured value of each sensitive attribute element during the actual heating process, Indicates The measurement error value of sensitive attribute elements, Indicates the heating time. Indicates the number of methods corresponding to different heating methods, Indicates the quantity index corresponding to different heating methods. Indicates The heating power value corresponding to each heating mode is: Indicates The temperature state ratio corresponding to a heating method refers to the ratio of the time that the mold is in different temperature ranges or temperature states to the total heating time under a certain heating method. It is used to describe the relative duration distribution of each temperature stage during the entire heating process of the mold, and can reflect the temperature change rhythm of the heating process and the influence weight of different temperature stages on the temperature adaptability of the mold.

4. The method for synchronously heating and separating the upper and lower modules of the heat-shaping optical module mold according to claim 1, characterized in that: The step of constructing a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameter includes: Performing spectrum analysis on the heating power parameter to obtain power spectrum data; Performing filtering on the power spectrum data to obtain filtered spectrum data; Extracting features from the filtered spectrum data to obtain a spectrum feature vector; Based on the frequency spectrum feature vector, setting the initial temperature rise condition corresponding to the optical module mold to be processed; Based on the initial temperature rise condition, a synchronous temperature rise simulation environment corresponding to the optical module mold to be processed is constructed.

5. The method for synchronously heating and separating the upper and lower modules of the heat-shaping optical module mold according to claim 1, characterized in that: The analyzing the temperature change data corresponding to the upper and lower modules in the synchronous temperature rise simulation environment includes: Discretizing the data in the synchronous heating simulation environment to obtain a discrete temperature sequence; Performing trend fitting on the discrete temperature sequence to obtain a temperature trend curve; Identifying a temperature mutation point in the temperature trend curve; Based on the temperature mutation point, dividing the temperature stages corresponding to the upper and lower modules; The temperature variation data corresponding to the temperature stage is analyzed.

6. The method for synchronously heating and separating the upper and lower modules of the heat-shaping optical module mold according to claim 1, characterized in that: The calculating, based on the heating rate parameter, the temperature balance of the upper and lower modules during the heating process comprises: The temperature balance of the upper and lower modules during the heating process is calculated using the following formula: in, Indicates the temperature balance of the upper and lower modules during the heating process, Indicates the total number of temperature sampling points during the heating process. Indicates the quantity index corresponding to the temperature sampling point. Indicated in The corresponding heating rate of the upper module at each sampling point is: Indicated in The heating rate of the lower module at each sampling point is represents the number of factors influencing the heating rate parameter, Indicates the quantity index corresponding to the influencing factor, Indicates The factor weight value corresponding to each influencing factor.

7. The method for synchronously heating and separating the upper and lower modules of the heat-shaping optical module mold according to claim 1, characterized in that: The step of querying the thermal stress change of the optical module mold to be processed during the test based on the synchronous heating effect includes: Quantitatively evaluating the synchronous heating effect to obtain a quantitative heating index; Based on the temperature rise quantitative index, dividing the temperature sensitive area corresponding to the optical module mold to be processed; Arrange strain gauges in the temperature sensitive area to obtain a strain gauge arrangement scheme; collecting a temperature strain data set in the strain gauge arrangement scheme; Based on the temperature strain data set, the thermal stress change of the optical module mold to be processed during the test is queried.

8. The method for synchronously heating and separating the upper and lower modules of a heat-shaping optical module mold according to claim 1, characterized in that: The planning of the operation flow of synchronous heating and separation of the upper and lower modules based on the interference factors includes: Query the source of the interference factor; Based on the source of the factors, identifying existing operation features corresponding to the upper and lower modules; Marking the key operation identifier corresponding to the existing operation feature; Analyze the optimizable links corresponding to the key operation identifiers; Based on the optimizable links, the operational procedures for synchronous heating and separation of the upper and lower modules are planned.

9. The method for synchronously heating and separating the upper and lower modules of a heat-shaping optical module mold according to claim 1, characterized in that: Based on the operation process, a synchronous control system for heating and separating the optical module mold to be processed is constructed, including: Determine various key parameters in the heating and separation operations of the optical module mold to be processed; Sorting out the corresponding mutual influence relationships between the key parameters; Collecting initial synchronization data corresponding to the optical module mold to be processed; Determine a synchronization setting value corresponding to the optical module mold to be processed according to the mutual influence relationship and the initial synchronization data; Based on the synchronization setting value, a synchronization control system for corresponding heating and separation of the optical module mold to be processed is constructed.

10. A system for synchronously heating and separating the upper and lower modules of a heat-shaping optical module mold, characterized in that: The system comprises: An environment construction module is used to obtain material property data corresponding to the optical module mold to be processed, analyze the heating application scenario corresponding to the optical module mold to be processed based on the material property data, configure the heating power parameters of the upper and lower modules corresponding to the optical module mold to be processed according to the heating application scenario, and construct a synchronous heating simulation environment corresponding to the optical module mold to be processed based on the heating power parameters; A balance calculation module is used to analyze the temperature change data corresponding to the upper and lower modules in the synchronous heating simulation environment, query the heating rate parameters in the temperature change data, and calculate the temperature balance of the upper and lower modules during the heating process based on the heating rate parameters; A thermal stress calculation module, used to analyze the synchronous heating effect of the optical module mold to be processed under different initial temperature difference conditions based on the temperature balance, and query the thermal stress change of the optical module mold to be processed during the test based on the synchronous heating effect; A process planning module, used to adjust the separation guide device corresponding to the upper and lower modules based on the change of the thermal stress, query the interference factors of the upper and lower modules in the synchronous heating and separation process based on the adjusted separation guide device, and plan the operation process corresponding to the synchronous heating and separation of the upper and lower modules based on the interference factors; A plan formulation module is used to construct a synchronous control system for heating and separation of the optical module mold to be processed based on the operation process; based on the synchronous control system, monitor the synchronous control state of the optical module mold to be processed, and analyze the control execution data under the synchronous control state; based on the control execution data, formulate a mold maintenance plan for heating and separation of the optical module mold to be processed.

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