Large-substrate motion platform and photoetching equipment

Abstract

The invention relates to the technical field of semiconductors, and provides a large-substrate motion platform and photoetching equipment, and the large-substrate motion platform comprises a wafer bearing table assembly, a base and a vertical action assembly; the wafer bearing table assembly is arranged on the base, and the vertical acting assembly is used for applying acting force to the wafer bearing table assembly; the acting force comprises upward acting force and downward acting force; when the upward acting force is independently applied or the upward acting force and the downward acting force are simultaneously applied, the vertical acting assembly applies the acting force in a non-contact mode. Through the configuration, the upward acting force is used for compensating the gravity, the downward acting force can improve the rigidity of the wafer bearing table assembly, the stability of the wafer bearing table assembly in the rotating process is improved, and the service life of the bearing is prolonged. In addition, when downward acting force independently acts on the wafer bearing table assembly, locking of the wafer bearing table assembly at any rotation angle can be achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a motion platform and photolithography equipment for a large substrate. Background Art

[0002] The wafer exposure process uses light to project the pattern on the mask onto the photoresist through an optical system to achieve pattern transfer. The exposure process is one of the important processes in the photolithography process in integrated circuit manufacturing. During exposure, a moving platform is required to adsorb the substrate, such as a substrate or wafer.

[0003] The motion platform is a platform for substrate connection and bearing, and the wafer table in the motion platform is used to carry and adsorb the substrate. Based on the needs of practical applications, such as defect detection based on the substrate, position deviation compensation, etc., the wafer table is required to perform linear motion or rotational motion. When the wafer table rotates around its own central axis, due to the large mass of its rotating body, all gravity acts on the bearing. If the rotating body is overloaded, the bearing will be unevenly stressed during rotation, which may affect the service life of the bearing. In severe cases, it may even cause damage to the bearing and cause it to get stuck. Moreover, if the equipment loses power or loses power abnormally, the existing wafer table cannot stop the rotating body quickly. At this time, the wafer table rotates due to its inertia force, and there are large uncertainties. It may collide with other subsystems, which poses a great safety hazard.

[0004] Therefore, the present invention requires a large-substrate motion platform and lithography equipment, the motion platform is equipped with a vertical action component, and the vertical action component provides an upward force and a downward force to the wafer stage component, wherein the upward force is used to compensate for its gravity to reduce the force acting on the bearing, which is beneficial to improve the stability of the wafer stage component during rotation and extend the service life of the bearing; the downward force can increase the rigidity of the wafer stage component and further ensure the stability of the wafer stage. In addition, when the downward force acts on the wafer stage component alone, the wafer stage component can be adsorbed and locked, so that the wafer stage component can be mechanically locked at any rotation angle, and it can also ensure that when the equipment is powered off or abnormally powered off, the wafer stage component is quickly shut down to eliminate safety hazards. Summary of the invention

[0005] The invention provides a large-substrate motion platform and photolithography equipment, the motion platform is equipped with a vertical action component, and the vertical action component provides an upward force and a downward force to the wafer stage component, wherein the upward force is used to compensate for its gravity, so as to reduce the force acting on the bearing, which is beneficial to improve the stability of the wafer stage component during rotation and extend the service life of the bearing; the downward force can improve the rigidity of the wafer stage component and further ensure the stability of the wafer stage. In addition, when the downward force acts on the wafer stage component alone, the wafer stage component can be adsorbed and locked, so that the wafer stage component can be mechanically locked at any rotation angle, and it can also ensure that when the equipment is powered off or abnormally powered off, the wafer stage component is quickly shut down to eliminate safety hazards.

[0006] In the present invention, the motion platform of the large substrate comprises: a wafer stage assembly, a base and a vertical action assembly;

[0007] The wafer stage assembly is arranged on the base, and the vertical action assembly is used to apply an action force to the wafer stage assembly;

[0008] The acting force includes an upward acting force and a downward acting force; when the upward acting force is applied alone or the upward acting force and the downward acting force are applied simultaneously, the vertical acting component applies the acting force in a non-contact manner;

[0009] When the upward force and the downward force are applied simultaneously, the downward force is smaller than the upward force;

[0010] The downward force, when applied alone, is used to lock the wafer stage assembly to the base.

[0011] Optionally, the vertical action component includes an action member, which has an action end, and the action end is vertically opposite to the wafer support table assembly. The action end is provided with a first action part and a second action part, the first action part is used to provide an upward force to the wafer support table assembly, and the second action part is used to provide a downward force to the wafer support table assembly.

[0012] Optionally, a plurality of the first acting portions and the second acting portions are provided, and the first acting portions and the second acting portions are alternately arranged along the circumferential direction on the acting end.

[0013] Optionally, the acting member is annular, one axial end of the acting member serves as the acting end, and the first acting portion and the second acting portion are circumferentially arranged around a central axis of the acting member.

[0014] Optionally, the first action portion includes a first air hole opened at the action end, and the first air hole is used to let in or suck out gas to provide an upward air pressure force to the wafer support table assembly.

[0015] Optionally, the first air hole is used to allow positive pressure gas to be introduced to provide an upward air pressure force on the bottom of the wafer stage assembly.

[0016] Optionally, the first action portion further includes an action plane arranged at the action end, and the first air hole is opened on the action plane.

[0017] Optionally, it is characterized in that the second action portion includes a second air hole opened at the action end, and the second air hole is used for introducing or sucking out gas to provide a downward air pressure force on the wafer support table assembly.

[0018] Optionally, the second air hole is used to suck out gas to provide a downward air pressure force on the lower end of the wafer stage assembly.

[0019] Optionally, the second action portion further includes an adsorption groove opened at the action end, and the second air hole is opened at the bottom of the adsorption groove.

[0020] Optionally, when the first action portion includes an action plane, the action plane is higher than the bottom of the adsorption tank.

[0021] Optionally, an isolation structure is further provided at the acting end of the acting member, and the isolation structure is isolated between the adjacent first acting portion and the second acting portion.

[0022] Optionally, the isolation structure includes an isolation groove opened at the active end.

[0023] Optionally, the vertical action component includes a first magnetic attraction and a second magnetic attraction, one of the first magnetic attraction and the second magnetic attraction is arranged on the wafer support table assembly, and the other is arranged on the base, at least one of the first magnetic attraction and the second magnetic attraction has a changeable magnetic pole, and the first magnetic attraction and the second magnetic attraction are arranged vertically opposite each other.

[0024] Optionally, the action member is located below the wafer support table assembly, and the upper end of the action member serves as the action end, which is vertically opposite to the lower end of the wafer support table assembly.

[0025] Optionally, the wafer support table assembly includes a suction cup and a rotating seat, the rotating seat is installed on the base in a manner that it can rotate along its own central axis, and the rotating central axis of the rotating seat extends vertically; the suction cup is arranged on the rotating seat, and the upper end of the suction cup has an adsorption area for carrying and adsorbing the part to be adsorbed, and the vertical action component is used to apply the force to the rotating seat.

[0026] The present invention also provides a photolithography device, wherein the photolithography device is equipped with the motion platform of the large substrate described above.

[0027] In summary, the motion platform of the large substrate includes: a wafer table assembly, a base and a vertical action assembly; the wafer table assembly is arranged on the base, and the vertical action assembly is used to apply a force to the wafer table assembly; the force includes an upward force and a downward force; when the upward force is applied alone or the upward force and the downward force are applied simultaneously, the vertical action assembly applies the force in a non-contact manner; when the upward force and the downward force are applied simultaneously, the downward force is smaller than the upward force; when the downward force is applied alone, it is used to lock the base.

[0028] With such configuration, the motion platform is equipped with a vertical action component, which provides an upward force and a downward force to the wafer table component through the vertical action component, wherein the upward force is used to compensate for its gravity to reduce the force acting on the bearing, which is beneficial to improve the stability of the wafer table component during rotation and extend the service life of the bearing; the downward force can increase the rigidity of the wafer table component and further ensure the stability of the wafer table. In addition, when the downward force acts on the wafer table component alone, the wafer table component can be adsorbed and locked, so that the wafer table component can be mechanically locked at any rotation angle, and it can also ensure that when the equipment is powered off or abnormally powered off, the wafer table component is quickly shut down to eliminate safety hazards. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of the overall structure of a large base motion platform according to the first embodiment of the present invention;

[0030] Figure 2 It is a structural schematic diagram of a vertical action component according to the first embodiment of the present invention;

[0031] Figure 3 This is a schematic diagram of the control structure of the vertical action component of the first embodiment of the present invention;

[0032] Figure 4 It is a schematic diagram of the partial structure of the motion platform of the large base according to the second embodiment of the present invention.

[0033] The reference numerals are as follows:

[0034] 10-chip-carrying platform assembly; 11-suction cup; 111-through hole; 12-rotating seat; 13-pneumatic slip ring;

[0035] 20- base;

[0036] 30-vertical action component; 31-action member; 311-first action part; 3111-first air hole; 3112-action plane; 312-second action part; 3121-second air hole; 3122-adsorption groove; 32-isolation structure; 33-first magnetic attraction; 34-second magnetic attraction;

[0037] 40-rotation drive assembly; 41-rotation motor; 42-bearing; 43-adapter flange; 44-motor connector;

[0038] 50-handover assembly; 51-suction nozzle; 52-adsorption base; 53-suction column; 54-vertical guide rail; 55-vertical motor;

[0039] 60-vertical limit mechanism; 61-vertical mechanical lower limit member; 62-vertical mechanical upper limit member; 63-vertical grating ruler;

[0040] 70- gravity compensation mechanism;

[0041] 80-angle detection component; 81-circumferential grating ruler;

[0042] 91-first valve; 92-second valve;

[0043] 100-parts to be adsorbed;

[0044] a-The central axis of the rotating seat. DETAILED DESCRIPTION

[0045] As used in the invention, the singular forms "one", "a", and "the" include plural objects, the term "or" is usually used to include the meaning of "and / or", the term "several" is usually used to include the meaning of "at least one", and the term "at least two" is usually used to include the meaning of "two or more". In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", and "third" can explicitly or implicitly include one or at least two of the features. In addition, as used in the invention, "installed", "connected", "connected", and one element "set" to another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, matching or transmission relationship between the two elements, and the connection, coupling, matching or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. For those skilled in the art, the specific meanings of the above terms in the invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used with respect to the exemplary embodiments as they are shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0046] The present invention proposes a motion platform with a large base, which is equipped with a vertical action component 30. The vertical action component 30 provides an upward force and a downward force to the wafer stage component, wherein the upward force is used to compensate for its gravity to reduce the force acting on the bearing, which is beneficial to improve the stability of the wafer stage component during rotation and extend the service life of the bearing; the downward force can increase the rigidity of the wafer stage component and further ensure the stability of the wafer stage. In addition, when the downward force acts on the wafer stage component alone, the wafer stage component can be adsorbed and locked, so that the wafer stage component can be mechanically locked at any rotation angle, and it can also ensure that when the equipment is powered off or abnormally powered off, the wafer stage component is quickly shut down to eliminate safety hazards.

[0047] Embodiment 1:

[0048] The motion platform of the large substrate in this embodiment includes: a wafer stage assembly 10, a base 20 and a vertical action assembly 30;

[0049] Please refer to Figure 1As shown, the wafer stage assembly 10 includes a suction cup 11 and a rotating seat 12, wherein the rotating seat 12 is mounted on the base 20 in a manner that it can rotate along its own central axis a; the base 20 is a flat plate structure. The suction cup 11 is disposed on the rotating seat 12, and the upper end of the suction cup 11 has an adsorption area for carrying and adsorbing the object to be adsorbed.

[0050] The bottom of the suction cup 11 is fixedly arranged on the upper end of the rotating seat 12, and the upper end of the suction cup 11 has an adsorption area for carrying and adsorbing the part to be adsorbed 100. The suction cup 11 can adopt electrostatic adsorption or vacuum adsorption. In this embodiment, the suction cup 11 adopts vacuum adsorption, and the upper end surface array of the suction cup 11 is provided with adsorption grooves or adsorption holes to form an adsorption area. On the one hand, the rotating seat 12 is used to drive the suction cup 11 to rotate, and on the other hand, it is also used as a suction cup seat to supply air to the suction cup 11, wherein an airway is arranged in the rotating seat 12, and the airway is connected to the adsorption grooves or adsorption holes on the upper surface of the suction cup 11. The rotating seat 12 is a circular ring structure, and a pneumatic slip ring 13 is also arranged in the rotating seat 12, wherein the pneumatic slip ring 13 has a stator and a mover, and the mover is coaxial with the rotating seat 12 and transmission matched, and an airway is arranged in the mover and is connected to the airway of the rotating seat 12. Therefore, during the rotation process, the mover of the pneumatic slip ring 13 rotates synchronously with the rotating seat 12, and the pipes connecting the airways of the two will not be entangled. The airway of the pneumatic slip ring 13 is connected to the external vacuum preloading device, so a negative pressure environment can be formed in the adsorption area on the upper surface of the suction cup 11 to achieve the purpose of vacuum adsorption; the structure and installation method of the pneumatic slip ring 13 are existing technologies and will not be repeated here.

[0051] In this embodiment, the motion platform of the large base also includes a rotation drive assembly 40 for driving the rotating seat 12 to rotate, and the rotation drive assembly 40 includes a rotating motor 41, a bearing 42, an adapter flange 43 and a movable connecting member 44, wherein the bearing 42 preferably adopts a cross roller bearing, and the adapter flange 43 is rotatably matched with the base 20 through the bearing 42. The movable connecting member 44 is connected between the adapter flange 43 and the rotating seat 12, and the movable connecting member 44 is annular and is coaxially arranged with the adapter flange 43 and the rotating seat 12. The movable connecting member 44 preferably adopts a connecting spring sheet, which ensures the circumferential stiffness while allowing the rotating seat 12 to have a certain axial floating margin. The rotating motor 41 drives the adapter flange 43 and the movable connecting member 44 to rotate together around the central axis a, and transmits the rotational motion to the rotating seat 12 to drive the rotating seat 12 to rotate.

[0052] Please continue to refer to Figure 1As shown, the vertical action component 30 is annular and fixed on the base 20, the rotating motor 41, the bearing 42 and a part of the adapter flange 43 are located on the inner side of the vertical action component 30, the rotating seat 12 is located above the vertical action component 30 and the two are coaxially arranged, when the vertical action component 30 applies an upward force to the rotating seat 12, there is a small gap between the rotating seat 12 and the vertical action component 30. Of course, in the actual installation structure, in order to ensure the assembly stability and mutual limiting relationship of the components, it is also necessary to add components such as a rotating shaft and a bearing seat, which will not be repeated here.

[0053] Of course, in other alternative embodiments, the vertically acting component 30 may be configured in other shapes, such as a block structure or a frame structure.

[0054] Please continue to refer to Figure 1 As shown, the motion platform of the large substrate also includes a handover assembly 50, which includes a plurality of suction nozzles 51 and an adsorption base 52, wherein the upper end of the suction nozzle 51 serves as its adsorption end, and each of the suction nozzles 51 is arranged on the adsorption base 52, and the adsorption base 52 is arranged on the base 20 for driving each of the suction nozzles 51 to rise and fall synchronously.

[0055] The suction nozzle 51 can absorb the adsorbed part 100 by electrostatic adsorption or vacuum adsorption. In this embodiment, the suction nozzle 51 adopts the method of vacuum adsorption, wherein the suction nozzle 51 is preferably made of elastic material, and the suction nozzle made of elastic material is particularly suitable for auxiliary adsorption of warped wafers or substrates. In addition, the handover component 50 also includes a suction column 53, which extends vertically. The suction column 53 is a hollow tubular structure, and its inner cavity serves as an airway. The upper end of the suction column 53 is connected to the suction nozzle 51, and the lower end of the suction column 53 is connected to the adsorption base 52. The adsorption base 52 is provided with an airway and communicates with the inner cavity of the suction column 53. The airway on the adsorption base 52 is connected to the external vacuum device, which is used to evacuate so that a negative pressure environment is formed at the adsorption end of the suction nozzle 51.

[0056] The suction nozzle 51 can be disposed on the base 20 in a manner of being lifted and lowered along the vertical direction along with the suction base 52 , and the vertical direction is parallel to the central axis a of the rotating base 12 itself.

[0057] The handover assembly 50 is located below the suction cup 11. The suction cup 11 is vertically provided with a through hole 111 for the suction nozzle 51 to pass through when it is raised or lowered. When the adsorption base 52 is vertically raised, the suction nozzle 51 is lifted upward through the through hole 111 to hand over and adsorb the object to be adsorbed 100. Then the adsorption base 52 is vertically lowered, so that the suction nozzle 51 is lowered and exits the through hole 111 downward. At this time, the rotation of the suction cup 11 will not be interfered by the suction nozzle 51. Therefore, the suction cup 11 can rotate freely.

[0058] Please continue to refer to Figure 1As shown, the handover assembly 50 further includes a vertical guide rail 54 and a vertical motor 55. The vertical guide rail 54 is disposed on the base 20 and extends vertically. The adsorption base 52 can be vertically lifted and lowered on the vertical guide rail 54. The vertical motor 55 is disposed on the base 20 to drive the adsorption base 52 to move up and down along the vertical guide rail 54. The number and installation position of the vertical guide rail 54 and the vertical motor 55 can be adaptively adjusted based on actual use requirements.

[0059] Please continue to refer to Figure 1 As shown, the motion platform applied to the large substrate also includes a vertical limiting mechanism 60, and the vertical limiting mechanism 60 is used to limit the lifting stroke of the handover assembly 50. The vertical limiting mechanism 60 includes a vertical mechanical lower limiting member 61, a vertical mechanical upper limiting member 62, and a vertical grating ruler 63. The vertical mechanical lower limiting member 61 is arranged on the base 20 and is located below the adsorption base 52. The vertical mechanical upper limiting member 62 is arranged on the base 20 and a part of it is located above the adsorption base 52. The vertical mechanical lower limiting member 61 and the vertical mechanical upper limiting member 62 can be limiting blocks that limit their lifting stroke by interfering with the adsorption base 52. The vertical grating ruler 63 is arranged on the base 20 and is vertically opposite to the adsorption base 52 for measuring its lifting position. In addition, in the process of lifting and lowering the adsorption base 52, in order to prevent rigid collision between the adsorption base 52 and the vertical mechanical lower limiter 61 and the vertical mechanical upper limiter 62, in this embodiment, a vertical buffer pad can be provided on the vertical mechanical lower limiter 61 and the vertical mechanical upper limiter 62 to effectively protect the adsorption base 52. The vertical limit mechanism 60 can accurately limit the lifting stroke of the handover assembly 50, thereby ensuring the vertical positioning accuracy of the handover assembly 50 during the process of handover of wafers or substrates.

[0060] Please continue to refer to Figure 1 As shown, the motion platform applied to the large substrate also includes a gravity compensation mechanism 70, which is arranged on the base 20 to provide an upward force to the adsorption base 52. The gravity compensation mechanism 70 can adopt hydraulic cylinder compensation, air flotation compensation, cylinder compensation or other known compensation methods. In this embodiment, the gravity compensation mechanism 70 is a plurality of compensation cylinders supported on the adsorption base 52, so as to improve the stability of the operation of the handover assembly 50, and reduce the energy consumption generated during the upward acceleration of the handover assembly 50, which helps to prevent the handover assembly 50 from falling in the event of a sudden power outage.

[0061] Please continue to refer to Figure 1 As shown, in this embodiment, the motion platform applied to the large substrate further includes an angle detection component 80 , and the angle detection component 80 is used to detect the rotation angle of the rotating seat 12 .

[0062] The angle detection component 80 may be a circumferential grating ruler 81, wherein the circumferential grating ruler 81 may be arranged on the base 20 or the rotating seat 12 for detecting the angular displacement of the rotating seat 12. In addition, the angle detection component 80 may also include a rotation limit sensor, which is arranged on the base 20, and is used to receive the angular displacement detected by the circumferential grating ruler 81 and to limit the rotation angle of the rotating seat 12. The angle detection component 80 may be used to detect the rotation angle of the rotating seat 12, and the rotation angle thereof may be detected by acquiring the rotation angle in real time.

[0063] In addition, the motion platform of the large substrate can be provided with a coarse motion structure, such as components such as an X-guide rail and a Y-guide rail, wherein the motion platform can realize long-stroke motion along the horizontal X and Y directions through the X-guide rail and the Y-guide rail.

[0064] Please combine Figure 2 As shown, the vertical action component 30 is arranged on the base 20 for applying a force to the wafer table assembly 10 in a non-contact manner, and the force includes an upward force and a downward force; the non-contact here means that the force of the motion platform is non-contact under normal working conditions, and when it is in an abnormal situation, such as an abnormal power outage, the downward force acts on the wafer table assembly 10 alone, which is used to adsorb the wafer table assembly and lock the wafer table assembly. At this time, the vertical action component 30 is in contact with the wafer table assembly 10.

[0065] For example, to reduce the vertical force acting on the bearing, it is necessary to clarify here that the upward force and the downward force can be applied simultaneously or independently. When the motion platform is working normally, the wafer table assembly 10 needs to rotate. At this time, it is preferred that the upward force and the downward force can be applied simultaneously, and the downward force is smaller than the upward force. At this time, the gravity of the wafer table assembly 10 is offset by the upward force to reduce the force acting on other components when the wafer table assembly 10 rotates, which is beneficial to improve the stability of the wafer table assembly during rotation and extend the service life of the bearing; in addition, the downward force can increase the rigidity of the wafer table assembly and further ensure the stability of the wafer table. At this time, the upward force and the downward force are both applied in a non-contact manner to avoid contact with the wafer table assembly 10 to eliminate the friction when the wafer table assembly 10 rotates. When emergency shutdown is required, such as abnormal power outage, it is preferred that the downward force acts solely on the wafer table assembly 10. At this time, the vertical action assembly 30 is used to adsorb the wafer table assembly and lock the wafer table assembly, so that the wafer table assembly can be mechanically locked at any rotation angle. At the same time, it can also ensure that when the equipment is powered off or the power is abnormally cut off, the wafer table assembly can be quickly shut down to eliminate safety hazards.

[0066] Please continue to refer to Figure 2As shown, the vertical action component 30 includes an action member 31, and the action member 31 has an action end, and the action end is vertically opposite to the wafer support platform component 10.

[0067] In this embodiment, the action member 31 is annular, and the annular shape of the action member 31 is adapted to the annular shape of the rotating seat 12. The central axis of the action member 31 extends vertically, and the action member 31 is coaxially arranged with the rotating seat 12. One end of the action member 31 along its axial direction serves as the action end; Figure 1 As shown, the vertical action component 30 is arranged below the entire wafer stage component 10, that is, the action member 31 is located below the rotating seat 12, and the upper end of the action member 31 serves as its action end.

[0068] The action end is provided with a first action portion 311 and a second action portion 312 , wherein the first action portion 311 is used to provide an upward action force to the wafer stage assembly 10 , and the second action portion 312 is used to provide a downward action force to the wafer stage assembly 10 .

[0069] In this embodiment, the first action part 311 and the second action part 312 both apply an action force to the bottom of the rotating seat 12 by means of air pressure. Figure 1 There is a small gap between the upper end of the first acting part 311 and the bottom of the rotating seat 12. The first acting part 311 introduces positive pressure gas into the gap, which increases the air pressure between the first acting part 311 and the bottom of the rotating seat 12, thereby providing an upward air pressure force for the bottom of the rotating seat 12; similarly, the second acting part 312 provides negative pressure to the gap and evacuates the gap, which reduces the air pressure between the second acting part 312 and the bottom of the rotating seat 12, thereby providing a downward air pressure force for the bottom of the rotating seat 12.

[0070] Of course, in other alternative embodiments, the force exerted by the first acting part 311 and the second acting part 312 on the wafer table assembly 10 can also be achieved through magnetic force. For example, the first acting part 311 repels the bottom of the rotating seat 12 through magnetic force to provide an upward force, and the second acting part 312 adsorbs the bottom of the rotating seat 12 through magnetic force to provide a downward force. In this case, the bottom of the rotating seat 12 needs to be adapted to magnetic attraction.

[0071] It is conceivable that, in this embodiment, the vertical action component 30 may be disposed not only below the wafer stage component 10, but also above the wafer stage component 10, and in this case, the lower end of the action member 31 serves as the action end. In this case, the first action portion 311 needs to provide negative pressure vacuum to apply an upward force to the upper end of the wafer stage component 10, and the second action portion 312 needs to pass positive pressure gas to apply a downward force to the upper end of the wafer stage component 10.

[0072] For further information, please refer to Figure 2 As shown, the first acting part 311 and the second acting part 312 are provided in plurality, and the first acting part 311 and the second acting part 312 are alternately arranged circumferentially on the acting end. Since the acting member 31 is annular and its acting end is also annular, the first acting part 311 and the second acting part 312 are alternately arranged circumferentially around the central axis of the acting member 31. In this embodiment, three first acting parts 311 and three second acting parts 312 are provided respectively, and the number of the first acting parts 311 and the second acting parts 312 can be adaptively adjusted based on actual use requirements. By means of the first acting parts 311 and the second acting parts 312 alternately and evenly distributed circumferentially, an upward force and a downward force can be uniformly provided to the wafer table assembly 10 to ensure the stability of the wafer table assembly 10.

[0073] In this embodiment, the vertical acting component 30 applies a force to the wafer stage component 10 through vacuum adsorption or positive pressure gas.

[0074] like Figure 2 As shown, the first action portion 311 includes a first air hole 3111 opened at the action end, and the first air hole 3111 is used to pass gas into or suck out gas to provide an upward air pressure force to the wafer stage assembly 10.

[0075] Since the action member 31 is located below the wafer stage assembly 10, the first air hole 3111 is used to introduce positive pressure gas to provide an upward air pressure force to the bottom of the wafer stage assembly 10, and the first air hole 3111 is externally connected to a positive pressure device.

[0076] In addition, the first action portion 311 further includes an action plane 3112 disposed at the action end, and the first air hole 3111 is opened on the action plane 3112. An air gap is formed between the first action portion 311 and the lower surface of the rotating seat 12, which is conducive to providing a uniform upward force on the lower surface of the rotating seat 12.

[0077] Please continue to refer to Figure 2 As shown, the second action portion 312 includes a second air hole 3121 opened at the action end, and the second air hole 3121 is used to pass gas into or suck out gas to provide a downward air pressure force on the wafer stage assembly 10.

[0078] Since the action member 31 is located below the wafer stage assembly 10 , the second air hole 3121 is used to suck out gas to provide a downward air pressure force on the bottom of the wafer stage assembly 10 , and the second air hole 3121 is externally connected to a vacuum preloading device.

[0079] Further, such as Figure 2As shown, the second action portion 312 also includes an adsorption groove 3122 opened at the action end, and each second action portion 312 includes two adsorption grooves 3122, that is, there are two adsorption grooves 3122 between two adjacent action planes 3112, and the second air hole 3121 is opened at the bottom of the adsorption groove 3122. Three second air holes 3121 are opened at the bottom of each adsorption groove 3122, and each second air hole 3121 is arranged along the circumferential direction. The number and setting method of the second air holes 3121 can be adjusted based on actual use requirements. When the second air hole 3121 is evacuated, the setting of the adsorption groove 3122 is conducive to limiting the vacuum environment to the area where the adsorption groove 3122 is located, so as to achieve the purpose of partitioning the first action portion 311 and the second action portion 312, so as to reduce the interference between the first action portion 311 and the second action portion 312.

[0080] In addition, the action plane 3112 is higher than the bottom of the adsorption groove 3122. Here, "higher" should be understood as on the action end, the action plane 3112 is more protruding than the bottom of the adsorption groove 3122. This is conducive to ensuring that the positive pressure gas introduced by the first air hole 3111 can effectively act on the lower surface of the rotating seat 12, and helps to partition the first action part 311 and the second action part 312, thereby reducing mutual interference between the two.

[0081] Furthermore, the action end of the action member 31 is also provided with an isolation structure 33, and the isolation structure 33 is isolated between the adjacent first action portion 311 and the second action portion 312. In this embodiment, the isolation structure 33 includes an isolation groove 331 opened at the action end. The air gap between the action plane 3112 and the lower surface of the rotating seat 12 is small, so the positive pressure gas introduced by the first air hole 3111 will flow along the surface of the action plane 3112 and the lower surface of the rotating seat 12, so that when the gas introduced by the first air hole 3111 flows in the circumferential direction, it flows to the isolation groove 331 in contact with the action plane 3112, and the isolation groove 331 has the effect of isolating the first action portion 311 and the second action portion 312.

[0082] Please refer to Figure 3As shown, the control of the action member 31 can be achieved through the first valve 91 and the second valve 92, wherein the first air hole 3111 is connected to the external positive pressure device through the first valve 91, and the second air hole 3121 is connected to the external vacuum preload device through the second valve 92. The vacuum preload device and the second valve 92 are normally open, which ensures that the second air hole 3121 is always in a vacuum state. Therefore, the second action part 312 always provides a downward force for the vertical action component 30. The first valve 91 is preferably controlled by a solenoid valve in the form of a two-position three-way single electric control mechanical reset. When the motion platform is abnormally powered off, the first valve 91 is mechanically reset to disconnect the positive pressure air circuit. The vacuum preload in the normally open state will cause the action member 31 to absorb the rotating seat 12 downward. Since the rotating seat 12 is connected through the movable connecting member 44 of the spring structure, the rotating seat 12 is allowed to have a small vertical displacement, and the rotating seat 12 is absorbed and moves downward. The lower surface of the rotating seat 12 is firmly absorbed on the upper surface of the action member 31, so that the rotating seat 12 is locked in the current state and will not rotate arbitrarily and collide.

[0083] This embodiment also provides a lithography device, which is equipped with the above-mentioned large substrate motion platform, and the motion platform is installed on the exposure platform of the lithography device.

[0084] In summary, the motion platform of the large substrate includes: a wafer stage assembly, a base and a vertical action assembly; the wafer stage assembly is arranged on the base, and the vertical action assembly is used to apply a force to the wafer stage assembly; the force includes an upward force and a downward force; when the upward force is applied alone or the upward force and the downward force are applied simultaneously, the vertical action assembly applies the force in a non-contact manner; when the upward force and the downward force are applied simultaneously, the downward force is smaller than the upward force; when the downward force is applied alone, it is used to lock the wafer stage assembly to the base.

[0085] With such configuration, the motion platform is equipped with a vertical action component, which provides an upward force and a downward force to the wafer table component through the vertical action component, wherein the upward force is used to compensate for its gravity to reduce the force acting on the bearing, which is beneficial to improve the stability of the wafer table component during rotation and extend the service life of the bearing; the downward force can increase the rigidity of the wafer table component and further ensure the stability of the wafer table. In addition, when the downward force acts on the wafer table component alone, the wafer table component can be adsorbed and locked, so that the wafer table component can be mechanically locked at any rotation angle, and it can also ensure that when the equipment is powered off or abnormally powered off, the wafer table component is quickly shut down to eliminate safety hazards.

[0086] Embodiment 2

[0087] The difference between this embodiment and the first embodiment lies in the different action modes of the vertical action component 30 .

[0088] The vertical action component 30 includes a first magnetic attraction 33 and a second magnetic attraction 34, one of the first magnetic attraction 33 and the second magnetic attraction 34 is set on the wafer support table component 10, and the other is set on the base 20, at least one of the first magnetic attraction 33 and the second magnetic attraction 34 has a changeable magnetic pole, and the first magnetic attraction 33 and the second magnetic attraction 34 are arranged vertically opposite to each other.

[0089] In this embodiment, the first magnetic attraction 33 is disposed on the lower surface of the rotating base 12 , and the second magnetic attraction 34 is disposed on the base 20 and located below the first magnetic attraction 33 , wherein the second magnetic attraction 34 is configured as an electromagnet.

[0090] The first magnetic attraction 33 and the second magnetic attraction 34 can be arranged in multiple groups along the circumference of the rotating seat 12, and are arranged one by one. By changing the magnetic poles of several of the second magnetic attraction 34, preferably, the arrangement of several second magnetic attraction 34 is arranged with different magnetic poles. If a part of the second magnetic attraction 34 has the same magnetic pole as the corresponding first magnetic attraction 33, it is used to provide an upward magnetic attraction force for the rotating seat 12, wherein the upward magnetic attraction force is used to compensate for its gravity to reduce the force acting on the bearing, which is beneficial to improve the stability of the wafer stage assembly during rotation and extend the service life of the bearing; the other part of the second magnetic attraction 34 has the opposite magnetic pole to the corresponding first magnetic attraction 33, which is used to provide a downward magnetic attraction force for the rotating seat 12, and the downward magnetic attraction force can improve the rigidity of the wafer stage assembly and further ensure the stability of the wafer stage. In addition, it should be ensured that the upward magnetic attraction force is greater than the downward magnetic attraction force, so that the vertical action component 30 provides an upward force to the wafer stage assembly 10 in a non-contact manner.

[0091] The vertical action component 30 provides both an upward magnetic attraction and a downward magnetic attraction for the wafer stage component 10. In addition, the magnetic attraction of the first magnetic attraction 33 and the second magnetic attraction 34 can be adjusted so that the magnetic attraction of the two is the same, and the upward magnetic attraction is provided alone to compensate for the gravity of the wafer stage component 10.

[0092] When the device is abnormal, the vertical action component 30 can provide a downward magnetic attraction force to the wafer stage component 10 alone. At this time, the magnetic poles of all the second magnetic attraction 34 can be adjusted to be opposite to the magnetic poles of the first magnetic attraction 33, or some of the second magnetic attraction 34 can be powered off, and the magnetic poles of the other part of the second magnetic attraction 34 can be adjusted to be opposite to the magnetic poles of the first magnetic attraction 33. At this time, the vertical action component 30 provides a downward magnetic attraction force to the wafer stage component 10 alone, and the wafer stage component 10 moves slightly downward vertically, so that the first magnetic attraction 33 is adsorbed on the second magnetic attraction 34, and the wafer stage component 10 is locked on the base 20.

[0093] Of course, the wafer table assembly 10 can also be positioned vertically, that is, the wafer table assembly 10 cannot make a slight movement vertically. At this time, although the second magnetic attraction 34 has a downward magnetic attraction force on the first magnetic attraction 33, since the wafer table assembly 10 cannot make a slight movement vertically, the second magnetic attraction 34 and the first magnetic attraction 33 still maintain a non-contact state, and by providing a downward adsorption force to the wafer table assembly 10, it can also prevent the wafer table assembly 10 from rotating to lock the wafer table assembly 10.

[0094] In addition, the vertical action component 30 can also provide an action force to the wafer stage component 10 in a contact manner. For example, the vertical action component 30 is a thrust bearing or a vertically supported guide rail. In this case, the vertical action component 30 provides an upward action force to the wafer stage component 10.

[0095] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0096] The above description is only a description of the preferred embodiments of the invention, and is not intended to limit the scope of the invention. Any changes or modifications made by a person of ordinary skill in the art based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A large-base motion platform, characterized in that: include: Wafer table assembly, base and vertical action assembly; The wafer stage assembly is arranged on the base, and the vertical action assembly is used to apply an action force to the wafer stage assembly; The acting force includes an upward acting force and a downward acting force; When the upward force is applied alone or the upward force and the downward force are applied simultaneously, the vertically acting component applies the force in a non-contact manner; When the upward force and the downward force are applied simultaneously, the downward force is smaller than the upward force; The downward force, when applied alone, is used to lock the wafer stage assembly to the base.

2. The large base motion platform as claimed in claim 1, characterized in that: The vertical action component includes an action member, which has an action end. The action end is vertically opposite to the wafer support table component. The action end is provided with a first action part and a second action part. The first action part is used to provide an upward force to the wafer support table component, and the second action part is used to provide a downward force to the wafer support table component.

3. The large base motion platform as claimed in claim 2, characterized in that: A plurality of the first acting portions and the second acting portions are provided, and the first acting portions and the second acting portions are alternately arranged along the circumferential direction on the acting end.

4. The large-base motion platform as claimed in claim 3, characterized in that: The action member is annular, and one axial end of the action member serves as the action end. The first action portion and the second action portion are circumferentially arranged around the central axis of the action member.

5. The large-base motion platform as claimed in claim 2, characterized in that: The first action portion includes a first air hole opened at the action end, and the first air hole is used to let in or suck out gas to provide an upward air pressure force to the wafer stage assembly.

6. The large-base motion platform as claimed in claim 5, characterized in that: The first air hole is used to allow positive pressure gas to be introduced to provide an upward air pressure force on the bottom of the wafer stage assembly.

7. The large-base motion platform as claimed in claim 5, characterized in that: The first action portion further includes an action plane disposed at the action end, and the first air hole is opened on the action plane.

8. The large-base motion platform as claimed in claim 2, characterized in that: The second action portion includes a second air hole opened at the action end, and the second air hole is used for introducing or sucking out gas to provide a downward air pressure force on the wafer stage assembly.

9. The large-base motion platform as claimed in claim 8, characterized in that: The second air hole is used to suck out gas to provide a downward air pressure force on the lower end of the wafer stage assembly.

10. The large-base motion platform according to claim 8, characterized in that: The second action portion further includes an adsorption groove opened at the action end, and the second air hole is opened at the bottom of the adsorption groove.

11. The large-base motion platform according to claim 10, characterized in that: When the first action portion includes an action plane, the action plane is higher than the bottom of the adsorption groove.

12. The large-base motion platform as claimed in claim 3, characterized in that: The acting end of the acting member is further provided with an isolation structure, and the isolation structure is isolated between the adjacent first acting portion and the second acting portion.

13. The large base motion platform as claimed in claim 12, characterized in that: The isolation structure includes an isolation groove opened at the active end.

14. The large-base motion platform according to claim 1, characterized in that: The vertical action component includes a first magnetic attraction and a second magnetic attraction, one of the first magnetic attraction and the second magnetic attraction is set on the wafer support table component, and the other is set on the base, at least one of the first magnetic attraction and the second magnetic attraction has a changeable magnetic pole, and the first magnetic attraction and the second magnetic attraction are set vertically opposite each other.

15. The large-base motion platform according to claim 1, characterized in that: The action member is located below the wafer stage assembly, and the upper end of the action member serves as the action end, which is vertically opposite to the lower end of the wafer stage assembly.

16. The large-base motion platform according to claim 1, characterized in that: The wafer support table assembly includes a suction cup and a rotating seat, and the rotating seat is installed on the base in a manner that it can rotate along its own central axis, and the rotating central axis of the rotating seat extends vertically; the suction cup is arranged on the rotating seat, and the upper end of the suction cup has an adsorption area for carrying and adsorbing the part to be adsorbed, and the vertical action component is used to apply the force to the rotating seat.

17. A lithography apparatus, characterized in that: The lithography equipment is equipped with a motion platform for a large substrate as described in any one of claims 1-16.

Images