Method and device for manufacturing PCB (Printed Circuit Board) with solder mask ink film printing

Abstract

The embodiment of the invention relates to the technical field of PCB (Printed Circuit Board) manufacturing, in particular to a PCB manufacturing method and a PCB manufacturing device for solder mask ink film printing, which are characterized in that a two-time exposure operation mode is adopted, the first exposure is carried out, a large copper surface area is subjected to light curing under the condition of not sucking vacuum, excessive pressure caused by contact between a film and a large copper surface is avoided, and film printing is avoided; and during the second exposure, the film and the large copper surface are normally vacuumized and then are attached together, and because the position of the large copper surface is subjected to light curing, a film print cannot be generated. According to the method, the designed mode of exposure twice is adopted, the probability of film printing generated by solder mask exposure is greatly reduced, and the problem of large copper surface film printing which cannot be solved by the conventional exposure design at present is solved.

Description

Technical Field

[0001] The embodiment of the present invention relates to the technical field of PCB production, and in particular to a method and device for producing a PCB board printed with solder mask ink film. Background Art

[0002] During the manufacturing process of printed circuit boards, after the PCB board is printed with solder mask ink, the board is pre-baked, and the ink on the board surface is not completely cured and is relatively soft. During the production of the exposure machine, one side of the board is close to the exposure machine table, and the other side is aligned with the film. After the alignment is completed, the board and the film are tightly fitted by vacuuming to form a vacuum state of -400±50mmHg in the frame to prevent LED light from irradiating the position to be developed through the gap. During this process, the soft ink on the board surface will contact the exposure table or film to produce indentations. This indentation is called "film print". Film print causes abnormal product appearance, thereby reducing the yield rate of PCB boards.

[0003] The current production process of solder mask printing is to print ink first, then pre-bake, and after exposing the pattern, remove the excess ink by developing. The above process is prone to the following problems:

[0004] (1) The ink is too thick, the solvent is difficult to evaporate after pre-baking, the solvent evaporates insufficiently, and the ink surface is sticky;

[0005] (2) After pre-baking, the ink is in a semi-dry state, and the board and the film are tightly fitted by vacuum. The large copper surface is indented with the film under vacuum pressure. Summary of the invention

[0006] In view of the above problems, the embodiments of the present invention provide a method and device for manufacturing a PCB board printed with solder mask ink film, which is used to solve the problems in the prior art that the solder mask printing ink is too thick, the solvent is difficult to volatilize after pre-baking, the solvent volatilization is insufficient, and the ink surface is sticky; the ink is in a semi-dry state after pre-baking, and the board and the film are tightly fitted by vacuum, and the large copper surface position produces indentations with the film under vacuum pressure.

[0007] According to one aspect of an embodiment of the present invention, a method for manufacturing a PCB board printed with solder mask ink film is provided, the method comprising:

[0008] Pre-treatment, making PCB multilayer boards;

[0009] Printing ink, forming an ink layer by screen printing on the surface of the PCB multilayer board;

[0010] Pre-baking, placing the PCB board in a baking device and pre-baking it according to a first preset temperature;

[0011] The first exposure is to obtain the first film data, and generate the second film data by unilaterally increasing the preset size of the window area in the first film data, and perform the first exposure of the PCB multilayer board by ultraviolet rays according to the second film data;

[0012] A second exposure, exposing the PCB multilayer board to ultraviolet light for a second time according to the first film data;

[0013] Developing to remove excess ink from the PCB multilayer board.

[0014] In some optional embodiments, the vacuum pressure of the first exposure is 0 mmHg, and the exposure scale is black coffee color with 10-12 grids.

[0015] In some optional embodiments, the vacuum pressure of the second exposure is -400 mmHg±50 mmHg, and the exposure scale is black coffee color with 10-12 grids.

[0016] In some optional embodiments, the preset size is 25 mi l.

[0017] In some optional embodiments, after the developing, the method further comprises:

[0018] Text: Print text on the PCB multilayer board;

[0019] Post-baking: placing the PCB board in a baking device and pre-baking it according to a second preset temperature.

[0020] In some optional embodiments, after the post-baking step, the PCB multilayer board is subjected to basic performance testing, and the basic performance testing includes any one or more of the following tests:

[0021] Appearance test: through AOI inspection or visual inspection, if the PCB multilayer board has no color difference or bubbles, the PCB multilayer board is qualified, otherwise it is unqualified;

[0022] Undercut test, slicing the PCB multilayer board. If the ink layer thickness of the PCB multilayer board is within 25.4um, the PCB multilayer board is qualified, otherwise it is unqualified;

[0023] Ink anti-solubility test, by soaking the PCB multilayer board in oil-boiling water for 30 minutes, if the ink of the PCB multilayer board has no softening, bubbling, or oil loss problems, the PCB multilayer board is qualified, otherwise it is unqualified;

[0024] Acid and alkali resistance test: soak the PCB multilayer board in 10% H2SO4 / 10% NaOH solution for 30 minutes. If there is no bubbling or discoloration of the ink and no oil loss in the 3M tape tensile test, the PCB multilayer board is qualified, otherwise it is unqualified.

[0025] IR furnace test: put the PCB multilayer board through the reflow oven at 160℃→260℃ for 3 times. If there is no serious discoloration of the ink, no bubbling or falling of the ink, the PCB multilayer board is qualified, otherwise it is unqualified.

[0026] Ink adhesion test: stick 3M tape on the PCB multilayer board and pull it. If the 3M tape does not fall off, the PCB multilayer board passes the test, otherwise it fails.

[0027] Hardness test: Use a hardness tester to scratch the PCB multilayer board for testing. If there are no ink scratches or exposed copper, the PCB multilayer board passes the test, otherwise it fails.

[0028] In some optional embodiments, after the post-baking step, the PCB multilayer board is further subjected to process performance testing, wherein the process performance testing includes any one or more of the following tests:

[0029] After the PCB multilayer board is subjected to the tin spray test, the 3M tape is repeatedly pulled at the same position of the PCB multilayer board for 3 times. If there is no blistering or falling of ink on the PCB multilayer board, the PCB multilayer board is qualified, otherwise it is unqualified;

[0030] Chemical gold test: After the PCB multilayer board is tested for chemical gold, use 3M tape to repeatedly pull the same position of the PCB multilayer board for 3 times. If there is no bubbling or shedding of ink on the PCB multilayer board, the PCB multilayer board is qualified, otherwise it is unqualified;

[0031] OSP test: After the PCB multilayer board is tested for OSP, use 3M tape to repeatedly pull the same position of the PCB multilayer board for 3 times. If there is no bubbling or falling of ink on the PCB multilayer board, the PCB multilayer board is qualified, otherwise it is unqualified;

[0032] Gold plating test: After the PCB multilayer board is gold-plated, use 3M tape to repeatedly pull the same position of the PCB multilayer board for 3 times. If there is no bubbling or falling off of the PCB multilayer board, the PCB multilayer board is qualified, otherwise it is unqualified.

[0033] In some optional embodiments, after the post-baking, PCB board front-end and back-end processes are also included, and the PCB board post-end processes include: surface treatment, molding, testing, and packaging.

[0034] In some optional embodiments, the pre-processing includes, in sequence: inner layer production, inner layer AOI, lamination, drilling, and outer layer production.

[0035] According to another aspect of an embodiment of the present invention, a device for manufacturing a PCB board printed with solder mask ink film is provided, wherein the device is used to execute the above-mentioned method for manufacturing a PCB board printed with solder mask ink film to manufacture a printed circuit board.

[0036] The method and device for making a PCB board with solder mask ink film printing of the present invention have the following beneficial effects: the present invention adopts a two-exposure operation mode, in which the large copper surface area is light-cured without vacuum suction in the first exposure, so as to avoid excessive pressure caused by contact between the film and the large copper surface, thereby eliminating film printing; in the second exposure, the film and the large copper surface are normally vacuumed and bonded together, and because the large copper surface position has been light-cured, no film printing can be produced. The present invention adopts the two-exposure mode designed in this article, which will greatly reduce the probability of film printing produced by solder mask exposure, and breaks through the problem of large copper surface film printing that cannot be solved by current conventional exposure designs.

[0037] The above description is only an overview of the technical solution of the embodiment of the present invention. In order to more clearly understand the technical means of the embodiment of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiment of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings. In the accompanying drawings:

[0039] Figure 1 A schematic flow chart of a method for manufacturing a PCB printed with solder mask ink film according to Example 1 of the present invention is shown;

[0040] Figure 2 The schematic diagram of the process after development of Example 1 provided by the present invention is shown;

[0041] Figure 3 A schematic diagram comparing the present invention and the prior art is shown in Example 1 provided by the present invention. DETAILED DESCRIPTION

[0042] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0043] Embodiment 1,

[0044] See also Figure 1The first embodiment of the method for making a PCB board with solder mask ink film printing is shown, and the improvement method for solder mask film printing on a large copper surface can solve the difficulty and limitations of the process in the current solder mask film printing improvement process through the present invention. The method includes:

[0045] 110, pre-processing, making a PCB multilayer board; in step 110, the pre-processing includes: inner layer production, inner layer AOI, lamination, drilling, and outer layer production.

[0046] 120, printing ink, screen printing on the surface of the PCB multilayer board to form an ink layer; in step 120, the screen can be selected according to the thickness requirement of the ink layer of the PCB multilayer board. In a specific example, the first screen can be 30T-150T screen, and the scraper speed is 20mm / min-80mm / min, the ink return knife speed is 20mm / min-80mm / min, and the printing pressure is 3kg / cm 2 -5kg / cm 2 , the scraper angle is required to be 5°-15° when printing ink on PCB multilayer boards.

[0047] 130, pre-baking, placing the PCB board in a baking device and pre-baking it according to a first preset temperature; in step 130, the main purpose of pre-baking after printing the ink is to remove the solvent in the ink and make it dry, thereby enhancing the bonding force between the ink and the substrate and preventing problems such as falling off or bubbling during subsequent processing. The pre-baking temperature can be 75°C and the time can be 45 minutes.

[0048] 140, first exposure, obtaining a first film data, and generating a second film data by increasing a preset size of a window area on one side of the first film data, and performing a first exposure of the PCB multilayer board by ultraviolet light according to the second film data; the vacuum pressure of the first exposure is 0 mmHg, and the exposure scale is black coffee color with 10-12 grids. In a specific example, the preset size is 25 mi l.

[0049] 150, second exposure, the PCB multilayer board is exposed to ultraviolet light for the second time according to the first film data; the vacuum pressure of the second exposure is -400mmHg±50mmHg, and the exposure scale is black coffee color with 10-12 grids.

[0050] 160, development, remove the excess ink of the PCB multilayer board. Put the PCB board into the developer so that the uncured solder paste is dissolved. The developer is a corrosive liquid that can corrode the uncured solder paste. During the development process, it should be noted that the temperature and time of the developer need to be well controlled, otherwise it will affect the development effect. In a specific example, the temperature of the developer is generally 25°C, and the development time is generally 2-5 minutes.

[0051] The present invention adopts a two-time exposure operation mode. In the first exposure, the large copper surface area is light-cured without vacuum absorption, so as to avoid excessive pressure caused by contact between the film and the large copper surface, thereby eliminating film marks; in the second exposure, the film and the large copper surface are normally vacuumed and bonded together. Because the large copper surface position has been light-cured, no film marks can be produced. The present invention adopts the two-time exposure mode designed in this article, which will greatly reduce the probability of film marks produced by solder mask exposure, and break through the problem of large copper surface film marks that cannot be solved by current conventional exposure designs.

[0052] In some optional embodiments, the vacuum pressure of the first exposure is 0 mmHg, and the exposure scale is black coffee color with 10-12 grids. The vacuum pressure of the second exposure is -400 mmHg±50 mmHg, and the exposure scale is black coffee color with 10-12 grids. In this embodiment, the present invention exposes the solder mask ink twice, and the first exposure data is enlarged by 25 mi l on one side according to the original film data of the working manuscript, and the large copper surface area is photocured after exposure. The second exposure data is produced normally according to the original film data of the working manuscript. The exposure machine needs to be turned off for vacuuming during the first exposure; the second exposure is produced according to normal vacuuming, that is, -400±50 mmHg. In addition, the parameters of the first exposure and the second exposure are shown in Table 1:

[0053] Exposure conditions Scope of control Exposure chamber / table temperature 21±3℃ Light source temperature ≤30℃ Exposure delay time 2000±1000ms Film cleaning frequency 72PNL / time Film vacuum degree -650±50mmHg Main vacuum -400±50mmHg Alignment X: ≤35um; Y: ≤35um Equal ≤15um Dust collecting machine speed 8±2m / min Replacement of dust-sticking paper for dust-sticking machine 1 time / 144 pieces Edge strip thickness range According to the MI finished plate thickness requirements, the edge strip thickness requirement is ≤ the edge strip thickness requirement and does not exceed 0.2mm Exposure ruler Black coffee color 10-12 grids Number of times black film is used ≤1500 times Energy uniformity ≥85％

[0054] Table 1

[0055] In some optional embodiments, see Figure 2 After the development, the method further includes: 210, text: printing text on the PCB multilayer board; 220, post-baking: placing the PCB board in a baking device and pre-baking it according to a second preset temperature. The second preset temperature can be 120-150 degrees, and the baking time can be 30 minutes. The ink of the PCB multilayer board is cured and fixed. After steps 210 and 220, the PCB multilayer board completes the baking step.

[0056] In some optional embodiments, after the post-baking, the PCB board front and back processes are also included, and the PCB board post-processes include: surface treatment, molding, testing, and packaging in sequence. In this embodiment, OSP treatment: the side of the bare copper plate to be welded is coated to form an organic film to prevent rust and oxidation. Shape making: The board shape required by the customer is made to facilitate the customer to perform SMT patching and assembly. Flying probe test: Test the board circuit to avoid short-circuit boards from flowing out. FQC final inspection: After completing all processes, a full sampling inspection is carried out to ensure the quality of the PCB board. Vacuum packaging: The finished PCB board is vacuum packed to prevent moisture, dust and shock.

[0057] In some optional embodiments, the pre-treatment includes: inner layer production, inner layer AO I, lamination, drilling, and outer layer production in sequence. In this embodiment, the pre-treatment specifically includes: cutting: cutting the PCB substrate into production size. Cleaning: cleaning the surface of the PCB substrate and removing surface contaminants. Laminating: sticking the dry film on the surface of the PCB substrate to prepare for subsequent image transfer. Exposure: using an exposure device to expose the laminated substrate with ultraviolet light to transfer the image of the substrate to the dry film. Developing, etching, and film removal: removing the uncured photosensitive film, etching away unnecessary copper foil with a strong alkaline solvent, and completing the production of the inner layer board. AO I optical scanning: comparing the image of the PCB board with the data of the good board to find bad phenomena (such as notches, depressions, etc.). VRS detection and maintenance: processing the bad image data detected by AO I, and relevant personnel will perform maintenance. Wire filling: soldering the gold wire on the notch or depression to prevent poor electrical properties. Browning: increasing the adhesion between the board and the resin, and increasing the wettability of the copper surface. Riveting: Cut the PP into small sheets and normal sizes, so that the inner layer board can be combined with the corresponding PP. Overlapping and pressing: Press multiple inner layer boards into one board. Targeting, edging, and grinding: Process the edges of the board to meet the design requirements. Positioning and drilling: Use a drilling machine to drill holes of different diameters and sizes on the board for subsequent processing of plug-ins and heat dissipation. Graphic processing: Graphic processing is performed on the outer layer of the PCB, and excess copper foil is removed by etching to form the final PCB conductor pattern. Electroplating: A layer of copper is plated on the hole wall to ensure reliable conductivity between the layers.

[0058] Embodiment 2:

[0059] Based on Example 1, after the post-baking step, the PCB multilayer board is further subjected to basic performance testing, and the basic performance testing includes any one or more of the following tests:

[0060] Appearance test, through AOI inspection or visual inspection, if the PCB multilayer board has no color difference or bubbles, the PCB multilayer board is qualified, otherwise it is unqualified;

[0061] Undercut test, slicing the PCB multilayer board. If the ink layer thickness of the PCB multilayer board is within 25.4um, the PCB multilayer board is qualified, otherwise it is unqualified;

[0062] Ink anti-solubility test, by soaking the PCB multilayer board in oil-boiling water for 30 minutes, if the ink of the PCB multilayer board has no softening, bubbling, or oil loss problems, the PCB multilayer board is qualified, otherwise it is unqualified;

[0063] Acid and alkali resistance test: soak the PCB multilayer board in 10% H2SO4 / 10% NaOH solution for 30 minutes. If there is no bubbling or discoloration of the ink and no oil loss in the 3M tape tensile test, the PCB multilayer board is qualified, otherwise it is unqualified.

[0064] IR furnace test: put the PCB multilayer board through the reflow oven at 160℃→260℃ for 3 times. If there is no serious discoloration of the ink, no bubbling or falling of the ink, the PCB multilayer board is qualified, otherwise it is unqualified.

[0065] Ink adhesion test: stick 3M tape on the PCB multilayer board and pull it. If the 3M tape does not fall off, the PCB multilayer board passes the test, otherwise it fails.

[0066] Hardness test: Use a hardness tester to scratch the PCB multilayer board for testing. If there are no ink scratches or exposed copper, the PCB multilayer board passes the test, otherwise it fails.

[0067] In some optional embodiments, after the post-baking step, the PCB multilayer board is further subjected to process performance testing, wherein the process performance testing includes any one or more of the following tests:

[0068] After the PCB multilayer board is subjected to the tin spray test, the 3M tape is repeatedly pulled at the same position of the PCB multilayer board for 3 times. If there is no blistering or falling of ink on the PCB multilayer board, the PCB multilayer board is qualified, otherwise it is unqualified;

[0069] Chemical gold test: After the PCB multilayer board is tested for chemical gold, use 3M tape to repeatedly pull the same position of the PCB multilayer board for 3 times. If there is no bubbling or shedding of ink on the PCB multilayer board, the PCB multilayer board is qualified, otherwise it is unqualified;

[0070] OSP test: After the PCB multilayer board is tested for OSP, use 3M tape to repeatedly pull the same position of the PCB multilayer board for 3 times. If there is no bubbling or falling of ink on the PCB multilayer board, the PCB multilayer board is qualified, otherwise it is unqualified;

[0071] Gold plating test: After the PCB multilayer board is gold-plated, use 3M tape to repeatedly pull the same position of the PCB multilayer board for 3 times. If there is no bubbling or falling off of the PCB multilayer board, the PCB multilayer board is qualified, otherwise it is unqualified.

[0072] In this embodiment, the PCB multilayer board can be subjected to basic performance test and process performance test by sampling test or full inspection after completing the solder mask process. See Table 2 below. After the PCB multilayer board manufactured by this application passes the basic performance test and process performance test, all test items are qualified.

[0073]

[0074]

[0075] Table 2

[0076] In addition, the present invention also tests 875 test samples through the above test, see Table 3 below and the appendix of the specification. Figure 3 Compared with the existing normal exposure scheme, after the copper surface solder mask of the present invention is exposed twice, the film printing defect rate is reduced from 100% to 0.22%, and the improvement is 99.78%.

[0077] plan project Total number of inspections Number of defects Defective rate Existing technology (single exposure) Film Printing 875 875 100％ The present invention Film Printing 875 2 0.22％

[0078] Table 3

[0079] Embodiment 3:

[0080] According to another aspect of an embodiment of the present invention, a device for making a PCB board printed with solder mask ink film is provided, and the device is used to execute the above-mentioned method for making a PCB board printed with solder mask ink film to make a printed circuit board. Through the device of this embodiment, the following steps are performed: pre-treatment, making a PCB multilayer board; printing ink, forming an ink layer by screen printing on the surface of the PCB multilayer board; pre-baking, placing the PCB board in a baking device and pre-baking according to a first preset temperature; first exposure, obtaining a first film data, and generating a second film data by increasing a preset size on one side of the window area in the first film data, and performing a first exposure of the PCB multilayer board to ultraviolet rays according to the second film data; second exposure, performing a second exposure of the PCB multilayer board to ultraviolet rays according to the first film data; development, removing excess ink from the PCB multilayer board.

[0081] The present invention adopts a two-time exposure operation mode. In the first exposure, the large copper surface area is light-cured without vacuum absorption, so as to avoid excessive pressure caused by contact between the film and the large copper surface, thereby eliminating film marks; in the second exposure, the film and the large copper surface are normally vacuumed and bonded together. Because the large copper surface position has been light-cured, no film marks can be produced. The present invention adopts the two-time exposure mode designed in this article, which will greatly reduce the probability of film marks produced by solder mask exposure, and break through the problem of large copper surface film marks that cannot be solved by current conventional exposure designs.

[0082] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. Similarly, in order to simplify the present invention and help understand one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, the various features of the embodiments of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. Wherein, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, wherein each claim itself is a separate embodiment of the present invention.

[0083] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and further may be divided into a plurality of submodules or subunits or subcomponents. Except that at least some of such features and / or processes or units are mutually exclusive.

[0084] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of multiple such elements. The present invention may be implemented with the aid of hardware comprising several different elements and with the aid of appropriately programmed computers. In a unit claim that lists several systems, several of these systems may be embodied by the same hardware item. The use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be understood as limitations on the order of execution.

Claims

1. A method for manufacturing a PCB printed with solder mask ink film, characterized in that: The method comprises: Pre-treatment, making PCB multilayer boards; Printing ink, forming an ink layer by screen printing on the surface of the PCB multilayer board; Pre-baking, placing the PCB board in a baking device and pre-baking it according to a first preset temperature; The first exposure is to obtain the first film data, and generate the second film data by unilaterally increasing the preset size of the window area in the first film data, and perform the first exposure of the PCB multilayer board by ultraviolet rays according to the second film data; A second exposure, exposing the PCB multilayer board to ultraviolet light for a second time according to the first film data; Developing to remove excess ink from the PCB multilayer board.

2. The method for manufacturing a PCB printed with solder mask ink film according to claim 1, characterized in that: The vacuum pressure of the first exposure is 0 mmHg, and the exposure scale is black coffee color with 10-12 grids.

3. The method for manufacturing a PCB printed with solder mask ink film according to claim 1, characterized in that: The vacuum pressure of the second exposure is -400 mmHg±50 mmHg, and the exposure scale is black coffee color with 10-12 grids.

4. The method for manufacturing a PCB printed with solder mask ink film according to claim 1, characterized in that: The preset size is 25 mil.

5. The method for manufacturing a PCB printed with solder mask ink film according to claim 1, characterized in that: After the development, the method further comprises: Text: Print text on the PCB multilayer board; Post-baking: placing the PCB board in a baking device and pre-baking it according to a second preset temperature.

6. The method for manufacturing a PCB printed with solder mask ink film according to claim 5, characterized in that: After the post-baking step, the PCB multilayer board is subjected to basic performance testing, wherein the basic performance testing includes any one or more of the following tests: Appearance test: through AOI inspection or visual inspection, if the PCB multilayer board has no color difference or bubbles, the PCB multilayer board is qualified, otherwise it is unqualified; Undercut test, slicing the PCB multilayer board. If the ink layer thickness of the PCB multilayer board is within 25.4um, the PCB multilayer board is qualified, otherwise it is unqualified; Ink anti-solubility test, by soaking the PCB multilayer board in oil-boiling water for 30 minutes, if the ink of the PCB multilayer board has no softening, bubbling, or oil loss problems, the PCB multilayer board is qualified, otherwise it is unqualified; Acid and alkali resistance test: soak the PCB multilayer board in 10% H2SO4 / 10% NaOH solution for 30 minutes. If there is no bubbling or discoloration of the ink and no oil loss in the 3M tape tensile test, the PCB multilayer board is qualified, otherwise it is unqualified. IR furnace test: put the PCB multilayer board through the reflow oven at 160℃→260℃ for 3 times. If there is no serious discoloration of the ink, no bubbling or falling of the ink, the PCB multilayer board is qualified, otherwise it is unqualified. Ink adhesion test: stick 3M tape on the PCB multilayer board and pull it. If the 3M tape does not fall off, the PCB multilayer board passes the test, otherwise it fails. Hardness test: Use a hardness tester to scratch the PCB multilayer board for testing. If there are no ink scratches or exposed copper, the PCB multilayer board passes the test, otherwise it fails.

7. The method for manufacturing a PCB printed with solder mask ink film according to claim 5, characterized in that: After the post-baking step, the process performance test of the PCB multilayer board is also performed, and the process performance test includes any one or more of the following tests: After the PCB multilayer board is subjected to the tin spray test, the 3M tape is repeatedly pulled at the same position of the PCB multilayer board for 3 times. If there is no blistering or falling of ink on the PCB multilayer board, the PCB multilayer board is qualified, otherwise it is unqualified; Chemical gold test: After the PCB multilayer board is tested for chemical gold, use 3M tape to repeatedly pull the same position of the PCB multilayer board for 3 times. If there is no bubbling or shedding of ink on the PCB multilayer board, the PCB multilayer board is qualified, otherwise it is unqualified; OSP test: After the PCB multilayer board is tested for OSP, use 3M tape to repeatedly pull the same position of the PCB multilayer board for 3 times. If there is no bubbling or falling of ink on the PCB multilayer board, the PCB multilayer board is qualified, otherwise it is unqualified; Gold plating test: After the PCB multilayer board is gold-plated, use 3M tape to repeatedly pull the same position of the PCB multilayer board for 3 times. If there is no bubbling or falling off of the PCB multilayer board, the PCB multilayer board is qualified, otherwise it is unqualified.

8. The method for manufacturing a PCB printed with solder mask ink film according to claim 5, characterized in that: After the post-baking, the process also includes the front and back processes of the PCB board, and the post-process of the PCB board includes: surface treatment, molding, testing, and packaging.

9. The method for manufacturing a PCB printed with solder mask ink film according to claim 1, characterized in that: The pre-processing includes: inner layer production, inner layer AOI, lamination, drilling, and outer layer production in sequence.

10. A PCB board manufacturing device printed with solder mask ink film, characterized in that: The device is used to execute the method for manufacturing a PCB board printed with solder mask ink film as described in any one of claims 1 to 9 to manufacture a printed circuit board.

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