Negative pressure two-phase liquid cooling system based on thin film evaporation

Abstract

The invention discloses a negative-pressure two-phase liquid cooling system based on film evaporation, which belongs to the technical field of two-phase liquid cooling, and comprises a closed negative-pressure heat dissipation module, a condensation filtering module, a liquid storage and supply module, a monitoring module, a vacuum pump and a controller, and is used for creating a vacuum environment for a whole loop; the output end of the closed negative pressure heat dissipation module is connected with the input end of the condensation filtering module, the output end of the condensation filtering module is connected with the input end of the liquid storage and supply module, the output end of the liquid storage and supply module is connected with one end of a three-way ball valve, and the other two connectors of the three-way ball valve are connected with the vacuum pump and the input end of the closed negative pressure heat dissipation module respectively. The invention solves the problems that the critical heat flux density is not high enough in the current common cold plate liquid cooling technology; the problem that the reliability of the system is reduced due to the fluctuation of the system pressure and the flow of the cooling working medium caused by the disordered growth of boiling bubbles of the cooling working medium under the high heat flow density can be solved.

Description

Technical Field

[0001] The invention relates to the technical field of two-phase liquid cooling, and in particular to a negative pressure two-phase liquid cooling system based on thin film evaporation. Background Art

[0002] With the rapid development of technologies such as cloud computing, artificial intelligence, and big data, the computing power demand of data centers continues to rise, and the power density of server chips has also increased accordingly, which has led to the problem of server heat dissipation becoming a major obstacle to its development. As a mature technology in server heat dissipation, cold plate liquid cooling technology closely fits the cold plate with the heating element, and the liquid flows in the cold plate to take away the heat to achieve heat dissipation. The coolant is generally deionized water. Cold plate liquid cooling technology is widely used in data center server heat dissipation because it takes up less space, requires less working fluid, and is green and environmentally friendly.

[0003] At present, cold plate liquid cooling technologies include single-phase cold plate technology and two-phase cold plate technology. Single-phase cold plate technology cannot utilize the latent heat of phase change of liquid working fluid, and its heat dissipation efficiency and critical heat flux density are low, which cannot meet the heat dissipation requirements of high heat flux density chips. When facing high-power chip heat dissipation, single-phase cold plates need to significantly increase the coolant flow rate to improve heat dissipation capacity, which will increase energy consumption and reduce cost performance. In two-phase cold plate technology, the cooling working fluid is usually a low-boiling point fluorine-containing refrigerant. Although this cooling working fluid can utilize the latent heat of boiling vaporization to achieve efficient heat transfer, the disordered growth of boiling bubbles under high heat flux density can easily cause system pressure and flow fluctuations, thereby reducing the reliability of the system. Summary of the invention

[0004] The purpose of the present invention is to provide a negative pressure two-phase liquid cooling system based on thin film evaporation, which solves the problem that the critical heat flux density of the currently commonly used cold plate liquid cooling technology is not high enough to meet the heat dissipation requirements of the high heat flux density of server chips, and the disordered growth of boiling bubbles of the cooling fluid under high heat flux density causes fluctuations in system pressure and cooling fluid flow, thereby reducing the reliability of the system.

[0005] To achieve the above-mentioned purpose, the present invention provides a negative pressure two-phase liquid cooling system based on thin film evaporation, comprising a closed negative pressure heat dissipation module, which is arranged in a server chassis and is used to exchange heat with a chip;

[0006] A condensation filtration module is used to condense the water vapor output by the closed negative pressure heat dissipation module into liquid and filter the liquid at the same time;

[0007] A liquid storage and supply module, used to receive the deionized water output by the condensation and filtration module and to supply deionized water to the closed negative pressure heat dissipation module;

[0008] Monitoring module, used to monitor the flow and pressure in the heat dissipation circuit;

[0009] Vacuum pump, used to create a vacuum environment for the entire heat dissipation circuit;

[0010] The controller is used to adjust the deionized water flow of the condensation filtration module in the heat dissipation loop and the pump power of the liquid storage and supply module according to the server chip temperature and the deionized water flow in the heat dissipation loop.

[0011] Preferably, the output end of the closed negative pressure heat dissipation module is connected to the input end of the condensation filtration module, the output end of the condensation filtration module is connected to the input end of the liquid storage and supply module, the output end of the liquid storage and supply module is connected to one end of a three-way ball valve, and the other two interfaces of the three-way ball valve are respectively connected to the vacuum pump and the input end of the closed negative pressure heat dissipation module.

[0012] Preferably, the condensation filtration module includes a steam circuit and a liquid circuit, wherein the steam circuit is provided with a condenser, the condenser is provided with a heat exchanger, the liquid circuit is provided with a flow meter, and the output end of the steam circuit is connected to the filter after merging with the output end of the liquid circuit.

[0013] Preferably, a steam pipe and a liquid pipe are provided in the server chassis, the closed negative pressure heat dissipation module is connected to the condensation filtration module through the steam pipe and the liquid pipe, the condensation filtration module is connected to the liquid storage and supply module through the liquid pipe, and the liquid storage and supply module is connected to the closed negative pressure heat dissipation module through the liquid pipe.

[0014] Preferably, the closed negative pressure heat dissipation module includes an integrated structure, an upper cover plate of the heat dissipation module is arranged above the integrated structure, an interface material is arranged below the integrated structure, the lower end of the interface material is in contact with the server chip, the integrated structure is airtightly connected to the upper cover plate of the heat dissipation module, the upper cover plate of the heat dissipation module is provided with liquid inlet and outlet pipelines and steam pipelines, the liquid inlet and outlet pipelines are connected to the liquid pipeline, and the steam pipelines are connected to the steam pipeline.

[0015] Preferably, the integrated structure includes a capillary core and a chip packaging shell, the capillary core is fixed at the top of the chip packaging shell, the inlet and outlet liquid pipelines are output after winding around the capillary core in the closed negative pressure heat dissipation module, the part of the inlet and outlet liquid pipelines in the closed negative pressure heat dissipation module is provided with holes for liquid outflow, the liquid pipeline is connected to the input end of the liquid circuit after being output from the closed negative pressure heat dissipation module, and the steam pipeline is connected to the input end of the steam circuit after being output from the closed negative pressure heat dissipation module.

[0016] Preferably, the liquid storage and supply module includes a solenoid valve, the output end of the solenoid valve is connected to a liquid storage tank, the output end of the liquid storage tank is connected to a micro gear pump, the output end of the micro gear pump is connected to flow meter 2, the output end of flow meter 2 is connected to one end of a three-way ball valve, and the input end of the solenoid valve is connected to the output end of the filter.

[0017] Preferably, the monitoring module includes a pressure sensor, temperature sensor 1 and temperature sensor 2, wherein the pressure sensor is arranged inside the closed negative pressure heat dissipation module, the temperature sensor 1 is arranged at the server chip, and the temperature sensor 2 is arranged at the junction of the steam circuit and the liquid circuit.

[0018] Preferably, the controller is a PID controller, which is used to receive and process information collected by flow meter 1, flow meter 2 and the monitoring module, and automatically control the opening of the solenoid valve, the cooling water flow of the condenser and the power of the micro gear pump according to the receiving and processing results.

[0019] Therefore, the negative pressure two-phase liquid cooling system based on thin film evaporation using the above structure has the following beneficial effects:

[0020] (1) By using high-performance capillary cores in a closed negative pressure heat dissipation module to enhance heat exchange, the chip heat dissipation method is changed from traditional single convection heat transfer and boiling phase change heat transfer to deionized water film evaporation heat transfer. The critical heat flux density can be increased by 5-7 times compared with the traditional method, meeting the heat dissipation requirements of high heat flux density of server chips;

[0021] (2) By using a PID control system, the chip temperature and power consumption are linked to the cooling system in feedback, ensuring stable chip temperature while saving pump work, thereby reducing the energy consumption of the cooling system;

[0022] (3) By using a closed circulation loop and capillary evaporation heat exchange, the generation of bubbles during the phase change process is effectively avoided, preventing system pressure fluctuations.

[0023] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of a heat dissipation circuit of an embodiment of a negative pressure two-phase liquid cooling system based on thin film evaporation of the present invention;

[0025] Figure 2 A top view of a server chassis of an embodiment of a negative pressure two-phase liquid cooling system based on thin film evaporation of the present invention;

[0026] Figure 3 It is a structural schematic diagram of a closed negative pressure heat dissipation module of an embodiment of a negative pressure two-phase liquid cooling system based on thin film evaporation of the present invention;

[0027] Figure 4 The figure is a schematic diagram of a controller control flow of an embodiment of a negative pressure two-phase liquid cooling system based on thin film evaporation of the present invention.

[0028] Reference numerals

[0029] 1. Server chassis; 11. Sealed negative pressure heat dissipation module; 12. Liquid pipeline; 13. Steam pipeline; 111. Upper cover of heat dissipation module; 112. Integrated structure; 1121. Capillary core; 1122. Chip packaging shell; 113. Interface material; 114. Server chip; 21. Flow meter one; 22. Flow meter two; 3. Condenser; 31. Heat exchanger; 4. Filter; 5. Solenoid valve; 6. Liquid storage tank; 7. Micro gear pump; 8. Three-way ball valve; 91. Pressure sensor; 921. Temperature sensor one; 922. Temperature sensor two; 10. Vacuum pump. DETAILED DESCRIPTION

[0030] Example

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0035] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting", "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0037] In the description of the present invention, it should be noted that the directions or positional relationships indicated by terms such as “upper”, “lower”, “left”, “right”, “inside” and “outside” are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0038] The specific model specifications need to be selected and determined based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0039] like Figures 1 to 3 As shown, a negative pressure two-phase liquid cooling system based on thin film evaporation includes a closed negative pressure heat dissipation module 11, which is arranged in a server chassis 1 and is used to exchange heat with a chip. A condensation filtration module is used to condense water vapor into liquid and filter the liquid at the same time. A liquid storage and supply module is used to receive deionized water output by the condensation filtration module and supply deionized water to the closed negative pressure heat dissipation module 11. A monitoring module is used to monitor the flow and pressure of important positions in the heat dissipation circuit. A vacuum pump 10 is used to create a vacuum environment for the entire heat dissipation circuit; since the boiling point of water under normal pressure is close to 100°C, which is higher than the safe working junction temperature of the server chip 114 (generally within 85°C), it is necessary to form a negative pressure in the heat dissipation circuit so that the boiling point of deionized water is within the range of 40 to 60°C. A controller is used to adjust the power of the condensation filtration module and the liquid storage and supply module in the heat dissipation circuit according to the temperature of the server chip 114 and the flow rate of deionized water in the heat dissipation circuit.

[0040] The output end of the closed negative pressure heat dissipation module 11 is connected to the input end of the condensation filtration module, the output end of the condensation filtration module is connected to the input end of the liquid storage and supply module, the output end of the liquid storage and supply module is connected to one end of the three-way ball valve 8, and the other two interfaces of the three-way ball valve 8 are respectively connected to the vacuum pump 10 and the input end of the closed negative pressure heat dissipation module 11.

[0041] The condensation filtration module includes a steam loop and a liquid loop, wherein the steam loop includes a condenser 3, on which a heat exchanger 31 is provided. The condenser 3 is a device for cooling water vapor after phase change into liquid. The condenser 3 is associated with the temperature of the server chip 114 through a controller, and the cooling water flow of the condenser 3 is adjusted in time to ensure that the steam is condensed in time and the liquid temperature is adjusted. A flow meter 21 is provided on the liquid loop, and a filter 4 is connected after the output end of the steam loop merges with the output end of the liquid loop. The filter 4 will filter impurity particles larger than 50μm in the cooling liquid to prevent the loop from being blocked.

[0042] A steam pipe 13 and a liquid pipe 12 are provided in the server chassis 1. The closed negative pressure heat dissipation module 11 is connected to the condensation filtration module through the steam pipe 13 and the liquid pipe 12. The condensation filtration module is connected to the liquid storage and supply module through the liquid pipe 12. The liquid storage and supply module is connected to the closed negative pressure heat dissipation module 11 through the liquid pipe 12.

[0043] The closed negative pressure heat dissipation module 11 includes an integrated structure 112, an upper cover plate 111 of the heat dissipation module is arranged above the integrated structure 112, an interface material 113 is arranged below the integrated structure 112, the lower end of the interface material 113 is in contact with the server chip 114, the integrated structure 112 is tightly connected to the upper cover plate 111 of the heat dissipation module, the upper cover plate 111 of the heat dissipation module is provided with liquid inlet and outlet pipelines and steam pipelines, the liquid inlet and outlet pipelines are connected to the liquid pipeline 12, and the steam pipeline is connected to the steam pipeline 13.

[0044] The closed negative pressure heat dissipation module 11 is mainly composed of three parts. The upper cover plate 111 of the heat dissipation module is provided with liquid inlet and outlet pipelines and steam pipelines, and the pipelines and the cover plate are connected together by welding; the integrated structure 112 is mainly composed of a chip packaging shell 1122 and a capillary core 1121. A liquid groove surrounding the capillary core 1121 is processed on the chip packaging shell 1122 to ensure that the liquid can immerse the capillary core 1121 from all sides, so that the temperature distribution on the chip surface is uniform; the capillary core 1121 and the packaging shell are combined together through an integrated sintering process.

[0045] Deionized water is used as the working fluid, and the surface tension and latent heat of vaporization of water are relatively large. When heat is dissipated through evaporation phase change in a porous structure, the main factor limiting its critical heat flux density is that the steam cannot escape in time, resulting in deterioration of heat transfer. Therefore, the present invention adopts a method of sintering a large-particle copper powder mixed with a pore-forming agent or sintering two copper powders of different particle sizes to prepare a double-aperture capillary wick 1121. The small pores can ensure the liquid supply of the capillary wick 1121, and the large-aperture pores can provide more space for the steam to escape, accelerate the steam discharge rate, and increase the evaporation heat transfer coefficient of the capillary wick 1121.

[0046] The interface material 113 is placed between the server chip 114 and the integrated structure 112 to reduce the thermal resistance of thermal conduction; the upper cover plate 111 of the heat dissipation module and the integrated structure 112 are assembled by welding technology to ensure the air tightness of the module, and are connected to the PCB board by bolts to fit the entire closed negative pressure heat dissipation module 11 tightly to the server chip 114.

[0047] The liquid inlet and outlet pipelines are output after passing through the capillary core 1121 in the closed negative pressure heat dissipation module 11. The part of the liquid inlet and outlet pipelines inside the closed negative pressure heat dissipation module 11 is provided with a hole for liquid outflow. The liquid pipeline 12 is connected to the input end of the liquid circuit after being output from the closed negative pressure heat dissipation module 11, and the steam pipeline 13 is connected to the input end of the steam circuit after being output from the closed negative pressure heat dissipation module 11.

[0048] The shell of the server chassis 1 is made of metal, and the main heating element inside is the server chip 114. The closed negative pressure heat dissipation module 11 separates the heat dissipation of the server chip 114 from the internal environment of the server chassis 1. After removing the non-condensable gas, the deionized water directly enters the interior of the closed negative pressure heat dissipation module 11 from the liquid inlet end of the liquid pipe 12 and surrounds the capillary core 1121 for replenishing the capillary core 1121. The remaining small amount of liquid is discharged from the liquid outlet end of the liquid pipe 12, and the water vapor generated by absorbing the heat dissipation of the server chip 114 is discharged from the server chassis 1 through the steam pipe 13.

[0049] The liquid storage and supply module includes a solenoid valve 5, the output end of the solenoid valve 5 is connected to a liquid storage tank 6, the output end of the liquid storage tank 6 is connected to a micro gear pump 7, the liquid storage tank 6 is made of a material that does not react with deionized water, stores deionized water, and ensures sufficient liquid supply in the circuit. The output end of the micro gear pump 7 is connected to a flow meter 22, the output end of the flow meter 22 is connected to one end of a three-way ball valve 8, and the input end of the solenoid valve 5 is connected to the output end of the filter 4. The micro gear pump 7 does work on the liquid, increases the pressure and flow rate of the liquid in the heat dissipation circuit, and enables the deionized water to overcome the resistance loss in the pipeline and complete the entire cycle.

[0050] The monitoring module includes a pressure sensor 91, a temperature sensor 1 921 and a temperature sensor 2 922, wherein the pressure sensor 91 is arranged inside the closed negative pressure heat dissipation module 11 to monitor the internal pressure of the closed negative pressure heat dissipation module 11, the temperature sensor 1 921 is arranged at the server chip 114 to measure the temperature of the server chip 114, and the temperature sensor 2 922 is arranged at the junction of the steam loop and the liquid loop to measure the temperature of deionized water.

[0051] The controller is used to receive and process the information collected by flow meter 1 21, flow meter 2 22 and the monitoring module, and then the controller automatically controls the opening of the solenoid valve 5 and the cooling water flow of the condenser 3 according to the receiving and processing results. The solenoid valve 5 is connected in series in the loop, and the opening of the solenoid valve 5 is controlled by the controller, thereby controlling the liquid flow in the loop.

[0052] The PID control is used to adjust the flow rate of deionized water in the heat dissipation circuit at different server chip 114 temperatures, so as to meet the heat dissipation requirements while saving energy as much as possible. The specific adjustment strategy is as follows: Figure 4 The main goal of the controller regulation is to achieve temperature stability of the server chip 114 under different power consumption. The temperature control of the server chip 114 is achieved by adjusting the door opening of the solenoid valve 5 in the loop and the flow of deionized water in the power control loop of the micro gear pump 7 and adjusting the flow of cooling water in the condenser 3 to control the temperature of the deionized water.

[0053] First, the target temperature of the server chip 114 is set to T s The PID control deviation Error is defined as the set target temperature T s The actual temperature T is obtained by real-time monitoring with the temperature sensor 921 c The difference between them. Therefore, the adjustment formula of the opening of the solenoid valve 5 is:

[0054]

[0055] The control formula for the cooling water flow of condenser 3 is:

[0056]

[0057] Among them, K p is the proportional gain, K i is the integral gain, K d is the differential gain, valve is the solenoid valve 5, cond is the condenser 3, and t is the time.

[0058] When the system is running, the controller meets the system heat dissipation requirements under different conditions according to the set server chip 114 temperature and heat dissipation circuit pressure, while reducing energy consumption. When adjusting the flow of deionized water in the heat dissipation circuit, while ensuring that the liquid can overcome the flow resistance, it is preferred to adjust the door opening of the solenoid valve 5 to increase the circuit flow to save the pump work of the micro gear pump 7. When the power consumption and temperature of the server chip 114 further increase, it is selected to adjust the pump power of the micro gear pump 7 to achieve flow increase. In order to protect the safe operation of various components in the heat dissipation circuit, the pump power of the micro gear pump 7 is set to a safe operating range.

[0059] By using adaptive PID control, the proportional, integral and differential gains of the PID controller are automatically adjusted according to the dynamic characteristics of the system and external conditions to achieve more precise control. The variable proportional gain adjustment can make the system respond quickly to changes in the temperature of the server chip 114, increase or decrease the working fluid flow rate and the cooling water flow rate of the condenser 3 in the loop. The variable integral gain adjustment can gradually increase the working fluid flow rate and the cooling water flow rate of the condenser 3 when the high power consumption lasts for a long time, ensuring that the system quickly adapts to changes in power consumption, and gradually reduces it at low power to avoid excessive adjustment causing the temperature of the server chip 114 to change too much. Using variable differential gain adjustment can predict the trend of system changes, avoid excessive increase in the working fluid mass flow rate and the cooling water flow rate of the condenser 3 at high power consumption, excessive response at low power consumption, reduce system oscillation and overshoot, and improve system stability.

[0060] In the specific implementation process, before the system is operated, the three-way ball valve 8 is first turned to connect the vacuum pump 10 with the closed negative pressure heat dissipation module 11, and then the vacuum pump 10 is started to make the internal pressure of the loop reach the set range, and then the three-way ball valve 8 is turned. At this time, the loop is disconnected from the vacuum pump 10, and the output end of the flow meter 22 is connected to the input end of the closed negative pressure heat dissipation module 11, and then liquid is injected into the liquid storage tank 6. When the server chip 114 starts to work and generates heat, the capillary core 1121 in the integrated structure 112 dissipates heat through the evaporation phase change of the deionized water transported from the liquid inlet end of the liquid pipeline 12, and the steam generated by the capillary core 1121 is discharged from the server chassis 1 through the steam pipeline 13. The steam passes through the condenser 3 and condenses into liquid, and the liquid temperature is adjusted through the heat exchanger 31. At the same time, a small amount of liquid in the liquid pipeline 12 flows out from the liquid outlet, and then the mass flow of the deionized water not absorbed by the integrated structure 112 is measured by the flow meter 1 21.

[0061] The two parts of liquid at the steam loop output end and the liquid loop output end are combined and flow through the filter 4 to filter out tiny impurities in the deionized water to avoid pipeline blockage. The filtered deionized water flows through the solenoid valve 5 and enters the liquid storage tank 6. The deionized water flows out from the output end of the liquid storage tank 6 and flows into the micro gear pump 7. After the micro gear pump 7 works on the deionized water, it is transported to the closed negative pressure heat dissipation module 11 through the flow meter 22. In this process, the flow meter 22 can measure the total mass flow of the deionized water transported to the closed negative pressure heat dissipation module 11. Then the deionized water repeats the process of evaporation and heat dissipation in the closed negative pressure heat dissipation module 11 to complete the cycle.

[0062] The present invention uses the above-mentioned negative pressure two-phase liquid cooling system based on thin film evaporation to solve the problem that the critical heat flux density of the currently commonly used cold plate liquid cooling technology is not high enough to meet the heat dissipation requirements of the high heat flux density of the server chip, and the disordered growth of boiling bubbles of the cooling fluid under high heat flux density causes fluctuations in system pressure and cooling fluid flow, thereby reducing the reliability of the system.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. A negative pressure two-phase liquid cooling system based on thin film evaporation, characterized in that: It includes a closed negative pressure heat dissipation module, which is arranged in the server chassis and is used to exchange heat with the chip; A condensation filtration module is used to condense the water vapor output by the closed negative pressure heat dissipation module into liquid and filter the liquid at the same time; A liquid storage and supply module, used to receive the deionized water output by the condensation and filtration module and to supply deionized water to the closed negative pressure heat dissipation module; Monitoring module, used to monitor the flow and pressure in the heat dissipation circuit; Vacuum pump, used to create a vacuum environment for the entire heat dissipation circuit; The controller is used to adjust the deionized water flow of the condensation filtration module in the heat dissipation loop and the pump power of the liquid storage and supply module according to the server chip temperature and the deionized water flow in the heat dissipation loop.

2. A negative pressure two-phase liquid cooling system based on thin film evaporation according to claim 1, characterized in that: The output end of the closed negative pressure heat dissipation module is connected to the input end of the condensation filtration module, the output end of the condensation filtration module is connected to the input end of the liquid storage and supply module, the output end of the liquid storage and supply module is connected to one end of a three-way ball valve, and the other two interfaces of the three-way ball valve are respectively connected to the vacuum pump and the input end of the closed negative pressure heat dissipation module.

3. A negative pressure two-phase liquid cooling system based on thin film evaporation according to claim 2, characterized in that: The condensation filtration module includes a steam circuit and a liquid circuit, wherein the steam circuit is provided with a condenser, the condenser is provided with a heat exchanger, the liquid circuit is provided with a flow meter, and the output end of the steam circuit is connected to the filter after merging with the output end of the liquid circuit.

4. A negative pressure two-phase liquid cooling system based on thin film evaporation according to claim 3, characterized in that: Steam pipes and liquid pipes are arranged in the server chassis. The closed negative pressure heat dissipation module is connected to the condensation filtration module through the steam pipe and the liquid pipe. The condensation filtration module is connected to the liquid storage and supply module through the liquid pipe. The liquid storage and supply module is connected to the closed negative pressure heat dissipation module through the liquid pipe.

5. A negative pressure two-phase liquid cooling system based on thin film evaporation according to claim 4, characterized in that: The closed negative pressure heat dissipation module includes an integrated structure, an upper cover plate of the heat dissipation module is arranged above the integrated structure, an interface material is arranged below the integrated structure, the lower end of the interface material is in contact with the server chip, the integrated structure is airtightly connected to the upper cover plate of the heat dissipation module, the upper cover plate of the heat dissipation module is provided with liquid inlet and outlet pipelines and steam pipelines, the liquid inlet and outlet pipelines are connected to the liquid pipeline, and the steam pipeline is connected to the steam pipeline.

6. A negative pressure two-phase liquid cooling system based on thin film evaporation according to claim 5, characterized in that: The integrated structure includes a capillary core and a chip packaging shell. The capillary core is fixed on the top of the chip packaging shell. The inlet and outlet liquid pipelines are output after winding around the capillary core in the closed negative pressure heat dissipation module. The part of the inlet and outlet liquid pipelines in the closed negative pressure heat dissipation module is provided with holes for liquid outflow. The liquid pipeline is connected to the input end of the liquid circuit after being output from the closed negative pressure heat dissipation module, and the steam pipeline is connected to the input end of the steam circuit after being output from the closed negative pressure heat dissipation module.

7. A negative pressure two-phase liquid cooling system based on thin film evaporation according to claim 6, characterized in that: The liquid storage and supply module includes a solenoid valve, the output end of the solenoid valve is connected to a liquid storage tank, the output end of the liquid storage tank is connected to a micro gear pump, the output end of the micro gear pump is connected to flow meter 2, the output end of flow meter 2 is connected to one end of a three-way ball valve, and the input end of the solenoid valve is connected to the output end of the filter.

8. The negative pressure two-phase liquid cooling system based on thin film evaporation according to claim 7, characterized in that: The monitoring module includes a pressure sensor, a temperature sensor 1 and a temperature sensor 2, wherein the pressure sensor is arranged inside the closed negative pressure heat dissipation module, the temperature sensor 1 is arranged at the server chip, and the temperature sensor 2 is arranged at the junction of the steam circuit and the liquid circuit.

9. A negative pressure two-phase liquid cooling system based on thin film evaporation according to claim 8, characterized in that: The controller is a PID controller, which is used to receive and process the information collected by flow meter 1, flow meter 2 and the monitoring module, and automatically control the opening of the solenoid valve, the cooling water flow of the condenser and the power of the micro gear pump according to the receiving and processing results.

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