Inductor structure integrated with external PIN

Abstract

An inductor structure integrated with an outer PIN comprises an inductor, the inductor is provided with a base body and an inner conductor located in the base body, and the two ends of the inner conductor are exposed at the top and the bottom of the base body to form a top electrode and a bottom electrode respectively; the outer PIN is integrally arranged on the base body, the bottom of the outer PIN is connected with the PCB, and the top of the outer PIN is connected with an upper circuit board which is arranged above the inductor and is provided with an application module device; the application module device is connected with a top electrode of the inductor through the upper circuit board, and a bottom electrode of the inductor is connected with the PCB. Through cooperation of the inductor integrated outer PIN structure, the application module device and the PCB, the inductor structure design which is free of extra lines, low in line loss, low in process difficulty, low in cost, small in module size and high in space utilization rate is achieved.

Description

Technical Field

[0001] The invention relates to electronic components, and in particular to an inductor structure with integrated external PIN. Background Art

[0002] The current servers and power modules are increasingly inclined towards miniaturization, low loss and high efficiency. For conventional power inductors, two or more electrodes are usually concentrated on one surface of the chip in the circuit, and need to be connected through pins or PCB built-in circuits in the application circuit. If the components are not on the same surface of the chip, part pins or PCB punching are also required to conduct the surrounding and upper and lower components through the copper deposition process.

[0003] If the inductor electrode is connected to each device through the same patch surface and a pin needle or a built-in PCB circuit is required as a medium for connection, the overall volume of the application module will be large, the line loss will be high, and the overall efficiency will be low. In order to meet the requirements of small overall volume and high utilization, other devices except the inductor (such as MOS tubes and capacitors) need to be very close to the inductor, where the inductor is connected to the PCB board through the bottom. If other devices are placed on the top of the inductor, part pins or PCB punching are required to connect the upper and lower parts through the copper plating process. In this case, the pin solution still cannot minimize the module volume, and the PCB punching costs a lot and the process is difficult.

[0004] It should be noted that the information disclosed in the above background technology section is only used for understanding the background of the present application, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the invention

[0005] The main purpose of the present invention is to overcome the defects existing in the above-mentioned background technology and provide an inductor structure with integrated external PIN.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] An inductor structure with integrated external PIN, comprising:

[0008] An inductor having a base and an internal conductor in the base, wherein two ends of the internal conductor are exposed at the top and bottom of the base to form a top electrode and a bottom electrode respectively;

[0009] An external PIN is integrated on the substrate, the bottom of the external PIN is connected to the PCB board, and the top of the external PIN is connected to the upper circuit board on which the application module device is installed above the inductor;

[0010] The application module device is connected to the top electrode of the inductor through an upper circuit board, and the bottom electrode of the inductor is connected to the PCB board.

[0011] Further:

[0012] The application module device includes a combination of one or more of a MOS tube, a capacitor and a resistor.

[0013] The external PIN is of C type or I type.

[0014] The outer PIN is made of copper material.

[0015] The outer PIN is made by forming a metal layer on a substrate through a metallization process.

[0016] The upper circuit board is a PCB.

[0017] The substrate is a magnet with magnetic properties.

[0018] Two groups of internal conductors are symmetrically arranged in the substrate to form a dual inductor, and the application module device cooperates with the dual inductor to form a corresponding circuit.

[0019] The application module device includes two groups of symmetrical MOS tube circuits, which are respectively connected to the dual inductors.

[0020] The present invention has the following beneficial effects:

[0021] The present invention provides an inductor structure with integrated external PINs, which innovatively integrates external PINs on the substrate of the inductor to achieve the coordinated connection between the inductor and surrounding application devices such as MOS tubes, capacitors and resistors. This design significantly reduces the overall volume of the module, reduces manufacturing costs, and reduces circuit losses. The bottom of the external PIN integrated with the inductor is connected to the PCB board, and the top of the external PIN is connected to the upper circuit board on which the application module device is installed above the inductor. The innovative design of the present invention not only improves the space utilization rate, but also simplifies the circuit connection and reduces the line loss caused by the traditional Pin needle or the built-in circuit of the PCB. In addition, the structure omits additional circuits, reduces the process difficulty, and makes the module design more convenient. In summary, the present invention achieves the goals of low circuit loss, high volume utilization, low-cost manufacturing and simplified process flow through its unique structural design, and provides an effective solution for the miniaturization, low loss and high efficiency of servers and power modules.

[0022] Other beneficial effects of the embodiments of the present invention will be further described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of an inductor structure integrating a C-shaped external PIN according to an embodiment of the present invention.

[0024] Figure 2 It is a schematic diagram of an I-type external PIN integrated in an inductor structure according to another embodiment of the present invention.

[0025] Figure 3 It is a three-dimensional schematic diagram of an inductor structure with integrated external PIN according to an embodiment of the present invention.

[0026] Figure 4 It is a three-dimensional schematic diagram from another perspective of the inductor structure with integrated external PIN according to an embodiment of the present invention. DETAILED DESCRIPTION

[0027] The following is a detailed description of the embodiments of the present invention. It should be emphasized that the following description is only exemplary and is not intended to limit the scope and application of the present invention.

[0028] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, connection can be used for fixing as well as for coupling or communication.

[0029] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] See also Figures 1 to 4The embodiment of the present invention provides an inductor structure with integrated external PIN, including: an inductor, having a substrate 1 and an internal conductor 2 located in the substrate 1, wherein the two ends of the internal conductor 2 are exposed at the top and bottom of the substrate 1 to form a top electrode 21 and a bottom electrode 22 respectively; an external PIN 3, which is integrated on the substrate 1, for example, symmetrically arranged on both sides of the substrate 1, the bottom 32 of the external PIN 3 is connected to a PCB board 4, and the top 31 of the external PIN 3 is connected to an upper circuit board 7 on which an application module device is installed above the inductor; the application module device is connected to the top electrode 21 of the inductor through the upper circuit board 7, and the bottom electrode 22 of the inductor is connected to the PCB board 4. The upper circuit board 7 can be a PCB board.

[0032] like Figure 1 As shown, in one embodiment, the outer PIN 3 may be C-shaped. Figures 2 to 4 As shown, in another embodiment, the outer PIN 3 may be of type I. In addition, the specific configuration of the outer PIN is not limited to the above-mentioned form.

[0033] In some embodiments, the outer PIN 3 may be made of copper material, or formed by forming a metal layer on a substrate through a metallization process such as electroplating metallization layer, PVD metallization layer, etc.

[0034] In some embodiments, the substrate 1 may be a magnet having magnetic properties.

[0035] like Figures 1 to 4 As shown, in some embodiments, two groups of internal conductors 2 are symmetrically arranged in the substrate 1 to form a dual inductor. Figure 3 and Figure 4 As shown, the application module device can cooperate with the dual inductor configuration corresponding circuit. The application module device can include a combination of one or more of a MOS tube 5, a capacitor and a resistor 6. Figure 3 and Figure 4 As shown, in one embodiment, the application module device may include two groups of symmetrical MOS tube circuits, which are respectively connected to the dual inductors.

[0036] The present invention realizes the connection between the inductor and the surrounding application module devices by integrating external PIN on the inductor substrate. This design effectively reduces the module volume, manufacturing cost and circuit loss. The integration of external PIN simplifies the circuit connection, reduces the space occupied by traditional pins or PCB built-in circuits, and eliminates additional circuits, reducing the process difficulty. This structure improves space utilization, makes module design more convenient, and provides an effective solution for miniaturization, low loss and high efficiency of devices such as servers and power modules.

[0037] The specific embodiments of the present invention are further described below.

[0038] An inductor structure with integrated external PIN 3, specifically Figures 1 to 4 As shown. The inductor structure may include two inductors arranged in the substrate 1, wherein the internal conductor 2 is symmetrically arranged in the upper and lower centers, and the external PIN 3 is integrated around the inductor. The Vin terminal of the PCB board 4 is connected through the bottom 32 of these external PINs 3, and the top 31 of the external PIN 3 is connected to the upper circuit board 7 on which the application module device is installed above the substrate 1. The application module device includes a MOS tube 5, a capacitor and a resistor 6, etc., which are further connected to the top electrode 21 of the inductor through the upper circuit board 7. When working, the current is transmitted to the bottom electrode 22 through the internal conductor 2 of the inductor, and finally connected to the Vout terminal of the PCB board 4 through the bottom electrode 22. The integrated external PIN 3 can be made of conductive copper or a metallization layer (such as an electroplated metallization layer, a PVD metallization layer, etc.), and its selection depends on the feasibility and cost-effectiveness of the inductor. The inductor structure design improves the volume utilization rate of the application module device, reduces redundant lines, and thus reduces line losses.

[0039] The present invention uses an external integrated PIN of the inductor to replace the traditional PIN pin row, PCB punching or PCB built-in circuit, and realizes the connection between devices. The external integrated PIN pin structure of the inductor is connected with the application module without additional circuits, effectively reducing the line loss, simplifying the process flow, reducing costs, reducing the module volume, and improving space utilization.

[0040] The present invention designs and integrates external conductors around the inductor, that is, integrates external PINs, thereby realizing the interconnection between the inductor and surrounding application devices such as capacitors and resistors. This design reduces the overall volume of the module, reduces manufacturing costs, and reduces circuit losses, thereby achieving low circuit losses, high volume utilization, and low manufacturing costs of the application module.

[0041] The inductor structure of the present invention has the following advantages:

[0042] 1. Reduce line loss.

[0043] 2. Minimize the size of the entire module.

[0044] 3. Reduce the cost of module miniaturization.

[0045] 4. Reduce the process difficulty of module miniaturization.

[0046] 5. Make module design more convenient.

[0047] In summary, the present invention realizes an inductor structure design with no additional lines, low line loss, low process difficulty, low cost, small module size and high space utilization.

[0048] The above content is a further detailed description of the present invention in combination with specific / preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, without departing from the concept of the present invention, it can also make several substitutions or modifications to these described embodiments, and these substitutions or modifications should be regarded as belonging to the protection scope of the present invention. In the description of this specification, the description of the reference terms "an embodiment", "some embodiments", "preferred embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily target the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In the absence of mutual contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples. Although the embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and modifications can be made herein without departing from the scope of protection of the patent application.

Claims

1. An inductor structure with integrated external PIN, characterized in that: include: An inductor having a base and an internal conductor in the base, wherein two ends of the internal conductor are exposed at the top and bottom of the base to form a top electrode and a bottom electrode respectively; An external PIN is integrated on the substrate, the bottom of the external PIN is connected to the PCB board, and the top of the external PIN is connected to the upper circuit board on which the application module device is installed above the inductor; The application module device is connected to the top electrode of the inductor through an upper circuit board, and the bottom electrode of the inductor is connected to the PCB board.

2. The inductor structure with integrated external PIN as claimed in claim 1, characterized in that: The application module device includes a combination of one or more of a MOS tube, a capacitor and a resistor.

3. The inductor structure with integrated external PIN as claimed in claim 1 or 2, characterized in that: The external PIN is of C type or I type.

4. The inductor structure with integrated external PIN as claimed in any one of claims 1 to 3, characterized in that: The outer PIN is made of copper material.

5. The inductor structure with integrated external PIN as claimed in any one of claims 1 to 3, characterized in that: The outer PIN is made by forming a metal layer on a substrate through a metallization process.

6. The inductor structure with integrated external PIN as claimed in any one of claims 1 to 5, characterized in that: The substrate is a magnet with magnetic properties.

7. The inductor structure with integrated external PIN as claimed in any one of claims 1 to 6, characterized in that: The upper circuit board is a PCB.

8. The inductor structure with integrated external PIN as claimed in any one of claims 1 to 7, characterized in that: Two groups of internal conductors are symmetrically arranged in the substrate to form a dual inductor, and the application module device cooperates with the dual inductor to form a corresponding circuit.

9. The inductor structure with integrated external PIN as claimed in claim 8, characterized in that: The application module device includes two groups of symmetrical MOS tube circuits, which are respectively connected to the dual inductors.

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