Fan-out type plate-level packaging bonding machine

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to a fan-out type plate-level packaging bonding machine which comprises a support and a cavity, the cavity is fixed to the inner side of the support, and a vacuum transmission door is arranged at the front end of the cavity; a pressure applying mechanism is assembled on the top of the support and extends into the cavity. An upper pressing platform is mounted at the bottom of the pressure applying mechanism; a lower pressing platform is arranged at the bottom in the cavity; and an alignment mechanism and a bearing mechanism are assembled on the inner side of the cavity. Through the structural design of the bearing mechanism, the alignment mechanism, the pressure applying mechanism and the PIN ejecting mechanism, feeding and discharging, high-precision alignment and press fit of products are achieved; and the flatness of each lamination layer is high, the parallelism between lamination surfaces is high, the uniformity of force acting on a product is high, the temperature uniformity of the platform is high, and temperature rise and temperature drop can be controlled, so that the board-level package can accommodate more chips, the production efficiency is improved, and the cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a fan-out type board-level packaging bonding machine. Background Art

[0002] Fan-out panel-level packaging is a technology that packages multiple wafers or chips on a large panel. It has the advantages of low cost and high space utilization, and is currently the most advanced packaging process. A bonding machine is required when bonding two products. In the prior art, the heating and cooling functions of the heating and cooling platform of the bonding machine are integrated, and oil circuits are used for heating and cooling. Since the board surface is too large, the pipeline needs to be of a certain length, but the uniformity of the pipeline distribution makes it difficult to achieve temperature uniformity. For example, the longer the pipeline, the greater the difference between the inlet temperature and the outlet temperature. At the same time, it is not easy to achieve high temperature and high pressure uniformly on the product surface in the prior art. In order to solve the above technical problems, we propose a fan-out panel-level packaging bonding machine. Summary of the invention

[0003] The object of the present invention is to provide a fan-out type panel-level packaging bonding machine to solve the problems raised in the above background technology.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] A fan-out board-level packaging bonding machine comprises a bracket and a cavity, wherein the cavity is fixed on the inner side of the bracket and a vacuum transmission door is arranged at the front end of the cavity;

[0006] A pressure mechanism is installed on the top of the bracket, and the pressure mechanism extends into the cavity;

[0007] An upper pressing platform is installed at the bottom of the pressing mechanism;

[0008] A lower pressing platform is provided at the bottom of the cavity;

[0009] The inner side of the cavity is equipped with a positioning mechanism and a receiving mechanism.

[0010] Preferably, the alignment mechanism includes a mounting seat, an upper guide rail, a U-shaped plate, a vertical plate, an alignment electric cylinder, a floating joint, a tension and pressure sensor, a linear bearing, an alignment bellows and an alignment block. Mounting seats are fixed on all four sides of the cavity. The upper guide rail is installed on the mounting seat. A U-shaped plate is installed on the upper guide rail. A vertical plate is installed on the top of the U-shaped plate. The alignment electric cylinder is installed on the top of the cavity through a bracket. The telescopic shaft of the alignment electric cylinder is fixed with a tension and pressure sensor and a floating joint in sequence. The floating joint is fixedly connected to the vertical plate. Two linear bearings are arranged on the side of the cavity. A pull rod is movably installed in the linear bearing. One end of the pull rod is connected to the U-shaped plate, and the other end is installed with an alignment block. An alignment bellows is sleeved on the outer side of the pull rod.

[0011] Preferably, the receiving mechanism includes a lower guide rail, a receiving bracket, a receiving linear bearing, a receiving bellows, a smooth cylinder and a receiving block. The lower guide rail is installed below the mounting seat, and the receiving bracket is installed on the lower guide rail. Two receiving linear bearings are arranged on the side of the cavity. A receiving push rod is movably installed in the receiving linear bearing. One end of the receiving push rod is connected to the receiving bracket, and the other end is installed with a receiving block. A receiving bellows is sleeved on the outer side of the receiving push rod, and the telescopic bearing of the smooth cylinder is fixedly connected to the receiving bracket.

[0012] Preferably, a top PIN mechanism is provided at the bottom of the bracket, and the top PIN mechanism includes a top PIN screw, a drive motor, a top PIN support rod and a bearing platform. A drive motor is fixed to the bottom inner side of the bracket, and a top PIN screw is fixed to the output end of the drive motor. The outer side of the top PIN screw is threadedly connected to the bearing platform, and the bearing platform is slidably connected to the inner side of the cavity. A group of top PIN support rods is provided on the bearing platform, and an avoidance hole is provided on the lower pressing platform, and the top PIN support rod is located in the avoidance hole.

[0013] Preferably, the upper pressing platform includes a pressure plate, a uniform pressure layer, an upper platform insulation layer, an upper platform cooling layer, an upper platform heating layer, an upper platform uniform temperature layer and an upper workbench which are fixedly connected in sequence from top to bottom, and the pressure plate is fixedly connected to the pressure mechanism.

[0014] Preferably, the lower pressing platform includes a lower platform substrate, a lower platform insulation layer, a lower platform cooling layer, a lower platform heating layer, a lower platform temperature uniforming layer and a lower workbench which are fixedly connected in sequence from bottom to top, and the lower platform substrate is fixed at the inner bottom of the cavity.

[0015] Preferably, the pressure mechanism includes a pressure electric cylinder, a pressure shaft and a bellows, five pressure electric cylinders are evenly fixed on the top of the bracket, the output end of the pressure electric cylinder is connected to the pressure shaft, the pressure shaft extends into the cavity, the bottom of the pressure shaft is fixedly connected to the pressure action plate, and the pressure shaft is mounted with a bellows.

[0016] Preferably, a gas port and a liquid port are fixed to one end of the pressure plate, and a plurality of guide shafts are evenly and slidably connected to the top of the pressure plate.

[0017] Preferably, a water pipe group is arranged on the inner side of the bracket and close to the cavity. Meanwhile, through the above technical solution, the present invention has at least the following beneficial effects:

[0018] The present invention realizes loading and unloading of products, high-precision positioning and pressing through the structural design of the receiving mechanism, the alignment mechanism, the pressure mechanism and the top PIN mechanism; and each pressing layer has high flatness, high parallelism between the pressing surfaces, high uniformity of the force acting on the product and high uniformity of the platform temperature, and can control heating and cooling, so that the board-level package can accommodate more chips, thereby improving production efficiency and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0020] Figure 1 It is a structural schematic diagram of the present invention;

[0021] Figure 2 It is a schematic diagram of the connection structure between the bracket and the cavity of the present invention;

[0022] Figure 3 It is a schematic diagram of the connection structure between the bracket and the water pipe group of the present invention;

[0023] Figure 4 It is a schematic diagram of the connection structure between the pressure-applying mechanism and the upper pressing mechanism of the present invention;

[0024] Figure 5 It is a side view of the pressure-applying mechanism and the upper pressing mechanism of the present invention;

[0025] Figure 6 It is a structural schematic diagram of the upper pressing platform and the lower pressing platform of the present invention;

[0026] Figure 7 It is a structural schematic diagram of the top PIN mechanism of the present invention;

[0027] Figure 8 The structure of the cavity of the present invention is shown in FIG. Figure 1 ;

[0028] Fig. 9 The structure of the cavity of the present invention is shown in FIG. Figure 2 ;

[0029] Fig.10 It is a structural schematic diagram of the alignment mechanism of the present invention;

[0030] Fig.11 It is a structural schematic diagram of the alignment mechanism and the pressure-applying mechanism of the present invention;

[0031] Fig.12It is a schematic diagram of the structural decomposition of the alignment mechanism and the receiving mechanism of the present invention;

[0032] Fig.13 It is a structural side view of the alignment mechanism and the receiving mechanism of the present invention;

[0033] Fig.14 It is a top view of the structure of the alignment mechanism and the receiving mechanism of the present invention.

[0034] In the figure: 1 bracket, 2 cavity, 201 vacuum transmission door, 202 water pipe group, 3 top PIN mechanism, 301 top lifting PIN screw rod, 302 drive motor, 303 top PIN support rod, 304 bearing platform, 4 pressure mechanism, 401 pressure electric cylinder, 402 pressure shaft, 403 bellows, 5 upper pressing platform, 51 pressure plate, 511 air port, 512 liquid port, 513 guide shaft, 52 uniform pressure layer, 53 upper platform insulation layer, 54 upper platform cooling layer, 55 upper platform heating layer, 56 upper platform uniform temperature layer, 57 upper workbench, 6 lower pressing platform , 61 lower platform base plate, 62 lower platform insulation layer, 63 lower platform cooling layer, 64 lower platform heating layer, 65 lower platform uniform temperature layer, 66 lower workbench, 7 alignment mechanism, 701 mounting seat, 702 upper guide rail, 703 U-shaped plate, 704 vertical plate, 705 alignment electric cylinder, 706 floating joint, 707 tension and pressure sensor, 708 linear bearing, 709 alignment bellows, 710 alignment block, 8 supporting mechanism, 801 lower guide rail, 802 supporting bracket, 803 supporting linear bearing, 804 supporting bellows, 805 smooth cylinder, 806 supporting block. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0036] Example 1

[0037] Reference Figure 1-14 A fan-out type board-level packaging bonding machine includes a bracket 1 and a cavity 2. The cavity 2 is fixed on the inner side of the bracket 1. A vacuum transmission door 201 is arranged at the front end of the cavity 2. The vacuum transmission door 201 can be opened and closed to facilitate the entry and exit of chips to be bonded. When closed, the vacuum transmission door 201 can ensure that the cavity 2 is in a sealed state;

[0038] A pressure mechanism 4 is installed on the top of the bracket 1, and the pressure mechanism extends into the cavity 2; an upper pressing platform 5 is installed at the bottom of the pressure mechanism 4; a lower pressing platform 6 is provided at the bottom of the cavity 2, and the upper pressing platform 5 and the lower pressing platform 6 are used to press chip product one and product two together; the inner side of the cavity 2 is equipped with a positioning mechanism 7 and a receiving mechanism 8.

[0039] Specifically, the alignment mechanism 7 includes a mounting seat 701, an upper guide rail 702, a U-shaped plate 703, a vertical plate 704, an alignment electric cylinder 705, a floating joint 706, a tension pressure sensor 707, a linear bearing 708, an alignment bellows 709 and an alignment block 710. The four sides of the cavity 2 are fixed with mounting seats 701, the upper guide rail 702 is installed on the mounting seat 701, the upper guide rail 702 is installed with a U-shaped plate 703, the top of the U-shaped plate 703 is installed with a vertical plate 704, the alignment electric cylinder 705 is installed on the top of the cavity 2 through a bracket, the telescopic shaft of the alignment electric cylinder 705 is fixed with a tension pressure sensor 707 and a floating joint 706 in sequence, the floating joint 706 is fixedly connected to the vertical plate 704, and two linear bearings are provided on the side of the cavity 2. Bearing 708, a pull rod is movably installed in the linear bearing 708, one end of the pull rod is connected to the U-shaped plate 703, and the other end is installed with an alignment block 710, and the outer side of the pull rod is sleeved with an alignment bellows 709; the function of the alignment mechanism is to align the four sides of product one and product two in the cavity 2 to align the two products; when in use, the telescopic shaft of the alignment electric cylinder 705 moves, driving the floating joint 706, the vertical plate 704 and the U-shaped plate 703 to move, and the U-shaped plate 703 slides on the upper guide rail 702, thereby driving the pull rod to slide in the linear bearing 708, and finally making the alignment block 710 move, and aligning the four sides of product one and product two; the two ends of the alignment bellows 709 are respectively connected to the cavity 2 and the U-shaped plate 703, and the alignment bellows 709 and the linear bearing 708 cooperate to perform sealing.

[0040] The receiving mechanism 8 includes a lower guide rail 801, a receiving bracket 802, a receiving linear bearing 803, a receiving bellows 804, a smooth cylinder 805 and a receiving block 806. The lower guide rail 801 is installed below the mounting seat 701, and the receiving bracket 802 is installed on the lower guide rail 801. Two receiving linear bearings 803 are arranged on the side of the cavity 2. A receiving push rod is movably installed in the receiving linear bearing 803. One end of the receiving push rod is connected to the receiving bracket 802, and the other end is installed with a receiving block 806. The outer side of the receiving push rod is sleeved with a receiving bellows 804, and the telescopic bearing of the smooth cylinder 805 is fixedly connected to the receiving bracket 802; the function of the receiving mechanism 8 is to lift the bearing product 1; the movement of the telescopic shaft of the smooth cylinder 805 drives the receiving bracket 802 to slide on the lower guide rail 801, and drives the receiving push rod and the receiving block 806 to move, thereby realizing the function of lifting the product 1.

[0041] A top PIN mechanism 3 is provided at the bottom of the bracket 1, and the top PIN mechanism 3 includes a top PIN screw rod 301, a drive motor 302, a top PIN support rod 303 and a bearing platform 304. The bottom of the inner side of the bracket 1 is fixed with a drive motor 302, and the output end of the drive motor 302 is fixed with a top PIN screw rod 301. The outer side of the top PIN screw rod 301 is threadedly connected with a bearing platform 304. The bearing platform 304 is slidably connected to the inner side of the cavity 2. A group of top PIN support rods 303 are provided on the bearing platform. 03. An avoidance hole is provided on the lower pressing platform 6, and the top PIN support rod 303 is located in the avoidance hole; when the driving motor 302 is started, the output end of the driving motor 302 drives the lifting PIN screw rod 301 to rotate, so that the bearing platform 304 can drive the top PIN support rod 303 to move up and down, so that the top PIN support rod 303 moves vertically along the avoidance hole and moves to the bottom of the lower pressing platform. There are multiple top PIN support rods 303, and the top PIN support rods 303 play the role of supporting product 2.

[0042] The upper pressing platform 5 includes a pressure plate 51, a uniform pressure layer 52, an upper platform insulation layer 53, an upper platform cooling layer 54, an upper platform heating layer 55, an upper platform temperature uniform layer 56 and an upper workbench 57, which are fixedly connected from top to bottom in sequence. The pressure plate 51 is fixedly connected to the pressure mechanism 4; the pressure plate 51 is made of a high-thickness plate and cannot be deformed under high pressure; the uniform pressure layer 52 is composed of an air bag layer, and thermal expansion affects the pressure. Since the force is mutual, it is fed back to the pressure in the air bag. By adjusting the pressure in the air bag, uniform pressure is achieved. At the same time, the uniform pressure layer increases temperature control to avoid high-temperature damage; the upper platform insulation layer 53 uses material properties to ensure the heating of the upper layer to avoid heat loss and affect the heating speed; the upper platform cooling layer 54 is used to cool the workbench; the upper platform heating layer 55 is used to heat the workbench; the upper platform temperature uniform layer 56 uses material properties to evenly transfer the temperature to the workbench; the upper workbench 57 uses material properties to control thermal expansion, processing flatness and deformation.

[0043] The lower pressing platform 6 includes a lower platform substrate 61, a lower platform insulation layer 62, a lower platform cooling layer 63, a lower platform heating layer 64, a lower platform temperature-uniform layer 65 and a lower workbench 66, which are fixedly connected in sequence from bottom to top, wherein the lower platform substrate 61 is fixed at the inner bottom of the cavity 2; the lower workbench 66 utilizes material properties to control thermal expansion, processing flatness and deformation; the lower platform temperature-uniform layer 65 utilizes material properties to evenly transfer temperature to the workbench; the lower platform heating layer 64 is used to heat the workbench; the lower platform cooling layer 63 is used to cool the workbench; the lower platform insulation layer 62 utilizes material properties to ensure heating of the upper layer, avoid heat loss, and affect the heating speed; the lower platform substrate 61 is a high-pressure load-bearing plate and cannot be deformed under high pressure.

[0044] The above-mentioned uniform temperature principle: using the anisotropy of material properties and temperature, the temperature transfer speed in the plane direction is much higher than the perpendicular direction to the plane, resulting in uniform plane temperature; the above-mentioned heating principle: due to the thermal expansion of the plate material, the inside of the plate can only arch upwards, and the edges will diffuse outwards, resulting in overall thermal expansion of the plate and poor uniformity in the Z direction.

[0045] The pressure mechanism 4 includes a pressure electric cylinder 401, a pressure shaft 402 and a bellows 403. Five pressure electric cylinders 401 are evenly fixed on the top of the bracket 1. The output end of the pressure electric cylinder 401 is connected to the pressure shaft 402, and the pressure shaft 402 extends to the inside of the cavity. The bottom of the pressure shaft 402 is fixedly connected to the pressure action plate 51, and the pressure shaft 402 is sleeved with a bellows 403; when the pressure electric cylinder 401 is started, the pressure shaft 402 applies downward pressure to the pressure action plate 51, and the bellows 403 plays a sealing role. Five pressure electric cylinders 401 and the pressure shaft 402 are used to make the applied pressure more uniform; at the same time, in the later stage of the specific implementation process, since the pressure shaft 402 acts on the pressure action plate 51, if the applied pressure is too large, it will cause stress concentration on the edge of the pressure shaft, and a stress release groove needs to be opened.

[0046] An air port 511 and a liquid port 512 are fixed at one end of the pressure plate 51, and a plurality of guide shafts 513 are evenly distributed and slidably connected to the top of the pressure plate 51. The setting of the guide shafts 513 can provide a guide for the movement of the pressure plate 51, so that the pressure plate 51 can move more stably.

[0047] A water pipe group 202 is arranged on the inner side of the bracket 1 and close to the cavity 2 .

[0048] Usage process: (a) First, the vacuum transmission door 201 and the PIN mechanism 3 are started, and the PIN support rod 303 rises to the material taking position, and the product 1 is handed over to the PIN support rod 303 of the PIN mechanism by the robot fork;

[0049] (b) Product 1 is raised from the top PIN mechanism to the transfer position, the receiving mechanism 8 moves, the receiving block 806 moves horizontally (i.e., retracts), and product 1 is transferred from the top PIN mechanism 3 to the receiving mechanism 8;

[0050] (c) Then the top PIN support rod 303 descends to the material taking position, and the second product is handed over to the top PIN mechanism by the robot fork;

[0051] (d) Product 2 is lifted up to the alignment area by the top PIN mechanism; then the alignment electric cylinder 705 is started to push out the alignment block 710, which aligns the four sides of product 1 and product 2 to ensure the accuracy of product bonding. After the alignment is completed, the alignment mechanism 7 retracts. A tension pressure sensor 707 is provided on the alignment mechanism to avoid damage to the product.

[0052] (e) closing the vacuum transfer door 201 and evacuating the chamber 2;

[0053] (f) The receiving block 806 of the receiving mechanism 8 is disengaged (i.e., expanded outward), so that product 1 falls on product 2. The receiving mechanism 8 is driven by a gentle cylinder 805 to avoid damaging the products by excessive speed. Then, the PIN mechanism 3 descends, and product 1 and product 2 fall onto the lower workbench 66.

[0054] (g) Finally, the pressure mechanism 4 is started, so that the upper pressing platform 5 applies pressure to the product 1 and the product 2 on the lower pressing platform, and the two products are pressed together.

[0055] After bonding is completed, release the vacuum, use the top PIN mechanism to lift the bonded product 1 and product 2 to the material removal position, and use the robot fork to take out the products.

[0056] The present invention realizes loading and unloading of products, high-precision positioning and pressing through the structural design of the receiving mechanism, the alignment mechanism, the pressure mechanism and the top PIN mechanism; and each pressing layer has high flatness, high parallelism between the pressing surfaces, high uniformity of the force acting on the product and high uniformity of the platform temperature, and can control heating and cooling, so that the board-level package can accommodate more chips, thereby improving production efficiency and reducing costs.

[0057] Obviously, the embodiments described above are only some embodiments of the present invention, rather than all embodiments. The preferred embodiments of the present invention are given in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific embodiments, or to perform equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of the present invention, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present invention.

Claims

1. A fan-out type board-level packaging bonding machine, characterized in that: It comprises a support (1) and a cavity (2), wherein the cavity (2) is fixed on the inner side of the support (1), and a vacuum transmission door (201) is arranged at the front end of the cavity (2); A pressure mechanism (4) is mounted on the top of the support (1), and the pressure mechanism extends into the cavity (2); An upper pressing platform (5) is installed at the bottom of the pressing mechanism (4); A lower pressing platform (6) is provided at the bottom of the cavity (2); The inner side of the cavity (2) is equipped with a positioning mechanism (7) and a receiving mechanism (8).

2. A fan-out board-level packaging bonding machine according to claim 1, characterized in that: The alignment mechanism (7) comprises a mounting seat (701), an upper guide rail (702), a U-shaped plate (703), a vertical plate (704), an alignment electric cylinder (705), a floating joint (706), a tension pressure sensor (707), a linear bearing (708), an alignment bellows (709) and an alignment block (710). The four sides of the cavity (2) are all fixed with mounting seats (701), the upper guide rail (702) is mounted on the mounting seat (701), the upper guide rail (702) is mounted with a U-shaped plate (703), and the top of the U-shaped plate (703) is mounted with a vertical plate (710). The aligning electric cylinder (705) is installed on the top of the cavity (2) through a bracket, and the telescopic shaft of the aligning electric cylinder (705) is fixed with a tension pressure sensor (707) and a floating joint (706) in sequence. The floating joint (706) is fixedly connected to the vertical plate (704). Two linear bearings (708) are arranged on the side of the cavity (2). A pull rod is movably installed in the linear bearing (708). One end of the pull rod is connected to the U-shaped plate (703), and the other end is installed with an aligning block (710). The outer side of the pull rod is sleeved with an aligning bellows (709).

3. A fan-out board-level packaging bonding machine according to claim 2, characterized in that: The receiving mechanism (8) comprises a lower guide rail (801), a receiving bracket (802), a receiving linear bearing (803), a receiving bellows (804), a smooth cylinder (805) and a receiving block (806); the lower guide rail (801) is mounted below the mounting seat (701); the receiving bracket (802) is mounted on the lower guide rail (801); two receiving linear bearings (803) are arranged on the side of the cavity (2); a receiving push rod is movably installed in the receiving linear bearing (803); one end of the receiving push rod is connected to the receiving bracket (802), and the other end is installed with a receiving block (806); the outer side of the receiving push rod is sleeved with a receiving bellows (804); the telescopic bearing of the smooth cylinder (805) is fixedly connected to the receiving bracket (802).

4. A fan-out board-level packaging bonding machine according to claim 1, characterized in that: A top PIN mechanism (3) is provided at the bottom of the bracket (1), and the top PIN mechanism (3) comprises a top PIN screw rod (301), a drive motor (302), a top PIN support rod (303) and a bearing platform (304). A drive motor (302) is fixed to the bottom of the inner side of the bracket (1), and a top PIN screw rod (301) is fixed to the output end of the drive motor (302). The outer side of the top PIN screw rod (301) is threadedly connected to the bearing platform (304), and the bearing platform (304) is slidably connected to the inner side of the cavity (2). A group of top PIN support rods (303) are provided on the bearing platform, and an avoidance hole is provided on the lower pressing platform (6), and the top PIN support rod (303) is located in the avoidance hole.

5. The fan-out board-level packaging bonding machine according to claim 1, characterized in that: The upper pressing platform (5) comprises a pressure plate (51), a pressure-uniforming layer (52), an upper platform heat-insulating layer (53), an upper platform cooling layer (54), an upper platform heating layer (55), an upper platform temperature-uniforming layer (56) and an upper working table (57) which are fixedly connected in sequence from top to bottom, and the pressure plate (51) is fixedly connected to the pressure mechanism (4).

6. A fan-out type board-level packaging bonding machine according to claim 5, characterized in that: The lower pressing platform (6) comprises a lower platform substrate (61), a lower platform heat insulation layer (62), a lower platform cooling layer (63), a lower platform heating layer (64), a lower platform temperature uniformity layer (65) and a lower working table (66) which are fixedly connected in sequence from bottom to top, and the lower platform substrate (61) is fixed to the inner bottom of the cavity (2).

7. A fan-out type board-level packaging bonding machine according to claim 6, characterized in that: The pressure mechanism (4) comprises a pressure electric cylinder (401), a pressure shaft (402) and a bellows (403). Five pressure electric cylinders (401) are evenly fixed on the top of the bracket (1). The output end of the pressure electric cylinder (401) is connected to the pressure shaft (402). The pressure shaft (402) extends into the cavity. The bottom of the pressure shaft (402) is fixedly connected to the pressure action plate (51). The pressure shaft (402) is sleeved with a bellows (403).

8. The fan-out type board-level packaging bonding machine according to claim 5, characterized in that: An air port (511) and a liquid port (512) are fixed to one end of the pressure plate (51), and a plurality of guide shafts (513) are evenly distributed and slidably connected to the top of the pressure plate (51).

9. The fan-out board-level packaging bonding machine according to claim 1, characterized in that: A water pipe group (202) is arranged on the inner side of the support (1) and close to the cavity (2).

Images