Heat sink, heat sink block or heat sink plate, and method for manufacturing same

Abstract

The invention relates to a heat sink, a heat sink block or a heat sink plate and a manufacturing method thereof. At least one package includes a die including a first surface, a second surface opposite the first surface, and one or more sidewalls transverse to the first surface and the second surface. One or more sidewalls extend from the first surface to the second surface. A plurality of separate and distinct heat spreaders are on the first surface of the die. Each respective separate and distinct heat sink of the plurality of separate and distinct heat sinks is separate and distinct from an adjacent separate and distinct heat sink of the plurality of separate and distinct heat sinks. The plurality of channels separate each respective one of the plurality of heat sinks from an adjacent one of the plurality of heat sinks. In some packages, a resilient thermally conductive material is present within and fills the plurality of channels.

Description

Technical Field

[0001] The present disclosure relates to one or more embodiments of a heat sink, slug or spreader, and one or more embodiments of methods of making the same. Background Art

[0002] The semiconductor industry has shown considerable interest in techniques and structures that reduce or prevent the effects generated by thermo-mechanical stress. For example, when a heat sink, heat block or heat plate is present on a die of a semiconductor package and there is a rise in temperature in the environment in which the package is located, the heat sink, heat block or heat plate may expand when dissipating the heat energy generated by the rise in temperature within the semiconductor package. Alternatively, when a heat sink, heat block or heat plate is present on a die of a semiconductor package and there is a drop in temperature in the environment in which the package is located, the heat sink, heat block or heat plate may contract when dissipating the heat energy generated by the drop in temperature within the semiconductor package. When the heat sink, heat block or heat plate expands and contracts due to these changes in temperature, the heat sink, heat block or heat plate may expand or contract by different amounts compared to other components of the semiconductor package due to differences in the coefficient of thermal expansion (CTE). These differences in expansion and contraction due to rising and falling temperatures generate mechanical stresses between the various components of the semiconductor package (e.g., the heat sink, heat slug or plate and the die), thereby causing or increasing the likelihood of defects propagating within the semiconductor package (e.g., cracking, delamination, or some other similar or like type of defect). Summary of the invention

[0003] At least one embodiment of a device (e.g., a semiconductor package, a semiconductor device, or some other similar or similar electronic device) of the present disclosure relates to a die, the die comprising a first surface, a second surface, and one or more sidewalls, the second surface being opposite to the first surface, the one or more sidewalls being transverse to the first surface and the second surface. The one or more sidewalls extend from the first surface to the second surface. A resin covers the one or more sidewalls of the die and extends around the die. A first non-conductive layer is on the second surface of the die. A plurality of conductive vias extend through the first non-conductive layer to the die. A plurality of conductive connection structures are coupled to the plurality of conductive vias and are on the first non-conductive layer. The plurality of conductive connection structures include a plurality of end surfaces separated from the plurality of conductive vias. A second non-conductive layer is on the first non-conductive layer and extends around the plurality of conductive connection structures. The plurality of end surfaces of the plurality of conductive connection structures are exposed from the second non-conductive layer. A plurality of heat sinks are on the first surface of the die. Each corresponding heat sink of the plurality of heat sinks is separated and different from an adjacent heat sink of the plurality of heat sinks. A plurality of channels separate each corresponding heat sink of the plurality of heat sinks from an adjacent heat sink of the plurality of heat sinks.

[0004] In some embodiments, the resilient second thermally conductive material at least partially fills the plurality of channels. The second thermally conductive material is configured to increase thermal dissipation of thermal energy during operation.

[0005] At least one embodiment of a method of manufacturing is directed to forming at least one embodiment of a semiconductor package as described above.

[0006] In view of the above discussion, embodiments of the present disclosure are directed to preventing, mitigating or reducing the likelihood of mechanical defects propagating within a semiconductor package including a heat sink, heat slug or heat plate, as will become readily apparent in view of the discussion herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to better understand the embodiments, reference will now be made to the accompanying drawings by way of example. In the accompanying drawings, the same reference numerals identify the same or similar elements or actions, unless the context otherwise indicates. The sizes and relative proportions of the elements in the accompanying drawings are not necessarily drawn to scale. For example, some of these elements may be enlarged and positioned to enhance the readability of the accompanying drawings.

[0008] Figure 1A Is the package along the Figure 1B A cross-sectional view taken along line 1A-1A in FIG.

[0009] Figure 1B Yes Figure 1A A top plan view of the package shown in ;

[0010] Figure 2A The embodiment of the package of the present disclosure is as follows Figure 2B A cross-sectional view taken along line 2A-2A in FIG.

[0011] Figure 2B Yes Figure 2A A top plan view of an embodiment of a package of the present disclosure shown in;

[0012] Figure 3 is a top plan view of an alternative embodiment of a package of the present disclosure;

[0013] Figure 4 is a top plan view of an alternative embodiment of a package of the present disclosure;

[0014] Figure 5 is a top plan view of an alternative embodiment of a package of the present disclosure;

[0015] Figure 6 is a top plan view of an alternative embodiment of a package of the present disclosure;

[0016] Fig. 7A is an alternative embodiment of the package of the present disclosure along the Figure 7BA cross-sectional view taken along line 7A-7A shown in FIG.

[0017] Figure 7B Yes Fig. 7A A top plan view of an alternative embodiment of a package of the present disclosure shown in;

[0018] Fig. 8A is an alternative embodiment of the package of the present disclosure along the Figure 8B A cross-sectional view taken along line 8A-8A shown in FIG.

[0019] Figure 8B Yes Fig. 8A A top plan view of an alternative embodiment of a package of the present disclosure shown in;

[0020] Fig. 9A is a stress diagram of the interface of a package without a heat sink, heat slug or heat plate;

[0021] Fig. 9B Yes Figure 1A and Figure 1B Stress diagram of the interface within the package shown in;

[0022] Fig. 9C As disclosed herein Figure 2A and Figure 2B A stress diagram of an interface within an embodiment of a package of the present disclosure shown in;

[0023] Fig.10 Is manufactured as Figure 2A and Figure 2B Flowchart of an embodiment of a method of multiple heat sinks, heat blocks or heat plates of a packaged embodiment of the present disclosure shown in;

[0024] Figures 11A-11E Yes Fig.10 sectional views of corresponding steps of the manufacturing method embodiment in the flowchart shown in Figure 2A and Figure 2B A plurality of heat sinks, heat slugs or heat plates of the packaged embodiments of the present disclosure shown in ;

[0025] Fig.12 Is manufactured as Fig. 7A and Figure 7B Flowchart of an alternative method of multiple heat sinks, heat slugs or heat plates of an alternative embodiment of the package of the present disclosure shown in;

[0026] Figure 13A-13C Yes Fig.12 sectional views of corresponding steps of the manufacturing method embodiment in the flowchart shown in Figure 2A and Figure 2B A plurality of heat sinks, heat slugs or heat plates of the packaged embodiments of the present disclosure shown in ;

[0027] Fig.14 Is manufactured as Figure 2A and Figure 2B A flowchart of an alternative method of multiple heat sinks, heat slugs or heat plates of an alternative embodiment of the package of the present disclosure shown in; and

[0028] Figure 15A-15E Yes Fig.14 sectional views of corresponding steps of the manufacturing method embodiment in the flowchart shown in Figure 2A and Figure 2B Multiple heat sinks, heat slugs or heat plates of the packaged embodiments of the present disclosure shown in FIG. DETAILED DESCRIPTION

[0029] In the following description, certain details are set forth to provide a thorough understanding of various embodiments of the apparatus, methods, and articles. However, those skilled in the art will appreciate that other embodiments may be practiced without these details. In other examples, well-known structures and methods associated with, for example, semiconductor manufacturing processes, are not shown or described in detail in some of the figures to avoid unnecessarily obscuring the description of the embodiments.

[0030] Unless the context requires otherwise, throughout this specification and the claims that follow, the word "comprise" and its variations such as "include", "comprising", "including", "including", "including but not limited to" are to be interpreted in an open inclusive sense.

[0031] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification do not necessarily refer to the same embodiment, or to all embodiments. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments to obtain further embodiments.

[0032] Headings are provided for convenience only and do not interpret the scope or meaning of the disclosure or the claims.

[0033] The sizes and relative positions of the elements in the drawings are not necessarily drawn to scale. For example, the shapes and angles of various elements may not be drawn to scale, and some of these elements may be enlarged and positioned to improve the readability of the drawings.

[0034] The use of "transverse" means that a surface, sidewall, or similar or similar structure or feature is angled relative to another corresponding surface, sidewall, or similar or similar corresponding structure or feature. For example, if a first surface is transverse to a first sidewall, the first surface may be at an angle equal to 25 degrees, 35 degrees, 45 degrees, 75 degrees, 90 degrees, 120 degrees, etc.

[0035] Generally, in semiconductor packages, a heat sink, heat block or heat plate is coupled to the surface of the package, the surface of the die in the package, or both. The heat sink, heat block or heat plate is generally manufactured as a continuous layer of a thermally conductive material (e.g., copper). Such a continuous heat sink, heat block or heat plate can be manufactured as a separate component, which is then coupled to the surface of the package, the surface of the die, or both. Alternatively, such a continuous heat sink can be grown on the surface of the package, the surface of the die, or both. However, since such a heat sink, heat block or heat plate is manufactured with a continuous layer of conductive material, the thermomechanical stress generated when the package is exposed to a temperature rise or fall is high, thereby causing the propagation of defects in the package, or increasing the possibility of defects propagating in the package. When defects propagate in the package, the package is generally damaged, so that the package will work outside the selected tolerance, causing the package to become defective and need to be replaced. Due to the increased probability of these defects occurring in the package, the overall life of the package is reduced, because the increased probability of defects occurring only increases as the package is exposed to more times of temperature rise and fall that generate these high thermomechanical stresses. In order to alleviate these high thermomechanical stresses, the heat sink, heat block or heat plate made of a continuous layer of conductive material is manufactured to be as thin as possible. However, there are manufacturing limitations that limit the thinness of the heat sink, heat block or heat plate made of a continuous layer of conductive material, so that the high thermomechanical stresses can only be alleviated to a certain extent by reducing the thickness of the heat sink, heat block or heat plate made of a continuous layer of conductive material.

[0036] In view of the above discussion, the present disclosure is directed to providing one or more embodiments of a package that includes a plurality of separate and different heat sinks, heat blocks or heat plates that are separate and different from each other to further mitigate the thermomechanical stresses that occur when the package is exposed to a rise or fall in temperature. For example, a plurality of separate and different heat sinks, heat blocks or heat plates further mitigate the thermomechanical stresses generated by a rise or fall in temperature in the package. By providing a plurality of separate and different heat sinks, heat blocks or heat plates to further mitigate these thermomechanical stresses, the possibility of defects propagating within the package is prevented or further reduced. By providing a plurality of separate and different heat sinks, heat blocks or heat plates to prevent or further reduce the possibility of defects, the useful life of the package is further increased, so that the package operates within a selected tolerance for a longer time compared to a package including a heat sink, heat block or heat plate made of a continuous layer of conductive material.

[0037] Figure 1A is package 100 along the Figure 1B A cross-sectional view taken along line 1A-1A shown in FIG. Figure 1B Yes Figure 1A A top plan view of package 100 is shown in FIG.

[0038] Package 100 includes a die 102 including a first surface 104, a second surface 106 opposite the first surface 104, and one or more sidewalls 108 transverse to the first surface 104 and the second surface 106. The one or more sidewalls 108 extend from the first surface 104 to the second surface 106.

[0039] An insulating, non-conductive or dielectric layer 110 is on the second surface 106 of the die 102. The dielectric layer 110 may be an ABF. One or more conductive vias 112 extend through the dielectric layer 110. One or more conductive vias 112 extend through the dielectric layer 110 to the second surface 106 of the die 102. The one or more conductive vias 112 are coupled to contact pads (not shown) of the die 102 along and at the second surface 106 of the die 102. The dielectric layer 110 includes one or more sidewalls 114 that are coplanar with one or more sidewalls 108 of the die 102 in the package 100.

[0040] The resin 116 extends around the die 102 and the dielectric layer 110. The resin 116 is a non-conductive material, such as a molding compound, an epoxy compound, or some other similar or similar type of non-conductive material. The resin 116 covers one or more sidewalls 108 of the die 102 and covers one or more sidewalls 114 of the dielectric layer 110. The resin 116 includes a third surface 118, a fourth surface 120 opposite the third surface 118, and one or more sidewalls 122 transverse to the third surface 118 and the fourth surface 120. The one or more sidewalls 122 of the resin 116 extend from the third surface 118 to the fourth surface 120. The third surface 118 of the resin 116 is coplanar with the first surface 104 of the die 102, and the fourth surface 120 is coplanar with the surface 124 of the dielectric layer 110.

[0041] One or more insulating, non-conductive or dielectric layers 126 are present on the fourth surface 120 of the resin 116 and on the surface 124 of the dielectric layer 110. Although the one or more insulating, non-conductive or dielectric layers 126 are Figure 1A 102. The dielectric layer 126 is shown as a single layer, but it can be multiple insulating, non-conductive or dielectric layers stacked on each other. The one or more dielectric layers 126 have a fifth surface 128 facing away from the die 102. The one or more dielectric layers 126 include one or more sidewalls 129 coplanar with the one or more sidewalls 122 of the resin 116.

[0042] One or more conductive connection structures 130 extend through the one or more dielectric layers 126 to the dielectric layer 110. Each conductive connection structure 130 of the one or more conductive connection structures 130 includes a conductive trace 130a and a conductive contact or contact 130b coupled to the corresponding conductive trace 130a. Each corresponding conductive trace of the one or more conductive traces 130a is coupled to a corresponding conductive via of the one or more conductive vias 112. The one or more conductive connection structures 130, together with the one or more conductive vias 112, provide a path for electrical signals to pass into and out of the package 100 and into and out of the die 102 within the package 100. For example, the package 100 can be mounted to an external electrical component (e.g., a printed circuit board (PCB)) by using one or more solder balls to interconnect the one or more conductive contacts 130b of the one or more conductive connection structures 130 to the external electrical component.

[0043] A heat sink, heat slug, or heat plate 131 is on the first surface 104 of the die 102 and on the third surface 118 of the resin 116. The heat sink, heat slug, or heat plate 131 is made of a continuous layer of a thermally conductive material, which may be, for example, copper or some other suitable type of thermally conductive material. The heat sink 130 includes one or more side walls 132 that are spaced inwardly from the one or more side walls 122 of the resin 116. The heat sink 130 includes a sixth surface 134 that faces away from the die 102. The sixth surface 134 is transverse to the one or more side walls 132 of the heat sink 130, and the one or more side walls 132 of the heat sink 130 extend from the sixth surface 134 to the third surface 118 of the resin 116. The heat sink 130 may be formed by a plurality of heat sinks 130 disposed on the heat sink 130. Figure 1B The one or more side walls 132 of the heat sink 130 that are spaced inwardly from the one or more side walls 122 of the resin 116 can be more easily seen in FIG.

[0044] like Figure 1B As shown in , package 100 has a rectangular outline when viewed in a top plan view. Figure 1B As shown in , the heat sink 130 has a rectangular profile when viewed in a top plan view.

[0045] Because heat sink 130 is a continuous layer of thermally conductive material (e.g., copper), the thermomechanical stresses generated when package 100 is exposed to temperature rises or drops are high, causing defects (e.g., delamination, cracks, or some other similar or similar type of defect) to propagate within package 100 or increase the likelihood of defects propagating within package 100. When defects propagate within package 100, package 100 is generally damaged, causing package 100 to operate outside of the selected tolerances, causing package 100 to become defective and need to be replaced, disposed of, or discarded. As the likelihood of these defects occurring within package 100 increases, the overall life of package 100 is reduced because the increased likelihood of defects occurring only increases as package 100 is exposed to more temperature rises and drops that generate these high thermomechanical stresses over the useful life of package 100. In order to mitigate these high thermomechanical stresses, heat sink 130, which is made of a continuous layer of thermally conductive material, is made as thin as possible. However, there are manufacturing constraints that limit the minimum thinness of the heat spreader 130 made of a continuous layer of conductive material, so that high thermomechanical stresses can only be relieved to a certain extent by reducing the thickness of the heat spreader 130 made of a continuous layer of conductive material.

[0046] Due to differences in coefficients of thermal expansion (CTE) between the various layers and materials used to form the package 100, defects may propagate further within the package 100. For example, the CTE of the heat sink 130 may be substantially different than the CTE of the die 102 and the dielectric layer 110. Such differences in CTE between the heat sink 130 and the die 102 and the dielectric layer 110 may cause an interface 136 where the dielectric layer 110 and the die 102 contact each other to begin to crack and delaminate from each other. Such cracking within the dielectric layer 110 or delamination between the dielectric layer 110 and the die 102 at this interface 136 may cause damage to the conductive vias 112 present within the dielectric layer 110. When the conductive vias 112 are damaged, the corresponding electrical signals may be inaccurate or unreliable when traveling in and out of the die 102 of the package 100.

[0047] In view of the above reference Figure 1A and Figure 1B As discussed above, the present disclosure is directed to providing embodiments of packages that further mitigate these thermomechanical stresses to further prevent or reduce the likelihood of defects propagating within embodiments of the packages of the present disclosure, thereby increasing their useful lifetimes.

[0048] Figure 2A The embodiment of the package 200 of the present disclosure is as follows Figure 2B A cross-sectional side view taken along line 2A-2A in FIG. Figure 2B Yes Figure 2A FIG. 1 is a top plan view of an embodiment of a package 200 of the present disclosure shown in FIG. 1 . The same or similar features of package 200 as compared to package 100 will be provided with the same or similar reference numerals. Figure 1A and Figure 1B The package 100 shown in FIG. Figure 2A and 2B These same or similar features between the embodiments of the package 200 of the present disclosure shown in , for the sake of simplicity and brevity of the present disclosure, the discussion of these same or similar features is not replicated here.

[0049] Different from Figure 1A and Figure 1BThe package 100 shown in the figure includes a heat sink, heat block or heat plate 131, and the package 200 includes a heat sink, heat block or heat plate structure 202, which includes a plurality of separate and different heat sinks, heat blocks or heat plates 204. Each separate and different heat sink in the plurality of separate and different heat sinks 204 is separate and different from an adjacent separate and different heat sink in the plurality of separate and different heat sinks 204. The plurality of separate and different heat sinks 204 are separated from each other by a plurality of channels, grooves or recesses 206, which extend through the heat sink structure 202 to the first surface 104 of the die 102. The plurality of channels 206 include a first group of channels 206a extending in a first direction and a second group of channels 206b extending in a second direction transverse to the first direction (which are not disclosed in the present disclosure). Figure 2B The first set of channels 206a and the second set of channels 206b extend through and intersect each other.

[0050] like Figure 2B As shown in FIG. 1 , in this embodiment of package 100, first set of channels 206a are transverse to second set of channels 206b at an angle substantially equal to 90 degrees. In other words, in this embodiment of package 100, first set of channels 206a are perpendicular or orthogonal to second set of channels 206b. Figure 2B In the orientation of the package shown in FIG. 2 , the first set of channels 206 a extend vertically and the second set of channels 206 b extend horizontally.

[0051] In this embodiment of package 200, the plurality of channels 206 remain empty. In other words, air is present within the plurality of channels 206. However, in some alternative embodiments, the plurality of channels 206 may be filled with a thermally conductive material having a high elastic modulus (see FIG. 1 ). Fig. 7A and Figure 7B ).

[0052] like Figure 2B As shown in , each respective heat sink in the plurality of separate and distinct heat sinks 204 has a rectangular prism shape. In some embodiments, the plurality of separate and distinct heat sinks 204 has a rectangular parallelepiped shape.

[0053] like Figure 2A and Figure 2B As shown in FIG. 1 , the plurality of separate and distinct heat sinks 204 are all substantially the same size and shape. In some embodiments, the size and shape of a corresponding heat sink in the plurality of separate and distinct heat sinks 204 may have different sizes relative to other heat sinks in the plurality of separate and distinct heat sinks 204 (see FIG. 10 ). Figure 6For example, providing heat sinks of different sizes and shapes in a plurality of separate and different heat sinks 204 along the first surface of the die 102 may more mitigate defect propagation in critical areas within the package 200 where the likelihood of defect propagation is generally relatively high, and may less mitigate defect propagation in non-critical areas within the package 200 where the likelihood of defect propagation is generally relatively low.

[0054] A corresponding channel in the plurality of channels 206 has a first dimension 208 (e.g., the width of the channel) extending between opposing sidewalls in the sidewalls 210 of adjacent heat sinks in the plurality of separate and distinct heat sinks 204. The first dimension 208 ranges from 10 to 350 micrometers (μm) and may be equal to the upper and lower ends of this range. The first dimension 208 is selected based on the situation and environment in which the package 200 will exist to balance the mitigation of thermomechanical stresses while providing effective heat dissipation. Balancing the mitigation of thermomechanical stresses along with the heat dissipation efficiency of the package 200 depending on the environment in which the package 200 will exist increases the useful life of the package 200, such that the useful life of the package 200 in that environment is greater than the useful life of the package 100 in the same environment. The first dimension 208 may also be adjusted based on the amount of space available for the package 200 when the package 200 is installed or used in an electronic device (e.g., a computer, a smartphone, a tablet, or some other similar or appropriate type of electronic device).

[0055] A respective heat sink in the plurality of separate and distinct heat sinks 204 has a second dimension (e.g., thickness) 212 extending from the first surface 104 of the die 102 to an end surface 214 of the plurality of separate and distinct heat sinks 204. Each respective heat sink in the plurality of separate and distinct heat sinks 204 extends away from the first surface 104 of the die 102 and terminates at a corresponding end surface in the end surface 214 of the plurality of separate and distinct heat sinks 204. The second dimension 212 ranges from 20 to 200 micrometers (μm) and may be equal to the upper and lower ends of this range. Similar to the first dimension 208, the second dimension 212 is selected based on the situation and environment in which the package 200 will exist to balance the mitigation of thermomechanical stresses while providing effective heat dissipation. Balancing the mitigation of thermomechanical stresses along with the heat dissipation efficiency of the package 200 depending on the environment in which the package 200 will exist increases the usable life of the package 200, such that the life of the package 200 in that environment is greater than the usable life of the package 100 in the same environment. Second dimension 212 may also be adjusted based on the amount of space available for package 200 when installed or used within an electronic device (eg, a computer, a smartphone, a tablet, or some other similar or appropriate type of electronic device).

[0056] A corresponding heat sink in the plurality of separate and distinct heat sinks 204 has a third dimension (e.g., the width of the heat sink) 216 extending between the opposing side walls of the heat sink. The third dimension 216 ranges from 20 to 4000 micrometers (μm) and may be equal to the upper and lower ends of this range. Similar to the first dimension 208 and the second dimension 212, the third dimension 216 is selected based on the situation and environment in which the package 200 will exist to balance the reduction of thermomechanical stress while providing effective heat dissipation. Balancing the reduction of thermomechanical stresses along with the heat dissipation efficiency of the package 200 depending on the environment in which the package 200 will exist increases the useful life of the package 200, so that the life of the package 200 in that environment is greater than the useful life of the package 100 in the same environment. When installed or used in an electronic device (e.g., a computer, a smart phone, a tablet computer, or some other similar or appropriate type of electronic device), the third dimension 216 may also be adjusted based on the amount of space available for the package 200.

[0057] Although the plurality of separate and distinct heat sinks 204 of package 200 may be similar in thickness (e.g., second dimension 212) to heat sink 130 of package 100, first dimension 208 and third dimension 216 may be adjusted and selected to prevent or further reduce the likelihood of defects propagating within package 200. For example, while the thickness of heat sink 130 of package 100 may only be made as thin as the plurality of separate and distinct heat sinks 204, the plurality of separate and distinct heat sinks 204 may be further adjusted in size and shape to provide more control and consistency in preventing or further reducing the likelihood of defects propagating within package 200 when exposed to cyclical increases and decreases in temperature as compared to package 100. In other words, the adjustability of the plurality of separate and distinct heat sinks 204 of package 200 is greater than the adjustability of heat sink 130 of package 100, resulting in package 200 having a much lesser likelihood of defects propagating within package 200 relative to the likelihood of defects propagating within package 100 when exposed to cyclical increases and decreases in temperature.

[0058] The multiple separate and distinct heat sinks are generally more efficient at dissipating heat from the package in a controlled manner because the multiple separate and distinct heat sinks 204 have a greater amount of exposed surface (i.e., the end surfaces 214 and sidewalls 210 of respective ones of the multiple separate and distinct heat sinks 204) relative to the heat sink 130. In other words, the total surface area exposed when the multiple separate and distinct heat sinks 204 are used is generally greater than the total surface area exposed by the heat sink 130. Although the total surface area of ​​the multiple separate and distinct heat sinks 204 exposed is greater, the total volume or area occupied by the multiple separate and distinct heat sinks 204 is generally equal to or less than the total volume or area occupied by the heat sink 130.

[0059] Although the thickness of multiple separate and distinct heat sinks 204 and heat sink 130 can be similar, the adjustability of the size and shape of multiple separate and distinct heat sinks 204 provides better control and better heat dissipation relative to package 100 in preventing or reducing the likelihood of defects propagating within package 200 when exposed to periodic increases and decreases in temperature.

[0060] By using multiple separate and distinct heat sinks 204 instead of a heat sink 130 made of a continuous layer of thermally conductive material, defects that propagate further within the package 100 due to differences in coefficients of thermal expansion (CTE) between the various layers and materials used to form the package 100 are mitigated. For example, while the multiple separate and distinct heat sinks 204 and the heat sink 130 may have the same CTE that is different from the CTE of the die 102 and the dielectric layer 110, the multiple separate and distinct heat sinks 204, which are separate and distinct from each other and each smaller in size relative to the heat sink 130, more uniformly interfere with any differences in expansion and contraction between the multiple separate and distinct heat sinks 204, the die 102, and the dielectric layer 110 than when the heat sink 130 is used instead. This more uniform distribution of expansion and contraction due to the individual separate and distinct heat sinks 204 prevents or reduces the likelihood of cracking or delamination at the interface 136. This prevention or reduction in the likelihood of defect propagation at interface 136 increases the usable lifetime of package 200 , such that package 200 has a longer usable lifetime than package 100 .

[0061] Figure 3A top plan view of an alternative embodiment of a package 300 relating to the present disclosure. In this embodiment, each of the plurality of separate and distinct heat sinks 302 has a cylindrical shape. Each respective heat sink in the plurality of separate and distinct heat sinks 302 is separated from the other respective heat sinks in the plurality of separate and distinct heat sinks 302 by a channel 303. Each heat sink in the plurality of separate and distinct heat sinks 302 includes a sidewall 305 having a profile such as Figure 3 The circle is shown in .

[0062] Figure 4 A top plan view of an alternative embodiment of a package 304 relating to the present disclosure. In this embodiment, each of the plurality of separate and distinct heat sinks 306 has a rhombic prism shape. Each respective heat sink in the plurality of separate and distinct heat sinks 306 is separated from the other respective heat sinks in the plurality of separate and distinct heat sinks 302 by a plurality of channels 307. The plurality of channels 307 includes a first set of channels 307a and a second set of channels 307b that are transverse to each other and intersect each other. Based on the Figure 4 In the orientation shown in FIG. 3 , the first set of channels 307 a and the second set of channels 307 b extend in a diagonal direction. Each of the plurality of separate and distinct heat sinks 306 includes a plurality of sidewalls 309 .

[0063] Figure 5 A top plan view of an alternative embodiment of a package 308 relating to the present disclosure. In this embodiment, each of a plurality of separate and distinct heat sinks 310 has a diamond prism shape and is coupled to a package 308 as disclosed herein. Figure 4 Each respective heat sink in the plurality of separate and distinct heat sinks 310 is separated from other respective heat sinks in the plurality of separate and distinct heat sinks 310 by channels 311 .

[0064] Figure 6 A top plan view of an alternative embodiment of a package 312 relating to the present disclosure. In this embodiment, a plurality of separate and distinct heat sinks 314 include a first group of heat sinks 314a and a second group of heat sinks 314b. The first group of heat sinks 314a has a cylindrical shape and the second group of heat sinks 314b has a rectangular prism shape. Each respective heat sink in the plurality of separate and distinct heat sinks 314 is separated from other respective heat sinks in the plurality of separate and distinct heat sinks 314 by a channel 315. Each heat sink in the first group of heat sinks 314a includes a sidewall 317, and each heat sink in the second group of heat sinks 314b includes a plurality of sidewalls 319.

[0065] like Figure 2A , Figure 2B , Figure 3, Figure 4 , Figure 5 and Figure 6 As shown in FIG, respective ones of the plurality of separate and distinct heat sinks 204, 302, 306, 310, 314 are arranged in an array along the first surface 104 of the die 102. In view of the various embodiments of the packages 200, 300, 304, 308, 312 of the present disclosure, the orientation and positioning of respective ones of the plurality of separate and distinct heat sinks 204, 302, 306, 310, 314 may be further adjusted or selected to further prevent or mitigate the propagation of defects within the various embodiments of the packages 200, 300, 304, 308, 312 of the present disclosure while providing adequate heat dissipation.

[0066] Fig. 7A Alternative embodiments of the package 400 are described below. Figure 7B A cross section taken along line 7A-7A in FIG. Figure 7B Involving Fig. 7A A top plan view of an alternative embodiment of package 400 is shown in FIG.

[0067] The package 400 includes a thermally conductive material 402 filling the plurality of trenches 206. The same or similar features of the package 400 will be provided with the same or similar reference numerals as compared to the packages 100, 200, respectively. Figure 1A , Figure 1B , Figure 2A and Figure 2B The packages 100 and 200 shown in FIG. Fig. 7A and Figure 7B These same or similar features between the embodiments of the package 400 of the present disclosure shown in , for the sake of simplicity and brevity of the present disclosure, the discussion of these same or similar features is not replicated here.

[0068] like Fig. 7AAs shown in , the thermally conductive material 402 is present within the plurality of trenches 206 and partially or completely fills the plurality of trenches 206. The thermally conductive material 402 may be a soft material (i.e., having a high elastic modulus) that is thermally conductive to further facilitate heat dissipation while having minimal or no effect on the generation of thermomechanical stresses that exist within the package 400 when exposed to cyclical increases and decreases in temperature. The thermally conductive material 402 covers the sidewalls 210 of the plurality of separate and distinct heat sinks 204. In this embodiment of the package 400, the thermally conductive material 402 completely fills the plurality of trenches 206 such that the thermally conductive material has a surface 404 that is coplanar with the end surfaces 214 of the plurality of separate and distinct heat sinks 204. In this embodiment of the package 400, the thermally conductive material 402 includes one or more end sidewalls 406 that are coplanar with the sidewalls 210 of a corresponding one of the plurality of separate and distinct heat sinks 204 at a peripheral region or edge of the heat sink structure 202. In other words, in this embodiment of the package 400, as shown in FIG. Figure 7B As shown in FIG. 4 , the heat conductive material 402 is not present on the third surface 118 of the resin 116. One or more end sidewalls 406 of the heat conductive material 402 are spaced inwardly from the one or more sidewalls 122 of the resin 116.

[0069] Fig. 8A is an alternative embodiment of the package 500 of the present disclosure. Figure 8B A cross-sectional view taken along line 8A-8A shown in FIG. Figure 8B A top plan view of an alternative embodiment of package 500 is directed. Package 500 is substantially the same as package 400, except that thermally conductive material 402 is present on the third surface of resin 116 and thermally conductive material 402 covers the sidewalls 210 of respective ones of a plurality of separate and distinct heat sinks 204 at a peripheral region or edge of heat sink structure 202. In this embodiment of package 500, thermally conductive material 402 includes one or more sidewalls 502 that are coplanar with sidewalls 122 of resin 116.

[0070] Thermally conductive material 402 may have an elastic modulus in the range of 0.1 to 5000 MPa (e.g., megapascals), and may be equal to the upper and lower ends of this range. For example, thermally conductive material 402 may be silicone, epoxy, paste, or some other similar or suitable type of material that is soft and elastic so that it deforms easily when placed under compression or tension. These various materials may be more elastic or less elastic depending on the situation or environment in which the final package may be used.

[0071] Fig. 9A6 is a top plan view of a stress map 600 at an interface 136 of a package 100 when the package 100 does not include a heat sink 130. As described previously herein, the interface 136 is where the die 102 (e.g., a silicon die) and the dielectric layer (e.g., an ABF layer or film) contact each other. The stress map 600 represents the thermomechanical stress generated at the interface when cooling from a first temperature to a second temperature. The first temperature is greater than the second temperature such that, for example, the first temperature is the maximum temperature of the package 100 when in use and the second temperature is room temperature (e.g., in some instances, room temperature can be in the range of 15 to 25 degrees Celsius or equal to the upper and lower ends of this range). As shown in the stress map 600, there are high stress regions 602 and low stress regions 604. As shown in the stress map 600, the low stress regions 604 are larger than the low stress regions 604, so that the possibility of defect propagation due to thermomechanical stress is low. However, when package 100 does not include heat sink 130, package 100 cannot easily and quickly dissipate thermal energy, so that due to the slow speed at which package 100 without heat sink 130 cools from the first temperature to the second temperature, components within package 100 may degrade faster over time.

[0072] Fig. 9B 6 is a top plan view of a stress map 606 at an interface 136 of the package 100 when the package 100 includes a heat sink 130. As described previously herein, the interface 136 is where the die 102 (e.g., a silicon die) and the dielectric layer (e.g., an ABF layer or film) contact each other. The stress map 606 represents the thermomechanical stress generated at the interface when cooling from a first temperature to a second temperature. The first temperature is greater than the second temperature. For example, in some instances, the first temperature is the maximum temperature of the package 100 when in use, and the second temperature is room temperature (e.g., in some instances, the room temperature can be in the range of 15 to 25 degrees Celsius or equal to the upper and lower ends of this range). As shown in the stress map 606, there are high stress regions 608 and low stress regions 610. The high stress region 602 in the stress map 600 is much smaller than the high stress region 608 in the stress map 606, and the low stress region 604 in the stress map 600 is much larger than the low stress region 610 in the stress map 606. In light of this, while there may be good heat dissipation through the presence of the heat spreader 130 completely covering the first surface 104 of the die 102, there is a high likelihood of defects (e.g., cracking, delamination, shearing, etc.) occurring at the interface 136 due to the large high stress region 608 (which is along a large portion of the interface 136). When the heat spreader 130 is present on the first surface 130 of the die 102, there is a 16% increase in the thermomechanical stress occurring at the interface 136 compared to when the package 100 does not include the heat spreader 130. However, as described above, the heat spreader 130 allows the package to dissipate heat more quickly and efficiently than when the heat spreader is not present.

[0073] Fig. 9C 6 is a top plan view of a stress map 612 for a package 200 including a plurality of separate and distinct heat sinks 204. As described previously herein, the interface 136 is the location where the die 102 (e.g., a silicon die) and the dielectric layer (e.g., an ABF layer or film) contact each other. The stress map 612 represents the thermomechanical stress generated at the interface when cooling from a first temperature to a second temperature. The first temperature is greater than the second temperature. For example, in some instances, the first temperature is the maximum temperature of the package 100 when in use, and the second temperature is room temperature (e.g., in some instances, the room temperature can be in the range of 15 to 25 degrees Celsius or equal to the upper and lower ends of this range). As shown in the stress map 612, there are high stress regions 614 and low stress regions 616, and both the high stress regions 614 and the low stress regions 616 are evenly distributed across and along the interface 136 within the package 200. High stress region 614 in stress map 612 is smaller than high stress region 608 in stress map 606 and larger than high stress region 602 in stress map 600, and low stress region 616 in stress map 612 is larger than low stress region 610 in stress map 606 and smaller than low stress region 604 in stress map 600. When multiple separate and distinct heat sinks 204 are present on first surface 104 of die 102, there is a 6.5% reduction in thermomechanical stress occurring at interface 136 compared to when package 100 includes heat sink 130. In view of this, multiple separate and distinct heat sinks 204 present at first surface 104 of die 102 of package 200 maintain good heat dissipation, allowing the package to cool relatively quickly from a first temperature to a second temperature while preventing or reducing the likelihood of defects propagating along interface 136. The likelihood of propagation of defects along the interface 136 is prevented or reduced because the high stress region 614 and the low stress region 616 are evenly distributed across the interface, the high stress region 614 is smaller than the high stress region 608, and the low stress region 616 is larger than the low stress region 610. In view of this, the package 200 with multiple separate and distinct heat sinks 204 not only provides the same or similar good heat dissipation as the package 100 with the heat sink 130, but also the multiple separate and distinct heat sinks 204 of the package 200 prevent or reduce thermomechanical stress at the interface 136 compared to the package 100 with the heat sink 130. This further prevention or reduction of thermomechanical stress at the interface 136 and the good heat dissipation result in the package 200 with multiple separate and distinct heat sinks 204 having a longer usable life than the package 100 with the heat sink 130.

[0074] Fig.10 is manufactured as disclosed herein Figure 2A and Figure 2BFlowchart 700 of a method of manufacturing an embodiment of a package shown in FIG. Flowchart 700 of a method of manufacturing includes a first step 702 , a second step 704 , a third step 706 and a fourth step 708 . Figures 11A-11E 7 is a cross-sectional view of corresponding steps of flowchart 700 , which will be discussed in detail herein together with corresponding steps of flowchart 700 as follows.

[0075] like Fig.11E As shown in FIG, assembly 710 has been fabricated including one or more dielectric layers 126, one or more conductive connection structures 130, dielectric layer 110, conductive vias 112, and resin 116. In other words, assembly 710 is a partially fabricated version of package 200 that has undergone processing and techniques within the semiconductor industry to form assembly 710.

[0076] In such Fig. 11B In the first step shown in , a temporary layer 712 is formed on the first surface 104 of the die 102 and the third surface 118 of the resin 116. In some embodiments, the temporary layer 712 can be a single layer, so that the temporary layer 712 is a mask layer or a photoresist layer that can be patterned or etched. In some alternative embodiments, the temporary layer 712 can be one or more stacked layers, so that the temporary layer is one or more mask layers or photoresist layers that can be patterned or etched.

[0077] After the first step 702 of forming the temporary layer 712 on the first surface 104 of the die 102 and the third surface 118 of the resin 116, in a second step 704, the temporary layer 712 is etched (e.g., chemically etched) or patterned (e.g., exposed to light, drilled, cut, etc.) to form one or more openings 714 in the temporary layer 712 that expose regions or areas of the first surface 104 of the die 102. The one or more openings 714 may be formed as rectangular shaped openings, circular shaped openings, diamond shaped openings, or some other size or shape to form a heat sink having that corresponding size and shape.

[0078] After the second step 704 of forming one or more openings 714 in the temporary layer 712, in a third step 706, a thermally conductive material is formed by being deposited into the one or more openings 714. The thermally conductive material may be a copper material or some other suitable thermally conductive material. After the thermally conductive material is formed by being deposited into the one or more openings 714, the thermally conductive material is allowed to solidify to form a plurality of separate and distinct heat sinks 204.

[0079] After the third step 706 in which a plurality of separate and distinct heat sinks 204 are formed on the first surface 104 of the die 102, in a fourth step 708, any remaining portions of the temporary layer 712 are removed. For example, the temporary layer 712 may be made of a material that degrades and dissolves when exposed to a fluid such as water, or may be made of a material that degrades and dissolves when exposed to light. Once the remaining portions of the temporary layer 712 are removed, an area 716 of the first surface 104 of the die 102 is exposed and the third surface 118 of the resin 116 is exposed. Removing these remaining portions of the temporary layer 712 defines a plurality of channels 206 between the plurality of separate and distinct heat sinks 204. In other words, the package 200 has been manufactured after the fourth step 708.

[0080] Fig.12 Flowchart 718 is a method of manufacturing a plurality of heat sinks, heat slugs or heat plates 204 of an alternative embodiment of package 400 in conjunction with forming a thermally conductive material 402 having a high elastic modulus. Flowchart 718 includes a first step 702, a second step 704, a third step 706, and a fourth step 708. As first step 702, second step 704, third step 706, and fourth step 708 have been described above with reference to Fig.10 and Figures 11A-11E The detailed description is not repeated here, so the discussion of the first step 702, the second step 704, the third step 706 and the fourth step 708 is not repeated here. The flowchart 718 also includes a fifth step 720, a sixth step 722 and a seventh step 724.

[0081] In a fifth step 720, another temporary layer 726 is formed on the third surface 118 of the resin 116. In some embodiments, the another temporary layer 726 may be partially formed on the first surface 104 of the die 102, depending on whether the respective heat sinks of the plurality of separate and distinct heat sinks 204 are spaced inwardly from the one or more sidewalls 108 of the die 102 at the peripheral region of the heat sink structure 202. Fig.13A, another temporary layer 726 covers the third surface 118 of the resin 116. In some embodiments, although not shown, one or more additional temporary layers (not shown) may be formed on and along the plurality of separate and different heat sinks 204 and in the plurality of channels 206 to avoid forming the another temporary layer 726 on and along the plurality of separate and different heat sinks 204 and in the plurality of channels 206. After being formed, the one or more additional temporary layers (not shown) may be patterned with openings to expose areas where the another temporary layer 726 is to be formed. Once the one or more additional temporary layers (not shown) are patterned, the another temporary layer 726 is formed at the exposed areas exposed by the openings in the one or more additional temporary layers. Once the another temporary layer 726 is formed at the exposed areas, the one or more additional temporary layers (not shown) are removed, thereby exposing the plurality of separate and different heat sinks 204 and the plurality of channels 206, so that a structure as shown in FIG. Fig.13A The one or more additional temporary layers may be a soluble material that degrades or dissolves when exposed to a liquid or gas, or may degrade and dissolve when exposed to a light source.

[0082] In the formation of Fig.13A After the fifth step 720 of forming another temporary layer 726 as shown in , in a sixth step 722, the plurality of trenches 206 are filled with a thermally conductive material 402 having a high elastic modulus. The thermally conductive material 402 having a high elastic modulus is soft and elastically deformable. In some embodiments, although not shown, one or more additional temporary layers (not shown) are formed on a plurality of separate and different heat sinks, on another temporary layer 726, and in the plurality of trenches 206. Once the one or more additional temporary layers (not shown) are formed, the one or more additional temporary layers (not shown) are patterned with openings to expose the plurality of trenches 206 and an area 716 of the first surface of the die 102. After patterning the one or more additional temporary layers (not shown), the thermally conductive material 402 is formed in the area 716 and the plurality of trenches 206 exposed by the openings in the one or more additional temporary layers (not shown). Once the thermally conductive material 402 is formed within the plurality of trenches 206 and on the area 716, the one or more additional temporary layers (not shown) are removed, thereby obtaining a thermally conductive material 402 having a high elastic modulus. Fig. 13B The one or more additional temporary layers may be soluble materials that degrade or dissolve when exposed to a liquid or gas, or may degrade and dissolve when exposed to a light source. Once the thermally conductive material 402 is formed in the plurality of channels 206 and on the region 716, the one or more sidewalls 210 of the plurality of separate and distinct heat sinks 204 are covered with the thermally conductive material 402.

[0083] After the sixth step 722 of forming the thermally conductive material 402 in the plurality of channels 206 and on the region 716, in a seventh step 724, the further temporary layer 726 is removed. The further temporary layer 726 may be a material that is soluble when exposed to a liquid or gas, or may degrade and dissolve when exposed to a light source. Once the further temporary layer 726 is removed, a thermally conductive material such as a semiconductor device is manufactured. Fig. 13C In other words, package 400 has been manufactured after seventh step 724 .

[0084] Package 500 may be formed by not forming another temporary layer 726 in fifth step 720, and instead, simply by proceeding to seventh step 724. By not performing sixth step 722, third surface 118 of resin 116 remains exposed, allowing thermally conductive material 402 to be formed on third surface 118 of resin 116 to manufacture package 500.

[0085] Fig.14 is manufactured as disclosed herein Figure 2A and Figure 2B 800 of an alternative method of manufacturing an embodiment of the package 200 of the present disclosure. The flowchart 800 of the alternative method of manufacturing an embodiment of the package 200 includes a first step 802, a second step 804, a third step 806, a fourth step 808, a fifth step 810, a sixth step 812, a seventh step 814, an eighth step 816, a ninth step 818, and a tenth step 820. Figure 15A-15E 8 is a cross-sectional view of corresponding steps of flowchart 800 , which will be discussed in detail herein together with corresponding steps of flowchart 800 as follows.

[0086] In a first step 802, a temporary layer 822 is formed on the first surface 104 of the die 102. After the first step 802 of forming the temporary layer 822 on the first surface of the die 102, in a second step 804, the temporary layer 822 is patterned with one or more openings 824. The openings 824 may be formed in the temporary layer 822 by drilling, etching (chemical etching, water etching, photoresist etching, etc.), or some other suitable type of technique for forming the one or more openings 824 in the temporary layer 822. After the one or more openings 824 are formed in the temporary layer 822, in a third step 806, a thermally conductive material is deposited into the one or more openings 824. The thermally conductive material is then allowed to cure and harden so that a plurality of separate and distinct heat sinks 204 are formed within the one or more openings 824 patterned within the temporary layer 822. The heat conductive material may be readily formed in a manner such as Fig.15A The results of the first step 802, the second step 804, and the third step 806 are seen in the cross-sectional view of the structure shown in FIG.

[0087] After the third step 806 of forming a plurality of separate and distinct heat sinks 204 within the one or more openings 824 patterned within the temporary layer 822, in a fourth step 808, flipping the temporary layer 822 as shown in FIG. Fig.15A , so that the temporary layer 822 and the end surfaces 214 of the plurality of separate and different heat sinks 204 are temporarily coupled to the support 826. For example, the support 826 can be a tape, a dummy wafer, or some other suitable type of support 826 to which the end surfaces 214 of the plurality of separate and different heat sinks 204 and the temporary layer 822 can be temporarily coupled by an adhesive. Fig. 15B The result of the fourth step 808 can be seen in the cross-sectional view of the structure shown in .

[0088] After the fourth step 808 of temporarily coupling the end surfaces 214 of the plurality of separate and distinct heat sinks 204 and the temporary layer 822 to the support 826, in a fifth step 810, a dielectric layer 110, which may be an ABF layer or film, is formed on the second surface 106 of the die 102. After the fifth step 810 of forming the dielectric layer 110 on the second surface 106 of the die 102, in a sixth step 812, one or more openings 824 are patterned within the dielectric layer 110. After the dielectric layer 110 is patterned with the one or more openings, a conductive material is formed within the one or more openings 824 and is allowed to solidify to form conductive vias 112 within the dielectric layer 110. The conductive vias 112 may be easily formed in a manner such as the embodiment of the present invention. Fig. 15C The results of the fifth step 810 and the sixth step 812 can be seen in the cross-sectional view of the structure shown in FIG.

[0089] After the sixth step 812 of forming the dielectric layer 110 on the second surface 106 of the die 102 and forming the conductive vias 112 extending through the dielectric layer 110 to the second surface 106 of the die 102, in a seventh step 814, a resin 116 is formed on one or more sidewalls 108 of the die 102 and on one or more sidewalls 114 of the dielectric layer 110. In this embodiment of the method of manufacturing the package 200 having the flowchart 800, before forming the resin 116, an additional temporary layer 828 is formed on the surface 830 of the support 826 and on one or more sidewalls 832 of the temporary layer (see Fig.15D ). The formation of this additional temporary layer 828 prevents the resin 116 from extending beyond the first surface 104 of the die 102. In some alternative embodiments of the method of manufacturing the package 200, this additional temporary layer 828 may not be formed, so that in a similar manner as disclosed herein, Figure 2A and Figure 2B In an alternative embodiment of a manufactured version of the package to the embodiment of package 200 shown in FIG, resin 116 extends beyond first surface 104 of die 102 .

[0090] After the seventh step 814 of forming the resin 116 on the one or more sidewalls 108 of the die 102 and the one or more sidewalls 114 of the dielectric layer 110, in the eighth step, one or more dielectric layers 126 are formed on the third surface 118 of the resin 116 and on the surface 124 of the dielectric layer 110. Together with the formation of the one or more dielectric layers 126, one or more conductive connection structures 130 are formed along the one or more dielectric layers 126. For example, a first dielectric layer of the one or more dielectric layers 126 is formed on the surface 124 of the dielectric layer 110 and the third surface 118 of the resin 116. The first dielectric layer is then patterned with first openings, and then a conductive material is deposited to fill those first openings. The conductive material is then allowed to cure, which forms the traces 130a of the conductive connection structures 130. After the first dielectric layer in the one or more dielectric layers 126 and the trace 130a of the conductive structure 130 have been formed, a second dielectric layer in the one or more dielectric layers 126 is formed on the first dielectric layer in the one or more dielectric layers 126 and on the trace 130a of the conductive connection structure 130. The second dielectric layer is then patterned with a second opening exposing an area of ​​the trace 130a of the conductive connection structure 130. A conductive material is then deposited and filled within the second opening. The conductive material within the second opening in the second dielectric layer in the one or more dielectric layers 126 is then allowed to solidify to form a contact 130b of the conductive connection structure 130. Once the contact 130b is formed, the conductive connection element has been formed. It can be easily formed in a manner such as Fig.15D The results of the seventh step 814 and the eighth step 816 can be seen in the cross-sectional view of the structure shown in FIG.

[0091] After the eighth step 816 of forming one or more dielectric layers 126 and conductive connection structures 130, in a ninth step 818, the support 826 is removed as shown. Fig.15D The structure shown in FIG. has been removed from the support 826 as shown in FIG. Fig.15D After the ninth step 818 of the structure shown in FIG. 1 , in a tenth step 820, the additional temporary layer 828 and any remaining amount of the temporary layer 822 are removed from the third surface 118 of the resin 116 and the first surface 104 of the die 102, thereby exposing the plurality of channels 206 extending between the plurality of separate and distinct heat sinks 204. The temporary layer 822 and the additional temporary layer 828 may be soluble materials that degrade or dissolve when exposed to a liquid or gas, or may degrade and dissolve when exposed to a light source. In other words, after the tenth step 820, the package 200 has been formed as described in the present disclosure. Fig.15E The one shown in is manufactured.

[0092] As discussed herein, one or more embodiments of the packages 200, 300, 304, 308, 312, 400, 500, each including a plurality of separate and distinct heat sinks, slugs, or heat plates 204 that are separate and distinct from one another, further mitigate thermomechanical stresses that occur when the packages 200, 300, 304, 308, 312, 400, 500 are exposed to increases or decreases in temperature, compared to the package 100 having the heat sink, slug, or heat plate 131. For example, the plurality of separate and distinct heat sinks, slugs, or heat plates 204 further mitigate thermomechanical stresses generated by increases or decreases in temperature in the packages 200, 300, 304, 308, 312, 400, 500 by having the plurality of separate and distinct heat sinks, slugs, or heat plates 204. This is because the separate and distinct heat sinks, slugs or plates 204 prevent or further reduce the likelihood of defects propagating within the package 200, 300, 304, 308, 312, 400, 500 due to the more even distribution of these thermo-mechanical stresses across the interface 136. By providing multiple separate and distinct heat sinks, slugs or plates 204 to prevent or further reduce the likelihood of defects, the usable life of the package 200, 300, 304, 308, 312, 400, 500 is further increased, allowing the package 200, 300, 304, 308, 312, 400, 500 to operate within selected tolerances for a longer period of time compared to a package 100 that includes a heat sink, slug or plate 131 made of a continuous layer of conductive material. The plurality of separate and distinct heat sinks 204 also provide heat dissipation efficiency similar to the heat sink, heat slug or heat plate 131 , and the heat dissipation efficiency may be further improved by providing a thermally conductive material 402 having a high elastic modulus within the plurality of channels 206 .

[0093] Various embodiments of multiple separate and distinct heat sinks, heat plates, or heat slugs 204 , 302 , 306 , 310 , 314 may be used in various types of semiconductor packages where heat dissipation improves functionality and increases the usable life of the corresponding semiconductor package.

[0094] At least one embodiment of the apparatus of the present disclosure can be summarized as comprising: a die including a first surface, a second surface, and one or more sidewalls, the second surface being opposite to the first surface, the one or more sidewalls being transverse to the first surface and the second surface, the one or more sidewalls extending from the first surface to the second surface; a resin covering the one or more sidewalls of the die and extending around the die; a first non-conductive layer on the second surface of the die; a plurality of conductive vias extending through the first non-conductive layer to the die; a plurality of conductive connection structures coupled to the plurality of conductive vias and extending to the die; On a first non-conductive layer, the plurality of conductive connection structures include a plurality of end surfaces, the plurality of end surfaces are separated from the plurality of conductive vias; a second non-conductive layer, the second non-conductive layer is on the first non-conductive layer and extends around the plurality of conductive connection structures, and wherein the plurality of end surfaces of the plurality of conductive connection structures are exposed from the second non-conductive layer; a plurality of heat sinks, the plurality of heat sinks are on the first surface of the die, each corresponding heat sink of the plurality of heat sinks is separated and different from an adjacent heat sink of the plurality of heat sinks; and a plurality of channels, the plurality of channels separate each corresponding heat sink of the plurality of heat sinks from an adjacent heat sink of the plurality of heat sinks.

[0095] The plurality of channels may include: a plurality of first channels extending in a first direction; and a plurality of second channels extending in a second direction, the second direction being transverse to the first direction.

[0096] The plurality of first channels may be perpendicular to the plurality of second channels; and each respective heat sink of the plurality of heat sinks may have a rectangular prism shape.

[0097] The plurality of first channels may be perpendicular to the plurality of second channels; and each respective heat sink of the plurality of heat sinks may have a rectangular parallelepiped shape.

[0098] A respective heat sink of the plurality of heat sinks may have at least one of a cylindrical shape, a rectangular prism shape, and a diamond prism shape.

[0099] Each corresponding heat sink among the plurality of heat sinks may include: a heat sink end surface separated from the first surface of the die; and a thickness extending from the first surface to the heat sink end surface, the thickness ranging from 20 to 200 microns (μm) or the thickness being equal to the upper and lower ends of this range.

[0100] Each respective one of the plurality of channels may have a distance extending between sidewalls of adjacent ones of the plurality of heat sinks, and the distance ranges from 10 to 350 micrometers (μm) or is equal to an upper end and a lower end of this range.

[0101] A corresponding heat sink of the plurality of heat sinks may be on a third surface of the resin.

[0102] The third surface of the resin may be coplanar with the first surface of the die.

[0103] The plurality of heat sinks may be spaced inwardly from one or more side walls of the resin.

[0104] At least one embodiment of the present disclosure can be summarized as including: a die including a first surface, a second surface, and one or more sidewalls, the second surface being opposite to the first surface, the one or more sidewalls being transverse to the first surface and the second surface, the one or more sidewalls extending from the first surface to the second surface; a resin covering the one or more sidewalls of the die and extending the die; a first non-conductive layer on the second surface of the die; a plurality of conductive vias extending through the first non-conductive layer to the die; a plurality of conductive connection structures coupled to the plurality of conductive vias and on the first non-conductive layer, the plurality of conductive connection structures comprising The die includes a plurality of end surfaces separated from the plurality of conductive vias; a second non-conductive layer on the first non-conductive layer and extending around the plurality of conductive connection structures, and wherein the plurality of end surfaces of the plurality of conductive connection structures are exposed from the second non-conductive layer; and a plurality of heat sinks on the first surface of the die, each respective heat sink of the plurality of heat sinks being separated and distinct from adjacent ones of the plurality of heat sinks; a plurality of channels separating each respective heat sink of the plurality of heat sinks from adjacent ones of the plurality of heat sinks; and a thermally conductive material filling the plurality of channels and being on the surface of the die.

[0105] The thermally conductive material may be elastic.

[0106] The heat conductive material may have an elastic modulus in the range of 0.1 to 5000 MPa or equal to the upper and lower ends of this range.

[0107] The thermally conductive material may be configured to increase thermal dissipation of thermal energy during operation.

[0108] Each corresponding heat sink among the plurality of heat sinks may include: a heat sink end surface separated from the first surface of the die; and a thickness extending from the first surface to the heat sink end surface, the thickness ranging from 20 to 200 microns (μm) or the thickness being equal to the upper and lower ends of this range.

[0109] The thermally conductive material filling the plurality of channels may have a thermally conductive surface that is coplanar with heat sink end surfaces of the plurality of heat sinks.

[0110] At least one embodiment of the method of the present disclosure can be summarized as including: forming a temporary layer covering a first surface of a die; removing portions of the temporary layer, thereby forming a plurality of openings in the temporary layer that expose areas of the first surface of the die; depositing a first thermally conductive material in the plurality of openings, thereby forming a plurality of separate and distinct heat sinks by at least partially filling the plurality of openings with the first thermally conductive material; and removing one or more remaining portions of the temporary layer, thereby exposing sidewalls of the plurality of separate and distinct heat sinks, exposing a plurality of channels extending between adjacent ones of the plurality of separate and distinct heat sinks.

[0111] The method also includes forming a second thermally conductive material within the plurality of trenches and on the first surface of the die, the second thermally conductive material having an elasticity ranging from 0.1 to 5000 MPa or equal to the upper and lower ends of this range.

[0112] The method may also include: forming a first non-conductive layer on a second surface of the die opposite to the first surface; forming a plurality of conductive vias extending through the first non-conductive layer to the second surface of the die; forming a resin surrounding the die and covering the sidewalls of the die; forming a plurality of conductive connection structures on the first non-conductive layer and on the resin; and forming a second non-conductive layer extending around the plurality of conductive connection structures.

[0113] A respective heat sink of the plurality of heat sinks may have at least one of a cylindrical shape, a rectangular prism shape, and a diamond prism shape.

[0114] The various embodiments described above can be combined to provide further embodiments. Aspects of the embodiments can be modified, employing concepts of the various patents, applications and publications, if necessary, to provide further embodiments.

[0115] These and other changes can be made to the embodiments in light of the above detailed description. Generally, in the following claims, the terms used should not be interpreted as limiting the claims to the specific embodiments disclosed in the specification and claims, but should be interpreted to include all possible embodiments along with the full range of equivalents to which such claims are entitled. Therefore, the claims are not limited by this disclosure.

Claims

1. A device comprising: a die, the die comprising a first surface, a second surface and one or more sidewalls, the second surface being opposite to the first surface, the one or more sidewalls being transverse to the first surface and the second surface, the one or more sidewalls extending from the first surface to the second surface; a resin covering the one or more sidewalls of the die and extending around the die; a first non-conductive layer on the second surface of the die; a plurality of conductive vias extending through the first non-conductive layer to the die; a plurality of conductive connection structures coupled to the plurality of conductive vias and on the first non-conductive layer, the plurality of conductive connection structures comprising a plurality of end surfaces spaced apart from the plurality of conductive vias; a second non-conductive layer on the first non-conductive layer and extending around the plurality of conductive connection structures, and wherein the plurality of end surfaces of the plurality of conductive connection structures are exposed from the second non-conductive layer; a plurality of heat sinks, the plurality of heat sinks being on the first surface of the die, each respective heat sink of the plurality of heat sinks being separate and distinct from an adjacent heat sink of the plurality of heat sinks; as well as A plurality of channels separate each respective one of the plurality of heat sinks from an adjacent one of the plurality of heat sinks.

2. The device of claim 1, wherein the plurality of channels comprises: a plurality of first channels extending in a first direction; as well as A plurality of second channels extend in a second direction, wherein the second direction is transverse to the first direction.

3. The device according to claim 2, wherein: The plurality of first channels are perpendicular to the plurality of second channels; and Each respective heat sink of the plurality of heat sinks has a rectangular prism shape.

4. The device according to claim 2, wherein: The plurality of first channels are perpendicular to the plurality of second channels; and Each corresponding heat sink among the plurality of heat sinks has a rectangular parallelepiped shape. 5 . The device of claim 1 , wherein a corresponding heat sink of the plurality of heat sinks has at least one of: a cylindrical shape, a rectangular prism shape, and a diamond prism shape.

6. The apparatus of claim 1 , wherein each respective heat sink of the plurality of heat sinks comprises: a heat sink end surface, the heat sink end surface being spaced apart from the first surface of the die; as well as The thickness extending from the first surface to the heat sink end surface ranges from 20 to 200 micrometers μm or is equal to the upper and lower ends of the range.

7. The device of claim 1, wherein each corresponding one of the plurality of channels has a distance extending between sidewalls of adjacent ones of the plurality of heat sinks, and the distance ranges from 10 to 350 microns or is equal to the upper and lower ends of the range.

8. The device of claim 1, wherein a corresponding heat sink of the plurality of heat sinks is on a third surface of the resin. 9 . The device of claim 8 , wherein the third surface of the resin is coplanar with the first surface of the die.

10. The apparatus of claim 1, wherein the plurality of heat spreaders are spaced inwardly from one or more side walls of the resin.

11. An apparatus comprising: a die, the die comprising a first surface, a second surface and one or more sidewalls, the second surface being opposite to the first surface, the one or more sidewalls being transverse to the first surface and the second surface, the one or more sidewalls extending from the first surface to the second surface; a resin covering the one or more sidewalls of the die and extending the die; a first non-conductive layer on the second surface of the die; a plurality of conductive vias extending through the first non-conductive layer to the die; a plurality of conductive connection structures coupled to the plurality of conductive vias and on the first non-conductive layer, the plurality of conductive connection structures comprising a plurality of end surfaces spaced apart from the plurality of conductive vias; a second non-conductive layer on the first non-conductive layer and extending around the plurality of conductive connection structures, and wherein the plurality of end surfaces of the plurality of conductive connection structures are exposed from the second non-conductive layer; a plurality of heat sinks, the plurality of heat sinks being on the first surface of the die, each respective heat sink of the plurality of heat sinks being separate and distinct from an adjacent heat sink of the plurality of heat sinks; a plurality of channels separating each respective one of the plurality of heat sinks from an adjacent one of the plurality of heat sinks; as well as A thermally conductive material fills the plurality of trenches and is on a surface of the die.

12. The device of claim 11, wherein the thermally conductive material is elastic. 13 . The device according to claim 12 , wherein the heat conductive material has an elastic modulus in the range of 0.1 to 5000 MPa or equal to the upper and lower ends of the range.

14. The apparatus of claim 11, wherein the thermally conductive material is configured to increase thermal dissipation of thermal energy during operation.

15. The device according to claim 11, wherein: Each respective heat sink of the plurality of heat sinks comprises: a heat sink end surface spaced apart from the first surface of the die; and The thickness extending from the first surface to the heat sink end surface ranges from 20 to 200 micrometers μm or is equal to the upper and lower ends of the range.

16. The apparatus of claim 15, wherein the thermally conductive material filling the plurality of channels has a thermally conductive surface that is coplanar with the heat sink end surfaces of the plurality of heat sinks.

17. A method comprising: forming a temporary layer covering the first surface of the die; removing portions of the temporary layer to form a plurality of openings in the temporary layer exposing areas of the first surface of the die; depositing a first thermally conductive material in the plurality of openings, thereby forming a plurality of separate and distinct heat sinks by at least partially filling the plurality of openings with the first thermally conductive material; as well as One or more remaining portions of the temporary layer are removed, thereby exposing sidewalls of the plurality of separate and distinct heat sinks, exposing a plurality of channels extending between adjacent ones of the plurality of separate and distinct heat sinks.

18. The method of claim 17, further comprising forming a second heat conductive material within the plurality of trenches and on the first surface of the die, the second heat conductive material having an elasticity ranging from 0.1 to 5000 MPa or equal to the upper and lower ends of the range.

19. The method according to claim 17, further comprising: forming a first non-conductive layer on a second surface of the die opposite the first surface; forming a plurality of conductive vias extending through the first non-conductive layer to the second surface of the die; forming a resin surrounding the die and covering a sidewall of the die; forming a plurality of conductive connection structures on the first non-conductive layer and on the resin; as well as A second non-conductive layer is formed extending around the plurality of conductive connection structures.

20. The method of claim 17, wherein a corresponding heat sink of the plurality of heat sinks has at least one of: a cylindrical shape, a rectangular prism shape, and a diamond prism shape.

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