Light-emitting module and manufacturing method of light-emitting module

Abstract

Provided are an improved novel light-emitting module and a method for manufacturing the light-emitting module so that the required positioning accuracy of a light-emitting device with respect to a base can be more reliably or more easily achieved, the light-emitting module including, for example, a light-emitting device and a base, the base has a mounting surface on which the light-emitting device is mounted via solder facing the first direction, and at least one protruding portion which is adjacent to the mounting surface in a direction intersecting the first direction and protrudes in the first direction relative to the mounting surface. At least one of the protruding portions has a plurality of first surfaces that come into contact with the light-emitting device in mutually different directions that intersect the first direction. A part of the side surface of the light-emitting device is in contact with the first surface, and the exposed part of the conductor part in the side surface is not in contact with the first surface.

Description

Technical Field

[0001] The invention relates to a light emitting module and a method for manufacturing the light emitting module. Background Art

[0002] Conventionally, there is known a light emitting module that guides light output from a light emitting device installed on a chassis to an end of an optical fiber via a plurality of optical components installed on the chassis (for example, Patent Document 1).

[0003] Patent Document 1: International Publication No. 2017 / 134911

[0004] In such a light emitting module, the positioning accuracy of the light emitting device with respect to the chassis is important from the viewpoint of improving the utilization efficiency of light outputted from the light emitting device. Summary of the invention

[0005] Therefore, an object of the present invention is to obtain an improved new light emitting module and a method for manufacturing the light emitting module, which can more reliably or easily achieve the required positioning accuracy of the light emitting device relative to the base.

[0006] The light-emitting module of the present invention, for example, comprises a light-emitting device and a conductive base, wherein the conductive base has a mounting surface on which the light-emitting device is mounted via a bonding material toward a first direction, and at least one protrusion adjacent to the mounting surface in a direction intersecting the first direction and protruding toward the first direction relative to the mounting surface; the at least one protrusion has a plurality of first surfaces connected to the light-emitting device in different directions intersecting the first direction, the light-emitting device has a light-emitting element and a side surface, the side surface exposing a conductor portion electrically connected to an electrode of the light-emitting element, a portion of the side surface being connected to the first surface, and a portion of the side surface where the conductor portion is exposed is not connected to the first surface.

[0007] In addition, the manufacturing method of the light-emitting module of the present invention is, for example: the light-emitting module comprises a light-emitting device and a base, wherein the base comprises a mounting surface on which the light-emitting device is mounted via a bonding material toward a first direction, and at least one protrusion adjacent to the mounting surface in a direction intersecting the first direction and protruding toward the first direction relative to the mounting surface; the at least one protrusion comprises a plurality of first surfaces connected to the light-emitting device in different directions intersecting the first direction, and the manufacturing method of the light-emitting module comprises: a first step of applying a paste-like bonding material on the mounting surface or placing a sheet-like bonding material; a second step of, after the first step, placing the light-emitting device on the bonding material and the mounting surface in a state in which the plurality of first surfaces are connected to the light-emitting device; a third step of, after the second step, heating and melting the bonding material; and a fourth step of, after the third step, mounting the light-emitting device on the mounting surface via the bonding material by curing the bonding material.

[0008] According to the present invention, an improved new light emitting module and a method for manufacturing the light emitting module can be obtained, which can more reliably or easily achieve the required positioning accuracy of the light emitting device relative to the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is an illustrative and schematic plan view of a light emitting module according to an embodiment.

[0010] Figure 2 This is an illustrative and schematic perspective view of a part of the light emitting module according to the embodiment.

[0011] Figure 3 This is an illustrative and schematic plan view of a part of the light emitting module according to the embodiment, and is a view showing a state in which the light emitting module is not mounted on the chassis.

[0012] Figure 4 This is an illustrative and schematic plan view of a part of the light emitting module according to the embodiment, and is a view showing a state where the light emitting module is mounted on a chassis.

[0013] Figure 5 This is an exemplary and schematic cross-sectional view of a light emitting device according to an embodiment.

[0014] Figure 6 This is a flowchart showing an example of the steps of the method for manufacturing the light emitting module according to the embodiment.

[0015] Figure 7 yes Figure 4 VII-VII section view.

[0016] Figure 8 yes Figure 4Section view VIII-VIII of .

[0017] Fig. 9 yes Figure 4 IX-IX section view.

[0018] Description of Reference Numerals

[0019] 10…Base

[0020] 11…First recess

[0021] 11a…Bottom surface (mounting surface)

[0022] 11b…Second concave portion

[0023] 11b1… bottom

[0024] 12, 12A, 12B…protrusion

[0025] 12a…noodle

[0026] 12b1, 12b2… (first side)

[0027] 12b3, 12b4…

[0028] 12c…Gap

[0029] 20…Laser source (light emitting device)

[0030] 21…Housing

[0031] 21A~21C…Components (layers)

[0032] 21a…noodle

[0033] 21b1, 21b2, 21b3, 21b4…side

[0034] 21c…noodle

[0035] 21d…Conductor layer (conductor part)

[0036] 22…Electrode

[0037] 23… Cover parts

[0038] 23a…Window

[0039] 23b…side (second side)

[0040] 24…Chip-on-Substrate Package

[0041] 24a…base

[0042] 24b…Light-emitting element

[0043] 24b1, 24b2…Electrode

[0044] 25…Bottom piece

[0045] 26…Collimating lens

[0046] 27…Internal reflector

[0047] 28…External reflector (reflector)

[0048] 28a…Reflecting surface

[0049] 29…Jointing material

[0050] 30…Optical fiber (first optical component)

[0051] 30a…end

[0052] 40…Solder

[0053] 100...Light emitting module

[0054] 101, 101a1~101an, 101b1~101bn...subunit

[0055] 102…Collimating lens (second optical component)

[0056] 103…Reflector (secondary optical component)

[0057] 104…condenser lens (second optical component)

[0058] 105…condenser lens (second optical component)

[0059] 106…Optical fiber holding portion

[0060] 107…Photosynthesis Department

[0061] 107a…optical beam combiner (second optical component)

[0062] 107b…Reflector (second optical component)

[0063] 107c…1 / 2 wavelength plate (second optical component)

[0064] 108…Coolant passage

[0065] A1, A2...array

[0066] B1, B2…junction

[0067] D1, D2…arrow (direction)

[0068] F1, F2…force

[0069] L…Laser

[0070] L1…Length

[0071] L2…Length

[0072] R…Containment Chamber

[0073] X…direction

[0074] Y…direction (third direction)

[0075] Z…direction (first direction, second direction) DETAILED DESCRIPTION

[0076] The following discloses an exemplary embodiment of the present invention. The structure of the embodiment shown below and the action and result (effect) brought about by the structure are an example. The present invention can also be implemented by structures other than those disclosed in the following embodiments. In addition, according to the present invention, at least one of the various effects (including derived effects) obtained by the structure can be obtained.

[0077] In this specification, serial numbers are assigned for the convenience of distinguishing components, parts, locations, directions, processes, etc., and do not indicate priority or order.

[0078] In each figure, the X direction is indicated by an arrow X, the Y direction is indicated by an arrow Y, and the Z direction is indicated by an arrow Z. The X direction, the Y direction, and the Z direction intersect each other and are orthogonal to each other. In addition, in this specification, the line of sight observed in the opposite direction of the Z direction is referred to as a top view. In addition, the direction refers to the direction of each component when it is assembled in the light emitting module.

[0079] It should be noted that in Figure 1 , Figure 5 In FIG. 1 , the optical path of the laser L is indicated by a solid arrow.

[0080] [Implementation Method]

[0081] [Structure of light-emitting module]

[0082] Figure 1 1 is a schematic diagram of the light emitting module 100 according to the embodiment, and is a plan view of the inside of the light emitting module 100 viewed in the direction opposite to the Z direction.

[0083] like Figure 1 As shown, the light emitting module 100 includes a base 10 , a plurality of subunits 101 , a light combining unit 107 , condenser lenses 104 and 105 , an optical fiber 30 , and an optical fiber holding unit 106 .

[0084] Each subunit 101 includes: a laser source 20, a collimating lens 102, and a reflector 103. The collimating lens 102 collimates the laser in the X direction, in this example, in the slow axis direction. It should be noted that, in the present embodiment, a collimating lens for collimating the laser in the Z direction, in this example, in the fast axis direction, is included in the laser source 20. However, this is an example, and the collimating lens for collimating the laser in the fast axis direction may also be provided outside the laser source 20 between the laser source 20 and the collimating lens 102. In such a case, the collimating lens for collimating in the fast axis direction is included in the subunit 101. The laser source 20 is an example of a light emitting device.

[0085] The laser light outputted by each laser source 20 is guided to the end 30a of the optical fiber 30 via the collimating lens 102 and the reflector 103 of each subunit 101, and further via the optical synthesis unit 107 and the focusing lenses 104 and 105, thereby optically coupling with the optical fiber 30. The optical fiber 30 is an example of a first optical component. In addition, the collimating lens 102, the reflector 103, the optical synthesis unit 107 and the focusing lenses 104 and 105 are an example of a second optical component that guides the laser light outputted from the plurality of laser sources 20 to the optical fiber 30 in a manner optically connected to the optical fiber 30.

[0086] The plurality of subunits 101, the optical synthesis unit 107, the focusing lenses 104 and 105, the end 30a of the optical fiber 30, and at least a portion of the optical fiber holding unit 106 are directly mounted on the base 10 or indirectly mounted via other components, and are housed in a housing formed between the base 10 and the housing. As an example, the housing is airtight, but it may not be airtight.

[0087] The base 10 has a plurality of stepped surfaces as the mounting surface of the subunit 101, which face the Z direction respectively, and deviate by a certain length in the opposite direction of the Z direction as they deviate by a certain length in the X direction. The subunit 101 has subunits 101a1, 101a2, ..., 101an (n is an integer greater than 2) constituting an array A1 arranged in the X direction, and subunits 101b1, 101b2, ..., 101bn constituting an array A2 arranged in the X direction.

[0088] The laser source 20 outputs laser light respectively. The laser light output from the laser source 20 advances in the X direction via the collimating lens 102 and the reflector 103. As described above, the subunits 101 are respectively provided on the step-shaped mounting surface. Therefore, the laser light advancing in the X direction from the reflector 103 of each subunit 101 does not interfere with the reflector of other subunits 101 that deviates in the X direction relative to the reflector 103.

[0089] The laser beams from the respective reflection mirrors 103 are input to the light combining unit 107, and are combined in the light combining unit 107. The light combining unit 107 includes a beam combiner 107a, a reflection mirror 107b, and a half-wave plate 107c.

[0090] The reflector 107b reflects the laser light from the subunit 101 of the array A1 toward the optical beam combiner 107a via the 1 / 2 wavelength plate 107c. The 1 / 2 wavelength plate 107c rotates the polarization plane of the light from the array A1.

[0091] On the other hand, the laser light from the subunit 101 of the array A2 is directly input to the optical beam combiner 107a.

[0092] The optical beam combiner 107a combines the laser beams from the two arrays A1 and A2. The optical beam combiner 107a is also called a polarization combining element.

[0093] The laser light from the optical beam combiner 107a is focused on the end 30a of the optical fiber 30 by the focusing lenses 104 and 105. The focusing lens 104 focuses the laser light on the fast axis, and the focusing lens 105 focuses the laser light on the slow axis.

[0094] The optical fiber holding portion 106 holds the optical fiber 30 via, for example, a bonding material.

[0095] The base 10 is made of a material with a relatively high thermal conductivity such as a metal material. The base 10 is electroplated on the surface of a copper material, for example. The components of the subunit 101, the components of the optical synthesis unit 107, and the focusing lenses 104 and 105 are mounted on the base 10 via a bonding material or a bonding material such as solder. These components may also be indirectly mounted on the base 10 via other components. The optical fiber holding portion 106 may be another component different from the base 10, or may be a part of the base 10.

[0096] In addition, the base 10 is provided with a coolant passage 108, which cools the subunit 101 including the laser source 20, the optical fiber holding part 106, the focusing lenses 104, 105, the optical beam combiner 107a, etc. A coolant such as a cooling liquid flows in the coolant passage 108. The coolant passage 108 passes, for example, near the mounting surface of each component of the base 10, for example, directly below or near it, and the inner surface of the coolant passage 108 and the coolant in the coolant passage 108 are thermally connected to the components and parts of the cooling target, that is, the subunit 101, the optical fiber holding part 106, the focusing lenses 104, 105, the optical beam combiner 107a, etc. The components and parts of the cooling target are cooled by heat exchange between the base 10 and the coolant.

[0097] [Laser source installation structure]

[0098] Figure 2 is a perspective view of a part of the light emitting module 100 . Figure 3 1 is a top view of a portion of the light emitting module 100, and is a view when the laser light source 20 is not installed. Figure 4 It is a plan view of a part of the light emitting module 100 , and is a view in a state where the laser light source 20 is mounted.

[0099] Figure 2 1 shows the location where the laser light source 20 included in the two subunits 101b1 and 101b2 of the array A2 is mounted in the base 10. Figure 2 For convenience of explanation, a state is shown in which the laser light source 20 of the subunit 101 b 1 is not yet mounted and the laser light source 20 of the subunit 101 b 2 is mounted.

[0100] like Figure 2 As shown, a plurality of surfaces 12a are provided in the base 10. The surfaces 12a are oriented toward the Z direction, intersecting and orthogonal to the Z direction. Figure 2 As shown, in array A2, multiple faces 12a are arranged in a step-like shape, and the step-like shape deviates by a certain length in the X direction and also deviates by a certain length in the opposite direction of the Z direction. Figure 2 In the parts shown in the figure, in the base 10, the parts corresponding to the two laser sources 20 adjacent to each other in the X direction in the arrays A1 and A2 all have the same Figure 2 However, the positions corresponding to the two laser sources 20 adjacent to each other in the X direction in the array A1 in the base 10 have the same shape as Figure 2 A mirror-image structure.

[0101] A first recess 11 for accommodating a portion of the laser source 20 is provided on each surface 12a. The first recess 11 is recessed at a substantially constant depth in the opposite direction of the Z direction relative to the surface 12a. The first recess 11 has a substantially quadrilateral shape in a plan view. That is, the bottom surface 11a of the first recess 11 has a substantially quadrilateral shape in a plan view. The bottom surface 11a faces the Z direction, intersects with the Z direction and is substantially orthogonal. The laser source 20 is mounted on the bottom surface 11a via the solder 40 through the so-called reflow soldering surface. The bottom surface 11a is an example of a mounting surface. The solder 40 is an example of a bonding material. The Z direction is an example of a first direction.

[0102] The bottom surfaces 11a are respectively offset by a certain length (depth) in the opposite direction of the Z direction relative to the corresponding surface 12a. Here, as described above, in each array A1, A2, the plurality of surfaces 12a are arranged in a step-like shape, and the step-like shape is such that as the surface 12a is offset by a certain length in the X direction, it is also offset by a certain length in the opposite direction of the Z direction. Thus, in each array A1, A2, the plurality of bottom surfaces 11a are arranged in a step-like shape, and the step-like shape is such that as the surface 12a is offset by a certain length in the X direction, it is also offset by a certain length in the opposite direction of the Z direction.

[0103] With respect to each such bottom surface 11a, the surface 12a deviates in the Z direction. That is, in the present embodiment, with respect to each bottom surface 11a formed in a stepped shape, it can be said that a protrusion 12 with the surface 12a as the top surface is formed. The protrusion 12 is adjacent to the bottom surface 11a in a direction intersecting the Z direction, and protrudes relative to the bottom surface 11a in the Z direction. It should be noted that in the present embodiment, two protrusions 12A and 12B are provided on the base 10 with respect to each bottom surface 11a. However, the number of protrusions 12 with respect to the bottom surface 11a is not limited to two, and may be one, or may be three or more. That is, at least one protrusion 12 may be provided on the base 10 corresponding to each bottom surface 11a. In addition, in the present embodiment, the top surfaces (the surface 12a in the present embodiment) of the plurality of protrusions 12 corresponding to one bottom surface 11a have the same position in the Z direction, that is, they are planes. In this case, by forming the first recess 11 and the notch 12c after forming the surface 12a, it is possible to relatively easily form a plurality of protrusions 12. It should be noted that the top surfaces of the plurality of protrusions 12 may also deviate in the Z direction. In addition, on the surface 12a, the collimating lens 102 and the reflector 103 may also be installed at a position away from the first recess 11.

[0104] like Figure 2 , 3 As shown, the protrusion 12 has four surfaces 12b1 to 12b4 constituting the side surfaces of the first recess 11. The surface 12b1 faces the opposite direction of the X direction, intersecting and being substantially orthogonal to the X direction. The surface 12b2 faces the Y direction, intersecting and being substantially orthogonal to the Y direction. The surface 12b3 faces the X direction, intersecting and being substantially orthogonal to the X direction. In addition, the surface 12b4 faces the opposite direction of the Y direction, intersecting and being substantially orthogonal to the Y direction.

[0105] like Figure 4As shown, the laser light source 20 has side surfaces 21b1 to 21b4 facing the four surfaces 12b1 to 12b4 of the protrusion 12, respectively. The side surface 21b1 faces the X direction, intersects and is approximately perpendicular to the X direction, and is opposite to the surface 12b1. The side surface 21b2 faces the opposite direction of the Y direction, intersects and is approximately perpendicular to the Y direction, and is opposite to the surface 12b2. The side surface 21b3 faces the opposite direction of the X direction, intersects and is approximately perpendicular to the X direction, and is opposite to the surface 12b3. In addition, the side surface 21b4 faces the Y direction, intersects and is approximately perpendicular to the Y direction, and faces the surface 12b4 of the first recess 11.

[0106] like Figure 4 As shown, the laser source 20 is arranged in the first recess 11 at a position biased in the opposite direction of the Y direction and the X direction. That is, the laser source 20 is mounted on the base 10 in a state where the side surface 21b1 is in contact with the surface 12b1 of the protrusions 12B and 12, and the side surface 21b2 is in contact with the surface 12b2 of the protrusions 12A and 12. That is, in this embodiment, the surface 12b1 and the surface 12b2 are used to position the laser source 20 relative to the base 10. In different directions intersecting the Z direction, in this embodiment as an example, the surface 12b1 and the surface 12b2 are in contact with the laser source 20 in the opposite direction of the X direction and the Y direction. According to such a structure, the laser source 20 can be positioned with high precision relative to the base 10 in different directions intersecting the Z direction. In addition, such a structure can also suppress the deviation of the laser source 20 relative to the base 10 around the Z axis. The surface 12b1 and the surface 12b2 are examples of the first surface, which can also be called a contact surface or a positioning surface. It should be noted that the direction opposite to the X direction and the Y direction are different directions from each other and are directions intersecting with each other.

[0107] In addition, if Figure 2 , Figure 3As shown, in the present embodiment, a second recess 11b for accommodating the solder 40 is provided on the bottom surface 11a. The second recess 11b is recessed to a substantially constant depth in the opposite direction of the Z direction relative to the bottom surface 11a. The second recess 11b has a substantially quadrilateral shape when viewed from above. That is, the bottom surface 11b1 of the second recess 11b has a substantially quadrilateral shape when viewed from above. The bottom surface 11b1 faces the Z direction, intersects with the Z direction and is substantially orthogonal. The solder 40, in a state before melting, has a quadrilateral and sheet-like shape that is smaller than the bottom surface 11b1 of the second recess 11b when viewed from above and has a substantially constant thickness. It should be noted that the solder 40 may also be in a paste form. The second recess 11b can be used as a positioning target for placing the solder 40 on the bottom surface 11a before melting. In addition, the second recess 11b can accommodate the melted, wetted and diffused solder. That is, by providing the second recess 11 b for receiving the solder 40 on the bottom surface 11 a , it is possible to obtain an effect that the solder 40 remains at an appropriate position after the laser light source 20 is mounted, both before and after melting.

[0108] [Laser source mechanism]

[0109] Figure 5 FIG. 2 is a cross-sectional view of a laser source 20 as a light emitting device. Figure 5 As shown, the laser source 20 includes a housing 21 , an electrode 22 , a cover member 23 , a chip on submount package 24 (CoS package), a base member 25 , a collimating lens 26 , an internal reflector 27 , an external reflector 28 , and a bonding material 29 .

[0110] The housing 21 has a stacked structure in which a plurality of plate-shaped components 21A to 21C are stacked. The housing 21 is, for example, a ceramic housing. In this case, the components 21A to 21C are made of ceramic. The components 21A to 21C are an example of a layer. Through holes are provided in each of the components 21A to 21C. The components 21A to 21C are stacked and integrated in such a manner that these through holes overlap in the Z direction. The cover component 23 is integrated in a state of being in contact with the component 21C in the Z direction while covering the through hole of the component 21C. In addition, the bottom component 25 is integrated in a state of being in contact with the component 21B in the opposite direction of the Z direction while penetrating the through hole of the component 21A and covering the through hole of the component 21B. With such a structure, a component storage chamber R surrounded by the components 21A to 21C, the cover component 23, and the bottom component 25 is formed inside the laser source 20. The cover component 23 is made of a material that can transmit laser light, such as sapphire or glass. The surface of the end portion of the cover member 23 in the opposite direction to the Z direction is formed except for the window portion 23a (see Figure 4), is covered with a shielding film for shielding laser light. The shielding film is, for example, a metal film. In addition, the bottom member 25 is made of a material with a relatively high thermal conductivity, such as a metal material, and functions as a heat dissipation unit. The bottom member 25 is integrated with the housing 21 in a state where it protrudes slightly in the opposite direction of the Z direction from the surface 21a of the end portion of the housing 21 in the opposite direction of the Z direction.

[0111] The electrode 22 is provided at a position away from the cover member 23 on the surface 21c at the end in the Z direction of the housing 21. The electrode 22 is made of a relatively high conductive material such as a metal material. Examples of the metal material include silver, copper, tungsten, molybdenum, gold, nickel, platinum, titanium, palladium, and the like.

[0112] A chip on submount package 24, a collimating lens 26, and an internal reflector 27 are housed in the housing chamber R. The chip on submount package 24 includes a submount 24a and a light emitting element 24b.

[0113] The base 24a has a plate shape that intersects and is substantially perpendicular to the Z direction. The base 24a is made of an insulating material with a relatively high thermal conductivity, such as ceramics or glass, such as aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide. The base 24a is mounted on the bottom member 25.

[0114] The light emitting element 24b is, for example, a semiconductor laser element having a fast axis and a slow axis. The light emitting element 24b has an elongated shape extending in the Y direction. The light emitting element 24b outputs laser light L in the Y direction. The chip-on-substrate package 24 is mounted such that the fast axis of the light emitting element 24b is in the Z direction and the slow axis is in the X direction.

[0115] The collimator lens 26 collimates the laser light L traveling in the Y direction in the Z direction, which is the fast axis direction in this example. The collimator lens 26 is attached to the base 24 a or the lens holder.

[0116] The internal reflection mirror 27 reflects the laser light L transmitted through the collimator lens 26 and traveling in the Y direction in the Z direction. The laser light L reflected by the internal reflection mirror 27 transmits through the window portion 23 a of the cover member 23 and is emitted to the outside of the laser light source 20 .

[0117] The external reflector 28 reflects the light that passes through the window 23a and travels in the Z direction toward the Y direction. The external reflector 28 is bonded to the surface 23b of the cover member 23 via a bonding material 29. The surface 23b is located at the end of the cover member 23 in the Z direction, faces the Z direction, and intersects and is substantially orthogonal to the Z direction.

[0118] Here, the reflecting surface 28a of the external reflector 28 extends in the direction toward the Y direction as it goes toward the Z direction, that is, in the direction between the Y direction and the Z direction. Therefore, by adjusting the relative mounting position of the external reflector 28 with respect to the cover member 23 in the Y direction as shown by the arrow D1, the relative position (height) of the laser L with respect to the cover member 23 in the Z direction as shown by the arrow D2 can be adjusted. In addition, by adjusting the relative angles of the external reflector 28 with respect to the cover member 23 around the X axis, the Y axis, and the Z axis, the direction of the laser L can be adjusted. In this case, first, before or after the bonding material 29 is applied and not yet cured and soft, the external reflector 28 and the cover member 23 are positioned using a jig or the like to obtain the desired position and direction of the laser L. Thereafter, the bonding material 29 is cured while maintaining the relative positioning state. According to such a structure and method, the position and direction of the laser L can be adjusted with higher accuracy. The bonding material 29 is, for example, a thermosetting or ultraviolet curing bonding material. The Z direction is an example of a second direction, the external reflector 28 is an example of a reflector, and the surface 23 b is an example of a second surface.

[0119] In the housing 21, a conductor layer made of a conductive metal material is provided at the boundaries B1 and B2 where the plurality of components 21A to 21C are adjacent to each other. The conductor layer is electrically connected to the electrode 24b1 or the electrode 24b2 of the light emitting element 24b via an electrode provided on the base 24a, a bonding wire, etc. In addition, the conductor layer is electrically connected to the electrode 22 via a via provided in the housing 21. That is, the conductive layer provided at the boundaries B1 and B2 constitutes a part of the wiring that electrically connects the electrodes 24b1 and 24b2 of the light emitting element 24b to the electrode 22 of the laser light source 20. The metal material of the conductive layer can be, for example, silver, copper, tungsten, molybdenum, gold, nickel, platinum, titanium, palladium, or an alloy thereof.

[0120] [Installation of laser source on the base]

[0121] Figure 6 FIG. 1 is a flowchart showing an example of a step of mounting the laser light source 20 on the base 10 in the method of manufacturing the light emitting module 100. Figure 6As shown, first, a sheet of solder 40 is placed or a paste of solder 40 is applied on the bottom surface 11a as the mounting surface, which is the bottom surface 11b1 of the second recess 11b in this embodiment (S11). Then, a laser light source 20 as a light emitting device is placed on the solder 40 and the bottom surface 11a (S12). In S12, in order to reliably connect the solder 40 with the bottom member 25 of the laser light source 20, it is preferable to appropriately set the thickness of the solder 40, the depth from the bottom surface 11a of the second recess 11b, and the protruding height from the surface 21a of the bottom member 25. S11 and S12 are sequentially performed on all the bottom surfaces 11a included in the light emitting module 100. S11 is an example of the first process, and S12 is an example of the second process.

[0122] Next, the solder 40 is heated and melted ( S13 ), and the melted solder 40 is cooled and solidified, so that the laser light source 20 is surface-mounted on the bottom surface 11 a ( S14 ). S13 is an example of the third step, and S14 is an example of the fourth step.

[0123] In S13, when the solder 40 melts, the laser light source 20 floats on the molten solder 40, and the position and posture are unstable, so that when the solder 40 is solidified in S14, it may deviate from the desired position. Therefore, in this embodiment, in S12, the laser light source 20 is placed on the solder 40 in a state where the side surface 21b1 is in contact with the surface 12b1 of the protrusion 12B, and the side surface 21b2 is in contact with the surface 12b2 of the protrusion 12A. Therefore, in S13 and S14, the movement of the laser light source 20 in the X direction relative to the base 10 is restricted by the contact between the surface 12b1 and the side surface 21b1, and the movement of the laser light source 20 in the opposite direction of the Y direction relative to the base 10 is restricted by the contact between the surface 12b2 and the side surface 21b2. In addition, there is also a situation where the movement of the laser source 20 relative to the base 10 in the Y direction and the opposite direction of the Y direction is limited by the friction between the side 21b1 and the surface 12b1, and the movement of the laser source 20 in the X direction and the opposite direction of the X direction is limited by the friction between the surface 12b2 and the side 21b2. As a result, in S13 and S14, the movement of the laser source 20 in the direction intersecting the Z direction and the rotation of the laser source 20 around the Z axis can be suppressed, and the desired positioning accuracy of the laser source 20 relative to the base 10 can be achieved more reliably or more easily. It should be noted that when the bonding material is other than the solder 40, the same effect can be obtained when the bonding material has fluidity, volume changes, shape changes, etc. during the period before the bonding material solidifies. Such bonding materials include metal solder paste (Au, Ag, Cu, etc.), solder materials, resin materials, etc.

[0124] In addition, in S13 and S14, if Figure 4As shown, by means of a pressing component, the laser source 20 can be pressed relative to the base 10 by a force F1 in the X direction and by a force F2 in the opposite direction of the Y direction. The force F1 is a pressing force for pressing the side surface 21b1 against the surface 12b1, and the force F2 is a pressing force for pressing the side surface 21b2 against the surface 12b2. Thus, the contact effect between the surface 12b1 and the side surface 21b1, and the contact effect between the surface 12b2 and the side surface 21b2 can be reliably obtained. It should be noted that within the range of obtaining the above-mentioned effects, the forces F1 and F2 are set as small as possible, and the forces are applied in a manner that the laser source 20 does not tilt. In addition, the forces F1 and F2 can be applied to both sides, or only one side can be applied.

[0125] Figure 7 to Figure 9 It is a cross-sectional view showing the state after S14, that is, the state in which the surface mounting of the laser light source 20 with respect to the bottom surface 11a is completed. Figure 7 yes Figure 4 VII-VII section view. Figure 8 yes Figure 4 VIII-VIII section view. In addition, Fig. 9 yes Figure 4 IX-IX section view.

[0126] When the laser source 20 is mounted on the base 10, Figure 7 , Fig. 9 As shown in FIG. 1 , the side surface 21b1 of the laser light source 20 is in contact with the surface 12b1 of the protrusion 12B. Figure 8 As shown, the side surface 21b2 of the laser source 20 contacts the surface 12b2 of the protrusion 12A. The laser source 20 is positioned relative to the base 10 in the directions intersecting the Z direction, ie, in the X direction and the Y direction, by contacting these two locations.

[0127] In addition, in the present embodiment, the side surface 21b4 ( Figure 7 )、Side 21b3( Figure 8 ), and side 21b1 ( Fig. 9 ), the boundary B1 between the component 21A and the component 21B is exposed (refer to Figure 5 ) is formed at an end of a conductor layer 21d. The conductor layer 21d constitutes a part of wiring that electrically connects the electrode 24b1 or the electrode 24b2 of the light emitting element 24b to the electrode 22 of the laser light source 20. The conductor layer 21d is an example of a conductor portion.

[0128] The conductor layer 21d is made by electroplating, for example, on the surface of the end of the component 21A in the Z direction before the components 21A to 21C are stacked and integrated. The source component arranged in a matrix shape relative to the areas for the multiple laser sources 20 (hereinafter referred to as packaging areas) is subjected to electroplating treatment for the component 21A, and the packaging areas cut out from the source component become the components 21A corresponding to the laser sources 20. In this case, the boundary between the adjacent packaging areas becomes the side surface of the component 21A, i.e., the shell 21. Here, the electroplating treatment is performed together with respect to the multiple packaging areas in the source component. Therefore, the wiring pattern for the electroplating treatment is formed in a manner that crosses the boundary of the multiple packaging areas. Therefore, in the present embodiment, in the side surfaces 21b1, 21b3, and 21b4 of the shell 21, the portion of the wiring pattern that crosses the boundary between the packaging areas is exposed as the end of the conductor layer 21d.

[0129] When the base 10 is made of a conductive material such as a metal material, when the end of the conductor layer 21d exposed on the side surfaces 21b1 and 21b2 contacts the surfaces 12b1 and 12b2 of the protrusion 12, a short circuit may occur between the electrodes 24b1 and 24b2 of the light emitting element 24b and the base 10. Fig. 9 As shown, in the side surface 21b1 connected to the surface 12b1, the end of the conductor layer 21d is exposed at a position away from the protrusion 12B. In other words, in the base 10, the protrusion 12B having the surface 12b1 is provided at a position away from the end of the conductor layer 21d. In other words, a part of the side surface 21b1 is connected to the surface 12b1 and the part of the side surface 21b1 where the end of the conductor layer 21d is exposed is not connected to the surface 12b1. Specifically, as Figure 2 to Figure 4 As shown, in the base 10, a notch 12c for exposing the end of the conductor layer 21d is provided between the protrusion 12A and the protrusion 12B. With such a structure, when the base 10 is made of a conductive material and the end of the conductor layer 21d is exposed on the side 21b1 of the housing 21 of the laser light source 20, it is possible to suppress the contact between the conductor layer 21d and the base 10, and the short circuit between the electrodes 24b1 and 24b2 of the light emitting element 24b and the base 10. In addition, it is also possible to suppress the phenomenon that the gap between the side 21b1 and the surface 12b1 in the bottom surface 11a moves in the Z direction due to the wettability of the molten solder 40 and the capillary phenomenon, thereby causing a short circuit between the end of the conductor layer 21d and the surface 12b1 via the solder 40.

[0130] In addition, if Figure 4As shown, the length L2 of the portion of the surface 12b1 that is in contact with the side surface 21b1 in the Y direction is shorter than the length L1 of the side surface 21b1 of the laser light source 20 that is in contact with the surface 12b1 in the Y direction. With such a structure, a notch 12c can be provided that is adjacent to the protrusion 12B having the surface 12b1 and serves as a non-formed portion of the protrusion 12B and the surface 12b1. Assuming that the amount of solder 40 applied in S12 is more than the required amount, when the molten solder 40 in S13 remains in the first recess 11, in S14, the solder 40 solidifies in a state of contact with the end of the conductor layer 21d exposed from the side surface 21b1, and a short circuit may occur between the end of the conductor layer 21d and the surface 12b1 via the solder 40. In this regard, in the present embodiment, even when the amount of the solder 40 is larger than the desired amount, the molten solder 40 can flow out of the first recess 11 from the notch 12c, which is the non-formed portion, in S13. Thus, it is possible to suppress a short circuit between the end of the conductor layer 21d and the surface 12b1 via the solder 40. The Y direction is an example of the third direction.

[0131] As described above, in the present embodiment, the protrusion 12 protruding from the bottom surface 11a (mounting surface) in the base 10 in the Z direction (first direction) has a surface 12b1 (first surface) in contact with the laser light source 20 (light emitting device) in the X direction and a surface 12b2 (first surface) in contact with the laser light source 20 in the Y direction. According to such a structure, the laser light source 20 is surface-mounted on the bottom surface 11a (mounting surface) in a state in which the laser light source 20 is in contact with the surfaces 12b1 and 12b2 in different directions from each other, so that the required positioning accuracy of the laser light source 20 relative to the base 10 can be achieved more easily or more reliably.

[0132] Furthermore, in the present embodiment, the laser light source 20 includes a light emitting element 24b and a side surface 21b1, and the side surface 21b1 exposes a conductor layer 21d (conductor portion) electrically connected to the electrodes 24b1 and 24b2 of the light emitting element 24b. In addition, a portion of the side surface 21b1 is in contact with the surface 12b1 of the protrusion 12B, and a portion of the side surface 21b1 where the conductor layer 21d is exposed is not in contact with the surface 12b1. With such a structure, it is possible to suppress a short circuit between the light emitting element 24b and the base 10 caused by the contact between the conductor layer 21d and the surface 12b1.

[0133] In addition, in the present embodiment, the bottom surface 11a is provided with a second recess 11b for accommodating the solder 40. According to such a structure, the solder 40 can be retained at an appropriate position after the laser source 20 is mounted, both before and after melting. In other words, it is possible to suppress the laser source 20 from moving from a desired position in S13 due to the flow of the molten solder 40. That is, according to such a structure, the required positioning accuracy of the laser source 20 relative to the base 10 can be achieved more easily or more reliably.

[0134] The above examples illustrate the embodiments of the present invention, but the above embodiments are only examples and are not intended to limit the scope of the invention. The above embodiments can be implemented in various other ways, and various omissions, substitutions, combinations, and changes can be made without departing from the gist of the invention. In addition, the specifications of various structures, shapes, etc. (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be appropriately changed and implemented.

Claims

1. A light emitting module, wherein: have: Light-emitting device; A conductive base having a mounting surface on which the light emitting device is mounted via a bonding material facing a first direction, and at least one protrusion adjacent to the mounting surface in a direction intersecting the first direction and protruding in the first direction relative to the mounting surface; The at least one protrusion has a plurality of first surfaces that are in contact with the light emitting device in different directions that intersect the first direction. The light emitting device comprises a light emitting element and a side surface, wherein a conductor portion electrically connected to an electrode of the light emitting element is exposed on the side surface. A portion of the side surface is in contact with the first surface, and a portion of the side surface where the conductor portion is exposed is not in contact with the first surface.

2. The light emitting module according to claim 1, wherein: The mounting surface is provided with a recessed portion for accommodating the bonding material.

3. The light emitting module according to claim 1, wherein: The light emitting device comprises a housing, the housing having the side surface and accommodating the light emitting element. The housing has a plurality of layers stacked in the first direction, The conductor portion exposed at the side surface is an end portion of a conductor layer formed at a boundary between two adjacent layers among the plurality of layers.

4. The light emitting module according to claim 3, wherein: The housing has a window portion through which light output from the light emitting element passes in a second direction. The light emitting device includes a reflector for reflecting light that passes through the window and travels in the second direction in a direction intersecting the second direction. The reflector is bonded to a second surface of the light emitting device facing the second direction via a bonding material.

5. The light emitting module according to claim 1, wherein: The length of the first surface in a third direction intersecting the first direction is shorter than the length of the side surface in the third direction.

6. The light emitting module according to any one of claims 1 to 5, wherein: The base has a plurality of mounting surfaces as the mounting surfaces, The light emitting module comprises: A plurality of light emitting devices as the light emitting devices; A plurality of second optical components guide the light output from each of the light emitting devices toward the first optical component.

7. A method for manufacturing a light emitting module, wherein: The light emitting module comprises: Light-emitting device; A base having a mounting surface on which the light emitting device is mounted via a bonding material facing a first direction, and at least one protrusion adjacent to the mounting surface in a direction intersecting the first direction and protruding in the first direction relative to the mounting surface; The at least one protrusion has a plurality of first surfaces that are in contact with the light emitting device in different directions that intersect the first direction. The manufacturing method of the light emitting module comprises: The first step is to apply a paste-like bonding material or place a sheet-like bonding material on the mounting surface; A second step, after the first step, placing the light emitting device on the bonding material and the mounting surface in a state where the plurality of first surfaces are in contact with the light emitting device; A third step, after the second step, heating and melting the bonding material; A fourth step is to mount the light emitting device on the mounting surface via the bonding material by curing the bonding material after the third step.

8. The method for manufacturing a light emitting module according to claim 7, wherein: A recess is provided on the mounting surface, In the first step, a paste-like bonding material is applied or a sheet-like bonding material is placed on the bottom surface of the recess.

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