Static electricity eliminating device, layer structure with static electricity eliminating function and film sticking machine

Abstract

The invention discloses a static electricity elimination device, a layer structure with a static electricity elimination function and a film sticking machine, the static electricity elimination device is applied to the layer structure, the layer structure comprises a functional layer and other layers, the functional layer is provided with a functional circuit and a peripheral wire, and the static electricity elimination device comprises a one-way conduction device and / or an energy consumption device. One end of the one-way conduction device is connected with the binding pin of the peripheral wire, the other end of the one-way conduction device is connected with the grounding end, the one-way conduction device is configured to introduce static electricity generated in the separation or attachment process of the functional layer and other layers into the grounding end, one end of the energy consumption device is connected with the binding pin of the peripheral wire, and the other end of the energy consumption device is connected with the grounding end. The other end of the energy consumption device is connected with the grounding end, and the energy consumption device is configured to consume static electricity generated in the process that the functional layer is separated from or attached to other layers in a light-emitting and / or heat-emitting mode. The design can prevent the functional circuit in the functional layer from being damaged by static electricity generated in the attaching or separating process of the functional layer and other layers.

Description

Technical Field

[0001] The present application relates to the technical field of static elimination, and in particular to a static elimination device, a layer structure with static elimination function, and a film laminating machine. Background Art

[0002] Taking a capacitive touch screen as an example of layer structure, the functional layer in the layer structure of the capacitive touch screen is a conductive film. Functional circuits such as sensing circuits and driving circuits are fabricated on the conductive layer of the conductive film to form sensing electrodes of the touch sensor.

[0003] The sensing circuit and the driving circuit are invisible grid circuits, and the diameter of the sensing circuit and the driving circuit is as small as a few microns or even lower. Such high-precision sensing circuits and driving circuits have a weak ability to withstand static electricity (for example, 8KV air discharge can cause the sensing circuit and the driving circuit to be damaged and broken). Therefore, how to effectively prevent the static electricity generated during the bonding or separation of the functional layer and other layers from damaging the functional circuits in the functional layer has become an urgent problem to be solved. Summary of the invention

[0004] The embodiments of the present application provide an electrostatic elimination device, a layer structure with electrostatic elimination function, and a film laminating machine, which can solve the problem in the related art that the static electricity generated during the bonding or separation of the functional layer with other layers causes damage to the functional circuits in the functional layer.

[0005] In the first aspect, an embodiment of the present application provides an electrostatic eliminator; the electrostatic eliminator is applied to a layer structure, the layer structure includes a functional layer and other layers, the functional layer has a functional circuit and a peripheral routing connected to the functional circuit, the electrostatic eliminator includes a unidirectional conductive device, one end of the unidirectional conductive device is used to connect to the binding pin of the peripheral routing, the other end of the unidirectional conductive device is connected to the ground terminal, the unidirectional conductive device is configured to introduce the static electricity generated during the separation or bonding of the functional layer with other layers into the ground terminal, and / or the electrostatic eliminator includes an energy-consuming device, one end of the energy-consuming device is used to connect to the binding pin of the peripheral routing, the other end of the energy-consuming device is connected to the ground terminal, and the energy-consuming device is configured to consume the static electricity generated during the separation or bonding of the functional layer with other layers by emitting light and / or generating heat.

[0006] Based on the static electricity elimination device of the embodiment of the present application, by designing a unidirectional conductive device, a path is formed between the functional circuit, the peripheral routing, the unidirectional conductive device and the grounding terminal, so that the static electricity generated during the bonding or separation of the functional layer with other layers is directly introduced into the grounding terminal through the functional circuit, the peripheral routing and the unidirectional conductive device in sequence, thereby effectively preventing the static electricity generated during the bonding or separation of the functional layer with other layers from causing damage to the functional circuit in the functional layer; by designing an energy-consuming device, a path is formed between the functional circuit, the peripheral routing, the energy-consuming device and the grounding terminal, so that the electrical energy corresponding to the static electricity generated during the bonding or separation of the functional layer with other layers is converted into light energy and / or heat energy of the energy-consuming device and consumed, thereby effectively preventing the static electricity generated during the bonding or separation of the functional layer with other layers from causing damage to the functional circuit in the functional layer.

[0007] In the second aspect, an embodiment of the present application provides a layer structure with an electrostatic elimination function; the layer structure includes a functional layer, other layers and the above-mentioned electrostatic elimination device, the functional layer has a functional circuit and peripheral wiring connected to the functional circuit, the other layers are adhered to at least one side of the functional layer, and the binding pins of the electrostatic elimination device and the peripheral wiring are detachably electrically connected.

[0008] Based on the layer structure with static electricity elimination function in the embodiment of the present application, the above-mentioned static electricity elimination device can introduce the static electricity generated by the friction between the layer structures during the transportation of the layer structure into the ground terminal or consume it, or can introduce the static electricity generated by the friction between the layer structure and other structures during the assembly process of the layer structure and other structures into the ground terminal or consume it, thereby effectively preventing static electricity from causing damage to the functional circuits in the functional layer.

[0009] In a third aspect, an embodiment of the present application provides a film laminating machine with a static electricity elimination function; the film laminating machine includes a film laminating table and a static electricity elimination device. The film laminating table carries a layer to be laminated, and the layer to be laminated includes a functional layer, and the functional layer has a functional circuit and a peripheral routing connected to the functional circuit. The static electricity elimination device includes a unidirectional conductive device, one end of which is used to connect to the binding pin of the peripheral routing, and the other end of the unidirectional conductive device is connected to the ground terminal, and the unidirectional conductive device is configured to introduce the static electricity generated in the process of laminating the functional layer with other layers into the ground terminal when the functional circuit is directly laminated to the bearing surface of the film laminating table; and / or, the static electricity elimination device includes an energy-consuming device, one end of which is used to connect to the binding pin of the peripheral routing, and the other end of the energy-consuming device is connected to the ground terminal, and the energy-consuming device is configured to consume the static electricity generated in the process of laminating the functional layer with other layers by emitting light and / or generating heat when the functional circuit is directly laminated to the bearing surface of the film laminating table.

[0010] The film laminating machine with static electricity elimination function in the embodiment of the present application has a static electricity elimination device, which can introduce the static electricity generated during the lamination of the functional layer with other layers into the ground terminal or consume it, thereby effectively preventing the static electricity generated during the lamination of the functional layer with other layers from damaging the functional circuits in the functional layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0012] Figure 1 This is a perspective structural diagram of a layer structure in one embodiment of the present application;

[0013] Figure 2 This is a schematic structural diagram of a unidirectional conductive device and / or an energy dissipation device in an embodiment of the present application;

[0014] Figure 3 This is a schematic diagram of the structure of a static elimination device in one embodiment of the present application;

[0015] Figure 4 This is a schematic diagram of the structure of other layers in one embodiment of the present application;

[0016] Figure 5 This is a structural schematic diagram of the connection between the binding pins of the static elimination device and the functional circuit in one embodiment of the present application;

[0017] Figure 6 This is a schematic diagram of the structure after other layers, functional layers and static elimination devices are assembled in one embodiment of the present application;

[0018] Figure 7 This is a schematic diagram of the structure of a layer in an embodiment of the present application;

[0019] Figure 8 is a schematic structural diagram of a layer structure in another embodiment of the present application;

[0020] Fig. 9 This is a schematic structural diagram of a layer structure in yet another embodiment of the present application;

[0021] Fig.10 This is a schematic diagram of the structure of a layer in another embodiment of the present application;

[0022] Fig.11 is a schematic structural diagram of a layer structure in another embodiment of the present application;

[0023] Fig.12 This is a schematic structural diagram of a layer structure in yet another embodiment of the present application;

[0024] Fig.13 This is a structural schematic diagram of a film laminating machine in one embodiment of the present application;

[0025] Fig.14 It is a structural schematic diagram of a film laminating machine in the related technology.

[0026] Reference numerals: 10, static elimination device; 11, unidirectional conductive device; 12, energy consumption device; 13, conductive member; GND, ground terminal; 20, layer structure; 21, functional layer; 211, functional circuit; 2111, sensing circuit; 2112, driving circuit; 2113, PET substrate; 2114, insulating layer; 212, peripheral routing; 2121, binding pin; 22, other layers; 221, substrate layer; 2211, hollow area; 2212, optical adhesive layer; 2213, first optical adhesive layer; 2214, second optical adhesive layer; 222, protective layer; 2221, first protective layer; 2222, second protective layer; 23, protective glass; 30, film laminating machine; 31, lower film laminating table; 32, upper film laminating table;

[0027] 30', film laminating machine; 31', lower film laminating table; 32', upper film laminating table; 33', static electricity eliminating ion blower. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0029] Please refer to Figure 1-Figure 3 and Figure 5 As shown, the first aspect of the present application proposes an electrostatic eliminator 10, which can introduce static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 into the ground terminal GND or consume it, thereby effectively preventing static electricity from damaging the functional circuit 211 in the functional layer 21.

[0030] The static eliminator 10 is applied to a layer structure 20, which includes a functional layer 21 and other layers 22. The functional layer 21 has a functional circuit 211 and a peripheral wiring 212 connected to the functional circuit 211. The static eliminator 10 includes a unidirectional conductive device 11; one end of the unidirectional conductive device 11 is used to connect to a binding pin 2121 of the peripheral wiring 212, and the other end of the unidirectional conductive device 11 is connected to a ground terminal GND. The unidirectional conductive device 11 is configured to introduce static electricity generated during the separation or bonding of the functional layer 21 and other layers 22 to the ground terminal GND. And / or, the static eliminator 10 includes an energy consuming device 12; one end of the energy consuming device 12 is used to connect to a binding pin 2121 of the peripheral wiring 212, and the other end of the energy consuming device 12 is connected to the ground terminal GND; the energy consuming device 12 is configured to consume static electricity generated during the separation or bonding of the functional layer 21 and other layers 22 by emitting light and / or generating heat.

[0031] The following combination Figure 1-Figure 3 The specific structure of the static eliminator 10 is introduced in detail.

[0032] like Figure 1-Figure 3 As shown, the static eliminator 10 is applied to a layer structure 20 .

[0033] The layer structure 20 includes a functional layer 21 and further layers 22 .

[0034] The functional layer 21 has a functional circuit 211 and a peripheral wiring 212, and the peripheral wiring 212 is connected to the functional circuit 211. Among them, the functional layer 21 can be a sensing circuit layer, in which case the functional circuit 211 corresponds to the sensing circuit 2111; the functional layer 21 can also be a driving circuit layer, in which case the functional circuit 211 corresponds to the driving circuit 2112; the functional layer 21 can also be a combination of a sensing circuit layer and a driving circuit layer, in which case the functional circuit 211 includes a sensing circuit 2111 and a driving circuit 2112. It should be noted that the functional circuit 211 and the peripheral wiring 212 can be formed by processing the corresponding material of the functional layer 21 through a yellow light process (exposure-development-etching, etc.). When the functional layer 21 is a combination of a sensing circuit layer and a driving circuit layer, insulation measures need to be taken between the sensing circuit 2111 and the driving circuit 2112. The insulation measures can be, but are not limited to, filling resin materials such as acrylic acid or polyurethane between the sensing circuit 2111 and the driving circuit 2112.

[0035] The other layer 22 may be a protective layer 222 of the functional layer 21, which is bonded to at least one side of the functional layer 21, so as to form a corresponding layer structure 20 with the functional layer 21. The other layer 22 may also be a combination layer of the functional layer 21, which is pre-bonded to at least one side of the functional layer 21, so as to form a corresponding layer structure 20 with the functional layer 21. It should be noted that the other layer 22 as the protective layer 222 has been bonded to the functional layer 21 in advance. However, the other layer 22 as the combination layer has not been bonded to the functional layer 21 in advance, but needs to be bonded to the other layer 22 to be bonded with the functional layer 21 to be bonded through a bonding process of a film bonding machine 30.

[0036] Considering that static electricity will be generated during the process of the functional layer 21 being attached to other layers 22 (in this case, the other layers 22 serve as a combined layer) or being separated (in this case, the other layers 22 serve as a protective layer 222), and the larger the size, the higher the static electricity generated. However, the functional circuit 211 in the functional layer 21 has a limited ability to withstand static electricity, and there is a risk of damaging the functional circuit 211 in the functional layer 21 due to excessive static electricity. For example, taking a capacitive touch screen as an example, the functional layer 21 in the layer structure 20 of the capacitive touch screen is a PET conductive film (such as an indium tin oxide film, a nanosilver film, a metal mesh copper film, a silver paste mesh film, etc.), and the functional circuits 211 such as a sensing circuit 2111 and a driving circuit 2112 are made on the conductive layer of the PET conductive film to form the sensing electrodes of the touch sensor. Because the sensing line 2111 and the driving line 2112 are invisible grid lines, the diameters of the sensing line 2111 and the driving line 2112 are as small as a few microns or even lower. Such high-precision sensing line 2111 and the driving line 2112 have a weak ability to withstand static electricity (for example, 8KV air discharge can cause the sensing line 2111 and the driving line 2112 to be damaged and broken).

[0037] like Figure 1-Figure 3 As shown, in order to solve the problem of static electricity damaging the functional circuit 211 in the functional layer 21 during the bonding or separation of the functional layer 21 and other layers 22, the static electricity elimination device 10 is designed to include a unidirectional conductive device 11 and / or an energy-consuming device 12.

[0038] The unidirectional conductive device 11 is a structural component used in the static eliminator 10 to introduce static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 into the ground terminal GND. The unidirectional conductive device 11 has unidirectional conductivity, that is, the unidirectional conductive device 11 can only allow the current corresponding to the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 to flow into the ground terminal GND in one direction. The specific manifestation of the unidirectional conductive device 11 will be described in detail below.

[0039] One end of the unidirectional conductive device 11 is used to connect to the binding pin 2121 of the peripheral wiring 212, and the other end of the unidirectional conductive device 11 is connected to the ground terminal GND. In this way, a path is formed between the functional circuit 211, the peripheral wiring 212, the unidirectional conductive device 11 and the ground terminal GND, so that the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 is directly introduced into the ground terminal GND through the functional circuit 211, the peripheral wiring 212, and the unidirectional conductive device 11 in sequence. The ground terminal GND can be the ground pin of the static eliminator 10 itself, or it can be other grounding networks independent of the static eliminator 10.

[0040] The energy dissipation device 12 is a structural component in the static elimination device 10 for consuming the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 in the form of light and / or heat. The energy dissipation device 12 has an energy consumption characteristic, that is, the energy dissipation device 12 can convert the electrical energy corresponding to the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 into light energy and / or heat energy for consumption. Of course, it is not ruled out that the energy dissipation device 12 can convert the electrical energy corresponding to the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 into kinetic energy for consumption. The specific manifestation of the energy dissipation device 12 will be introduced in detail below.

[0041] One end of the energy consuming device 12 is used to connect to the binding pin 2121 of the peripheral wiring 212, and the other end of the energy consuming device 12 is connected to the ground terminal GND. In this way, a path is formed between the functional circuit 211, the peripheral wiring 212, the energy consuming device 12 and the ground terminal GND, so that the electrical energy corresponding to the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 is converted into light energy and / or heat energy of the energy consuming device 12 and consumed.

[0042] Based on the static elimination device 10 in the embodiment of the present application, by designing the unidirectional conductive device 11, a path is formed between the functional circuit 211, the peripheral wiring 212, the unidirectional conductive device 11 and the ground terminal GND, so that the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 is directly introduced into the ground terminal GND through the functional circuit 211, the peripheral wiring 212 and the unidirectional conductive device 11 in sequence, thereby effectively preventing the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 from damaging the functional circuit 211 in the functional layer 21. By designing the energy-consuming device 12, a path is formed between the functional circuit 211, the peripheral wiring 212, the energy-consuming device 12 and the ground terminal GND, so that the electrical energy corresponding to the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 is converted into light energy and / or heat energy of the energy-consuming device 12 and consumed, thereby effectively preventing the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 from damaging the functional circuit 211 in the functional layer 21.

[0043] When the static electricity elimination device 10 includes a unidirectional conductive device 11 or an energy dissipation device 12, the specific forms of the unidirectional conductive device 11 or the energy dissipation device 12 may be, but are not limited to, the following embodiments.

[0044] like Figure 2 As shown in (a), in the first embodiment, the electrostatic eliminator 10 includes a unidirectional conductive device 11, which is a diode. The anode of the diode is used to connect to the binding pin 2121 of the peripheral wiring 212, and the cathode of the diode is connected to the ground terminal GND.

[0045] It should be noted that the number of diodes can be one or more (more than two). When the number of diodes is multiple, the multiple diodes can be connected between the binding pin 2121 of the peripheral routing 212 and the ground terminal GND in series, parallel or mixed connection.

[0046] By designing the diode, the diode has unidirectional conductivity, and a path is formed among the functional circuit 211, the peripheral wiring 212, the diode and the ground terminal GND, so that the static electricity generated during the bonding or separation of the functional layer 21 with other layers 22 is directly introduced into the ground terminal GND through the functional circuit 211, the peripheral wiring 212 and the diode in sequence, thereby effectively preventing the static electricity generated during the bonding or separation of the functional layer 21 with other layers 22 from damaging the functional circuit 211 in the functional layer 21.

[0047] like Figure 2 As shown in (b), in the second embodiment, the static elimination device 10 includes an energy consuming device 12, which is a resistor, one end of which is used to connect to the binding pin 2121 of the peripheral wiring 212, and the other end of the resistor is connected to the ground terminal GND.

[0048] It should be noted that the number of resistors can be one or more (more than two). When the number of resistors is multiple, the multiple resistors can be connected between the binding pin 2121 of the peripheral routing 212 and the ground terminal GND in series, parallel or mixed connection.

[0049] By designing the resistor, the resistor has energy consumption characteristics, and a path is formed between the functional circuit 211, the peripheral wiring 212, the resistor and the ground terminal GND, so that the electrical energy corresponding to the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 is converted into heat energy of the resistor and consumed, thereby effectively preventing the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 from damaging the functional circuit 211 in the functional layer 21.

[0050] like Figure 2As shown in (c), in the third embodiment, the static elimination device 10 includes an energy-consuming device 12, which is a light-emitting diode. The anode of the light-emitting diode is used to connect to the binding pin 2121 of the peripheral wiring 212, and the cathode of the light-emitting diode is connected to the ground terminal GND.

[0051] It should be noted that the number of light-emitting diodes can be one or more (more than two). When the number of light-emitting diodes is multiple, the multiple light-emitting diodes can be connected between the binding pin 2121 of the peripheral routing 212 and the ground terminal GND in series, parallel or mixed connection.

[0052] By designing the light-emitting diode, the light-emitting diode has energy consumption characteristics, and a path is formed between the functional circuit 211, the peripheral wiring 212, the light-emitting diode and the ground terminal GND, so that the electrical energy corresponding to the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 is converted into light energy of the light-emitting diode and consumed, thereby effectively preventing the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 from damaging the functional circuit 211 in the functional layer 21.

[0053] like Figure 2 As shown in (d), in some other embodiments, the static eliminator 10 includes a unidirectional conductive device 11, which can be a triode, wherein the first connection end of the triode is used to connect to the binding pin 2121 of the peripheral wiring 212, the second connection end of the triode is connected to the ground terminal GND, and the controlled end of the triode is connected to the controller of the static eliminator 10. It should be noted that in the process of the functional layer 21 being attached to or detached from the other layer 22, the controller of the static eliminator 10 controls the controlled end of the triode, so that the first connection end of the triode is connected to the second connection end of the triode, and a path is formed between the functional circuit 211, the peripheral wiring 212, the triode and the ground terminal GND, so that the static electricity generated in the process of the functional layer 21 being attached to or detached from the other layer 22 is directly introduced into the ground terminal GND through the functional circuit 211, the peripheral wiring 212, and the triode in sequence, thereby effectively preventing the static electricity generated in the process of the functional layer 21 being attached to or detached from the other layer 22 from damaging the functional circuit 211 in the functional layer 21. Of course, the unidirectional conducting device 11 may also be a field effect transistor, which is similar to a triode and will not be described in detail here.

[0054] It should be noted that when the static eliminator 10 includes a unidirectional conductive device 11, the unidirectional conductive device 11 may also be a combination of at least two of a diode, a triode, and a field effect transistor. When the static eliminator 10 includes an energy dissipation device 12, the energy dissipation device 12 may also be a combination of a resistor and a light emitting diode. This will not be described in detail here.

[0055] When the static electricity elimination device 10 includes a unidirectional conductive device 11 and an energy dissipation device 12 , the specific combination of the unidirectional conductive device 11 and the energy dissipation device 12 may be, but is not limited to, the following embodiments.

[0056] like Figure 2 As shown in (e), in the first embodiment, the unidirectional conductive device 11 is a diode, the energy consumption device 12 is a resistor, the anode of the diode is used to connect to the binding pin 2121 of the peripheral wiring 212, the cathode of the diode is connected to one end of the resistor, and the other end of the resistor is connected to the ground terminal GND.

[0057] It should be noted that a diode and a resistor are connected in series to form a series stack. The number of series stacks can be one or more (more than two). When the number of series stacks is multiple, the multiple series stacks can be connected between the binding pin 2121 of the peripheral routing 212 and the ground terminal GND in series, parallel or mixed connection.

[0058] By designing the diode and the resistor, the diode has a unidirectional conduction characteristic, and the resistor has an energy consumption characteristic, a path is formed among the functional circuit 211, the peripheral wiring 212, the diode, the resistor and the ground terminal GND, so that a part of the static electricity generated during the bonding or separation of the functional layer 21 with other layers 22 is directly introduced into the ground terminal GND via the functional circuit 211, the peripheral wiring 212, the diode and the resistor in sequence, and the electric energy corresponding to another part of the static electricity generated during the bonding or separation of the functional layer 21 with other layers 22 is converted into heat energy of the resistor and consumed, thereby effectively preventing the static electricity generated during the bonding or separation of the functional layer 21 with other layers 22 from damaging the functional circuit 211 in the functional layer 21.

[0059] like Figure 2 As shown in (f), in the second embodiment, the unidirectional conducting device 11 is a diode, the energy consuming device 12 is a light emitting diode, the anode of the diode is used to connect to the binding pin 2121 of the peripheral wiring 212, the cathode of the diode is connected to the anode of the light emitting diode, and the cathode of the light emitting diode is connected to the ground terminal GND.

[0060] It should be noted that a diode and a light-emitting diode are connected in series to form a series stack. The number of series stacks can be one or more (more than two). When the number of series stacks is multiple, the multiple series stacks can be connected between the binding pin 2121 of the peripheral routing 212 and the ground terminal GND in series, parallel or mixed connection.

[0061] By designing diodes and light-emitting diodes, the diodes have unidirectional conduction characteristics, and the light-emitting diodes have energy consumption characteristics. A path is formed among the functional circuit 211, the peripheral wiring 212, the diodes, the light-emitting diodes and the ground terminal GND, so that a part of the static electricity generated during the bonding or separation of the functional layer 21 with other layers 22 is directly introduced into the ground terminal GND via the functional circuit 211, the peripheral wiring 212, the diodes and the light-emitting diodes in sequence, and the electric energy corresponding to another part of the static electricity generated during the bonding or separation of the functional layer 21 with other layers 22 is converted into light energy of the light-emitting diodes and consumed, thereby effectively preventing the static electricity generated during the bonding or separation of the functional layer 21 with other layers 22 from damaging the functional circuit 211 in the functional layer 21.

[0062] Of course, in other embodiments, when the static eliminator 10 includes the unidirectional conductive device 11 and the energy consuming device 12, it can also be a combination of at least one of a triode and a field effect transistor and at least one of a resistor and a light emitting diode.

[0063] Considering that the unidirectional conductive device 11 and / or the energy consuming device 12 are used to connect with the binding pins 2121 of the peripheral wiring 212, and the number of the binding pins 2121 of the peripheral wiring 212 is multiple (more than two), in order to facilitate the electrical connection between the unidirectional conductive device 11 and / or the energy consuming device 12 and the binding pins 2121 of the peripheral wiring 212, it is designed that the static elimination device 10 also includes a conductive member 13. The specific configuration of the conductive member 13 can be but is not limited to the following embodiments.

[0064] like Figure 1 and Figure 3 As shown, in the first embodiment, the static eliminator 10 includes a unidirectional conductive device 11, and the unidirectional conductive device 11 is used to connect with the binding pin 2121 of the peripheral wiring 212 via the conductive member 13. In this way, the conductive member 13 serves as an intermediate connection structure between the unidirectional conductive device 11 and the binding pin 2121 of the peripheral wiring 212, which can enhance the connection stability between the unidirectional conductive device 11 and the binding pin 2121 of the peripheral wiring 212.

[0065] like Figure 1 and Figure 3 As shown, in the second embodiment, the static eliminator 10 includes an energy consuming device 12, and the energy consuming device 12 is used to connect with the binding pin 2121 of the peripheral wiring 212 via the conductive member 13. In this way, the conductive member 13 serves as an intermediate connection structure between the energy consuming device 12 and the binding pin 2121 of the peripheral wiring 212, which can enhance the connection stability between the energy consuming device 12 and the binding pin 2121 of the peripheral wiring 212.

[0066] like Figure 1 and Figure 3As shown, in the third embodiment, the static eliminator 10 includes a unidirectional conductive device 11 and an energy consuming device 12, and one of the unidirectional conductive device 11 and the energy consuming device 12 is used to connect with the binding pin 2121 of the peripheral wiring 212 via a conductive member 13. When the unidirectional conductive device 11 is closer to the binding pin 2121 of the peripheral wiring 212 than the energy consuming device 12 in the connection sequence, the unidirectional conductive device 11 is used to connect with the binding pin 2121 of the peripheral wiring 212 via the conductive member 13 to enhance the connection stability between the unidirectional conductive device 11 and the binding pin 2121 of the peripheral wiring 212; when the energy consuming device 12 is closer to the binding pin 2121 of the peripheral wiring 212 than the unidirectional conductive device 11 in the connection sequence, the energy consuming device 12 is used to connect with the binding pin 2121 of the peripheral wiring 212 via the conductive member 13 to enhance the connection stability between the energy consuming device 12 and the binding pin 2121 of the peripheral wiring 212.

[0067] It should be noted that the number of conductive parts 13 can be one or more (more than two); when the number of conductive parts 13 is one, all binding pins 2121 of the peripheral routing 212 are connected to the unidirectional conductive device 11 or the energy consuming device 12 through the same conductive part 13; when the number of conductive parts 13 is more than one, each binding pin 2121 of the peripheral routing 212 can be connected to the unidirectional conductive device 11 or the energy consuming device 12 through one conductive part 13, or multiple binding pins 2121 of the peripheral routing 212 can be connected to the unidirectional conductive device 11 or the energy consuming device 12 through the same conductive part 13, and at least one remaining binding pin 2121 of the peripheral routing 212 is connected to the unidirectional conductive device 11 or the energy consuming device 12 through another conductive part 13.

[0068] Specifically, the conductive member 13 is a metal film. The conductive member 13 is made of one of copper, tin, iron, foil or silver. In this design, copper, tin, iron, foil or silver all have good conductivity, and can achieve good electrical connection between the unidirectional conductive device 11 / energy consuming device 12 and the peripheral pins of the peripheral wiring 212, so that a path is formed between the functional circuit 211, the peripheral wiring 212, the conductive member 13, the unidirectional conductive device 11 / energy consuming device 12 and the ground terminal GND, so that the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 is introduced into the ground terminal GND in sequence through the functional circuit 211, the peripheral wiring 212, the conductive member 13, and the unidirectional conductive device 11, or the electrical energy corresponding to the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 is converted into light energy or heat energy and consumed, thereby effectively preventing the static electricity generated during the bonding or separation of the functional layer 21 and other layers 22 from damaging the functional circuit 211 in the functional layer 21.

[0069] Considering that the conductive member 13 is used to realize the electrical connection between the unidirectional conductive device 11 / energy consuming device 12 and the binding pin 2121 of the peripheral wiring 212, there can be many specific connection methods between the conductive member 13 and the binding pin 2121 of the peripheral wiring 212. For example, the electrostatic eliminator 10 may also include a snap-in structure, and the conductive member 13 is used to connect with the binding pin 2121 of the peripheral wiring 212 via the snap-in structure; the specific form of the snap-in structure is not limited here, and the designer can replace it according to some structures in the relevant technology for realizing the snap-in connection between two components. For another example, the electrostatic eliminator 10 may also include a plug-in structure, and the conductive member 13 is used to connect with the binding pin 2121 of the peripheral wiring 212 via the plug-in structure; the specific form of the plug-in structure is not limited here, and the designer can also replace it according to some structures in the relevant technology for realizing the plug-in connection between two components. In an embodiment of the present application, the static elimination device 10 also includes an adhesive (not shown in the figure), and the conductive member 13 is used to connect to the binding pin 2121 of the peripheral wiring 212 via the adhesive. Among them, the specific form of the adhesive can be but is not limited to double-sided tape or glue. In this design, by designing an adhesive, the conductive member 13 is used to connect to the binding pin 2121 of the peripheral wiring 212 through the adhesive. On the one hand, the connection stability between the conductive member 13 and the binding pin 2121 of the peripheral wiring 212 can be achieved, and on the other hand, the assembly difficulty between the conductive member 13 and the binding pin 2121 of the peripheral wiring 212 can be reduced.

[0070] Please refer to Figure 4-Figure 6 As shown, the second aspect of the present application proposes a layer structure 20 with an electrostatic elimination function, the layer structure 20 includes a functional layer 21, other layers 22 and the above-mentioned electrostatic elimination device 10. The functional layer 21 has a functional circuit 211 and a peripheral wiring 212 connected to the functional circuit 211. The other layer 22 is attached to at least one side of the functional layer 21. The electrostatic elimination device 10 is detachably electrically connected to the binding pin 2121 of the peripheral wiring 212.

[0071] It should be noted that when the other layer 22 is used as a protective layer 222, the other layer 22 is detachably attached to at least one side of the functional layer 21; when the other layer 22 is used as a combined layer, the other layer 22 is non-detachably attached to at least one side of the functional layer 21.

[0072] It can be understood that during the transportation of the layer structure 20, there is a possibility of mutual friction between different layer structures 20, which makes it easy for static electricity to be generated between the layer structures 20 and the layer structures 20. Therefore, during the transportation of the layer structure 20, there is no need to remove the static electricity elimination device 10 from the binding pin 2121 of the peripheral wiring 212. The static electricity elimination device 10 is connected to the binding pin 2121 of the peripheral wiring 212, and the static electricity generated by the friction between the layer structures 20 and the layer structures 20 can be introduced into the ground terminal GND through the unidirectional conductive device 11, and / or consumed by the energy-consuming device 12, thereby effectively avoiding the static electricity generated by the friction between the layer structures 20 and the layer structures 20 during transportation from damaging the functional circuit 211 in the functional layer 21. After the layer structure 20 is transported and in the process of being assembled with other structures, there is still the possibility of mutual friction between the layer structure 20 and other structures, which makes it easy to generate static electricity between the layer structure 20 and other structures. Therefore, the static electricity elimination device 10 does not need to be removed from the binding pin 2121 of the peripheral wiring 212 during the assembly of the layer structure 20 with other structures. The static electricity elimination device 10 is connected to the binding pin 2121 of the peripheral wiring 212, and the static electricity generated by the friction between the layer structure 20 and other structures can be introduced into the ground terminal GND through the unidirectional conductive device 11, and / or consumed by the energy-consuming device 12, thereby effectively avoiding the static electricity generated by the friction during the assembly of the layer structure 20 with other structures to damage the functional circuit 211 in the functional layer 21. After the assembly of the layer structure 20 with other structures is completed, the static electricity elimination device 10 can be removed from the binding pin 2121 of the peripheral wiring 212.

[0073] Based on the layer structure 20 with static electricity elimination function in the embodiment of the present application, the above-mentioned static electricity elimination device 10 can introduce the static electricity generated by the friction between the layer structure 20 and the layer structure 20 into the ground terminal GND or consume it during the transportation of the layer structure 20, or can introduce the static electricity generated by the friction between the layer structure 20 and other structures during the assembly process of the layer structure 20 and other structures into the ground terminal GND or consume it, thereby effectively avoiding static electricity from causing damage to the functional circuit 211 in the functional layer 21.

[0074] When the other layer 22 is bonded to at least one side of the functional layer 21 as a combined layer, the other layer 22 is a substrate layer 221, and the substrate layer 221 is non-detachably bonded to at least one side of the functional layer 21. The substrate layer 221 is made of optically clear adhesive (OCA) or glass.

[0075] When the substrate layer 221 is made of optical adhesive:

[0076] Specifically, Figure 7As shown, the layer structure 20 includes a protective glass 23, an optical adhesive layer 2212 and a functional layer 21 which are stacked in sequence. The functional layer 21 includes a PET substrate 2113, a sensing circuit 2111 and a driving circuit 2112, and the sensing circuit 2111 and the driving circuit 2112 are arranged on both sides of the PET substrate 2113 along the thickness direction of the PET substrate 2113.

[0077] like Figure 8 As shown, the layer structure 20 includes a protective glass 23, an optical adhesive layer 2212 and a functional layer 21 which are stacked in sequence. The functional layer 21 includes a PET substrate 2113, an insulating layer 2114, a sensing circuit 2111 and a driving circuit 2112. The sensing circuit 2111 and the driving circuit 2112 are both arranged on one side of the PET substrate 2113 close to the optical adhesive layer 2212, and the insulating layer 2114 is arranged between the sensing circuit 2111 layer and the driving circuit 2112 layer. The material for preparing the insulating layer 2114 can be, but is not limited to, resins such as acrylic acid and polyurethane.

[0078] like Fig. 9 As shown, the layer structure 20 includes a protective glass 23, a first optical adhesive layer 2213, a first functional layer 21, a second optical adhesive layer 2214, and a second functional layer 21, which are stacked in sequence. The first functional layer 21 includes a first PET substrate 2113 and a sensing circuit 2111 layer, and the sensing circuit 2111 layer is arranged on one side of the first PET substrate 2113 along the thickness direction of the first PET substrate 2113. The second functional layer 21 includes a second PET substrate 2113 and a driving circuit 2112 layer, and the driving circuit 2112 layer is arranged on one side of the second PET substrate 2113 along the thickness direction of the second PET substrate 2113.

[0079] More specifically, Figure 4-Figure 6 As shown, when the preparation material of the substrate layer 221 is optical adhesive, a hollow area 2211 is provided at the position of the substrate layer 221 corresponding to the binding pin 2121 of the peripheral wiring 212, and at least a part of the static elimination device 10 (specifically, the above-mentioned conductive member 13) is located in the hollow area 2211. In this design, by providing the hollow area 2211 in the area of ​​the substrate layer 221 corresponding to the binding pin 2121 of the peripheral wiring 212, the conductive member 13 of the static elimination device 10 can be avoided during the bonding process between the substrate layer 221 and the functional layer 21, so that the thickness difference between the conductive member 13 of the static elimination device 10 and the hollow area 2211 is adapted.

[0080] When the substrate layer 221 is made of glass:

[0081] Specifically, Fig.10As shown, the layer structure 20 includes stacked glass and a functional layer 21. The functional layer 21 includes an insulating layer 2114, a sensing circuit 2111 and a driving circuit 2112. The sensing circuit 2111 and the driving circuit 2112 are arranged on the same side of the glass, and the sensing circuit 2111 is arranged closer to the glass than the driving circuit 2112. The insulating layer 2114 is arranged between the sensing circuit 2111 layer and the driving circuit 2112 layer. The material for preparing the insulating layer 2114 can be, but is not limited to, resins such as acrylic acid and polyurethane.

[0082] When the other layer 22 is attached to at least one side of the functional layer 21 as the protective layer 222, the other layer 22 is the protective layer 222, and the protective layer 222 is detachably attached to at least one side of the functional layer 21. The protective layer 222 is made of one of polyethylene terephthalate (PET), polyethylene (PE) and cast polypropylene (CPP).

[0083] When the protective layer 222 is made of polyethylene terephthalate (PET):

[0084] Specifically, Fig.11 As shown, the layer structure 20 includes a first protective layer 2221, a functional layer 21, and a second protective layer 2222 stacked in sequence. The functional layer 21 includes a PET substrate 2113, a sensing circuit 2111, and a driving circuit 2112, and the sensing circuit 2111 and the driving circuit 2112 are arranged on both sides of the PET substrate 2113 along the thickness direction of the PET substrate 2113.

[0085] like Fig.12 As shown, the layer structure 20 includes a first protective layer 2221, a functional layer 21, and a second protective layer 2222 which are stacked in sequence. The functional layer 21 includes a PET substrate 2113, an insulating layer 2114, a sensing circuit 2111, and a driving circuit 2112. The sensing circuit 2111 and the driving circuit 2112 are both arranged on the same side of the PET substrate 2113, and the insulating layer 2114 is arranged between the sensing circuit 2111 layer and the driving circuit 2112 layer. The insulating layer 2114 can be made of, but is not limited to, resins such as acrylic acid and polyurethane.

[0086] When the protective layer 222 is a plastic protective layer, the material of the plastic protective layer is polyethylene (PE):

[0087] Specifically, Fig.11As shown, the layer structure 20 includes a first protective layer 2221, a functional layer 21, and a second protective layer 2222 stacked in sequence. The functional layer 21 includes a PET substrate 2113, a sensing circuit 2111, and a driving circuit 2112, and the sensing circuit 2111 and the driving circuit 2112 are arranged on both sides of the PET substrate 2113 along the thickness direction of the PET substrate 2113.

[0088] like Fig.12 As shown, the layer structure 20 includes a first protective layer 2221, a functional layer 21, and a second protective layer 2222 which are stacked in sequence. The functional layer 21 includes a PET substrate 2113, an insulating layer 2114, a sensing circuit 2111, and a driving circuit 2112. The sensing circuit 2111 and the driving circuit 2112 are both arranged on the same side of the PET substrate 2113, and the insulating layer 2114 is arranged between the sensing circuit 2111 layer and the driving circuit 2112 layer. The insulating layer 2114 can be made of, but is not limited to, resins such as acrylic acid and polyurethane.

[0089] When the protective layer 222 is made of cast polypropylene (CPP):

[0090] Specifically, Fig.11 As shown, the layer structure 20 includes a first protective layer 2221, a functional layer 21, and a second protective layer 2222 stacked in sequence. The functional layer 21 includes a PET substrate 2113, a sensing circuit 2111, and a driving circuit 2112, and the sensing circuit 2111 and the driving circuit 2112 are arranged on both sides of the PET substrate 2113 along the thickness direction of the PET substrate 2113.

[0091] like Fig.12 As shown, the layer structure 20 includes a first protective layer 2221, a functional layer 21, and a second protective layer 2222 which are stacked in sequence. The functional layer 21 includes a PET substrate 2113, an insulating layer 2114, a sensing circuit 2111, and a driving circuit 2112. The sensing circuit 2111 and the driving circuit 2112 are both arranged on the same side of the PET substrate 2113, and the insulating layer 2114 is arranged between the sensing circuit 2111 layer and the driving circuit 2112 layer. The insulating layer 2114 can be made of, but is not limited to, resins such as acrylic acid and polyurethane.

[0092] Please refer to Figure 13-14As shown, the third aspect of the present application proposes a film laminating machine 30 with a static elimination function, the film laminating machine 30 includes a film laminating table and a static elimination device 10. The film laminating table carries a layer to be laminated, the layer to be laminated includes a functional layer 21, and the functional layer 21 has a functional circuit 211 and a peripheral wiring 212 connected to the functional circuit 211. The static electricity elimination device 10 includes a unidirectional conductive device 11, one end of which is used to connect to the binding pin 2121 of the peripheral wiring 212, and the other end of the unidirectional conductive device 11 is connected to the ground terminal GND. The unidirectional conductive device 11 is configured to introduce the static electricity generated during the bonding process of the functional layer 21 and other layers 22 into the ground terminal GND when the functional circuit 211 is directly bonded to the bearing surface of the film-laminating table; and / or, the static electricity elimination device 10 includes an energy-consuming device 12, one end of the energy-consuming device 12 is used to connect to the binding pin 2121 of the peripheral wiring 212, and the other end of the energy-consuming device 12 is connected to the ground terminal GND. The energy-consuming device 12 is configured to consume the static electricity generated during the bonding process of the functional layer 21 and other layers 22 by emitting light and / or generating heat when the functional circuit 211 is directly bonded to the bearing surface of the film-laminating table.

[0093] For example, the semi-finished layer structure 20 includes a protective layer 222, a first optical adhesive layer 2213 and a functional layer 21 that have been laminated and stacked in sequence; the film laminating table includes an upper film laminating table 32 and a lower film laminating table 31, and the film laminating machine 30 can, but is not limited to, complete the laminating operation of the semi-finished layer structure 20 and the second optical adhesive layer 2214 through the following processing:

[0094] Step 1: placing the second optical adhesive layer 2214 on the lower film-laminating stage 31 ; placing the semi-finished layer structure 20 on the upper film-laminating stage 32 , and laminating the functional layer 21 to the upper film-laminating stage 32 .

[0095] Step 2: tear off the protective layer 222 on the surface of the semi-finished layer structure 20 .

[0096] Step 3: Start vacuum suction and lamination. Move the lower lamination stage 31 to the same position as the upper lamination stage 32 , and use the roller of the lower lamination stage 31 to laminat the second optical adhesive layer 2214 and the semi-finished structure with the protective layer 222 removed.

[0097] It should be noted that in the above step 1, the second optical adhesive layer 2214 can be formed into a hollow area 2211 by a laser cutting process, and the lower film-mounting station 31 is provided with an electrostatic eliminator 10 at the position corresponding to the hollow area 2211 of the second optical adhesive layer 2214. In the above step 2, the upper film-mounting station 32 can also be provided with an electrostatic eliminator 10, and the static electricity generated during the separation process of the protective layer 222, the first optical adhesive layer 2213 and the functional layer 21 can be introduced into the ground terminal GND or consumed by the electrostatic eliminator 10 provided on the upper film-mounting station 32. In the above step 3, the electrostatic eliminator 10 provided on the lower film-mounting station 31 can introduce the static electricity generated during the bonding process of the functional layer 21 and the second optical adhesive layer 2214 into the ground terminal GND or consume it.

[0098] Based on the film laminating machine 30 with static electricity elimination function in the embodiment of the present application, it has a static electricity elimination device 10, which can introduce the static electricity generated in the process of laminating the functional layer 21 with other layers 22 into the ground terminal GND or consume it, thereby effectively preventing the static electricity generated in the process of laminating the functional layer 21 with other layers 22 from damaging the functional circuit 211 in the functional layer 21.

[0099] It is worth mentioning that Fig.14 As shown, Fig.14 It is a structural schematic diagram of a film laminating machine 30' in the related art. Compared with the film laminating machine 30' in the related art which uses a static electricity eliminating ion blower 33' to eliminate the static electricity generated during the laminating process of the functional layer 21 and other layers 22, the static electricity eliminating device 10 in the embodiment of the present application will not cause a large air turbulence to form above the functional layer 21 and other layers 22 like the static electricity eliminating ion blower 33', thereby reducing the adverse effects of foreign matter adhering to the functional layer 21 and other layers 22 caused by air turbulence.

[0100] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0101] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A static elimination device, characterized in that: Applied to a layer structure, the layer structure includes a functional layer and other layers, the functional layer has a functional circuit and a peripheral wiring connected to the functional circuit; the static elimination device includes: A unidirectional conductive device, one end of which is used to be connected to the binding pin of the peripheral routing, and the other end is connected to the ground terminal, and the unidirectional conductive device is configured to introduce static electricity generated during the separation or bonding of the functional layer and the other layers into the ground terminal; and / or An energy dissipation device, one end of which is used to be connected to the binding pin of the peripheral routing, and the other end is connected to the ground terminal. The energy dissipation device is configured to consume the static electricity generated during the separation or bonding process of the functional layer and the other layers by emitting light and / or generating heat.

2. The static eliminator according to claim 1, characterized in that: The static elimination device comprises a unidirectional conductive device, wherein the unidirectional conductive device is a diode, wherein the anode of the diode is used to be connected to the binding pin of the peripheral wiring, and the cathode of the diode is connected to the ground terminal; or The static elimination device includes an energy consuming device, which is a resistor, one end of which is used to be connected to the binding pin of the peripheral wiring, and the other end of which is connected to the ground terminal; or The static electricity elimination device includes an energy-consuming device, which is a light-emitting diode. The anode of the light-emitting diode is used to be connected to the binding pin of the peripheral wiring, and the cathode of the light-emitting diode is connected to the ground terminal.

3. The static eliminator according to claim 1, characterized in that: The static elimination device comprises a unidirectional conductive device and an energy dissipation device, wherein the unidirectional conductive device is a diode and the energy dissipation device is a resistor; the anode of the diode is used to be connected to the binding pin of the peripheral wiring, the cathode of the diode is connected to one end of the resistor, and the other end of the resistor is connected to the ground terminal; or The electrostatic elimination device includes a unidirectional conductive device and an energy-consuming device, wherein the unidirectional conductive device is a diode, and the energy-consuming device is a light-emitting diode; the anode of the diode is used to be connected to the binding pin of the peripheral wiring, the cathode of the diode is connected to the anode of the light-emitting diode, and the cathode of the light-emitting diode is connected to the ground terminal.

4. The static eliminator according to any one of claims 1 to 3, characterized in that: The static eliminator includes the one-way conductive device, and the static eliminator further includes a conductive member, and the one-way conductive device is used to connect with the binding pin of the peripheral wiring via the conductive member; or The static eliminator includes the energy dissipation device, and the static eliminator further includes a conductive member, and the energy dissipation device is connected to the binding pin of the peripheral wiring via the conductive member; or The static eliminator comprises a unidirectional conductive device and the energy dissipation device, and the static eliminator further comprises a conductive member, and one of the unidirectional conductive device and the energy dissipation device is used to connect to the binding pin of the peripheral wiring via the conductive member.

5. The static eliminator according to claim 4, characterized in that: The conductive element is made of a material selected from the group consisting of copper, tin, iron, foil and silver.

6. The static eliminator according to claim 4, characterized in that: Also includes: The conductive member is connected to the binding pins of the peripheral wiring via the adhesive member.

7. A layer structure having a static elimination function, characterized in that: include: A functional layer, comprising functional circuits and peripheral wiring connected to the functional circuits; Other layers, attached to at least one side of the functional layer; The static elimination device according to any one of claims 1 to 6 is detachably electrically connected to the binding pins of the peripheral wiring.

8. The layer structure having a static elimination function according to claim 7, characterized in that: The other layer is a substrate layer, the substrate layer is attached to at least one side of the functional layer, and the substrate layer is made of optical glue or glass.

9. The layer structure having a static elimination function according to claim 8, characterized in that: The substrate layer is made of optical adhesive, and a hollow area is provided on the substrate layer at a position corresponding to the binding pins of the peripheral wiring, and at least a part of the static elimination device is located in the hollow area.

10. The layer structure having a static elimination function according to claim 7, characterized in that: The other layer is a plastic protective layer, and the plastic protective layer is detachably attached to at least one side of the functional layer.

11. A film laminating machine with static elimination function, characterized in that: include: A film laminating table, carrying a layer to be laminated, wherein the layer to be laminated includes a functional layer, and the functional layer has a functional circuit and a peripheral wiring connected to the functional circuit; An electrostatic eliminator, wherein the electrostatic eliminator comprises a unidirectional conductive device, one end of which is used to be connected to the binding pin of the peripheral wiring, the other end of which is connected to the ground end, and the unidirectional conductive device is configured to introduce static electricity generated during the bonding process of the functional layer with other layers into the ground end when the functional circuit is directly bonded to the bearing surface of the film-laminating table; and / or the electrostatic eliminator comprises an energy-consuming device, one end of which is used to be connected to the binding pin of the peripheral wiring, the other end of which is connected to the ground end, and the energy-consuming device is configured to consume static electricity generated during the bonding process of the functional layer with other layers by emitting light and / or generating heat when the functional circuit is directly bonded to the bearing surface of the film-laminating table.

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