Circuit board, functional part module and electronic device

Abstract

The invention provides a circuit board, a functional part module and an electronic device. The electronic device comprises a circuit board, a function piece, a supporting assembly, a first cooling fin and a locking piece. The circuit board comprises a substrate and a stud; the functional part is arranged on the substrate; the supporting assembly is used for bearing the functional part and comprises a bottom plate and a plurality of elastic elements, and the elastic elements are arranged between the bottom plate and the base plate; the first radiating fin is arranged between the bottom plate and the functional part; the locking piece correspondingly penetrates through the first cooling fin and the bottom plate to be locked into the stud.

Description

Technical Field

[0001] The present invention relates to a circuit board, a functional component module and an electronic device, and in particular to a circuit board, a functional component module and an electronic device with universality. Background Art

[0002] In the prior art, a base plate is usually used in a heat dissipation device of a solid state disk (SSD) module to enhance the heat conduction effect, and a thermal conductive adhesive is usually used to increase the physical contact area between the base plate and the SSD module to achieve a good heat conduction effect.

[0003] However, not only is the overall size limited by the product (such as SSD module) selection, but when the SSD module product is designed to be double-sided (front + back) punched, the thickness of the thermal conductive glue and / or the base plate must be adjusted to achieve good contact and thus achieve the expected heat conduction effect. At the same time, when the design of the SSD module product is changed to a single-sided (front) punched product, the thickness of the thermal conductive glue or the base plate must be adjusted.

[0004] Therefore, the above-mentioned prior art has the following problems:

[0005] 1. The heat dissipation base plate design is easily restricted by the design of the solid-state drive module product. Different solid-state drive modules must use base plates and thermal conductive adhesives of different thicknesses.

[0006] 2. When replacing the SSD module, you must confirm whether the thickness of the base plate and thermal conductive glue used has a good contact area. If the size does not match and the contact area is not good, you need to replace the base plate and thermal conductive glue with a suitable one, which not only increases the risk of disassembly and replacement of parts, but also easily causes the risk of damage caused by disassembly and installation screws during the disassembly process. Summary of the invention

[0007] One of the objects of the present invention is to provide a circuit board that can adapt to different thicknesses and weights of functional modules arranged thereon.

[0008] Another object of the present invention is to provide a functional component module that can adjust the distance between the module and the circuit board.

[0009] Another object of the present invention is to provide an electronic device with universality.

[0010] A circuit board of the present invention comprises a substrate, a supporting assembly and a locking piece. A stud is arranged on the substrate; the supporting assembly is suitable for carrying a functional part, wherein the supporting assembly comprises a bottom plate and a plurality of elastic elements, and the elastic elements are arranged between the bottom plate and the substrate; the locking piece passes through the bottom plate and locks into the stud, wherein the elastic element provides a supporting force to the bottom plate.

[0011] In one embodiment, the elastic element is a gasket or foam.

[0012] In one embodiment, each elastic element includes a nut and a spring, wherein the nut is fixed to the bottom plate, and one end of the spring is fixed to the nut, and the spring is located between the bottom plate and the base plate.

[0013] A functional component module of the present invention comprises a functional component, a supporting assembly and a heat sink. The supporting assembly carries the functional component and comprises a bottom plate and a plurality of elastic elements, wherein the elastic elements are arranged on a side of the bottom plate relatively far from the functional component; and the heat sink is arranged between the bottom plate and the functional component.

[0014] In one embodiment, the elastic element is a gasket or foam.

[0015] In one embodiment, each elastic element includes a nut and a spring, wherein the nut is fixed to the bottom plate, and one end of the spring is fixed to the nut, and the spring is located on a side of the bottom plate relatively far away from the functional component.

[0016] In one embodiment, a plurality of electronic components are disposed on a single side of the functional component or a plurality of electronic components are disposed on two opposite sides of the functional component.

[0017] An electronic device of the present invention includes a circuit board, a functional component, a support assembly, a first heat sink and a locking component. The circuit board includes a substrate and a stud; the functional component is arranged on the substrate; the support assembly carries the functional component and includes a bottom plate and a plurality of elastic elements, wherein the elastic elements are arranged between the bottom plate and the substrate; the first heat sink is arranged between the bottom plate and the functional component; and the locking component passes through the first heat sink and the bottom plate and locks into the stud.

[0018] In one embodiment, the elastic element is a gasket or foam.

[0019] In one embodiment, each elastic element includes a nut and a spring, wherein the nut is fixed to the bottom plate, and one end of the spring is fixed to the nut, and the spring is located between the bottom plate and the base plate.

[0020] In one embodiment, a plurality of electronic components are disposed on a single side of the functional component or a plurality of electronic components are disposed on two opposite sides of the functional component.

[0021] In one embodiment, the electronic device further includes a heat dissipation element disposed on a side of the functional component relatively away from the bottom plate.

[0022] In one embodiment, the electronic device further includes a second heat sink disposed between the functional component and the heat dissipation element.

[0023] Based on the above, by setting up the supporting assembly, the circuit board can adapt to the functional parts with different thicknesses and weights set thereon, and the distance between the functional parts and the circuit board can be adjusted steplessly, thereby making the electronic device convenient for functional parts of different thicknesses and weights. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1A An exploded schematic diagram of an electronic device.

[0025] Figure 1B for Figure 1A A partial enlarged view of .

[0026] Figure 2A for Figure 1B Exploded view of the support assembly in Figure 1.

[0027] Figure 2B for Figure 2A Schematic diagram from another perspective.

[0028] Figure 2C for Figure 2B Schematic diagram of the combination of support components.

[0029] Figure 3 for Figure 1A Schematic diagram of the assembly of the electronic device.

[0030] Figure 4A and Figure 4B Schematic diagrams of different implementations of elastic elements.

[0031] The reference numerals are as follows:

[0032] 100: Electronic devices

[0033] 110: Circuit board

[0034] 112:Substrate

[0035] 114: Stud

[0036] 120: Functional parts

[0037] 130:Support component

[0038] 132: Bottom plate

[0039] 132a: Top surface

[0040] 132b: Bottom

[0041] 134, 134', 134": elastic element

[0042] 135: Nut

[0043] 136: Spring

[0044] 140: First heat sink

[0045] 150: Locking firmware

[0046] 160: Cooling element

[0047] 170: Second heat sink DETAILED DESCRIPTION

[0048] Figure 1A is an exploded schematic diagram of an electronic device, and Figure 1B for Figure 1A A partial enlarged view of . Figure 2A for Figure 1B Exploded diagram of the support assembly in Figure 2B for Figure 2A Another perspective diagram of Figure 2C for Figure 2B Schematic diagram of the combination of support components.

[0049] Please refer to Figure 1A and Figure 1B The electronic device 100 of this embodiment can be a computer or a server. The electronic device 100 at least includes a circuit board 110, a functional component 120, a support assembly 130, a first heat sink 140 and a locking member 150. The circuit board 110 includes a substrate 112 and a stud 114, wherein the stud 114 is disposed on the substrate 112. The functional component 120 and the support assembly 130 are both disposed on the substrate 112, wherein the support assembly 130 includes a bottom plate 132 and a plurality of elastic elements 134, the bottom plate 132 is used to carry the functional component 120, and the elastic elements 134 are disposed between the bottom plate 132 and the substrate 112, wherein the elastic elements 134 are used to support the bottom plate 132 and the functional component 120 carried on the bottom plate 132. The first heat sink 140 is disposed between the bottom plate 132 and the functional component 120, and is used to increase the contact area between the bottom plate 132 and the functional component 120, thereby enhancing the heat conduction effect. The locking members 150 pass through the first heat sink 140 and the bottom plate 132 and are locked into the studs 114 disposed on the base plate 112 to preliminarily fix the bottom plate 132 relative to the base plate 112 .

[0050] Please also refer to Figure 2A , Figure 2B and Figure 2CIn this embodiment, each elastic element 134 includes a nut 135 and a spring 136, wherein the nut 135 is riveted into the bottom plate 132 from the bottom plate 132 toward the top surface 132a of the functional component 120, and the end of the nut 135 protrudes from the bottom surface 132b of the bottom plate 132, and one end of the spring 136 is fixed to the end of the nut 135 protruding from the bottom surface 132b of the bottom plate 132, so that the spring 136 is located between the bottom plate 132 and the base plate 112, and the other end of the spring 136 is suitable for abutting the base plate 112, such as Figure 1B Show.

[0051] Please continue to refer to Figure 1A and Figure 1B . As mentioned above, the functional component 120 of this embodiment is a solid state drive module, but it is not limited thereto. Specifically, the functional component 120 can be one of two specifications of solid state drive modules, wherein one specification of the solid state drive module is a solid state drive module with multiple electronic components on one side (i.e., single-sided component); and the other specification of the solid state drive module is a solid state drive module with multiple electronic components on two opposite sides (i.e., double-sided component). The user selects a solid state drive module of appropriate specifications to install on the support assembly 130 according to actual needs.

[0052] In addition, the electronic device 100 further includes a heat dissipation element 160 disposed on a side of the functional component 120 relatively away from the bottom plate 132. The heat dissipation element 160 may be a combination of a heat dissipation plate and a heat dissipation fin. In other embodiments, the heat dissipation element 160 may also be a heat dissipation plate, a heat dissipation fin or a fan, or a combination of any two or more of the heat dissipation plate, the heat dissipation fin and the fan. The actual heat dissipation element 160 is selected and disposed according to the requirements.

[0053] In addition, the electronic device 100 further includes a second heat sink 170 disposed between the functional component 120 and the heat dissipation element 160 . The use of the second heat sink 170 can enhance the heat dissipation effect between the functional component 120 and the heat dissipation element 160 .

[0054] The first heat sink 140 and the second heat sink 170 can be thermally conductive pads or heat dissipation plates, which can be selected according to the actual needs.

[0055] Figure 3 for Figure 1A Please also refer to the assembly diagram of the electronic device. Figure 1A , Figure 1B and Figure 3 After the functional component 120 , the supporting component 130 , the first heat sink 140 , etc. are assembled on the circuit board 110 to form the electronic device 100 , the supporting component 130 can function to achieve the following advantages.

[0056] Specifically, the first heat sink 140 disposed between the base plate 132 and the functional component 120 can increase the contact area between the base plate 132 and the functional component 120, and the second heat sink 170 disposed between the functional component 120 and the heat dissipation element 160 can increase the contact area between the functional component 120 and the heat dissipation element 160, thereby enhancing the overall heat conduction effect of the electronic device 100 and effectively improving the heat dissipation efficiency.

[0057] In addition, after the heat dissipation element 160 is assembled on the functional component 120 , the weight of the heat dissipation element 160 and the functional component 120 exert a downward force on the support assembly 130 .

[0058] In the prior art, when the heat dissipation element is assembled on the top of the functional part, the weight of the heat dissipation element will cause the circuit board to bend, which will cause the electronic components on the circuit board to crack and cannot continue to operate effectively.

[0059] In contrast, in this embodiment, although the function part 120 and the heat dissipation element 160 assembled above the function part 120 exert downward force, the stud 114 provides an upward supporting force for the bottom plate 132, and the spring 136 in the elastic element 134 also provides an upward elastic restoring force to push the bottom plate 132, thereby offsetting the downward force exerted on the upper part of the circuit board 110 by the weight of the function part 120 and the heat dissipation element 160. In this way, the circuit board 110 can be effectively prevented from bending and tin cracking can be avoided.

[0060] Furthermore, in this embodiment, the functional component 120 is designed to be assembled on the bottom plate 132 in a quick-release manner, so the functional component 120 can be replaced simply and quickly according to needs, which can reduce the risk of damage caused by removing screws during the disassembly process compared to the prior art.

[0061] In addition, the arrangement of the elastic element 134 allows the distance between the bottom plate 132 and the circuit board 110 to be adjusted according to the thickness and weight of the functional component 120 carried thereon, so the electronic device 100 of this embodiment can be used for functional components 120 of different specifications.

[0062] Specifically, the functional component 120 is selected from a solid-state hard disk module with a single-sided component specification and a solid-state hard disk module with a double-sided component specification, wherein the thickness of the solid-state hard disk module with a double-sided component specification is thicker than that of the solid-state hard disk module with a single-sided component specification; and the thickness difference between the solid-state hard disk module with a double-sided component specification and the solid-state hard disk module with a single-sided component specification can be eliminated by the compression degree of the spring 136.

[0063] Specifically, compared to the double-sided SSD module assembled on the bottom plate 132, the spring 136 is in a relatively compressed state, while the single-sided SSD module is assembled on the bottom plate 132, the spring 136 is in a relatively relaxed state, wherein the deformation distance of the spring 136 from the relaxed state to the compressed state is about 1 mm. Incidentally, when the bottom plate 132 is fixed to the stud 114 using the locking element 150, the bottom plate 132 will retain a movable distance relative to the base plate 112 along the assembly direction, so as to facilitate the deformation and pushing of the spring 136.

[0064] Figure 4A and Figure 4B Schematic diagrams of different implementations of elastic elements. Figure 4A As shown, the elastic element 134' may also be a gasket; Figure 4B As shown, the elastic element 134" can also be made of foam. The spring 136 has the advantage of better elastic recovery force compared to the gasket and foam, and the gasket and foam have the advantage of more flexible setting position compared to the spring 136, and the user can choose the setting position of the gasket and foam.

[0065] Specifically, when the elastic element 134 is a combination of a nut 135 and a spring 136, the support assembly 130 needs to be assembled on the circuit board 110 in advance to facilitate the subsequent assembly of the functional component 120 on the bottom plate 132 of the support assembly 130. Alternatively, the support assembly 130 can also be assembled with the functional component 120 in advance to form a functional component 120 module to facilitate the subsequent assembly of the functional component 120 module on the circuit board 110.

[0066] When the elastic element 134 is selected as a gasket and foam, the gasket and foam do not need to be attached to the functional part 120 or the circuit board 110 in advance, and the end user can determine the setting position of the gasket and foam according to usage habits or needs. Therefore, compared with the case of using a combination of a nut 135 and a spring 136 as the elastic element 134, it is also more convenient to use.

[0067] In summary, in the circuit board, functional component module and electronic device 100 of the present invention, through the setting of the support component, the support component not only provides a good supporting effect, but also enables the circuit board to adapt to the functional components with different thicknesses and weights arranged thereon, so as to steplessly adjust the distance between the functional components and the circuit board, thereby making the electronic device have the convenience of being applicable to functional components with different thicknesses and weights.

[0068] In addition, the use of the heat sink can increase the contact area between the base plate and the functional component and / or the functional component and the heat dissipation element, effectively improving the overall heat conduction efficiency of the electronic device.

[0069] In addition, the functional parts and the base plate are assembled or disassembled using a quick-release method, which can simplify and quickly replace the functional parts and reduce the risk of damage caused by disassembly screws during the disassembly process.

Claims

1. A circuit board, characterized in that: include: a base plate on which a stud is disposed; A supporting assembly, suitable for carrying a functional component, comprising a bottom plate and a plurality of elastic elements, wherein the plurality of elastic elements are disposed between the bottom plate and the base plate; and a locking piece, correspondingly passing through the base plate and locking into the stud, The elastic element provides supporting force to the bottom plate.

2. The circuit board according to claim 1, characterized in that The plurality of elastic elements are gaskets or foams.

3. The circuit board according to claim 1, characterized in that: Each of the elastic elements includes a nut and a spring, wherein the nut is fixed to the bottom plate, and one end of the spring is fixed to the nut, and the spring is located between the bottom plate and the base plate.

4. A functional component module, characterized in that: include: A functional part; A supporting assembly, carrying the functional part, comprising a bottom plate and a plurality of elastic elements, wherein the plurality of elastic elements are arranged on a side of the bottom plate relatively away from the functional part; as well as A heat sink is arranged between the bottom plate and the functional component.

5. The functional component module according to claim 4, characterized in that: The plurality of elastic elements are gaskets or foams.

6. The functional component module according to claim 4, characterized in that: Each of the elastic elements includes a nut and a spring, wherein the nut is fixed to the bottom plate, and one end of the spring is fixed to the nut, and the spring is located on a side of the bottom plate relatively far away from the functional component.

7. The functional component module according to claim 4, characterized in that: A plurality of electronic components are arranged on a single side of the functional part or a plurality of electronic components are arranged on two opposite sides of the functional part respectively.

8. An electronic device, characterized in that: include: A circuit board includes a substrate and a stud; A functional component is disposed on the substrate; A supporting assembly, carrying the functional part, comprising a bottom plate and a plurality of elastic elements, wherein the plurality of elastic elements are arranged between the bottom plate and the base plate; a first heat sink disposed between the base plate and the functional component; and A locking piece passes through the first heat sink and the bottom plate and is locked into the stud.

9. The electronic device as claimed in claim 8, characterized in that: The plurality of elastic elements are gaskets or foams.

10. The electronic device as claimed in claim 8, characterized in that Each of the elastic elements includes a nut and a spring, wherein the nut is fixed to the bottom plate, and one end of the spring is fixed to the nut, and the spring is located between the bottom plate and the base plate.

11. The electronic device according to claim 8, wherein: A plurality of electronic components are arranged on a single side of the functional part or a plurality of electronic components are arranged on two opposite sides of the functional part respectively.

12. The electronic device as claimed in claim 8, characterized in that: The invention also comprises a heat dissipation element which is arranged on a side of the functional part which is relatively far away from the bottom plate.

13. The electronic device according to claim 12, wherein: The invention also comprises a second heat sink, which is arranged between the functional part and the heat dissipation element.

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