Novel circuit board structure for wireless charging and manufacturing method thereof

Abstract

The invention is applicable to the technical field of low-resistance circuit board manufacturing, and provides a novel circuit board structure for wireless charging and a manufacturing method thereof, and the method comprises the steps: manufacturing a main circuit on a substrate; one or more layers of sub-circuits are stacked on the main circuit; carrying out insulation treatment; therefore, the thickness of the circuit is improved, the processing difficulty is reduced, the yield of the circuit board is greatly improved, the resistance value of the circuit and the distance between the circuits are reduced, and larger current can pass through, so that the charging efficiency is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of low-resistance circuit board manufacturing, and in particular relates to a novel circuit board structure for wireless charging and a manufacturing method thereof. Background Art

[0002] Most of the existing circuit boards are made by purchasing ordinary flexible circuit boards and insulating materials. After the copper plating process, the total copper thickness (original copper + copper plating) is generally required to be more than 60um, and then the conventional etching process is used to realize the processing of the circuit. The circuit spacing is generally designed to be 0.1mm; however, the thicker the copper thickness, the greater the etching difficulty, the low processing yield of the manufacturer, and there are problems such as large resistance, large spacing, and high cost. The existing processing methods can no longer meet people's usage needs. Summary of the invention

[0003] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a novel circuit board structure for wireless charging and a method for manufacturing the same, aiming to solve the problems of large spacing between circuits, large circuit resistance, low product yield, high cost, etc. caused by the inability of the prior art to provide an effective method for manufacturing a novel circuit board structure for wireless charging.

[0004] In one aspect, the present invention provides a novel method for manufacturing a circuit board structure for wireless charging, the method comprising the following steps:

[0005] Make the main circuit on the substrate board;

[0006] Stacking one or more layers of sub-circuits on the main circuit;

[0007] Insulation treatment.

[0008] Furthermore, making a main circuit on the substrate board includes:

[0009] Performing metallization treatment on the surface of the substrate plate to form a metal layer;

[0010] Laminating a first dry film on the surface of the metal layer;

[0011] Expose and develop the first dry film to remove unexposed portions and then expose the metal layer;

[0012] The main circuit is formed by copper plating on the surface of the exposed metal layer.

[0013] Furthermore, stacking a sub-circuit on the main line includes:

[0014] The second dry film is attached to the first dry film and the main circuit.

[0015] Furthermore, the method further comprises:

[0016] The second dry film is exposed and developed to remove unexposed portions and then expose the main circuit.

[0017] Further preferably, the method further comprises:

[0018] Expose and develop the second dry film to remove unexposed portions and then expose portions of the main circuit;

[0019] The exposing part of the main line includes: exposing a part of the main line which is narrower than the main line.

[0020] Furthermore, the method further comprises:

[0021] The sub-circuit is formed by copper plating on the surface of the exposed main circuit, or copper plating on the surface of the exposed part of the main circuit is formed by copper plating.

[0022] Furthermore, the method further comprises:

[0023] The second dry film, the first dry film and the metal layer directly under the first dry film are removed.

[0024] Preferably, the metallization treatment of the surface of the substrate plate comprises: ion implantation and coating of the metal layer;

[0025] The copper plating includes: electroplating copper or chemical copper deposition.

[0026] Preferably, before copper plating is performed on the exposed surface of the main circuit to form the sub-circuit, or copper plating is performed on the exposed surface of the main circuit to form the sub-circuit, the method includes:

[0027] The substrate plate is bent and formed.

[0028] On the other hand, the present invention provides a novel circuit board structure for wireless charging, wherein the structure is manufactured by the above-mentioned novel circuit board structure manufacturing method for wireless charging.

[0029] The beneficial effects of the present invention are: making a main circuit on a substrate board; stacking one or more layers of sub-circuits on the main circuit; and performing insulation treatment; thereby increasing the thickness of the circuit while reducing the difficulty of processing, greatly improving the yield rate of the circuit board, reducing the resistance value of the circuit and the circuit spacing, and being able to pass a larger current, thereby improving the charging efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a flow chart of a method for manufacturing a novel circuit board structure for wireless charging provided in the first embodiment of the present invention;

[0031] Figure 2is a cross-sectional view of a circuit board in a first state during the manufacturing process of a novel circuit board structure manufacturing method for wireless charging provided by Embodiment 1 of the present invention;

[0032] Figure 3 is a cross-sectional view of a circuit board in a second state during the manufacturing process of the novel circuit board structure manufacturing method for wireless charging provided by the first embodiment of the present invention;

[0033] Figure 4 is a cross-sectional view of a circuit board in a third state during the manufacturing process of the novel circuit board structure manufacturing method for wireless charging provided by the first embodiment of the present invention;

[0034] Figure 5 is a cross-sectional view of a circuit board in a fourth state during the manufacturing process of the novel circuit board structure manufacturing method for wireless charging provided by the first embodiment of the present invention;

[0035] Figure 6 is a cross-sectional view of a circuit board in a fifth state during the manufacturing process of the novel circuit board structure manufacturing method for wireless charging provided by the first embodiment of the present invention;

[0036] Figure 7 is a cross-sectional view of a circuit board in a sixth state during the manufacturing process of a novel circuit board structure manufacturing method for wireless charging provided by Embodiment 1 of the present invention;

[0037] Figure 8 is a cross-sectional view of a circuit board in a seventh state during the manufacturing process of a novel circuit board structure manufacturing method for wireless charging provided by Embodiment 1 of the present invention;

[0038] Fig. 9 It is a cross-sectional view of a circuit board in the eighth state during the manufacturing process of the novel circuit board structure manufacturing method for wireless charging provided by the first embodiment of the present invention. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0040] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments:

[0041] Embodiment 1:

[0042] Figure 1 The implementation process of the method for manufacturing a novel circuit board structure for wireless charging provided by the first embodiment of the present invention is shown. For the convenience of explanation, only the part related to the embodiment of the present invention is shown. Figures 2 to 9, as detailed below:

[0043] Step S101, making a main circuit on a substrate board;

[0044] In an embodiment of the present invention, making the main circuit 200 on the substrate plate 100 includes: performing metallization treatment on the surface of the substrate plate 100 to form a metal layer 110, such as Figure 2 As shown; the first dry film 120 is attached to the surface of the metal layer 110, such as Figure 3 After the first dry film 120 is exposed and developed to remove the unexposed portion 121, the metal layer 110 is exposed, as shown Figure 4 The surface of the exposed metal layer 110 is copper plated to form the main circuit 200, as shown in FIG. Figure 5 As shown; wherein the substrate plate is made of insulating material.

[0045] The metallization treatment of the surface of the substrate plate 100 includes: ion implantation to form a metal coating 110 .

[0046] Furthermore, the substrate plate 100 is made of polyimide.

[0047] Step S102, stacking one or more sub-circuits on the main circuit;

[0048] In an embodiment of the present invention, stacking the sub-circuit 210 on the main circuit 200 includes: laminating the second dry film 130 on the first dry film 120 and the main circuit 200, such as Figure 6 shown.

[0049] Furthermore, the method further includes: exposing and developing the second dry film 130 to remove the unexposed portion 131 to expose the main circuit 200; making the sub-circuit 210 made by copper plating later have the same width as the main circuit 200 to meet different usage requirements.

[0050] Preferably, the method further comprises: exposing and developing the second dry film 130 to remove the unexposed portion 131 and then exposing a portion of the main circuit 200, such as Figure 7 so that the width of the sub-circuit 210 made of copper plating is narrower than the width of the main circuit 200; the exposed portion of the main circuit 200 includes: exposing a portion of the main circuit 200 that is narrower than the main circuit 200.

[0051] The method further includes: copper plating on the surface of the exposed main circuit 200 to form the sub-circuit 210, or copper plating on the surface of the exposed part of the main circuit 200 to form the sub-circuit 210, such as Figure 8 As shown; circuit stacking (sub-circuit 210 is stacked on the main circuit 200), which reduces the resistance of the circuit and improves the current passing capacity.

[0052] Furthermore, the method further includes: removing the second dry film 130 and the first dry film 120 as well as the metal layer 110 directly below the first dry film 120, such as Fig. 9 As shown; to expose the stacked circuits (main circuit 200 and sub-circuit 210), an etching process can be used.

[0053] Preferably, copper plating is performed on the surface of the exposed main circuit 200 to form the sub-circuit 210, or before copper plating is performed on the surface of the exposed part of the main circuit 200 to form the sub-circuit 210, the process includes: bending the substrate board 100 to achieve the shape that the flexible circuit board needs to be bent to avoid breaking the sub-circuit 210; wherein the substrate board 100 can be a soft board or a hard board.

[0054] Further preferably, copper plating includes: electroplating copper or chemical copper deposition. Preferably, electroplating copper is used, which has higher precision and makes the spacing between circuits narrower.

[0055] Step S103: insulation treatment.

[0056] In an embodiment of the present invention, the insulation treatment includes: applying insulation paint or laminating insulation film on the second dry film 130 and the sub-circuit 210 .

[0057] In an embodiment of the present invention, stacking multiple layers of sub-circuits 210 on the main circuit 200 includes: stacking sub-circuits 210 again on the sub-circuit 210 according to the manufacturing method of step S102 .

[0058] In an embodiment of the present invention, a main circuit 200 is made on a substrate board 100; one or more layers of sub-circuits 210 are stacked on the main circuit 200; and insulation treatment is performed; thereby increasing the thickness of the circuit while reducing the difficulty of processing, greatly improving the yield rate of the circuit board, reducing the resistance value of the circuit and the circuit spacing, and allowing a larger current to pass, thereby improving the charging efficiency.

[0059] Embodiment 2:

[0060] A novel circuit board structure for wireless charging provided in the second embodiment of the present invention is manufactured by the method provided in the first embodiment, except that, before step S101: a positioning hole is opened in the waste area of ​​the substrate plate 100 for subsequent processing, preferably by laser drilling.

[0061] What has been described herein in this specification and the accompanying drawings includes examples of circuit board structures and methods for making the same that can provide novel wireless charging. Of course, it is not possible to describe every conceivable combination of elements and / or methods for the purpose of describing the various features of the present disclosure, but it is recognized that many other combinations and permutations of the disclosed features are possible. Therefore, it is obvious that various modifications can be made to the present disclosure without departing from the scope or spirit of the present disclosure. In addition, or in an alternative, other embodiments of the present disclosure may be apparent from consideration of the present specification and the accompanying drawings and from the practice of the present disclosure as presented herein. It is intended that the examples set forth in this specification and the accompanying drawings be considered to be illustrative and not restrictive in all respects. Although specific terms are employed herein, they are used in a general and descriptive sense and are not used for limiting purposes.

Claims

1. A novel method for manufacturing a circuit board structure for wireless charging, characterized in that: The method comprises the following steps: Make the main circuit on the substrate board; Stacking one or more layers of sub-circuits on the main circuit; Insulation treatment.

2. The method according to claim 1, characterized in that The main circuit is made on the substrate board including: Performing metallization treatment on the surface of the substrate plate to form a metal layer; Laminating a first dry film on the surface of the metal layer; Expose and develop the first dry film to remove unexposed portions and then expose the metal layer; The main circuit is formed by copper plating on the surface of the exposed metal layer.

3. The method according to claim 2, characterized in that The sub-circuit is superimposed on the main line and comprises: The second dry film is attached to the first dry film and the main circuit.

4. The method according to claim 3, characterized in that The method further comprises: The second dry film is exposed and developed to remove unexposed portions and then expose the main circuit.

5. The method according to claim 3, characterized in that The method further comprises: Expose and develop the second dry film to remove unexposed portions and then expose portions of the main circuit; The exposing part of the main line includes: exposing a part of the main line which is narrower than the main line.

6. The method according to claim 4 or 5, characterized in that The method further comprises: The sub-circuit is formed by copper plating on the surface of the exposed main circuit, or copper plating on the surface of the exposed part of the main circuit is formed by copper plating.

7. The method according to claim 5, characterized in that The method further comprises: The second dry film, the first dry film and the metal layer directly under the first dry film are removed.

8. The method according to claim 2 or 6, characterized in that: The metallization treatment of the surface of the substrate plate comprises: ion implantation and plating of the metal layer; The copper plating includes: electroplating copper or chemical copper deposition.

9. The method according to claim 6, characterized in that Before copper plating the exposed surface of the main circuit to form the sub-circuit, or copper plating the exposed surface of the main circuit to form the sub-circuit, the method includes: The substrate plate is bent and formed.

10. A novel circuit board structure for wireless charging, characterized in that: Made by the method according to any one of claims 1 to 9.

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