Automatic circuit board processing equipment and use method thereof

Abstract

The invention relates to the field of circuit board processing, in particular to automatic circuit board processing equipment and a using method thereof, and the automatic circuit board processing equipment comprises a copper deposition tank, a cover plate and the like; a storage cavity is formed in the copper deposition tank; a cover plate is slidably connected to the front side of the copper deposition tank. According to the invention, the copper deposition tank is divided into a plurality of chambers through the partition plates, so that each circuit board is located at the same solution depth for copper deposition, the situation that the copper deposition effects of the circuit board are different due to different solution depths is avoided, and the copper deposition effect of the circuit board is improved; solution generated through the round holes scours the lower side of the circuit board, so that water flow flows from the lower side to the front side and the rear side of the circuit board, the phenomenon of uneven copper deposition on the surface of the circuit board caused by bubble accumulation is prevented, and the copper deposition effect of equipment on the circuit board is improved. The middle part of the circuit board is supported by the supporting pipe, so that the middle part of the circuit board is prevented from sinking downwards, metal copper is uniformly attached to the surface of the circuit board, and the copper deposition effect of equipment on the circuit board is improved.

Description

Technical Field

[0001] The present invention relates to the field of circuit board processing, and in particular to a circuit board automated processing device and a use method thereof. Background Art

[0002] During the production process of circuit boards, the copper deposition process attaches a layer of metallic copper to the bare circuit board to make it conductive. When copper is deposited on the circuit board, most copper deposition pools use complexes formed by copper salts and other substances, which are not as stable as pure copper salts. In addition, considering that the existing copper deposition pools are overall high and large in volume, the solute distribution states in different areas of the pool are not always the same. For example, due to evaporation, the concentration of metallic copper ions is higher in the part close to the surface of the solution, while the concentration is lower in the depths, resulting in different copper deposition effects for the same batch of circuit boards, which in turn affects the quality of the finished circuit boards. In the process, not only the bare board needs to be attached with metal copper on the surface, but also the holes opened in the bare board need to be attached with metal copper. The existing method immerses the circuit board in the solution in a vertical manner. This method will cause the bubbles to get stuck in the holes when floating up, resulting in poor adhesion of the metal copper in the holes. Although the horizontal placement method reduces the problem of bubbles getting stuck in the holes, when the circuit board is placed horizontally, the surface tension between the liquid and the surface of the circuit board will cause the bubbles to adhere to the side of the circuit board. At the same time, since the side of the circuit board is not smooth, it is easier for the bubbles to be intercepted at the side of the circuit board, and then there is also the problem of bubbles affecting the uniform copper deposition of the circuit board.

[0003] At the same time, when the existing horizontally placed circuit board is immersed in the solution, the contact area with the circuit board is reduced by supporting the circuit board at the four corners to avoid excessive influence of the supporting structure on the metal copper adhesion of the circuit board. When the circuit board is large as a whole, this supporting method will cause the middle part of the circuit board to be unsupported and concave downward. The concave circuit board will cause uneven adhesion of the metal copper during copper deposition, and will also cause poor adhesion of the metal copper in the concave part, resulting in poor quality of the finished circuit board. Summary of the invention

[0004] In order to overcome the disadvantages that the effects of copper deposition on existing circuit boards are different due to the different depths of the solution, which affects the quality of the finished product, and the circuit boards will be disturbed by bubbles whether they are placed vertically or horizontally, resulting in uneven adhesion of the metal copper, and at the same time, the four-corner support method is used to reduce the impact on the copper deposition of the circuit boards, which will cause the middle of the circuit boards to sag downward, the present invention provides a circuit board automatic processing equipment and a method of using the same.

[0005] The technical solution is: a circuit board automated processing equipment, including a copper sinking tank, a cover plate and a water pipe; a storage cavity is arranged in the copper sinking tank; a cover plate is slidably connected to the front side of the copper sinking tank; a water pipe is connected to the left and right sides of the copper sinking tank; each water pipe is connected to an external copper sinking solution conveying device; it also includes a partition plate, a push rod, an electric slider, a defoaming component and a separation system; a plurality of slide grooves are opened on the copper sinking tank; an electric slider is slidably connected to each slide groove; each electric slider is provided with a partition plate that makes each circuit board at the same solution depth; a plurality of push rods are slidably connected in the copper sinking tank to prevent bubbles from adhering to the surface of the circuit board; each push rod is provided with a connecting groove, and the storage cavity is connected to the connecting groove; each push rod is provided with a supporting groove for supporting the circuit board, and the height of each supporting groove is greater than the thickness of the circuit board; a defoaming component for improving the bubble elimination effect is connected in the copper sinking tank; a separation system for preventing incomplete copper sinking of the circuit board is connected in the copper sinking tank.

[0006] Furthermore, the defoaming component includes a fixed plate, an electric push rod, a connecting rod and a supporting tube; a drainage trough is provided at the lower rear side of the copper sinking tank; a first connecting cavity is provided at the rear side of the copper sinking tank, and the first connecting cavity is connected to the drainage trough; a plurality of first impurity discharge ports are provided in the copper sinking tank, and each of the first impurity discharge ports is connected to the first connecting cavity; a plurality of second impurity discharge ports are provided at the rear side of the cover plate; a drainage pipe is provided at the front side of the cover plate; a second connecting cavity is provided in the cover plate; the drainage pipe is connected to each second impurity discharge port through the second connecting cavity; a waste liquid recovery device is provided at the rear side of the copper sinking tank, the drainage trough is connected to the waste liquid recovery device, and the drainage pipe is connected to the waste liquid recovery device through a hose; a fixed plate is fixedly connected to the upper side of the copper sinking tank ... Several electric push rods are fixed on the plate; the output end of each electric push rod passes through the fixed plate; a connecting rod is fixed to the output end of each electric push rod; a sealing portion is provided on the lower side of each connecting rod; several support tubes for improving the bubble elimination effect are commonly connected to several push rods, and two support tubes at the same horizontal height are symmetrically arranged front and back; each support tube is located above the adjacent partition plate; each support tube is connected to the adjacent connecting groove; several circular holes are opened on each support tube, and a diaphragm is provided on each circular hole; several extraction pipes are connected to the right side of the copper sinking pool; each extraction pipe is located on the upper side of a partition plate, and each extraction pipe is connected to an external extraction device.

[0007] Furthermore, the upper side surface of each support tube is flush with the lower side surface of the adjacent support groove.

[0008] Furthermore, each first row of miscellaneous openings is located at the rear side of the copper sinking tank.

[0009] Furthermore, the circular holes on all the support tubes located in the front are located on the side facing the second row of miscellaneous openings; the circular holes on all the support tubes located in the front are located on the side facing the first row of miscellaneous openings; and each circular hole is configured to be in a constricted shape.

[0010] Furthermore, each partition plate can be removed from the copper sinking tank.

[0011] Furthermore, the outer sides of the copper sink and the cover plate are coated with an anti-rust coating.

[0012] Furthermore, the separation system includes a pressing plate and a movable block; each connecting rod is fixedly connected to a plurality of pressing plates to prevent the support tube from interfering with the attachment of deposited copper ions; each top rod is slidably connected to a plurality of movable blocks through a spring; each top rod is provided with a plurality of rectangular grooves; every two movable blocks opposite to each other on the left and right are fixedly connected to the support tube; each support tube slides up and down in an adjacent rectangular groove; a deformable waterproof membrane is provided between each rectangular groove and the top rod.

[0013] Furthermore, each support tube is coated with a rubber diaphragm.

[0014] A method for using circuit board automated processing equipment comprises the following steps: S1: Loading, after pushing the cover upwards and opening it, the worker places each circuit board on the corresponding support groove and then closes the cover; S2: Liquid inlet: The copper deposition solution is pumped into the water pipe through an external copper deposition solution delivery device, so that the solution enters the connecting tank, and then enters each support pipe, and then the sealing part is used to pump the solution into the upper side of each partition plate for copper deposition; S3: Support adjustment, by pushing the support tube back and forth and alternately separating from the lower side of the circuit board through the pressing sheet, so that the contact surface between the support tube and the circuit board leaks out, achieving the effect of uniform copper deposition on the lower side of the circuit board; S4: Draining and unloading. After the copper deposition is completed, first use the liquid extraction equipment to make the liquid extraction tube produce suction. After the copper deposition solution on each partition plate is extracted, lift the cover plate upward and open it, and finally take out the circuit board after the copper deposition is completed.

[0015] Compared with the prior art, the present invention has the following advantages: the present invention realizes that the copper deposition pool is divided into multiple chambers by a partition plate, so that each circuit board is placed in the same solution depth for copper deposition, thereby avoiding different copper deposition effects on the circuit boards due to different solution depths, and improving the copper deposition effect on the circuit boards; The solution generated through the circular hole is flushed on the lower side of the circuit board, so that the water flows from the lower side of the circuit board to the front and back sides respectively, preventing the phenomenon of uneven copper deposition on the surface of the circuit board caused by bubble accumulation, and improving the copper deposition effect of the equipment on the circuit board; The support tube provides support for the middle of the circuit board to prevent the middle of the circuit board from sinking downward, ensuring that the metal copper is evenly attached to the surface of the circuit board, and improving the copper deposition effect of the equipment on the circuit board; The support tube is alternately pushed apart from the lower side of the circuit board by pressing sheets to avoid the support tube covering most of the lower side of the circuit board, thereby ensuring a more comprehensive copper deposition effect of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the circuit board automated processing equipment and the use method thereof of the present invention; Figure 2 is a cross-sectional view of a cover plate of the present invention; Figure 3 It is a schematic diagram of the three-dimensional structure of the copper sinking pool, the top rod and the support tube combination of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the connecting rod and the supporting tube combination of the present invention; Figure 5 is a cross-sectional view of a support tube of the present invention; Figure 6 It is a front view of the partition plate, the top rod and the connecting rod of the present invention; Figure 7 It is a schematic diagram of the combined three-dimensional structure of the top rod and the connecting rod of the present invention; Figure 8 It is a schematic diagram of the three-dimensional structure of the copper sinking pool, the ejector rod and the electric slider of the present invention; Fig. 9 It is a schematic diagram of the three-dimensional structure of the copper sink pool and the partition plate combination of the present invention; Fig.10 It is a schematic diagram of the three-dimensional structure of the combination of the pressing piece and the movable block of the present invention; Fig.11 It is a schematic diagram of the combined three-dimensional structure of the push rod, support tube and movable block of the present invention.

[0017] Figure numbers: 1-copper sink, 1001-storage cavity, 1002-drainage trough, 1003-first connecting cavity, 1004-slide, 1005-first miscellaneous outlet, 1006-liquid extraction pipe, 2-cover plate, 2001-drainage pipe, 2002-second miscellaneous outlet, 2003-second connecting cavity, 3-water pipe, 4-circuit board, 5-partition plate, 6-top rod, 6001-connecting groove, 6002-support groove, 6003-rectangular groove, 101-fixed plate, 102-electric push rod, 103-connecting rod, 10301-sealing part, 104-electric slider, 105-support tube, 10501-round hole, 201-pressing sheet, 202-movable block. DETAILED DESCRIPTION

[0018] The preferred technical solutions of the present invention are described in detail below with reference to the accompanying drawings. Example 1

[0019] A circuit board automated processing equipment, such as Figure 1-Figure 9As shown, it includes a copper sinking pool 1, a cover plate 2 and a water pipe 3; a storage cavity 1001 is provided in the copper sinking pool 1; the cover plate 2 is slidably connected to the front side of the copper sinking pool 1; a water pipe 3 is connected to both sides of the copper sinking pool 1; each water pipe 3 is connected to an external copper sinking solution conveying device; It also includes a partition plate 5, a push rod 6, an electric slider 104, a defoaming component and a separation system; four slide grooves 1004 are opened on the copper sinking pool 1; each slide groove 1004 is slidably connected to an electric slider 104; each electric slider 104 is provided with a partition plate 5; four push rods 6 are slidably connected in the copper sinking pool 1; each push rod 6 is provided with a connecting groove 6001, and the storage cavity 1001 is connected to the connecting groove 6001; each push rod 6 is provided with a supporting groove 6002, and the height of each supporting groove 6002 is greater than the thickness of the circuit board 4; a defoaming component is connected in the copper sinking pool 1; a separation system is connected in the copper sinking pool 1.

[0020] The defoaming assembly includes a fixing plate 101, an electric push rod 102, a connecting rod 103 and a supporting tube 105; a drainage groove 1002 is provided at the lower part of the rear side of the copper sinking pool 1; a first connecting cavity 1003 is provided at the rear side of the copper sinking pool 1, and the first connecting cavity 1003 is connected to the drainage groove 1002; a plurality of first impurity discharge ports 1005 are provided in the copper sinking pool 1, and each first impurity discharge port 1005 is connected to the first connecting cavity 1003; the rear side of the cover plate 2 A plurality of second impurity discharge ports 2002 are provided; a liquid discharge pipe 2001 is provided on the front side of the cover plate 2; a second connecting cavity 2003 is provided in the cover plate 2; the liquid discharge pipe 2001 is connected to each second impurity discharge port 2002 through the second connecting cavity 2003; a waste liquid recovery device is provided on the rear side of the copper precipitation tank 1, the liquid discharge tank 1002 is connected to the waste liquid recovery device, and the liquid discharge pipe 2001 is connected to the waste liquid recovery device through a hose; a liquid discharge pipe 2001 is fixedly connected to the upper side of the copper precipitation tank 1 A fixed plate 101; four electric push rods 102 are fixedly connected to the fixed plate 101; the output end of each electric push rod 102 passes through the fixed plate 101; the output end of each electric push rod 102 is fixedly connected to a connecting rod 103; a sealing portion 10301 is provided on the lower side of each connecting rod 103; four top rods 6 are commonly connected to a plurality of support tubes 105, and two support tubes 105 at the same horizontal height are symmetrically arranged front to back; each support tube 105 is located above an adjacent partition plate 5; each support tube 105 is connected to an adjacent connecting groove 6001; a plurality of circular holes 10501 are opened on each support tube 105, and a diaphragm is provided on each circular hole 10501; a plurality of liquid extraction tubes 1006 are connected to the right side of the copper precipitation pool 1; each liquid extraction tube 1006 is respectively located on the upper side of a partition plate 5, and each liquid extraction tube 1006 is connected to an external liquid extraction device.

[0021] The upper side of each support tube 105 is flush with the lower side of the adjacent support groove 6002 to prevent the middle of the circuit board 4 from sinking downward without support, and to ensure that the metal copper is evenly attached to the surface of the circuit board 4.

[0022] Each first row of miscellaneous openings 1005 is located at the rear side of the copper sinking pool 1 .

[0023] The circular holes 10501 on all the support tubes 105 located in the front are all located on the side facing the second row of impurity openings 2002; the circular holes 10501 on all the support tubes 105 located in the front are all located on the side facing the first row of impurity openings 1005; each circular hole 10501 is configured to be tapered to increase the flow rate of the solution sprayed from the circular hole 10501 and enhance the bubble elimination effect on the side of the circuit board 4.

[0024] Each partition plate 5 can be removed from the copper precipitation tank 1, so that workers can directly rinse the partition plates 5 and prevent impurities in the solution from adhering to the partition plates 5 and being difficult to clean.

[0025] The outer sides of the copper sink 1 and the cover plate 2 are coated with an anti-rust coating.

[0026] After the existing circuit board 4 is hoisted into the copper sinking tank 1 by an external hoisting device, it reacts in the copper sinking tank 1 for a period of time and then the circuit board 4 is hoisted to realize the copper sinking process of the circuit board 4. In this process, considering that the concentrations of metal ions and other reactants in the solution have a gradient at different depths, the concentration of metal copper ions is higher in the part close to the surface of the solution due to evaporation, while the concentration is lower in the depth, resulting in different copper sinking effects of the circuit board 4. In order to avoid this phenomenon, a plurality of partition plates 5 are arranged in the copper sinking tank 1, so that the partition plates 5 divide the copper sinking tank 1 into a plurality of chambers. At this time, after the worker pushes the cover plate 2 upwards, the circuit board 4 is pushed into each chamber respectively, and the support plate 2 is used to lift the circuit board 4 into the copper sinking tank 1. The support groove 6002 supports the four corners of each circuit board 4. It should be noted that: each circuit board 4 is located above the adjacent partition plate 5. At this time, the worker first pushes the cover plate 2 downward, and then pumps the copper plating solution into the water pipe 3 through the external copper plating solution delivery equipment to fill the storage cavity 1001 with the solution. Since the connecting groove 6001 is connected with the storage cavity 1001, the solution enters the connecting groove 6001. As the solution level rises, the solution enters each support tube 105 in turn. It should be noted that: since each circular hole 10501 is provided with a diaphragm, that is, the solution will not flow out of the circular hole 10501 after entering the support tube 105, when all support tubes 105 are filled After the solution is released, all the electric push rods 102 are started to contract, thereby driving the connecting rod 103 to move upward, so that the blocking part 10301 blocks the lower side of the connecting groove 6001. At this time, the connecting rod 103 continues to move upward, and then uses the blocking part 10301 to compress the solution in the connecting groove 6001, so that the pressure in the connecting groove 6001 and the supporting tube 105 increases, and then the diaphragm at the circular hole 10501 is opened by the pressure, so that the solution is discharged from the circular hole 10501 to the upper side of each partition plate 5, and then the electric push rod 102 is controlled to reciprocate and extend, so that the blocking part 10301 and the connecting groove 6001 cooperate to form a piston, and the solution is pressed into each partition plate 5. On the other hand, when the solution on the upper side of each partition plate 5 covers the circuit board 4, the electric push rod 102 is stopped to keep the solution depth of each circuit board 4 consistent, and then the copper plating process is carried out to avoid different copper plating effects of the circuit boards 4 due to the different solution depths, thereby improving the copper plating effect of the circuit boards 4. When the copper plating of the circuit boards 4 is completed, the external liquid pumping equipment is started to make the liquid pumping tube 1006 generate a suction force, so that the copper plating solution on each partition plate 5 is pumped away through the liquid pumping tube 1006. At this time, the workers push the cover plate 2 upward to open it, and take out the circuit board 4 after the copper plating is completed. At the same time, after opening the cover plate 2, the difficult-to-clean areas inside the copper plating tank 1 can also be cleaned.

[0027] It is also considered that bubbles will be generated during the copper deposition reaction of the circuit board 4, and the circuit board 4 not only needs to adhere metal copper to its surface, but most importantly, the through holes opened in the circuit board 4 need to be adhered with metal copper. When the circuit board 4 is placed horizontally for copper deposition, bubbles can be discharged from any direction, reducing the possibility of bubbles adhering to the holes. However, the problem that comes with it is that bubbles tend to stay at the lower side of the circuit board 4, resulting in uneven adhesion of metal copper to the lower side of the circuit board 4. In order to avoid this phenomenon, the electric push rod 102 is started to contract at intervals, so that the circular hole 10501 discharges the solution at intervals, such as Figure 3 As shown, the solution flushed out from the circular hole 10501 is flushed on the lower side of the circuit board 4, so that the solution flows to the front and rear sides of the circuit board 4 respectively, and the bubbles staying on the lower side and the side of the circuit board 4 are taken away, thereby preventing the uneven copper deposition on the surface of the circuit board 4 caused by the accumulation of bubbles, and improving the copper deposition effect of the equipment on the circuit board 4.

[0028] It is also taken into consideration that, while supporting the four corners of the circuit board 4 by means of the support groove 6002, the contact area with the circuit board 4 is reduced, so that the metal copper covers the circuit board 4 more comprehensively. This support method will cause the middle part of the circuit board 4 to be concave downward without a support point. The concave circuit board 4 will cause uneven adhesion of the metal copper during copper deposition. At the same time, the metal copper at the concave part of the circuit board 4 has poor adhesion ability and is easy to fall off during subsequent use. The support tube 105 is used to provide support for the middle part of the circuit board 4, so that the circuit board 4 can be deposited with copper in a flat state, preventing the middle part of the circuit board 4 from being concave downward, ensuring that the metal copper is evenly adhered to the surface of the circuit board 4, and improving the copper deposition effect of the equipment on the circuit board 4.

[0029] In order to further reduce the influence of bubbles on the circuit board 4, after the circuit board 4 has been soaked for a period of time, the two electric sliders 104 on the front side are started to slide upward on the slide groove 1004, and the two electric push rods 102 on the front side are started to contract, so that the front push rod 6 and the connecting rod 103 move upward synchronously, thereby driving the front side of the circuit board 4 to tilt upward, so that the front half of the circuit board 4 gradually floats out of the liquid surface, so that a small amount of bubbles remaining on the lower side of the circuit board 4 come into contact with the air to burst the bubbles, and then the front electric slider 104 and the electric push rod 102 are reset, and the rear electric slider 104 and the electric push rod 102 are started to tilt the rear side of the circuit board 4 upward, and this reciprocating process is repeated to completely remove the remaining bubbles, and then the circuit board 4 is re-immersed in the solution to continue copper deposition, thereby further reducing the phenomenon of uneven copper deposition caused by bubbles.

[0030] In the above process, it is also considered that impurities are easy to float on the upper side of the circuit board 4 during the copper deposition process, and the impurities will also affect the copper deposition of the circuit board 4. When the front side or the rear side of the circuit board 4 is tilted, the external copper deposition solution delivery device is started to pump the copper deposition solution into the water pipe 3, and the circular hole 10501 is used to discharge the solution into the upper side of each layer of the partition plate 5. At this time, the liquid level of the solution gradually exceeds the first row of impurities 1005 and the second row of impurities 2002, so that the solution flows backward to the first connecting cavity 1003 and the second connecting cavity 2003 through the first row of impurities 1005 and the second row of impurities 2002 respectively. Out, and finally flow to the waste liquid recovery equipment for collection through the drainage trough 1002 and the drainage pipe 2001. Since the circuit board 4 will continuously consume the metal ions in the solution during copper deposition, the solution on the upper side of the partition plate 5 can also be replaced by the above method, so that the metal ions in the solution are always kept sufficient, thereby improving the copper deposition effect of the equipment on the circuit board 4. During the flow of the solution, the impurities remaining on the upper side of the circuit board 4 are unable to stay on the upper side of the circuit board 4 and interfere with the adhesion of the metal copper ions due to the flow of the solution and the inclination of the circuit board 4, thereby improving the copper deposition effect of the equipment on the circuit board 4. Example 2

[0031] On the basis of Example 1, Figure 1 , Fig.10 and Fig.11 As shown, the separation system includes a pressing plate 201 and a movable block 202; a plurality of pressing plates 201 are fixedly connected to each connecting rod 103; a plurality of movable blocks 202 are slidably connected to each push rod 6 through a spring; a plurality of rectangular grooves 6003 are opened on each push rod 6; every two movable blocks 202 opposite to each other on the left and right are fixedly connected to the support tube 105; each support tube 105 slides up and down in the adjacent rectangular grooves 6003; a deformable waterproof membrane is arranged between each rectangular groove 6003 and the push rod 6, and the rectangular groove 6003 is always covered by the waterproof membrane to prevent the solution from flowing back to the connecting groove 6001.

[0032] Each support tube 105 is covered with a rubber membrane to prevent the support tube 105 from damaging the circuit board 4 when it is reset.

[0033] When the support tube 105 is used to support the middle part of the circuit board 4, although the problem of poor copper deposition effect caused by the depression of the circuit board 4 is solved, the overall contact area between the support tube 105 and the circuit board 4 is relatively large, resulting in more parts of the lower side of the circuit board 4 being blocked by the support tube 105, making the large area of ​​metal copper attached to the lower side of the circuit board 4 poor. In order to avoid this phenomenon, the two electric push rods 102 on the front side are started to extend downward, thereby pushing the connecting rod 103 to move downward, thereby driving the pressing sheet 201 to squeeze the movable block 202 to move downward, so that the spring between the movable block 202 and the ejector rod 6 is compressed, and at the same time drives all the ejector rods 6 on the front side Move downward a short distance to separate the front support tube 105 from the lower side of the circuit board 4. After the circuit board 4 has been copper-plated for a period of time, the front electric push rod 102 is controlled to reset, so that the movable block 202 is reset under the action of the spring, and then the support tube 105 is re-fitted with the lower side of the circuit board 4 to support the circuit board 4. Then the rear electric push rod 102 is started to extend downward, and the rear support tube 105 is separated from the lower side of the circuit board 4 in the above manner. In this way, the support tube 105 is alternately separated from the circuit board 4 by reciprocating, so as to avoid the support tube 105 covering most of the lower side of the circuit board 4, thereby ensuring that the copper plating effect of the circuit board 4 is more comprehensive.

[0034] A method for using circuit board automated processing equipment comprises the following steps: S1: Loading, after pushing the cover plate 2 upwards and opening it, the worker places each circuit board 4 on the corresponding support groove 6002, and then closes the cover plate 2; S2: Liquid inlet: The copper deposition solution is pumped into the water pipe 3 through an external copper deposition solution delivery device, so that the solution enters the connecting groove 6001, and then enters each support tube 105, and then the sealing part 10301 is used to pump the solution into the upper side of each partition plate 5 for copper deposition; S3: Support adjustment, by pushing the support tube 105 back and forth and alternately separating from the lower side of the circuit board 4 through the pressing sheet 201, so that the contact surface between the support tube 105 and the circuit board 4 is exposed, so as to achieve the effect of uniform copper deposition on the lower side of the circuit board 4; S4: Draining and unloading. After the copper deposition is completed, the liquid extraction device is used to make the liquid extraction tube 1006 produce suction. After the copper deposition solution on each partition plate 5 is extracted, the cover plate 2 is lifted up and opened, and finally the circuit board 4 after the copper deposition is completed is taken out.

[0035] It should be understood that this embodiment is only used to illustrate the present invention and is not used to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope limited by the appended claims of the application.

Claims

1. A circuit board automated processing device, comprising a copper sinking tank (1), a cover plate (2) and a water pipe (3); a storage chamber (1001) is provided in the copper sinking tank (1); the front side of the copper sinking tank (1) is slidably connected to the cover plate (2); the left and right sides of the copper sinking tank (1) are both connected to a water pipe (3); each water pipe (3) is connected to an external copper sinking solution conveying device; characterized in that: The invention also comprises a partition plate (5), a push rod (6), an electric slider (104), a defoaming component and a separation system; a plurality of slide grooves (1004) are provided on the copper sinking pool (1); each slide groove (1004) is slidably connected to an electric slider (104); each electric slider (104) is provided with a partition plate (5) which enables each circuit board (4) to be at the same solution depth; a plurality of push rods (6) are slidably connected in the copper sinking pool (1) for preventing bubbles from adhering to the surface of the circuit board (4); each push rod (6) is provided with a connecting groove (6001), and the storage cavity (1001) is connected to the connecting groove (6001); each push rod (6) is provided with a supporting groove (6002) for supporting the circuit board (4), and the height of each supporting groove (6002) is greater than the thickness of the circuit board (4); a defoaming component for improving the bubble elimination effect is connected in the copper sinking pool (1); and a separation system for preventing incomplete copper deposition of the circuit board (4) is connected in the copper sinking pool (1).

2. The circuit board automated processing equipment according to claim 1, characterized in that: The defoaming assembly comprises a fixing plate (101), an electric push rod (102), a connecting rod (103) and a supporting tube (105); a drainage groove (1002) is provided at the lower rear side of the copper sinking pool (1); a first connecting cavity (1003) is provided at the rear side of the copper sinking pool (1), and the first connecting cavity (1003) is connected to the drainage groove (1002); a plurality of first impurity discharge ports (1005) are provided in the copper sinking pool (1), and each of the first impurity discharge ports (1005) is connected to the first connecting cavity (1003); the cover plate (2) A plurality of second impurity discharge ports (2002) are provided at the rear side; a liquid discharge pipe (2001) is provided at the front side of the cover plate (2); a second communication cavity (2003) is provided in the cover plate (2); the liquid discharge pipe (2001) and each second impurity discharge port (2002) are connected to each other through the second communication cavity (2003); a waste liquid recovery device is provided at the rear side of the copper precipitation tank (1), the liquid discharge tank (1002) is connected to the waste liquid recovery device, and the liquid discharge pipe (2001) is connected to the waste liquid recovery device through a hose; a fixed The fixed plate (101) is provided with a plurality of electric push rods (102); the output end of each electric push rod (102) passes through the fixed plate (101); the output end of each electric push rod (102) is fixedly connected to a connecting rod (103); a sealing portion (10301) is provided on the lower side of each connecting rod (103); the plurality of push rods (6) are commonly connected to a plurality of support tubes (105) for improving the bubble elimination effect, and the two support tubes (105) at the same horizontal height are symmetrically arranged front and back. The copper precipitation tank (1) is provided with a plurality of liquid extraction pipes (1006). Each liquid extraction pipe (1006) is located on the upper side of a partition plate (5). Each supporting pipe (105) is connected to an adjacent connecting groove (6001). Each supporting pipe (105) is provided with a plurality of circular holes (10501), and each circular hole (10501) is provided with a diaphragm. The copper precipitation tank (1) is connected to a plurality of liquid extraction pipes (1006) on the right side. Each liquid extraction pipe (1006) is located on the upper side of a partition plate (5), and each liquid extraction pipe (1006) is connected to an external liquid extraction device.

3. The circuit board automated processing equipment according to claim 2, characterized in that: The upper side surface of each support tube (105) is flush with the lower side surface of the adjacent support groove (6002).

4. The circuit board automated processing equipment according to claim 2, characterized in that: Each first row of miscellaneous openings (1005) is located at the rear side of the copper sinking pool (1).

5. The circuit board automated processing equipment according to claim 3, characterized in that: The circular holes (10501) on all the support tubes (105) located at the front are all located on the side facing the second row of miscellaneous openings (2002); the circular holes (10501) on all the support tubes (105) located at the front are all located on the side facing the first row of miscellaneous openings (1005); and each circular hole (10501) is configured to be in a constricted shape.

6. The circuit board automated processing equipment according to claim 4, characterized in that: Each partition plate (5) can be removed from the copper sinking pool (1).

7. The circuit board automated processing equipment according to claim 6, characterized in that: The outer sides of the copper sink (1) and the cover plate (2) are both coated with an anti-rust coating.

8. The circuit board automated processing equipment according to claim 5, characterized in that: The separation system comprises a pressing sheet (201) and a movable block (202); each connecting rod (103) is fixedly connected with a plurality of pressing sheets (201) for preventing a support tube (105) from interfering with the attachment of deposited copper ions; each top rod (6) is slidably connected with a plurality of movable blocks (202) via a spring; each top rod (6) is provided with a plurality of rectangular grooves (6003); every two movable blocks (202) opposite to each other on the left and right are fixedly connected with the support tube (105); each support tube (105) slides up and down in an adjacent rectangular groove (6003); and a deformable waterproof membrane is provided between each rectangular groove (6003) and the top rod (6).

9. The circuit board automated processing equipment according to claim 8, characterized in that: Each support tube (105) is coated with a rubber diaphragm.

10. A method for using circuit board automated processing equipment, characterized in that: The operation method uses the circuit board automated processing equipment according to claim 9, and comprises the following steps: S1: Loading, after pushing the cover plate (2) upwards and opening it, the worker places each circuit board (4) on the corresponding support groove (6002), and then closes the cover plate (2); S2: Liquid inlet, the copper deposition solution is pumped into the water pipe (3) through an external copper deposition solution delivery device, so that the solution enters the connecting groove (6001), and then enters each support tube (105), and then the sealing part (10301) is used to pump the solution into the upper side of each partition plate (5) for copper deposition; S3: support adjustment, by pushing the support tube (105) to be separated from the lower side of the circuit board (4) by the pressing sheet (201) in a reciprocating manner, so that the contact surface between the support tube (105) and the circuit board (4) is exposed, thereby achieving the effect of uniform copper deposition on the lower side of the circuit board (4); S4: Draining and unloading. After the copper deposition is completed, the liquid extraction device is first used to cause the liquid extraction pipe (1006) to generate suction. After the copper deposition solution on each partition plate (5) is completely extracted, the cover plate (2) is lifted up and opened, and finally the circuit board (4) after the copper deposition is completed is taken out.

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