Display module

Abstract

A display module according to an embodiment may include: a display panel including a plurality of pixels; a cover panel disposed under the display panel and including a shielding layer including a metal; and the protective film is arranged below the covering panel. The protective film may include: a conductive adhesive layer disposed under the shield layer and having conductivity; a protective layer disposed under the conductive adhesive layer and including a recessed portion exposing a portion of the conductive adhesive layer; and a protruding member disposed under the conductive adhesive layer having conductivity, and including a first portion overlapping the portion of the conductive adhesive layer exposed by the recessed portion of the protective layer, and a second portion extending in a first direction from the first portion.

Description

Technical Field

[0001] Embodiments of the inventive concept relate to a display module. More particularly, embodiments of the inventive concept relate to a display module during a process of providing or manufacturing an electronic device. Background Art

[0002] The display module may include a display panel on which an image is displayed, and a cover panel and a protective film disposed below the display panel. After removing the protective film from the display module, the electronic device may be manufactured by assembling with various kits. The protective film may protect the display panel and the cover panel until the display panel and the cover panel are assembled with the kit.

[0003] During the manufacturing process of the electronic device, static electricity may flow into the display panel. When the static electricity flowing into the display panel is not discharged to the outside, the element characteristics of the transistor included in the display panel may change. Therefore, the static electricity flowing into the display panel needs to be discharged to the outside not only after assembling with the kit but also before assembling with the kit. Summary of the invention

[0004] Embodiments of the inventive concept provide a display module having improved reliability.

[0005] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0006] The display module according to the embodiment may include: a display panel including a plurality of pixels; a cover panel disposed under the display panel and including a shielding layer including a metal; and a protective film disposed under the cover panel. The protective film may include: a conductive adhesive layer disposed under the shielding layer and having conductivity; a protective layer disposed under the conductive adhesive layer and including a recessed portion exposing a portion of the conductive adhesive layer; and a protruding member disposed under the conductive adhesive layer having conductivity and including a first portion and a second portion, the first portion overlapping a portion of the conductive adhesive layer exposed by the recessed portion of the protective layer, and the second portion extending from the first portion in a first direction.

[0007] In an embodiment, the conductive adhesive layer may contact a lower surface of the shielding layer, an upper surface of the protection layer, and an upper surface of the first portion of the protruding member.

[0008] In an embodiment, a first adhesion force between the lower surface of the shielding layer and the upper surface of the conductive adhesive layer may be smaller than each of a second adhesion force between the lower surface of the conductive adhesive layer and the upper surface of the protective layer and a third adhesion force between the lower surface of the conductive adhesive layer and the upper surface of the first portion of the protruding member.

[0009] In an embodiment, in a plan view, the first portion of the protruding member may overlap the shielding layer. In a plan view, the second portion of the protruding member may protrude from the shielding layer in the first direction.

[0010] In an embodiment, the recessed portion of the protection layer may be recessed from an outer edge of the protection layer in a direction opposite to the first direction.

[0011] In an embodiment, the conductive adhesive layer may have a planar shape overlapping a planar shape of the shielding layer.

[0012] In an embodiment, the protruding member and the shielding layer may comprise the same material.

[0013] In an embodiment, the shielding layer may include a body portion and at least one static electricity induction pattern portion.

[0014] In an embodiment, the shielding layer may include: a first layer; a second layer disposed under the first layer, electrically connected to the first layer and including at least one static electricity induction pattern portion; and an adhesive layer disposed between the first layer and the second layer.

[0015] In an embodiment, the cover panel may further include an impact absorbing layer including a cushion layer and a heat dissipation layer disposed between the impact absorbing layer and the shielding layer.

[0016] The display module according to the embodiment may include: a display panel including a plurality of pixels; a cover panel disposed below the display panel and including a shielding layer, the shielding layer including a metal and including a first protrusion protruding in a first direction; and a protective film disposed below the cover panel. The protective film may include: an adhesive layer disposed below the shielding layer; and a protective layer disposed below the adhesive layer and including a second protrusion, the second protrusion protruding in the first direction, overlapping with the first protrusion, and the second protrusion having a size smaller than that of the first protrusion.

[0017] In an embodiment, the adhesive layer may contact a lower surface of the shielding layer and an upper surface of the protective layer.The adhesive layer may expose each of the first protrusion and the second protrusion.

[0018] In an embodiment, the first protrusion may include a first portion overlapping the second protrusion and a second portion positioned outside the first portion.

[0019] In an embodiment, the second protrusion may expose a second portion of the first protrusion.

[0020] In an embodiment, an adhesive force between a lower surface of the shielding layer and an upper surface of the adhesive layer may be smaller than an adhesive force between a lower surface of the adhesive layer and an upper surface of the protective layer.

[0021] In an embodiment, the first protrusion may protrude from the main body portion of the shielding layer in the first direction. The shielding layer may have at least one groove formed between the main body portion and the first protrusion.

[0022] The display module according to the embodiment may include: a display panel including a plurality of pixels; a cover panel disposed below the display panel and including a shielding layer including a metal; and a protective film disposed below the cover panel. The protective film may include: a conductive adhesive layer disposed below the shielding layer; a protective layer disposed below the conductive adhesive layer and including a main body portion having an opening and a protrusion protruding from the main body portion in a first direction; and a conductive layer disposed below the conductive adhesive layer and positioned within the opening of the main body portion of the protective layer, and the conductive layer has conductivity.

[0023] In an embodiment, the conductive adhesive layer may contact a lower surface of the shielding layer, an upper surface of the protection layer, and an upper surface of the conductive layer.

[0024] In an embodiment, the adhesion between the lower surface of the shielding layer and the upper surface of the conductive adhesive layer may be smaller than each of the adhesion between the lower surface of the conductive adhesive layer and the upper surface of the protective layer and the adhesion between the lower surface of the conductive adhesive layer and the upper surface of the conductive layer.

[0025] In an embodiment, the conductive layer may be a single-sided conductive tape having an upper surface with adhesive properties, the upper surface of the single-sided conductive tape contacting the conductive adhesive layer.

[0026] The display module according to the embodiment can discharge static electricity flowing into the display panel to the outside even before being assembled with the kit. Therefore, the reliability of the display panel, the display module, and the electronic device can be improved.

[0027] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the inventive concepts as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification, illustrate embodiments and together with the description serve to explain the inventive concept.

[0029] Figure 1A and Figure 1B 1 and 2 are top and rear views illustrating a display module according to an embodiment.

[0030] Figure 2 It is along Figure 1A A cross-sectional view taken along line II'.

[0031] Figure 3is a schematic diagram including Figure 1A and Figure 1B A cross-sectional view of a display area of ​​a display panel in a display module.

[0032] Figure 4A , Figure 4B and Figure 4C The diagram is included in Figure 1A and Figure 1B A rear view of various examples of shielding layers in a display module.

[0033] Figure 5A and Figure 5B 1 and 2 are top and rear views illustrating a display module according to an embodiment.

[0034] Figure 6 yes Figure 5B Magnified view of area A.

[0035] Figure 7 It is along Figure 5A A cross-sectional view taken along line II-II'.

[0036] Fig. 8A and Figure 8B 1 and 2 are top and rear views illustrating a display module according to an embodiment.

[0037] Fig. 9 It is along Fig. 8A A cross-sectional view taken along line III-III'. DETAILED DESCRIPTION

[0038] Illustrative, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0039] Figure 1A and Figure 1B 2 are a top view and a rear view illustrating a display module DM according to an embodiment. Figure 2 It is along Figure 1A A cross-sectional view taken along line II'.

[0040] refer to Figure 1A to Figure 2 , the display module DM according to the embodiment may include a display panel 100 , a driving circuit chip 210 , a circuit board 220 , a cover panel 300 , and a protective film 400 .

[0041] The display panel 100 may include a display area DA and a non-display area NDA. A plurality of pixels PX for generating an image may be disposed in the display area DA. An image may be generated by combining light emitted from the plurality of pixels PX, respectively. For example, the pixels PX may be arranged in a matrix along a first direction D1 and a second direction D2 intersecting the first direction D1. For example, the second direction D2 may be perpendicular to the first direction D1.

[0042] The non-display area NDA may be positioned around the display area DA. For example, in a plan view, the non-display area NDA may surround the display area DA.

[0043] The non-display area NDA may include a first pad area and a second pad area. For example, the first pad area may be spaced apart from the display area DA in the second direction D2. The second pad area may be spaced apart from the first pad area in the second direction D2.

[0044] In an embodiment, the non-display area NDA may include a bending area BA positioned between the display area DA and the first pad area. The bending area BA may be bent along a bending axis extending in the first direction D1. The bending area BA may be bent so that the first pad area and the second pad area are positioned below the display area DA. Hereinafter, the upper direction may refer to a third direction D3, and the lower direction may refer to a direction opposite to the third direction D3.

[0045] The driving circuit chip 210 may be disposed in the first pad region on the display panel 100. For example, the driving circuit chip 210 may be directly mounted on the display panel 100 in a chip on plastic (COP) manner, but this is exemplary and the embodiment is not limited thereto.

[0046] The circuit board 220 may be disposed in the second pad region on the display panel 100. That is, the circuit board 220 may be disposed on an end portion of the display panel 100 and may be spaced apart from the driving circuit chip 210 in the second direction D2.

[0047] The driving circuit chip 210 and the circuit board 220 may be electrically connected to the display panel 100. As described above, since the bending area BA is bent along the bending axis extending in the first direction D1, a portion of the display panel 100 on which the driving circuit chip 210 and the circuit board 220 are mounted may be positioned below the display panel 100.

[0048] The driving circuit chip 210 and the circuit board 220 may provide a driving signal to the display panel 100. The driving signal may include a driving voltage, a gate signal, or a data signal, etc., for driving the display panel 100. The driving signal may be transmitted to the pixels PX disposed in the display area DA through a plurality of pads and a plurality of transmission lines.

[0049] The cover panel 300 may be disposed under the display panel 100. The cover panel 300 may be attached to the lower surface of the display panel 100. The cover panel 300 may cover the display area DA of the display panel 100. The cover panel 300 may also cover at least a portion of the non-display area NDA of the display panel 100.

[0050] The cover panel 300 may protect the display panel 100 from the external environment (e.g., impact, electromagnetic waves, or noise, etc.) below the display panel 100. In addition, the cover panel 300 may diffuse the heat generated in the display panel 100, and may reduce or prevent the heat generated from electronic components (such as a processor, a battery, or a memory, etc.) below the display panel 100 that may be positioned in the electronic device from being transferred to the display panel 100.

[0051] The display panel 100 to which the cover panel 300 is attached may be assembled with various kits (eg, a bracket, a case, a cover window, or an electronic component, etc.) and may be provided as various types of electronic devices.

[0052] The protective film 400 may be disposed below the cover panel 300. The protective film 400 may be attached to the lower surface of the cover panel 300. The protective film 400 may be configured to protect the display panel 100 and the cover panel 300 during the process of providing or manufacturing the electronic device. The protective film 400 may remain attached below the cover panel 300 until the display panel 100 having the cover panel 300 attached to the display panel 100 is assembled with the kit. Therefore, before being assembled with the kit, the protective film 400 may protect the display panel 100 and the cover panel 300. When the kit is assembled with the display panel 100, the protective film 400 may be peeled off from the cover panel 300. The protective film 400 may be referred to as a release film.

[0053] For example, the display panel 100, the cover panel 300 attached under the display panel 100, and the protective film 400 attached under the cover panel 300 may define the display module DM. In addition, although not illustrated in the drawings, the display module DM may further include various components (such as a cover window or an upper protective film, etc.) attached to the display panel 100. The detailed configurations of the cover panel 300 and the protective film 400 will be described later.

[0054] Figure 3 is a schematic diagram including Figure 1A and Figure 1B FIG. 1 is a cross-sectional view of a display area DA of a display panel 100 in a display module DM.

[0055] In the following, reference will be made to Figure 3 The display area DA of the display panel 100 is described in more detail.

[0056] refer to Figure 3 , the display panel 100 may include a substrate 110, a buffer layer 120, a pixel PX, and an encapsulation layer 140. The pixel PX may include a first transistor TR1, a second transistor TR2, a capacitor CAP, and a light emitting element LED.

[0057] The substrate 110 may be an insulating substrate formed of a transparent material or an opaque material. In an embodiment, the substrate 110 may include plastic. In this case, the display panel 100 may be a flexible display panel. In an embodiment, the substrate 110 may include glass. In this case, the display panel 100 may be a rigid display panel.

[0058] The buffer layer 120 may be disposed on the substrate 110. The buffer layer 120 may prevent or reduce impurities (such as oxygen or moisture) from penetrating into the upper portion of the substrate 110 through the substrate 110. The buffer layer 120 may include an inorganic material such as a silicon compound or a metal oxide. For example, the buffer layer 120 may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), Silicon Oxycarbide (SiO x C y ), Silicon Carbonitride (SiC x N y ), aluminum oxide (AlO x ), aluminum nitride (AlN x ), tantalum oxide (TaO x ), hafnium oxide (HfO x )、ZrO x ) or titanium oxide (TiO x ) etc. These may be used alone or in combination. The buffer layer 120 may have a single layer structure or a multi-layer structure including a plurality of insulating layers.

[0059] The first transistor TR1, the second transistor TR2 and the capacitor CAP may be disposed on the buffer layer 120. The first transistor TR1 may include an active layer AL1, a gate electrode GE1, a source electrode SE1 and a drain electrode DE1. The first transistor TR1 may be a driving transistor connected to the light emitting element LED. The second transistor TR2 may include an active layer AL2, a gate electrode GE2, a source electrode SE2 and a drain electrode DE2. The second transistor TR2 may be a switching transistor connected to the data line.

[0060] The active layers AL1 and AL2 may be disposed on the buffer layer 120. Each of the active layers AL1 and AL2 may include an oxide semiconductor, a silicon semiconductor, an organic semiconductor, or the like. For example, the oxide semiconductor may include an oxide of at least one of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The silicon semiconductor may include amorphous silicon or polycrystalline silicon, or the like. Each of the active layers AL1 and AL2 may include a source region, a drain region, and a channel region positioned between the source region and the drain region.

[0061] The display panel 100 may further include insulating layers 131, 132, 133, 134, and 135. The first insulating layer 131 may be disposed on the active layers AL1 and AL2. The first insulating layer 131 may cover the active layers AL1 and AL2 on the buffer layer 120. The first insulating layer 131 may include an inorganic insulating material.

[0062] The gate electrodes GE1 and GE2 may be disposed on the first insulating layer 131. The gate electrode GE1 may overlap with the channel region of the active layer AL1, and the gate electrode GE2 may overlap with the channel region of the active layer AL2. Each of the gate electrodes GE1 and GE2 may include a conductive material such as a metal, an alloy, a conductive metal nitride, a conductive metal oxide, or a transparent conductive material. For example, each of the gate electrodes GE1 and GE2 may include gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), an alloy containing aluminum, an alloy containing silver, an alloy containing copper, an alloy containing molybdenum, aluminum nitride (AlN), or the like. x ), tungsten nitride (WN x ), titanium nitride (TiN x ), chromium nitride (CrN x ), Tantalum Nitride (TaN x ), strontium ruthenium oxide (SrRuO x ), zinc oxide (ZnO x )、Indium Tin Oxide (ITO), Tin Oxide (SnO x ), indium oxide (InO x ), gallium oxide (GaO x ) or indium zinc oxide (IZO), etc. These may be used alone or in combination. Each of the gate electrodes GE1 and GE2 may have a single-layer structure or a multi-layer structure including a plurality of conductive layers.

[0063] The second insulating layer 132 may be disposed on the gate electrodes GE1 and GE2. The second insulating layer 132 may cover the gate electrodes GE1 and GE2 on the first insulating layer 131. The second insulating layer 132 may include an inorganic insulating material.

[0064] The capacitor electrode CPE may be disposed on the second insulating layer 132. The capacitor electrode CPE may overlap the gate electrode GE1. The gate electrode GE1, the second insulating layer 132, and the capacitor electrode CPE may form a capacitor CAP.

[0065] The third insulating layer 133 may be disposed on the capacitor electrode CPE. The third insulating layer 133 may cover the capacitor electrode CPE on the second insulating layer 132. The third insulating layer 133 may include an inorganic insulating material.

[0066] Source electrodes SE1 and SE2 and drain electrodes DE1 and DE2 may be disposed on the third insulating layer 133. The source electrode SE1 and the drain electrode DE1 may be connected to the source region and the drain region of the active layer AL1, respectively. The source electrode SE2 and the drain electrode DE2 may be connected to the source region and the drain region of the active layer AL2, respectively. Each of the source electrodes SE1 and SE2 and the drain electrodes DE1 and DE2 may include a conductive material.

[0067] The fourth insulating layer 134 may be disposed on the source electrodes SE1 and SE2 and the drain electrodes DE1 and DE2. The fourth insulating layer 134 may include an organic insulating material. For example, the fourth insulating layer 134 may include a photoresist, a polypropylene-based resin, a polyimide-based resin, a polyamide-based resin, a siloxane-based resin, an acrylic-based resin, or an epoxy-based resin, etc. These may be used alone or in combination.

[0068] The pixel electrode PE may be disposed on the fourth insulating layer 134. The pixel electrode PE may include a conductive material. The pixel electrode PE may be connected to the drain electrode DE1 through a contact hole formed in the fourth insulating layer 134. Therefore, the pixel electrode PE may be electrically connected to the first transistor TR1.

[0069] The fifth insulating layer 135 may be disposed on the pixel electrode PE. The fifth insulating layer 135 may cover a peripheral portion of the pixel electrode PE and may define a pixel opening exposing a central portion of the pixel electrode PE. The fifth insulating layer 135 may include an organic insulating material.

[0070] The emission layer EL may be disposed on the pixel electrode PE. The emission layer EL may be disposed in a pixel opening of the fifth insulating layer 135. In some embodiments, the emission layer EL may include at least one of an organic light emitting material and a quantum dot.

[0071] In an embodiment, the organic light-emitting material may include a low molecular weight organic compound or a high molecular weight organic compound. Examples of low molecular weight organic compounds may include copper aluminum phthalocyanine, N,N'-diphenylbenzidine or tris-(8-hydroxyquinoline), etc. Examples of high molecular weight organic compounds may include poly(3,4-ethylenedioxythiophene), polyaniline, polystyrene or polyfluorene, etc. These may be used alone or in combination.

[0072] In an embodiment, the quantum dot may include a core comprising a II-VI compound, a III-V compound, a IV-VI compound, a IV element, and / or a IV compound. In an embodiment, the quantum dot may have a core-shell structure including a core and a shell surrounding the core. The shell may be used as a protective layer to prevent the core from being chemically denatured to maintain semiconductor properties, and may be used as a charging layer to impart electrophoretic properties to the quantum dot.

[0073] The common electrode CE may be disposed on the emission layer EL. The common electrode CE may also be disposed on the fifth insulating layer 135. The common electrode CE may include a conductive material. The pixel electrode PE, the emission layer EL, and the common electrode CE may form a light emitting element LED.

[0074] The encapsulation layer 140 may be disposed on the common electrode CE. The encapsulation layer 140 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In an embodiment, the encapsulation layer 140 may include: a first inorganic encapsulation layer 141 disposed on the common electrode CE; an organic encapsulation layer 142 disposed on the first inorganic encapsulation layer 141; and a second inorganic encapsulation layer 143 disposed on the organic encapsulation layer 142. In addition, although not shown in the figure, various functional layers (such as a touch sensing layer, a color filter layer, or a light collection layer, etc.) may be additionally disposed on the encapsulation layer 140.

[0075] In the following, we will refer again to Figure 1A to Figure 2 The cover panel 300 and the protection film 400 are described in more detail.

[0076] The cover panel 300 may have a multi-layer structure including a plurality of layers. Figure 2 As shown in FIG, the cover panel 300 may include an impact absorbing layer 320, a heat dissipation layer 340, a shielding layer 360, and adhesive layers 310, 330, and 350. The impact absorbing layer 320, the heat dissipation layer 340, the shielding layer 360, and the adhesive layers 310, 330, and 350 may be stacked in a third direction D3 as a thickness direction.

[0077] An adhesive layer 310 for attaching the cover panel 300 to the display panel 100 may be provided on an upper surface of the cover panel 300. For example, an embossed pattern may be formed in an upper surface of the adhesive layer 310 attached below the display panel 100. During the attaching process of the cover panel 300, the embossed pattern may discharge bubbles to the outside.

[0078] The impact absorbing layer 320 may be disposed under the adhesive layer 310. In an embodiment, the impact absorbing layer 320 may include a first supporting layer 321, a cushion layer 323, and a second supporting layer 325.

[0079] The first supporting layer 321 and the second supporting layer 325 may be plastic layers including a polymer such as polyethylene terephthalate (PET) or polyimide (PI), etc. For example, the first supporting layer 321 may include PET, and the second supporting layer 325 may include PI, but this is exemplary and the embodiment is not limited thereto.

[0080] At least one of the first supporting layer 321 and the second supporting layer 325 may be colored. For example, the first supporting layer 321 may be colored. For example, the first supporting layer 321 may be black. The first supporting layer 321 may absorb light incident on the first supporting layer 321.

[0081] The cushion layer 323 may be a porous layer formed of a material such as polyurethane or polyethylene, etc. The cushion layer 323 may include a foamed resin. The cushion layer 323 may include an elastomer.

[0082] Adhesive layers 322 and 324 may be respectively disposed between the first supporting layer 321 and the cushion layer 323 and between the cushion layer 323 and the second supporting layer 325 to attach them.

[0083] The heat dissipation layer 340 may be disposed below the impact absorbing layer 320. The heat dissipation layer 340 may dissipate heat generated by electronic components such as a processor, a battery, or a memory. The heat dissipation layer 340 may include a material having excellent thermal conductivity. For example, the heat dissipation layer 340 may include a carbon material such as graphite, graphene, or carbon nanotubes (CNTs).

[0084] The heat dissipation layer 340 may have a plurality of openings 340OP penetrating the body of the heat dissipation layer 340 in the thickness direction (eg, in the third direction D3 ).

[0085] The adhesive layer 330 and / or the adhesive layer 350 may extend into the opening 340OP of the heat dissipation layer 340, not only improving the bonding force between the heat dissipation layer 340 and the impact absorbing layer 320 and / or the heat dissipation layer 340 and the shielding layer 360, but also preventing or reducing the separation of the heat dissipation layer 340 from other layers in the cover panel 300. For example, when the heat dissipation layer 340 includes graphite, the graphite has a relatively weak peeling force, so that during the process of providing or manufacturing the electronic device, during the rework process of separating the components (e.g., frame, printed circuit board or battery, etc.) attached below the cover panel 300, the heat dissipation layer 340 may be peeled off or separated from another layer. The adhesive layers 330 and 350 on opposite sides of the heat dissipation layer 340 are connected to each other at the opening 340OP of the heat dissipation layer 340 to relatively firmly attach the heat dissipation layer 340 to other layers in the cover panel 300 and prevent or reduce the heat dissipation layer 340 from peeling off from another layer.

[0086] The adhesive layers 310 , 322 , 324 , 330 , and 350 may be a pressure sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, an optically clear resin (OCR) film, or the like.

[0087] The shielding layer 360 may be disposed below the heat dissipation layer 340. The shielding layer 360 may prevent or reduce electromagnetic waves, static electricity, or noise, etc. from flowing from the external environment below the cover panel 300 to the display panel 100. In addition, the shielding layer 360 may improve the heat dissipation characteristics of the heat dissipation layer 340. The shielding layer 360 may be a metal layer including a metal having excellent thermal conductivity and shielding properties, such as copper or aluminum. In addition, the shielding layer 360 may be electrically connected to a grounded kit, which may be used as a ground after being assembled with the kit, so that static electricity flowing into the display panel 100 and / or the cover panel 300 may be discharged to the outside.

[0088] FIG. 4A to FIG. 4C The diagram is included in Figure 1A and Figure 1B FIG. 1 is a rear view of various examples of the shielding layer 360 in the display module DM. For example, FIG. 4A to FIG. 4C Each of the Figure 1B Rear view of.

[0089] refer to Figure 1A , Figure 1B and Figure 4A In an embodiment, the shielding layer 360a may have a planar shape that completely covers the display area DA of the display panel 100. After being assembled with the assembly, the ground portion GP of the shielding layer 360a may be electrically connected to the grounded assembly.

[0090] refer to Figure 1A , Figure 1B and Figure 4BIn an embodiment, the shielding layer 360b may include a main body portion 360ba and at least one electrostatic induction pattern portion 360bb. The main body portion 360ba may have a recessed portion recessed in an inward direction from an outer edge of the main body portion 360ba. The electrostatic induction pattern portion 360bb may protrude from the recessed portion of the main body portion 360ba and may have a pointed shape. Since the shielding layer 360b includes the electrostatic induction pattern portion 360bb having a pointed shape, static electricity may be more effectively induced to be discharged to the outside. Figure 4B The shielding layer 360b is shown to include three static electricity induction pattern parts 360bb, but this is exemplary and the embodiment is not limited thereto. For example, the shielding layer 360b may include one, two, or four or more static electricity induction pattern parts 360bb.

[0091] refer to Figure 1A , Figure 1B and Figure 4C In an embodiment, the shielding layer 360c may include a first layer 362 and a second layer 364 disposed under the first layer 362 and electrically connected to the first layer 362. For example, the first layer 362 may have a planar shape that completely covers the display area DA of the display panel 100.

[0092] The second layer 364 may include a connection portion 364a and at least one static electricity induction pattern portion 364b. The static electricity induction pattern portion 364b may have a pointed shape. Figure 4C The second layer 364 is shown to include three static electricity induction pattern parts 364b, but this is exemplary and the embodiment is not limited thereto. For example, the second layer 364 may include one, two, or four or more static electricity induction pattern parts 364b.

[0093] The adhesive layer may be disposed between the first layer 362 and the second layer 364. The adhesive layer may bond the first layer 362 and the second layer 364 to each other. The first layer 362 and the second layer 364 may be electrically connected to each other. For example, the adhesive layer may have an opening that overlaps a portion of the second layer 364. A portion of the first layer 362 and a portion of the second layer 364 may contact each other through the opening of the adhesive layer, so that the first layer 362 and the second layer 364 may be electrically connected to each other.

[0094] Reference again Figure 1A to Figure 2 , the protective film 400 may include a conductive adhesive layer 410 , a protective layer 420 , and a protruding member 430 .

[0095] A conductive adhesive layer 410 for attaching the protective film 400 to the cover panel 300 may be provided on the upper surface of the protective film 400. The conductive adhesive layer 410 may have conductivity. The upper surface of the conductive adhesive layer 410 may contact the lower surface of the shielding layer 360. For example, the conductive adhesive layer 410 may have a planar shape corresponding to the planar shape of the cover panel 300. For example, the conductive adhesive layer 410 may have a planar shape corresponding to the planar shape of the shielding layer 360. The conductive adhesive layer 410 may attach the protective layer 420 and the protruding member 430 to the lower surface of the cover panel 300.

[0096] The protective layer 420 may be disposed below the conductive adhesive layer 410. The upper surface of the protective layer 420 may contact the lower surface of the conductive adhesive layer 410. The protective layer 420 may include a plastic layer including a polymer such as PET or PI. Figure 2 4 is illustrated as a single-layer structure, but the protective layer 420 may have a multi-layer structure including a plurality of layers. For example, the protective layer 420 may have a multi-layer structure in which a soluble adhesive layer, a mask layer, a step compensation layer, etc. are provided between the plastic layer and the conductive adhesive layer 410, but this is exemplary and the embodiment is not limited thereto.

[0097] The protective layer 420 may have a recessed portion 420r exposing a portion of the conductive adhesive layer 410. That is, the lower surface of the portion of the conductive adhesive layer 410 may be exposed without being covered by the protective layer 420. Figure 1B As shown in FIG. 4 , the recessed portion 420 r may be recessed from an outer edge (eg, an edge in the first direction D1 ) of the protective layer 420 in an inward direction (eg, a direction opposite to the first direction D1 ). Figure 1B The protective layer 420 is shown to have two recessed portions 420 r , but this is exemplary and the embodiment is not limited thereto. For example, the protective layer 420 may have one or three or more recessed portions 420 r , and the recessed portions 420 r may be formed at respective edges of the protective layer 420 .

[0098] The protrusion member 430 may be disposed under the conductive adhesive layer 410 to correspond to the recessed portion 420r of the protective layer 420. For example, the protrusion member 430 may be disposed on the same layer as the protective layer 420. Figure 1B The protective film 400 is shown to include two protruding members 430 , but this is exemplary and the embodiment is not limited thereto. For example, one or three or more protruding members 430 may be provided corresponding to the number of the concave portions 420 r of the protective layer 420 .

[0099] The upper surface of a portion of the protruding member 430 may contact the lower surface of the conductive adhesive layer 410. The protruding member 430 may have conductivity. For example, the protruding member 430 may include the same material as the shielding layer 360, such as a metal (e.g., copper or aluminum, etc.). For another example, the protruding member 430 may include a material different from that of the shielding layer 360.

[0100] The protruding member 430 may include a first portion 430a and a second portion 430b. The first portion 430a of the protruding member 430 may overlap with a portion of the conductive adhesive layer 410 exposed by the recessed portion 420r of the protective layer 420. The upper surface of the first portion 430a of the protruding member 430 may contact a lower surface of a portion of the conductive adhesive layer 410 exposed by the recessed portion 420r of the protective layer 420. For example, Figure 1B As shown in FIG. 4 , the first portion 430a of the protruding member 430 may have a planar shape corresponding to the planar shape of the recessed portion 420r of the protective layer 420. That is, in a plan view, the first portion 430a of the protruding member 430 may have a shape embedded in the recessed portion 420r of the protective layer 420. In a plan view, the first portion 430a of the protruding member 430 may overlap the shielding layer 360.

[0101] The second portion 430b of the protruding member 430 may extend from the first portion 430a in one direction (e.g., in the first direction D1). In a plan view, the second portion 430b of the protruding member 430 may protrude from the shielding layer 360 in one direction (e.g., in the first direction D1). The first portion 430a and the second portion 430b of the protruding member 430 may be provided integrally. The second portion 430b of the protruding member 430 may be a grip portion that helps facilitate removal of the protective film 400 from the cover panel 300 when assembled with the kit.

[0102] As described above, the upper surface of the conductive adhesive layer 410 may contact the lower surface of the shielding layer 360, and the lower surface of the conductive adhesive layer 410 may contact the upper surface of the protective layer 420 and the upper surface of the first portion 430a of the protruding member 430. The first adhesive force between the lower surface of the shielding layer 360 and the upper surface of the conductive adhesive layer 410 may be smaller than the second adhesive force between the lower surface of the conductive adhesive layer 410 and the upper surface of the protective layer 420. In addition, the first adhesive force between the lower surface of the shielding layer 360 and the upper surface of the conductive adhesive layer 410 may be smaller than the third adhesive force between the lower surface of the conductive adhesive layer 410 and the upper surface of the first portion 430a of the protruding member 430. Therefore, when the protective film 400 is removed from the cover panel 300 to be assembled with the kit, the protective film 400 including the conductive adhesive layer 410 may be easily removed from the cover panel 300.

[0103] In addition, in a state where the protective film 400 is attached below the cover panel 300, the protruding member 430 may function as a discharge path for discharging static electricity flowing into the display panel 100 and / or the cover panel 300 to the outside. As described above, after removing the protective film 400 and assembling with the kit, the shielding layer 360 may be electrically connected to the grounded kit to discharge static electricity flowing into the display panel 100 and / or the cover panel 300 to the outside. However, even before the shielding layer 360 is electrically connected to the grounded kit (i.e., even before assembling with the kit), it is necessary to discharge static electricity flowing into the display panel 100 and / or the cover panel 300 to the outside.

[0104] For example, during the process of providing or manufacturing an electronic device, various processes or tests (e.g., a driving test) may be performed on the display module DM having the cover panel 300 and the protective film 400 attached below the display panel 100 in a state where the display module DM is placed on a fixture of various equipment. At this time, the lower surface of the protruding member 430 may contact the upper surface of the fixture. According to an embodiment, since the protruding member 430 having conductivity is attached to the shielding layer 360 through the conductive adhesive layer 410, the static electricity flowing into the display panel 100 and / or the cover panel 300 may be discharged to the outside (e.g., to the fixture) through the shielding layer 360, the conductive adhesive layer 410, and the protruding member 430. That is, the protruding member 430 may serve as a discharge path for discharging the static electricity flowing into the display panel 100 and / or the cover panel 300 to the outside before being assembled with the kit. Therefore, it is possible to prevent or reduce changes in the element characteristics of the transistor in the display panel 100 caused by the static electricity flowing into the display panel 100 before being assembled with the kit. Therefore, the reliability of the display panel 100, the display module DM, and the electronic device may be improved.

[0105] Figure 5A and Figure 5B 2 are a top view and a rear view illustrating a display module DM' according to an embodiment. Figure 6 yes Figure 5B Magnified view of area A. Figure 7 It is along Figure 5A A cross-sectional view taken along line II-II'.

[0106] refer to FIG. 5A to FIG. 7, the display module DM′ according to the embodiment may include a display panel 100, a driving circuit chip 210, a circuit board 220, a cover panel 1300, and a protective film 1400. The cover panel 1300 may include an impact absorbing layer 320, a heat dissipation layer 340, a shielding layer 1360, and adhesive layers 310, 330, and 350. The protective film 1400 may include an adhesive layer 1410 and a protective layer 1420. In addition to the shielding layer 1360 and the protective film 1400, the display module DM′ may be the same as the reference 100. Figures 1A to 4C The display modules DM described are substantially the same or similar, and therefore, repeated descriptions may be omitted or simplified.

[0107] The shielding layer 1360 may be disposed under the heat dissipation layer 340. The shielding layer 1360 may include a main body portion 1362 and a first protrusion 1364. For example, the main body portion 1362 of the shielding layer 1360 may have a planar shape that completely covers the display area DA of the display panel 100. That is, the shielding layer 1360 may have a planar shape in which the first protrusion 1364 is additionally provided to the display area DA of the display panel 100. Figure 4A For example, the shielding layer 1360 may have a shape in which the first protrusion 1364 is additionally provided to the shielding layer 360a. Figure 4B The shape of the shielding layer 360b shown in FIG. As another example, the shielding layer 1360 may have a shape including Figure 4C The shielding layer 1360 may have a multilayer structure of an upper layer and a lower layer as shown in FIG. 1 , and the shielding layer 1360 may have a structure in which a first protrusion 1364 is additionally provided to the upper layer ( Figure 4C The shape of the first layer 362).

[0108] The first protrusion 1364 of the shielding layer 1360 may protrude in one direction (eg, in the first direction D1) from the body portion 1362. The body portion 1362 and the first protrusion 1364 of the shielding layer 1360 may be integrally provided. Figure 5B The shielding layer 1360 is shown to include two first protrusions 1364 , but this is exemplary and the embodiment is not limited thereto. For example, the shielding layer 1360 may include one or three or more first protrusions 1364 .

[0109] An adhesive layer 1410 for attaching the protective film 1400 to the cover panel 1300 may be provided on the upper surface of the protective film 1400. The upper surface of the adhesive layer 1410 may contact the lower surface of the shielding layer 1360. For example, the adhesive layer 1410 may have a planar shape that overlaps and corresponds to the planar shape of the main body portion 1362 of the shielding layer 1360. The adhesive layer 1410 may overlap the main body portion 1362 of the shielding layer 1360, and may not overlap the first protrusion 1364 of the shielding layer 1360. That is, the adhesive layer 1410 may expose the first protrusion 1364 of the shielding layer 1360. The upper surface of the adhesive layer 1410 may contact the lower surface of the main body portion 1362 of the shielding layer 1360, and the adhesive layer 1410 may not contact the lower surface of the first protrusion 1364 of the shielding layer 1360.

[0110] The protective layer 1420 may be disposed under the adhesive layer 1410. The protective layer 1420 may include a body portion 1422 and a second protrusion 1424. For example, the body portion 1422 of the protective layer 1420 may have a planar shape that overlaps and corresponds to a planar shape of the body portion 1362 of the shielding layer 1360.

[0111] The second protrusion 1424 of the protective layer 1420 may correspond to the first protrusion 1364 of the shielding layer 1360. The second protrusion 1424 of the protective layer 1420 may protrude in one direction (eg, in the first direction D1) from the body portion 1422. The body portion 1422 and the second protrusion 1424 of the protective layer 1420 may be integrally provided. Figure 5B The protective layer 1420 is shown to include two second protrusions 1424 , but this is exemplary and the embodiment is not limited thereto. For example, the protective layer 1420 may include one or three or more second protrusions 1424 corresponding to the first protrusions 1364 of the shielding layer 1360 .

[0112] The second protrusion 1424 of the protective layer 1420 may overlap with the first protrusion 1364 of the shielding layer 1360. The second protrusion 1424 of the protective layer 1420 may have a smaller size than the first protrusion 1364 of the shielding layer 1360. For example, Figure 5B As shown in FIG. 1 , in a plan view, the first protrusion 1364 of the shielding layer 1360 may completely overlap with the second protrusion 1424 of the protection layer 1420 .

[0113] The first protrusion 1364 of the shielding layer 1360 may include a first portion 1364a and a second portion 1364b positioned outside the first portion 1364a. The first portion 1364a may be a portion overlapping with the second protrusion 1424 in a plan view, and the second portion 1364b may be a portion not overlapping with the second protrusion 1424 in a plan view. For example, the lower surface of the first portion 1364a of the first protrusion 1364 of the shielding layer 1360 may contact the upper surface of the second protrusion 1424 of the protective layer 1420. For example, in a plan view, the second portion 1364b may surround the first portion 1364a overlapping with the second protrusion 1424. The second protrusion 1424 of the protective layer 1420 may expose the second portion 1364b of the first protrusion 1364 of the shielding layer 1360. That is, the lower surface of the second portion 1364 b of the first protrusion 1364 of the shielding layer 1360 may be exposed without being covered by the second protrusion 1424 of the protective layer 1420 .

[0114] When assembled with the kit, the first protrusion 1364 of the shielding layer 1360 and the second protrusion 1424 of the protective layer 1420 may be gripping portions that help facilitate removal of the protective film 1400 from the cover panel 1300. For example, when assembled with the kit, the first protrusion 1364 of the shielding layer 1360 may be separated from the main body portion 1362 and may be removed together with the protective film 1400.

[0115] In an embodiment, Figure 6 and Figure 7 As shown in , in order to easily separate the first protrusion 1364 of the shielding layer 1360 from the body portion 1362 , the shielding layer 1360 may have at least one groove GR formed at a boundary between the body portion 1362 and the first protrusion 1364 . Figure 6 The shielding layer 1360 is shown to have four grooves GR arranged in the second direction D2, but this is exemplary and the embodiment is not limited thereto. For example, the shielding layer 1360 may have one, two, three, or five or more grooves GR.

[0116] For example, Figure 7 As shown in , the groove GR may be formed in an upward direction (e.g., in the third direction D3) from the lower surface of the shielding layer 1360. For another example, the groove GR may be formed in a downward direction (e.g., in a direction opposite to the third direction D3) from the upper surface of the shielding layer 1360. For another example, the groove GR may be formed to penetrate the shielding layer 1360 in the thickness direction.

[0117] As described above, the upper surface of the adhesive layer 1410 may contact the lower surface of the shielding layer 1360 (e.g., the lower surface of the main body portion 1362), and the lower surface of the adhesive layer 1410 may contact the upper surface of the protective layer 1420 (e.g., the upper surface of the main body portion 1422). The fourth adhesive force between the lower surface of the shielding layer 1360 and the upper surface of the adhesive layer 1410 may be less than the fifth adhesive force between the lower surface of the adhesive layer 1410 and the upper surface of the protective layer 1420. Therefore, when the protective film 1400 is removed from the cover panel 1300 to be assembled with the kit, the protective film 1400 including the adhesive layer 1410 may be easily removed from the cover panel 1300.

[0118] In addition, in a state where the protective film 1400 is attached below the cover panel 1300, the first protrusion 1364 of the shielding layer 1360 can serve as a discharge path for discharging static electricity flowing into the display panel 100 and / or the cover panel 1300 to the outside. As described above, after removing the protective film 1400 and assembling with the kit, the shielding layer 1360 can be electrically connected to the grounded kit to discharge static electricity flowing into the display panel 100 and / or the cover panel 300 to the outside. However, even before the shielding layer 1360 is electrically connected to the grounded kit (i.e., even before assembling with the kit), it is necessary to discharge static electricity flowing into the display panel 100 and / or the cover panel 1300 to the outside.

[0119] For example, during a process of providing or manufacturing an electronic device, various processes or tests (e.g., a driving test) may be performed on the display module DM having the cover panel 1300 and the protective film 1400 attached below the display panel 100 in a state where the display module DM is placed on a jig of various equipment. At this time, since the first protrusion 1364 of the shielding layer 1360 is formed to be larger than the second protrusion 1424 of the protective layer 1420, a portion of the lower surface of the second portion 1364b of the first protrusion 1364 of the shielding layer 1360 that is not covered by the second protrusion 1424 of the protective layer 1420 and exposed may contact the upper surface of the jig. According to an embodiment, static electricity flowing into the display panel 100 and / or the cover panel 1300 may be discharged to the outside (e.g., to the jig) through the second portion 1364b of the first protrusion 1364 of the shielding layer 1360. That is, the first protrusion 1364 of the shielding layer 1360 can function as a discharge path for discharging static electricity flowing into the display panel 100 and / or the cover panel 1300 to the outside before being assembled with the kit. Therefore, it is possible to prevent or reduce changes in element characteristics of transistors in the display panel 100 due to static electricity flowing into the display panel 100 before being assembled with the kit. Therefore, the reliability of the display panel 100, the display module DM', and the electronic device can be improved.

[0120] Fig. 8A and Figure 8B 2 are a top view and a rear view illustrating a display module DM″ according to an embodiment. Fig. 9 It is along Fig. 8A A cross-sectional view taken along line III-III'.

[0121] refer to FIG. 8A to FIG. 9 , the display module DM″ according to the embodiment may include a display panel 100, a driving circuit chip 210, a circuit board 220, a cover panel 300 and a protective film 2400. The cover panel 300 may include an impact absorbing layer 320, a heat dissipation layer 340, a shielding layer 360 and adhesive layers 310, 330 and 350. The protective film 2400 may include a conductive adhesive layer 410, a protective layer 2420 and a conductive layer 440. In addition to the protective layer 2420 and the conductive layer 440 of the protective film 2400, the display module DM″ may be the same as the reference Figures 1A to 4C The display modules DM described are substantially the same or similar, and therefore, repeated descriptions may be omitted or simplified.

[0122] A conductive adhesive layer 410 for attaching the protective film 2400 to the cover panel 300 may be provided on the upper surface of the protective film 2400. The conductive adhesive layer 410 may have conductivity. The upper surface of the conductive adhesive layer 410 may contact the lower surface of the shielding layer 360. For example, the conductive adhesive layer 410 may have a planar shape that overlaps and corresponds to the planar shape of the cover panel 300. For example, the conductive adhesive layer 410 may have a planar shape that overlaps and corresponds to the planar shape of the shielding layer 360. The conductive adhesive layer 410 may attach the protective layer 2420 and the conductive layer 440 below the cover panel 300.

[0123] The protective layer 2420 may be disposed under the conductive adhesive layer 410. The protective layer 2420 may include a body portion 2422 and a protrusion 2424. For example, the body portion 2422 of the protective layer 2420 may have a planar shape corresponding to that of the shielding layer 360.

[0124] The body portion 2422 of the protective layer 2420 may have at least one opening 2422OP penetrating the body portion 2422 in the thickness direction (eg, in the third direction D3 ). Figure 8B The main body portion 2422 of the protective layer 2420 is shown to have two openings 2422OP, but this is exemplary and the embodiment is not limited thereto. For example, the main body portion 2422 of the protective layer 2420 may have one or three or more openings 2422OP.

[0125] The protrusion 2424 of the protective layer 2420 may protrude in one direction (eg, in the first direction D1) from the body portion 2422. The body portion 2422 and the protrusion 2424 of the protective layer 2420 may be integrally provided. Figure 8B The protective layer 2420 is shown to include two protrusions 2424, but this is exemplary and the embodiment is not limited thereto. For example, the protective layer 2420 may include one or three or more protrusions 2424. The protrusions 2424 of the protective layer 2420 may be gripping portions that help facilitate removal of the protective film 2400 from the cover panel 300 when assembled with the kit.

[0126] The conductive layer 440 may be positioned within the opening 2422OP of the body portion 2422 of the protective layer 2420. The conductive layer 440 may be disposed below the conductive adhesive layer 410. For example, the conductive layer 440 may be disposed on the same layer as the protective layer 2420. Figure 8B The protective film 2400 is shown to include two conductive layers 440 , but this is exemplary and the embodiment is not limited thereto. For example, one or three or more conductive layers 440 may be provided corresponding to the number of openings 2422OP of the main body portion 2422 of the protective layer 2420 .

[0127] The upper surface of the conductive layer 440 may contact the lower surface of the conductive adhesive layer 410. The conductive layer 440 may have conductivity. In an embodiment, the conductive layer 440 may be a conductive tape. For example, the conductive layer 440 may be a single-sided conductive tape having an upper surface with adhesive properties. The upper surface of the conductive layer 440 may have adhesive properties, and the lower surface of the conductive layer 440 may not have adhesive properties.

[0128] As described above, the upper surface of the conductive adhesive layer 410 may contact the lower surface of the shielding layer 360, and the lower surface of the conductive adhesive layer 410 may contact the upper surface of the protective layer 2420 (e.g., the upper surface of the main body portion 2422) and the upper surface of the conductive layer 440. The sixth adhesive force between the lower surface of the shielding layer 360 and the upper surface of the conductive adhesive layer 410 may be less than the seventh adhesive force between the lower surface of the conductive adhesive layer 410 and the upper surface of the protective layer 2420. In addition, the sixth adhesive force between the lower surface of the shielding layer 360 and the upper surface of the conductive adhesive layer 410 may be less than the eighth adhesive force between the lower surface of the conductive adhesive layer 410 and the upper surface of the conductive layer 440. Therefore, when the protective film 2400 is removed from the cover panel 300 to be assembled with the kit, the protective film 2400 including the conductive adhesive layer 410 may be easily removed from the cover panel 300.

[0129] In addition, in a state where the protective film 2400 is attached below the cover panel 300, the conductive layer 440 can function as a discharge path for discharging static electricity flowing into the display panel 100 and / or the cover panel 300 to the outside. As described above, after removing the shielding film 2400 and assembling with the kit, the shielding layer 360 can be electrically connected to the grounded kit to discharge static electricity flowing into the display panel 100 and / or the cover panel 300 to the outside. However, even before the shielding layer 360 is electrically connected to the grounded kit (i.e., even before assembling with the kit), it is necessary to discharge static electricity flowing into the display panel 100 and / or the cover panel 300 to the outside.

[0130] For example, during a process of providing or manufacturing an electronic device, various processes or tests (e.g., a driving test) may be performed on the display module DM' having the cover panel 300 and the protective film 2400 attached below the display panel 100 in a state where the display module DM' is placed on a jig of various equipment. At this time, the lower surface of the conductive layer 440 may contact the upper surface of the jig. According to an embodiment, since the conductive layer 440 having conductivity is attached to the shielding layer 360 through the conductive adhesive layer 410, static electricity flowing into the display panel 100 and / or the cover panel 300 may be discharged to the outside (e.g., to the jig) through the shielding layer 360, the conductive adhesive layer 410, and the conductive layer 440. That is, the conductive layer 440 may function as a discharge path for discharging static electricity flowing into the display panel 100 and / or the cover panel 300 to the outside before being assembled with the kit. Therefore, it is possible to prevent or reduce changes in the element characteristics of the transistor in the display panel 100 due to static electricity flowing into the display panel 100 before being assembled with the kit. Therefore, the reliability of the display panel 100, the display module DM″, and the electronic device may be improved.

[0131] Although certain embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the concept of the present invention is not limited to such embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that are apparent to those of ordinary skill in the art.

Claims

1. A display module, wherein: The display module comprises: A display panel including a plurality of pixels; a cover panel disposed below the display panel and including a shielding layer including metal; and A protective film is disposed below the cover panel and comprises: a conductive adhesive layer, disposed below the shielding layer and having conductivity; a protective layer disposed under the conductive adhesive layer and including a recessed portion exposing a portion of the conductive adhesive layer; and A protruding member is disposed below the conductive adhesive layer having conductivity and includes a first portion overlapping the portion of the conductive adhesive layer exposed by the recessed portion of the protective layer and a second portion extending from the first portion in a first direction.

2. The display module according to claim 1, wherein: The conductive adhesive layer contacts a lower surface of the shielding layer, an upper surface of the protection layer, and an upper surface of the first portion of the protruding member.

3. The display module according to claim 2, wherein: A first adhesion force between the lower surface of the shielding layer and the upper surface of the conductive adhesive layer is smaller than each of a second adhesion force between the lower surface of the conductive adhesive layer and the upper surface of the protective layer and a third adhesion force between the lower surface of the conductive adhesive layer and the upper surface of the first portion of the protruding member.

4. The display module according to claim 1, wherein: In the plan view, The first portion of the protruding member overlaps the shielding layer, and The second portion of the protruding member protrudes from the shielding layer in the first direction.

5. The display module according to claim 1, wherein: The recessed portion of the protective layer is recessed from an outer edge of the protective layer in a direction opposite to the first direction.

6. The display module according to claim 1, wherein: The conductive adhesive layer has a planar shape overlapping with a planar shape of the shielding layer.

7. The display module according to claim 1, wherein: The protruding member and the shielding layer include the same material.

8. The display module according to claim 1, wherein: The shielding layer includes a main body portion and at least one static electricity induction pattern portion.

9. The display module according to claim 1, wherein: The shielding layer comprises: First floor; a second layer disposed below the first layer, electrically connected to the first layer, and comprising at least one static electricity induction pattern portion; and The adhesive layer is disposed between the first layer and the second layer.

10. The display module according to claim 1, wherein: The cover panel also includes: impact absorbing layers, including padding; and The heat dissipation layer is arranged between the impact absorbing layer and the shielding layer.

11. A display module, wherein: The display module comprises: A display panel including a plurality of pixels; a cover panel disposed below the display panel and including a shielding layer including a metal and including a first protrusion protruding in a first direction; and A protective film is disposed below the cover panel and comprises: an adhesive layer disposed below the shielding layer; and A protective layer is disposed under the adhesive layer and includes a second protrusion portion that protrudes in the first direction, overlaps with the first protrusion portion, and has a size smaller than that of the first protrusion portion.

12. The display module according to claim 11, wherein: The adhesive layer contacts the lower surface of the shielding layer and the upper surface of the protective layer, and The adhesive layer exposes each of the first protrusion and the second protrusion.

13. The display module according to claim 12, wherein: The first protrusion includes a first portion overlapping the second protrusion and a second portion positioned outside the first portion.

14. The display module according to claim 13, wherein: The second protrusion exposes the second portion of the first protrusion.

15. The display module according to claim 12, wherein: An adhesive force between the lower surface of the shielding layer and the upper surface of the adhesive layer is smaller than an adhesive force between the lower surface of the adhesive layer and the upper surface of the protective layer.

16. The display module according to claim 11, wherein: The first protrusion protrudes from the main body portion of the shielding layer in the first direction, and The shielding layer has at least one groove formed between the body portion and the first protrusion.

17. A display module, wherein: The display module comprises: A display panel including a plurality of pixels; a cover panel disposed below the display panel and including a shielding layer including metal; and A protective film is disposed below the cover panel and comprises: a conductive adhesive layer, disposed below the shielding layer; a protective layer disposed below the conductive adhesive layer and including a main body portion having an opening and a protrusion protruding from the main body portion in a first direction; and A conductive layer is disposed below the conductive adhesive layer and positioned within the opening of the main body portion of the protective layer, and has conductivity.

18. The display module according to claim 17, wherein: The conductive adhesive layer contacts a lower surface of the shielding layer, an upper surface of the protection layer, and an upper surface of the conductive layer.

19. The display module according to claim 18, wherein: The adhesion between the lower surface of the shielding layer and the upper surface of the conductive adhesive layer is smaller than each of the adhesion between the lower surface of the conductive adhesive layer and the upper surface of the protective layer and the adhesion between the lower surface of the conductive adhesive layer and the upper surface of the conductive layer.

20. The display module according to claim 17, wherein: The conductive layer is a single-sided conductive tape having an upper surface with adhesive properties, the upper surface of the single-sided conductive tape contacting the conductive adhesive layer.

Images