Test socket assembly for semiconductor integrated circuits with gaseous fluid cooling

Abstract

A receptacle assembly for a semiconductor integrated circuit chip is provided. The receptacle assembly includes a receptacle frame including a frame body defining a frame opening sized to receive a chip. The receptacle assembly also includes a receptacle cartridge including a cartridge body defining a plurality of cavities, each cavity sized to receive a test probe therein. The receptacle assembly also includes a manifold assembly including a manifold defining a channel extending within the manifold, a manifold inlet connected with the manifold and sized to receive a gaseous cooling fluid, and a manifold outlet connected with the manifold and defining an aperture in fluid communication with the channel and the frame opening. The receptacle assembly defines a receptacle outlet in fluid communication with the frame opening, and the receptacle assembly defines a fluid path between the manifold inlet and the receptacle outlet.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Application Serial No. 63 / 396,389, filed on August 9, 2022, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The field of the present disclosure relates generally to a test socket for a semiconductor integrated circuit, and more particularly to a test system having a test socket assembly for testing a semiconductor integrated circuit (IC) chip, wherein the test system is cooled by a gaseous fluid. Background Art

[0004] Semiconductor integrated circuit (IC) chips are produced in various packages or chip configurations and are produced in large quantities. The production of IC chips usually includes testing the IC chips in a manner that simulates the application of these IC chips by end users. One way to test IC chips is to connect each IC chip to a printed circuit board (PCB) or a load board through a test socket assembly, and the printed circuit board or load board performs various functions of the IC chip. The test socket assembly can be reused to test many IC chips.

[0005] The operation of a test socket assembly can generate a significant amount of heat. Furthermore, known test socket assemblies may have shortcomings in reducing heat generation. Therefore, improvements in cooling test socket assemblies are needed. Summary of the invention

[0006] In one aspect, a socket assembly for a semiconductor integrated circuit (IC) chip is provided. The socket assembly includes a socket frame, the socket frame includes a frame body defining a frame opening, the size of the frame opening is designed to receive a semiconductor IC chip. The socket assembly also includes a socket box, the socket box includes a box body, the box body defines a plurality of cavities, each cavity is sized to accommodate a test probe therein, the socket frame covers a portion of the socket box, and exposes a plurality of cavities at the frame opening. The socket assembly also includes a manifold assembly, the manifold assembly includes a manifold defining a channel extending within the manifold, a manifold inlet connected to the manifold and sized to receive a gaseous cooling fluid, and a manifold outlet connected to the manifold and defining a hole in fluid communication with the channel and the frame opening. The socket assembly defines a socket outlet in fluid communication with the frame opening, and the socket assembly defines a fluid path between the manifold inlet and the socket outlet.

[0007] In another aspect, a manifold assembly for a socket assembly for a semiconductor IC chip is provided. The manifold assembly includes a manifold defining a channel extending within the manifold, a manifold inlet connected to the manifold and sized to receive a gaseous cooling fluid, and a manifold outlet connected to the manifold and including an aperture in fluid communication with the channel and an exterior of the manifold assembly.

[0008] On the other hand, a method for assembling a socket assembly for a semiconductor IC chip is provided. The method includes forming a socket frame, the socket frame includes a frame body defining a frame opening, the size of the frame opening is designed to receive a semiconductor IC chip, the socket frame is defined with a frame inlet extending through the socket frame, and the frame inlet is fluidly connected to the frame opening. The method also includes forming a socket box and forming a manifold assembly, the socket box includes a box body defining a plurality of cavities, and the size of each cavity is set to receive a test probe therein. The manifold assembly includes a manifold defining a channel extending in the manifold, a manifold inlet connected to the manifold and sized to receive a gaseous cooling fluid, and a manifold outlet connected to the manifold and including a hole in fluid communication with the channel. The method also includes coupling the manifold assembly to the socket frame by aligning the manifold outlet with the frame inlet so that the manifold outlet and the frame inlet are fluidly connected to each other. In addition, the method includes mounting the socket frame on the socket box by covering a portion of the socket box with the socket frame and exposing the plurality of cavities at the frame opening. The socket assembly defines a socket outlet in fluid communication with a frame opening of the socket frame and defines a fluid path between the manifold inlet and the socket outlet. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is an exploded schematic diagram of an exemplary test system;

[0010] Figure 2A yes Figure 1 A top perspective view of an exemplary socket assembly in a test system is shown;

[0011] Figure 2B yes Figure 2A a bottom perspective view of the illustrated socket assembly;

[0012] Figure 2C yes Figure 2A an exploded view of the socket assembly shown;

[0013] Figure 2D is along Figure 2A The section line marked in 2D-2D section Figure 2A a perspective view of a cross-section of the socket assembly shown;

[0014] Figure 2E yes Figure 2A a partially transparent perspective view of a manifold assembly of the illustrated socket assembly;

[0015] Figure 2F is along Figure 2A The section line marked in the figure is 2F-2F. Figure 2A A cross-sectional view of the socket assembly shown;

[0016] Figure 2G yes Figure 2F an enlarged view of a portion of the socket assembly shown;

[0017] Figure 3A An overview of the fluid flow is shown;

[0018] Figure 3B shows the fluid flow path; and

[0019] Figure 4 Yes Assembly Figure 1-2G A flow chart of a method of a socket assembly is shown. DETAILED DESCRIPTION

[0020] The present disclosure includes a test socket assembly and method of using a gaseous cooling fluid to improve heat transfer for a test system of a semiconductor integrated circuit (IC) chip and socket assembly.

[0021] Consumer demand for next-generation technologies, such as high-speed gaming, computer graphics, the Internet of Things (IoT), 5G, artificial intelligence (AI), deep learning, vehicle-to-vehicle communications, and autonomous vehicles, has created a need for high-speed data transmission and processing technologies. High reliability testing is essential for such high-speed, multi-functional devices.

[0022] When testing IC chips, an essential component of a test system capable of testing IC chips is a test socket assembly for IC chips, which can be reused multiple times to test a large number of IC chips. The test socket assembly electrically and mechanically connects the IC chip to a printed circuit board (PCB) or a load board. The extent to which the test socket assembly can be reused is quantified by how many "cycles" the test socket assembly can withstand without performance (e.g., signal performance) being reduced. Each time an IC chip is inserted or set into a test socket assembly is called a cycle. Typically, over the course of many cycles, the electrical and mechanical properties of the structure and contacts of the test socket assembly begin to degrade. One reason for the degradation is the repeated heating and deformation of the test socket assembly caused by the heat generated by the IC chip (especially a high-performance IC chip) during the test. This degradation ultimately affects the integrity of the test itself, and at this point, the test socket assembly reaches the end of its service life.

[0023] Figure 11 is an exploded schematic diagram of an exemplary test system 100 including an exemplary socket assembly 102, a semiconductor IC chip 104 and a PCB 106. The IC chip 104 is to be tested with the test system 100. The PCB 106 includes a test circuit. The socket assembly 102 provides electrical and mechanical connections between the IC chip 104 and the PCB 106. The test system 100 also includes a plurality of probes 108. The probes 108 may include a ground probe 108-g, a signal probe 108-s and a power probe 108-p. The probes 108 are placed in the socket assembly 102 and are used to establish an electrical connection between the IC chip 104 and the PCB 106. Specifically, the ground probe 108-g is grounded. The signal probe 108-s transmits a signal between the IC chip 104 and the PCB 106. The power probe 108-p is configured to be connected to a power supply. Power, grounding and signals are provided from the PCB board 106 to the IC chip 104 through the probes 108.

[0024] In operation, the socket assembly 102 is mounted on the PCB. To test the IC chip 104, the IC chip 104 is received in the socket assembly 102 and placed in the test system 100.

[0025] The socket assembly 102 is used as a reusable interface for connecting many IC chips 104 to the PCB 106. The high performance (e.g., high speed) of the IC chip 104 can generate a large amount of heat. For example, the rate of heat transferred by a 63 millimeter (mm)×95 mm IC chip can reach 1.2 kilowatts (kW). However, the socket assembly 102 is generally required to maintain high reliability without being adversely affected or overheated by the heat generated by the IC chip 104 during testing.

[0026] Conventional socket frames for socket assemblies are made of plastic, non-heat-conducting materials. In this solution, the IC chip is cooled by heat transfer from a heat sink that contacts the top surface of the IC chip (i.e., the surface of the IC chip facing away from the test socket assembly). This cooling mechanism effectively removes heat from the top surface of the IC chip. However, as the performance of the IC chip increases, the heat generated increases sharply from the 100 watt (W) level to 200W, 300W, or even 900W or higher levels. In addition, in the case where the contact points between the IC chip and the test socket assembly (e.g., the contact points between the IC chip and the probe) generate high heat, additional problems will be brought about. The high heat at the contact point is on the bottom side of the IC chip, which is the surface opposite to the top surface of the IC chip and facing the test socket assembly. The heat sink placed on the top surface of the IC chip may not be enough to dissipate the high heat generated at the contact point, or has increased difficulty in dissipating the high heat generated at the contact point. Therefore, efficiently and effectively dissipating so much heat is a relatively new problem in reliably testing high-performance IC chips.

[0027] The high heat generated at the contact points reduces the performance and life of the test socket assembly. As the socket assembly 102 is repeatedly used to test many IC chips 104, the large amount of heat may deform the socket assembly, affect the electrical performance of the conventional test system, and cause the system to be unable to transmit high-frequency signals. As a result, the conventional test system may have a limited life and unsatisfactory performance, especially for high-frequency signals.

[0028] The systems and assemblies described herein provide a solution to the problem of dissipating heat from high performance IC chips during testing to ensure test quality and extend the life of the test system. The socket assembly disclosed herein is intended to keep the test socket assembly cooled by using a gaseous cooling fluid to carry away heat from the contact points between the test socket assembly and the IC chip, thereby increasing the life of the test socket, reducing maintenance, and ultimately reducing downtime of the test system. The gaseous cooling fluid is advantageous because the flow path is not limited to a predetermined fluid channel, and the gaseous cooling fluid can flow in contact with or close to the contact points.

[0029] Figure 2A-2G Various views of an exemplary receptacle assembly 102 are shown. Figure 2A is a top perspective view of the receptacle assembly 102 . Figure 2B is a bottom perspective view of the receptacle assembly 102 . Figure 2C is an exploded view of the socket assembly 102 , which also includes an enlarged view of the probe 108 . Figure 2D is along Figure 2A 2 is a perspective view of a cross-section of the receptacle assembly 102 taken along the section line 2D-2D marked in FIG. Figure 2E is a partially transparent perspective view of the manifold assembly 226 of the receptacle assembly 102 . Figure 2F It is along Figure 2A FIG. 2 is a cross-sectional view of the socket assembly 102 taken along the line labeled 2F-2F in FIG. 2 , wherein the IC chip 104 is placed in the socket assembly 102 . Figure 2G yes Figure 2F An enlarged view of a portion of the receptacle assembly 102 is shown.

[0030] In the exemplary embodiment, the receptacle assembly 102 includes a receptacle frame 202 and a receptacle housing 204. In the illustrated embodiment, the receptacle frame 202 and the receptacle housing 204 are separate components (see FIG. Figure 2C In some embodiments, the socket frame 202 and the socket box 204 are manufactured as a single piece (ie, only one piece). The single-piece socket assembly 102 can improve heat transfer through the socket frame 202 and the socket box 204 and simplify the manufacturing and assembly process.

[0031] In an exemplary embodiment, the socket frame 202 includes a frame body 201 ( Figure 2C). The frame body 201 defines a frame opening 203, which is sized to accommodate the IC chip 104 therein. The frame body 201 includes a frame frame 242 that defines the frame opening 203. The frame body 201 is metal or made of metal, such as but not limited to aluminum, magnesium, titanium, zirconium, copper, iron and / or their alloys, such as aluminum 5053. The metal frame body 201 can improve heat transfer. The socket frame 202 can also include an insulating layer 205 ( Figure 2A ). The insulating layer 205 of the socket frame 202 can be an anodic film, such as aluminum oxide, which is generated on metal by anodizing and is non-conductive. The insulating layer can be coated with a polytetrafluoroethylene (PTFE) coating. In some embodiments, the part of the frame body 201 does not include the insulating layer 205. For example, the side 207 of the frame body 201 facing the socket box 204 and cooperating therewith or a part of the side 207 does not have the insulating layer 205, which is achieved by removing the insulating layer 205, or has never been coated with the insulating layer 205. In the case where the side 207 does not have an insulating layer, the heat transfer between the socket frame 202 and other parts of the test system 100 (such as the socket box 204 and the IC chip 104) can be improved. The remaining surfaces of the socket frame 202 are coated with the insulating layer 205 to limit short circuits. In some embodiments, the frame body 201 is not metal, but is made of a non-metallic material or a non-metallic material, such as but not limited to plastic.

[0032] In an exemplary embodiment, the socket box 204 includes a box body 209 ( Figure 2C , Figure 2F and Figure 2G ). The box body 209 is metal or made of metal, such as but not limited to aluminum, magnesium, titanium, zirconium, copper, iron and / or alloys thereof. The metal box body 209 improves heat transfer. The box body 209 and the frame body 201 can be made of different types of metals or alloys. The box body 209 defines a plurality of cavities 206 ( Figure 2G ). Each cavity 206 is sized to accommodate a probe 108 therein. The cavity 206 may be a ground cavity 206 configured to receive a ground probe 108-g therein (see Figure 1 The cavity 206 may be a signal cavity 206 configured to receive a signal probe 108-s therein. The cavity 206 may also be a power cavity 206 configured to receive a power probe 108-p therein. The socket box 204 includes an insulating layer 211 ( Figure 2G). The insulating layer 211 can be an anodic film, such as aluminum oxide, which is produced on metal by an anodizing process and is non-conductive. The insulating layer can be coated with a PTFE coating. The insulating layer 211 limits the probes 108 from contacting each other to avoid electrical short circuits, and limits the probes 108 from contacting the metal socket box 204. In some embodiments, the ground cavity 206 does not have an insulating layer 211 and / or has a conductive material such as gold, copper, nickel, or another conductive material that is not easily oxidized applied to the surface of the ground cavity 206, so that oxidation between the ground probe 108-g and the box body 209 is prevented. In this way, the electrical performance and thermal conductivity of the test system 100 can be improved. In some embodiments, the signal probe 108-s includes an insulating ring 110 (see Figure 1 ). The signal cavity 206 may not include the insulating layer 211, which also improves the thermal performance of the test system 100, and the signal probe 108-s is not electrically connected to the socket box 204. In other embodiments, the side 210 ( Figure 2C ) does not have the insulating layer 211, thereby improving the thermal performance of the test system 100. When the socket box 204 is assembled with the socket frame 202, the side 210 of the socket box frame 204 and the side 207 of the socket frame 202 face each other. In some embodiments, thermal grease or thermal paste (not shown) can be applied to the side 207 of the socket frame 202, the side 210 of the socket box 204, or both. The thermal grease eliminates the air gap or space between the sides 207, 210 that creates thermal insulation, thereby helping to improve heat transfer and heat dissipation.

[0033] In the exemplary embodiment, the socket box 204 also includes a box bottom plate 213 ( Figure 2C and Figure 2F The cavity 206 is provided through the box bottom plate 213 so that the probe 108 is placed in the cavity 206 and electrically connected to the PCB board 106. The cavity 206 for the signal probe 108-s includes an insulating material similar to that of the insulating ring 110.

[0034] In some embodiments, the box body 209 and / or the box bottom plate 213 are made of non-metallic materials, such as but not limited to plastic. Using a non-metallic box body and / or box bottom plate provides improved electrical insulation.

[0035] To assemble the socket assembly 102, the socket frame 202 is placed on the socket box 204 so that the cavity 206 of the socket box 204 is exposed from the frame opening 203 of the socket frame 202, so that the probe 108 is placed in the cavity 206, and the IC chip 104 is placed in the frame opening 203 and electrically connected to the probe 108. The socket frame 202 and the socket box 204 can be connected together using one or more fasteners 224 (e.g., screws, nuts, or bolts).

[0036] By applying the metal socket frame body 201 and the metal box body 209 and the improved heat transfer mechanism as described above, the socket frame 202 and the socket box 204 may still not enable sufficient dissipation of a large amount of heat generated by the operation of the high-performance IC chip 104 during testing, especially the high heat generated at the contact point between the IC chip 104 and the probe 108. The additional heat sink attached to the IC chip 104 or the socket assembly 102 in the conventional technology may also not be able to effectively dissipate the high heat generated at the contact point. The high heat generated at the contact point that is not dissipated will reduce the performance of the socket assembly 102 and shorten its life.

[0037] The socket assembly disclosed herein incorporates fluid cooling to dissipate high heat. In an exemplary embodiment, the socket assembly 102 also includes a manifold assembly 226 ( Figure 2E ). The manifold assembly 226 includes a manifold 228 that defines a passage 230 located within the manifold 228. The passage 230 is located within the manifold 228 and extends transversely through the manifold 228. The passage 230 can be formed by drilling into the manifold 228 starting from the outside of the manifold 228. The manifold assembly 226 can also include a plug 214 and / or an O-ring 232 to restrict fluid from flowing out of the drill port 216. Alternatively, the passage 230 can be formed in the manifold 228 during the manufacturing process of the manifold 228 by the manufacturing process of the manifold 228, such as deformation, molding, or casting. The manifold 228 can be made of a metal or non-metal material.

[0038] In the exemplary embodiment, the manifold assembly 226 also includes a manifold inlet 234 that is sized to receive the gaseous cooling fluid. In the illustrated embodiment, the manifold inlet 234 is connected to the manifold 228 at an angle to the passage 230. In some embodiments, the manifold inlet 234 is connected to the passage 230 along the longitudinal axis or length of the passage 230. The manifold inlet 234 can be connected to the manifold 228 by replacing the plug 214 and / or the O-ring 232 with the manifold inlet 234 at the location where the plug 214 and / or the O-ring 232 are located, thereby saving part costs and improving fluid flow. In some embodiments, the manifold inlet 234 is integrally formed or formed as a single piece with the manifold 228.

[0039] In an exemplary embodiment, the manifold assembly 226 also includes a manifold outlet 240. The manifold outlet 240 defines a hole 244. The manifold outlet 240 may define another hole sized to receive a fastener 246 therethrough to connect the manifold outlet 240 to the manifold 228. In some embodiments, the manifold outlet 240 may be integrally formed or formed as a single piece with the manifold 228. The manifold outlet 240 may also include an outlet ring 248 located at the end of the hole 244. The position of the outlet ring 248 at the end of the hole 244 may be adjusted to control the clearance area on the socket frame 202 or the area where the manifold assembly 226 is mounted on the socket assembly 102. The outlet ring 248 may be adjusted upward, downward, leftward, and / or rightward. The manifold outlet 240 may include a grid 250 located at the end of the hole 244 and inside the outlet ring 248. The grid 250 reduces the path area, thereby increasing the air pressure, so as to increase the distance covered by the cooling fluid. The grid 250 may be angled so that the spray pattern angle of the cooling fluid is increased so that the cooling fluid covers a larger area. The manifold assembly 226 may include a plurality of manifold outlets 240 distributed along the length of the passage 230 .

[0040] In operation, when the manifold inlet 234 and the manifold outlet 240 are connected to the manifold 228 , fluid flows from the manifold inlet 234 into the manifold assembly 226 , through the passage 230 , and out of the manifold assembly 226 via the manifold outlet 240 .

[0041] In an exemplary embodiment, the receptacle frame 202 of the receptacle assembly 102 includes a frame entry 212. The frame entry 212 may be a channel (eg, a channel) defined within the frame border 242 of the receptacle frame 202. Figure 2D , see also the later described Figure 3A and Figure 3B ). The frame entrance 212 is positioned in the interior of the frame body 201 and is positioned transversely through the frame body 201. The frame entrance 212 can be at an angle to the frame border 242 and angled toward the corner 251 of the frame opening 203. The frame entrance 212 in the socket frame 202 can be formed by drilling into the socket frame 202 starting from the outside of the socket frame 202. Alternatively, the frame entrance 212 can be formed in the frame body 201 during the manufacture of the frame body 201 by a manufacturing process such as deformation or casting. The socket frame 202 and the socket box 204 can define a socket outlet 252. The socket outlet 252 can be a gap between the socket frame 202 and the socket box 204. The socket outlet 252 can be located at multiple locations of the socket assembly 102.

[0042] In operation, the manifold assembly 226 is connected to the socket frame 202 via fasteners 254 so that the manifold outlet 240 is in fluid communication with the frame inlet 212. Fluid flows from the manifold assembly 226 through the manifold outlet to the frame inlet 212 and into the frame opening 203, cooling the IC chip 104 positioned therein. In the illustrated embodiment, the manifold assembly 226 is positioned along the frame border 242 of the socket frame 202. The manifold assembly 226 can be positioned above or below the frame border 242 of the socket frame 202. In some embodiments, the manifold assembly 226 can be connected to the socket assembly 102 at other portions of the socket assembly, such as at a cover frame or docking plate of the socket assembly.

[0043] The flow rate of the cooling fluid is determined by the cooling needs of the test system 100 and can be adjusted by a cooling system (not shown) connected to the manifold inlet 234. The cooling fluid is gaseous. Exemplary cooling fluids are dry air or dehumidified air, vaporized dry ice, or vaporized liquid nitrogen. It is advantageous to use vaporized dry ice or vaporized liquid nitrogen because it has a lower temperature than dry air. In operation, vaporized dry ice or vaporized liquid nitrogen can be circulated from solid dry ice or liquid nitrogen to the test system 100 via the cooling system.

[0044] In operation, the socket assembly 102 is connected to the cooling system through the manifold inlet 234. The cooling system pumps a cooling fluid into and cools the socket assembly 102 and the test system 100. The cooling fluid takes away heat from the test system 100. In some embodiments, the frame body 201 of the socket frame 202 and the box body 209 of the socket box 204 are metal and thermally conductive. The heat generated from the IC chip 104, the probe 108, and the PCB 106 is transferred to the socket frame 202 and the socket box 204, and then the heat is transferred out by the cooling fluid circulating in the fluid path.

[0045] When the socket frame 202 and / or the socket box 204 are made of non-metallic materials, the systems and assemblies described herein can be used to effectively dissipate the heat generated in testing high-performance IC chips. Although non-metallic materials have much lower thermal conductivity than metallic materials, the gaseous fluid flows near or in contact with the contact points between the IC chip 104 and the socket box 204 and other components in the test system 100, thereby carrying heat away from the IC chip 104 and the socket assembly 102.

[0046] Thus, heat is effectively dissipated and the performance of the IC chip 104 and socket assembly 102 remain consistent and unaffected by extensive heat and repeated use.

[0047] The manifold assembly 226 described herein can be retrofitted to an existing test system 100 or receptacle assembly 102 by connecting the manifold assembly 226 to other components of the receptacle assembly 102 or test system 100. For example, a frame inlet 212 can be drilled into the frame rim 242 of the receptacle assembly 102, and the manifold assembly 226 can be connected to the receptacle frame 202 so that the manifold assembly 226 is in fluid communication with the receptacle frame 202 at the frame inlet 212. Alternatively, the manifold assembly 226 can be mounted on other components of the test system 100, such as a cover frame or docking plate, for cooling fluid to flow into the frame opening 203. Improved heat dissipation is provided by retrofitting, saving component and manufacturing costs.

[0048] Figure 3A and Figure 3B Fluid flow within the socket assembly 102 is shown. Figure 3A A fluid flow profile 302 is shown. Figure 3B A fluid path 304 is shown. The fluid flow profile 302 and fluid path 304 are based on simulation data. In the fluid flow profile 302, lighter lines represent lower temperatures. As shown, a cooling fluid 306 flows from the manifold inlet 234 into the manifold 228. The cooling fluid 306 then flows through the frame inlet 212 and into the frame opening 203. The cooling fluid 306 circulates around the IC chip 104 and cools the IC chip, exits the socket assembly 102 at the socket outlet 252, and removes heat from the IC chip 104 and the socket box 204. The cooling fluid 306 flows on and / or above the top surface of the socket box 204. The cooling fluid 306 may also flow between the socket box 204 and the box bottom plate 213 (see Figure 2C ) in the area between the frame inlets 212. The frame inlets 212 are angled toward the corners 251 of the frame opening 203 to cover the area around the IC chip. At least some of the frame inlets 212 are positioned near the corners 251. In operation, the parameters of the socket assembly 102 and the test system 100 can be adjusted based on the simulated fluid flow. For example, the center 308 of the frame opening 203 can have a reduced fluid flow based on the simulation. The pressure of the cooling fluid and / or the size of the manifold inlet 234 can be adjusted. The angle of the frame inlet 212 can also be adjusted. Additional frame inlets 212 can be included and positioned near the midpoint between adjacent corners 251 so that the cooling fluid is directed toward the center 308 of the frame opening 203. In the illustrated embodiment, two manifold assemblies 226 are positioned along two opposing frame borders 242 of the socket frame 202. The number, shape, and position of the manifold assemblies 226 can be adjusted. For example, the manifold assembly 226 may be curved, or multiple manifold assemblies may be used to surround the corner 251 of the frame opening 203 , such that the receptacle outlet 252 is open and in fluid communication with the exterior of the testing system 100 .

[0049] Figure 4 4 is a flowchart of an exemplary method 400 for assembling a socket assembly for an IC chip. The socket assembly may be the socket assembly 102 disclosed above. In this exemplary embodiment, the method 400 includes forming 402 a socket frame, the socket frame including a frame body defining a frame opening, the size of the frame opening being designed to accommodate an IC chip. The socket frame includes a frame inlet positioned to pass through the socket frame and located inside the socket frame, the frame inlet being in fluid communication with the frame opening. The method 400 also includes forming 404 a socket box, the socket box including a box body, the box body defining a plurality of cavities, each cavity being sized to receive a test probe therein. The method 400 also includes forming 406 a manifold assembly. The manifold assembly may be the manifold assembly 226 disclosed above. In addition, the method 400 includes connecting 408 the manifold assembly to the socket frame by aligning the manifold outlet with the frame inlet, so that the manifold outlet and the frame inlet are in fluid communication with each other. The method 400 also includes mounting 410 the socket frame on the socket box by covering a portion of the socket box and exposing a plurality of cavities at the opening.

[0050] Technical effects of the systems, apparatus, and methods described herein may include: (a) improving heat transfer in a test system for high performance IC chips using a gaseous cooling fluid; and, (b) an improved manifold assembly for improving heat dissipation in existing socket assemblies.

[0051] In the above description and the following claims, reference is made to a number of terms that have the following meanings.

[0052] As used herein, an element or step recited in the singular and preceded by the word "a" or "an" should be understood as not excluding plural elements or steps, unless such exclusion is explicitly recited. Furthermore, reference to "an exemplary embodiment" or "an embodiment" of the present disclosure is not intended to be interpreted as excluding the existence of additional implementations that also incorporate the recited features.

[0053] "Optional" or "optionally" means that the subsequently described event or circumstance can or cannot occur, and that the description includes instances where the event occurs and instances where it does not.

[0054] Approximate language as used herein throughout the specification and claims can be used to modify any quantitative representation that is permissible without causing a change in the basic function to which it is associated. Therefore, the value modified by one or more terms such as "approximately", "approximately" and "substantially" is not limited to the exact value specified. In at least some cases, approximate language may correspond to the accuracy of the instrument used to measure the value. Here, as well as throughout the specification and claims, range limitations may be combined or interchanged. Such a range is determined and includes all subranges contained therein, unless the context or language indicates otherwise.

[0055] Unless specifically stated otherwise, disjunctive language, such as the phrase "at least one of X, Y, or Z," is generally understood in context to state that an item, term, etc. may be X, Y, or Z, or any combination thereof (e.g., X, Y, and / or Z). Thus, such disjunctive language is generally not intended to, and should not, imply that certain embodiments require that at least one of X, at least one of Y, or at least one of Z each be present. Additionally, conjunctive language, such as the phrase "at least one of X, Y, and Z," should also be understood to mean X, Y, Z, or any combination thereof, including "X, Y, and / or Z," unless explicitly stated otherwise.

[0056] The systems and methods described herein are not limited to the specific embodiments described herein, but rather, components of the systems and / or steps of the methods may be utilized independently and separately from other components and / or steps described herein.

[0057] Although specific features of various embodiments of the present disclosure may be shown in some drawings and not in other drawings, this is only for convenience. According to the principles of the present disclosure, any feature of the drawings may be referenced and / or claimed in combination with any feature of any other drawings.

[0058] This written description uses examples to provide details about the present disclosure, including the best mode, and also enables those skilled in the art to implement the present disclosure, including making and using any device or system and performing any combined method. The patentable scope of the present disclosure is defined by the claims, and may include other examples that occur to those skilled in the art. These other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements that are not substantially different from the literal language of the claims.

Claims

1. A socket assembly for a semiconductor integrated circuit chip, the socket assembly comprising: a socket frame including a frame body defining a frame opening sized to receive a semiconductor IC chip; a socket box including a box body defining a plurality of cavities, each cavity being sized to receive a test probe therein, the socket frame covering a portion of the socket box, and the plurality of cavities being exposed at the frame opening; as well as, Manifold assembly, including: a manifold defining a passage extending within the manifold; a manifold inlet connected to the manifold and sized to receive a gaseous cooling fluid; and, a manifold outlet connected to the manifold and defining an aperture in fluid communication with the passage and the frame opening, The socket assembly defines a socket outlet in fluid communication with the frame opening, and the socket assembly defines a fluid path between the manifold inlet and the socket outlet.

2. The socket assembly according to claim 1, wherein: The socket frame defines a frame inlet extending therethrough, the frame inlet being in fluid communication with the frame opening, the manifold assembly being connected to the socket frame, and the aperture of the manifold outlet being in fluid communication with the frame inlet.

3. The socket assembly according to claim 2, wherein: The frame inlet is angled toward a corner of the frame opening.

4. The socket assembly according to claim 2, wherein: The frame entry is positioned proximate a corner of the frame opening.

5. The socket assembly according to claim 1, wherein: The gaseous cooling fluid is dehumidified air.

6. The socket assembly according to claim 1, wherein: The gaseous cooling fluid is gaseous dry ice and / or vaporized liquid nitrogen.

7. The socket assembly according to claim 1, wherein: The manifold inlet is located along the longitudinal axis of the channel.

8. The socket assembly according to claim 1, wherein: The manifold outlet also includes a grid positioned at the end of the aperture.

9. The socket assembly according to claim 1, wherein: The manifold outlet also includes an adjustable outlet ring positioned at the end of the bore.

10. A manifold assembly for a socket assembly of a semiconductor integrated circuit chip, the manifold assembly comprising: a manifold defining a passage extending within the manifold; a manifold inlet connected to the manifold and sized to receive a gaseous cooling fluid; as well as, A manifold outlet is connected to the manifold and includes an aperture in fluid communication with the passage and an exterior of the manifold assembly.

11. The manifold assembly of claim 10, wherein: The gaseous cooling fluid is dehumidified air, gas-phase dry ice and / or vaporized liquid nitrogen.

12. The manifold assembly of claim 10, wherein: The manifold outlet also includes a grid located at the end of the aperture.

13. The manifold assembly of claim 10, wherein: The manifold outlet also includes an adjustable ring located at the end of the aperture.

14. The manifold assembly of claim 10, wherein: The manifold inlet is positioned along the longitudinal axis of the channel.

15. A method of assembling a socket assembly for a semiconductor integrated circuit chip, the method comprising: forming a socket frame, the socket frame comprising a frame body defining a frame opening sized to receive a semiconductor IC chip, the socket frame defining a frame inlet extending through the socket frame, the frame inlet being in fluid communication with the frame opening; forming a socket box including a box body defining a plurality of cavities, each cavity being sized to receive a test probe therein; A manifold assembly is formed, the manifold assembly comprising: a manifold defining a passage extending within the manifold; a manifold inlet connected to the manifold and sized to receive a gaseous cooling fluid; and, a manifold outlet connected to the manifold and comprising an aperture in fluid communication with the passageway; connecting the manifold assembly to the receptacle frame by aligning the manifold outlet with the frame inlet so that the manifold outlet and the frame inlet are in fluid communication with each other; and, The socket frame is mounted on the socket box by covering a portion of the socket box with the socket frame and exposing the plurality of cavities at frame openings, The socket assembly defines a socket outlet in fluid communication with a frame opening of the socket frame, and defines a fluid path between the manifold inlet and the socket outlet.

16. The method according to claim 15, wherein: Forming the manifold assembly further includes positioning the manifold inlet along a longitudinal axis of the passage.

17. The method according to claim 15, wherein: Forming the receptacle frame further includes positioning the frame entry to be angled toward a corner of the frame opening.

18. The method according to claim 15, wherein: Forming the receptacle frame further includes positioning the frame entry proximate a corner of the frame opening.

19. The method according to claim 15, further comprising: simulating fluid flow in the socket assembly; as well as, Parameters of the socket assembly are optimized based on the simulated fluid flow.

20. The method according to claim 15, wherein: Forming a manifold assembly also includes forming the manifold assembly including a grid and / or an adjustable ring positioned at the ends of the apertures.

Images