Integrated circuit package, system including printed circuit board and integrated circuit package, method of soldering integrated circuit package to printed circuit board

Abstract

An integrated circuit package is provided having a package connector and at least three bottommost points of the package defining a base plane, where a shortest distance between the base plane and a package connector solder surface is at least 6 mils (0.152 mm). A printed circuit board including a pad; an integrated circuit package comprising a package connector and at least three bottommost points of the package in contact with the printed circuit board; and a solder post having a height of at least 6 mils (0.152 mm), the solder post electrically and mechanically connecting the pad to the packaged connector. A method for controlling the height of a weld column is disclosed.

Description

Technical Field

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 439,794, filed on January 18, 2023, the contents of which are hereby incorporated in their entirety. Technical Field

[0003] The present disclosure relates to integrated circuit packaging of microchips for printed circuit boards, and in particular to electrically connecting a package connector to a printed circuit board via a package connector that does not extend below a seating plane of the package. Background Art

[0004] Thermal cycling induced fatigue is a factor in lead failures in electronic devices in harsh environments (electric vehicles, aircraft and satellites). Traditionally, this problem has been handled by a number of technical constraints / workarounds during design: printed circuit board construction to reduce its thermal growth rate (extremely expensive PCB: copper-invar-copper); reducing temperature rise (conservative design, less than optimal electronic performance); complex cooling arrangements (larger volume and more costly); moving larger integrated circuit chips away from hot spots (complex electrical layout, less than optimal robustness and noise suppression); and avoiding the use of IC packages without lead pin package connectors (e.g., avoiding leadless chip carrier packages).

[0005] Solder connections fail due to thermal fatigue due to differences in thermal expansion. The component package may experience a small expansion, while the PCB may experience a relatively large expansion. Due to the difference in thermal expansion between the component package and the PCB, shear forces are induced in the solder. The shear forces induce stresses and strains within the solder material. The stresses and strains in the solder material are cyclic in nature due to cold / hot thermal cycles caused by environmental or equipment operating conditions. These cyclic stresses and strains induce cyclic fatigue of the solder material. Cyclic fatigue is particularly problematic when integrated circuit board packages are used in harsh thermal environments. The difference in thermal expansion causes the solder pad to bulge, or the solder column itself to crack and / or break.

[0006] Prior art integrated circuit (IC) packages have package connectors or terminals (commonly referred to as pins, pads or leads) that extend below the bottom of the integrated circuit component package so that when soldered, there is a gap between the bottom of the IC and the PCB, particularly for surface mounted devices. The base plane of the component package is typically defined by the lowest point of the package connector pins, which rest on the pads of the PCB. The component package has a gap between the bottom of the IC and the PCB, in which the base plane is located below the bottom of the IC. The standoff dimension is defined as the dimension between the base plane and the bottom of the IC. The component package has a positive standoff dimension.

[0007] Traditionally, when extended solder posts are desired in order to improve thermal cycle life, solder paste posts are placed on pads of a printed circuit board using a solder paste stencil. The thickness of the solder paste stencil (conventionally about 5 mils (0.127 mm)) defines the height of the solder paste posts on each pad. The integrated circuit package is then placed so that its package connector is located above the solder paste post, and the PCB, IC package, and solder paste post are heated until the solder paste post is melted and softened to allow the weight of the integrated circuit package to press their package connectors into the solder paste post, resulting in uneven solder post heights between package connectors, and in particular, a height that is much shorter than the solder post height defined by the solder paste stencil thickness (conventionally about 5 mils (0.127 mm)).

[0008] Unfortunately, due to the gap under the bottom of the IC, the solder height cannot be uniformly controlled, causing variability in thermal cycle life between production units, which is a quality issue. With the gap, the solder height cannot be easily and accurately raised or adjusted to increase thermal cycle life. The gap between the bottom of the IC and the PCB may reduce the effectiveness of the thermal cooling path of the IC unless additional thermally conductive material is added to fill the gap.

[0009] When extended solder columns are desired to control thermal cycle life, the solder between package connector pins, pads and leads on printed circuit boards has a traditional height of 5 mils (0.127 mm), however, as mentioned above, this height is not well controlled in practice.

[0010] There is a need for hardware implementations of integrated circuit board packages that are resistant to failure due to cyclic fatigue. Summary of the invention

[0011] Various aspects provide apparatus, systems and methods relating to an integrated circuit component package having a package connector soldering surface, an IC bottom, the IC bottom thereby defining a base plane of the package, wherein a shortest distance between the base plane and the package connector soldering surface is at least 6 mils (0.152 mm), 8 mils (0.203 mm) or 10 mils (0.254 mm) to apply a solder post height of at least 6 mils (0.152 mm), 8 mils (0.203 mm) or 10 mils (0.254 mm).

[0012] According to one aspect, an integrated circuit package is provided, comprising a package connector having a soldering surface and at least three bottommost points of the package defining a seating plane, wherein the shortest distance between the seating plane and the soldering surface of the package connector is at least 6 mils (0.152 mm).

[0013] In one aspect, a system is provided, comprising: a printed circuit board including a solder pad; an integrated circuit package including a package connector and at least three bottom-most points of the package that contact the printed circuit board; and a solder post having a height of at least 6 mils (0.152 mm) that electrically and mechanically connects the solder pad to the package connector.

[0014] According to one aspect, a method is provided, the method comprising: forming an integrated circuit package, the integrated circuit package comprising a package connector having a soldering surface and at least three bottom-most points of the package defining a base plane; positioning the integrated circuit package relative to a printed circuit board so that a shortest distance between a soldering surface of the package connector of the integrated circuit package and a solder pad of the printed circuit board is at least 6 mils (0.152 mm); and soldering the package connector to the solder pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings illustrate examples of apparatus, systems, and methods relating to integrated circuit board packages having package connectors that do not extend below a base plane of the package and have solder post heights thereby constrained to be uniformly at least 6 mils (0.152 mm), 8 mils (0.203 mm), or 10 mils (0.254 mm).

[0016] Figure 1 Shown is a top view of a printed circuit board with solder posts on pads.

[0017] Figure 2A , Figure 2B and Figure 2C A bottom perspective view, a bottom view, and a side view, respectively, of an integrated circuit package for applying solder post height via the shortest distance between the seating plane and the package connector are shown.

[0018] Figure 3 A side view of the package is shown positioned on a printed circuit board with solder posts connecting the package connectors to solder pads.

[0019] Figure 4A and Figure 4B A bottom view and a side view of a package having the shortest distance between the package connector and the seating surface are shown, respectively.

[0020] Figure 5 A side view of a package positioned on a printed circuit board is shown with a standoff spacer positioned between solder posts connecting the package connector to pads of the printed circuit board.

[0021] Fig. 6AThe package with the shortest distance between the package connector (leads) and the base surface is shown.

[0022] Figure 6B The package with the shortest distance between the package connectors (pins) and the seating surface is shown.

[0023] Figure 6C The package with the shortest distance between the package connector (pad) and the seating surface is shown.

[0024] Fig.6D The package with the shortest distance between the lowest solder surface of the package connector (leads) and the base surface is shown.

[0025] Figure 7 A table of cycles-to-failure data for packages with different solder post heights (solder thickness) is shown.

[0026] Figure 8 A method for controlling weld post height is shown.

[0027] 9A to 9D Shown are cross-sectional side views of a printed circuit board during successive steps of a solder post formation process using a solder stencil.

[0028] Reference numerals for any illustrated element that appear in multiple different figures have the same meaning in the multiple figures, and reference or discussion herein to any illustrated element in the context of any particular figure also applies to every other figure (if any) in which the same illustrated element is shown. DETAILED DESCRIPTION

[0029] Various aspects provide apparatus, systems and methods relating to an integrated circuit board package having a package connector and a base plane that constrains solder post height to be uniformly at least 6 mils (0.152 mm), 8 mils (0.203 mm) or 10 mils (0.254 mm).

[0030] The various aspects provided can be used for printed circuit board level implementation or to provide additional packaging options for integrated circuits for high reliability applications. Other aspects increase the fatigue life of integrated circuit products, reduce design constraints, and reduce the variation of fatigue life, improving the quality of integrated circuit products or products using integrated circuits.

[0031] According to one aspect, the integrated circuit package is configured to control the solder height when mounted on a printed circuit board, and further provide a higher solder height than the conventional solder height by configuring the package connector to be at least 6 mils (0.152 mm) away from the package base plane. A solder paste template can be used to set a solder paste column on a pad of the printed circuit board. The thickness of the solder paste template can be greater than about 6 mils (0.152 mm) to limit the height of the solder paste column on each pad. Then, the integrated circuit package can be placed with its base plane on the PCB base surface so that the package connector welding surface is above the solder paste column. The IC package, PCB and solder paste column can be heated until the solder paste column melts and softens to allow the package connector welding surface to be welded with the solder paste column. Since the base plane of the IC package is located on the base surface of the PCB, there is no gap in between, so the weight of the IC package may not press the package connector into the molten solder to deform or shorten the solder paste column, so that a uniform solder column of at least 6 mils (0.152 mm) can always be obtained.

[0032] Hardware implementation improvements may be made to improve thermal cycling fatigue life by adding additional solder post heights above traditional values. Traditional fixture dimensions may be increased to add additional solder post heights. Additional gap material may be added under the integrated circuit package to increase and uniformly / constantly / tightly control solder post heights under the package connector. Integrated circuit package features may be added for high reliability integrated circuit (HiRel IC) packages to control chip mounting at a higher height relative to the printed circuit board. A solder post height of at least 6 mils (0.152 mm), 8 mils (0.203 mm), or 10 mils (0.254 mm) may increase fatigue life by allowing more thermal cycles, and may reduce variation in cycles before failure and improve mass production quality.

[0033] The integrated circuit package can be any type of package, and the package connector can be any type. For example, the package can be a surface mount package, a chip carrier package, or a flat package having a pad package connector for connecting to a pad on a printed circuit board via a solder ball or solder post. The package can be a pin grid array package with a pin package connector. The package can be a ball grid array package with a pad package connector. Other packages and package connectors can also be used.

[0034] Figure 1A top view of a printed circuit board 110 is shown with solder posts 120 located on pads 112 of the printed circuit board 110. The pads 112 on the printed circuit board 110 are flush with the surface of the package located on the printed circuit board 110. The solder post height may be at least 6 mils (0.152 mm), 8 mils (0.203 mm), or 10 mils (0.254 mm). A seating surface 114 is provided for placing the package on the printed circuit board 110.

[0035] Figure 2A , Figure 2B and Figure 2C A bottom perspective view, a bottom view, and a side view of package 130 are shown, respectively. Package 130 can be highly reliable because it has the ability to withstand many thermal cycles before failure. Package 130 has a bottom 132 having at least three bottom-most points 148 defining a seating plane 144. Package connectors 134 are positioned on sides 136, above seating plane 144. Each package connector 134 has a package connector soldering surface 133, wherein solder posts (see Figure 1 ) can be soldered to the package connector 134. Figure 2A 1 is a three-dimensional perspective bottom view showing the package connector recessed into the package. The shortest distance 146 is the distance between the lowest point of the package connector soldering surface 133 and the base plane 144. In one example, the lowest point of the package connector soldering surface 133 defines a connector plane 135 parallel to the base plane 144, where the shortest distance 146 is the distance between the planes. The package 130 may have a shortest distance 146 of at least 6 mils (0.152 mm), 8 mils (0.203 mm), or 10 mils (0.254 mm).

[0036] Figure 3 1 shows a side view of a system having a printed circuit board and an integrated circuit package. The package 130 has a bottom 132 having at least three bottom-most points 138 located on the base surface 114 of the printed circuit board 110 (see FIG. Figure 2A and Figure 2B). The package 130 has a package connector 134 extending from a side 136 thereof, showing a corresponding package connector soldering surface 133. The printed circuit board 110 has a pad 112 that is flush with the upper surface of the printed circuit 110. The shortest distance 146 is the distance between the package connector soldering surface 133 and the corresponding pad 112. In one example, the lowest point of the package connector soldering surface 133 defines a connector plane 135 parallel to the base plane 144, wherein the shortest distance 146 is between the planes. The soldering column 120 extends between the corresponding package connector soldering surface 133 of the corresponding package connector 134 and the corresponding pad 112. The height 122 of the soldering column 120 is the same as the length of the shortest distance 146. The package 130 may have a shortest distance 146 of at least 6 mils (0.152 mm), 8 mils (0.203 mm), or 10 mils (0.254 mm). The solder posts 120 may be manually formed between the package connector soldering surface 133 of the package connector 134 and the corresponding solder pads 112, or may be formed by masking the PCB with a solder template. 9A to 9D .

[0037] Figure 4A and Figure 4B A top view and a side view of a package 130 are shown, respectively, having a standoff spacer 140 for accommodating taller or longer solder posts. The illustrated package 130 is a leadless chip carrier (LCCC). The standoff spacer 140 may be attached to the bottom 132 of the package 130 before being placed on a printed circuit board. With the standoff spacer 140 attached to the bottom 132 of the package 130, the standoff spacer 140 has a bottom 142 that defines a seating plane 144. The distance between the lowest point of the package connector 134 and the seating plane 144 is a shortest distance 146. In one example, the lowest point of the package connector 134 (i.e., the package connector soldering surface 133) defines a connector plane 135 that is parallel to the seating plane 144, wherein the shortest distance 146 is between the connector plane 135 and the seating plane 144. When the package connector 134 is positioned over the pads 112 of the printed circuit board 110, the bottom 142 of the standoff spacer 140 is arranged to contact and rest on the printed circuit board. (See Figure 1 As indicated above, the shortest distance 146 is between the package connectors 134, that is, between the package connector soldering surface 133 of the package connector 134 and the package base plane 144, which corresponds to the solder post height 122. (See Figure 5). The solder posts 120 can connect the package connector 134 to the pads 112 of the printed circuit board 110 when the solder posts 120 are tall enough or have a sufficient height to fill the shortest distance 146 therebetween. To make the connection, the solder post height is at least equal to the shortest distance 146 between the package connector soldering surface 133 of the package connector 134 and the corresponding pad 112 of the printed circuit board 110 when the package 130 is on the printed circuit board 110.

[0038] Figure 5 A side view of a system having a printed circuit board and an integrated circuit package is shown, wherein a standoff spacer is located between the printed circuit board and the integrated circuit package. Standoff spacer 140 is located between printed circuit board 110 and integrated circuit package 130, wherein a bottom 132 of package 130 contacts standoff spacer 140, and at least three bottom-most points 148 of standoff spacer 140 (see FIG. Figure 4A ) contacts the base surface 114 of the printed circuit board 110. The package 130 has a package connector 134 extending from its side 136. The printed circuit board 110 has a pad 112 that is flush with the upper surface of the printed circuit 110. The shortest distance 146 is the distance between the package connector soldering surface 133 of the package connector 134 and the corresponding pad 112. The soldering column 120 extends between the corresponding package connector soldering surface 133 of the package connector 134 and the corresponding pad 112. The height 122 of the soldering column 120 is the same as the length of the shortest distance 146. The combination of the package 130 and the support spacer 140 can force the shortest distance 146 to be at least 6 mils (0.152 mm), 8 mils (0.203 mm), or 10 mils (0.254 mm). The soldering column 120 can be manually formed between the package connector 134 and the corresponding pad 112, or can be formed by masking the PCB with a soldering template. See 9A to 9D .

[0039] The package 130 has a bottom 132 that is elevated by a standoff spacer 140 for solder height control, wherein the standoff spacer 140 is attached to the bottom 132. The standoff spacer 140 may be attached to the bottom 132 of the package 130 prior to being positioned on the base surface 114 of the printed circuit board 110 (see Figure 1). With the standoff spacer 140 attached to the bottom 132 of the package 130, the standoff spacer 140 has a bottom 142 that defines a seating plane 144. The package 130 has a package connector 134 that has a corresponding package connector soldering surface 133 that does not extend through the seating plane 144 or does not extend below the seating plane and is a shortest distance 146 from the seating plane. When the package connector 134 is positioned over the pads 112 of the printed circuit board 110, the bottom 142 of the standoff spacer 140 is arranged to contact and be located on the printed circuit board. (See Figure 3 A). Since the pads 112 on the printed circuit board 110 are flush with the surface of the package on the printed circuit board 110, the pads 112 are positioned in the base plane 144 of the package 130 when the package 130 is on the printed circuit board 110. To form a connection between the pads 112 and the package connector 134, the solder column height is at least equal to the shortest distance 146 corresponding to the distance between the lower surface of the package connector soldering surface 133 of the package connector 134 and the top surface of the pads 112 of the printed circuit board 110 when the package 130 is on the printed circuit board 110.

[0040] Fig. 6A A side view of a package having a package connector 134 extending from a side 136 of the package 130 is shown. The package 130 can be highly reliable because it can provide resistance to thermal fatigue failure by inducing a higher solder height. The package 130 has a bottom 132 having at least three bottommost points defining a base plane 144. The three bottommost points can take the shape of a flat surface, two or more lines, three or more separate feet, or any positioning features of similar nature. The package connector 134 extends from the side 136 and has a welding surface 133 located above the base plane 144. The shortest distance 146 is the distance between the lowest point of the welding surface 133 of the package connector 134 and the base plane 144. The package 130 can have a shortest distance 146 of at least 6 mils (0.152 mm).

[0041] Package 130 provides a surface mount IC package option with a package connector 134 that is elevated above the bottom 132 of package 130 such that the corresponding soldering surface 133 of package connector 134 is a predefined and precisely controlled distance from the base plane 144. Solder height can be uniformly controlled, with the shortest distance 146 providing a dimensional reference constrained and defined by the contact surface between the package and the printed circuit board that does not move / deform during the soldering process (more uniform solder post height improves quality). When package 130 is located on the base surface of printed circuit board 110, the distance between the lowest soldering surface 133 of package connector 134 and the pad 112 on the printed circuit board corresponds to the shortest distance 146. Package 130 is firmly held in place on the printed circuit board to maintain the distance between package connector 134 and the pad 112 on printed circuit board 110 during the soldering process. Because the package 130 has a predetermined minimum distance 146, and the package is fully seated during the soldering process, the solder post height can be easily and accurately produced and is constrained to be at least as high as the predetermined minimum distance 146. The bottom 132 of the package 130 that directly contacts the printed circuit board can also improve thermal cooling of the integrated circuit within the package 130. By directly contacting the printed circuit board, the vibration modal frequency of the integrated circuit to the soldering subsystem can be increased.

[0042] Figure 6B A side view of a package having a package connector 134 extending from a side 136 of the package 130, which is a pin, is shown. The package 130 can be highly reliable because it can provide resistance to thermal fatigue failure by inducing a higher solder height. The package 130 has a bottom 132 having at least three bottommost points 138 defining a base plane 144 (see FIG. Figure 2B ). Package connector 134 extends from side 136 and has solder surface 133 located above seating plane 144. Shortest distance 146 is the distance between the lowest point of solder surface 133 of package connector 134 and seating plane 144. Package 130 may have shortest distance 146 of at least 6 mils (0.152 mm), 8 mils (0.203 mm), or 10 mils (0.254 mm).

[0043] Figure 6C A side view of a package having a package connector 134 extending from a side 136 of the package 130, the package connector being a solder pad, is shown. The package 130 can be highly reliable because it can provide resistance to thermal fatigue failure by inducing a higher solder height. The package 130 has a bottom 132 having at least three bottommost points 138 defining a base plane 144 (see FIG. Figure 2B). Package connector 134 extends from side 136 and has a soldering surface 133 located above seating plane 144. Shortest distance 146 is the distance between the lowest soldering surface 133 of package connector 134 and seating plane 144. Package 130 may have a shortest distance 146 of at least 6 mils (0.152 mm), 8 mils (0.203 mm), or 10 mils (0.254 mm).

[0044] Fig.6D A side view of a package is shown having a package connector 134 extending from a side 136 of the package 130, the package connector being a lead. The package 130 can be highly reliable because it can provide resistance to thermal fatigue failure by inducing a higher solder height. The package 130 has a bottom 132 having at least three bottommost points defining a seating plane 144 (see FIG. Figure 2B ). The package connector 134 extends from the side 136 above the base plane 144 and has a soldering surface 133 for soldering to the solder paste column. The shortest distance 146 is the distance between the lowest soldering surface 133 and the base plane 144. In one example, the lowest soldering surface 133 can define a connection plane 135 parallel to the base plane 144, and the shortest distance 146 is the shortest distance between the planes. The package 130 can have a shortest distance 146 of at least 6 mils (0.152 mm), 8 mils (0.203 mm), or 10 mils (0.254 mm).

[0045] Various aspects can improve vibration and shock performance. In addition, by sharing the load via the contact between the bottom 132 and the base plane 144, the vibration stress experienced by the integrated circuit pins and solder can be reduced (the vibration and shock fatigue life of the electronic device is improved).

[0046] Aspects may provide an economical and easy way to increase thermal life of electronic devices, improve quality, and improve potential cost savings by removing additional design measures.

[0047] Various aspects provide a packaging option with a controlled height of the package connector relative to the bottom of the integrated circuit package. Structural features can be added to the bottom of any integrated circuit chip package as an integral part of the package so that when there is no free space between the package and its mounting location on a printed circuit board, the integrated circuit pins can be raised from the base plane, wherein the pin height is precisely and uniformly controlled.

[0048] Figure 7A data table showing the thermal fatigue life of solder for different solder column heights. Leadless chip carrier (LCCC) packages with different solder heights were cycled between -20°C and 70°C in two hours. The package connected to the printed circuit board with a solder height of 6 mils (0.152mm) withstands 129% more cycles before failure compared to the traditional solder height of 5 mils (0.127mm). The package connected to the printed circuit board with a solder height of 8 mils (0.203mm) withstands 196% more cycles before failure compared to the traditional solder height of 5 mils (0.127mm). The package connected to the printed circuit board with a solder height of 10 mils (0.254mm) withstands 277% more cycles before failure compared to the traditional solder height of 5 mils (0.127mm).

[0049] A method for precisely increasing and controlling the height of solder pillars beneath integrated circuit packages can improve thermal cycle fatigue life and quality consistency of the final product. The method includes: controlling the solder thickness on the PCB board; modifying the integrated circuit package to position the package connector at a predefined positive minimum distance from the base surface. Control of solder thickness can be achieved through manufacturing procedures such as adjusting the thickness of the solder paste template.

[0050] Figure 8 A method of controlling solder post height is shown. An integrated circuit package is formed 802, the integrated circuit package including a package connector having a soldering surface and at least three bottom-most points of the package defining a base plane. The integrated circuit package is positioned 804 relative to a printed circuit board such that the shortest distance between the soldering surface of the package connector of the integrated circuit package and a solder pad of the printed circuit board is at least 6 mils (0.152 mm). The package connector is soldered 806 to the solder pad.

[0051] 9A to 9D A cross-sectional side view of a printed circuit board is shown during successive steps in the solder post formation process. Fig. 9A A printed circuit board 110 having solder pads 112 is shown. Fig. 9B The printed circuit board 110 is shown with a solder paste stencil 160 positioned thereon, wherein patterned holes 162 in the solder paste stencil 160 are positioned at the pads 112. The solder paste stencil 160 has a thickness 124. Fig. 9C The printed circuit board 110 is shown with a solder paste stencil 160 , wherein a solder paste 166 is applied to the solder paste stencil 160 by a squeegee 164 , thereby pushing the solder paste 166 into the patterned holes 162 and into contact with the pads 112 . Fig.9DThe printed circuit board 110 is shown with the solder paste stencil 160 removed to leave the solder posts 120 on the pads 112, and the package 130 is positioned on the printed circuit board 110 with its package connector 134 located on the solder posts 120. The thickness 124 of the solder paste stencil 160 together with the package connector 134 can define the height 122 of the solder posts 120. The thickness 124 of the solder paste stencil 160 can be 6 mils (0.152 mm), 8 mils (0.203 mm), or 10 mils (0.254 mm) or any higher value. Covering the printed circuit board 110 with a solder paste stencil 160 having a thickness of at least 6 mils (0.152 mm) can facilitate positioning the integrated circuit package 130 relative to the printed circuit board 110 so that the shortest distance 146 (see FIG. 146 ) between the package connector 134 and the pads 112 is greater than or equal to the minimum distance 146 between the package connector 134 and the pads 112. Figure 3 ) is at least 6 mils (0.152 mm). In various aspects, when the package connector 134 is located on the solder post 120, the package 130 may or may not be in contact with the printed circuit board 110.

[0052] The aspects presented are applicable to any industry or application where electronic lifetime and reliability are an issue: electric vehicles, locomotives, aerospace or anywhere where integrated circuits themselves or ambient temperature fluctuations are high.

[0053] Although examples have been described above, other modifications and examples may be made in accordance with this disclosure without departing from the spirit and scope of these disclosed examples.

Claims

1. A device, comprising: An integrated circuit package includes a package connector having a soldering surface and at least three bottommost points of the package defining a seating plane, wherein the shortest distance between the seating plane and the package connector soldering surface is at least 6 mils (0.152 mm).

2. The apparatus of claim 1, wherein the shortest distance between the seating plane and the package connector soldering surface is at least 8 mils (0.203 mm).

3. The apparatus of claim 1, wherein the shortest distance between the seating plane and the package connector soldering surface is at least 10 mils (0.254 mm).

4. The apparatus of claim 1, claim 2 or claim 3, wherein the package connector is selected from the group consisting of pins, leads and pads.

5. The apparatus of claim 1, claim 2 or claim 3, comprising a standoff spacer attached to the integrated circuit package and comprising at least three bottom-most points defining a seating plane.

6. A system, comprising: A printed circuit board, the printed circuit board comprising a pad; an integrated circuit package including a package connector and at least three bottom-most points of the package that contact the printed circuit board; and A solder post having a height of at least 6 mils (0.152 mm) electrically and mechanically connects the solder pad to the package connector.

7. The system of claim 6, wherein the height of the weld post is at least 8 mils (0.203 mm).

8. The system of claim 6, wherein the height of the weld post is at least 10 mils (0.254 mm).

9. The system of claim 6, claim 7 or claim 8, wherein the package connector is selected from the group consisting of pins, leads and pads.

10. The system of claim 6, claim 7 or claim 8, comprising a standoff spacer between the printed circuit board and the integrated circuit package, wherein the at least three bottom-most points of the package are in contact with the standoff spacer, and the standoff spacer is in contact with the printed circuit board.

11. The system of claim 10, wherein the standoff spacer contacts both the printed circuit board and the integrated circuit package and has a thickness sufficient to ensure a minimum distance between the package connector and the pad is at least 6 mils (0.152 mm).

12. The system of claim 10, wherein the integrated circuit package has a bottom plane defined by at least three bottom-most points of the package, wherein a shortest distance between the bottom plane and the package connector is at least 6 mils (0.152 mm).

13. A method comprising: forming an integrated circuit package including a package connector having a soldering surface and at least three bottom-most points of the package defining a seating plane; Positioning the integrated circuit package relative to a printed circuit board so that the shortest distance between a package connector soldering surface of the integrated circuit package and a pad of the printed circuit board is at least 6 mils (0.152 mm); and The package connector is soldered to the pad.

14. The method according to claim 13, comprising: The printed circuit board is masked with a solder paste stencil having a thickness of at least 6 mils (0.152 mm).

15. The method of claim 14, wherein the thickness of the solder paste stencil facilitates a solder post having a height to span the shortest distance between a package connector soldering surface of the integrated circuit package and a pad of the printed circuit board.

16. A method according to claim 13 or claim 14, comprising: A standoff spacer is positioned between the integrated circuit package and the printed circuit board.

17. The method of claim 13, wherein the shortest distance between the package connector soldering surface and the pad is at least 8 mils (0.203 mm).

18. The method of claim 13, wherein the shortest distance between the package connector soldering surface and the pad is at least 10 mils (0.254 mm).

19. The method of claim 13 or claim 14, wherein the shortest distance between the seating plane and the package connector soldering surface is at least 6 mils (0.152 mm).

20. The method of claim 13 or claim 14, wherein soldering the package connector to the pad comprises: A solder post is formed, the solder post having a height of at least 6 mils (0.152 mm), the solder post electrically and mechanically connecting the solder pad to the package connector soldering surface.

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