A high-precision air-floating transfer mechanism and its control method

By adopting the design of the joint working of dual airfloat modules in the airfloat transport mechanism, the problem of the airfloat collapse during large load pressure is solved, and high-precision transport and stable and efficient production operation are achieved.

CN119742269BActive Publication Date: 2025-05-27CYG SEMICON EQUIP (ZHUHAI) CO LTD
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Patent Information

Application Number
CN202510246314.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-03-04
Publication Date
2025-05-27
Estimated Expiration
2045-03-04

AI Technical Summary

Technical Problem

When the existing conventional gas-floating transport mechanism bears a large pressure, the gas-floating layer is prone to collapse and cannot maintain a stable working state, which affects production efficiency.

Method used

A high-precision air-floating load transfer mechanism is designed, and the dual air-floating modules work together. The first air-floating module and the second air-floating module form an air film between the support table and the support plate to ensure the stability of the suspension of the load-bearing module. When faced with a large bonding force, the first air float module comes into contact with the support table to conduct pressure to avoid damage to the air float structure.

Benefits of technology

It effectively buffers and absorbs large pressure shocks during high-precision load transfer, isolates the damage of pressure to the fragile structure of air float, ensures stable and efficient operation of the equipment, and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application discloses a high-precision air-floating transfer mechanism and its control method, including: a support tabletop, a first transfer module, a second transfer module, a carrying module, and a control module; the first transfer module is arranged on the support tabletop; the second transfer module is connected to the movable part of the first transfer module; the carrying module includes a rotation module, a first support plate, a material loading plate, a first air-floating module, and a second air-floating module. A first avoidance hole is provided inside the first support plate, the first air-floating module is located inside the first avoidance hole, the rotation module is arranged on the first support plate, the material loading plate is simultaneously connected to the first air-floating module and the movable part of the rotation module, the first air-floating module is used to generate an air film between itself and the support tabletop, and the second air-floating module is arranged on the lower surface of the support tabletop and is used to generate an air film between the first support plate and the support tabletop; the control module is used to respectively control the working states of the first air-floating module and the second air-floating module. The present application can bear greater pressure.
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Description

Technical Field

[0001] The present application relates to the technical field of mechanical transportation, and particularly relates to a high-precision air-floating transfer mechanism and its control method. Background Art

[0002] At present, with the booming development of high-tech industries such as electronic manufacturing and semiconductor packaging, the high-precision transfer of micro-components has become a key link in determining product quality and production efficiency. As electronic products become increasingly powerful in function and more compact in structure, the sizes of chips and various precision electronic components are continuously shrinking, and the requirements for corresponding pin pitches and line accuracies are almost stringent. The accuracy standard of the transfer platform has even been raised to the micron or even nanometer level.

[0003] The air-floating transfer technology uses a gas film to lift the transfer platform, greatly reducing the frictional resistance during movement and providing a feasible path for high-precision transfer. Therefore, it has received wide attention and application in the industry. However, there is a thorny problem with existing conventional air-floating transfer mechanisms: once they need to bear a large pressure, the air-floating layer is extremely prone to collapse and cannot maintain a stable working state.

[0004] In the semiconductor packaging process, chip bonding is a very important step. When performing wire bonding, a certain bonding force needs to be applied to firmly connect the metal wire to the chip pins and the substrate pads. This bonding force can sometimes reach thousands of Newtons. In existing ordinary air-floating transfer platforms, the air-floating layer mainly relies on continuously introduced high-pressure gas to form an air cushion to support the upper structure. Its original design focus is on reducing friction to assist high-precision transfer, but it does not fully consider the problem of bearing large pressures. Once encountering a large bonding force, the fragile air-floating layer is instantly overloaded under pressure, the air cushion quickly collapses, and the originally suspended bearing platform loses balance and falls into an unstable state, thus affecting the overall production efficiency of the product. Summary of the Invention

[0005] The present application aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present application provides a high-precision air-floating transfer mechanism and its control method, which can bear a greater pressure.

[0006] In a first aspect, the present application provides a high-precision air-floating transfer mechanism, including:

[0007] A support tabletop;

[0008] A first transfer module, the fixed part of the first transfer module is arranged on the support tabletop;

[0009] A second transfer module, the fixed part of the second transfer module is connected to the movable part of the first transfer module;

[0010] A carrier module, the carrier module is located on the support tabletop and includes a rotation module, a first support plate, a material loading plate, a first air-floating module, and a second air-floating module. A first avoidance hole is provided in the first support plate, the first air-floating module is located in the first avoidance hole, the fixed part of the rotation module is arranged on the first support plate, the lower surface of the material loading plate is connected to both the first air-floating module and the movable part of the rotation module. The first air-floating module is used to generate an air film between itself and the support tabletop, and the second air-floating module is arranged on the lower surface of the support tabletop and is used to generate an air film between the first support plate and the support tabletop;

[0011] A control module, the control module is respectively connected to the first air-floating module and the second air-floating module, and is used to respectively control the working states of the first air-floating module and the second air-floating module.

[0012] The high-precision air-floating transfer mechanism according to the embodiments of the first aspect of the present application has at least the following beneficial effects: When the device is started, the control module synchronously sends start instructions to the second air-floating module and the first air-floating module to regulate their working states. After receiving the instructions, the second air-floating module quickly sprays high-pressure gas evenly into the corresponding area of the first support plate, efficiently forming a gas film with an appropriate thickness and strong stability. At the same time, the first air-floating module starts to operate in the first avoidance hole in the first support plate, stably outputs high-pressure air flow downward, and quickly constructs another gas film, cooperating with the second air-floating module to make the carrying module completely suspended above the support table, almost eliminating the influence of friction by virtue of the air cushion. In this ideal suspended state, the first transfer module and the second transfer module accurately drive the carrying module to linearly displace smoothly and smoothly in the X and Y directions according to the preset program and process requirements. During this period, the rotation module accurately adjusts the angle of the material loading plate according to the instructions to ensure that the complex and changeable processing and transfer orientation requirements are met. When the carrying module is transferred to the established working position and is about to face key processes such as chip bonding that require a large bonding force, the control module quickly responds according to the preset logic, accurately controls the first air-floating module to stop supplying gas and turn off the air-floating function, and the supporting force borne by it is immediately withdrawn. The first support plate in the carrying module together with the material loading plate falls steadily on the support table under the action of gravity. The support table can be made of marble with high rigidity and high load-bearing capacity, and has excellent compressive characteristics, providing a solid and reliable bearing foundation for the large bonding force to be applied subsequently. At the same time, the second air-floating module can flexibly adjust its working state according to the specific process requirements in the future. If small-range fine adjustment of the material loading plate is still required in the subsequent process to achieve higher-precision alignment, the second air-floating module maintains the gas film support to help the material loading plate adjust lightly and flexibly. In the transfer operation, the two air-floating modules cooperate tacitly to support the carrying module, isolate the friction interference by virtue of the air cushion, and ensure high-precision transfer. When facing the scenario of applying a large bonding force, the first air-floating module abuts against the support table, vertically conducts the pressure to the support table, and effectively buffers and absorbs the large-pressure impact through reasonable switching of the air-floating module, isolates the damage of the pressure to the fragile air-floating structure, stably maintains the transfer precision throughout the process, ensures the stable and efficient operation of the device, meets the requirements of complex production processes, and thus improves the production efficiency.

[0013] According to some embodiments of the first aspect of the present application, the carrying module further includes a second support plate, the second support plate is provided with a second avoidance hole at the position of the first avoidance hole, the first air-floating module is located in the first avoidance hole and the second avoidance hole, and the material loading plate is connected to the movable part of the rotation module through the second support plate.

[0014] According to some embodiments of the first aspect of the present application, flexible connection blocks are spaced apart at the edge of the second avoidance hole on the second support plate. One end of the flexible connection block is connected to the upper surface of the second support plate, and the other end is connected to the lower surface of the material carrying plate.

[0015] According to some embodiments of the first aspect of the present application, the rotation module includes a U-shaped groove arc motor, a first slide rail, and a first slider. The arc of the U-shaped groove arc motor and the first slide rail corresponds to the first avoidance hole. The fixed part of the U-shaped groove arc motor and the first slide rail are concentrically arranged on the first support plate with the first avoidance hole, the movable part of the U-shaped groove arc motor is connected to the lower surface of the second support plate, and the lower surface of the second support plate is also connected to the first slide rail through the first slider.

[0016] According to some embodiments of the first aspect of the present application, the rotation module further includes an induction sheet and a in-place sensor. The induction sheet is arranged on the lower surface of the second support plate, and the in-place sensor is arranged on the upper surface of the first support plate and located on the moving path of the induction sheet.

[0017] According to some embodiments of the first aspect of the present application, support vertical surfaces are provided on both sides of the support table surface. There are two first transfer modules. The fixed parts of the two first transfer modules are respectively arranged on the opposite sides of the support vertical surfaces, and the movable parts of the two first transfer modules move synchronously. The two ends of the fixed part of the second transfer module are respectively arranged on the movable parts of the two first transfer modules.

[0018] According to some embodiments of the first aspect of the present application, the first transfer module includes a first U-shaped groove linear motor, a first mounting block, a second slide rail, and a second slider. The first U-shaped groove linear motor is arranged on the support vertical surface. One side of the first mounting block is connected to the driving end of the first U-shaped groove linear motor. The second slide rail is arranged on the support table surface and is parallel to the first U-shaped groove linear motor. The lower surface of the first mounting block is connected to the second slide rail through the second slider, and the other side of the first mounting block is connected to the fixed part of the second transfer module.

[0019] According to some embodiments of the first aspect of the present application, the second transfer module includes a support block, a second U-shaped groove linear motor, a second mounting block, a third slide rail, and a third slider. Both ends of the support block are respectively connected to the two first mounting blocks. The second U-shaped groove linear motor is disposed on the side wall of the support block. The driving end of the second U-shaped groove linear motor is connected to the second mounting block. The third slide rail is disposed on the upper surface of the support block and is parallel to the second U-shaped groove linear motor. The second mounting block is connected to the third slide rail through the third slider, and the second mounting block is connected to the upper surface of the first support plate.

[0020] According to some embodiments of the first aspect of the present application, it further includes a support frame, and a plurality of shock isolation air bags are provided on the support frame. The support table is disposed on the support frame through the shock isolation air bags.

[0021] In a second aspect, the present application further provides a control method for a high-precision air-floating transfer mechanism, which is applied to the high-precision air-floating transfer mechanism according to any one of the embodiments of the first aspect. The control method includes:

[0022] In response to a first control instruction, the first air-floating module and the second air-floating module are turned on, so that an air film is formed between the first air-floating module, the first support plate, and the support table;

[0023] According to the first control instruction, control the first transfer module, the second transfer module, and the rotation module to change the position of the loading plate;

[0024] In response to a second control instruction, the second air-floating module is continuously turned on, and the first air-floating module is turned off, so that the first air-floating module contacts the support table, and an air film is formed between the first support plate and the support table.

[0025] The additional aspects and advantages of the present application will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The additional aspects and advantages of the present application will become obvious and easy to understand in conjunction with the following description of the embodiments with reference to the accompanying drawings, where:

[0027] Figure 1 is a schematic structural diagram of a high-precision air-floating transfer mechanism provided by an embodiment of the present application;

[0028] Figure 2 is a schematic structural diagram of a carrier module provided by an embodiment of the present application;

[0029] Figure 3Exploded schematic diagram of the carrier module provided by an embodiment of the present application;

[0030] Figure 4 Structural schematic diagram of the first transfer module provided by an embodiment of the present application;

[0031] Figure 5 Structural schematic diagram of the second transfer module provided by an embodiment of the present application;

[0032] Figure 6 Flow chart of the control method for the high-precision air-bearing transfer mechanism provided by an embodiment of the present application.

[0033] The reference numerals in the accompanying drawings are as follows:

[0034] Supporting tabletop 100; supporting vertical surface 110; first transfer module 200; first U-shaped groove linear motor 210; first mounting block 220; second slide rail 230; second slider 240; second transfer module 300; support block 310; second U-shaped groove linear motor 320; second mounting block 330; third slide rail 340; third slider 350; carrier module 400; U-shaped groove arc motor 411; first slide rail 412; first slider 413; induction sheet 414; in-place sensor 415; first support plate 420; first avoidance hole 421; material loading plate 430; first air-bearing module 440; second air-bearing module 450; second support plate 460; second avoidance hole 461; flexible connection block 462; support frame 500; shock isolation airbag 510. Detailed implementation manners

[0035] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.

[0036] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0037] In the description of the present application, if the first and second are described only for the purpose of distinguishing technical features, they should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence of the indicated technical features.

[0038] In the description of this application, unless otherwise clearly defined, terms such as "setting", "installation", "connection", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in this application in combination with the specific content of the technical solution.

[0039] In the current booming development of high-tech industries such as electronic manufacturing and semiconductor packaging, the high-precision transfer of micro-components has become a crucial link in determining product quality and production efficiency. As electronic products become increasingly powerful in function and more compact in structure, the sizes of chips and various precision electronic components are constantly shrinking, and the requirements for corresponding pin pitches and line accuracies are almost stringent. The accuracy standard of the transfer platform has even been raised to the micron or even nanometer level.

[0040] The air-floating transfer technology uses a gas film to lift the transfer platform, greatly reducing the frictional resistance during movement and providing a feasible path for high-precision transfer. Therefore, it has received wide attention and application in the industry. However, there is a thorny problem with existing conventional air-floating transfer mechanisms: once a large pressure needs to be borne, the air-floating layer is extremely prone to collapse and cannot maintain a stable working state.

[0041] In the semiconductor packaging process, chip bonding is a very important step. When performing wire bonding, a certain bonding force needs to be applied to firmly connect the metal wire to the chip pins and the substrate pads, and this bonding force can sometimes reach thousands of Newtons. For existing ordinary air-floating transfer platforms, the air-floating layer mainly relies on continuously introduced high-pressure gas to form an air cushion to support the upper structure. Its original design focus is on reducing friction to assist high-precision transfer, but it does not fully consider the problem of bearing large pressures. Once encountering a large bonding force, the fragile air-floating layer is instantly overloaded under pressure, the air cushion quickly collapses, and the originally suspended bearing platform loses balance and falls into an unstable state, thus affecting the production efficiency of the overall product.

[0042] Based on this, this application provides a high-precision air-floating transfer mechanism and its control method to solve the above-mentioned technical problems. The technical solutions of this application will be elaborated in detail one by one below.

[0043] In the first aspect, referring to Figures 1 to 3, this application provides a high-precision air-floating transfer mechanism, including: a support table 100, a first transfer module 200, a second transfer module 300, a carrying module 400 and a control module. The fixed part of the first transfer module 200 is arranged on the support table 100; the fixed part of the second transfer module 300 is connected to the movable part of the first transfer module 200; the carrying module 400 is located on the support table 100 and includes a rotation module, a first support plate 420, a material loading plate 430, a first air-floating module 440 and a second air-floating module 450. A first avoidance hole 421 is provided inside the first support plate 420, the first air-floating module 440 is located inside the first avoidance hole 421, the fixed part of the rotation module is arranged on the first support plate 420, the lower surface of the material loading plate 430 is simultaneously connected to the first air-floating module 440 and the movable part of the rotation module. The first air-floating module 440 is used to generate an air film between itself and the support table 100, and the second air-floating module 450 is arranged on the lower surface of the support table 100 and is used to generate an air film between the first support plate 420 and the support table 100; the control module is respectively connected to the first air-floating module 440 and the second air-floating module 450 and is used to respectively control the working states of the first air-floating module 440 and the second air-floating module 450.

[0044] When the device starts up, the control module synchronously sends startup instructions to the second air-floating module 450 and the first air-floating module 440 to regulate their working states. After receiving the instructions, the second air-floating module 450 quickly and evenly sprays high-pressure gas into the corresponding area of the first support plate 420 to efficiently form a gas film with an appropriate thickness and strong stability. At the same time, the first air-floating module 440 starts to operate in the first avoidance hole 421 in the first support plate 420, stably outputs high-pressure air flow downward, and quickly constructs another gas film, cooperating with the second air-floating module 450 to make the carrying module 400 completely suspended above the support table 100, almost eliminating the influence of friction by virtue of the air cushion. In this ideal suspended state, the first transfer module 200 and the second transfer module 300 accurately drive the carrying module 400 to linearly displace smoothly and smoothly along the X and Y directions according to the preset program and process requirements. During this period, the rotation module accurately adjusts the angle of the material loading plate 430 according to the instructions to ensure that the complex and changeable processing and transfer orientation requirements are met. When the carrying module 400 is transferred to the established working position and is about to face key processes such as chip bonding that require a large bonding force, the control module quickly responds according to the preset logic, accurately controls the first air-floating module 440 to stop supplying gas and turn off the air-floating function. The supporting force borne by it is immediately withdrawn, and the first support plate 420 in the carrying module 400 together with the material loading plate 430 fall steadily on the support table 100 under the action of gravity. The support table 100 can be made of marble with high rigidity and high load-bearing capacity, having excellent compressive characteristics, providing a stable and reliable bearing foundation for the large bonding force to be applied subsequently. At the same time, the second air-floating module 450 can flexibly adjust its working state according to the specific subsequent process requirements. If small-range fine-tuning of the material loading plate 430 is still required in the subsequent process to achieve higher-precision alignment, the second air-floating module 450 maintains the gas film support to assist the material loading plate 430 to adjust lightly and flexibly. In the transfer operation, the double air-floating modules cooperate tacitly to support the carrying module 400, isolate the friction interference by virtue of the air cushion, and ensure high-precision transfer. When facing the scenario of applying a large bonding force, the first air-floating module 440 abuts against the support table 100, vertically conducts the pressure to the support table 100, effectively buffers and absorbs the impact of the large pressure, isolates the damage of the pressure to the fragile air-floating structure, stably maintains the transfer precision throughout the process, ensures the stable and efficient operation of the device, meets the requirements of complex production processes, and thus improves the production efficiency.

[0045] Refer to Figure 2 and Figure 3It can be understood that the carrying module 400 further includes a second support plate 460. The second support plate 460 is provided with a second avoidance hole 461 at the position of the first avoidance hole 421. The first air-floating module 440 is located in the first avoidance hole 421 and the second avoidance hole 461. The material-carrying plate 430 is connected to the movable part of the rotating module through the second support plate 460. The addition of the second support plate 460 provides an additional support structure for the entire carrying module 400. When performing high-precision transfer operations or under certain external disturbances, the second support plate 460 can share the force transmitted from the material-carrying plate 430, playing a role in strengthening and stabilizing, so that the carrying module 400 can carry the material more stably, ensuring the normal operation of the equipment under complex working conditions. At the same time, when the rotating module drives the material-carrying plate 430 to adjust the angle, the force can be transmitted more smoothly through the second support plate 460, reducing the shaking or deviation caused by unreasonable connection structures. In this way, when fine-tuning the angle of the material, the rotation angle can be controlled more precisely, meeting the requirements of high-precision processing.

[0046] Referring to Figure 3 It can be understood that the second support plate 460 is provided with flexible connection blocks 462 at intervals at the edge of the second avoidance hole 461. One end of the flexible connection block 462 is connected to the upper surface of the second support plate 460, and the other end is connected to the lower surface of the material-carrying plate 430. During the operation of the equipment, the material-carrying plate 430 may be impacted due to sudden start-stop, acceleration-deceleration, or external vibration. The flexible connection blocks 462 play a role similar to shock absorption. They can absorb this impact energy and prevent the impact force from being directly transmitted to the second support plate 460 and other key components. In addition, due to inevitable dimensional errors in the manufacturing and assembly processes, or due to material fatigue and other reasons after long-term use of the equipment, resulting in slight deformations, the flexible connection blocks 462 can well adapt to these situations. These flexible connection blocks 462 can compensate for the position difference between the material-carrying plate 430 and the second support plate 460 to a certain extent, so that the material-carrying plate 430 can still maintain a relatively stable working state when it is not completely flat.

[0047] Continuing to refer to Figure 3, it can be understood that the rotation module includes a U-shaped groove arc motor 411, a first slide rail 412 and a first slider 413. The arcs of the U-shaped groove arc motor 411 and the first slide rail 412 correspond to the first avoidance hole 421. The fixed part of the U-shaped groove arc motor 411 and the first slide rail 412 are concentrically arranged with the first avoidance hole 421 on the first support plate 420 respectively. The movable part of the U-shaped groove arc motor 411 is connected to the lower surface of the second support plate 460, and the lower surface of the second support plate 460 is also connected to the first slide rail 412 through the first slider 413. When the fixed part of the U-shaped groove arc motor 411 and the first slide rail 412 are concentrically arranged with the first avoidance hole 421 on the first support plate 420, a fixed rotation center is defined, which enables the loading plate 430 to rotate stably around this center under the drive of the rotation module. If the rotation module is not concentrically arranged, the loading plate 430 will be eccentric during rotation, and the eccentric rotation will cause the materials on the loading plate 430 to be subjected to uneven centrifugal forces, which may cause the components to shift, shake or even fall off.

[0048] Continue to refer to Figure 3 , it can be understood that the rotation module further includes an induction sheet 414 and a position sensor 415. The induction sheet 414 is arranged on the lower surface of the second support plate 460, and the position sensor 415 is arranged on the upper surface of the first support plate 420 and located on the moving path of the induction sheet 414. During the rotation of the loading plate 430 driven by the rotation module, when the induction sheet 414 rotates with the loading plate 430 to a position corresponding to the position sensor 415, the position sensor 415 will generate a signal change. In this way, it can be accurately determined whether the loading plate 430 has rotated to the preset angular position. At the same time, the control system can adjust the drive of the U-shaped groove arc motor 411 in real time according to the feedback signal of the position sensor 415, and correct the angular deviation during the rotation in time, improving the operation safety and stability of the equipment.

[0049] Refer to Figure 1 and Figure 4 , it can be understood that support facades 110 are provided on both sides of the support tabletop 100. There are two first transfer modules 200. The fixed parts of the two first transfer modules 200 are respectively arranged on the opposite sides of the support facades 110, and the movable parts of the two first transfer modules 200 move synchronously. The two ends of the fixed part of the second transfer module 300 are respectively arranged on the movable parts of the two first transfer modules 200. By using the bilaterally symmetric first transfer modules 200 to support the second transfer module 300 and the loading module 400, the deformation of the support structure caused by uneven force can be reduced, and the load can be better balanced. The synchronous movement of the movable parts of the two first transfer modules 200 can drive the second transfer module 300 to move smoothly synchronously, improving the operation stability.

[0050] Continuing to refer to Figure 1 and Figure 4 Figure 4 , it can be understood that the first transfer module 200 includes a first U-shaped groove linear motor 210, a first mounting block 220, a second slide rail 230, and a second slider 240. The first U-shaped groove linear motor 210 is disposed on the support vertical surface 110. One side of the first mounting block 220 is connected to the driving end of the first U-shaped groove linear motor 210. The second slide rail 230 is disposed on the support table surface 100 and is parallel to the first U-shaped groove linear motor 210. The lower surface of the first mounting block 220 is connected to the second slide rail 230 through the second slider 240. The other side of the first mounting block 220 is connected to the fixed part of the second transfer module 300. When the first U-shaped groove linear motor 210 drives the first mounting block 220 to move, the second slide rail 230 and the second slider 240 play an accurate guiding role, reducing the vibration and shaking that may be caused by uneven power transmission or component loosening, and ensuring the stability of the movement process.

[0051] Referring to Figure 1 and Figure 5 Figure 5 , it can be understood that the second transfer module 300 includes a support block 310, a second U-shaped groove linear motor 320, a second mounting block 330, a third slide rail 340, and a third slider 350. Both ends of the support block 310 are respectively connected to the two first mounting blocks 220. The second U-shaped groove linear motor 320 is disposed on the side wall of the support block 310. The driving end of the second U-shaped groove linear motor 320 is connected to the second mounting block 330. The third slide rail 340 is disposed on the upper surface of the support block 310 and is parallel to the second U-shaped groove linear motor 320. The second mounting block 330 is connected to the third slide rail 340 through the third slider 350. The second mounting block 330 is connected to the upper surface of the first support plate 420. When the second U-shaped groove linear motor 320 drives the second mounting block 330 to move, the cooperation of the third slide rail 340 and the third slider 350 plays an accurate guiding role, reducing the vibration and shaking that may be caused by uneven power transmission or component loosening, and ensuring the stability of the movement process.

[0052] It should be noted that the first U-shaped groove linear motor 210 and the second U-shaped groove linear motor 320 have no iron core inside, there is no cogging effect and electromagnetic attraction, and the mover will not be interfered by these factors during the movement process. Therefore, higher positioning accuracy can be achieved, reaching a positioning accuracy of micron or even sub-micron level, meeting the application requirements with extremely high positioning accuracy. At the same time, there is no mechanical contact between the mover and the stator of the U-shaped groove linear motor, and there is no friction loss problem in traditional mechanical transmission. Therefore, the mechanical efficiency is high, the energy loss is small, the energy consumption and operation cost of the equipment can be effectively reduced, and at the same time, the wear and faults caused by friction are reduced, and the service life of the equipment is extended.

[0053] Reference Figure 1 It can be understood that the high-precision air-floating transfer mechanism provided in this application further includes a support frame 500. A number of shock isolation air bags 510 are provided on the support frame 500, and the support table 100 is arranged on the support frame 500 through the shock isolation air bags 510. In the actual working environment, the equipment may be disturbed by vibrations generated from surrounding equipment, ground traffic or other factors. The shock isolation air bags 510 can effectively isolate these external vibrations. At the same time, the shock isolation air bags 510 can buffer the impact force generated when pressing the loading plate 430, so that components such as the support table 100 and the loading module 400 and transfer module thereon are not affected by vibrations.

[0054] In a second aspect, with reference to Figure 6 this application also provides a control method for a high-precision air-floating transfer mechanism. This control method is applied to the high-precision air-floating transfer mechanism of any one of the embodiments in the first aspect. This control method includes but is not limited to the following steps:

[0055] Step S610: In response to a first control instruction, turn on the first air-floating module and the second air-floating module to form an air film between the first air-floating module, the first support plate and the support table;

[0056] Step S620: According to the first control instruction, control the first transfer module, the second transfer module and the rotation module to change the position of the loading plate;

[0057] Step S630: In response to a second control instruction, continuously turn on the second air-floating module and turn off the first air-floating module to make the first air-floating module contact the support table, and form an air film between the first support plate and the support table.

[0058] In steps S610 to S630, when responding to the first control instruction, the first air floating module 440 and the second air floating module 450 are simultaneously turned on, and an air film is formed between the first air floating module 440, the first support plate 420 and the support table 100. This way of the dual air floating modules working together enables the carrier module 400 to be stably suspended on the support table 100, effectively reducing the friction force. In this nearly frictionless state, the first transfer module 200, the second transfer module 300 and the rotation module are uniformly controlled to achieve the comprehensive adjustment of the material carrier plate 430 in terms of plane and angle. When receiving the second control instruction, the control method can orderly perform the conversion of the working state. The second air floating module 450 is continuously turned on and the first air floating module 440 is turned off, so that the first air floating module 440 contacts the support table 100, while an air film still remains between the first support plate 420 and the support table 100. This switching method can effectively transfer the relatively large pressure (such as the bonding force during key bonding) that may be applied to the material carrier plate 430 to the support table 100 while ensuring the stability of the carrier module 400. The whole switching process is stable and orderly, avoiding equipment shaking or accuracy loss caused by sudden change of the working mode, and providing a stable basis for subsequent pressure-bearing operations. By turning on the dual air floating modules and performing multi-module linkage control, high-precision transfer operations are achieved; in the pressure-bearing stage, through reasonable switching of the air floating modules, it is ensured that the equipment can stably bear the pressure, effectively buffer and absorb large pressure impacts, isolate the damage of the pressure to the fragile air floating structure, stably maintain the transfer accuracy throughout the process, ensure the stable and efficient operation of the equipment, meet the requirements of complex production processes, and thus improve the production efficiency.

[0059] The embodiments of the present application have been described in detail above with reference to the accompanying drawings. However, the present application is not limited to the above embodiments. Within the knowledge scope of those of ordinary skill in the art to which the present application pertains, various changes can be made without departing from the purpose of the present application.

Claims

1. A high-precision air floating transfer mechanism, characterized in that: include: Support table top; A first transfer module, wherein a fixed portion of the first transfer module is disposed on the support table; a second transfer module, wherein a fixed portion of the second transfer module is connected to a movable portion of the first transfer module; A bearing module, the bearing module is located on the support table, comprising a rotating module, a first supporting plate, a material carrying plate, a first air flotation module and a second air flotation module, the first supporting plate is provided with a first avoidance hole, the first air flotation module is located in the first avoidance hole, the fixed part of the rotating module is arranged on the first supporting plate, the lower surface of the material carrying plate is connected to the movable parts of the first air flotation module and the rotating module at the same time, the first air flotation module is used to generate an air film between itself and the support table, and the second air flotation module is arranged on the lower surface of the support table, and is used to generate an air film between the first supporting plate and the support table; A control module, wherein the control module is connected to the first air flotation module and the second air flotation module respectively, and is used to control the working states of the first air flotation module and the second air flotation module respectively; Wherein, the bearing module further comprises a second supporting plate, the second supporting plate is provided with a second avoiding hole at the position of the first avoiding hole, the first air flotation module is located in the first avoiding hole and the second avoiding hole, and the material carrying plate is connected to the movable part of the rotating module through the second supporting plate; The rotation module includes a U-shaped groove circular arc motor, a first slide rail and a first slider. The curvature of the U-shaped groove circular arc motor and the first slide rail corresponds to the first avoidance hole. The fixed part of the U-shaped groove circular arc motor and the first slide rail are respectively arranged concentrically with the first avoidance hole on the first support plate. The movable part of the U-shaped groove circular arc motor is connected to the lower surface of the second support plate, and the lower surface of the second support plate is also connected to the first slide rail through the first slider.

2. The high-precision air floating transfer mechanism according to claim 1, characterized in that: The second support plate is provided with flexible connection blocks at intervals at the edge of the second avoidance hole, one end of the flexible connection block is connected to the upper surface of the second support plate, and the other end is connected to the lower surface of the material loading plate.

3. The high-precision air floating transfer mechanism according to claim 1, characterized in that: The rotating module further includes a sensing sheet and an in-position sensor. The sensing sheet is disposed on the lower surface of the second supporting plate, and the in-position sensor is disposed on the upper surface of the first supporting plate and is located on a moving path of the sensing sheet.

4. The high-precision air floating transfer mechanism according to claim 1, characterized in that: Support vertical surfaces are provided on both sides of the support table, and two first transfer modules are provided. The fixed parts of the two first transfer modules are respectively arranged on opposite sides of the support vertical surfaces, and the movable parts of the two first transfer modules move synchronously, and the two ends of the fixed part of the second transfer module are respectively arranged on the movable parts of the two first transfer modules.

5. The high-precision air floating transfer mechanism according to claim 4, characterized in that: The first transfer module includes a first U-groove linear motor, a first mounting block, a second slide rail and a second slider. The first U-groove linear motor is arranged on the supporting vertical surface. One side of the first mounting block is connected to the driving end of the first U-groove linear motor. The second slide rail is arranged on the supporting table and is parallel to the first U-groove linear motor. The lower surface of the first mounting block is connected to the second slide rail through the second slider. The other side of the first mounting block is connected to the fixed part of the second transfer module.

6. The high-precision air floating transfer mechanism according to claim 5, characterized in that: The second transfer module includes a support block, a second U-groove linear motor, a second mounting block, a third slide rail and a third slider, the two ends of the support block are respectively connected to the two first mounting blocks, the second U-groove linear motor is arranged on the side wall of the support block, the driving end of the second U-groove linear motor is connected to the second mounting block, the third slide rail is arranged on the upper surface of the support block and is parallel to the second U-groove linear motor, the second mounting block is connected to the third slide rail through the third slider, and the second mounting block is connected to the upper surface of the first support plate.

7. The high-precision air floating transfer mechanism according to claim 1, characterized in that: It also includes a support frame, on which a plurality of seismic isolation air bags are arranged, and the support table is arranged on the support frame through the seismic isolation air bags.

8. A control method for a high-precision air-floating transfer mechanism, characterized in that: Applicable to the high-precision air floating transfer mechanism according to any one of claims 1 to 7, the control method comprises: In response to a first control instruction, the first air flotation module and the second air flotation module are turned on to form an air film between the first air flotation module, the first support plate and the support table; According to the first control instruction, control the first transfer module, the second transfer module and the rotation module to change the position of the carrier plate; In response to the second control instruction, the second air flotation module is continuously opened and the first air flotation module is closed, so that the first air flotation module contacts the support table and an air film is formed between the first support plate and the support table.

Citation Information

Patent Citations

  • Air floating platform for wafer cutting machine

    CN113572337A

  • Motion platform and photoetching machine

    CN117572727A