PCB thermal balance layout method

Abstract

The present invention discloses a PCB thermal balance layout method. The PCB thermal balance layout method includes: zoning and arranging components on a PCB board, obtaining a plurality of zoning and layout schemes of components on the PCB board; performing thermal simulation on the plurality of zoning and layout schemes respectively, determining a plurality of temperature distributions corresponding to the plurality of zoning and layouts; screening a PCB board zoning layout that meets a preset heat dissipation requirement according to the plurality of temperature distributions; and adjusting the ventilation layout of components on the PCB board for the screened zoning and layout of the PCB board to improve the heat dissipation effect. The technical solution of the embodiment of the present invention can realize heat conduction and dispersion without using a radiator, and reduce system cost.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB thermal design, and in particular to a PCB thermal balance layout method. Background Art

[0002] In the development of modern electronic devices, the design of PCB (Printed Circuit Board) is crucial, especially its thermal layout design, which directly affects the stability and reliability of the device. The electronic components on the PCB will generate a lot of heat when working. If the heat cannot be dissipated in time, it may cause the components to overheat, thus affecting the overall performance of the device or even causing failures. Therefore, how to effectively carry out PCB thermal balance layout has become an important issue that electronic engineers must face.

[0003] Currently, aluminum alloy is usually used on the side of the PCB for heat dissipation, or a metal heat dissipation layer is connected to the side to increase heat dissipation, which increases the thickness of the module and increases the cost. Summary of the invention

[0004] The present invention provides a PCB thermal balance layout method to achieve heat conduction and dispersion without using a radiator and reduce system cost.

[0005] The present invention provides a PCB thermal balance layout method, which performs partition layout on components on a PCB board and obtains multiple partition layout schemes of the components on the PCB board;

[0006] Performing thermal simulations on the various partition layout schemes respectively to determine a plurality of temperature distributions corresponding to the various partition layouts;

[0007] Screening a partition layout of the PCB board that meets a preset heat dissipation requirement according to the plurality of temperature distributions;

[0008] According to the selected partition layout of the PCB board, the ventilation layout of the components on the PCB board is adjusted to improve the heat dissipation effect.

[0009] Optionally, the components on the PCB are arranged in zones, including:

[0010] Get the type, quantity and heat generation of components on the PCB;

[0011] The components with low heat generation are placed at the most upstream of the cooling airflow, and the components with high heat generation are placed at the most downstream of the cooling airflow;

[0012] The temperature sensitive components are isolated.

[0013] Optionally, after selecting the partition layout of the PCB board that meets the preset heat dissipation requirement according to the plurality of temperature distributions, the method further includes:

[0014] Determining the installation direction of the PCB board;

[0015] Placing copper over a large area on the signal plane of the PCB board;

[0016] Filling the space between the components and the PCB with a high thermal conductivity material;

[0017] A star-shaped ground layout is adopted for different areas of the PCB board.

[0018] Optionally, the PCB board is installed in a vertical direction.

[0019] Optionally, adjusting the ventilation layout of components on the PCB board includes:

[0020] The components with high heat generation are arranged at positions directly opposite to the vents, so that the airflow at the vents is directed toward the components with high heat generation;

[0021] The direction of the air duct is adjusted, and the heat generating components are placed in a dispersed manner so that the airflow from the vents flows through the heat generating components evenly.

[0022] Optionally, the position, size and shape of the vent are associated with the heat dissipation requirements of the components with high heat generation.

[0023] Optionally, the copper plating width at the vent is greater than or equal to a preset threshold.

[0024] Optionally, thermal simulations are performed on a plurality of the partition layout schemes respectively, including:

[0025] Obtaining parameters of the component; wherein the parameters include: power consumption of the component, thermal conductivity and thermal resistance of the substrate into which the component is loaded, and thermal conductivity and thermal resistance of the package of the component;

[0026] Set boundary conditions and heat dissipation conditions;

[0027] Thermal simulations were performed separately to analyze and predict the temperature distribution and heat dissipation effects corresponding to the various PCB board partition layout schemes.

[0028] Optionally, the PCB thermal balance layout method further includes:

[0029] The PCB board after the ventilation layout is adjusted is simulated again to analyze and predict the temperature distribution and heat dissipation effect of the PCB board;

[0030] After simulation verification, the thermally balanced layout of the PCB board is obtained.

[0031] Optionally, after simulation verification, a PCB thermal balance layout is obtained, including:

[0032] Compare the obtained simulation result with the preset standard of the PCB board to determine whether it passes the simulation verification;

[0033] If so, a thermally balanced PCB layout is obtained.

[0034] The technical solution of the embodiment of the present invention is to perform a partition layout on the components on the PCB board and obtain multiple partition layout schemes of the components of the PCB board, further simulate the partition layout schemes of the multiple PCB boards, and determine multiple different temperature distributions corresponding to the partition layout schemes of different PCB boards. Then, the partition layout of the PCB board that meets the preset heat dissipation requirements is screened according to the temperature distribution, and finally the partition layout of the screened PCB board is adjusted for ventilation layout to improve the heat dissipation effect. The embodiment of the present invention performs a PCB thermal balance layout through the partition layout of components, thermal simulation and optimization of ventilation design. Compared with the prior art, it can avoid using devices such as radiators for heat dissipation, avoid increasing the module thickness of the PCB board, and reduce the system cost. By partitioning the components, heat conduction and dispersion can be achieved, thereby avoiding heat accumulation in local areas. Through thermal simulation, potential heat dissipation problems in the PCB board layout process can be discovered in time, and can be adjusted and optimized in the design stage. Thereby, the accuracy and efficiency of the PCB layout can be improved, and the trial and error cost in actual production can be reduced. By adjusting the ventilation layout, it can be ensured that the components work at a suitable temperature.

[0035] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0037] Figure 1 A flowchart of a PCB thermal balance layout method provided according to an embodiment of the present invention;

[0038] Figure 2 A schematic diagram of a PCB thermal balance layout according to an embodiment of the present invention;

[0039] Figure 3 A flowchart of another PCB thermal balance layout method provided according to an embodiment of the present invention;

[0040] Figure 4 A flowchart of another PCB thermal balance layout method provided according to an embodiment of the present invention;

[0041] Figure 5 The present invention is a flowchart of another PCB thermal balance layout method provided according to an embodiment of the present invention. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0043] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0044] Figure 1 FIG. 1 is a flow chart of a PCB thermal balance layout method provided according to an embodiment of the present invention, referring to FIG. Figure 1 , PCB thermal balance layout methods include:

[0045] S101, performing partition layout on the components on the PCB board, and obtaining multiple partition layout schemes of the components on the PCB board.

[0046] Specifically, when the PCB board is zoned, the basic principle to be followed is to place temperature-sensitive components in relatively low temperature areas and to place components with high heat generation in locations that are easy to dissipate heat. For example, temperature-sensitive components (such as temperature sensors) should be close to the air inlet or upstream of the air duct, and staggered with other heat-generating components in the direction of air rise, so as to obtain cold air in time for heat dissipation. Components with high heat generation (such as high-power chips and power supplies) should be placed near the air outlet or at the top to make full use of the convection heat dissipation effect. And components with high heat generation should be dispersed as much as possible to avoid heat source concentration. Further, based on the basic principles of the above layout, a variety of zone layouts of components of the PCB board are obtained.

[0047] S102 , performing thermal simulations on various partition layout schemes respectively to determine a plurality of temperature distributions corresponding to the various partition layouts.

[0048] The temperature distribution can be specifically understood as the temperature variation of the entire PCB board or its different regions under different working conditions.

[0049] Specifically, according to the obtained various partition layouts of the components of the PCB board, the models of the PCB board and the components are respectively constructed, the relevant parameters are set, and the thermal simulation software is used to perform simulation calculations to predict the temperature distribution of each partition layout of the components of the PCB board, and then determine the corresponding multiple temperature distributions of the various partition layouts. Exemplarily, the partition layout of the components of each PCB board can be simulated and analyzed by power DC / ANSYS simulation software, and the temperature distribution of the components can be predicted, and then the corresponding multiple temperature distributions of the various partition layouts can be determined. Or first use MATLAB software to calculate the temperature value of the corresponding node of each component, and then use thermal simulation software Icepak to build a model of the initial layout, and perform grid division and solution calculations to predict the temperature distribution of the components, and then determine the corresponding multiple temperature distributions of the various partition layouts.

[0050] S103, selecting a partition layout of a PCB board that meets a preset heat dissipation requirement according to a plurality of temperature distributions.

[0051] The preset heat dissipation requirements can be specifically understood as the heat dissipation requirements required to meet the temperature range set according to the use environment of the PCB board, component power consumption, and thermal management requirements. The preset heat dissipation requirements are used to ensure that sensitive components on the PCB board (such as high-power chips and power supplies) work within a certain temperature range to avoid performance degradation or damage due to overheating.

[0052] Specifically, thermal simulation can be used to obtain the temperature distribution of each area of ​​the partition layout on the PCB board. Then, by analyzing and judging the temperature distribution, the partition layout of the PCB board that meets the preset heat dissipation requirements can be screened to ensure that all components operate within a safe temperature range, thereby improving the reliability and performance of the PCB board.

[0053] S104: According to the partition layout of the screened PCB board, the ventilation layout of the components on the PCB board is adjusted to improve the heat dissipation effect.

[0054] Specifically, since the heat dissipation efficiency of the surface bottom layer of the PCB board is much greater than the side heat dissipation, the side heat dissipation is not considered. The ventilation layout of the partition layout of the screened PCB board is optimized, mainly by optimizing the arrangement of components and designing the ventilation layout to improve heat distribution and air flow, and finally achieve more effective heat dissipation. For example, by reasonably dispersing and arranging high-power consumption components (components that generate a lot of heat) to avoid concentrating in a small area, the overheating risk of a local area can be effectively reduced. By distributing high-power consumption components in different areas of the PCB board, hot spots are avoided and the increase in local temperature is reduced. By increasing the spacing between the heat-generating components, the heat is avoided from affecting each other and the dispersion of heat flow is improved. By arranging heat dissipation holes, air flow channels, etc., it is ensured that the air flow can cover all high heat source areas to promote cold air to flow through high temperature areas and take away heat.

[0055] The technical solution of the embodiment of the present invention is to perform a partition layout on the components on the PCB board and obtain multiple partition layout schemes of the components of the PCB board, further simulate the partition layout schemes of the multiple PCB boards, and determine multiple different temperature distributions corresponding to the partition layout schemes of different PCB boards. Then, the partition layout of the PCB board that meets the preset heat dissipation requirements is screened according to the temperature distribution, and finally the partition layout of the screened PCB board is adjusted for ventilation layout to improve the heat dissipation effect. The embodiment of the present invention performs a PCB thermal balance layout through the partition layout of components, thermal simulation and optimization of ventilation design. Compared with the prior art, it can avoid using devices such as radiators for heat dissipation, avoid increasing the module thickness of the PCB board, and reduce the system cost. By partitioning the components, heat conduction and dispersion can be achieved, thereby avoiding heat accumulation in local areas. Through thermal simulation, potential heat dissipation problems in the PCB board layout process can be discovered in time, and can be adjusted and optimized in the design stage. Thereby, the accuracy and efficiency of the PCB layout can be improved, and the trial and error cost in actual production can be reduced. By adjusting the ventilation layout, it can be ensured that the components work at a suitable temperature.

[0056] According to another optional embodiment of the present invention, optionally, the components on the PCB are arranged in zones, including:

[0057] Get the type, quantity and heat value of components on the PCB.

[0058] Specifically, the type, quantity and heat generation of components on the PCB board are obtained, and they are classified according to the heat generation.

[0059] For example, Figure 2 FIG. 1 is a schematic diagram of a PCB thermal balance layout according to an embodiment of the present invention. Figure 2 The components on the PCB board obtained include 13 signal module package devices and 4 power module package devices. Specifically, the types of components and their maximum junction temperatures and heat generation (power consumption) are as follows: the maximum junction temperature and heat generation of FPGA (Field-Programmable Gate Array) are 175°C and 40W, the two DDR4 (Double Data Rate 4, fourth-generation double data rate synchronous dynamic random access memory) modules are the first storage module DDR4-1 and the second storage module DDR4-2, and their maximum junction temperatures and heat generation are both 125°C and 8W, the four RF (Radio Frequency, RF) modules are the first RF module RF1, the second RF module RF2, the third RF module RF3 and the fourth RF module RF4, and their maximum junction temperatures and heat generation are both 125°C and 1W, the two ADCs (Analog-to-Digital Converters) are the first analog-to-digital converter ADC1 and the second analog-to-digital converter ADC2, and their maximum junction temperatures and heat generation are both 85°C and 1.65W, the maximum junction temperature and heat generation of the first high-speed differential module AD are 175°C and 1W, and the FPGA is configured with two PROMs (Programmable read-only memory, programmable read-only memory) are the third storage module PROM1 and the fourth storage module PROM2, their maximum junction temperature and heat generation are 150℃ and 2W, the maximum junction temperature and heat generation of the second high-speed differential module DA are 175℃ and 0.5W, the maximum junction temperature and heat generation of the DDR power module U2 are 85℃ and 5W, the two DC-DC (Direct Current to Direct Current) converters are the first power conversion module DC-DC1 and the second power conversion module DC-DC2, their maximum junction temperature and heat generation are 125℃ and 44W, and the maximum junction temperature and heat generation of the DC-DC regulator U1 are 125℃ and 80W. Among them, the maximum junction temperature refers to the highest temperature that the internal junction part of a semiconductor device (such as a transistor, an integrated circuit, etc.) can withstand when it is working.

[0060] Place components with low heat generation at the upstream of the cooling airflow, and components with high heat generation at the downstream of the cooling airflow.

[0061] For details, please refer to Figure 2 , since the first high-speed differential module AD and the second high-speed differential module DA have low heat generation but poor heat resistance, they are placed at the most upstream of the cooling airflow. The first power conversion module DC-DC1, the second power conversion module DC-DC2 and the DC-DC regulator U1 have high heat generation but good heat resistance, and are placed at the most downstream of the cooling airflow, and are arranged in the first area 111 of the PCB board. In addition, the first power conversion module DC-DC1 and the second power conversion module DC-DC2 are dispersedly arranged to reduce the voltage drop on the ground line and the current loop area.

[0062] In the layout of a specific PCB board, the first high-speed differential module AD and the second high-speed differential module DA are arranged along the second direction Y and are arranged on the first side of the first direction X of the PCB board; because the FPGA variable power chip will generate different power consumption due to different burning programs, the FPGA is arranged close to the middle position to obtain better heat dissipation and better wiring space (wiring is not shown in the figure). The first power conversion module DC-DC1, the second power conversion module DC-DC2 and the DC-DC regulator U1 are arranged along the first direction X and are arranged on the first side of the second direction Y of the PCB board. The first storage module DDR4-1, the second storage module DDR4-2 and the DDR power module U2 are arranged along the first direction X, and the FPGA and the first storage module DDR4-1 and the second storage module DDR4-2 are arranged along the second direction Y, so that the first storage module DDR4-1 and the second storage module DDR4-2 are arranged close to the middle position to obtain better heat dissipation and better wiring space (wiring is not shown in the figure). The first high-speed differential module AD, the second high-speed differential module DA, the FPGA, the first storage module DDR4-1, the second storage module DDR4-2, the DDR power module U2, the third storage module PROM1 and the fourth storage module PROM2 are arranged in the second area 112 of the PCB board.

[0063] It is understandable that, according to the modular design of the PCB board, the third storage module PROM1 and the fourth storage module PROM2 are arranged along the first direction X, and the third storage module PROM1, the fourth storage module PROM2 and the FPGA are arranged along the second direction Y. The arrangement of other PCB boards, for example, the stacking design of the PCB board, the thickness of each layer is set according to the board thickness, impedance and design requirements, and the design of the stacked electrical ground structure of the PCB (such as GVVG, G is the ground layer, V is the power layer) can all be designed by existing methods, which will not be repeated here.

[0064] Isolate temperature sensitive components.

[0065] Specifically, temperature-sensitive components (such as other heat-sensitive components other than temperature detection components) should be isolated to avoid direct exposure to high temperature environments. Temperature-sensitive components should be kept away from components that generate large amounts of heat, or isolated using heat shielding plates.

[0066] Continue to refer Figure 2 , since the first analog-to-digital converter ADC1, the second analog-to-digital converter ADC2, the first radio frequency module RF1, the second radio frequency module RF2, the third radio frequency module RF3 and the fourth radio frequency module RF4 are all temperature-sensitive devices, they are arranged in the third area 113 of the PCB board and are arranged away from the first area 111 and the second area 112. At the same time, according to the isolation partition design of the digital signal and the radio frequency signal, the FPGA and the first analog-to-digital converter ADC1, the second analog-to-digital converter ADC2, the first radio frequency module RF1, the second radio frequency module RF2, the third radio frequency module RF3 and the fourth radio frequency module RF4 are isolated and partitioned. The first analog-to-digital converter ADC1 and the second analog-to-digital converter ADC2 are arranged along the second direction Y, and the first radio frequency module RF1, the second radio frequency module RF2, the third radio frequency module RF3 and the fourth radio frequency module RF4 are arranged along the second direction Y.

[0067] Figure 3 FIG. 1 is a flow chart of another PCB thermal balance layout method provided according to an embodiment of the present invention, referring to FIG. Figure 3 Based on the above embodiments, the PCB thermal balance layout method includes:

[0068] S201, zoning and arranging components on a PCB board, and obtaining a plurality of zoning and arranging schemes of components on the PCB board.

[0069] S202 , performing thermal simulations on various partition layout schemes respectively to determine a plurality of temperature distributions corresponding to the various partition layouts.

[0070] Optionally, thermal simulations are performed for various partition layout schemes, including:

[0071] Obtaining parameters of components; wherein the parameters include: power consumption of components, thermal conductivity and thermal resistance of substrates into which components are loaded, and thermal conductivity and thermal resistance of components' packages.

[0072] Specifically, the temperature is set to 25° C. by default, and the power consumption of components, the thermal conductivity and thermal resistance of the substrate into which the components are loaded, and the thermal conductivity and thermal resistance of the component package are loaded into the thermal simulation software for simulation.

[0073] Set boundary conditions and cooling conditions.

[0074] Specifically, boundary conditions are set, and heat dissipation conditions are set to forced air cooling. The boundary conditions and heat dissipation conditions are set the same when performing thermal simulations on multiple partition layout schemes, so that the multiple temperature distributions finally obtained are only related to the influencing factor of the partition layout of the PCB.

[0075] Thermal simulations are performed separately to analyze and predict the temperature distribution and heat dissipation effects corresponding to various PCB board partition layout schemes.

[0076] Specifically, thermal simulations are performed on various partition layout schemes to obtain the voltage drop (IR-DROP), current density and AC impedance of the corresponding components of various PCB boards, as well as the time domain color temperature diagram of the entire PCB board. Furthermore, the temperature distribution and heat dissipation effect corresponding to various PCB board partition layout schemes are predicted through time domain color temperature diagram analysis. Through thermal simulation, potential heat dissipation problems can be discovered in time, and adjustments and optimizations can be made during the design stage. It can improve the accuracy and efficiency of PCB board design and reduce the trial and error costs in actual production.

[0077] S203, selecting a partition layout of a PCB board that meets a preset heat dissipation requirement according to a plurality of temperature distributions.

[0078] S204: Determine the installation direction of the PCB board.

[0079] Among them, the installation direction of the PCB board affects the assembly, function and convenience of use of the components on the PCB board. Usually, the factors that need to be considered usually include: the direction of the components, markings, the connection direction of the interface, and design measures to prevent reverse insertion.

[0080] In an optional manner provided by an embodiment of the present invention, the PCB board is installed vertically to allow the PCB board to dissipate heat better. When there are multiple PCB boards, all PCB boards can be installed vertically, and the distance between the PCB boards should not be less than 2 cm to ensure smooth air circulation.

[0081] S205, copper is laid over a large area on the signal plane of the PCB board.

[0082] Specifically, sufficient space is reserved on the PCB board for large-area copper plating. Heat is conducted to the plane layer of the PCB board by plating large-area copper plating or using ground connection vias, so that the entire PCB board can be fully utilized for heat dissipation. This setting can effectively reduce the operating temperature of components.

[0083] For example, reference Figure 2 The first area 111, the second area 112 and the third area 113 on the PCB board are all copper-plated over a large area.

[0084] S206. Fill the space between components and the PCB board with high thermal conductivity material.

[0085] Specifically, in the process of mounting the packaged components on the PCB, materials with high thermal conductivity and strong fluidity are used to ensure that the solder balls are completely filled with high thermal conductivity media without gaps during the mounting process, thereby ensuring the heat dissipation effect and reducing the operating temperature of the components.

[0086] S207. Use a star-shaped ground layout for different areas of the PCB board.

[0087] Specifically, during the wiring process of the PCB board, a wide and short ground line layout can reduce the ground line impedance and reduce the voltage drop and current loop area on the ground line. A star-shaped ground line (not shown in the figure) layout is used in different areas of the PCB board to reduce the ground potential difference between different areas and reduce the formation of eddy currents.

[0088] S208. According to the partition layout of the screened PCB board, the ventilation layout of the components on the PCB board is adjusted to improve the heat dissipation effect.

[0089] Optionally, adjust the ventilation layout of components on the PCB, including:

[0090] Place components that generate a lot of heat directly opposite the vents so that the airflow at the vents is directed toward the components that generate a lot of heat.

[0091] Specifically, for components with high heat dissipation requirements, the vent design is optimized to ensure that the airflow can be accurately directed to the component to achieve effective heat dissipation.

[0092] Optionally, the position, size and shape of the vents are associated with heat dissipation requirements of components that generate large amounts of heat.

[0093] Specifically, according to the power, heat distribution and heat dissipation method of the components, the vents are arranged reasonably to ensure smooth air circulation and avoid overheating. For example, the vents should be placed above or around the heat-generating components to effectively take away the generated heat. When the heat generation of the components is high, the enlarged vents are used to increase the air circulation to meet their heat dissipation requirements. The shape of the vents directly affects the efficiency of air flow, thereby affecting the heat dissipation performance of the components. Vents of different shapes will change the direction, speed and flow of the airflow, thereby affecting the heat dissipation effect. When the heat generation of the components is high, the use of long strip vents can provide a large area of ​​ventilation channels, and can evenly distribute cold air to avoid local overheating. At the same time, the shape of the copper plating does not have sharp angles, which can ensure uniform current distribution and improve stability and heat dissipation.

[0094] Optionally, the copper plating width at the vent is greater than or equal to a preset threshold.

[0095] The preset threshold value may be specifically understood as an effective copper width of the PCB board that enables effective heat dissipation. For example, the preset threshold value may be 50 mil.

[0096] Specifically, the copper plating width at the vent can affect the heat conduction area. For example, when the copper plating width is wider, the heat conduction area can be effectively increased, thereby improving the heat dissipation effect.

[0097] Adjust the direction of the air duct and place the heat-generating components in a dispersed manner so that the airflow from the vents flows evenly through the heat-generating components.

[0098] Specifically, the air duct should be reasonably planned based on the principle that the air flow can flow smoothly through each component to avoid blockage or eddy current in the air duct. At the same time, the wind resistance should be reduced as much as possible to improve the heat dissipation efficiency.

[0099] Figure 4 FIG. 1 is a flow chart of another PCB thermal balance layout method provided according to an embodiment of the present invention, referring to FIG. Figure 4 Based on the above embodiments, the PCB thermal balance layout method includes:

[0100] S301, zoning and arranging components on a PCB board, and obtaining a plurality of zoning and arranging schemes of components on the PCB board.

[0101] S302 , performing thermal simulations on various partition layout schemes respectively to determine a plurality of temperature distributions corresponding to the various partition layouts.

[0102] S303, selecting a partition layout of a PCB board that meets a preset heat dissipation requirement according to a plurality of temperature distributions.

[0103] S304: According to the partition layout of the screened PCB board, the ventilation layout of the components on the PCB board is adjusted to improve the heat dissipation effect.

[0104] S305, simulating the PCB board again after adjusting the ventilation layout, analyzing and predicting the temperature distribution and heat dissipation effect of the PCB board.

[0105] Specifically, the PCB board after adjusting the ventilation layout is thermally simulated again to obtain the voltage drop (IR-DROP), current density and AC impedance of the corresponding components of the PCB board, as well as the time domain color temperature diagram of the entire PCB board. Furthermore, the temperature distribution and heat dissipation effect corresponding to the PCB board partition layout scheme are predicted through time domain color temperature diagram analysis. Through thermal simulation, potential heat dissipation problems can be discovered in time, and adjustments and optimizations can be made during the design stage. It can improve the accuracy and efficiency of PCB board design and reduce the trial and error costs in actual production.

[0106] S306: After simulation verification, a thermally balanced layout of the PCB board is obtained.

[0107] Optionally, after simulation verification, a PCB thermal balance layout is obtained, including:

[0108] Compare the obtained simulation results with the preset standards of the PCB board to determine whether they pass the simulation verification.

[0109] The preset standard can be specifically understood as the standard specified in the chip manual of the component. For example, for components with high heat generation and high power, the voltage drop and current density must be within the values ​​specified in the chip manual.

[0110] Specifically, before thermal simulation is performed, the device manual of each component usually defines a series of preset standards. Among them, the preset standards may include: maximum allowable IR-DROP, current density and AC impedance. The simulation software simulates the voltage drop, temperature distribution and other results when the current flows through the circuit and conductor, and further compares the simulation results with the preset standards to determine whether the partition layout scheme of the PCB board meets the actual application requirements.

[0111] If so, a thermally balanced PCB layout is obtained.

[0112] Specifically, when aspects such as IR-DROP, current density, and AC impedance meet predetermined standards, the design can be considered to have passed verification, and the final PCB board thermal balance layout solution is obtained.

[0113] Figure 5 FIG. 1 is a flow chart of another PCB thermal balance layout method provided according to an embodiment of the present invention, referring to FIG. Figure 5 Based on the above embodiments, the PCB thermal balance layout method includes:

[0114] S401, zoning and arranging components on the PCB board, and obtaining multiple zoning and arranging schemes of the components on the PCB board.

[0115] S402 , performing thermal simulations on various partition layout schemes respectively to determine a plurality of temperature distributions corresponding to the various partition layouts.

[0116] S403, selecting a partition layout of a PCB board that meets a preset heat dissipation requirement according to a plurality of temperature distributions.

[0117] S404: Determine the installation direction of the PCB board.

[0118] S405, copper is laid over a large area on the signal plane of the PCB board.

[0119] S406. Fill the space between components and the PCB with high thermal conductivity material.

[0120] S407. Use star-shaped ground layout for different areas of the PCB board.

[0121] S408. According to the partition layout of the screened PCB board, the ventilation layout of the components on the PCB board is adjusted to improve the heat dissipation effect.

[0122] S409, simulating the PCB board again after adjusting the ventilation layout, and analyzing and predicting the temperature distribution and heat dissipation effect of the PCB board.

[0123] S410, after simulation verification, a thermally balanced layout of the PCB board is obtained.

[0124] S411: If the simulation verification fails, execute S409.

[0125] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0126] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A PCB thermal balance layout method, characterized in that: include: Partitioning and arranging components on a PCB board to obtain multiple partitioning and layout schemes for the components of the PCB board; Performing thermal simulations on the various partition layout schemes respectively to determine a plurality of temperature distributions corresponding to the various partition layouts; Screening a partition layout of the PCB board that meets a preset heat dissipation requirement according to the plurality of temperature distributions; According to the selected partition layout of the PCB board, the ventilation layout of the components on the PCB board is adjusted to improve the heat dissipation effect.

2. The PCB thermal balance layout method according to claim 1, characterized in that: Partition and layout the components on the PCB, including: Get the type, quantity and heat generation of components on the PCB; The components with low heat generation are placed at the most upstream of the cooling airflow, and the components with high heat generation are placed at the most downstream of the cooling airflow; The temperature sensitive components are isolated.

3. The PCB thermal balance layout method according to claim 1, characterized in that: After selecting the partition layout of the PCB board that meets the preset heat dissipation requirement according to the plurality of temperature distributions, the method further includes: Determining the installation direction of the PCB board; Placing copper over a large area on the signal plane of the PCB board; Filling the space between the components and the PCB with a high thermal conductivity material; A star-shaped ground layout is adopted for different areas of the PCB board.

4. The PCB thermal balance layout method according to claim 3, characterized in that: The PCB board is installed vertically.

5. The PCB thermal balance layout method according to claim 1, characterized in that: Adjusting the ventilation layout of components on the PCB board includes: The components with high heat generation are arranged at positions directly opposite to the vents, so that the airflow at the vents is directed toward the components with high heat generation; The direction of the air duct is adjusted, and the heat generating components are placed in a dispersed manner so that the airflow from the vents flows through the heat generating components evenly.

6. The PCB thermal balance layout method according to claim 5, characterized in that: The position, size and shape of the vents are associated with the heat dissipation requirements of the components that generate a large amount of heat.

7. The PCB thermal balance layout method according to claim 5, characterized in that: The copper plating width at the vent is greater than or equal to a preset threshold.

8. The PCB thermal balance layout method according to claim 1, characterized in that: Thermal simulations are performed on various partition layout schemes, including: Obtaining parameters of the component; wherein the parameters include: power consumption of the component, thermal conductivity and thermal resistance of the substrate into which the component is loaded, and thermal conductivity and thermal resistance of the package of the component; Set boundary conditions and heat dissipation conditions; Thermal simulations were performed separately to analyze and predict the temperature distribution and heat dissipation effects corresponding to the various PCB board partition layout schemes.

9. The PCB thermal balance layout method according to claim 1, characterized in that: Also includes: The PCB board after the ventilation layout is adjusted is simulated again to analyze and predict the temperature distribution and heat dissipation effect of the PCB board; After simulation verification, the thermally balanced layout of the PCB board is obtained.

10. The PCB thermal balance layout method according to claim 9, characterized in that: After simulation verification, the PCB thermal balance layout is obtained, including: Compare the obtained simulation result with the preset standard of the PCB board to determine whether it passes the simulation verification; If so, a thermally balanced PCB layout is obtained.

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