A manufacturing process for a circuit body without substrate, a circuit board and a light-emitting body

Abstract

The present invention discloses a manufacturing process for a circuit body, a circuit board and a light-emitting body without a substrate. A carrier jig is used as a carrier to manufacture the circuit body. The manufactured circuit body is peeled off from the carrier jig and cut into shape. The cut circuit body is bonded to a substrate to form a circuit board. In the light-emitting body manufacturing process, a carrier jig is used as a carrier to manufacture the circuit body. The manufactured circuit body is peeled off from the carrier jig, cut into shape, and then bonded to the substrate. LED lamp beads are welded on the circuit body and combined with the substrate to form a light-emitting board. The circuit body and the substrate are manufactured separately. The substrate can be installed on the lamp carrier first, and then the circuit body is bonded to the substrate; the circuit body can also be bonded to the substrate to form a light-emitting board, and then the light-emitting board is installed on the lamp carrier. The substrate material can be selected according to demand, and the substrate can be purchased by itself for cutting and application, thereby reducing costs. In the manufacturing process, when the circuit layer detection is unqualified, the insulating bottom layer can be peeled off, and cost waste is small.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a manufacturing process of a circuit body without a substrate, a circuit board and a light-emitting body. Background Art

[0002] Circuit boards are an important part of electronic devices, and their main function is to support and connect electronic components. For simple circuit boards, such as LED light source boards, the production method is mainly to fix the copper foil layer on the substrate, then perform an etching process to make the circuit layer, then apply a solder mask layer on the circuit layer, and finally attach the components. After this method is used to make the circuit layer, if the circuit layer fails the inspection, it will be discarded, resulting in a waste of substrate.

[0003] And because the copper foil layer is formed on the substrate, the substrate is provided by the circuit board manufacturer, the overall price is high, and there are few types of substrates to choose from, which to a certain extent limits its scope of application. Summary of the invention

[0004] The main purpose of the present invention is to provide a manufacturing process for a circuit body, a circuit board and a light-emitting body without a substrate, aiming to realize the separate manufacturing of the circuit layer and the substrate and remove the restriction on the substrate.

[0005] The present invention provides a process for manufacturing a circuit body without a substrate, comprising the following steps:

[0006] 1) Prepare a bearing fixture for bearing the circuit layer;

[0007] 2) Making a strippable insulating bottom layer on the bearing surface of the bearing fixture;

[0008] 3) Make the circuit layer on the insulating bottom layer and test the circuit layer;

[0009] 4) Making an insulating protective layer on the circuit layer and exposing the pads of the circuit layer;

[0010] 5) Solder components on the pads of the circuit layer, and the circuit body is composed of the insulating bottom layer, circuit layer, insulating protective layer and components;

[0011] 6) Peel the circuit body off the supporting jig and cut it into shape.

[0012] Preferably, the circuit layer is made of a copper foil layer bonded to the insulating bottom layer through an etching process.

[0013] Preferably, a first positioning hole is provided on the carrying jig, and a corresponding second positioning hole is provided on the copper foil layer, and the copper foil layer is aligned with the second positioning hole and is attached to the carrying surface of the carrying jig.

[0014] Preferably, a low-concentration resin is coated on the bearing surface of the bearing fixture to form the insulating bottom layer.

[0015] The present invention provides a circuit board manufacturing process, comprising the following steps:

[0016] 1) Prepare a bearing fixture for bearing the circuit layer;

[0017] 2) Making a strippable insulating bottom layer on the bearing surface of the bearing fixture;

[0018] 3) Make the circuit layer on the insulating bottom layer and test the circuit layer;

[0019] 4) Making an insulating protective layer on the circuit layer and exposing the pads of the circuit layer;

[0020] 5) Solder components on the pads of the circuit layer, and the circuit body is composed of the insulating bottom layer, circuit layer, insulating protective layer and components;

[0021] 6) Peel the circuit body off the supporting jig and cut it into shape.

[0022] 7) Cutting the substrate into the desired shape;

[0023] 8) Bond the circuit body to the substrate.

[0024] Preferably, the circuit layer is made of a copper foil layer bonded to the insulating bottom layer through an etching process.

[0025] Preferably, a first positioning hole is provided on the carrying jig, and a corresponding second positioning hole is provided on the copper foil layer, and the copper foil layer is aligned with the second positioning hole and is attached to the carrying surface of the carrying jig.

[0026] Preferably, a low-concentration resin is coated on the bearing surface of the bearing fixture to form the insulating bottom layer.

[0027] Preferably, the substrate is a metal plate, a ceramic plate, a plastic plate or a polymer fiber cloth.

[0028] Preferably, the circuit body and the substrate are bonded together by a thermally conductive insulating adhesive.

[0029] The present invention further proposes a luminous body manufacturing process, comprising the following steps:

[0030] 1) Prepare a bearing fixture for bearing the circuit layer;

[0031] 2) Making a strippable insulating bottom layer on the bearing surface of the bearing fixture;

[0032] 3) Make the circuit layer on the insulating bottom layer and test the circuit layer;

[0033] 4) Making an insulating protective layer on the circuit layer and exposing the pads of the circuit layer;

[0034] 5) Weld the LED lamp beads on the pads of the circuit layer, and the circuit body is composed of the insulating bottom layer, the circuit layer, the insulating protection layer and the LED lamp beads;

[0035] 6) Peel the circuit body off the supporting jig and cut it into shape;

[0036] 7) Cutting the substrate into the desired shape;

[0037] 8) Bonding the circuit body to the substrate to form a light-emitting board;

[0038] 9) Fix the light-emitting board to the lamp carrier.

[0039] Preferably, the circuit layer is made of a copper foil layer bonded to the insulating bottom layer through an etching process.

[0040] Preferably, a first positioning hole is provided on the carrying jig, and a corresponding second positioning hole is provided on the copper foil layer, and the copper foil layer is aligned with the second positioning hole and is attached to the carrying surface of the carrying jig.

[0041] Preferably, a low-concentration resin is coated on the bearing surface of the bearing fixture to form the insulating bottom layer.

[0042] Preferably, the substrate is a metal plate, a ceramic plate, a plastic plate or a polymer fiber cloth.

[0043] Preferably, the circuit body and the substrate are bonded together by a thermally conductive insulating adhesive.

[0044] Preferably, the substrate and the lamp carrier are bonded together by a heat-conducting insulating adhesive.

[0045] The present invention further proposes a luminous body manufacturing process, comprising the following steps:

[0046] 1) Prepare a bearing fixture for bearing the circuit layer;

[0047] 2) Making a strippable insulating bottom layer on the bearing surface of the bearing fixture;

[0048] 3) Make the circuit layer on the insulating bottom layer and test the circuit layer;

[0049] 4) Making an insulating protective layer on the circuit layer and exposing the pads of the circuit layer;

[0050] 5) Weld the LED lamp beads on the pads of the circuit layer, and the circuit body is composed of the insulating bottom layer, the circuit layer, the insulating protection layer and the LED lamp beads;

[0051] 6) Peel the circuit body off the supporting jig and cut it into shape;

[0052] 7) Cutting the substrate into the desired shape;

[0053] 8) bonding the substrate to the lamp carrier;

[0054] 9) Bond the circuit body to the substrate.

[0055] Preferably, the circuit layer is made of a copper foil layer bonded to the insulating bottom layer through an etching process.

[0056] Preferably, a first positioning hole is provided on the carrying jig, and a corresponding second positioning hole is provided on the copper foil layer, and the copper foil layer is aligned with the second positioning hole and is attached to the carrying surface of the carrying jig.

[0057] Preferably, a low-concentration resin is coated on the bearing surface of the bearing fixture to form the insulating bottom layer.

[0058] Preferably, the substrate is a metal plate, a ceramic plate, a plastic plate or a polymer fiber cloth.

[0059] Preferably, the circuit body and the substrate are bonded together by a thermally conductive insulating adhesive.

[0060] Preferably, the substrate and the lamp carrier are bonded together by a heat-conducting insulating adhesive.

[0061] The beneficial effects of the present invention are:

[0062] In the process for manufacturing a circuit body without a substrate proposed by the present invention, a carrier jig is used as a carrier to manufacture the circuit body, and the manufactured circuit body is peeled off from the carrier jig and cut into shape. The manufactured circuit body can be bonded to a substrate of any material to form a circuit board. The substrate can be selected according to demand, and the substrate can be purchased and processed by the manufacturer to reduce costs. In the manufacturing process, when the circuit layer is unqualified, the insulating bottom layer can be peeled off, which reduces cost waste. The carrier jig can be reused.

[0063] In the circuit board manufacturing process proposed by the present invention, a carrier jig is used as a carrier to manufacture the circuit body, and the manufactured circuit body is peeled off from the carrier jig and cut into shape; the cut circuit body is bonded to a substrate to form a circuit board. The substrate material can be selected according to demand, and the substrate can be purchased for cutting and application, thereby reducing costs. In the manufacturing process, when the circuit layer is unqualified, the insulating bottom layer can be peeled off, which reduces cost waste. The carrier jig can be reused.

[0064] In the light-emitting body manufacturing process proposed by the present invention, a carrier jig is used as a carrier to manufacture the circuit body. The manufactured circuit body is peeled off from the carrier jig, cut into shape, and then bonded to the substrate. LED lamp beads are welded on the circuit body, which is combined with the substrate to form a light-emitting board. The circuit body and the substrate are manufactured separately, and the substrate can be first installed on the lamp carrier, and then the circuit body is bonded to the substrate; the circuit body can also be bonded to the substrate to form a light-emitting board, and then the light-emitting board is installed on the lamp carrier. The substrate material can be selected according to demand, and the substrate can be purchased by oneself for cutting and application, thereby reducing costs. In the manufacturing process, when the circuit layer is detected to be unqualified, the insulating bottom layer can be peeled off, which saves cost and can reduce the pollution of the waste substrate to the environment. The carrier jig can be reused. DETAILED DESCRIPTION

[0065] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0066] 1. An embodiment of the process for manufacturing a substrate-free circuit body of the present invention is proposed:

[0067] A process for manufacturing a circuit body without a substrate comprises the following steps:

[0068] Step 1) Prepare a support fixture for supporting the circuit layer. The support fixture is flat and has a flat surface and positioning holes 1 at the four corners.

[0069] Step 2) Coat the bearing surface of the bearing fixture with a low-concentration resin and cover it with a copper foil layer. The low-concentration resin is an adhesive. The copper foil layer is bonded to the bearing fixture through the low-concentration resin. After the low-concentration resin is cured, a peelable insulating bottom layer is formed. A positioning hole 2 corresponding to the positioning hole 1 is provided on the copper foil layer. The positioning hole 2 is aligned with the positioning hole so that the copper foil layer is accurately attached to the bearing surface of the bearing fixture. The setting of the positioning hole 2 and the positioning hole 1 is also used for the positioning and attachment of the photomask in the subsequent steps.

[0070] Step 3) Make and inspect the circuit layer: The copper foil layer is made into the circuit layer through the etching process. The etching process is a prior art, including photomask coating, UV lamp irradiation, development, etching, dissolving photomask and other processes. After the circuit layer is made, it is inspected by an optical inspection machine. If it fails the inspection, the insulating bottom layer can be peeled off and the bearing fixture can continue to be used; if it passes the inspection, it proceeds to the next step.

[0071] Step 4) Make an insulating protective layer: apply solder resist ink on the circuit layer, cover the solder resist ink with a photomask printed with pad covering positions, and remove the photomask after irradiating with UV light, so that the ink parts not covered by the pad covering positions are cured by ultraviolet light to form an insulating protective layer, while the ink at the pad position covered by the pad covering position is not cured, and then use solder resist development technology to remove the ink on the pad to expose the pad, and apply anti-oxidation material on the pad.

[0072] Step 5) soldering components on the pads of the circuit layer, and the circuit body is composed of the insulating bottom layer, the circuit layer, the insulating protection layer and the components.

[0073] Step 6) Peel the circuit body off the supporting jig and cut it into the required shape.

[0074] The manufactured circuit body can be bonded to a substrate of any material to form a circuit board. Users can choose the substrate according to their needs, and can purchase the substrate for processing to reduce costs. In the manufacturing process, if the circuit layer fails the inspection, the insulating bottom layer can be peeled off, which saves costs. The bearing fixture can be reused.

[0075] 2. An embodiment of the circuit board manufacturing process of the present invention is proposed:

[0076] A manufacturing process comprises the following steps:

[0077] Step 1) Prepare a support fixture for supporting the circuit layer. The support fixture is flat and has a flat surface and positioning holes 1 at the four corners.

[0078] Step 2) Coat the bearing surface of the bearing fixture with a low-concentration resin and cover it with a copper foil layer. The low-concentration resin is an adhesive. The copper foil layer is bonded to the bearing fixture through the low-concentration resin. After the low-concentration resin is cured, a peelable insulating bottom layer is formed. A positioning hole 2 corresponding to the positioning hole 1 is provided on the copper foil layer. The positioning hole 2 is aligned with the positioning hole so that the copper foil layer is accurately attached to the bearing surface of the bearing fixture. The setting of the positioning hole 2 and the positioning hole 1 is also used for the positioning and attachment of the photomask in the subsequent steps.

[0079] Step 3) Make and inspect the circuit layer: The copper foil layer is made into the circuit layer through the etching process. The etching process is a prior art, including photomask coating, UV lamp irradiation, development, etching, dissolving photomask and other processes. After the circuit layer is made, it is inspected by an optical inspection machine. If it fails the inspection, the insulating bottom layer can be peeled off and the bearing fixture can continue to be used; if it passes the inspection, it proceeds to the next step.

[0080] Step 4) Make an insulating protective layer: apply solder resist ink on the circuit layer, cover the solder resist ink with a photomask printed with pad covering positions, and remove the photomask after irradiating with UV light, so that the ink parts not covered by the pad covering positions are cured by ultraviolet light to form an insulating protective layer, while the ink at the pad position covered by the pad covering position is not cured, and then use solder resist development technology to remove the ink on the pad to expose the pad, and apply anti-oxidation material on the pad.

[0081] Step 5) soldering components on the pads of the circuit layer, and the circuit body is composed of the insulating bottom layer, the circuit layer, the insulating protection layer and the components.

[0082] Step 6) Peel the circuit body off the supporting jig and cut it into the required shape.

[0083] Step 7) Cut the substrate into a desired shape. The substrate material is selected according to the needs, and can be a metal plate, a ceramic plate, a plastic plate or a polymer fiber cloth.

[0084] Step 8) bonding the circuit body to the substrate. The circuit body and the substrate are bonded by heat-conducting insulating adhesive.

[0085] In this process, the carrier jig can be reused. During the production process, if the circuit layer fails the inspection, the insulating bottom layer can be peeled off, which will not waste the substrate and can reduce the pollution of the waste substrate to the environment.

[0086] 3. An embodiment of the luminous body manufacturing process of the present invention is proposed:

[0087] A luminous body manufacturing process comprises the following steps:

[0088] Step 1) Prepare a support fixture for supporting the circuit layer. The support fixture is flat and has a flat surface and positioning holes 1 at the four corners.

[0089] Step 2) Coat the bearing surface of the bearing fixture with a low-concentration resin and cover it with a copper foil layer. The low-concentration resin is an adhesive. The copper foil layer is bonded to the bearing fixture through the low-concentration resin. After the low-concentration resin is cured, a peelable insulating bottom layer is formed. A positioning hole 2 corresponding to the positioning hole 1 is provided on the copper foil layer. The positioning hole 2 is aligned with the positioning hole so that the copper foil layer is accurately attached to the bearing surface of the bearing fixture. The setting of the positioning hole 2 and the positioning hole 1 is also used for the positioning and attachment of the photomask in the subsequent steps.

[0090] Step 3) Make and inspect the circuit layer: The copper foil layer is made into the circuit layer through the etching process. The etching process is a prior art, including photomask coating, UV lamp irradiation, development, etching, dissolving photomask and other processes. After the circuit layer is made, it is inspected by an optical inspection machine. If it fails the inspection, the insulating bottom layer can be peeled off and the bearing fixture can continue to be used; if it passes the inspection, it proceeds to the next step.

[0091] Step 4) Make an insulating protective layer: apply solder resist ink on the circuit layer, cover the solder resist ink with a photomask printed with pad covering positions, and remove the photomask after irradiating with UV light, so that the ink parts not covered by the pad covering positions are cured by ultraviolet light to form an insulating protective layer, while the ink at the pad position covered by the pad covering position is not cured, and then use solder resist development technology to remove the ink on the pad to expose the pad, and apply anti-oxidation material on the pad.

[0092] Step 5) solder the LED lamp beads on the pads of the circuit layer, and the circuit body is composed of the insulating bottom layer, the circuit layer, the insulating protection layer and the LED lamp beads. If the circuit layer includes an LED driving circuit, the driving components are also soldered on the circuit layer.

[0093] Step 6) Peel the circuit body off the supporting jig and cut it into the required shape.

[0094] Step 7) Cut the substrate into a desired shape. The substrate material is selected according to the needs, and can be a metal plate, a ceramic plate, a plastic plate or a polymer fiber cloth.

[0095] Step 8) The circuit body is bonded to the substrate by heat-conducting insulating adhesive. LED lamp beads are welded on the circuit body and combined with the substrate to form a light-emitting board.

[0096] 9) The light-emitting board is fixed to the lamp carrier by bonding with heat-conducting insulating adhesive to form a light-emitting body.

[0097] The carrier jig in this process can be reused. During production, if the circuit layer fails the inspection, the insulating bottom layer can be peeled off, which will not waste the substrate and can reduce the pollution of the waste substrate to the environment. The circuit body and the substrate are made separately. The lighting manufacturer can choose the substrate material according to the needs, and can purchase the substrate for cutting and application, which reduces the cost.

[0098] 4. Another embodiment of the luminous body manufacturing process of the present invention is proposed:

[0099] A luminous body manufacturing process comprises the following steps:

[0100] Step 1) Prepare a support fixture for supporting the circuit layer. The support fixture is flat and has a flat surface and positioning holes 1 at the four corners.

[0101] Step 2) Coat the bearing surface of the bearing fixture with a low-concentration resin and cover it with a copper foil layer. The low-concentration resin is an adhesive. The copper foil layer is bonded to the bearing fixture through the low-concentration resin. After the low-concentration resin is cured, a peelable insulating bottom layer is formed. A positioning hole 2 corresponding to the positioning hole 1 is provided on the copper foil layer. The positioning hole 2 is aligned with the positioning hole so that the copper foil layer is accurately attached to the bearing surface of the bearing fixture. The setting of the positioning hole 2 and the positioning hole 1 is also used for the positioning and attachment of the photomask in the subsequent steps.

[0102] Step 3) Make and inspect the circuit layer: The copper foil layer is made into the circuit layer through the etching process. The etching process is a prior art, including photomask coating, UV lamp irradiation, development, etching, dissolving photomask and other processes. After the circuit layer is made, it is inspected by an optical inspection machine. If it fails the inspection, the insulating bottom layer can be peeled off and the bearing fixture can continue to be used; if it passes the inspection, it proceeds to the next step.

[0103] Step 4) Make an insulating protective layer: apply solder resist ink on the circuit layer, cover the solder resist ink with a photomask printed with pad covering positions, and remove the photomask after irradiating with UV light, so that the ink parts not covered by the pad covering positions are cured by ultraviolet light to form an insulating protective layer, while the ink at the pad position covered by the pad covering position is not cured, and then use solder resist development technology to remove the ink on the pad to expose the pad, and apply anti-oxidation material on the pad.

[0104] Step 5) solder the LED lamp beads on the pads of the circuit layer, and the circuit body is composed of the insulating bottom layer, the circuit layer, the insulating protection layer and the LED lamp beads. If the circuit layer includes an LED driving circuit, the driving components are also soldered on the circuit layer.

[0105] Step 6) Peel the circuit body off the supporting jig and cut it into the required shape.

[0106] Step 7) Cut the substrate into a desired shape. The substrate material is selected according to the needs, and can be a metal plate, a ceramic plate, a plastic plate or a polymer fiber cloth.

[0107] Step 8) The substrate is fixed to the lamp carrier by bonding with a heat-conducting insulating adhesive.

[0108] Step 9) The circuit body is fixed to the substrate by bonding with a heat-conducting insulating adhesive, and the circuit body, the substrate and the lamp carrier are combined to form a light-emitting body.

[0109] The carrier jig in this process can be reused. During production, if the circuit layer fails the inspection, the insulating bottom layer can be peeled off, which will not waste the substrate and can reduce the pollution of the waste substrate to the environment. The circuit body and the substrate are made separately, so that the substrate can be fixed to the lamp carrier first. Lamp manufacturers can choose the substrate material according to their needs, and can purchase the substrate for cutting and application to reduce costs.

[0110] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structural transformation made using the specification of the present invention, or directly or indirectly applied in other related technical fields, is also included in the patent protection scope of the present invention.

Claims

1. A process for manufacturing a circuit body without a substrate, characterized in that: The following steps are involved: 1) Prepare a bearing fixture for bearing the circuit layer; 2) Making a strippable insulating bottom layer on the bearing surface of the bearing fixture; 3) Make the circuit layer on the insulating bottom layer and test the circuit layer; 4) Making an insulating protective layer on the circuit layer and exposing the pads of the circuit layer; 5) Solder components on the pads of the circuit layer, and the circuit body is composed of the insulating bottom layer, circuit layer, insulating protective layer and components; 6) Peel the circuit body off the supporting jig and cut it into shape.

2. The process for manufacturing a substrate-free circuit main body according to claim 1, characterized in that: The circuit layer is made of a copper foil layer bonded on the insulating bottom layer through an etching process.

3. The process for manufacturing a substrate-free circuit main body according to claim 2, characterized in that: The carrying jig is provided with a first positioning hole, and the copper foil layer is provided with a corresponding second positioning hole. The copper foil layer is aligned with the second positioning hole and is attached to the carrying surface of the carrying jig.

4. The circuit board manufacturing process according to claim 1, 2 or 3, characterized in that: A low-concentration resin is coated on the bearing surface of the bearing fixture to form the insulating bottom layer.

5. A circuit board manufacturing process, characterized in that: The following steps are involved: 1) Using the process for manufacturing a circuit body without a substrate according to any one of claims 1 to 4 to manufacture a circuit body; 2) cutting the substrate into a desired shape; 3) Bond the circuit body to the substrate.

6. A luminous body manufacturing process, characterized in that: The following steps are involved: 1) Using LED lamp beads as components, and adopting the substrate-free circuit body manufacturing process described in any one of claims 1 to 4 to manufacture the circuit body; 2) cutting the substrate into a desired shape; 3) Bonding the circuit body to the substrate to form a light-emitting board; 4) Fix the light-emitting board to the lamp carrier.

7. A luminous body manufacturing process, characterized in that: The following steps are involved: 1) Using LED lamp beads as components, and adopting the substrate-free circuit body manufacturing process described in any one of claims 1 to 4 to manufacture the circuit body; 2) cutting the substrate into a desired shape; 3) bonding the substrate to the lamp carrier; 4) Bond the circuit body to the substrate.

8. The luminous body manufacturing process according to claim 5, 6 or 7, characterized in that: The substrate is a metal plate, a ceramic plate, a plastic plate or a polymer fiber cloth.

9. The circuit board manufacturing process according to claim 5, 6 or 7, characterized in that: The circuit body and the substrate are bonded together by heat-conducting insulating adhesive.

10. The circuit board manufacturing process according to claim 6 or 7, characterized in that: The substrate and the lamp carrier are bonded together by heat-conducting insulating adhesive.