High-voltage static electrode micro particulate matter removing device suitable for semiconductor manufacturing industry

Abstract

The invention discloses a high-voltage static electrode micro particulate matter removing device suitable for the semiconductor manufacturing industry. The device comprises a base, a movable removing assembly arranged on the surface of the base, a particulate matter removing adjusting assembly arranged in the base and a clamping assembly arranged in the base. The semiconductor raw materials are moved and removed in the inclined groove, the semiconductor raw materials are subjected to self-rotation to remove particles, the semiconductor raw materials can be quickly mounted and dismounted in the inclined groove, the semiconductor raw materials are effectively clamped to remove the particles, the time loss of personnel is reduced in the particle removing process, and the working efficiency is improved. The extension height of the first particle removing plate and the second particle removing plate can be adjusted through a hydraulic pump connected with the bottoms in a matched mode, the semiconductor raw materials are subjected to different requirements and required particle removing, and different particle removing plates can be conveniently installed at the particle removing positions. And in the process of removing the particles from the semiconductor raw material, an efficient adjustment intervention measure is provided for the control of the next stage after the particles are removed.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing equipment, and in particular to a high-voltage static electrode micro-particle removal device suitable for the semiconductor manufacturing industry. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. Most electronic products, such as computers, mobile phones or digital recorders, have a very close relationship with semiconductors in their core units. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential semiconductor material in various applications.

[0003] Patent No. (CN114196900A) discloses a method for surface treatment of stainless steel components in the semiconductor chip manufacturing industry. The invention uses a mixed solution of ammonia water, hydrogen peroxide and water in a volume ratio of 1:3:4. The mixed solution can react chemically with Ti-containing materials frequently used in semiconductor chip manufacturing, and will not corrode the stainless steel components themselves, and has high chemical selectivity. The arc aluminum spraying process used in the spraying process further increases the roughness of the component surface on the basis of sandblasting, ensuring that the attachments of the components are more tightly combined during use, and the product itself will not be affected by the falling of the attachments. At the same time, it can also reduce the difficulty of cleaning the attachments of the component later, and reduce the cleaning cost. The surface treatment of stainless steel components using the method of the present invention can meet the surface finish and roughness conditions, and improve the accuracy and qualified rate of chip products.

[0004] However, there are some problems in the use of manufacturing equipment in the existing semiconductor manufacturing industry. 1. The current semiconductor manufacturing industry on the market is not convenient for moving and removing surface particles as a whole, which increases the time loss of personnel during the removal process and is not convenient to operate; 2. The current semiconductor manufacturing industry on the market is not convenient for adjusting the overall degree of control when removing surface particles. In the process of removing particles from semiconductor raw materials, there is a lack of efficient adjustment intervention measures for the next stage of control after particle removal, thereby reducing the overall particle removal quality and process convenience; 3. The current semiconductor manufacturing industry on the market lacks a good clamping and stabilization measure when removing microparticles from its semiconductor raw materials, making it inconvenient for rapid removal. To this end, we propose a high-voltage static electrode microparticle removal device suitable for the semiconductor manufacturing industry; Summary of the invention

[0005] The object of the present invention is to provide a high-voltage static electrode micro-particle removal device suitable for the semiconductor manufacturing industry to solve the problems raised in the above-mentioned background technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: comprising a base, a moving removal component arranged on the surface of the base, a particle removal adjustment component arranged inside the base, and a clamping component arranged inside the base;

[0007] Fixed blocks are arranged on both sides of the base, and movable blocks are arranged on both sides of the base;

[0008] The moving and removing assembly comprises an inclined opening opened on one side of the fixed block, an electric telescopic rod is arranged inside the inclined opening, one end of the electric telescopic rod is matched and connected with a spring column, and one end of the spring column is arranged with a movable block;

[0009] The particle removal adjustment component includes a hydraulic pump disposed inside the base, a fixing plate is disposed at one end of the hydraulic pump, a first particle removal plate is connected to the surface of the fixing plate, and a second particle removal plate is connected to the surface of the fixing plate;

[0010] The clamping assembly comprises a placing block arranged at one side of the movable block, a placing opening is provided inside the placing block, a clamping plate is connected inside the placing opening, and a semiconductor raw material is connected inside the placing opening.

[0011] Preferably, the movable removal component also includes a mounting groove opened on the inclined surface inside the inclined mouth, an electric telescopic rod is cooperatively connected to the inside of the mounting groove, one end of the electric telescopic rod is detachably connected to a connecting head, one side of the movable block is fixedly connected to a mounting plate, a circular groove is opened on the surface of the mounting plate, a spring column is detachably connected to the inside of the circular groove, and one end of the spring column is detachably connected to a connecting head.

[0012] Preferably, the particle removal adjustment assembly also includes a first mounting plate detachably connected to one end of the hydraulic pump, a second mounting plate detachably connected to the other end of the hydraulic pump, an inclined groove is provided on the surface of the shell, and the first mounting plate is detachably connected to the bottom of the inclined groove.

[0013] Preferably, the surface of the second mounting plate is detachably connected to the bottom of the fixing plate, there are multiple fixing plates, and the mesh sizes of the first particle removal plate and the second particle removal plate are different.

[0014] Preferably, openings are provided on both side surfaces of the base, an inclined groove is provided inside the opening, an embedded block is connected inside the inclined groove, a movable plate is fixedly connected to one end of the embedded block, a connecting port is provided on the surface of the base, and the inside of the connecting port is communicated with the inside of the embedded groove.

[0015] Preferably, the clamping assembly also includes a vertical plate arranged inside the inclined groove, a placement block is embedded in the vertical plate, a clamping block is movably connected inside the placement opening of the placement block, a first screw hole is opened on the surface of the clamping block, and a second screw hole is opened on the inner bottom of the placement opening.

[0016] Preferably, the first and second particle removal plates are cooperatively connected with side plates on their outer sides, a first connecting hole is provided on the surface of the side plate, a second connecting hole is provided on the outer surface of the fixed plate, the first and second connecting holes are internally aligned, and bolts are cooperatively connected inside the first and second connecting holes.

[0017] Preferably, one side of the movable block is detachably connected to an inclined plate, one end of the inclined plate is detachably connected to a motor, the output end of the motor is connected to an input end of a rotating shaft, one end of the rotating shaft is detachably connected to a connecting column, and one end of the connecting column is detachably connected to a vertical plate.

[0018] Preferably, a cooling groove is provided at one end of the base, drainage ports are provided on both sides of the cooling groove, and a conduit is embedded and connected at one end of the drainage port.

[0019] Preferably, the surface of the conduit is connected with a valve, one end of the base is provided with a chip removal port, the interior of the chip removal port is communicated with the interior of the inclined groove, and the surface of the base is detachably connected with a controller, through which the power supply current of the motor and the electric telescopic rod is controlled.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. In the technical solution, when removing surface particles from the semiconductor raw material, the semiconductor raw material is moved and removed in the chute, so that it can be conveniently placed in different particle removal positions, and the semiconductor raw material is self-rotated to remove particles, thereby increasing the particle removal efficiency. The semiconductor raw material can be quickly installed and disassembled in the chute, and is effectively clamped to remove particles. The time loss of personnel is reduced during the particle removal process, and the operation is convenient.

[0022] 2. In the technical solution, during the particle removal process, the first particle removal plate and the second particle removal plate can be adjusted in extension height by a hydraulic pump connected at the bottom to perform particle removal according to different requirements and needs of the semiconductor raw materials, and different particle removal plates can be conveniently installed at the particle removal position, which is beneficial to increase the particle removal efficiency of the semiconductor raw materials and reduce the collision loss caused by the need to change the particle removal position and transport. In the process of particle removal of semiconductor raw materials, there are efficient adjustment intervention measures for the next stage control after particle removal, thereby improving the overall particle removal quality and process convenience.

[0023] 3. In the technical scheme, first, an embedded block fixedly connected to one end of the movable block is inserted into the embedded groove through an opening provided on the surface of the base, so that the embedded block can move in the embedded groove. The embedded groove is provided in the inner groove provided on both sides of the base, so that the embedded block can move in the embedded groove. The extension angle of the opening and the embedded groove is consistent with the extension angle of the inclined groove, which is convenient for the movable block to extend to the embedded groove and the base for horizontal movement. A fixed block is fixedly connected to the outer side of the top of the inclined end of the base, and the fixed block is opened to the mounting groove through an inclined opening provided on one side. The mounting opening is located on the inclined surface of the inner side of the inclined opening. The electric telescopic rod is installed and connected through the mounting opening. One end of the electric telescopic rod is installed with a spring column through a connecting head, and the spring column is installed in a circular groove provided in the mounting block. One end of the mounting block is fixedly connected to the movable block. The function of the spring column is to provide a micro-angle adjustment for the electric telescopic rod when extending and retracting, which is convenient for the inclined installation of the electric telescopic rod. At this time, the power supply of the electric telescopic rod can be turned on by the controller to drive the movable block to move horizontally on the bottom plate and outside the inclined groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0025] Figure 1 This is a schematic diagram of the overall structure of a high-voltage static electrode micro-particle removal device suitable for the semiconductor manufacturing industry of the present invention;

[0026] Figure 2 It is a schematic diagram of the structure of a particle removal regulating component of a high-voltage static electrode micro-particle removal device applicable to the semiconductor manufacturing industry of the present invention;

[0027] Figure 3 This is a schematic diagram of the internal structure of a movable block of a high-voltage static electrode micro-particle removal device suitable for the semiconductor manufacturing industry of the present invention;

[0028] Figure 4 This is a schematic diagram of the structure of a clamping assembly of a high-voltage static electrode micro-particle removal device suitable for the semiconductor manufacturing industry of the present invention;

[0029] Figure 5 This is a schematic diagram of the bottom structure of a fixed plate of a high-voltage static electrode micro-particle removal device applicable to the semiconductor manufacturing industry of the present invention;

[0030] Figure 6 This is a schematic diagram of the structure of a fixed block of a high-voltage static electrode micro-particle removal device applicable to the semiconductor manufacturing industry of the present invention;

[0031] Figure 7 This is a schematic diagram of the internal structure of a cooling tank of a high-voltage static electrode micro-particle removal device suitable for the semiconductor manufacturing industry according to the present invention;

[0032] Figure 8 The present invention is a high-voltage static electrode micro-particle removal device suitable for semiconductor manufacturing industry Figure 3 Schematic diagram of the structure enlarged view of point A in the middle.

[0033] In the figure: 1, base; 2, inclined groove; 3, opening; 4, embedded groove; 5, connecting port; 6, embedded block; 7, mounting block; 8, movable block; 9, fixed block; 101, inclined port; 102, mounting groove; 103, electric telescopic rod; 104, connecting head; 105, spring column; 106, round groove; 111, first mounting plate; 112, hydraulic pump; 113, second mounting plate; 114, fixed plate; 115, first particle removal plate; 116, second particle removal plate Particle board; 12, side plate; 13, first connecting hole; 14, second connecting hole; 15, bolt; 16, inclined plate; 17, motor; 18, rotating shaft; 19, connecting column; 201, vertical plate; 202, placement block; 203, placement port; 204, clamping plate; 205, first screw hole; 206, second screw hole; 21, cooling trough; 22, drain port; 23, conduit; 24, valve; 25, chip removal port; 26, semiconductor raw material; 27, controller. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0035] See also Figure 1-8 As shown, a schematic diagram of the overall structure of a high-voltage static electrode micro-particle removal device suitable for the semiconductor manufacturing industry includes a base 1, a mobile removal component arranged on the surface of the base 1, a particle removal adjustment component arranged inside the base 1, and a clamping component arranged inside the base 1.

[0036] Fixed blocks 9 are arranged on both sides of the base 1 , and movable blocks 8 are arranged on both sides of the base 1 .

[0037] The movable removal assembly includes an inclined opening 101 opened on one side of the fixed block 9 , an electric telescopic rod 103 is arranged inside the inclined opening 101 , one end of the electric telescopic rod 103 is connected with a spring column 105 , and one end of the spring column 105 is arranged with a movable block 8 .

[0038] The clamping assembly includes a placement block 202 disposed on one side of the movable block 8 . A placement opening 203 is provided inside the placement block 202 . A clamping plate 204 is connected to the placement opening 203 . A semiconductor raw material 26 is connected to the placement opening 203 .

[0039] The movable removal component also includes a mounting groove 102 opened on the inclined surface inside the inclined mouth 101, and an electric telescopic rod 103 is connected inside the mounting groove 102, and a connector 104 is detachably connected to one end of the electric telescopic rod 103. A mounting plate is fixedly connected to one side of the movable block 8, and a circular groove 106 is opened on the surface of the mounting plate. A spring column 105 is detachably connected inside the circular groove 106, and a connector 104 is detachably connected to one end of the spring column 105.

[0040] Openings 3 are provided on both sides of the base 1, and inclined grooves 2 are provided inside the openings 3. Insert blocks 6 are connected to the inside of the inclined grooves 2, and a movable plate is fixedly connected to one end of the insert block 6. A connecting port 5 is provided on the surface of the base 1, and the inside of the connecting port 5 is communicated with the inside of the insert groove 4.

[0041] The clamping assembly also includes a vertical plate 201 arranged inside the inclined groove 2, and a placement block 202 is embedded inside the vertical plate 201. A clamping block is movably connected inside the placement opening 203 of the placement block 202. A first screw hole 205 is opened on the surface of the clamping block, and a second screw hole 206 is opened on the inner bottom of the placement opening 203.

[0042] In this embodiment, first, the embedded block 6 fixedly connected at one end of the movable block 8 is inserted into the embedded groove 4 through the opening 3 opened on the surface of the base 1, so that the embedded block 6 can move in the embedded groove 4. The embedded groove 4 is opened in the inner groove opened on both sides of the base 1, so that the embedded block 6 can move in the embedded groove 4. The extension angle of the opening 3 and the inside of the embedded groove 4 is consistent with the extension angle of the inside of the inclined groove 2, which is convenient for the movable block 8 to extend to the embedded groove 4 and move horizontally with the base 1. The outer side of the top of the inclined end of the base 1 is fixedly connected with a fixed block 9, and the fixed block 9 is opened to the installation groove 102 through the inclined opening 101 opened on one side, and the installation opening is located at the inclined opening 101. On the inner inclined surface, the electric telescopic rod 103 is installed and connected through the installation port, one end of the electric telescopic rod 103 is installed with the spring column 105 through the connector 104, the spring column 105 is installed in the circular groove 106 provided inside the mounting block 7, one end of the mounting block 7 is fixedly connected with the movable block 8, the function of the spring column 105 is to provide a micro-angle adjustment for the electric telescopic rod 103 when extending and retracting, so as to facilitate the installation of the electric telescopic rod 103 in an inclined shape, at this time, the power supply of the electric telescopic rod 103 can be turned on through the controller 27 to drive the movable block 8 to move horizontally on the bottom plate and outside the inclined slot 2.

[0043] Subsequently, the motor 17 is installed on the inner side of the movable block 8 through the inclined plate 16, and the input end of the rotating shaft 18 connected to the output end of the motor 17 is connected to the vertical plate 201 through the connecting column 19. A placement block 202 is installed inside the vertical plate 201, and the two ends of the semiconductor raw material 26 are placed through the placement opening 203 opened inside the placement block 202. After the semiconductor raw material 26 is placed in the placement opening 203, a clamping plate 204 is installed on the top of the placement opening 203. The first screw hole 205 opened on the surface of the clamping plate 204 is aligned with the inside of the second screw hole 206 opened on the top of the placement opening 203. The bolts 15 are tightened therein to stably install the semiconductor raw material 26. The movable block 8 is located on both sides of the base 1, and there are clamping mechanisms and motors 17 on both sides to connect and control the semiconductor raw material 26.

[0044] Next, when removing the surface particles, the power current output ends of the two motors 17 are connected through the controller 27. The motor 17 drives the rotating shaft 18 connected to its output end to rotate, and the rotating shaft 18 drives the vertical plate 201 connected at one end through the connecting column 19 to rotate. Finally, the semiconductor raw material 26 is driven to rotate through the vertical plate 201 and the clamping mechanism inside it. A particle removal mechanism corresponding to different particle removal effects is installed in the chute 2 (the particle removal mechanism is shown in Example 2). The semiconductor raw material 26 can be moved and removed by moving it to different particle removal plate surfaces through the movement of the electric telescopic rod 103.

[0045] It should be noted that when removing surface particles from the semiconductor raw material 26, the semiconductor raw material 26 is moved and removed in the chute 2 so that it can be conveniently placed in different particle removal positions, and the semiconductor raw material 26 is self-rotated to remove particles, thereby increasing the particle removal efficiency. The semiconductor raw material 26 can be quickly installed and disassembled in the chute 2, and is effectively clamped to remove particles, thereby reducing the time loss of personnel in the particle removal process and facilitating operation.

[0046] Example 2: Please refer to Figure 1 , Figure 2 , Figure 5 and Figure 7 This embodiment further explains Example 1. The particle removal adjustment component in the figure includes a hydraulic pump 112 arranged inside the base 1, and a fixed plate 114 is arranged at one end of the hydraulic pump 112. The surface of the fixed plate 114 is connected to a first particle removal plate 115, and the surface of the fixed plate 114 is connected to a second particle removal plate 116.

[0047] The particle removal adjustment component also includes a first mounting plate 111 detachably connected to one end of the hydraulic pump 112, and a second mounting plate 113 detachably connected to the other end of the hydraulic pump 112. An inclined groove 2 is opened on the surface of the shell, and the first mounting plate 111 is detachably connected to the bottom of the inclined groove 2.

[0048] The surface of the second mounting plate 113 is detachably connected to the bottom of the fixing plate 114 . There are multiple fixing plates 114 . The first particle removal plate 115 and the second particle removal plate 116 have different mesh sizes, which is convenient for removing particles of different sizes.

[0049] A cooling groove 21 is provided at one end of the base 1, and drainage ports 22 are provided on both sides of the cooling groove 21. A conduit 23 is embedded in one end of the drainage port 22, and a valve 24 is connected to the surface of the conduit 23. A chip discharge port 25 is provided at one end of the base 1, and the interior of the chip discharge port 25 is communicated with the interior of the inclined groove 2. A controller 27 is detachably connected to the surface of the base 1, and the power supply current of the motor 17 and the electric telescopic rod 103 is controlled by the controller 27.

[0050] In this embodiment, the hydraulic pump 112 is installed at the bottom of the inner side of the chute 2 through the first mounting plate 111, and the first mounting plate 111 is multiple and the hydraulic pump 112 is also multiple. The multiple hydraulic pumps 112 and the first mounting plate 111 are used to increase the installation of the fixed plate 114, thereby increasing the stability when removing surface particles and preventing the occurrence of force shedding. The hydraulic pump 112 is installed at the bottom of the fixed plate 114 through the second mounting plate 113 detachably connected at the top. The hydraulic pump 112 is multiple and the fixed plate 114 is also multiple. The first particle removal plate 115 and the second particle removal plate 116 are installed through the multiple fixed plates 114, thereby increasing the diverse selectivity of particle removal. When the semiconductor raw material 26 rotates, the power supply current output ends of the hydraulic pumps 112 of different groups are connected through the controller 27, so that the hydraulic pump 112 works to lift the fixed plate 114, so that the required particle removal surface installed on the surface of the required fixed plate 114 is lifted, so that it contacts the surface of the semiconductor raw material 26, and performs targeted particle removal.

[0051] Subsequently, when the first particle removal plate 115 and the second particle removal plate 116 are worn and need to be replaced, the user can loosen the bolts 15 connected to the inside of the first connecting hole 13 and the second connecting hole 14 to separate the side plate 12 from the fixed plate 114. The first particle removal plate 115 and the second particle removal plate 116 are both installed with bendable side plates 12 on the outside, and the side plates 12 are connected to the second connecting holes 14 on the outside of the fixed plate 114 through the first connecting holes 13 opened on the surface by bolts 15, which facilitates the installation between the first particle removal plate 115 and the second particle removal plate 116 and the fixed plate 114 and also facilitates disassembly, so that the whole is easy to replace.

[0052] Then, the particle body after the particle is removed is discharged through the chip removal port 25 opened at the bottom of the base 1, and the interior of the chip removal port 25 is communicated with the interior of the chute 2. After the semiconductor raw material 26 is removed from the particles, it is disassembled and placed in a cooling groove 21 opened at one end of the top of the base 1. The surface of the semiconductor raw material 26 is cooled by the liquid in the cooling groove 21, and anti-oxidation treatment is performed to improve the quality and performance of the material surface. The discharge port 22 opened in the cooling groove 21 discharges the waste liquid through the conduit 23 to increase the convenience of use. The conduit 23 is controlled by a valve 24 connected to the surface.

[0053] It should be noted that, during the particle removal process, the first particle removal plate 115 and the second particle removal plate 116 can be adjusted in extension height by means of the hydraulic pump 112 connected at the bottom, so as to perform particle removal according to different requirements and needs on the semiconductor raw material 26, and different particle removal plates can be conveniently installed at the particle removal position, which is beneficial to increase the particle removal efficiency of the semiconductor raw material 26 and reduce the collision loss caused by the need to change the particle removal position and transport. In the process of particle removal of the semiconductor raw material, there are efficient adjustment intervention measures for the next stage control after particle removal, thereby improving the overall particle removal quality and process convenience.

[0054] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A high voltage static electrode micro-particle removal device suitable for semiconductor manufacturing industry, characterized by: It comprises a base (1), a moving removal component arranged on the surface of the base (1), a particle removal adjustment component arranged inside the base (1), and a clamping component arranged inside the base (1); Fixed blocks (9) are arranged on both sides of the base (1), and movable blocks (8) are arranged on both sides of the base (1); The moving and removing assembly comprises an inclined opening (101) opened on one side of the fixed block (9), an electric telescopic rod (103) is arranged inside the inclined opening (101), one end of the electric telescopic rod (103) is connected with a spring column (105), and one end of the spring column (105) is provided with a movable block (8); The particle removal adjustment component comprises a hydraulic pump (112) arranged inside the base (1); a fixing plate (114) is arranged at one end of the hydraulic pump (112); a first particle removal plate (115) is cooperatively connected to the surface of the fixing plate (114); and a second particle removal plate (116) is cooperatively connected to the surface of the fixing plate (114); The clamping assembly comprises a placement block (202) arranged on one side of the movable block (8); a placement opening (203) is provided inside the placement block (202); a clamping plate (204) is connected inside the placement opening (203); and a semiconductor raw material (26) is connected inside the placement opening (203).

2. The high-voltage static electrode micro-particle removal device suitable for semiconductor manufacturing industry according to claim 1 is characterized in that: The moving and removing assembly further comprises a mounting groove (102) provided on the inner inclined surface of the inclined opening (101); an electric telescopic rod (103) is cooperatively connected to the inside of the mounting groove (102); one end of the electric telescopic rod (103) is detachably connected to a connector (104); one side of the movable block (8) is fixedly connected to a mounting plate; a circular groove (106) is provided on the surface of the mounting plate; a spring column (105) is detachably connected to the inside of the circular groove (106); one end of the spring column (105) is detachably connected to the connector (104).

3. The high-voltage static electrode micro-particle removal device suitable for semiconductor manufacturing industry according to claim 2 is characterized by: The particle removal adjustment component also includes a first mounting plate (111) detachably connected to one end of the hydraulic pump (112); the other end of the hydraulic pump (112) is detachably connected to a second mounting plate (113); an inclined groove (2) is provided on the surface of the shell; and the first mounting plate (111) is detachably connected to the bottom of the inclined groove (2).

4. The high-voltage static electrode micro-particle removal device suitable for semiconductor manufacturing industry according to claim 3 is characterized by: The surface of the second mounting plate (113) is detachably connected to the bottom of the fixing plate (114), there are multiple fixing plates (114), and the mesh sizes of the first particle removal plate (115) and the second particle removal plate (116) are different.

5. The high-voltage static electrode micro-particle removal device suitable for semiconductor manufacturing industry according to claim 4 is characterized in that: The base (1) is provided with openings (3) on both side surfaces, an inclined groove (2) is provided inside the opening (3), an insert (6) is connected to the inside of the inclined groove (2), and a movable plate is fixedly connected to one end of the insert (6), and a connecting port (5) is provided on the surface of the base (1), and the inside of the connecting port (5) is communicated with the inside of the insert groove (4).

6. The high-voltage static electrode micro-particle removal device suitable for semiconductor manufacturing industry according to claim 1 is characterized by: The clamping assembly also includes a vertical plate (201) arranged inside the inclined groove (2), a placement block (202) is embedded and connected inside the vertical plate (201), a clamping block is movably connected inside the placement opening (203) of the placement block (202), a first screw hole (205) is opened on the surface of the clamping block, and a second screw hole (206) is opened on the inner bottom of the placement opening (203).

7. The high-voltage static electrode micro-particle removal device suitable for semiconductor manufacturing industry according to claim 1 is characterized by: The first particle removal plate (115) and the second particle removal plate (116) are connected to the outside of a side plate (12), a first connection hole (13) is provided on the surface of the side plate (12), a second connection hole (14) is provided on the outside surface of the fixing plate (114), the first connection hole (13) and the second connection hole (14) are aligned inside, and bolts (15) are connected inside the first connection hole (13) and the second connection hole (14).

8. The high-voltage static electrode micro-particle removal device suitable for semiconductor manufacturing industry according to claim 7 is characterized in that: One side of the movable block (8) is detachably connected to an inclined plate (16), one end of the inclined plate (16) is detachably connected to a motor (17), an output end of the motor (17) is connected to an input end of a rotating shaft (18), one end of the rotating shaft (18) is detachably connected to a connecting column (19), and one end of the connecting column (19) is detachably connected to a vertical plate (201).

9. The high-voltage static electrode micro-particle removal device suitable for semiconductor manufacturing industry according to claim 1 is characterized by: A cooling groove (21) is provided at one end of the base (1), drainage ports (22) are provided on both sides of the cooling groove (21), and a conduit (23) is embedded and connected at one end of the drainage port (22).

10. The high-voltage static electrode micro-particle removal device suitable for semiconductor manufacturing industry according to claim 9, characterized in that: The surface of the conduit (23) is cooperatively connected with a valve (24); one end of the base (1) is provided with a chip removal opening (25); the interior of the chip removal opening (25) is communicated with the interior of the chute (2); the surface of the base (1) is detachably connected with a controller (27); the power supply current of the motor (17) and the electric telescopic rod (103) is controlled by the controller (27).

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