A double-sided adhesive tape without knife printing processing technology

Abstract

The present invention discloses a knife-free processing technology for double-sided adhesive tape. The process comprises the following steps: S1: compounding a release film layer on a base film, and then compounding a layer of separator onto the release film layer; S2: die-cutting and half-breaking onto the release film layer; S3: compounding the double-sided adhesive tape onto the separator, and compounding a layer of paper paper onto the double-sided adhesive tape; S4: die-cutting and half-breaking onto the separator; S5: removing the separator from the side; S6: die-cutting and half-breaking onto the base film, and then discharging the base film and the paper paper; S7: transferring the side where the double-sided adhesive tape is located onto a layer of paper paper, and compounding a layer of separator paper onto the side where the release film layer is located. A knife-free processing technology for double-sided adhesive tape in the present invention realizes reverse cutting by adding a separator between the film layer and the double-sided adhesive tape, and then discharging it after cutting, which ensures that the adhesive will not penetrate into the knife printing, and reverse release problems will not occur. It is not only convenient for waste discharge and transfer, but also ensures production efficiency and yield.

Description

Technical Field

[0001] The invention relates to the field of die-cutting processing, and in particular to a double-sided adhesive non-knife printing processing technology. Background Art

[0002] With the continuous development and breakthrough of 5G technology, 5G construction is accelerating, the demand for smart terminal devices supporting 5G technology is rising, and smart terminal devices are also ushering in a wave of replacement, so the smart terminal precision die-cutting industry is also more prosperous. On smart devices, double-sided adhesive products are the most widely used structure, which plays the role of bonding and sealing in the equipment.

[0003] Double-sided adhesive products are generally designed with a release film layer. When in use, the film layer is clamped without touching the double-sided adhesive, and then attached to the backing. After full pressure, the film layer is torn off, and then other components are bonded to the double-sided adhesive on the film side.

[0004] In general die-cutting process, reverse cutting process is adopted, that is, die-cutting with the knife facing the adhesive surface. However, this process will leave knife marks on the film layer. After long-term storage, the double-sided adhesive will penetrate into the knife marks. When using it, there will be a reverse release problem that the double-sided adhesive will be taken away when peeling off the film layer.

[0005] Another process is the tangent process, which means the knife cuts towards the film layer, so there will be no knife mark on the film layer. The finger position of the glue is cut first, and then the film layer is laminated and the shape is die-cut out. However, this process is easy to take away the product when discharging waste, and it is also not convenient to transfer to the sticker.

[0006] At present, there is no good way to solve the problems existing in the above two processes. Summary of the invention

[0007] In order to solve the above problems, the present invention provides a double-sided adhesive tape processing technology without knife marks, which realizes reverse cutting by adding a diaphragm between the film layer and the double-sided adhesive, and then discharging it after cutting, thereby ensuring that the adhesive will not penetrate into the knife marks and that reverse release problems will not occur. It is not only convenient for waste discharge and transfer, but also ensures production efficiency and product yield.

[0008] According to one aspect of the present invention, a double-sided adhesive tape non-knife printing process is provided, comprising the following steps:

[0009] S1: Compounding a release film layer on a base film, and then compounding a layer of separator on the release film layer, wherein one side of the separator is adhesive and the other side is a release surface;

[0010] S2: Die cutting and half cutting to the release film layer;

[0011] S3: Compounding a double-sided adhesive tape onto the diaphragm, and compounding a layer of paper onto the double-sided adhesive tape, wherein the diaphragm extends into the double-sided adhesive tape;

[0012] S4: Die cutting and half cutting to the diaphragm;

[0013] S5: removing the diaphragm from the side so that the double-sided adhesive and the release film layer are attached together;

[0014] S6: die-cutting and half-cutting the base film, and then discharging the base film and the face paper;

[0015] S7: transferring the side where the double-sided adhesive is located to a layer of sticker, and compounding a layer of separator paper on the side where the release film layer is located.

[0016] In some embodiments, in step S1, the adhesive side of the separator is compounded with the release film layer. The benefit of this is that a specific method of compounding the separator with the release film layer is further described.

[0017] In some embodiments, in step S2, nesting is performed during die cutting, which is beneficial in that nesting the composite film layer can ensure the accuracy of die cutting, further describing the situation during the first die cutting.

[0018] In some embodiments, in step S2, the diaphragm is die-cut from the top downwards. This is beneficial in that it describes the die-cutting direction during the first die-cutting.

[0019] In some embodiments, in step S3, the dimension of the membrane extending into the double-sided adhesive tape is 0.2 mm. The benefit of this is that it describes the specific dimension of the membrane extending into the double-sided adhesive tape.

[0020] In some embodiments, in step S4, the die-cutting is performed from the top of the surface paper downwards. This is beneficial in that the die-cutting direction during the second die-cutting is described.

[0021] In some embodiments, in step S5, before removing the membrane, the excess waste of the double-sided adhesive is first removed. This is beneficial in that a waste removal step before removing the membrane is described.

[0022] In some embodiments, in step S6, the die-cutting is performed from the top of the surface paper downwards. This is beneficial in that the die-cutting direction during the third die-cutting is described. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a double-sided adhesive tape non-knife printing processing process during the first die-cutting according to an embodiment of the present invention;

[0024] Figure 2 for Figure 1 A schematic diagram of a double-sided adhesive tape non-knife printing process during the second die-cutting process is shown;

[0025] Figure 3 for Figure 1 A schematic diagram of a double-sided adhesive tape non-knife printing process during the third die-cutting process is shown;

[0026] Figure 4 for Figure 1 A schematic diagram of a product produced by a double-sided adhesive tape non-knife printing process is shown.

[0027] In the figure: base film 1, release film layer 2, separator 3, double-sided tape 4, face paper 5, sticker 6, separator paper 7. DETAILED DESCRIPTION

[0028] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0029] The process includes several main steps, which are described below.

[0030] S1: The first reunion.

[0031] like Figure 1 As shown, a release film layer 2 is firstly compounded on a base film 1, and then a layer of diaphragm 3 is compounded on the release film layer 2 to form a composite film layer.

[0032] One side of the diaphragm 3 is sticky, and the other side is a release surface. The sticky side of the diaphragm 3 is compounded with the release film layer 2, with the release surface facing upward.

[0033] S2: First die cutting.

[0034] The composite film layer in step S1 is die-cut for the first time using a die-cutting device, wherein the cutter cuts downward from the top of the diaphragm 3 and cuts halfway to the release film layer 2 .

[0035] Preferably, the die-cutting device also performs nesting of the composite film layer while performing die-cutting.

[0036] S3: Second reunion.

[0037] like Figure 2 As shown, the double-sided adhesive tape 4 is compounded onto the diaphragm 3 after the first die-cutting, and a layer of paper 5 is compounded onto the double-sided adhesive tape 4 to form a second composite film layer.

[0038] The diaphragm 3 extends into the adhesive area of ​​the double-sided adhesive tape 4, and the extending dimension is preferably 0.2 mm.

[0039] S4: Second die cutting.

[0040] The composite film layer in step S3 is die-cut for the second time using a die-cutting device, with the cutter cutting downward from the top of the face paper 5 and halfway through to the diaphragm 3 .

[0041] S5: Remove the diaphragm 3.

[0042] like Figure 3 As shown, the excess waste of the double-sided adhesive 4 is discharged, and then the diaphragm 3 is removed from the side, so that the double-sided adhesive 4 and the release film layer 2 can be attached together to form a third composite film layer.

[0043] S6: The third die cutting.

[0044] The composite film layer in step S5 is die-cut for the third time using a die-cutting device, with the cutter cutting downward from the top of the surface paper 5 and halfway through to the base film 1 .

[0045] After die-cutting, the composite film layer needs to be discharged to remove waste materials such as the face paper 5 and the bottom film 1 , so that only the double-sided adhesive 4 and the release film layer 2 remain.

[0046] S7: Reposting and reconciliation.

[0047] like Figure 4 As shown, the side where the double-sided adhesive tape 4 is located is transferred to a layer of sticker 6, and finally a layer of separator paper 7 is compounded on the side where the release film layer 2 is located, and finally the desired product is formed.

[0048] The double-sided adhesive tape non-knife printing processing technology of the present invention mainly has the following beneficial effects:

[0049] 1. The reverse cutting process of double-sided adhesive tape is realized, and there will be no knife marks on the release film layer;

[0050] 2. When the processed double-sided adhesive is placed for a long time, the adhesive will not penetrate into the knife mark and there will be no anti-release problem;

[0051] 3. Make the double-sided adhesive product waste discharge and transfer smooth, ensuring its production efficiency and yield.

[0052] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A double-sided adhesive tape non-knife printing process, characterized in that: The following steps are included S1: a release film layer (2) is laminated on a base film (1), and then a separator (3) is laminated on the release film layer (2), wherein one side of the separator (3) is adhesive and the other side is a release surface; S2: die-cutting and half-cutting to the release film layer (2); S3: Compounding a double-sided adhesive tape (4) onto the diaphragm (3), and compounding a layer of paper paper (5) onto the double-sided adhesive tape (4), wherein the diaphragm (3) extends into the double-sided adhesive tape (4); S4: Die cutting and half cutting to the diaphragm (3); S5: removing the diaphragm (3) from the side, so that the double-sided adhesive (4) and the release film layer (2) are attached together; S6: die-cutting and half-cutting the base film (1), and then discharging the base film (1) and the face paper (5); S7: The side where the double-sided adhesive tape (4) is located is transferred to a layer of sticker (6), and a layer of separator paper (7) is laminated on the side where the release film layer (2) is located.

2. The double-sided adhesive tape non-knife printing process according to claim 1, characterized in that: In step S1, the adhesive side of the separator (3) is compounded with the release film layer (2).

3. The double-sided adhesive tape non-knife printing process according to claim 1, characterized in that: In step S2, nesting is performed simultaneously with die-cutting.

4. The double-sided adhesive tape non-knife printing process according to claim 1, characterized in that: In step S2, die cutting is performed from the top of the diaphragm (3) downwards.

5. The double-sided adhesive tape non-knife printing process according to claim 1, characterized in that: In step S3, the dimension of the diaphragm (3) extending into the double-sided adhesive tape (4) is 0.2 mm.

6. The double-sided adhesive tape non-knife printing process according to claim 1, characterized in that: In step S4, die-cutting is performed downward from the top of the surface paper (5).

7. The double-sided adhesive tape non-knife printing process according to claim 1, characterized in that: In step S5, before removing the diaphragm (3), the excess waste of the double-sided adhesive tape (4) is first discharged.

8. The double-sided adhesive tape non-knife printing process according to claim 1, characterized in that: In step S6, die-cutting is performed downward from the top of the surface paper (5).

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