Film coating method, system and equipment for large-aperture optical element and storage medium
Through the adjustment of multi-deposition source system and deposition process parameters, the precise control of the thickness spatial distribution of the large-diameter optical element film layer is achieved, solving the defects of large-diameter optical element coating in the prior art, and improving the film deposition efficiency and adaptability.
Patent Information
- Application Number
- CN202411709603.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-27
- Publication Date
- 2025-04-04
AI Technical Summary
The existing coating method is not suitable for coating of large-diameter optical components, especially in the control of spatial distribution of film thickness of film layer deposition.
Using a multi-deposition source system, precise control of the spatial distribution of membrane deposition is achieved through deposition simulation experiments and adjustment of deposition process parameters. The specific steps include conducting simulation experiments based on the deposition requirements, adjusting the spatial position or deposition power of the deposition source, calculating the contribution degree of each deposition source, and setting the target deposition process parameters based on the contribution degree, and ultimately achieving uniform or regional deposition of the film layer thickness.
The precise control of the spatial distribution of the film layer of large-diameter optical elements is achieved, the film layer deposition efficiency is improved, and the singularity problem of deposition thickness distribution in traditional methods is avoided. It is suitable for the deposition of large-diameter and super-thick film layers.
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Figure CN119753603A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of optical element coating technology, and in particular to a coating method, system, device and storage medium for large-aperture optical elements. Background Art
[0002] The uniformity of optical thin film deposition distribution is one of the important indicators for preparing optical thin films and functional thin films, and it is also an important issue that must be faced in the manufacturing process of optical components. Uneven distribution of thin film deposition will, on the one hand, seriously affect and even destroy the optical properties of the film system, and on the other hand, the error introduced by the unevenness will cause the spectral curves at different positions of the optical component to drift, and will also cause polarization aberration and wavefront distortion, thus affecting the optical performance of the entire optical system. Therefore, when preparing high-performance optical thin film components, it is very important to strictly control or correct the uniformity of the thickness distribution of the thin film deposited on the optical component.
[0003] According to the currently known literature reports, the methods for correcting and controlling the uniformity of thin film deposition on optical elements can be mainly summarized as follows: the rotation mode of the revolution of the substrate carrier of the coating equipment, such as plane rotation, planetary rotation and single-axis gyroscope rotation; according to the requirements of the substrate carrier tooling, the geometric configuration of the coating equipment is optimized in a targeted manner during the actual manufacturing process of the coating equipment; the optimization and correction of the thin film deposition uniformity shielding baffle. The above correction methods have their own advantages and disadvantages, but there are still certain defects in the control of the spatial distribution of film thickness deposited during the deposition of large-aperture optical elements and ultra-thick film layers. For example, when depositing large-aperture and ultra-large-aperture optical elements, if a uniformity baffle is used, a singularity of the deposition thickness distribution will appear at the center of the deposition area. If a planetary rotation method is used, the maximum size of the optical element to be deposited will be greatly compressed, which cannot meet the coating requirements of large-aperture optical elements. Summary of the invention
[0004] In view of this, the present application provides a coating method, system, device and storage medium for large-aperture optical elements to solve the problem that existing coating methods are not suitable for coating large-aperture optical elements.
[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a coating method for a large-aperture optical element, which includes: according to the deposition requirements, using a multi-deposition source system to perform a deposition simulation experiment on the surface shape of the element to be deposited, and obtaining the spatial distribution data of the film layer deposition, the multi-deposition source system includes a plurality of deposition sources with adjustable deposition process parameters, and the deposition process parameters include spatial position or deposition power; according to the spatial distribution data of the film layer deposition, repeatedly adjusting the deposition process parameters of each deposition source and performing a simulation experiment to obtain the final experimental results; according to the final experimental results, obtaining the contribution of each deposition source to the final spatial distribution of the deposited film layer; calculating the target deposition process parameters of each deposition source under the condition of achieving the deposition requirements based on the contribution; and controlling the plurality of deposition sources to coat the element to be deposited according to the target deposition process parameters.
[0006] As a further improvement of the present application, after calculating the target deposition process parameters of each deposition source according to the contribution to achieve the deposition requirements, it also includes: conducting real experimental verification on the target deposition process parameters, and confirming whether the deposition result of the element to be deposited meets the deposition requirements based on the real experimental verification results.
[0007] As a further improvement of the present application, according to the spatial distribution data of film layer deposition, the deposition process parameters of each deposition source are repeatedly adjusted and simulation experiments are carried out to obtain the final experimental results, including: according to the spatial distribution data of film layer deposition and the deposition power of each deposition source, the spatial position of each deposition source is repeatedly adjusted and simulation experiments are carried out to obtain the final experimental results; or, according to the spatial distribution data of film layer deposition and the spatial position of each deposition source, the deposition power of each deposition source is repeatedly adjusted and simulation experiments are carried out to obtain the final experimental results.
[0008] As a further improvement of the present application, adjusting the spatial position of each deposition source specifically includes: adjusting the spatial position of each deposition source when the planar spatial positions of all deposition sources do not overlap.
[0009] As a further improvement of the present application, the deposition requirements include uniformly coating the surface of the element to be deposited, or depositing film layers of different thicknesses in different regions on the surface of the element to be deposited.
[0010] As a further improvement of the present application, the number of deposition sources is at least 2, and whenever the size of the element to be deposited increases by a preset size, the number of deposition sources increases by a preset number.
[0011] As a further improvement of the present application, the multi-deposition source system includes one of a magnetron sputtering cathode system, an ion beam sputtering system, and an electron beam evaporation system.
[0012] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a coating system for large-aperture optical elements, which includes: an experimental simulation module, which is used to perform a deposition simulation experiment on the surface shape of the element to be deposited using a multi-deposition source system according to deposition requirements to obtain film layer deposition spatial distribution data, the multi-deposition source system includes multiple deposition sources with adjustable deposition process parameters, and the deposition process parameters include spatial position or deposition power; an adjustment module, which is used to repeatedly adjust the deposition process parameters of each deposition source and perform simulation experiments according to the film layer deposition spatial distribution data to obtain the final experimental results; a contribution acquisition module, which is used to obtain the contribution of each deposition source to the final deposited film layer spatial distribution according to the final experimental results; a calculation module, which is used to calculate the target deposition process parameters of each deposition source under the condition of achieving deposition requirements according to the contribution; a coating module, which is used to control multiple deposition sources to coat the element to be deposited according to the target deposition process parameters.
[0013] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a computer device, which includes a processor and a memory coupled to the processor, wherein program instructions are stored in the memory, and when the program instructions are executed by the processor, the processor executes the steps of the coating method for large-aperture optical elements as described in any of the above items.
[0014] In order to solve the above technical problems, another technical solution adopted by the present application is: to provide a storage medium storing program instructions of a coating method for a large-aperture optical element that can implement any of the above items.
[0015] The beneficial effects of the present application are as follows: the coating method of the large-aperture optical element of the present application realizes film deposition through a vacuum coating chamber with multiple deposition sources, the multiple deposition sources are distributed in different spatial positions of the vacuum coating chamber, the spatial positions of all deposition sources can be adjusted, the deposition powers of all deposition sources can be adjusted independently, and the spatial distribution of the film thickness deposition is adjusted by adjusting the spatial position of the deposition source or the deposition power of the deposition source according to the deposition requirements of the element to be deposited, and finally the required deposition thickness spatial distribution is achieved. Compared with the traditional film uniformity optimization method, it has a greater film deposition spatial distribution adjustment capability, which can not only realize uniform deposition of the film layer, but also realize the planned deposition of the thickness of different regions of the film layer. At the same time, the use of multiple deposition sources can effectively improve the film deposition efficiency, and has better adaptability to the film deposition of large-aperture optical elements and ultra-thick film layers such as silicon carbide modified layers. At the same time, no uniformity optimization baffle is required, and no singular point of the deposition thickness distribution will be formed in the central area, which is more convenient for the deposition application of large-aperture optical elements. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1is a schematic flow chart of a coating method for a large-aperture optical element according to an embodiment of the present invention;
[0017] Figure 2 is a schematic diagram of adjusting the spatial position of a deposition source in a coating method for a large-aperture optical element according to an embodiment of the present invention;
[0018] Figure 3 is a schematic diagram of adjusting the deposition power of a deposition source in a coating method for a large-aperture optical element according to an embodiment of the present invention;
[0019] Figure 4 Schematic diagram of functional modules of a coating system for a large-aperture optical element according to an embodiment of the present invention;
[0020] Figure 5 is a schematic diagram of the structure of a computer device according to an embodiment of the present invention;
[0021] Figure 6 It is a schematic diagram of the structure of the storage medium of an embodiment of the present invention. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0023] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.
[0024] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0025] Figure 1 FIG. 1 is a flow chart of a coating method for a large-aperture optical element according to an embodiment of the present invention. It should be noted that the method of the present invention is not limited to the method of the present invention if substantially the same results are achieved. Figure 1 The process sequence shown is limited. Figure 1 As shown, the coating method of the large-aperture optical element comprises the following steps:
[0026] Step S101: performing a deposition simulation experiment on the surface of the element to be deposited using a multi-deposition source system according to deposition requirements to obtain spatial distribution data of film deposition, wherein the multi-deposition source system includes a plurality of deposition sources with adjustable deposition process parameters, and the deposition process parameters include spatial position or deposition power.
[0027] It should be noted that the coating method of the large-aperture optical element described in this embodiment is implemented based on physical vapor deposition (PVD), which includes deposition methods such as electron beam evaporation, magnetron sputtering, and ion beam sputtering. The coating method of the large-aperture optical element is suitable for a vacuum coating device with multiple deposition sources, in which multiple deposition sources are arranged, and the deposition process parameters of each deposition source are adjustable. Among them, the deposition process parameters refer to the parameters of the deposition source that can affect the spatial distribution of the film layer during the deposition process, such as the spatial position or deposition power of the deposition source. Among them, the vacuum coating equipment includes a vacuum chamber, which can also be applied to the coating processing of small-aperture devices. When the large-aperture optical element is coated, the large-aperture optical element can be directly fixed and placed in the vacuum chamber. When the small-aperture device is coated, the small-aperture device can be loaded in a fixture and rotated or planetary in the vacuum chamber.
[0028] Specifically, before coating a large-aperture optical element, the experimental simulation system is first used to simulate the coating of the surface shape of the element to be deposited according to the deposition requirements to obtain the spatial distribution data of the film layer deposition.
[0029] Step S102: According to the spatial distribution data of the film layer deposition, the deposition process parameters of each deposition source are repeatedly adjusted and simulation experiments are performed to obtain the final experimental results.
[0030] Specifically, after obtaining the spatial distribution data of film layer deposition through simulation experiments, the deposition process parameters of each deposition source are adjusted, and then the adjusted deposition process parameters are used to carry out simulation experiments. By repeatedly adjusting the deposition process parameters and carrying out simulation experiments, the final experimental results are obtained.
[0031] Furthermore, step S102 specifically includes:
[0032] According to the spatial distribution data of film deposition and the deposition power of each deposition source, the spatial position of each deposition source is repeatedly adjusted and simulation experiments are performed to obtain the final experimental results;
[0033] Or,
[0034] According to the spatial distribution data of film deposition and the spatial position of each deposition source, the deposition power of each deposition source is repeatedly adjusted and simulation experiments are carried out to obtain the final experimental results.
[0035] Specifically, in this embodiment, the deposition process parameter is one of the spatial position of the deposition source or the deposition power. Figure 2 As shown, when the deposition process parameter is the spatial position, the deposition power of the deposition source remains unchanged. By arranging the deposition source on the position adjustment mechanism (6), the spatial position of each deposition source (2) can be adjusted by using the position adjustment mechanism (6). The adjustment of the spatial position can be an adjustment of the vertical height or an adjustment of the deposition direction of the deposition source. Figure 2 The size of the inverted triangle (3) indicates the deposition power of the deposition source. If the sizes of the inverted triangles are equal, it means that the deposition power of the deposition sources is the same. Figure 3 As shown, when the deposition process parameter is the deposition power, the spatial position of the deposition source remains unchanged, and the deposition power of the deposition source (2) is directly adjusted. Figure 3 The size of the inverted triangle (3) indicates the deposition power of the deposition source. Different sizes of the inverted triangles indicate different deposition powers of the deposition sources.
[0036] Step S103: Obtain the contribution of each deposition source to the final spatial distribution of the deposited film layer according to the final experimental results.
[0037] Specifically, after obtaining the final experimental results, the contribution of each deposition source to the final spatial distribution of the deposited film layer is obtained using the experimental results.
[0038] Step S104: Calculating target deposition process parameters of each deposition source to achieve deposition requirements based on the contribution.
[0039] Specifically, the target deposition process parameters corresponding to the deposition source under the condition of achieving the deposition requirements are calculated according to the contribution of each deposition source. It should be noted that the deposition relationship between multiple deposition sources conforms to the general accumulation model. When the position is fixed and the deposition space distribution is stable, the deposition thickness accumulation is proportional to the product of the deposition rate and the deposition time. Therefore, in this embodiment, the deposition space distribution of multiple deposition sources and the final deposition form are expressed as:
[0040] Dgoal=D1×Dv1×Dt1+D2×Dv2×Dt2+D3×Dv3×Dt3+……+D n ×Dv n ×Dt n
[0041] Among them, Dgoal represents the final deposition requirement to be achieved, D represents the deposition distribution, Dv represents the deposition rate, Dt represents the deposition time, and n represents the number of deposition sources. According to the deposition requirement and the deposition spatial distribution of the deposition sources, a reasonable deposition rate and deposition time are calculated, which are the target deposition process parameters corresponding to the deposition requirement.
[0042] Furthermore, in order to ensure the accuracy of the target deposition process parameters, after step S104, it also includes: performing real experimental verification on the target deposition process parameters, and confirming whether the deposition result of the to-be-deposited element meets the deposition requirements based on the real experimental verification result.
[0043] Specifically, after obtaining the target deposition process parameters of each deposition source, each deposition source in the vacuum coating equipment is set based on the target deposition process parameters, and then a coating test is performed on the element to be deposited to confirm whether the coating result meets the pre-set deposition requirements. If not, the above steps S101 to S104 are repeated until the target deposition process parameters that meet the deposition requirements are obtained.
[0044] Furthermore, in this embodiment, the step of adjusting the spatial position of each deposition source specifically includes: adjusting the spatial position of each deposition source when the planar spatial positions of all deposition sources do not overlap.
[0045] It should be noted that, in this embodiment, the spatial position of each deposition source is adjustable within a certain range, and when all deposition sources are mapped onto the same plane, the deposition sources after adjusting their positions will not overlap, thereby avoiding mutual occlusion of the deposition sources.
[0046] Step S105: controlling a plurality of deposition sources to coat the element to be deposited according to target deposition process parameters.
[0047] Specifically, after the target deposition process parameters are obtained, parameters are set for each deposition source on the vacuum coating equipment according to the target deposition process parameters of each deposition source, and then the target deposition process parameters are controlled to perform a coating operation on the element to be deposited.
[0048] Furthermore, in this embodiment, the deposition requirement includes uniformly coating the surface of the element to be deposited, or depositing film layers of different thicknesses in different regions on the surface of the element to be deposited.
[0049] Furthermore, in this embodiment, the number of deposition sources is at least 2, and the number of deposition sources increases by a preset number each time the size of the element to be deposited increases by a preset size. For example, when the size of the element to be deposited increases by 2000 mm, the number of deposition sources increases by two. By setting a corresponding number of deposition sources according to the size of the element to be deposited, it is ensured that during the deposition process of the element to be deposited, the spatial distribution of the deposition thickness of the film layer can be adjusted, and finally the desired spatial distribution of the deposition thickness is achieved.
[0050] Furthermore, in this embodiment, the multi-deposition source system includes one of a magnetron sputtering cathode system, an ion beam sputtering system, and an electron beam evaporation system.
[0051] The coating method of large-aperture optical elements of the present application realizes film deposition through a vacuum coating chamber with multiple deposition sources, and the multiple deposition sources are distributed in different spatial positions of the vacuum coating chamber, and the spatial positions of all deposition sources can be adjusted, and the deposition powers of all deposition sources can be adjusted independently. According to the deposition requirements of the element to be deposited, the spatial distribution of the deposition thickness of the film layer is adjusted by adjusting the spatial position of the deposition source or the deposition power of the deposition source, and finally the required deposition thickness spatial distribution is achieved. Compared with the traditional film uniformity optimization method, it has a greater ability to adjust the spatial distribution of film deposition, which can not only realize uniform deposition of the film layer, but also realize the planned deposition of the thickness of different regions of the film layer. At the same time, the use of multiple deposition sources can effectively improve the film deposition efficiency, and has better adaptability to the film deposition of large-aperture optical elements and ultra-thick film layers such as silicon carbide modified layers. At the same time, there is no need for uniformity optimization baffles, and no singularity of the deposition thickness distribution will be formed in the central area, which is more convenient for the deposition application of large-aperture optical elements.
[0052] Figure 4 Schematic diagram of the functional modules of the coating system of the large-aperture optical element according to the embodiment of the present invention. Figure 4 As shown, the coating system 20 for large-aperture optical elements includes:
[0053] The experimental simulation module 21 is used to perform a deposition simulation experiment on the surface of the element to be deposited using a multi-deposition source system according to the deposition requirements to obtain the spatial distribution data of the film layer deposition. The multi-deposition source system includes a plurality of deposition sources with adjustable deposition process parameters, and the deposition process parameters include spatial position or deposition power.
[0054] An adjustment module 22, used to repeatedly adjust the deposition process parameters of each deposition source and perform simulation experiments according to the spatial distribution data of the film deposition to obtain the final experimental results;
[0055] A contribution acquisition module 23 is used to acquire the contribution of each deposition source to the final spatial distribution of the deposited film layer according to the final experimental results;
[0056] A calculation module 24, used for calculating the target deposition process parameters of each deposition source in order to achieve the deposition requirement according to the contribution;
[0057] The coating module 25 is used to control multiple deposition sources to coat the element to be deposited according to target deposition process parameters.
[0058] Optionally, after the calculation module 24 performs the operation of calculating the target deposition process parameters of each deposition source according to the contribution calculation to achieve the deposition requirement, it is also used to: perform real experimental verification on the target deposition process parameters, and confirm whether the deposition result of the element to be deposited meets the deposition requirement based on the real experimental verification result.
[0059] Optionally, the adjustment module 22 executes the operation of repeatedly adjusting the deposition process parameters of each deposition source and performing simulation experiments according to the spatial distribution data of the film layer deposition to obtain the final experimental results, specifically including: repeatedly adjusting the spatial position of each deposition source and performing simulation experiments according to the spatial distribution data of the film layer deposition and the deposition power of each deposition source to obtain the final experimental results; or, repeatedly adjusting the deposition power of each deposition source and performing simulation experiments according to the spatial distribution data of the film layer deposition and the spatial position of each deposition source to obtain the final experimental results.
[0060] Optionally, the adjustment module 22 performs an operation of adjusting the spatial position of each deposition source, specifically including: adjusting the spatial position of each deposition source when the planar spatial positions of all deposition sources do not overlap.
[0061] Optionally, the deposition requirement includes uniformly coating the surface of the element to be deposited, or depositing film layers of different thicknesses on different regions of the surface of the element to be deposited.
[0062] Optionally, the number of deposition sources is at least 2, and the number of deposition sources increases by a preset number each time the size of the element to be deposited increases by a preset size.
[0063] Optionally, the multi-deposition source system includes one of a magnetron sputtering cathode system, an ion beam sputtering system, and an electron beam evaporation system.
[0064] For other details about the technical solutions for implementing each module in the coating system for large-aperture optical elements in the above embodiment, reference may be made to the description of the coating method for large-aperture optical elements in the above embodiment, which will not be repeated here.
[0065] It should be noted that each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other. For system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.
[0066] See also Figure 5 , Figure 5 FIG. 1 is a schematic diagram of the structure of a computer device according to an embodiment of the present invention. Figure 5 As shown, the computer device 30 includes a processor 31 and a memory 32 coupled to the processor 31, wherein the memory 32 stores program instructions. When the program instructions are executed by the processor 31, the processor 31 executes the steps of the coating method for large-aperture optical elements described in any of the above embodiments.
[0067] The processor 31 may also be referred to as a resource (Central Processing Unit). The processor 31 may be an integrated circuit chip having signal processing capabilities. The processor 31 may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.
[0068] See also Figure 6 , Figure 6Schematic diagram of the structure of the storage medium of the embodiment of the present invention. The storage medium of the embodiment of the present invention stores program instructions 41 that can implement the coating method of the above-mentioned large-aperture optical element, wherein the program instructions 41 can be stored in the above-mentioned storage medium in the form of a software product, including a number of instructions for a computer device (which can be a personal computer, server, or network device, etc.) or a processor (processor) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes, or computer devices such as computers, servers, mobile phones, tablets, etc.
[0069] In the several embodiments provided in the present application, it should be understood that the disclosed computer devices, systems and methods can be implemented in other ways. For example, the system embodiments described above are only schematic, for example, the division of units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of systems or units, which can be electrical, mechanical or other forms.
[0070] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above integrated unit may be implemented in the form of hardware or in the form of software functional units. The above is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of this application, or directly or indirectly used in other related technical fields, is also included in the patent protection scope of the present application.
Claims
1. A coating method for a large-aperture optical element, characterized in that: It includes: According to the deposition requirements, a deposition simulation experiment is performed on the surface of the element to be deposited using a multi-deposition source system to obtain spatial distribution data of film layer deposition, wherein the multi-deposition source system includes a plurality of deposition sources with adjustable deposition process parameters, and the deposition process parameters include spatial position or deposition power; According to the spatial distribution data of the film layer deposition, the deposition process parameters of each deposition source are repeatedly adjusted and simulation experiments are performed to obtain the final experimental results; Obtaining the contribution of each deposition source to the final spatial distribution of the deposited film layer according to the final experimental result; Calculating target deposition process parameters of each deposition source to achieve the deposition requirement according to the contribution; The plurality of deposition sources are controlled according to the target deposition process parameters to perform film coating on the element to be deposited.
2. The coating method for a large-aperture optical element according to claim 1, characterized in that: After calculating the target deposition process parameters of each deposition source according to the contribution to achieve the deposition requirement, the method further includes: The target deposition process parameters are verified by real experiments, and based on the real experimental verification results, it is confirmed whether the deposition result of the element to be deposited meets the deposition requirements.
3. The coating method for a large-aperture optical element according to claim 1, characterized in that: According to the spatial distribution data of the film layer deposition, the deposition process parameters of each deposition source are repeatedly adjusted and a simulation experiment is performed to obtain a final experimental result, including: According to the film layer deposition spatial distribution data and the deposition power of each deposition source, repeatedly adjusting the spatial position of each deposition source and performing simulation experiments to obtain the final experimental results; Or, According to the film layer deposition spatial distribution data and the spatial position of each deposition source, the deposition power of each deposition source is repeatedly adjusted and a simulation experiment is performed to obtain the final experimental result.
4. The coating method for a large-aperture optical element according to claim 3, characterized in that: The adjusting the spatial position of each deposition source specifically includes: The spatial position of each deposition source is adjusted when the planar spatial positions of all deposition sources do not overlap.
5. The coating method for a large-aperture optical element according to claim 1, characterized in that: The deposition requirements include uniformly coating the surface of the component to be deposited, or depositing film layers of different thicknesses in different regions on the surface of the component to be deposited.
6. The coating method for a large-aperture optical element according to claim 1, characterized in that: The number of the deposition sources is at least 2, and the number of the deposition sources increases by a preset number each time the size of the element to be deposited increases by a preset size.
7. The coating method for a large-aperture optical element according to claim 1, characterized in that: The multi-deposition source system includes one of a magnetron sputtering cathode system, an ion beam sputtering system, and an electron beam evaporation system.
8. A coating system for large-aperture optical elements, characterized in that: It includes: An experimental simulation module, used to perform a deposition simulation experiment on the surface of the element to be deposited using a multi-deposition source system according to deposition requirements to obtain spatial distribution data of film layer deposition, wherein the multi-deposition source system includes a plurality of deposition sources with adjustable deposition process parameters, wherein the deposition process parameters include spatial position or deposition power; An adjustment module, used to repeatedly adjust the deposition process parameters of each deposition source and perform simulation experiments according to the film layer deposition spatial distribution data to obtain a final experimental result; A contribution acquisition module, used to acquire the contribution of each deposition source to the final spatial distribution of the deposited film layer according to the final experimental result; A calculation module, used for calculating the target deposition process parameters of each deposition source under the condition of achieving the deposition requirement according to the contribution; The coating module is used to control the multiple deposition sources to coat the element to be deposited according to the target deposition process parameters.
9. A computer device, characterized in that: The computer device includes a processor and a memory coupled to the processor, wherein program instructions are stored in the memory, and when the program instructions are executed by the processor, the processor executes the steps of the coating method for a large-aperture optical element as described in any one of claims 1 to 7.
10. A storage medium, characterized in that: The device stores program instructions capable of implementing a coating method for a large-aperture optical element as claimed in any one of claims 1 to 7.