A printed circuit board electroplating device capable of ensuring uniformity of electroplating layer

By setting up a decompression structure and clamping components in the printed circuit board plating device, the uneven distribution of metal layers caused by bubbles and impurities during the electroplating process is solved, and the uniformity of the electroplating layer and the plating quality are improved.

CN119753796APending Publication Date: 2025-04-04BAIQIANG ELECTRONICS SHENZHEN
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Patent Information

Application Number
CN202411958897.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-30
Publication Date
2025-04-04

AI Technical Summary

Technical Problem

Printed circuit boards are prone to adhere to bubbles and impurities during the electroplating process, resulting in uneven distribution of metal layers and affecting the plating quality.

Method used

A printed circuit board electroplating device is designed, including impurity removal structure and connection components, control structure and clamping components, which can quickly eliminate bubbles on the surface of the printed circuit board and remove impurities in the plating solution through a liquid pump, a liquid extraction tube and a filter plate.

Benefits of technology

By eliminating bubbles and removing impurities, the uniformity of the electroplating layer is ensured, and the quality and stability of the electroplating are improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a printed circuit board electroplating device capable of ensuring uniformity of an electroplated layer, relates to the field of printed circuit board electroplating, and comprises: an electroplating box; the top of the electroplating box is arranged as an open structure, and a lifting structure is fixedly arranged on the top of the electroplating box, and a connecting component is slidably arranged on the outer side of the bottom of the lifting structure; a control structure is slidably arranged on the inner side of the connecting component, and a clamping component is fixedly arranged on the bottom of the control structure; an impurity removal structure is fixedly arranged on the bottom of the electroplating box, and bubbles on the surface of the printed circuit board can be quickly eliminated by means of the impurity removal structure and the connecting component as well as the control structure and the clamping component, and impurities in the electroplating solution can be removed, which is beneficial to ensuring uniform electroplating effect, and solves the problem that the adhesion of bubbles interferes with the deposition of the metal layer, and the impurities mixed into the electroplating solution will destroy the uniform distribution state of the electroplating current.
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Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board electroplating, and in particular to a printed circuit board electroplating device capable of ensuring the uniformity of an electroplating layer. Background Art

[0002] Printed circuit boards are providers of electrical connections for electronic components. In the manufacture of printed circuit boards, electroplating is a key step. Metal layers are added to circuit boards and through-holes through electrolysis to protect copper wires and connection holes. The quality of electroplating directly affects the overall quality of the printed circuit board.

[0003] Currently, printed circuit boards face two major challenges when immersed in electroplating solutions. First, a large number of bubbles are easily attached to the surface of the circuit board, which interferes with the deposition of the metal layer, resulting in uneven distribution of the metal layer on the surface of the circuit board, seriously affecting the quality and effect of the electroplating. Second, during the electroplating operation, there is a risk that dust and other impurities on the surface of the circuit board will fall into the electroplating solution. Once impurities are mixed into the electroplating solution, the uniform distribution of the electroplating current will be destroyed, which will bring challenges to the stability and consistency of the electroplating effect, making it difficult to ensure high-quality electroplating. Summary of the invention

[0004] In view of this, the present invention provides a printed circuit board electroplating device capable of ensuring the uniformity of the electroplating layer, which has an impurity removal structure and a connection component as well as a control structure and a clamping component, which can quickly eliminate bubbles on the surface of the printed circuit board and can remove impurities inside the electroplating solution, which is beneficial to ensuring a uniform electroplating effect.

[0005] The present invention provides a printed circuit board electroplating device capable of ensuring uniformity of an electroplated layer, specifically comprising: an electroplating box; the electroplating box is filled with an electroplating liquid, and a rotating shaft is rotatably arranged inside the bottom side of the electroplating box; a bevel gear A is fixedly arranged at the top of the rotating shaft, and the rotating shaft and the bevel gear A are both symmetrically arranged in two groups; a cam is fixedly arranged on the outside of the rotating shaft, and a stirring plate is also fixedly arranged on the outside of the rotating shaft; the stirring plates are arranged in a ring array, and the cams are symmetrically arranged in four groups;

[0006] The top of the electroplating box is arranged as an open structure, and a lifting structure is fixedly arranged on the top of the electroplating box, and a connecting component is slidably arranged on the outer side of the bottom of the lifting structure; a control structure is slidably arranged on the inner side of the connecting component, and a clamping component is fixedly arranged on the bottom of the control structure; a debris removal structure is fixedly arranged on the bottom of the electroplating box, and the debris removal structure includes: a check valve, a debris removal box and a filter screen; the check valve is fixedly arranged inside the bottom side of the electroplating box; the debris removal box is fixedly arranged outside the bottom end of the check valve, and one side of the debris removal box is arranged as an opening structure; the filter screen is fixedly arranged inside one side of the debris removal box.

[0007] In at least some embodiments, a drive seat is fixedly provided on the outside of the electroplating box, and a drive shaft is rotatably provided inside the drive seat; the drive shaft is fixedly provided at the shaft end of the motor device, and the motor device is fixedly provided on the outside of the drive seat; two sets of bevel gears B are symmetrically fixedly provided on the outside of the drive shaft, and the two sets of bevel gears B are respectively meshed with the two sets of bevel gears A.

[0008] In at least some embodiments, the impurity removal structure also includes: a threaded hole, a cover plate and a hexagon socket bolt; the threaded hole is opened inside one side of the impurity removal box, and four groups of threaded holes are symmetrically opened; the cover plate is movably arranged inside the opening structure on one side of the impurity removal box; the hexagon socket bolt is movably arranged inside the cover plate, and the hexagon socket bolt is arranged inside the threaded hole through a threaded connection.

[0009] In at least some embodiments, the impurity removal structure also includes: a liquid extraction pipe, a liquid pump and a liquid return pipe; one end of the liquid extraction pipe is fixedly arranged inside the bottom side of the impurity removal box; the liquid inlet of the liquid pump is fixedly connected to the other end of the liquid extraction pipe; the bottom end of the liquid return pipe is fixedly arranged on the outside of the liquid outlet of the liquid pump, and the top end of the liquid return pipe is fixedly arranged inside the top side of the electroplating box.

[0010] In at least some embodiments, the lifting structure includes: a lifting frame, a double-headed screw A, a synchronous wheel, a sliding seat, a lifting rod A, a lifting rod B, a connecting seat, a cross bar and a lifting plate; the lifting frame is fixedly arranged on the top of the electroplating box; the double-headed screw A is rotatably arranged on the top of the lifting frame, and the double-headed screw A and the lifting frame are symmetrically arranged in two groups, and the two groups of lifting frames are located on both sides of the opening structure at the top of the electroplating box; one group of double-headed screws A is fixedly arranged at the shaft end of the motor device, and the motor device is fixedly arranged on the outside of the lifting frame; the number of synchronous wheels is set to two groups, and the two groups of synchronous wheels are respectively fixedly arranged on the double-headed screw A The outside of the double-head screw rod A is provided with a synchronous belt device between the two sets of synchronous wheels; the sliding seat is arranged on the outside of the double-head screw rod A through a threaded connection, and the sliding seat is symmetrically arranged in four groups; the lifting rod A is rotatably arranged at the bottom of one group of sliding seats; the lifting rod B is rotatably arranged at the bottom of another group of sliding seats, and the lifting rod B is cross-rotatably connected with the lifting rod A; the connecting seats are symmetrically arranged in four groups, and two groups of connecting seats are rotatably arranged at the bottom of the lifting rod A, and the other two groups of connecting seats are rotatably arranged at the bottom of the lifting rod B; the cross bar is slidably arranged between the inside of the two groups of connecting seats; the lifting plate is fixedly arranged on the outside of the cross bar.

[0011] In at least some embodiments, the lifting structure also includes: a guide column, a baffle and a limit plate; the guide column is fixedly arranged at the bottom of the lifting plate; the baffle is fixedly arranged at the bottom end of the guide column, and the guide column and the baffle are arranged in a straight line; the limit plate is fixedly arranged at the bottom of the lifting frame, and the top of the limit plate is in contact with the bottom of the lifting plate.

[0012] In at least some embodiments, the connection assembly includes: a connection platform, a double-headed screw B, a handle A, a connecting seat and a fixed rod; the connection platform is slidably arranged on the outside of the guide column, and a spring member is arranged between the top of the connection platform and the top of the guide column, and the connection platform is located at the top of the baffle; the double-headed screw B is rotatably arranged on the top of the connection platform; the handle A is fixedly arranged at the end of the double-headed screw B in a circular array; the connecting seat is arranged on the outside of the double-headed screw B through a threaded connection; the fixed rod is fixedly arranged inside the connection platform, and two groups of fixed rods are arranged.

[0013] In at least some embodiments, the control structure includes: a control frame, a sliding rod, a control panel, a threaded barrel, a handle B and a threaded rod; the control frame is slidably arranged between two sets of fixed rods, and the control frame is fixedly connected to the connecting seat; the sliding rod is slidably arranged inside the control frame; the control panel is fixedly arranged on the outside of the sliding rod in a linear arrangement; the threaded barrel is rotatably arranged inside the control frame; the handle B is fixedly arranged on the top of the threaded barrel in a circular array; the threaded rod is arranged inside the threaded barrel through a threaded connection, and the threaded rod is fixedly connected to the topmost control panel.

[0014] In at least some embodiments, the clamping assembly includes: a load-bearing frame, a clamping frame, a splint and a base plate; the load-bearing frame is fixedly arranged at the bottom of the control frame; the clamping frame is fixedly arranged at the bottom of the load-bearing frame, and the clamping frame is arranged in an L shape; the clamping frames are arranged in a straight line, and the clamping frames are fixedly connected; the splint is movably arranged on the inner side of the top of the clamping frame, and the splint is fixedly arranged on the outer side of the control plate, and the splint is arranged in a straight line; the base plate is fixedly arranged at the bottom of the bottommost clamping frame, and the bottom of the base plate is in contact with the outer side of the cam.

[0015] Beneficial Effects

[0016] 1. The present invention, by providing a double-headed screw B and a connecting seat, can make two groups of control frames move in opposite directions at the same time, so that the clamping frames at the bottom of the two groups of control frames move in the opposite direction; at the same time, by using a threaded barrel in conjunction with a threaded rod and a sliding rod, the linear arrangement control board can drive the clamping plate to move up and down synchronously, and then the printed circuit board can be fixed according to the specific size of the printed circuit board; and multiple groups of printed circuit boards can be fixed at the same time, which is conducive to simultaneous electroplating of multiple groups of printed circuit boards according to the specific size of the printed circuit boards.

[0017] 2. The present invention, by providing a cam and a bottom plate as well as a guide column and a spring member, can make the bottom plate drive the printed circuit board to shake up and down through the clamping frame when the cam rotates, so that the bubbles on the surface of the printed circuit board can be quickly eliminated; it is beneficial to prevent the attached bubbles from interfering with the deposition of the metal layer; at the same time, by using the driving shaft and the bevel gear B and the bevel gear A and the rotating shaft, the stirring plate can stir the electroplating solution in multiple directions, so that the main salt distribution in the electroplating solution is more uniform; thus, it can ensure that the metal layer is uniformly adsorbed on the printed circuit board, thereby improving the uniform electroplating effect.

[0018] 3. The present invention, by providing a liquid pump, a liquid extraction pipe and a liquid return pipe, can draw the plating liquid in the plating box into the impurity removal box and then return it to the plating box; at the same time, the cooperation of the check valve and the filter screen plate allows the impurities in the plating liquid to be retained inside the impurity removal box; the impurities in the plating liquid can be removed, which is beneficial to ensure the uniform distribution of the electroplating current and the stability of the electroplating; and the hexagon socket bolts and threaded holes can be used to conveniently disassemble and install the cover plate, which is beneficial to remove and process the impurities retained in the impurity removal box, thereby enhancing the practicability of the electroplating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0020] The drawings described below are only related to some embodiments of the present invention, but are not intended to limit the present invention.

[0021] In the attached picture:

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0023] Figure 2 It is a schematic cross-sectional structural diagram of the electroplating box of the present invention.

[0024] Figure 3 It is a schematic diagram of the internal structure of the electroplating box of the present invention.

[0025] Figure 4 It is a schematic diagram of the split structure of the impurity removal structure of the present invention.

[0026] Figure 5 It is a schematic diagram of the connection structure between the lifting structure and the connecting component of the present invention.

[0027] Figure 6 It is a structural schematic diagram of the lifting structure of the present invention.

[0028] Figure 7 It is a schematic diagram of the upper surface structure of the connection platform of the present invention.

[0029] Figure 8 It is a schematic diagram of the connection structure between the control structure and the clamping assembly of the present invention.

[0030] Fig. 9 It is a structural schematic diagram of the control structure of the present invention.

[0031] Fig.10 It is a schematic diagram of the upper surface structure of the base plate of the present invention.

[0032] Fig.11It is a structural schematic diagram of the clamping plate and the clamping frame of the present invention.

[0033] Reference numerals list

[0034] 1. Electroplating box; 101. Rotating shaft; 102. Stirring plate; 103. Cam; 104. Bevel gear A; 105. Driving seat; 106. Driving shaft; 107. Bevel gear B;

[0035] 2. De-impurity structure; 201. Check valve; 202. De-impurity box; 203. Threaded hole; 204. Cover plate; 205. Hexagon socket bolt; 206. Filter screen; 207. Liquid extraction pipe; 208. Liquid pump; 209. Liquid return pipe;

[0036] 3. Lifting structure; 301. Lifting frame; 302. Double-headed screw A; 3021. Synchronous wheel; 303. Sliding seat; 304. Lifting rod A; 305. Lifting rod B; 306. Connecting seat; 307. Crossbar; 308. Lifting plate; 309. Guide column; 3010. Baffle; 3011. Limiting plate;

[0037] 4. Connecting assembly; 401. Connecting platform; 402. Double-head screw B; 403. Handle A; 404. Connecting seat; 405. Fixing rod;

[0038] 5. Control structure; 501. Control frame; 502. Sliding rod; 503. Control board; 504. Threaded barrel; 505. Handle B; 506. Threaded rod;

[0039] 6. Clamping assembly; 601. Load-bearing frame; 602. Clamping frame; 603. Clamping plate; 604. Bottom plate. DETAILED DESCRIPTION

[0040] In order to make the purpose, scheme and advantages of the technical solution of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described in conjunction with the drawings of the specific embodiments of the present invention. Unless otherwise specified, the terms used herein have the usual meanings in the art. The same reference numerals in the drawings represent the same components.

[0041] Example 1: Please refer to Figures 1 to 11 As shown:

[0042] The present invention provides a printed circuit board electroplating device capable of ensuring uniformity of an electroplated layer, comprising an electroplating box 1; the electroplating box 1 is filled with an electroplating liquid, and a rotating shaft 101 is rotatably arranged inside the bottom side of the electroplating box 1; a bevel gear A104 is fixedly arranged at the top of the rotating shaft 101, and the rotating shaft 101 and the bevel gear A104 are both symmetrically arranged in two groups; a cam 103 is fixedly arranged on the outside of the rotating shaft 101, and a stirring plate 102 is also fixedly arranged on the outside of the rotating shaft 101; the stirring plates 102 are arranged in a ring array, and the cams 103 are symmetrically arranged in four groups;

[0043] In the disclosed embodiment, the top of the electroplating box 1 is set as an open structure, and a lifting structure 3 is fixedly set on the top of the electroplating box 1, and a connecting component 4 is slidably set on the outer side of the bottom of the lifting structure 3; a control structure 5 is slidably set on the inner side of the connecting component 4, and a clamping component 6 is fixedly set on the bottom of the control structure 5; a debris removal structure 2 is fixedly set at the bottom of the electroplating box 1; a driving seat 105 is fixedly set on the outer side of the electroplating box 1, and a driving shaft 106 is rotatably set inside the driving seat 105; the driving shaft 106 is fixedly set at the shaft end of the motor device, and the motor device is fixedly set on the outer side of the driving seat 105; two sets of bevel gears B107 are symmetrically fixed on the outer side of the driving shaft 106 , and the two groups of bevel gears B107 are respectively meshed with the two groups of bevel gears A104; its specific functions are: by providing the cam 103 and the bottom plate 604 and the guide column 309 and the spring member, when the cam 103 rotates, the bottom plate 604 can drive the printed circuit board to shake up and down through the clamping frame 602, so that the bubbles on the surface of the printed circuit board can be quickly eliminated; it is beneficial to prevent the attached bubbles from interfering with the deposition of the metal layer; at the same time, by using the driving shaft 106 and the bevel gear B107 and the bevel gear A104 and the rotating shaft 101, the stirring plate 102 can stir the electroplating solution in multiple directions, so that the main salt distribution inside the electroplating solution is more uniform.

[0044] Example 2: Please refer to Figures 2 to 4As shown: On the basis of the first embodiment, the impurity removal structure 2 includes: a check valve 201, a impurity removal box 202, a filter screen 206, a threaded hole 203, a cover plate 204, a hexagon socket bolt 205, a liquid extraction pipe 207, a liquid pump 208 and a liquid return pipe 209; the check valve 201 is fixedly arranged inside the bottom side of the electroplating box 1; the impurity removal box 202 is fixedly arranged outside the bottom end of the check valve 201, and one side of the impurity removal box 202 is arranged as an open structure; the filter screen 206 is fixedly arranged inside one side of the impurity removal box 202; the threaded hole 203 is opened inside one side of the impurity removal box 202, and the threaded hole 203 is symmetrically opened in four groups; the cover plate 204 is movably arranged inside the opening structure on one side of the impurity removal box 202; the hexagon socket bolt 205 is movably arranged on the cover plate 204 The interior of the electroplating box 1 is provided with a hexagon socket bolt 205 which is threadedly connected inside the threaded hole 203; one end of the liquid extraction pipe 207 is fixedly arranged inside the bottom side of the impurity removal box 202; the liquid inlet of the liquid pump 208 is fixedly connected to the other end of the liquid extraction pipe 207; the bottom end of the liquid return pipe 209 is fixedly arranged outside the liquid outlet of the liquid pump 208, and the top end of the liquid return pipe 209 is fixedly arranged inside the top side of the electroplating box 1; its specific function is: by providing the liquid pump 208, the liquid extraction pipe 207 and the liquid return pipe 209, the plating liquid in the electroplating box 1 can be pumped into the impurity removal box 202 and then flow back to the electroplating box 1; at the same time, the cooperation of the check valve 201 and the filter screen plate 206 makes the impurities in the electroplating liquid remain inside the impurity removal box 202; the impurities inside the electroplating liquid can be removed.

[0045] Example 3: Please refer to Figures 5 to 11As shown: On the basis of the first and second embodiments, the lifting structure 3 includes: a lifting frame 301, a double-headed screw A302, a synchronous wheel 3021, a sliding seat 303, a lifting rod A304, a lifting rod B305, a connecting seat 306, a cross bar 307, a lifting plate 308, a guide column 309, a baffle 3010 and a limit plate 3011; the lifting frame 301 is fixedly arranged on the top of the electroplating box 1; the double-headed screw A302 is rotatably arranged on the top of the lifting frame 301, and the double-headed screw A302 and the lifting frame 301 are symmetrically arranged in two groups, and the two groups of lifting frames 301 are located on both sides of the top opening structure of the electroplating box 1; one group of double-headed screws A302 is fixedly arranged on the shaft end of the motor device, and the motor device is fixed The lifting frame 301 is fixedly arranged on the outside of the lifting frame 301; the number of synchronous wheels 3021 is set to two groups, and the two groups of synchronous wheels 3021 are respectively fixedly arranged on the outside of the double-headed screw A302, and a synchronous belt device is installed between the two groups of synchronous wheels 3021; ​​the sliding seat 303 is arranged on the outside of the double-headed screw A302 through a threaded connection, and the sliding seat 303 is symmetrically arranged in four groups; the lifting rod A304 is rotatably arranged at the bottom of one group of sliding seats 303; the lifting rod B305 is rotatably arranged at the bottom of another group of sliding seats 303, and the lifting rod B305 is cross-rotatably connected with the lifting rod A304; the connecting seat 306 is symmetrically arranged in four groups, and the two groups of connecting seats 306 are rotatably arranged at the bottom of the lifting rod A304 , and the other two groups of connecting seats 306 are rotatably set at the bottom of the lifting rod B305; the cross bar 307 is slidably set between the two groups of connecting seats 306; the lifting plate 308 is fixedly set on the outside of the cross bar 307, and the lifting plate 308 and the cross bar 307 are symmetrically set in two groups; the guide column 309 is fixedly set at the bottom of the lifting plate 308; the baffle 3010 is fixedly set at the bottom of the guide column 309, and the guide column 309 and the baffle 3010 are arranged in a straight line; the limit plate 3011 is fixedly set at the bottom of the lifting frame 301, and the top of the limit plate 3011 is in contact with the bottom of the lifting plate 308; the connecting component 4 includes: a connecting platform 401, a double-headed screw B402, a handle A403, a connecting seat 4 04 and fixed rod 405; the connecting platform 401 is slidably arranged on the outside of the guide column 309, and a spring member is arranged between the top of the connecting platform 401 and the top of the guide column 309, and the connecting platform 401 is located at the top of the baffle 3010; the double-headed screw B402 is rotatably arranged on the top of the connecting platform 401; the handle A403 is fixedly arranged at the end of the double-headed screw B402 in a circular array; the connecting seat 404 is arranged on the outside of the double-headed screw B402 through a threaded connection; the fixed rod 405 is fixedly arranged inside the connecting platform 401, and the fixed rod 405 is arranged in two groups; the control structure 5 includes: a control frame 501, a sliding rod 502, a control panel 503, a threaded barrel 504, a handle B505 and a threaded rod 506;The control frame 501 is slidably arranged between the outer sides of the two groups of fixed rods 405, and the control frame 501 and the connecting seat 404 are arranged to be fixedly connected, and the control frame 501 and the connecting seat 404 are symmetrically arranged with two groups; the sliding rod 502 is slidably arranged inside the control frame 501; the control board 503 is fixedly arranged on the outer side of the sliding rod 502 in a straight line arrangement; the threaded cylinder 504 is rotatably arranged inside the control frame 501; the handle B505 is fixedly arranged on the outer side of the top of the threaded cylinder 504 in a circular array; the threaded rod 506 is arranged inside the threaded cylinder 504 by threaded connection, and the threaded rod 506 and the topmost control board 503 are arranged to be fixedly connected; the clamping assembly 6 includes: a load-bearing frame 601, a clamping frame 602, a clamping plate 603 and a bottom plate 604; the load-bearing frame 601 is fixedly arranged at the bottom of the control frame 501; the clamping frame 602 is fixedly arranged on the load-bearing frame 601 bottom, and the clamping frame 602 is set in L shape; the clamping frame 602 is arranged in a straight line, and the clamping frames 602 are fixedly connected; the clamping plate 603 is movably arranged on the inner side of the top of the clamping frame 602, and the clamping plate 603 is fixedly arranged on the outer side of the control board 503, and the clamping plate 603 is arranged in a straight line; the bottom plate 604 is fixedly arranged at the bottom of the bottom clamping frame 602, and the bottom of the bottom plate 604 is in contact with the outer side of the cam 103; its specific function is: by setting the double-headed screw B402 and the connecting seat 404, the two groups of control frames 501 can move in opposite directions at the same time, so that the clamping frames 602 at the bottom of the two groups of control frames 501 move in the opposite direction; at the same time, the threaded barrel 504 cooperates with the threaded rod 506 and the sliding rod 502, so that the straight-line clamping plate 603 can be moved up and down synchronously, and then it can be fixed according to the specific size of the printed circuit board. ;

[0046] Specific usage and function of this embodiment: In the present invention, when in use, the double-headed screw B402 is rotated by the handle A403, so that the double-headed screw B402 drives the two groups of control frames 501 to move in the opposite direction through the connecting seat 404, so that the clamping frames 602 at the bottom of the two groups of control frames 501 move in the opposite direction synchronously, and then the spacing between the clamping frames 602 at the bottom of the two groups of control frames 501 is adjusted according to the size of the printed circuit board; the printed circuit board is placed on the top of the clamping frame 602, and then the threaded cylinder 504 is rotated by the handle B505, and the threaded cylinder 504 drives the linear actuator 506 and the sliding rod 502 to move in the opposite direction. The arrangement control board 503 moves downward, so that the linear arrangement clamping plate 603 moves downward synchronously, so that the printed circuit board is fixed between the clamping plate 603 and the clamping frame 602; the starting motor device drives a set of double-headed screws A302 to rotate, and the two sets of double-headed screws A302 rotate simultaneously through the synchronous wheel 3021 and the synchronous belt device, so that the sliding seat 303 drives the lifting rod A304 and the lifting rod B305 to rotate in the opposite direction, so that the lifting plate 308 moves downward. When the bottom of the lifting plate 308 is in contact with the top of the limit plate 3011, it indicates that the printed circuit board is located in the plating solution in the plating box 1; by Current is passed inside, so that the main salt inside the electroplating solution provides metal ions, so that the metal ions are adsorbed on the printed circuit board to form a metal layer; the motor device is started to drive the driving shaft 106 to rotate, and the driving shaft 106 drives the two sets of rotating shafts 101 to rotate in opposite directions through the bevel gear B107 and the bevel gear A104. The two sets of rotating shafts 101 stir the electroplating solution in multiple directions through the stirring plate 102, so that the main salt inside the electroplating solution is more uniform; at the same time, the rotating shaft 101 drives the cam 103 to rotate, and the cam 103 drives the control frame 501 and the armature through the bottom plate 604 and the clamping frame 602 and the load-bearing frame 601 and the spring member. The connecting platform 401 moves up and down, causing the printed circuit board to shake up and down, so that the bubbles on the surface of the printed circuit board are eliminated; the plating liquid in the plating box 1 flows into the impurity removal box 202 through the non-return valve 201, and at the same time, the plating liquid in the impurity removal box 202 flows back into the plating box 1 through the liquid pump 208, the liquid suction pipe 207 and the liquid return pipe 209, and the plating liquid retains impurities in the impurity removal box 202 through the filter screen plate 206 and the non-return valve 201; the cover plate 204 can be easily disassembled and installed by using the hexagon socket bolts 205 and the threaded holes 203, which is conducive to removing and processing the impurities retained in the impurity removal box 202.

Claims

1. A printed circuit board electroplating device capable of ensuring uniformity of electroplating layer, characterized in that: include: An electroplating box (1); the electroplating box (1) is filled with electroplating liquid, and a rotating shaft (101) is rotatably arranged inside the bottom side of the electroplating box (1); a bevel gear A (104) is fixedly arranged at the top of the rotating shaft (101), and the rotating shaft (101) and the bevel gear A (104) are both symmetrically arranged in two groups; a cam (103) is fixedly arranged on the outside of the rotating shaft (101), and a stirring plate (102) is also fixedly arranged on the outside of the rotating shaft (101); the stirring plates (102) are arranged in a ring array, and the cams (103) are symmetrically arranged in four groups; The top of the electroplating box (1) is arranged as an open structure, and a lifting structure (3) is fixedly arranged on the top of the electroplating box (1), and a connecting component (4) is slidably arranged on the outer side of the bottom of the lifting structure (3); a control structure (5) is slidably arranged on the inner side of the connecting component (4), and a clamping component (6) is fixedly arranged on the bottom of the control structure (5); a de-impurity structure (2) is fixedly arranged on the bottom of the electroplating box (1), and the de-impurity structure (2) comprises: a check valve (201), a de-impurity box (202) and a filter screen (206); the check valve (201) is fixedly arranged inside the bottom side of the electroplating box (1); the de-impurity box (202) is fixedly arranged on the outer side of the bottom end of the check valve (201), and one side of the de-impurity box (202) is arranged as an open structure; the filter screen (206) is fixedly arranged inside one side of the de-impurity box (202).

2. A printed circuit board electroplating device capable of ensuring uniformity of electroplating layer according to claim 1, characterized in that: A drive seat (105) is fixedly arranged on the outside of the electroplating box (1), and a drive shaft (106) is rotatably arranged inside the drive seat (105); the drive shaft (106) is fixedly arranged on the shaft end of the motor device, and the motor device is fixedly arranged on the outside of the drive seat (105); two groups of bevel gears B (107) are symmetrically fixedly arranged on the outside of the drive shaft (106), and the two groups of bevel gears B (107) are respectively meshed with the two groups of bevel gears A (104).

3. A printed circuit board electroplating device capable of ensuring uniformity of electroplating layer according to claim 1, characterized in that: The impurity removal structure (2) further comprises: a threaded hole (203), a cover plate (204) and a hexagon socket bolt (205); the threaded hole (203) is provided inside one side of the impurity removal box (202), and the threaded hole (203) is symmetrically provided in four groups; the cover plate (204) is movably provided inside the opening structure on one side of the impurity removal box (202); the hexagon socket bolt (205) is movably provided inside the cover plate (204), and the hexagon socket bolt (205) is provided inside the threaded hole (203) through a threaded connection.

4. A printed circuit board electroplating device capable of ensuring uniformity of electroplating layer according to claim 3, characterized in that: The impurity removal structure (2) further comprises: a liquid extraction pipe (207), a liquid pump (208) and a liquid return pipe (209); one end of the liquid extraction pipe (207) is fixedly arranged inside the bottom side of the impurity removal box (202); the liquid inlet of the liquid pump (208) is fixedly connected to the other end of the liquid extraction pipe (207); the bottom end of the liquid return pipe (209) is fixedly arranged outside the liquid outlet of the liquid pump (208), and the top end of the liquid return pipe (209) is fixedly arranged inside the top side of the electroplating box (1).

5. A printed circuit board electroplating device capable of ensuring uniformity of electroplating layer according to claim 1, characterized in that: The lifting structure (3) comprises: a lifting frame (301), a double-headed screw rod A (302), a synchronous wheel (3021), a sliding seat (303), a lifting rod A (304), a lifting rod B (305), a connecting seat (306), a cross bar (307) and a lifting plate (308); the lifting frame (301) is fixedly arranged on the top of the electroplating box (1); the double-headed screw rod A (302) is rotatably arranged on the top of the lifting frame (301), and the double-headed screw rod A (302) and the lifting frame (301) are symmetrically arranged in two groups, and the two groups of lifting frames (301) are located on both sides of the top opening structure of the electroplating box (1); one group of double-headed screw rods A (302) is fixedly arranged on the shaft end of the motor device, and the motor device is fixedly arranged on the outside of the lifting frame (301); the number of synchronous wheels (3021) is set to two groups, and the two groups of synchronous wheels (3021) are respectively fixedly arranged on the double-headed screw rods A ( The sliding seat (303) is arranged on the outside of the double-headed screw rod A (302) through a threaded connection, and the sliding seat (303) is symmetrically arranged in four groups; the lifting rod A (304) is rotatably arranged at the bottom of one group of sliding seats (303); the lifting rod B (305) is rotatably arranged at the bottom of another group of sliding seats (303), and the lifting rod B (305) and the lifting rod A (304) are cross-rotatably connected; the connecting seat (306) is symmetrically arranged in four groups, and two groups of connecting seats (306) are rotatably arranged at the bottom of the lifting rod A (304), and the other two groups of connecting seats (306) are rotatably arranged at the bottom of the lifting rod B (305); the cross bar (307) is slidably arranged between the insides of the two groups of connecting seats (306); and the lifting plate (308) is fixedly arranged on the outside of the cross bar (307).

6. A printed circuit board electroplating device capable of ensuring uniformity of electroplating layer according to claim 5, characterized in that: The lifting structure (3) further comprises: a guide column (309), a baffle (3010) and a limit plate (3011); the guide column (309) is fixedly arranged at the bottom of the lifting plate (308); the baffle (3010) is fixedly arranged at the bottom of the guide column (309), and the guide column (309) and the baffle (3010) are arranged in a straight line; the limit plate (3011) is fixedly arranged at the bottom of the lifting frame (301), and the top of the limit plate (3011) is in contact with the bottom of the lifting plate (308).

7. A printed circuit board electroplating device capable of ensuring uniformity of electroplating layer according to claim 6, characterized in that: The connection assembly (4) comprises: a connection platform (401), a double-headed screw rod B (402), a handle A (403), a connection seat (404) and a fixed rod (405); the connection platform (401) is slidably arranged on the outside of the guide column (309), and a spring member is arranged between the top of the connection platform (401) and the top of the guide column (309), and the connection platform (401) is located on the top of the baffle (3010); the double-headed screw rod B (402) is rotatably arranged on the top of the connection platform (401); the handle A (403) is fixedly arranged on the end of the double-headed screw rod B (402) in a circular array; the connection seat (404) is arranged on the outside of the double-headed screw rod B (402) by threaded connection; the fixed rod (405) is fixedly arranged inside the connection platform (401), and two groups of the fixed rods (405) are arranged.

8. A printed circuit board electroplating device capable of ensuring uniformity of electroplating layer according to claim 7, characterized in that: The control structure (5) comprises: a control frame (501), a sliding rod (502), a control panel (503), a threaded barrel (504), a handle B (505) and a threaded rod (506); the control frame (501) is slidably arranged between two groups of fixed rods (405), and the control frame (501) is fixedly connected to the connecting seat (404); the sliding rod (502) is slidably arranged inside the control frame (501); the control panel (503) is fixedly arranged outside the sliding rod (502) in a linear arrangement; the threaded barrel (504) is rotatably arranged inside the control frame (501); the handle B (505) is fixedly arranged at the top of the threaded barrel (504) in a ring array; the threaded rod (506) is arranged inside the threaded barrel (504) by threaded connection, and the threaded rod (506) is fixedly connected to the top control panel (503).

9. A printed circuit board electroplating device capable of ensuring uniformity of electroplating layer according to claim 8, characterized in that: The clamping assembly (6) comprises: a load-bearing frame (601), a clamping frame (602), a clamping plate (603) and a bottom plate (604); the load-bearing frame (601) is fixedly arranged at the bottom of the control frame (501); the clamping frame (602) is fixedly arranged at the bottom of the load-bearing frame (601), and the clamping frame (602) is arranged in an L shape; the clamping frames (602) are arranged in a straight line, and the clamping frames (602) are fixedly connected; the clamping plate (603) is movably arranged on the inner side of the top of the clamping frame (602), and the clamping plate (603) is fixedly arranged on the outer side of the control board (503), and the clamping plate (603) is arranged in a straight line; the bottom plate (604) is fixedly arranged at the bottom of the bottommost clamping frame (602), and the bottom of the bottom plate (604) is in contact with the outer side of the cam (103).