Multi-mode curing monitoring method and system with time-space resolution

Abstract

The present invention aims to provide a spatiotemporally resolved multi-mode curing monitoring method and system, comprising: using an airbrush to uniformly spray fluorescent speckle on a sample surface to obtain a test sample; securing the test sample, adjusting the positions of an industrial gray point camera, an optical coherence tomography (OCT) measurement device, and an optical filter to clearly visualize the speckle pattern on the test sample surface and a cross-sectional view of the test sample; emitting diffuse light behind the test sample to trigger the photocuring process of the test material, and simultaneously performing OCT curing monitoring, FDIC curing monitoring, and speckle tracking-based OCT curing monitoring to obtain surface and internal change data of the test sample. This invention can synchronize DIC and OCT measurements, thereby obtaining consistent monitoring results for both the surface and the interior, providing richer experimental data for polymer curing monitoring.

Description

Technical Field

[0001] The present invention relates to the technical field of material measurement, and in particular to a multi-mode curing monitoring method and system with time-space resolution. Background Art

[0002] High molecular weight polymers (such as rubber, resin and fiber) are widely used in daily life, industry and medicine due to their excellent properties. The curing and molding process of polymers directly determines their final microstructure and macroscopic properties, and plays a key role in high-end application fields such as aerospace, electronic devices and biomedical materials. However, the curing process is accompanied by complex physical state transformations and performance evolution, which places higher demands on the precise control and reliability of material processing. Therefore, real-time monitoring and in-depth analysis of the polymer curing process can not only reveal the inherent laws of its curing mechanism, but also provide a solid theoretical basis for the optimization design of material properties and the improvement of reliability in practical applications.

[0003] Existing polymer curing monitoring technologies are mainly divided into two categories: contact and non-contact:

[0004] Contact techniques, such as differential scanning calorimetry (DSC), dielectric analysis (DEA), and dynamic mechanical analysis (DMA), acquire physical or chemical signals through direct contact with the sample surface or interior. These techniques monitor the curing process by measuring certain physical quantities of the polymer in real time, providing detailed information on the curing reaction kinetics and microscopic property changes. However, contact techniques have limitations: interference with the material's curing process, poor environmental adaptability, and the inability to measure spatial distributions. These limitations restrict their application in complex environments or specialized applications.

[0005] Non-contact technology has gradually become a research hotspot in recent years, especially DIC (digital image correlation) technology and OCT (optical coherence tomography) technology:

[0006] 1) DIC technology is based on the measurement of surface deformation and displacement fields. By tracking the evolution of the speckle pattern on the sample surface, it can obtain the full-field strain distribution of the sample in real time during the curing process. Its advantages are that it does not require contact with the sample, is applicable to a variety of materials and complex geometries, and can provide high-resolution information at both macro and micro scales.

[0007] 2) OCT technology relies on the principle of optical interference. The reflected light from different depths of the sample interferes with the reference arm beam to form an interference spectrum. By performing Fourier transform on the interference spectrum, the microstructural information of the sample is obtained. OCT can not only non-destructively measure the depth information inside the material, but also provide nanoscale displacement and dynamic change characterization in combination with phase analysis. It is an important development direction in the field of curing monitoring.

[0008] The two technologies are considered to be the most promising solidification monitoring methods due to their high precision, real-time performance and multi-scenario adaptability.

[0009] While DIC and OCT technologies enable non-contact, full-field curing monitoring, the polymer curing process exhibits significant spatial distribution characteristics. Surface and internal displacements and deformations can exhibit distinct dynamic patterns, making it difficult to fully grasp the complexity of the curing process with a single technique. Therefore, to precisely control the polymer curing process, simultaneous monitoring of both surface and internal deformation characteristics is necessary.

[0010] However, in the existing technology, if DIC technology is used to monitor the surface and OCT technology is used to monitor the cross-section, the two experimental results cannot match well due to the unidirectionality of the polymerization process and slight differences in the sample environment. The combination of OCT and DVC (digital volume correlation) technology can realize three-dimensional full-field curing monitoring, which is an effective method to characterize the internal and surface behavior of polymer curing and can achieve precise control of the polymer curing process. However, three-dimensional full-field measurement requires the collection of a large amount of data at each curing state, and the amount of data is hundreds or thousands of times that of two-dimensional monitoring data, which cannot meet the needs of dynamic monitoring.

[0011] Based on this, a multimodal curing monitoring method that can synchronize DIC and OCT measurements and obtain consistent monitoring results between the surface and the interior is in urgent need of development. Summary of the Invention

[0012] The object of the present invention is to provide a multi-mode curing monitoring method and system with time and space resolution to at least solve one technical problem in the prior art.

[0013] The technical solution of the present invention is:

[0014] A multi-mode curing monitoring method with time and space resolution, comprising:

[0015] Use an airbrush to evenly spray fluorescent speckles on the surface of the sample to obtain the sample to be tested;

[0016] Fixing the sample to be tested, adjusting the positions of the industrial gray point camera, the OCT measuring device, and the filter so that the speckle pattern on the surface of the sample to be tested and the cross-sectional view of the sample to be tested are clearly visible;

[0017] Diffuse light is emitted directly below the sample to trigger the light curing process of the material to be tested. OCT curing monitoring, FDIC curing monitoring, and OCT curing monitoring based on speckle tracking are performed simultaneously to obtain surface and internal change data of the sample to be tested.

[0018] The OCT curing monitoring process includes:

[0019] During the curing process, collecting the interference spectrum of the sample to be tested by OCT;

[0020] Performing Fourier transform on the collected interference spectrum to extract its phase information, and performing differential calculation on the phase-frequency characteristics before and after the Fourier transform change to obtain the phase difference distribution of the package of the reaction cross-section change information;

[0021] The phase difference distribution is processed by phase unwrapping to obtain the shrinkage strain at any point on the material, and the shrinkage strain is differentiated with respect to time to obtain the curing rate of the sample to be tested.

[0022] The method of processing the phase difference distribution by phase unwrapping to obtain the shrinkage strain at any point on the material, and differentiating the shrinkage strain with respect to time to obtain the curing rate of the sample to be tested includes:

[0023] The phase demodulated by the differential phase formula is a warped phase distributed in [-π, π]. The relationship between the phase difference and the optical path difference after unwinding is expressed as:

[0024]

[0025] Where umwrap represents phase unwrapping; λ c represents the central wavelength of the broadband light source of the OCT system; ΔФ j (t) represents the phase difference before and after the change;

[0026] According to the physical relationship between optical path difference and deformation, the strain at point z on the material can be expressed as:

[0027]

[0028] Among them, ε z (t) is the shrinkage strain of the material, d is the distance between point z and the lower surface of the sample to be tested;

[0029] The measured phase change can be used to estimate the shrinkage strain of the polymer during the curing process. Differentiating the shrinkage strain with respect to time can yield the curing rate v, as shown in the formula:

[0030]

[0031] The FDIC solidification monitoring process includes:

[0032] Select one of the obtained surface images of the material to be tested as a reference image, and select a region of interest in the reference image as a search window;

[0033] Dividing the search window into at least one subregion, and calculating the correlation between each subregion of the deformed image and a reference subregion using a normalized cross-correlation function;

[0034] By taking the maximum value of the correlation function calculation result, the optimal matching position of the deformed sub-region is determined; and the pixel-level displacement of the sub-region is preliminarily determined by the offset between the matching position and the original position of the reference sub-region;

[0035] Use sub-pixel interpolation processing to obtain high-precision sub-pixel displacement of sub-regions;

[0036] After calculating the displacement of each sub-region, the displacements of all sub-regions are combined into the displacement field of the entire search window;

[0037] By numerically differentiating the displacement field, the strain field of the entire search window is obtained.

[0038] The step of dividing the search window into at least one sub-region and calculating the correlation between each sub-region of the deformed image and a reference sub-region using a normalized cross-correlation function comprises:

[0039] The normalized cross-correlation function can be expressed as:

[0040]

[0041] Among them, I f (i, j) is the grayscale value of the reference sub-region, I r (i′, j′) is the grayscale value of the sub-region after deformation, Γ f is the average grayscale of the reference sub-region, Γ r is the average grayscale of the sub-region after deformation.

[0042] The process of OCT curing monitoring based on speckle tracking includes:

[0043] Collecting the time-varying interference spectrum of the sample to be tested by the OCT system;

[0044] After demodulating the interference spectrum using Fourier transform, the amplitude of the interference signal is obtained, and the amplitude-frequency characteristic of the interference signal along the wave number axis is used as the cross-sectional profile of the sample to be measured;

[0045] According to the cross-sectional profile of the sample to be tested, a suitable search window is selected in the cross-sectional profile, and the size of the sub-region in the search window is determined, and the full-field displacement is obtained through DIC calculation;

[0046] The full-field strain is obtained by differentiating the full-field displacement.

[0047] The time-space resolved multi-mode curing monitoring method comprises:

[0048] The amplitude of the interference signal is:

[0049]

[0050] Where k is the wave number of light, M is the number of surfaces of the material being measured that participate in the interference, and I R and I j are the intensities of the reflected light from the reference surface and the scattered light from the jth surface inside the sample to be tested; f represents the frequency of change of the interference signal along the wavenumber direction; f Rj represents the frequency corresponding to the optical path difference between the jth surface and the reference surface; Δk is the wavenumber bandwidth.

[0051] A monitoring system based on the multi-mode curing monitoring method as described above comprises:

[0052] A bracket, used to fix the sample to be tested with fluorescent speckles sprayed on the surface;

[0053] A backlight, disposed directly below the sample to be measured, for emitting uniform diffuse light to excite fluorescent speckles of the sample to be measured;

[0054] The red filter is located directly above the sample to be tested;

[0055] an OCT measuring device, disposed directly above the red filter, for emitting light and receiving light filtered by the red filter to detect cross-sectional information of the sample to be measured;

[0056] The DIC device is arranged on one side of the red filter and is used to capture the reflected light after being reflected by the red filter; the reflected light includes the blue light generated after the fluorescent speckle is excited and the purple light emitted by the backlight.

[0057] The bracket comprises:

[0058] bracket body;

[0059] a first fixing mechanism, one end of which is rotatably connected to the bracket body and the other end of which is detachably fixed to the sample to be tested;

[0060] a second fixing mechanism, one end of which is rotatably connected to the bracket body and the other end of which is detachably fixed to the red filter;

[0061] The first fixing mechanism is closer to the backlight than the second fixing mechanism.

[0062] The DIC device comprises:

[0063] A lens group, used to receive the blue light generated after the fluorescent speckle is excited and the purple light emitted by the backlight;

[0064] A blue filter is provided behind the lens group and is used to filter the blue light;

[0065] The sensor is arranged behind the blue filter and is used to collect the light filtered by the blue filter.

[0066] The beneficial effects of the present invention include at least:

[0067] The method disclosed herein triggers the photocuring process of the material to be tested by emitting diffuse light directly below the sample to be tested, and simultaneously performs OCT curing monitoring, FDIC curing monitoring, and OCT curing monitoring based on speckle tracking, thereby obtaining surface and internal change data of the sample to be tested. The method disclosed herein utilizes the fluorescence speckle penetration capability, specular reflection elimination capability, and speckle contrast enhancement capability of fluorescence imaging to synchronize DIC and OCT measurements, thereby obtaining consistent monitoring results for both the surface and the interior, providing richer experimental data for polymer curing monitoring. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 This is a flow chart of the multi-mode curing monitoring method of the present invention;

[0069] Figure 2 This is the schematic diagram of PhS-OCT curing monitoring;

[0070] Figure 3 Solidify monitoring schematics for FDIC;

[0071] Figure 4 The schematic diagram of OCT curing monitoring based on speckle tracking;

[0072] Figure 5 This is a schematic diagram of the structure of the multimodal measurement system of the present invention;

[0073] Figure 6 This is the strain rate curve after normalization using the FDIC technique;

[0074] Figure 7 The normalized strain rate curve using speckle tracking-based OCT technology;

[0075] Figure 8 This is the strain rate curve after normalization using PhS-OCT technology. DETAILED DESCRIPTION

[0076] The present application will be further described below with reference to the accompanying drawings. Specific embodiment 1:

[0078] The present invention provides an embodiment:

[0079] like Figure 1A spatiotemporally resolved multi-mode curing monitoring method includes: using an airbrush to uniformly spray fluorescent speckles on a sample surface to obtain a sample to be tested; fixing the sample to be tested, and adjusting the positions of an industrial gray point camera, an OCT measurement device, and a filter so that the speckle pattern on the surface of the sample to be tested and a cross-sectional view of the sample to be tested are clearly visible; emitting diffuse light behind the sample to be tested to trigger the photocuring process of the material to be tested, and simultaneously performing OCT curing monitoring, FDIC curing monitoring, and OCT curing monitoring based on speckle tracking to obtain surface and internal change data of the sample to be tested.

[0080] Specifically, such as Figure 2 The principle of PhS-OCT curing monitoring is as follows:

[0081] First, the interference spectrum collected during the curing process is Fourier transformed to extract its phase information. Then, the phase-frequency characteristics before and after the change are differentially calculated to obtain the phase difference distribution of the reaction cross-section change information. The phase demodulated by the differential phase formula is a wrapped phase distributed in [-π, π]. To restore the true phase, it is necessary to perform phase unwrapping. The relationship between the phase difference and the optical path difference after unwrapping can be expressed as:

[0082]

[0083] Where unwrap represents phase unwinding. Based on the physical relationship between optical path difference and deformation, the strain at point z on the material can be expressed as:

[0084]

[0085] Among them, ε z (t) is the shrinkage strain of the material, and d is the distance between point z and the lower surface. The shrinkage strain of the polymer during the curing process can be estimated from the measured phase change. The curing rate v can be obtained by differentiating the shrinkage strain with respect to time. The formula is:

[0086]

[0087] FDIC solidification monitoring principle, such as Figure 3 As shown:

[0088] FDIC technology first requires selecting a reference image from the obtained material surface image, usually the first frame, and then selecting a region of interest (ROI) in the reference image as the search window. The ROI is then divided into several subregions, and the normalized cross-correlation function is used to calculate the correlation between each subregion of the deformed image and the reference subregion. The closer the value of the normalized cross-correlation function is to 1, the more accurate the matching result. The normalized cross-correlation function can be expressed as:

[0089]

[0090] Among them, I f (i, j) is the grayscale value of the reference sub-region, I r (i′, j′) is the grayscale value of the sub-region after deformation, is the average grayscale of the reference sub-region, is the average grayscale of the deformed subregion. By maximizing the correlation function, we determine the optimal matching position of the deformed subregion. The offset between the matching position and the original position of the reference subregion allows us to preliminarily determine the pixel-level displacement. Sub-pixel interpolation is then used to obtain highly accurate sub-pixel displacement. After calculating the displacement of each subregion, the displacements of all subregions are combined to form the displacement field for the entire ROI. By numerically differentiating the displacement field, we can obtain the strain field for the entire ROI.

[0091] OCT solidification monitoring principle based on speckle tracking, such as Figure 4 :

[0092] The frequency variation of the interference signal collected by the OCT system along the wavenumber direction corresponds to the depth information of the sample. After signal demodulation using the Fourier transform method, the amplitude of the interference signal can be expressed as:

[0093]

[0094] Where k is the wave number of light, M is the number of surfaces of the material being measured that participate in the interference, and I R and I j are the intensities of the reflected light from the reference surface and the scattered light from the jth surface inside the material being tested. It can be seen that only when f=f Rj The signal in the time-frequency domain has amplitude, and its intensity is related to the intensity of the light scattered by the material. The frequency is proportional to the optical path difference. Therefore, the amplitude-frequency characteristics of the interference signal along the wavenumber axis are the cross-sectional profile of the material being measured.

[0095] After obtaining the cross-sectional profile of the material being tested, select a suitable ROI in the image and determine the size of the sub-region. The full-field displacement can be obtained by DIC calculation, and the full-field strain can be obtained by differential calculation of the full-field displacement. The process of using speckle tracking-based OCT technology for curing monitoring is as follows: Figure 4 Shown:

[0096] Unlike thermal deformation measurement, the curing process of polymers is a unidirectional process with strong spatial distribution characteristics such as global or local non-uniform displacement. It is necessary to provide non-contact full-field curing monitoring for the complex deformation behavior of the polymer surface and interior. The method described in this embodiment, through the combination of three imaging technologies, can simultaneously realize the curing characterization based on three technologies: PhS-OCT (Phase-sensitive OCT, phase-sensitive optical coherence tomography), FDIC (Fluorescent DIC, fluorescent DIC) and speckle tracking-based OCT, and simultaneously obtain the spatiotemporal resolution of curing information on the surface and interior to ensure the consistency of the curing environment. In addition, the multiple curing monitoring results and rich experimental basis obtained in this way can be calibrated with each other and cross-validated with multiple sets of data, providing high measurement accuracy for the curing monitoring of polymers. Specific embodiment 2:

[0098] The present invention provides an embodiment:

[0099] like Figure 5 A monitoring system based on the multi-mode curing monitoring method as described in specific embodiment 1 comprises: a bracket 1, a backlight 2, a red filter 3, an OTC measuring device 4 and a DIC device 5; wherein the bracket 1 is used to fix the sample to be measured with fluorescent speckles sprayed on the surface; the backlight 2 is arranged on one side of the sample to be measured and is used to emit uniform diffuse light to stimulate the fluorescent speckles of the sample to be measured; the red filter 3 is located on the opposite side of the backlight 2; the OTC measuring device 4 is arranged behind the red filter 3 and its height can be adjusted, as shown in FIG. Figure 5 The M in the figure is used to receive the light filtered by the red filter 3 to detect the cross-sectional information of the sample to be tested; the DIC device 5 is provided on one side of the red filter 3 to capture the reflected light after being reflected by the red filter 3; the reflected light includes the blue light generated after the fluorescent speckle is excited and the purple light emitted by the backlight.

[0100] Specifically, the bracket 1 includes: a bracket body 101, a first fixing mechanism 102 and a second fixing mechanism 103; wherein one end of the first fixing mechanism 102 is connected to the bracket body 101 through a pin structure, such as Figure 5 S in the middle, and the other end is fixed to the sample to be tested by a clamping mechanism, such as a clip; one end of the second fixing mechanism 103 is connected to the bracket body 101 by a pin structure, and the other end is fixed to the red filter 3 by a clamping mechanism, such as a clip; preferably, a bending point is provided in the middle of the second fixing mechanism 103, which can be a pin structure, to facilitate adjustment of the angle of the red filter 3, such as 45°; wherein, the first fixing mechanism 102 is closer to the backlight 2 than the second fixing mechanism 103.

[0101] Specifically, the DIC device 5 includes: a lens group 501, a blue filter 502, and a sensor 503; wherein the lens group 501 is used to receive the blue light generated after the fluorescent speckle is excited and the purple light emitted by the backlight; the blue filter 502 is set behind the lens group 501 to filter the blue light; the sensor 503 is set behind the blue filter 502 to collect the light filtered by the blue filter 502. Preferably, the lens group 501 can be selected as needed, such as Figure 5 The first lens L1 and the second lens L2 in.

[0102] When using, according to Figure 5 The multimodal measurement system was built as shown in the optical path structure diagram, and the dental resin material CharmFil was selected as the sample to be tested for the curing detection experiment.

[0103] First, an airbrush is used to evenly spray fluorescent speckle onto the surface of the CharmFil material. The coated sample is then mounted on a stage. The industrial gray-dot camera, OCT measurement device, and filters are positioned to clearly visualize the speckle pattern on the material surface and a cross-sectional view of the material. A 395nm backlight is then activated to trigger the CharmFil material's photocuring process. A multimodal measurement system monitors the curing process in real time, including changes on the material surface and within it.

[0104] Then, the strain fields of the CharmFil material calculated by the three techniques described in Specific Example 1 are obtained.

[0105] Then, a point in the strain field is selected to generate a strain curve that changes with time. The strain curve is derived to obtain a relative strain rate curve, and the strain rate curve is normalized, such as Figure 6-8 shown.

[0106] Finally, analysis of the experimental results revealed consistent trends in the strain-time and strain rate-time curves obtained using the three techniques. The strain all started at 0 and gradually accumulated to approximately -0.013. The strain rate also started at 0, peaked at approximately 20 seconds, and then decayed to 0 over time. The curing information obtained from the three data sets matched the information provided in the material specifications, demonstrating the good consistency and reliability of the monitoring results obtained by the three techniques during the curing process.

[0107] The above disclosures are only a few specific implementation scenarios of the present invention, but the present invention is not limited thereto. Any changes that can be conceived by those skilled in the art should fall within the scope of protection of the present invention. The above invention numbers are for descriptive purposes only and do not represent the advantages or disadvantages of the implementation scenarios.

Claims

1. A multi-mode curing monitoring method with time and space resolution, characterized in that: include: Use an airbrush to evenly spray fluorescent speckles on the surface of the sample to obtain the sample to be tested; Fix the sample to be tested, adjust the industrial gray point camera, OCT The measurement device and the filter are positioned so that the speckle pattern on the surface of the sample to be measured and the cross-sectional view of the sample to be measured are clearly visible; Emitting diffuse light directly below the sample to be tested triggers the light curing process of the sample to be tested, and at the same time OCT Curing monitoring, FDIC Solidification monitoring and speckle tracking based OCT Curing monitoring to obtain surface and internal change data of the sample to be tested; described OCT The process of curing monitoring includes: During the curing process, OCT collecting an interference spectrum of the sample to be tested; Performing Fourier transform on the collected interference spectrum to extract its phase information, and performing differential calculation on the phase-frequency characteristics before and after the Fourier transform change to obtain the phase difference distribution of the package of the reaction cross-section change information; Processing the phase difference distribution by phase unwrapping to obtain the shrinkage strain at any point on the material, and differentiating the shrinkage strain with respect to time to obtain the curing rate of the sample to be tested; The method of processing the phase difference distribution by phase unwrapping to obtain the shrinkage strain at any point on the material, and differentiating the shrinkage strain with respect to time to obtain the curing rate of the sample to be tested includes: The phase demodulated by the differential phase formula is The relationship between the distributed winding phase, the phase difference after unwinding and the optical path difference is expressed as: ； in, unwrap represents phase unwrapping; λ c represent OCT The central wavelength of the system's broadband light source; ΔФ j ( t ) represents the phase difference before and after the change; According to the physical relationship between optical path difference and deformation, the point on the material The strain can be expressed as: ； in, is the shrinkage strain of the material, d is the point z The distance between the bottom surface of the sample to be tested; The measured phase change can be used to estimate the shrinkage strain of the polymer during the curing process, and the curing rate can be obtained by differentiating the shrinkage strain with respect to time. , the formula is: ; described FDIC The process of curing monitoring includes: Select one of the obtained surface images of the sample to be tested as a reference image, and select a region of interest in the reference image as a search window; Dividing the search window into at least one subregion, and calculating the correlation between each subregion of the deformed image and a reference subregion using a normalized cross-correlation function; By taking the maximum value of the correlation function calculation result, the optimal matching position of the deformed sub-region is determined; and the pixel-level displacement of the sub-region is preliminarily determined by the offset between the matching position and the original position of the reference sub-region; Use sub-pixel interpolation processing to obtain high-precision sub-pixel displacement of sub-regions; After calculating the displacement of each sub-region, the displacements of all sub-regions are combined into the displacement field of the entire search window; By numerically differentiating the displacement field, the strain field of the entire search window is obtained; The step of dividing the search window into at least one sub-region and calculating the correlation between each sub-region of the deformed image and a reference sub-region using a normalized cross-correlation function comprises: The normalized cross-correlation function can be expressed as: ； in, is the grayscale value of the reference sub-region, is the grayscale value of the sub-region after deformation, is the average grayscale of the reference sub-region, is the average grayscale of the sub-region after deformation; The speckle tracking-based OCT The process of curing monitoring includes: pass OCT The system collects the interference spectrum that changes with time, demodulates the interference spectrum using Fourier transform to obtain the amplitude of the interference signal, and uses the amplitude-frequency characteristics of the interference signal along the wavenumber axis as the cross-sectional profile of the sample to be measured; According to the cross-sectional profile of the sample to be tested, a suitable search window is selected in the cross-sectional profile, and the size of the sub-region in the search window is determined, and the DIC The full-field displacement is calculated; The full-field strain is obtained by differentiating the full-field displacement; The time-space resolved multi-mode curing monitoring method comprises: The amplitude of the interference signal is: Where k is the wave number of light, is the number of surfaces of the material being measured that participate in the interference, They are respectively the reflected light from the reference surface and the light inside the sample to be tested. The intensity of light scattered from a surface; f Represents the frequency of change of the interference signal along the wavenumber direction; f Rj Representative j The frequency corresponding to the optical path difference between the surface and the reference surface; is the wavenumber bandwidth.

2. A monitoring system based on the spatiotemporal resolution multi-mode curing monitoring method according to claim 1, characterized in that: include: A bracket, used to fix the sample to be tested with fluorescent speckles sprayed on the surface; A backlight, disposed below the sample to be tested, for emitting uniform diffuse light to excite fluorescent speckles of the sample to be tested; A red filter is located directly above the sample to be tested; OCT a measuring device, disposed directly above the red filter, for emitting light and receiving light filtered by the red filter to detect cross-sectional information of the sample to be measured; DIC A device, disposed on one side of the red filter, for capturing reflected light after being reflected by the red filter; the reflected light includes blue light generated after being excited by the fluorescent speckle and purple light emitted by the backlight; described DIC Device, comprising: A lens group, used to receive the blue light generated after the fluorescent speckle is excited and the purple light emitted by the backlight; A blue filter is provided behind the lens group and is used to filter the blue light; The sensor is arranged behind the blue filter and is used to collect the light filtered by the blue filter.

3. The monitoring system according to claim 2, characterized in that The bracket comprises: bracket body; a first fixing mechanism, one end of which is rotatably connected to the bracket body and the other end of which is detachably fixed to the sample to be tested; a second fixing mechanism, one end of which is rotatably connected to the bracket body and the other end of which is detachably fixed to the red filter; The first fixing mechanism is closer to the backlight than the second fixing mechanism.

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