PCB embedded magnetic ring integrated structure and method

Abstract

The invention belongs to the field of PCBs, and discloses a PCB embedded magnetic ring integration structure and method, the structure comprises a PCB, the PCB is internally provided with a magnetic ring, and the magnetic ring is fixedly connected with the PCB through a fixing column; welding devices are fixedly connected to the upper end face and the lower end face of the PCB, and each welding device comprises a sheet, a bare core and a resistor-capacitor; a cofferdam and pins are arranged on the periphery of the PCB, the welding device and the magnetic ring are fixedly connected with the PCB through pouring sealant, miniaturization integration of the isolated power source and the isolated gate driver is achieved through PCB magnetic ring embedding and three-dimensional multi-layer space utilization, meanwhile, the cofferdam encapsulation and stamp hole technology is adopted, and the reliability of the isolated power source and the isolated gate driver is improved. Under the low-cost design principle, a board-level circuit is converted into a microcircuit module, external signals are led out, the stamp hole bonding pad design does not need an additional lead ball mounting procedure, low-cost design is achieved, and the technical problems that in the prior art, magnetic isolation is large in size, hardware is complex, cost is high, and the miniaturization requirement of new-generation aerospace equipment cannot be met are solved.

Description

Technical Field

[0001] The invention belongs to the technical field of PCBs and relates to a PCB embedded magnetic ring integrated structure and method. Background Art

[0002] PCB printed circuit board is a support carrier for connecting electronic components. By etching conductive lines on the insulating substrate, various electronic components are connected according to the predetermined circuit design to achieve functions such as signal transmission and power distribution. The gate driver is a buffer circuit between the low-voltage controller and the high-power circuit, and is mounted on the PCB board by surface mounting or through-hole insertion. The gate driver has the following functions: 1) Convert the low-voltage signal of the controller into a higher voltage drive signal to achieve stable conduction and shutdown of the power device; 2) Can provide transient pull and sink current, increase the switching speed of the power device, and reduce switching losses; 3) Can effectively isolate the noise of the high-power circuit to prevent sensitive circuits from being interfered with; 4) Has a protective function to effectively prevent damage to the power device.

[0003] In high-voltage power systems, isolation is used to avoid harm to the human body caused by high-voltage electricity, and safety standards are met. Isolation drive is a type of gate driver that can protect the control system from damage caused by lightning strikes, high-voltage transients, etc., while eliminating ground loops, reducing interference from the high-voltage side to the low-voltage side, and achieving current and voltage changes and energy transfer. Isolation drive includes single-channel and dual-channel drive isolation, which uses internal isolation belts to physically isolate the high-voltage and low-voltage parts, and can be used for low-side, high-side or half-bridge applications. Magnetic isolation solutions are commonly used isolation methods. Micro-transformers and electronic circuits are integrated inside the circuit to achieve signal transmission. They have the characteristics of long life and wide operating temperature range.

[0004] The existing magnetic isolation is large in size, complex in hardware, and high in cost. It cannot meet the miniaturization requirements of the new generation of aerospace equipment and cannot be used on a large scale. Summary of the invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a PCB embedded magnetic ring integrated structure and method, the magnetic ring is embedded in the PCB, the welding device is installed on the upper and lower end surfaces of the PCB, and a low-cost cofferdam encapsulation technology is adopted. The welding device and the PCB board are fixed with a potting glue to realize three-dimensional multi-layer space utilization, thereby solving the technical problems in the prior art that the magnetic isolation has a large volume, complex hardware, and high cost and cannot meet the miniaturization requirements of the new generation of aerospace equipment.

[0006] In order to achieve the above object, the present invention adopts the following technical solution: The present invention provides a PCB embedded magnetic ring integrated structure, comprising a PCB board, wherein a magnetic ring is arranged inside the PCB board and fixedly connected to the PCB board through a fixing column; welding devices are fixedly connected to upper and lower end surfaces of the PCB board, and the welding devices include sheets, bare cores, and resistors and capacitors; a cofferdam and pins are arranged on the periphery of the PCB board, and the welding device and the magnetic ring are fixedly connected to the PCB board through a potting glue.

[0007] Furthermore, stamp hole pads are provided on both sides of the PCB board for electrical connection with an external circuit.

[0008] Furthermore, the surface coating of the stamp hole pad is nickel-palladium-gold, wherein the thickness of the nickel layer is 3 μm. 6μm, the thickness of palladium layer is 0.05μm 0.3μm, the thickness of the gold layer is greater than 0.03μm.

[0009] Furthermore, the sliced ​​RCs are welded on the upper and lower end surfaces of the PCB, and the bare core is fixedly connected to the PCB by adhesive or bonding.

[0010] Furthermore, the magnetic ring converts alternating current into isolated electricity, which acts on the gate driver.

[0011] Furthermore, a cavity is provided in the PCB board for installing a magnetic ring, the cavity is adapted to the magnetic ring, and a fixing column is provided on the inner side of the magnetic ring.

[0012] Furthermore, the height of the cavity is greater than the height of the magnetic ring.

[0013] Furthermore, the PCB board is connected to the user end through silicone rubber.

[0014] The present invention also provides a method for integrating a PCB embedded magnetic ring. Based on the above-mentioned PCB embedded magnetic ring integrated structure, the method comprises the following steps: installing the magnetic ring inside the PCB board and fixedly connecting it to the PCB board through a fixing column; fixing a welding device on the upper and lower end surfaces of the PCB board; encapsulating the upper and lower end surfaces of the PCB board, and fixedly connecting the welding device, the magnetic ring and the PCB board through a potting glue.

[0015] Furthermore, before installing the magnetic ring inside the PCB board, the method further includes: detecting the inductance of the PCB board.

[0016] Compared with the prior art, the present invention has the following beneficial technical effects: The present invention discloses a PCB embedded magnetic ring integrated structure. The magnetic ring is embedded when the PCB board is manufactured. Resistors and capacitors, bare cores and sheets can be welded on both sides of the PCB, and three-dimensional multi-layer space is effectively utilized to increase the space utilization rate to three times of the original space, thereby greatly reducing the volume of traditional circuits to 1 / 3 of the original volume.

[0017] The present invention discloses a PCB embedded magnetic ring integrated structure, which adopts low-cost cofferdam encapsulation technology to realize three-dimensional integration of embedded magnetic rings, resistors and capacitors, bare cores and chip devices, and at the same time, encloses a built-in isolated power supply and a gate drive circuit and then performs potting, so as to make it a small-volume microcircuit module.

[0018] The present invention discloses a PCB embedded magnetic ring integrated structure. When the PCB board is processed, a stamp hole semicircular pad is designed as an external pin of the final circuit module, thereby eliminating additional processes such as lead wires and ball planting, streamlining the process flow and reducing the manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a structural schematic diagram of a PCB embedded magnetic ring integrated structure of the present invention; Figure 2 is a principle block diagram of a magnetic ring in an embodiment of the present invention; Figure 3 Schematic diagram of the structure of the stamp hole pad in an embodiment of the present invention.

[0020] Reference numerals: 1- Magnetic ring. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0022] Example 1 The present invention discloses a PCB embedded magnetic ring integrated structure. When the PCB board is manufactured, the magnetic ring 1 is embedded. Resistors, capacitors, bare cores, chips and other components can be welded on the front and back sides of the PCB. The three-dimensional multi-layer space realizes three times the space utilization rate per unit board area, and the volume of the traditional circuit can be reduced to 1 / 3.

[0023] Select a suitable magnetic ring 1 according to the performance requirements of the built-in isolated power gate driver. For applications with higher operating frequencies, select a magnetic ring 1 with high magnetic permeability and low loss to ensure good electromagnetic compatibility and signal transmission quality. Consider parameters such as the size, shape, and inductance of the magnetic ring 1 to ensure that it can meet the requirements of the circuit design.

[0024] During the PCB design phase, the embedded position of the magnetic ring 1 is accurately planned. According to the three-dimensional layout design, ensure that the position relationship between the magnetic ring 1 and other electronic components is reasonable and will not interfere with each other. Place the magnetic ring 1 near the power supply part or the key signal path to maximize its electromagnetic shielding and filtering effects.

[0025] Low-cost cofferdam encapsulation technology is used to embed the magnetic ring 1, the resistor and capacitor, and the bare core chip devices to achieve three-dimensional integration. At the same time, low-cost cofferdam encapsulation technology is used to cofferdam the dual isolation power supply and dual-channel gate driver and then encapsulate them to make it a small-volume microcircuit module.

[0026] Install the prepared cofferdam on the PCB board and then perform the encapsulation operation. Fill the inside of the cofferdam with potting glue to ensure that the internal circuit is completely encapsulated to improve the strength and stability of the encapsulation.

[0027] When processing the PCB board, a stamp hole pad is designed, specifically a semicircular pad as the external pin of the final circuit module, which eliminates additional steps such as lead wires and ball planting, streamlines the process flow and reduces manufacturing costs.

[0028] The use of stamp hole semicircular pads eliminates the need for additional lead balling processes, reducing production costs and process complexity. During the welding process, the microcircuit module can be directly welded to the external circuit through the stamp hole pad, improving production efficiency and welding quality.

[0029] Example 2 like Figure 1 As shown, the magnetic ring 1 is buried in the PCB board. The magnetic ring 1 is a transformer in principle, which converts the input power into isolated power. Specifically, the input power is simultaneously input to two isolated power supplies and the gate driver. Since a bare core is installed at one end of the PCB board, the bare core converts the input power into AC power, and converts the AC power into isolated power. Based on the principle of electromagnetic induction, the voltage of the isolated power is greater than the voltage of the AC power. The isolated power is converted into DC power of the same voltage through a diode and output to the gate driver. The input end of the gate driver is DC power, and the output is DC power.

[0030] During the PCB manufacturing process, the magnetic ring 1 is embedded in the PCB board. A cavity matching the size of the magnetic ring can be opened on the PCB board by laser cutting or mechanical processing, and then the magnetic ring 1 is accurately placed in the cavity and fixed. The stability and reliability of the magnetic ring 1 in the PCB board are ensured to avoid loosening or displacement during subsequent processing and use.

[0031] When the input power is connected to the PCB, the current flows into the magnetic ring 1 through the wires on the PCB. Due to the high magnetic permeability of the magnetic ring, the current generates a strong magnetic field around the magnetic ring. According to the basic principle of the transformer, the voltage ratio is equal to the turns ratio to achieve the required voltage conversion.

[0032] The bare core converts the input power into AC power in the circuit, and usually refers to electronic components such as chips or transistors without packaging, which have the characteristics of small size, high performance, and low cost. In this embodiment, the bare core can convert the input DC power into AC power through the internal circuit structure to provide an input signal for the subsequent magnetic ring 1.

[0033] When the bare core converts the input power into AC power, the AC power passes through the primary winding of the magnetic ring 1 transformer, generating an alternating magnetic field around the magnetic ring. According to the law of electromagnetic induction, this alternating magnetic field will induce an electromotive force in the secondary winding of the transformer, thereby generating isolated power. Due to the isolation effect of the magnetic ring 1, the isolated power output by the secondary winding is completely isolated from the input power supply electrically, realizing the isolation function of the power supply.

[0034] The diode plays a key role in converting isolated electricity into direct current of the same voltage in the circuit. The diode is an electronic component with unidirectional conductivity. When the positive pole of the diode is connected to a high potential and the negative pole is connected to a low potential, the diode is turned on; when the positive pole of the diode is connected to a low potential and the negative pole is connected to a high potential, the diode is cut off. Using this characteristic of the diode, alternating current can be converted into direct current.

[0035] When selecting a diode, you need to consider parameters such as its maximum reverse voltage, maximum forward current, and forward voltage drop. For example, for high-voltage isolation circuits, you need to choose a diode with high reverse withstand voltage; for high-current applications, you need to choose a diode with high forward current. At the same time, you also need to consider the forward voltage drop of the diode, and try to choose a diode with a small forward voltage drop to improve the efficiency of the power supply.

[0036] The input of the gate driver is direct current, which is isolated after diode rectification and filtering. The gate driver's requirements for input direct current include voltage stability, current supply capacity, etc. In order to ensure that the gate driver can work properly, the voltage fluctuation of the input direct current must be within a certain range, usually requiring the voltage fluctuation not to exceed ±5%. At the same time, the input direct current also needs to provide sufficient current for the gate driver to meet its needs to drive power devices.

[0037] The output of the gate driver is direct current, which has the characteristics of high voltage and current driving capability, and can directly drive the gate of the power device. The voltage and current of the output direct current can be adjusted according to the needs of the power device, and can usually be set by an external resistor or potentiometer.

[0038] The gate driver converts the input DC power into a drive signal suitable for the gate of the power device. It is mainly used to provide sufficient voltage and current driving capabilities, achieve fast switching conversion, provide protection functions, etc.

[0039] For example: the input power is 5V and it is a DC power supply, and it is input to two isolated power supplies and the gate driver at the same time. The bare core converts the 5V DC power into 5V AC power, which is converted into 10V AC power through the magnetic ring 1. The diode rectifies it into 10V DC power and outputs it to the gate driver. The input end of the gate driver is 5V DC power, and the output is 5V DC power.

[0040] In this embodiment, the input of the magnetic ring 1 is AC 5V, and the output is AC 10V, so the turns ratio is 1:2. According to the turns ratio, the turns of the primary winding and the secondary winding of the magnetic ring 1 can be calculated.

[0041] The input ends of the gate driver are A channel input, B channel input, DIS enable pin and DT dead time control pin; the output ends are A channel drive voltage high output, A channel drive voltage low output, B channel drive voltage high output and B channel drive voltage low output.

[0042] The DIS enable pin is pulled down or left floating during normal use, and the DT dead time control pin is connected high to allow two-way control at the same time. The DIS enable pin plays a key role in controlling whether the driver as a whole works in the gate driver. During normal use, the pin can be pulled down or left floating to ensure that the driver is in a normal enabled state, can process the input signal and output the corresponding drive voltage. When pulled down, for example, connected to the ground through a resistor of a suitable resistance value (such as about 10kΩ), a clear low-level signal will be given to the logic circuit inside the driver, informing it that it is currently in a normal working enabled state. When left floating, the driver generally assumes that it is in an enabled state, and can also receive and process input signals and output drive voltages normally. When the driver needs to be temporarily stopped, the DIS enable pin can be connected to a high level.

[0043] The DT dead time control pin is mainly used to control the dead time between the two channels (channel A and channel B) at the output of the gate driver. In order to prevent the upper and lower bridge arm power devices of the same phase from being turned on at the same time, causing serious problems such as power short circuit, a certain dead time needs to be set between the two drive signals. When the DT dead time control pin is connected to a high level, the driver allows two channels to be controlled simultaneously, which means that the drive signals of channel A and channel B can be adjusted separately according to the input signal. At the same time, the driver will reasonably set the dead time according to the preset logic or configuration parameters to ensure the safe switching of the upper and lower bridge arm power devices.

[0044] like Figure 2As shown, the upper and lower ends of the PCB board are fixedly connected with welding devices, including chips, bare cores, and resistors and capacitors. The chips and resistors and capacitors are welded on the upper and lower ends of the PCB board, and the bare core is fixedly connected to the PCB board by adhesive or bonding. The chips, bare cores, and resistors and capacitors are connected on one side of the PCB board, and the chips and resistors and capacitors are connected on the other side.

[0045] It should be noted that during the fixing process of the upper and lower end surfaces, it is necessary to avoid overlapping of the pins of the welded components on both sides or too small a spacing in the vertical direction to prevent short circuit problems during the welding process.

[0046] The welding of resistors and capacitors on the upper and lower ends of the PCB board can be done by manual welding or automatic welding. When welding manually, the operator uses an electric soldering iron, preheats the soldering iron tip to the appropriate temperature, and then dips an appropriate amount of solder wire. Place the resistor and capacitor components on the PCB board according to the position of the silk screen mark, touch the component pins and pads with the soldering iron tip to melt the solder wire and form a solder joint between the pins and pads. During the welding process, pay attention to controlling the welding time and the amount of solder to avoid problems such as cold soldering, short circuits or excessive solder joints.

[0047] For mass production or situations where high welding precision is required, automatic welding equipment can be used to weld resistors and capacitors. Automatic welding equipment can quickly and accurately complete the welding of a large number of resistors and capacitors by programming the welding parameters and welding sequence, thereby improving welding efficiency and quality. After welding, the solder joints of the resistors and capacitors must also be carefully checked to ensure that each solder joint meets the quality requirements.

[0048] Finished devices are soldered using surface mount technology (SMT). First, place the PCB on a high-precision placement machine workbench, and use the placement machine's visual recognition system to identify the pad positions on the PCB and the pin positions of the finished devices. Then, the placement machine accurately absorbs the finished devices and aligns the device pins with the corresponding pads on the PCB according to the preset layout position. After soldering is completed, the solder joints are quality checked, using an optical microscope or X-ray inspection equipment to check whether the solder joints are full and whether there are defects such as cold soldering and bridging. For solder joints that do not meet quality requirements, manual re-soldering or rework is performed in a timely manner to ensure the soldering quality of the finished devices and PCB boards.

[0049] After the soldering device is connected to the PCB board, it is encapsulated using a cofferdam, so that the microsystem is transformed from the PCB board into a microcircuit module. The top and bottom surfaces of the cofferdam can be laser engraved and marked.

[0050] Example 3 like Figure 3As shown, stamp hole pads are provided on both sides of the PCB board for electrical connection with the external circuit, wherein the surface plating of the stamp hole pads is nickel-palladium-gold, wherein the thickness of the nickel layer is 3 μm 6μm, the thickness of palladium layer is 0.05μm 0.3μm, the thickness of the gold layer is greater than 0.03μm.

[0051] The nickel-palladium-gold plating of the stamp hole pad not only ensures good solderability, but also improves the stability of signal transmission. The nickel layer as the bottom layer can effectively prevent the oxidation and diffusion of the copper layer, ensuring the electrical performance of the pad is stable. The palladium layer and the gold layer further improve the oxidation resistance and solderability of the pad, reducing the resistance and noise during signal transmission.

[0052] The nickel layer plays an important role in the surface plating of the stamp hole pad. First, it provides good protection for the pad to prevent the diffusion of the underlying copper. In a high temperature environment, copper atoms easily diffuse to the surface of the pad, affecting the welding quality and reliability. The nickel layer can effectively block the diffusion of copper atoms and ensure the stability of the pad.

[0053] Palladium and tin in solder can form good intermetallic compounds, thus improving the quality and reliability of welding. In addition, when the gold layer has tiny pores or wear, the palladium layer can also prevent the underlying metal from being corroded, further enhancing the protection performance of the pad.

[0054] Gold is an inert metal with strong anti-oxidation ability, which can effectively prevent the pad surface from being oxidized in the air, thus ensuring that the solder can quickly and evenly wet the pad surface during the soldering process. In addition, the gold layer can also improve the conductivity and corrosion resistance of the pad.

[0055] As the pins of the microsystem module, the stamp hole pad has the advantage of direct soldering. Compared with the traditional pin-type or surface mount pins, the stamp hole pad does not require additional plug-in or surface mount processes, which simplifies the production process and improves production efficiency. For example, in the assembly process of electronic products, the PCB board with the stamp hole pad can be directly soldered with other electronic components without complicated plug-in or surface mount operations, saving time and labor costs.

[0056] Example 4 A method for integrating a magnetic ring embedded in a PCB includes the following steps: installing a magnetic ring 1 inside a PCB board and fixing it to the PCB board through a fixing column; fixing a welding device on the upper and lower end surfaces of the PCB board; encapsulating the upper and lower end surfaces of the PCB board and fixing the welding device, the magnetic ring 1 and the PCB board through a potting glue. Before installing the magnetic ring 1 inside the PCB board, the method also includes: detecting the inductance of the PCB board.

[0057] Specifically, before installing the magnetic ring, the PCB board is cleaned, and a suitable magnetic ring 1 is selected according to the operating frequency, power requirements and electromagnetic compatibility requirements of the circuit, and the magnetic ring 1 is tested, including parameters such as the inductance, quality factor and DC resistance of the magnetic ring 1. A cavity for the magnetic ring 1 is predetermined on the PCB, the size of which is consistent with the outer contour of the magnetic core 1, and the thickness of the PCB is greater than the thickness of the magnetic core 1. Then, a fixing column is processed, the size of which is consistent with the inner contour of the magnetic core 1, and is placed inside the magnetic core 1. Then, the PCB, the magnetic core 1 and the fixing column are combined and placed at the middle of the thickness of the printed circuit board stack for printed circuit board pressing.

[0058] The welding components are fixedly mounted on the upper and lower end surfaces of the PCB board, and the top and bottom surfaces of the PCB board are encapsulated using a cofferdam encapsulation process, so that the circuit is finally presented in the form of a micromodule. At the same time, laser engraving and marking can be performed on the surface of the encapsulation layer.

[0059] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0060] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

Claims

1. A PCB embedded magnetic ring integrated structure, characterized in that: The invention comprises a PCB board, wherein a magnetic ring (1) is arranged inside the PCB board and is fixedly connected to the PCB board via a fixing column; welding devices are fixedly connected to the upper and lower end surfaces of the PCB board, and the welding devices include a sheet, a bare core, and a resistor and a capacitor; a cofferdam and pins are arranged at the periphery of the PCB board, and the welding device and the magnetic ring (1) are fixedly connected to the PCB board via a potting glue.

2. The PCB embedded magnetic ring integrated structure according to claim 1, characterized in that: Stamp hole pads are arranged on both sides of the PCB board for electrical connection with an external circuit.

3. The PCB embedded magnetic ring integrated structure according to claim 2, characterized in that: The surface coating of the stamp hole pad is nickel-palladium-gold, in which the nickel layer thickness is 3 μm. 6μm, the thickness of palladium layer is 0.05μm 0.3μm, the thickness of the gold layer is greater than 0.03μm.

4. The PCB embedded magnetic ring integrated structure according to claim 1, characterized in that: The chips and resistors and capacitors are welded on the upper and lower end surfaces of the PCB board, and the bare core is fixedly connected to the PCB board by adhesive or bonding.

5. The PCB embedded magnetic ring integrated structure according to claim 4, characterized in that: The magnetic ring (1) converts alternating current into isolated electricity, which acts on the gate driver.

6. The PCB embedded magnetic ring integrated structure according to claim 1, characterized in that: A cavity is provided inside the PCB board for mounting a magnetic ring (1); the cavity is adapted to fit the magnetic ring (1); and a fixing column is provided inside the magnetic ring (1).

7. The PCB embedded magnetic ring integrated structure according to claim 6, characterized in that: The height of the cavity is greater than the height of the magnetic ring (1).

8. The PCB embedded magnetic ring integrated structure according to claim 1, characterized in that: The PCB board is connected to the user end through silicone rubber.

9. A method for integrating a magnetic ring embedded in a PCB, characterized in that: The PCB embedded magnetic ring integrated structure according to any one of claims 1 to 8 comprises the following steps: The magnetic ring (1) is installed inside the PCB board and fixedly connected to the PCB board via a fixing column; Fix the welding components on the upper and lower surfaces of the PCB; The upper and lower end surfaces of the PCB board are encapsulated, and the welding device, the magnetic ring (1) and the PCB board are fixedly connected by potting glue.

10. The method for integrating a magnetic ring embedded in a PCB according to claim 9, characterized in that: Before installing the magnetic ring (1) inside the PCB board, the method further comprises: detecting the inductance of the PCB board.

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