Aerospace printed circuit board layout method, device, equipment and readable storage medium

Abstract

The present application discloses a method, device, equipment and readable storage medium for aerospace printed circuit board imposition, by obtaining the analysis data of the aerospace printed circuit board to be processed and the user imposition instruction, for the circular aerospace printed circuit board to be processed, the center coordinates and radius of the aerospace printed circuit board to be processed are determined, and the imposition layout arranged in an equilateral triangle matrix is ​​obtained in combination with the user imposition instruction, and the final imposition model is obtained by adding holes and silk screen on the imposition layout. The present application obtains the imposition model in the above manner, which can improve the efficiency to a certain extent and reduce the errors caused by manual imposition of the aerospace printed circuit board compared to the manual imposition processing of the aerospace printed circuit board. At the same time, for the circular aerospace printed circuit board to be processed, by analyzing the aerospace printed circuit board to be processed and the user imposition instruction, a more compact equilateral triangle matrix imposition method is adopted, which can improve the utilization rate of the material to a certain extent compared to the original upper and lower regular arrangement method.

Description

Technical Field

[0001] The present application relates to the field of electronic manufacturing technology, and in particular to a method, device, equipment and readable storage medium for aerospace printed circuit board assembly. Background Art

[0002] Aerospace is one of the most challenging and widely driven high-tech fields in the world today. Space activities have profoundly changed human cognition of the universe and provided an important driving force for the progress of human society. The development of the aerospace industry is inseparable from the research and development and design of spacecraft. Every electronic device in a spacecraft requires a printed circuit board to provide electrical connections for its electronic components. At present, after engineers complete the design of printed circuit boards, they need to manually produce production materials for platemaking. Not only is the work efficiency low, but it is also prone to errors, resulting in reduced production efficiency and quality of aerospace printed circuit boards. Therefore, how to better plate aerospace printed circuit boards and improve production efficiency and quality has always been a concern for people. Summary of the invention

[0003] In view of this, the present application provides a method, device, equipment and readable storage medium for aerospace printed circuit boards, so as to improve the production efficiency and quality of aerospace printed circuit boards to a certain extent.

[0004] In order to achieve the above objectives, the proposed solution is as follows:

[0005] A method for assembling a space printed circuit board, comprising:

[0006] Obtain analysis data and user layout instructions for aerospace printed circuit boards to be processed;

[0007] Based on the analysis data, determining the number of layers of the printed circuit board to be processed and the positive and negative properties of each inner layer;

[0008] Based on the analysis data, determining whether the shape of the aerospace printed circuit board to be processed is circular;

[0009] If yes, then determine the center coordinates and radius r of the aerospace printed circuit board to be processed;

[0010] According to the user's imposition instruction, determine the number of impositions m in the X direction, the number of impositions n in the Y direction and the distance between the panels k;

[0011] According to the number of panels m in the X direction, the number of panels n in the Y direction, the center coordinates, the radius r and the board spacing k, a panel layout is obtained, wherein each odd row in the Y direction contains m aerospace printed circuit boards to be processed whose centers are located on the same straight line, each even row contains m-1 aerospace printed circuit boards to be processed whose centers are located on the same straight line, the center distance between adjacent aerospace printed circuit boards to be processed in each row is 2r+k, the center lines of the aerospace printed circuit boards to be processed in each row are parallel to the X direction, and the center of each aerospace printed circuit board to be processed on the even row is only 2r+k away from the centers of the two aerospace printed circuit boards to be processed on the adjacent odd rows;

[0012] Based on the coordinates of the center of each aerospace printed circuit board to be processed in the layout, a regular hexagonal wireframe is added as a gold-plated corner wireframe around the periphery of each aerospace printed circuit board to be processed, and the distance from the center of each aerospace printed circuit board to be processed to each side of the corresponding gold-plated corner wireframe is r+k / 2, and each gold-plated corner wireframe has two sides parallel to the Y direction;

[0013] Based on the gold-plated corner wire frame and the analysis data, a plurality of graphic gold-plated process wires are added for each aerospace printed circuit board to be processed in the imposition layout, wherein one end of the graphic gold-plated process wire is connected to the gold-plated corner wire frame, and the other end is connected to the wire of the aerospace printed circuit board to be processed;

[0014] Based on the position of each gold-plated corner line in the imposition layout, a gold-plated wire frame is added around the imposition layout, and the gold-plated wire frame is connected to the outer boundary vertices and sides of the gold-plated corner line frame in the imposition layout;

[0015] According to the user layout instructions and the preset hole adding requirements, add the coupon cutting holes, target positioning holes, inner layer positioning holes, sun exposure positioning holes and gold plating hanger holes to the layout;

[0016] According to the user imposition instruction and the preset silk-screen addition requirements, the system time, unit and drawing number are added to the imposition layout;

[0017] According to preset instructions, adding an attachment plate, a target plate and a gold-plated plate to the imposition layout, wherein the gold-plated plate is connected to the gold-plated wire and the gold-plated hanger hole respectively;

[0018] For the coupon plate and the target plate, adding corresponding coupon plate gold-plated wires and target plate gold-plated wires on the imposition layout;

[0019] Based on the imposition layout, calculating the number of aerospace printed circuit boards to be processed;

[0020] Based on the positive and negative properties of each inner layer, the electroplating area of ​​each layer is calculated;

[0021] From the printed circuit board to be processed, according to the preset process edge adding requirements, corresponding process edges are added around the layout of the imposition, and the imposition size is determined;

[0022] Determine the blanking size according to the number of layers;

[0023] According to the preset silk-screen addition requirements, the number of the aerospace printed circuit boards to be processed, the panel size, the blanking size and the identification of the electroplating area are added to the panel layout to obtain a final panel model.

[0024] Optionally, obtaining the panel layout according to the number of panels m in the X direction, the number of panels n in the Y direction, the coordinates of the center of the circle, the radius r and the panel spacing k includes:

[0025] According to the number of panels n in the Y direction, determine whether there is an odd number of rows;

[0026] If it exists, then create an odd-numbered row panel according to the number of panels m in the X direction, the center coordinates, the radius r and the board spacing k, each odd-numbered row panel contains m aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is located on the same straight line and parallel to the X direction, and the distance between adjacent aerospace printed circuit boards to be processed is 2r+k. At the same time, the center of each aerospace printed circuit board to be processed on the odd-numbered row panel is only 2×(2r+k)sin60° away from the center of one aerospace printed circuit board to be processed on the adjacent odd row;

[0027] According to the number of panels n in the Y direction, determine whether there is an even number of rows;

[0028] If it exists, then create an even-numbered row panel according to the number of panels m in the X direction, the center coordinates, the radius r and the board spacing k, each even-numbered row panel contains m-1 aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is located on the same straight line and parallel to the X direction, and the distance between adjacent aerospace printed circuit boards to be processed is 2r+k. At the same time, the center of each aerospace printed circuit board to be processed on the even-numbered row is 2r+k away from the center of the two aerospace printed circuit boards to be processed on the adjacent odd-numbered rows;

[0029] Based on the odd-numbered row imposition and the even-numbered row imposition, an imposition layout is obtained.

[0030] Optionally, creating an odd-row panel according to the number of panels m in the X direction, the coordinates of the center of the circle, the radius r, and the panel spacing k includes:

[0031] According to the number of panels m in the X direction, the center coordinates, the radius r and the board spacing k, under the condition that each odd-numbered row panel contains m aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is located on the same straight line and parallel to the X direction, the distance between adjacent aerospace printed circuit boards to be processed is 2r+k, and at the same time, the center of each aerospace printed circuit board to be processed on the odd-numbered row panel is only 2×(2r+k)sin60° away from the center of one aerospace printed circuit board to be processed on the adjacent odd-numbered row, the center coordinates of each aerospace printed circuit board to be processed in each odd-numbered row panel are calculated;

[0032] Based on the calculated coordinates of the centers of each circle, the aerospace printed circuit board to be processed is created to obtain an odd-numbered row layout.

[0033] Optionally, obtaining the panel layout according to the number of panels m in the X direction, the number of panels n in the Y direction, the coordinates of the center of the circle, the radius r and the panel spacing k includes:

[0034] According to the number of panels m in the X direction, the center coordinates, the radius r and the board spacing k, a first reference plate is created, wherein the first reference plate contains m aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is on the first straight line, and the distance between the centers of adjacent aerospace printed circuit boards to be processed is 2r+k;

[0035] Determine whether the number of panels in the Y direction is greater than or equal to 2;

[0036] If the number of panels in the Y direction is greater than or equal to 2, a second reference plate is created according to the number of panels in the Y direction n, the radius r and the plate spacing k, wherein the second reference plate contains m-1 aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is on the second straight line, and the distance between the centers of adjacent aerospace printed circuit boards to be processed is 2r+k;

[0037] Based on the number of panels in the Y direction, the first reference plates are used in odd rows and the second reference plates are used in even rows, and they are combined alternately in parallel to create a panel layout.

[0038] Optionally, the actual electroplating area of ​​each layer is calculated based on the positive and negative properties of each inner layer, including:

[0039] Determine the parameters of the electroplating edge and the debonding strip based on the positive and negative properties of each inner layer;

[0040] Based on the parameters of the plating edge and the strip, the actual plating area of ​​each layer is calculated.

[0041] Optionally, also include:

[0042] Based on the final layout model, determine the drilling layer;

[0043] By comparing the types and positions of the boreholes in the borehole layer, the boreholes with the same type and position are screened out, and one of the boreholes is retained.

[0044] Optionally, also include:

[0045] According to the pre-set limiting conditions and in combination with the analysis data, compliance testing is performed on the aerospace printed circuit board to be processed, and a compliance testing report is generated;

[0046] According to the preset silk screen addition requirements, the number of the aerospace printed circuit boards to be processed, the panel size, the blanking size and the identification of the electroplating area are added to obtain the final panel model, including:

[0047] According to the preset silk-screen addition requirements, the number of the aerospace printed circuit boards to be processed, the panel size, the blanking size and the identification of the electroplating area are added to obtain the final panel model and compliance test report.

[0048] A space printed circuit board assembly device, comprising:

[0049] A data acquisition module is used to acquire analysis data of the aerospace printed circuit board to be processed and user imposition instructions;

[0050] A data analysis module, used to determine the number of layers of the printed circuit board to be processed and the positive and negative properties of each inner layer based on the analysis data;

[0051] A shape judgment module, used to judge whether the shape of the aerospace printed circuit board to be processed is circular based on the analysis data; if so, determine the center coordinates and radius r of the aerospace printed circuit board to be processed;

[0052] An instruction processing module, used for determining the number of panels m in the X direction, the number of panels n in the Y direction and the panel spacing k according to the user panel instruction;

[0053] An initial panelization module is used to obtain a panelization layout according to the number of panels m in the X direction, the number of panels n in the Y direction, the center coordinates, the radius r and the board spacing k, wherein each odd-numbered row in the Y direction contains m aerospace printed circuit boards to be processed whose centers are located on the same straight line, and each even-numbered row contains m-1 aerospace printed circuit boards to be processed whose centers are located on the same straight line, and the distance between the centers of adjacent aerospace printed circuit boards to be processed in each row is 2r+k, and the center lines of the aerospace printed circuit boards to be processed in each row are parallel to the X direction, and the center of each aerospace printed circuit board to be processed on the even-numbered row is only 2r+k away from the centers of the two aerospace printed circuit boards to be processed on the adjacent odd-numbered rows;

[0054] A gold-plated corner line adding module is used to add a regular hexagonal wireframe as a gold-plated corner line frame on the periphery of each aerospace printed circuit board to be processed based on the center coordinates of each aerospace printed circuit board to be processed in the imposition layout, wherein the distance from the center of each aerospace printed circuit board to be processed to each side of the corresponding gold-plated corner line frame is r+k / 2, and each gold-plated corner line frame has two sides parallel to the Y direction;

[0055] A gold-plated process wire adding module is used to add a plurality of graphic gold-plated process wires for each aerospace printed circuit board to be processed in the imposition layout based on the gold-plated corner wire frame and the analysis data, wherein one end of the graphic gold-plated process wire is connected to the gold-plated corner wire frame, and the other end is connected to the wire of the aerospace printed circuit board to be processed;

[0056] A gold-plated wire adding module, used for adding a gold-plated wire frame around the imposition layout based on the position of each gold-plated corner line in the imposition layout, wherein the gold-plated wire frame is connected to the outer boundary vertices and sides of the gold-plated corner line frame in the imposition layout;

[0057] A hole position adding module is used to add coupon cutting holes, target positioning holes, inner layer positioning holes, sun exposure positioning holes and gold plating hanger holes to the layout of the layout according to the user layout instruction and the preset hole position adding requirements;

[0058] A logo adding module, used for adding logos of system time, unit and drawing number on the layout of the layout according to the layout instruction of the user and the preset silk screen adding requirements;

[0059] A pad adding module, used for adding a bonding pad, a target pad and a gold-plated pad to the imposition layout according to a preset instruction, wherein the gold-plated pad is connected to the gold-plated wire and the gold-plated hanger hole respectively;

[0060] A gold-plated wire adding module, for adding corresponding gold-plated wires of the coupon plate and the target plate on the layout of the imposition plate;

[0061] A circuit board quantity calculation module, used for calculating the quantity of aerospace printed circuit boards to be processed based on the imposition layout;

[0062] An electroplating area calculation module, used to calculate the electroplating area of ​​each layer based on the positive and negative properties of each inner layer;

[0063] A process edge adding module is used to add corresponding process edges around the imposition layout from the printed circuit board to be processed according to the preset process edge adding requirements, and determine the imposition size;

[0064] A blanking size determination module, used to determine the blanking size according to the number of layers;

[0065] The final panel determination module is used to add the number of the aerospace printed circuit boards to be processed, the panel size, the blanking size and the electroplating area identification on the panel layout according to the preset silk screen addition requirements to obtain the final panel model.

[0066] An aerospace printed circuit board assembly device, comprising: a memory and a processor;

[0067] The memory is used to store programs;

[0068] The processor is used to execute the program to implement each step of the aerospace printed circuit board platemaking method as described in any of the above items.

[0069] A readable storage medium stores a computer program, which, when executed by a processor, implements each step of any of the aforementioned aerospace printed circuit board platemaking methods.

[0070] It can be seen from the above technical scheme that the embodiment of the present application provides a method, device, equipment and readable storage medium for aerospace printed circuit board imposition, which obtains the analysis data and user imposition instructions of the aerospace printed circuit board to be processed; based on the analysis data, determines the number of layers of the aerospace printed circuit board to be processed and the positive and negative attributes of each inner layer; based on the analysis data, determines whether the shape of the aerospace printed circuit board to be processed is circular; if so, determines the center coordinates and radius r of the aerospace printed circuit board to be processed; according to the user imposition instructions, determines the number of impositions m in the X direction, the number of impositions n in the Y direction and the board spacing k; according to the number of impositions m in the X direction, the number of impositions n in the Y direction, the center coordinates, the radius r and The board spacing k is obtained to obtain a layout, in which each odd-numbered row in the Y direction contains m aerospace printed circuit boards to be processed whose centers are located on the same straight line, and each even-numbered row contains m-1 aerospace printed circuit boards to be processed whose centers are located on the same straight line, and the distance between the centers of adjacent aerospace printed circuit boards to be processed in each row is 2r+k, and the center lines of the aerospace printed circuit boards to be processed in each row are parallel to the X direction, and the center of each aerospace printed circuit board to be processed on the even-numbered row is only 2r+k away from the centers of the two aerospace printed circuit boards to be processed on the adjacent odd-numbered rows; based on the center coordinates of each aerospace printed circuit board to be processed in the layout, a regular hexagonal line is added to the periphery of each aerospace printed circuit board to be processed. The frame is used as a gold-plated corner line frame, and the distance from the center of each aerospace printed circuit board to be processed to each side of the corresponding gold-plated corner line frame is r+k / 2, and each gold-plated corner line frame has two sides parallel to the Y direction; based on the gold-plated corner line frame and the analysis data, a number of graphic gold-plated process wires are added for each aerospace printed circuit board to be processed in the imposition layout, one end of the graphic gold-plated process wire is connected to the gold-plated corner line frame, and the other end is connected to the wire of the aerospace printed circuit board to be processed; based on the position of each gold-plated corner line in the imposition layout, a gold-plated wire frame is added around the imposition layout, and the gold-plated wire frame is connected to the outer boundary vertices and sides of the gold-plated corner line frame in the imposition layout; according to the user imposition instruction, the holes to be processed are added according to the preset hole positions. According to the requirements, add the attachment plate cutting hole, target positioning hole, inner layer positioning hole, exposure positioning hole and gold-plated hanger hole; according to the user imposition instruction, according to the preset silk screen adding requirements, add the system time, unit and drawing number identification; according to the preset instructions, add the attachment plate, target plate and gold-plated plate, and the gold-plated plate is connected with the gold-plated wire and the gold-plated hanger hole respectively; for the attachment plate and target plate, add the corresponding attachment plate gold-plated wire and target plate gold-plated wire; based on the imposition layout, calculate the number of aerospace printed circuit boards to be processed; based on the positive and negative properties of each inner layer, calculate the electroplating area of ​​each layer; from the printed circuit board to be processed, according to the preset process edge adding requirements and the gold-plated plate, add the corresponding process edge and determine the imposition size;According to the number of layers, the blanking size is determined; according to the preset silk screen addition requirements, the number of the aerospace printed circuit boards to be processed, the panel size, the blanking size and the identification of the electroplating area are added to obtain the final panel model. The present application obtains the panel model in the above manner, which can improve efficiency to a certain extent and reduce errors caused by manual processing of aerospace printed circuit boards compared to manual panel processing of aerospace printed circuit boards. At the same time, for the circular aerospace printed circuit boards to be processed, by analyzing the aerospace printed circuit boards to be processed and the user panel instructions, a more compact equilateral triangle matrix panel method is adopted, which can improve the utilization rate of materials to a certain extent compared to the original upper and lower regular arrangement method. ; BRIEF DESCRIPTION OF THE DRAWINGS

[0071] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0072] Figure 1 A flow chart of a method for assembling a space printed circuit board provided in an embodiment of the present application;

[0073] Figure 2 A layout diagram of a layout provided in an embodiment of the present application;

[0074] Figure 3 It is a traditional regular matrix layout diagram;

[0075] Figure 4 A schematic diagram of a layout sequence provided in an embodiment of the present application;

[0076] Figure 5 A schematic diagram of a method for determining a layout position provided in an embodiment of the present application;

[0077] Figure 6 A schematic diagram of the structure of an aerospace printed circuit board assembly device provided in an embodiment of the present application;

[0078] Figure 7 A hardware structure block diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0079] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0080] Figure 1 A flow chart of a method for assembling a printed circuit board for aerospace provided in an embodiment of the present application, the method may include the following steps:

[0081] Step S100, obtaining analysis data of the aerospace printed circuit board to be processed and user imposition instructions.

[0082] Specifically, the analysis data of the above-mentioned aerospace printed circuit board to be processed can be obtained through the CAM350 software, and the properties of the corresponding layer can be defined in CAM350 according to the specific data of each layer. For example: the top layer is defined as top; the bottom layer is defined as bottom; the top solder mask layer is defined as mask top; the bottom solder mask layer is defined as mask bottom; the top character layer is defined as silk top; the bottom character layer is defined as silk bottom; the machined layer is defined as Temporary; and the drilling layer is defined as NC Primary. Among them, the positioning holes and other hole positions added in the embodiment of the present application need to be added to the drilling layer, and the added silk-screen content needs to be added to the top character layer or the bottom character layer, which is determined by the actual effect to be displayed.

[0083] The above-mentioned user layout instructions may include the user-input unit, drawing number, number of layouts in the X direction, number of layouts in the Y direction, layout spacing, plate thickness, punching holes, attached plates, aperture enlargement numerical options, technician name, minimum line width D code size, minimum line width layer, minimum aperture, original size (length), original size (width), etc. Among them, the minimum line width D code size, minimum line width layer, minimum aperture, original size (length), original size (width) can be set as data detection items, and the relevant attribute values ​​​​performed in the software are automatically extracted according to relevant commands, which is convenient for users to check and layout planning.

[0084] According to actual use requirements, variables can be pre-defined and initially assigned values. User imposition instructions can be obtained from users in the form of a pop-up dialog box, and the required content is listed in the dialog box for users to fill in or select.

[0085] Step S101: based on the analysis data, determine the number of layers of the printed circuit board to be processed and the positive and negative properties of each inner layer.

[0086] Specifically, by analyzing the inner layer of the aerospace printed circuit board to be processed, the number of layers of the aerospace printed circuit board to be processed can be obtained. The inner layer attributes are analyzed to determine whether the inner layer is a positive film or a negative film, and then the positive and negative attributes of each inner layer are assigned. By analyzing the inner layer, the number of layers of the printed circuit board to be processed can be obtained.

[0087] Step S102: Based on the analysis data, determine whether the shape of the aerospace printed circuit board to be processed is circular.

[0088] Specifically, if the shape of the aerospace printed circuit board to be processed is , step S103 is executed.

[0089] Step S103, determining the center coordinates and radius r of the aerospace printed circuit board to be processed.

[0090] Step S104: Determine the number of panels m in the X direction, the number of panels n in the Y direction, and the panel spacing k according to the user's panelization instruction.

[0091] Specifically, the number of panels m in the X direction, the number of panels n in the Y direction, and the panel spacing k can be obtained from the panel instructions input in advance by the user. The number of panels is selected according to actual needs, and the panel spacing can be set in combination with industry operating specifications and actual conditions.

[0092] Step S105 , obtaining a panel layout according to the number of panels m in the X direction, the number of panels n in the Y direction, the coordinates of the center of the circle, the radius r and the panel spacing k.

[0093] Specifically, in the panel layout, each odd-numbered row in the Y direction contains m aerospace printed circuit boards to be processed whose centers are located on the same straight line, and each even-numbered row contains m-1 aerospace printed circuit boards to be processed whose centers are located on the same straight line. The distance between the centers of adjacent aerospace printed circuit boards to be processed in each row is 2r+k, and the lines connecting the centers of the aerospace printed circuit boards to be processed in each row are parallel to the X direction. The center of each aerospace printed circuit board to be processed on the even-numbered row is only 2r+k away from the centers of the two aerospace printed circuit boards to be processed on the adjacent odd-numbered rows.

[0094] refer to Figure 2 As shown, Figure 2 A layout diagram of a panel is provided in an embodiment of the present application. The number of panels in the X direction is 5, and the number of panels in the Y direction is 5. The layout of the panel contains five rows, including three odd rows and two even rows. Each odd row contains five aerospace printed circuit boards to be processed, and each even row contains four aerospace printed circuit boards to be processed. The center of an aerospace printed circuit board to be processed in an even row is only 2r+k away from the center of two aerospace printed circuit boards to be processed in an odd row, that is, the three centers form an equilateral triangle. Compared with Figure 3The regular matrix arrangement in a traditional regular matrix layout diagram and the triangular matrix arrangement proposed in the embodiment of the present application can improve the utilization rate of the board material to a certain extent.

[0095] Step S106: Based on the center coordinates of each aerospace printed circuit board to be processed in the imposition layout, a regular hexagonal wireframe is added as a gold-plated corner wireframe around the periphery of each aerospace printed circuit board to be processed.

[0096] Specifically, the gold-plated corner line can be added by using the point coordinates and the first and last coordinates of the added line, and the corresponding line D code. The width can be a solid line of 0.3mm. The distance from the center of each aerospace printed circuit board to be processed to each side of the corresponding gold-plated corner line frame is r+k / 2, and each gold-plated corner line frame has two sides parallel to the Y direction. The role of the gold-plated corner line can easily judge the actual effective area of ​​the printed circuit board, in order to provide a current conduction channel for the gold plating of the microwave printed circuit board.

[0097] Step S107: Based on the gold-plated corner wire frame and the analysis data, a number of graphic gold-plated process wires are added for each aerospace printed circuit board to be processed in the imposition layout.

[0098] Specifically, one end of the graphic gold-plated process wire is connected to the gold-plated corner wire frame, and the other end is connected to the wire of the aerospace printed circuit board to be processed, thereby establishing a connection between the gold-plated corner wire and the aerospace printed circuit board to be processed, providing a current conduction channel. The graphic gold-plated process wire can provide a gold-plated channel for the aerospace printed circuit board to be processed during the gold-plating process, so the process wire in the graphic can be directly connected to the gold-plated corner wire, and editing the process wire can quickly respond to all the layouts to achieve full interconnection of the gold-plated areas, which can effectively improve the efficiency of engineering pre-processing.

[0099] Step S108: based on the positions of the gold-plated corner lines in the layout, add a gold-plated wire frame around the layout.

[0100] Specifically, in order to facilitate gold plating, 0.5mm lines are used in the plate layout to form a gold-plated wire frame for conducting current. The gold-plated wire frame is connected to the outer vertices and sides of the regular hexagonal gold-plated corner wire frame, and is connected to the process edge, so that the gold-plated corner wire, gold-plated wire, and process edge are connected, providing a conductive path for product gold plating.

[0101] Step S109: according to the user's layout instructions and the preset hole position adding requirements, add the coupon cutting holes, target positioning holes, inner layer positioning holes, drying positioning holes and gold plating hanger holes to the layout.

[0102] Specifically, in the layout of the panel, according to the preset hole position addition requirements, after adding the coupon cut hole, target positioning hole, inner layer positioning hole, sun exposure positioning hole and gold-plated hanger hole in the drilling layer, all the drill holes can be arranged in the order of aperture size from small to large on the left side of the panel. Only one drill hole of the same size aperture is selected, where the step value between the disks is 4mm, and the disk diameter variable is set to be 1mm larger than the aperture of the class hole. At the same time, for the convenience of inspection, the aperture size can be added above each class hole as a label, and the character used for the label is to create a new character D code through the D code table.

[0103] Among them, the gold-plated hanger holes can be set on the left and right sides of the middle of the layout, and the positioning holes can be distributed on the outside of the corner line. They can be set in the middle position of the upper left, lower left, upper right and lower right of the layout. The number is generally required to be 4 to 6 groups, which are pre-set according to actual needs. Each group of positioning holes consists of 1 sun-drying positioning hole with a diameter of 2.55mm and 2 silk-screen positioning holes with a diameter of 1.2mm. In order to improve the utilization rate of the board, the 2.55 positioning hole position is moved inward to the gold-plated wire frame and the outside of the gold-plated corner line. The attachment plate cutting holes can be set to 2 groups, and the distribution position can be the middle of the right side of the layout diagram. The coordinates of the attachment plate cutting holes can be determined by assignment and calculation. The attachment hole diameter is the minimum aperture on the microwave board software. The attachment hole and the attachment disk constitute the attachment plate for the cutting test, and the cutting direction line diameter can be assigned to 0.2mm.

[0104] Step S110: according to the user's imposition instruction and the preset silk-screen adding requirement, the system time, unit and drawing number are added to the imposition layout.

[0105] Specifically, the system time, unit and drawing number can be marked on the pre-selected layer in the imposition model by adding character commands and coordinating with spatial coordinates. At the same time, corresponding parameter changes can be made for different character layers. Among them, the pre-selected layers can be the top character layer and the bottom character layer. Depending on the different layers, it can be determined whether the characters are mirrored. For example, when adding a mark to the bottom character layer, all mirroring can be performed; when marking the inner layer, it is necessary to further judge the specific properties of the inner layer.

[0106] Step S111: according to the preset instructions, add the attached plate, target plate and gold-plated plate to the imposition layout.

[0107] Specifically, by adding a target D code at the spatial coordinate position, based on the target D code, a gold-plated disk, an attachment plate, a target disk, a silk-screen alignment disk, a spare positioning system disk, and an inner layer alignment target disk are added to the imposition model. Among them, the gold-plated disk is connected to the gold-plated wire and the gold-plated hanger hole respectively. In order to facilitate gold plating, a gold-plated disk for contacting the fixture and the hanger with gold plating can be added on the front and back sides of the gold-plated hanger hole, and its D code size can be set to a rectangle with a length of 15 mm and a width of 4 mm.

[0108] Step S112: For the coupon plate and the target plate, corresponding coupon plate gold-plated lines and target plate gold-plated lines are added to the layout of the imposition.

[0109] Step S113: Calculate the number of aerospace printed circuit boards to be processed based on the panel layout.

[0110] Specifically, the odd and even rows can be determined by the number of panels in the Y direction in the panel layout. The number of aerospace printed circuit boards to be processed in each odd-numbered panel is the same as the number of panels in the X direction, and the number of aerospace printed circuit boards to be processed in each even-numbered panel is the number of panels in the X direction minus 1, and the number of aerospace printed circuit boards to be processed can be calculated. For example, if the number of panels in the Y direction is 5, there are three odd rows and two even rows, and the number of aerospace printed circuit boards to be processed is 3×5+2×(5-1)=23.

[0111] Step S114: Based on the positive and negative properties of each inner layer, the electroplating area of ​​each layer is calculated.

[0112] Step S115: From the printed circuit board to be processed, according to the preset process edge adding requirements, add corresponding process edges around the imposition layout to determine the imposition size.

[0113] Specifically, according to the pre-set process edge adding requirements, the top layer and the bottom layer can be set to add solid filling process edges, and the remaining inner layers are dot matrix graphic process edges. In order to ensure that no residual film will remain on the edge of the board when the graphic is transferred, the edge of the board must be covered. At the same time, in order to save board materials, the process edge cannot be too far away from the aerospace printed circuit board to be processed. Therefore, the layout distance of the process edge can be started from 3mm away from the gold-plated corner line. The width of the process edge can be 30mm. The gold-plated disk is located on the process edge, so that the gold-plated disk on the process edge is connected to the gold-plated wire.

[0114] Step S116: Determine the material size according to the number of layers.

[0115] Specifically, for each number of layers, combined with the actual processing method, optional cutting sizes can be obtained. For example, there may be multi-layer boards with more than 6 layers. Due to the limitation of the processing mold, the output cutting sizes are only "360mmx310mm" and "460mmx410mm". At this time, you can only choose from them.

[0116] Step S117, according to the preset silk screen addition requirements, add the number of aerospace printed circuit boards to be processed, the panel size, the blanking size and the electroplating area identification on the panel layout to obtain the final panel model.

[0117] Specifically, by marking the number, panel size, blanking size and electroplating area of ​​the aerospace printed circuit boards to be processed on the board surface, the above data can be easily checked and confirmed. In order to avoid unnecessary copper dissolution during gold plating, the above mark is added to the board surface and intersects with the gold-plated wire. The above panel model contains the processing data of each layer such as the final panel layout, drilling layer, character layer, etc., so that the printed circuit board can be manufactured according to the data during subsequent processing.

[0118] It can be seen from the above technical scheme that an aerospace printed circuit board panelization method provided in an embodiment of the present application obtains analysis data and user panelization instructions of the aerospace printed circuit board to be processed; based on the analysis data, determines the number of layers of the printed circuit board to be processed and the positive and negative attributes of each inner layer; based on the analysis data, determines whether the shape of the aerospace printed circuit board to be processed is circular; if so, determines the center coordinates and radius r of the aerospace printed circuit board to be processed; according to the user panelization instructions, determines the number of panels m in the X direction, the number of panels n in the Y direction, and the board spacing k; according to the number of panels m in the X direction, the number of panels n in the Y direction, the center coordinates, the radius r, and the board spacing k, obtains the panelization layout, In the above-mentioned layout, each odd-numbered row in the Y direction contains m aerospace printed circuit boards to be processed whose centers are located on the same straight line, and each even-numbered row contains m-1 aerospace printed circuit boards to be processed whose centers are located on the same straight line. The distance between the centers of adjacent aerospace printed circuit boards to be processed in each row is 2r+k. The center lines of the aerospace printed circuit boards to be processed in each row are parallel to the X direction. The center of each aerospace printed circuit board to be processed on the even-numbered row is only 2r+k away from the centers of the two aerospace printed circuit boards to be processed on the adjacent odd-numbered rows. Based on the center coordinates of each aerospace printed circuit board to be processed in the above-mentioned layout, a regular hexagonal wireframe is added as a gold-plated corner wireframe on the periphery of each aerospace printed circuit board to be processed. The distance from the center of the aerospace printed circuit board to each side of the corresponding gold-plated corner wire frame is r+k / 2, and each gold-plated corner wire frame has two sides parallel to the Y direction; based on the gold-plated corner wire frame and the analysis data, a number of graphic gold-plated process wires are added for each aerospace printed circuit board to be processed in the imposition layout, one end of the graphic gold-plated process wire is connected to the gold-plated corner wire frame, and the other end is connected to the wire of the aerospace printed circuit board to be processed; based on the position of each gold-plated corner wire in the imposition layout, a gold-plated wire frame is added around the imposition layout, and the gold-plated wire frame is connected to the outer boundary vertices and sides of the gold-plated corner wire frame in the imposition layout; according to the user imposition instruction, according to the preset hole position addition requirements, add the attachment board cutting holes, targets Positioning holes, inner layer positioning holes, exposure positioning holes and gold-plated hanger holes; according to the user's imposition instructions, according to the preset silk screen addition requirements, add the system time, unit and drawing number identification; according to the preset instructions, add the attachment plate, target plate and gold-plated plate, and the gold-plated plate is connected with the gold-plated wire and the gold-plated hanger hole respectively; for the attachment plate and target plate, add the corresponding attachment plate gold-plated wire and target plate gold-plated wire; based on the imposition layout, calculate the number of aerospace printed circuit boards to be processed; based on the positive and negative properties of each inner layer, calculate the electroplating area of ​​each layer; from the printed circuit board to be processed, according to the preset process edge addition requirements and the gold-plated plate, add the corresponding process edge and determine the imposition size; according to the number of layers, determine the blanking size;According to the preset silk-screen addition requirements, add the number of the aerospace printed circuit boards to be processed, the panel size, the blanking size and the identification of the electroplating area to obtain the final panel model. The present application obtains the panel model in the above manner, which can improve efficiency to a certain extent and reduce errors caused by manual panel processing of aerospace printed circuit boards. At the same time, for the circular aerospace printed circuit boards to be processed, by analyzing the aerospace printed circuit boards to be processed and the user panel instructions, a more compact equilateral triangle matrix panel method is adopted, which can improve the utilization rate of materials to a certain extent compared with the original upper and lower regular arrangement method. ;

[0119] In some embodiments of the present application, according to the method of claim 1, a panel layout is obtained according to the number of panels m in the X direction, the number of panels n in the Y direction, the coordinates of the center of the circle, the radius r and the panel spacing k. There are multiple ways to obtain the panel layout, and two of the implementation methods are illustrated below.

[0120] The first implementation method may include the following steps:

[0121] S11. According to the number of panels n in the Y direction, determine whether there is an odd number of panels.

[0122] Specifically, if it exists, execute step S12.

[0123] S12. Create an odd-numbered row of panels according to the number of panels m, the coordinates of the center of the circle, the radius r, and the panel spacing k in the X direction.

[0124] Specifically, assuming that the number of panels in the X direction is 5 and the number of panels in the Y direction is 5, there are 3 odd rows, namely rows 1, 3, and 5, and 2 even rows, namely rows 2 and 4. Figure 4 As shown, Figure 4 A schematic diagram of a panelization sequence is provided for an embodiment of the present application. Position 1 may be the initially acquired aerospace printed circuit board to be processed. Taking the aerospace printed circuit board to be processed at position 1 as a reference, the first row is first created along the X direction, and then other odd rows are created in sequence based on position 1.

[0125] Finally, it can be obtained that 3 odd-numbered rows of the panelization contain 5 aerospace printed circuit boards to be processed, namely positions 1-15; the center of each aerospace printed circuit board to be processed in each odd-numbered row panelization is located on the same straight line and parallel to the X direction, that is, the center of the aerospace printed circuit boards to be processed at positions 1-5 is located on the same straight line, the center of the aerospace printed circuit boards to be processed at positions 6-10 is located on the same straight line, and the center of the aerospace printed circuit boards to be processed at positions 11-15 is located on the same straight line, and the three straight lines are parallel to the X direction; and the distance between adjacent aerospace printed circuit boards to be processed is 2r+k, that is, positions 1 and 2, 2 and 3, ..., 8 and 9, .. ., 11 and 12, ..., 14 and 15 are all at a distance of 2r+k; the center of each aerospace printed circuit board to be processed on the odd-numbered row panel is only at a distance of 2×(2r+k)sin60° from the center of an aerospace printed circuit board to be processed on the adjacent odd-numbered row, that is, the center of the aerospace printed circuit board to be processed at position 6 of the second row is only at a distance of 2×(2r+k)sin60° from the center of the aerospace printed circuit board to be processed at position 1 of the adjacent first row, and the center of the aerospace printed circuit board to be processed at position 6 of the second row is only at a distance of 2×(2r+k)sin60° from the center of the aerospace printed circuit board to be processed at position 11 of the adjacent second row.

[0126] S13. According to the number of panels n in the Y direction, determine whether there is an even-numbered panel row.

[0127] Specifically, if it exists, execute step S14.

[0128] S14. Create an even-numbered row layout according to the layout quantity m, the center coordinates, the radius r and the board spacing k in the X direction.

[0129] Specifically, refer to Figure 4 As shown, taking the aerospace printed circuit board to be processed at position 1 as the reference, according to Figure 5 way, Figure 5 The spacing between the middle plates is 10, the circle where point A is located can be the aerospace printed circuit board to be processed at position 1, the circle where point B is located can be the aerospace printed circuit board to be processed at position 2, and the circle where point C is located can be the aerospace printed circuit board to be processed at position 16. Based on this, the center position of the aerospace printed circuit board to be processed at position 16 is determined, and the three center points are connected to form an equilateral triangle with a side length of 2r+k. In this way, the aerospace printed circuit boards to be processed at positions 17-23 can be determined in sequence.

[0130] Finally, the 2nd and 4th rows contain 4 aerospace printed circuit boards to be processed. The center of each aerospace printed circuit board to be processed in each even-numbered row is located on the same straight line and parallel to the X direction, and the distance between adjacent aerospace printed circuit boards to be processed is 2r+k. At the same time, the center of each aerospace printed circuit board to be processed on the even-numbered row is 2r+k away from the center of the two aerospace printed circuit boards to be processed on the adjacent odd-numbered rows.

[0131] S15. Obtaining a layout based on the odd-numbered row layout and the even-numbered row layout.

[0132] Specifically, in the layout diagram, an equilateral triangle is formed between the centers of the aerospace printed circuit boards to be processed at positions 1, 2, and 16.

[0133] The second implementation method may include:

[0134] S21. Create a first reference plate according to the number of panels m, the center coordinates, the radius r and the plate spacing k in the X direction.

[0135] Specifically, the first reference plate includes m aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is on the first straight line, and the distance between the centers of adjacent aerospace printed circuit boards to be processed is 2r+k.

[0136] S22: Determine whether the number of panels in the Y direction is greater than or equal to 2.

[0137] Specifically, if the number of panels in the Y direction is greater than or equal to 2, step S23 is executed.

[0138] S23. Create a second reference plate according to the number of panels n, the radius r and the plate spacing k in the Y direction.

[0139] Specifically, the second reference plate includes m-1 aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is on the second straight line, and the distance between the centers of adjacent aerospace printed circuit boards to be processed is 2r+k.

[0140] S24, based on the number of panels in the Y direction, the odd-numbered rows use the first reference plate, and the even-numbered rows use the second reference plate, and they are combined in parallel and alternately to create a panel layout.

[0141] Specifically, refer to Figure 2 As shown, the number of panels in the Y direction is 5, the odd rows are 1, 3, 5, and the even rows are 2, 4. By using the first reference plate for the odd rows and the second reference plate for the even rows in parallel and alternately, a panel layout can be created. Figure 2 The 1st, 3rd and 5th rows are the first reference plates, and the 2nd and 4th rows are the second reference plates.

[0142] In some embodiments of the present application, S12, creating an odd-numbered row layout according to the layout quantity m, the center coordinates, the radius r, and the board spacing k in the X direction, includes the following steps:

[0143] S31. Calculate the center coordinates of each aerospace printed circuit board to be processed in each odd-numbered row of panels according to the number of panels m, the center coordinates, the radius r and the board spacing k in the X direction.

[0144] Specifically, during the calculation, it can be assumed that each odd-numbered row panel contains m aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is located on the same straight line and parallel to the X direction, the distance between adjacent aerospace printed circuit boards to be processed is 2r+k, and at the same time, the center of each aerospace printed circuit board to be processed on the odd-numbered row panel is only 2×(2r+k)sin60° away from the center of one aerospace printed circuit board to be processed on the adjacent odd row, and the center coordinates of each aerospace printed circuit board to be processed in each odd-numbered row panel are calculated.

[0145] Will Figure 2 and Figure 4Combined with the analysis, assuming that the center coordinates of the aerospace printed circuit board to be processed at position 1 are (0, 0), then to meet the above conditions, the center coordinates of the aerospace printed circuit board to be processed at position 2 are (2r+k, 0), the center coordinates of the aerospace printed circuit board to be processed at position 3 are (2×(2r+k), 0), the center coordinates of the aerospace printed circuit board to be processed at position 4 are (3×(2r+k), 0), and the center coordinates of the aerospace printed circuit board to be processed at position 5 are (2r+k, 0). The center coordinates of the circle are (4×(2r+k), 0), the center coordinates of the aerospace printed circuit board to be processed at position 6 are (0, 2×(2r+k)sin60°), the center coordinates of the aerospace printed circuit board to be processed at position 7 are (2r+k, 2×(2r+k)sin60°), the center coordinates of the aerospace printed circuit board to be processed at position 8 are (2×(2r+k), 2×(2r+k)sin60°), and the center coordinates of the aerospace printed circuit board to be processed at position 9 are (0, 2×(2r+k)sin60°). The center coordinates of the printed circuit board are (3×(2r+k), 2×(2r+k)sin60°), the center coordinates of the aerospace printed circuit board to be processed at position 10 are (4×(2r+k), 2×(2r+k)sin60°), the center coordinates of the aerospace printed circuit board to be processed at position 11 are (0, 4×(2r+k)sin60°), and the center coordinates of the aerospace printed circuit board to be processed at position 12 are (2r+k, 4×( 2r+k)sin60°), the center coordinates of the aerospace printed circuit board to be processed at position 13 are (2×(2r+k), 4×(2r+k)sin60°), the center coordinates of the aerospace printed circuit board to be processed at position 14 are (3×(2r+k), 4×(2r+k)sin60°), and the center coordinates of the aerospace printed circuit board to be processed at position 15 are (4×(2r+k), 4×(2r+k)sin60°).

[0146] S32. Based on the calculated coordinates of the centers of the circles, an aerospace printed circuit board to be processed is created to obtain an odd-numbered row layout.

[0147] In some embodiments of the present application, S14, creating an even-numbered row layout according to the layout quantity m, the center coordinates, the radius r, and the board spacing k in the X direction, may include the following steps:

[0148] S41. Calculate the center coordinates of each aerospace printed circuit board to be processed in each even-numbered row of panels according to the number of panels m, the center coordinates, the radius r and the board spacing k in the X direction.

[0149] Specifically, during the calculation, the center coordinates of each aerospace printed circuit board to be processed in each even-numbered row layout can be calculated based on the condition that the center of each aerospace printed circuit board to be processed in each even-numbered row layout is located on the same straight line and parallel to the X direction, and the distance between adjacent aerospace printed circuit boards to be processed is 2r+k. At the same time, the center of each aerospace printed circuit board to be processed on the even-numbered row is 2r+k away from the center of two aerospace printed circuit boards to be processed on adjacent odd-numbered rows.

[0150] Will Figure 2 and Figure 4 Combined with the analysis, assuming that the center coordinates of the aerospace printed circuit board to be processed at position 16 are (r+k / 2, (2r+k)sin60°), then to meet the above conditions, the center coordinates of the aerospace printed circuit board to be processed at position 17 are (3×(r+k / 2), (2r+k)sin60°), the center coordinates of the aerospace printed circuit board to be processed at position 18 are (5×(r+k / 2), (2r+k)sin60°), and the center coordinates of the aerospace printed circuit board to be processed at position 19 are (7×(r+k / 2), (2r+k)sin 60°), the center coordinates of the aerospace printed circuit board to be processed at position 20 are (r+k / 2, 3×(2r+k)sin60°), the center coordinates of the aerospace printed circuit board to be processed at position 21 are (3×(r+k / 2), 3×(2r+k)sin60°), the center coordinates of the aerospace printed circuit board to be processed at position 22 are (5×(r+k / 2), 3×(2r+k)sin60°), and the center coordinates of the aerospace printed circuit board to be processed at position 23 are (7×(r+k / 2), 3×(2r+k)sin60°).

[0151] S42. Based on the calculated coordinates of the centers of the circles, an aerospace printed circuit board to be processed is created to obtain an even-numbered row layout.

[0152] In some embodiments of the present application, the actual plating area of ​​each layer is calculated based on the positive and negative properties of each inner layer, which may include: determining the parameters of the plating edge and the debonding strip based on the positive and negative properties of each inner layer, and calculating the actual plating area of ​​each layer based on the parameters of the plating edge and the debonding strip.

[0153] In some embodiments of the present application, the drilling situation can be analyzed after obtaining the final imitation model to avoid repeated drilling and affect production efficiency. Based on this, the drilling layer can be determined based on the final imitation model, and the types and positions of the holes in the drilling layer can be compared to screen out holes with the same type and position, and retain one of the holes.

[0154] Specifically, according to the drilling type and position, the drilling holes of the same type and position can be screened. In order to save manufacturing efficiency and reduce the impact of processing errors, only one of the drilling holes can be retained. The drilling layer contains the drilling type, position and corresponding tool number of each drilling hole. To determine the drilling type, the aperture type of the drilling hole can be judged, the pre-set drilling table and aperture size are extracted, the aperture size is calculated by formula, and the tool number is assigned using the calculation result, so as to finally classify the aperture of each drilling hole in the drilling layer, and determine the drilling type, position and corresponding tool number of each drilling hole.

[0155] In some embodiments of the present application, in order to ensure that the electrical parameters comply with national standards, the printed circuit board to be processed can be subjected to compliance testing by pre-setting restriction conditions, and a compliance test report can be generated for user analysis. The specific process may include:

[0156] Based on the pre-set limiting conditions and combined with the analysis data, the aerospace printed circuit boards to be processed are tested for compliance and a compliance test report is generated.

[0157] Specifically, compliance testing can include testing the minimum spacing between lines in each layer, testing the minimum spacing between lines and disks, testing the minimum spacing between disks, and testing whether there are lines in the character layer that do not meet 0.127mm. By analyzing the final output compliance test report, possible problems in the printed circuit board can be discovered early so that they can be handled in advance.

[0158] At this time, step S117, according to the preset silk screen addition requirements, add the number of aerospace printed circuit boards to be processed, the panel size, the blanking size and the identification of the electroplating area to obtain the final panel model, which may include:

[0159] According to the preset silk-screen addition requirements, add the number of aerospace printed circuit boards to be processed, the panel size, blanking size and electroplating area identification to obtain the final panel model and compliance test report.

[0160] A space printed circuit board platemaking device provided in an embodiment of the present application is described below. The space printed circuit board platemaking device described below and the space printed circuit board platemaking method described above can be referred to each other.

[0161] Figure 6 A schematic diagram of the structure of an aerospace printed circuit board assembly device provided in an embodiment of the present application, the device may include:

[0162] The data acquisition module 100 is used to acquire the analysis data of the aerospace printed circuit board to be processed and the user's imposition instruction;

[0163] The data analysis module 101 is used to determine the number of layers of the printed circuit board to be processed and the positive and negative properties of each inner layer based on the analysis data;

[0164] The shape determination module 102 is used to determine whether the shape of the aerospace printed circuit board to be processed is circular based on the analysis data; if so, determine the center coordinates and radius r of the aerospace printed circuit board to be processed;

[0165] The instruction processing module 103 is used to determine the number of panels m in the X direction, the number of panels n in the Y direction and the panel spacing k according to the user's panelization instruction;

[0166] The initial panelization module 104 is used to obtain a panelization layout according to the number of panels m in the X direction, the number of panels n in the Y direction, the coordinates of the center of the circle, the radius r and the board spacing k, wherein each odd-numbered row in the Y direction contains m aerospace printed circuit boards to be processed whose centers are located on the same straight line, each even-numbered row contains m-1 aerospace printed circuit boards to be processed whose centers are located on the same straight line, the distance between the centers of adjacent aerospace printed circuit boards to be processed in each row is 2r+k, the connecting line of the centers of the aerospace printed circuit boards to be processed in each row is parallel to the X direction, and the distance between the center of each aerospace printed circuit board to be processed on the even-numbered row and the center of two aerospace printed circuit boards to be processed on the adjacent odd-numbered rows is 2r+k;

[0167] The gold-plated corner line adding module 105 is used to add a regular hexagonal wireframe as a gold-plated corner line frame on the periphery of each aerospace printed circuit board to be processed based on the center coordinates of each aerospace printed circuit board to be processed in the imposition layout, wherein the distance from the center of each aerospace printed circuit board to be processed to each side of the corresponding gold-plated corner line frame is r+k / 2, and each gold-plated corner line frame has two sides parallel to the Y direction;

[0168] The gold-plated process wire adding module 106 is used to add a number of graphic gold-plated process wires for each aerospace printed circuit board to be processed in the imposition layout based on the gold-plated corner wire frame and the analysis data, wherein one end of the graphic gold-plated process wire is connected to the gold-plated corner wire frame, and the other end is connected to the wire of the aerospace printed circuit board to be processed;

[0169] A gold-plated wire adding module 107 is used to add a gold-plated wire frame around the layout based on the position of each gold-plated corner line in the layout, and the gold-plated wire frame is connected to the outer boundary vertices and sides of the gold-plated corner line frame in the layout;

[0170] The hole adding module 108 is used to add the coupon cutting holes, target positioning holes, inner layer positioning holes, sun exposure positioning holes and gold plating hanger holes to the layout of the layout according to the user layout instruction and the preset hole adding requirements;

[0171] The logo adding module 109 is used to add the logo of the system time, unit and drawing number on the layout of the layout according to the layout instruction of the user and the preset silk screen adding requirements;

[0172] The pad adding module 110 is used to add the attachment plate pad, the target plate and the gold-plated pad on the imposition layout according to the preset instructions, and the gold-plated pad is connected to the gold-plated wire and the gold-plated hanger hole respectively;

[0173] The gold-plated wire adding module 111 is used to add corresponding gold-plated wires of the coupon plate and the target plate on the imposition layout for the coupon plate and the target plate;

[0174] A circuit board quantity calculation module 112, for calculating the quantity of aerospace printed circuit boards to be processed based on the imposition layout;

[0175] The electroplating area calculation module 113 is used to calculate the electroplating area of ​​each layer based on the positive and negative properties of each inner layer;

[0176] The process edge adding module 114 is used to add corresponding process edges around the imposition layout from the printed circuit board to be processed according to the preset process edge adding requirements, and determine the imposition size;

[0177] A blanking size determination module 115 is used to determine the blanking size according to the number of layers;

[0178] The final plate determination module 116 is used to add the number of aerospace printed circuit boards to be processed, the plate size, the blanking size and the electroplating area identification on the plate layout according to the preset silk screen addition requirements to obtain the final plate model.

[0179] It can be seen from the above technical scheme that an aerospace printed circuit board imposition device provided in the embodiment of the present application is used to obtain the analysis data and user imposition instructions of the aerospace printed circuit board to be processed through the data acquisition module 100; the data analysis module 101 is used to determine the number of layers of the printed circuit board to be processed and the positive and negative attributes of each inner layer based on the analysis data; the shape judgment module 102 is used to determine whether the shape of the aerospace printed circuit board to be processed is circular based on the analysis data; if so, determine the center coordinates and radius r of the aerospace printed circuit board to be processed; the instruction processing module 103 is used to determine the number of impositions m in the X direction, the number of impositions n in the Y direction and the board spacing k according to the user imposition instructions; the initial imposition module 101 is used to determine the number of impositions m in the X direction, the number of impositions n in the Y direction and the board spacing k according to the user imposition instructions; the initial imposition module 102 is used to determine the number of impositions m in the X direction, the number of impositions n in the Y direction and the board spacing k according to the user imposition instructions; the initial imposition module 103 is used to determine the number of impositions m in the X direction, the number of impositions n in the Y direction and the board spacing k according to the user imposition instructions; the initial imposition module 101 is used to determine the number of impositions n in the Y direction and the board spacing k according to the user imposition instructions; the initial imposition module 101 is used to determine the number of impositions m in the X direction, the number of impositions n in the Y direction and the board spacing k according to the user imposition instructions; the initial imposition module 102 is used to determine the number of impositions m in the X direction, the number of impositions n in the Y direction and the board spacing k according to the user imposition instructions; the initial imposition module 101 is used to determine the number of impositions n in the Y 04, used to obtain a panel layout according to the number of panels m in the X direction, the number of panels n in the Y direction, the coordinates of the center of the circle, the radius r and the board spacing k, in which each odd row in the Y direction contains m aerospace printed circuit boards to be processed whose centers are located on the same straight line, and each even row contains m-1 aerospace printed circuit boards to be processed whose centers are located on the same straight line, and the distance between the centers of adjacent aerospace printed circuit boards to be processed in each row is 2r+k, and the connecting line of the centers of the aerospace printed circuit boards to be processed in each row is parallel to the X direction, and the distance between the center of each aerospace printed circuit board to be processed on the even row and the center of each aerospace printed circuit board to be processed is only 2r+k from the centers of the two aerospace printed circuit boards to be processed on the adjacent odd rows; gold-plated corner line adding module 10 5, for adding a regular hexagonal wireframe as a gold-plated corner wireframe to the periphery of each aerospace printed circuit board to be processed based on the center coordinates of each aerospace printed circuit board to be processed in the imposition layout, the distance from the center of each aerospace printed circuit board to the corresponding side of the gold-plated corner wireframe is r+k / 2, and each gold-plated corner wireframe has two sides parallel to the Y direction; a gold-plated process wire adding module 106, for adding a number of graphic gold-plated process wires to each aerospace printed circuit board to be processed in the imposition layout based on the gold-plated corner wireframe and analysis data, one end of the graphic gold-plated process wire is connected to the gold-plated corner wireframe, and the other end is connected to the wire of the aerospace printed circuit board to be processed; a gold-plated wire adding module 107, for adding a regular hexagonal wireframe as a gold-plated corner wireframe to the periphery of each aerospace printed circuit board to be processed based on the imposition layout The positions of the gold-plated corner lines in the layout are determined, and a gold-plated wire frame is added around the layout, and the gold-plated wire frame is connected to the outer boundary vertices and sides of the gold-plated corner line frame in the layout; a hole position adding module 108 is used to add the attachment plate cutting hole, target positioning hole, inner layer positioning hole, drying positioning hole and gold-plated hanger hole to the layout according to the user's layout instruction and the preset hole position adding requirements; a logo adding module 109 is used to add the system time, unit and drawing number logo to the layout according to the user's layout instruction and the preset silk screen adding requirements; a pad adding module 110 is used to add the attachment plate, target plate and gold-plated plate to the layout according to the preset instructions, and the gold-plated plate is connected to the gold-plated wire and the gold-plated hanger hole respectively;The gold-plated line adding module 111 is used to add corresponding gold-plated lines for attached plates and target plates on the imposition layout for the attached plates and target plates; the circuit board quantity calculation module 112 is used to calculate the number of aerospace printed circuit boards to be processed based on the imposition layout; the electroplating area calculation module 113 is used to calculate the electroplating area of ​​each layer based on the positive and negative properties of each inner layer; the process edge adding module 114 is used to add corresponding process edges around the imposition layout from the printed circuit boards to be processed according to the preset process edge adding requirements, and determine the imposition size; the blanking size determination module 115 is used to determine the blanking size according to the number of layers; the final imposition determination module 116 is used to add the number of aerospace printed circuit boards to be processed, the imposition size, the blanking size and the electroplating area identification on the imposition layout according to the preset silk screen adding requirements, and obtain the final imposition model. The present application obtains a panelization model by the above method, which can improve efficiency to a certain extent and reduce errors caused by manual panelization of aerospace printed circuit boards compared to manual panelization of aerospace printed circuit boards. At the same time, for circular aerospace printed circuit boards to be processed, by analyzing the aerospace printed circuit boards to be processed and the user panelization instructions, a more compact regular triangle matrix panelization method is adopted, which can improve the utilization rate of materials to a certain extent compared to the original upper and lower regular arrangement method. ;

[0180] An aerospace printed circuit board layout device, the embodiment of the present application also provides an electronic device, Figure 7 The hardware structure diagram of the electronic device is shown in FIG. Figure 7 , the hardware structure of the electronic device may include: at least one processor 1, at least one communication interface 2, at least one memory 3 and at least one communication bus 4;

[0181] In the embodiment of the present application, the number of the processor 1, the communication interface 2, the memory 3, and the communication bus 4 is at least one, and the processor 1, the communication interface 2, and the memory 3 communicate with each other through the communication bus 4;

[0182] The processor 1 may be a central processing unit CPU, or an application-specific integrated circuit ASIC (Application Specific Integrated Circuit), or one or more integrated circuits configured to implement the embodiments of the present invention, etc.;

[0183] The memory 3 may include a high-speed RAM memory, and may also include a non-volatile memory, such as at least one disk memory;

[0184] The memory stores a program, and the processor can call the program stored in the memory, and the program is used to: implement the aforementioned aerospace printed circuit board platemaking method and the various steps of the aforementioned aerospace printed circuit board platemaking method.

[0185] An embodiment of the present application also provides a storage medium, which can store a program suitable for execution by a processor, wherein the program is used to: implement the aforementioned aerospace printed circuit board panelization method and the various steps of the aforementioned aerospace printed circuit board panelization.

[0186] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0187] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The various embodiments can be combined with each other, and the same or similar parts can be referenced to each other.

[0188] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for assembling a printed circuit board for aerospace, characterized in that: include: Obtain analysis data and user layout instructions for aerospace printed circuit boards to be processed; Based on the analysis data, determining the number of layers of the printed circuit board to be processed and the positive and negative properties of each inner layer; Based on the analysis data, determining whether the shape of the aerospace printed circuit board to be processed is circular; If yes, then determine the center coordinates and radius r of the aerospace printed circuit board to be processed; According to the user's imposition instruction, determine the number of impositions m in the X direction, the number of impositions n in the Y direction and the distance between the panels k; According to the number of panels m in the X direction, the number of panels n in the Y direction, the center coordinates, the radius r and the board spacing k, a panel layout is obtained, wherein each odd row in the Y direction contains m aerospace printed circuit boards to be processed whose centers are located on the same straight line, each even row contains m-1 aerospace printed circuit boards to be processed whose centers are located on the same straight line, the center distance between adjacent aerospace printed circuit boards to be processed in each row is 2r+k, the center lines of the aerospace printed circuit boards to be processed in each row are parallel to the X direction, and the center of each aerospace printed circuit board to be processed on the even row is only 2r+k away from the centers of the two aerospace printed circuit boards to be processed on the adjacent odd rows; Based on the coordinates of the center of each aerospace printed circuit board to be processed in the layout, a regular hexagonal wireframe is added as a gold-plated corner wireframe around the periphery of each aerospace printed circuit board to be processed, and the distance from the center of each aerospace printed circuit board to be processed to each side of the corresponding gold-plated corner wireframe is r+k / 2, and each gold-plated corner wireframe has two sides parallel to the Y direction; Based on the gold-plated corner wire frame and the analysis data, a plurality of graphic gold-plated process wires are added for each aerospace printed circuit board to be processed in the imposition layout, wherein one end of the graphic gold-plated process wire is connected to the gold-plated corner wire frame, and the other end is connected to the wire of the aerospace printed circuit board to be processed; Based on the position of each gold-plated corner line in the imposition layout, a gold-plated wire frame is added around the imposition layout, and the gold-plated wire frame is connected to the outer boundary vertices and sides of the gold-plated corner line frame in the imposition layout; According to the user layout instructions and the preset hole adding requirements, add the coupon cutting holes, target positioning holes, inner layer positioning holes, sun exposure positioning holes and gold plating hanger holes to the layout; According to the user imposition instruction and the preset silk-screen addition requirements, the system time, unit and drawing number are added to the imposition layout; According to preset instructions, adding an attachment plate, a target plate and a gold-plated plate to the imposition layout, wherein the gold-plated plate is connected to the gold-plated wire and the gold-plated hanger hole respectively; For the coupon plate and the target plate, adding corresponding coupon plate gold-plated wires and target plate gold-plated wires on the imposition layout; Based on the imposition layout, calculating the number of aerospace printed circuit boards to be processed; Based on the positive and negative properties of each inner layer, the electroplating area of ​​each layer is calculated; From the printed circuit board to be processed, according to the preset process edge adding requirements, corresponding process edges are added around the layout of the imposition, and the imposition size is determined; Determine the blanking size according to the number of layers; According to the preset silk-screen addition requirements, the number of the aerospace printed circuit boards to be processed, the panel size, the blanking size and the identification of the electroplating area are added to the panel layout to obtain a final panel model.

2. The method according to claim 1, characterized in that The method of obtaining a panel layout according to the number of panels m in the X direction, the number of panels n in the Y direction, the coordinates of the center of the circle, the radius r and the panel spacing k includes: According to the number of panels n in the Y direction, determine whether there is an odd number of rows; If it exists, then create an odd-numbered row panel according to the number of panels m in the X direction, the center coordinates, the radius r and the board spacing k, each odd-numbered row panel contains m aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is located on the same straight line and parallel to the X direction, and the distance between adjacent aerospace printed circuit boards to be processed is 2r+k. At the same time, the center of each aerospace printed circuit board to be processed on the odd-numbered row panel is only 2×(2r+k)sin60° away from the center of one aerospace printed circuit board to be processed on the adjacent odd row; According to the number of panels n in the Y direction, determine whether there is an even number of rows; If it exists, then create an even-numbered row panel according to the number of panels m in the X direction, the center coordinates, the radius r and the board spacing k, each even-numbered row panel contains m-1 aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is located on the same straight line and parallel to the X direction, and the distance between adjacent aerospace printed circuit boards to be processed is 2r+k. At the same time, the center of each aerospace printed circuit board to be processed on the even-numbered row is 2r+k away from the center of the two aerospace printed circuit boards to be processed on the adjacent odd-numbered rows; Based on the odd-numbered row imposition and the even-numbered row imposition, an imposition layout is obtained.

3. The method according to claim 2, characterized in that The step of creating an odd-numbered row of panels according to the number of panels m in the X direction, the coordinates of the center of the circle, the radius r, and the panel spacing k includes: According to the number of panels m in the X direction, the center coordinates, the radius r and the board spacing k, under the condition that each odd-numbered row panel contains m aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is located on the same straight line and parallel to the X direction, the distance between adjacent aerospace printed circuit boards to be processed is 2r+k, and at the same time, the center of each aerospace printed circuit board to be processed on the odd-numbered row panel is only 2×(2r+k)sin60° away from the center of one aerospace printed circuit board to be processed on the adjacent odd-numbered row, the center coordinates of each aerospace printed circuit board to be processed in each odd-numbered row panel are calculated; Based on the calculated coordinates of the centers of each circle, the aerospace printed circuit board to be processed is created to obtain an odd-numbered row layout.

4. The method according to claim 1, characterized in that: The method of obtaining a panel layout according to the number of panels m in the X direction, the number of panels n in the Y direction, the coordinates of the center of the circle, the radius r and the panel spacing k includes: According to the number of panels m in the X direction, the center coordinates, the radius r and the board spacing k, a first reference plate is created, wherein the first reference plate contains m aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is on the first straight line, and the distance between the centers of adjacent aerospace printed circuit boards to be processed is 2r+k; Determine whether the number of panels in the Y direction is greater than or equal to 2; If the number of panels in the Y direction is greater than or equal to 2, a second reference plate is created according to the number of panels in the Y direction n, the radius r and the plate spacing k, wherein the second reference plate contains m-1 aerospace printed circuit boards to be processed, the center of each aerospace printed circuit board to be processed is on the second straight line, and the distance between the centers of adjacent aerospace printed circuit boards to be processed is 2r+k; Based on the number of panels in the Y direction, the first reference plates are used in odd rows and the second reference plates are used in even rows, and they are combined alternately in parallel to create a panel layout.

5. The method according to claim 1, characterized in that The actual electroplating area of ​​each layer is calculated based on the positive and negative properties of each inner layer, including: Determine the parameters of the electroplating edge and the debonding strip based on the positive and negative properties of each inner layer; Based on the parameters of the plating edge and the strip, the actual plating area of ​​each layer is calculated.

6. The method according to any one of claims 1 to 5, characterized in that: Also includes: Determine the drilling layer based on the final layout model; By comparing the types and positions of the boreholes in the borehole layer, the boreholes with the same type and position are screened out, and one of the boreholes is retained.

7. The method according to any one of claims 1 to 5, characterized in that: Also includes: According to the pre-set limiting conditions and in combination with the analysis data, compliance testing is performed on the aerospace printed circuit board to be processed, and a compliance testing report is generated; According to the preset silk screen addition requirements, the number of the aerospace printed circuit boards to be processed, the panel size, the blanking size and the identification of the electroplating area are added to obtain the final panel model, including: According to the preset silk-screen addition requirements, the number of the aerospace printed circuit boards to be processed, the panel size, the blanking size and the identification of the electroplating area are added to obtain the final panel model and compliance test report.

8. An aerospace printed circuit board paneling device, characterized in that: include: A data acquisition module is used to acquire analysis data of the aerospace printed circuit board to be processed and user imposition instructions; A data analysis module, used to determine the number of layers of the printed circuit board to be processed and the positive and negative properties of each inner layer based on the analysis data; A shape judgment module, used to judge whether the shape of the aerospace printed circuit board to be processed is circular based on the analysis data; if so, determine the center coordinates and radius r of the aerospace printed circuit board to be processed; An instruction processing module, used for determining the number of panels m in the X direction, the number of panels n in the Y direction and the panel spacing k according to the user panelization instruction; An initial panelization module is used to obtain a panelization layout according to the number of panels m in the X direction, the number of panels n in the Y direction, the center coordinates, the radius r and the board spacing k, wherein each odd-numbered row in the Y direction contains m aerospace printed circuit boards to be processed whose centers are located on the same straight line, each even-numbered row contains m-1 aerospace printed circuit boards to be processed whose centers are located on the same straight line, the center distance between adjacent aerospace printed circuit boards to be processed in each row is 2r+k, the center lines of the aerospace printed circuit boards to be processed in each row are parallel to the X direction, and the center of each aerospace printed circuit board to be processed on the even-numbered row is only 2r+k away from the centers of the two aerospace printed circuit boards to be processed on the adjacent odd-numbered rows; A gold-plated corner line adding module is used to add a regular hexagonal wireframe as a gold-plated corner line frame on the periphery of each aerospace printed circuit board to be processed based on the center coordinates of each aerospace printed circuit board to be processed in the imposition layout, wherein the distance from the center of each aerospace printed circuit board to be processed to each side of the corresponding gold-plated corner line frame is r+k / 2, and each gold-plated corner line frame has two sides parallel to the Y direction; A gold-plated process wire adding module is used to add a plurality of graphic gold-plated process wires for each aerospace printed circuit board to be processed in the imposition layout based on the gold-plated corner wire frame and the analysis data, wherein one end of the graphic gold-plated process wire is connected to the gold-plated corner wire frame, and the other end is connected to the wire of the aerospace printed circuit board to be processed; A gold-plated wire adding module, used for adding a gold-plated wire frame around the imposition layout based on the position of each gold-plated corner line in the imposition layout, wherein the gold-plated wire frame is connected to the outer boundary vertices and sides of the gold-plated corner line frame in the imposition layout; A hole position adding module is used to add coupon cutting holes, target positioning holes, inner layer positioning holes, sun exposure positioning holes and gold plating hanger holes to the layout of the layout according to the user layout instruction and the preset hole position adding requirements; A logo adding module, used for adding logos of system time, unit and drawing number on the layout of the layout according to the layout instruction of the user and the preset silk screen adding requirements; A pad adding module, used for adding a bonding pad, a target pad and a gold-plated pad to the imposition layout according to a preset instruction, wherein the gold-plated pad is connected to the gold-plated wire and the gold-plated hanger hole respectively; A gold-plated wire adding module, for adding corresponding gold-plated wires of the coupon plate and the target plate on the layout of the imposition plate; A circuit board quantity calculation module, used for calculating the quantity of aerospace printed circuit boards to be processed based on the imposition layout; An electroplating area calculation module, used to calculate the electroplating area of ​​each layer based on the positive and negative properties of each inner layer; A process edge adding module is used to add corresponding process edges around the imposition layout from the printed circuit board to be processed according to the preset process edge adding requirements, and determine the imposition size; A blanking size determination module, used to determine the blanking size according to the number of layers; The final panel determination module is used to add the number of the aerospace printed circuit boards to be processed, the panel size, the blanking size and the electroplating area identification on the panel layout according to the preset silk screen addition requirements to obtain the final panel model.

9. An aerospace printed circuit board layout device, characterized in that: include: Memory and processor; The memory is used to store programs; The processor is used to execute the program to implement the various steps of the aerospace printed circuit board platemaking method as described in any one of claims 1-7.

10. A readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, each step of the aerospace printed circuit board platemaking method as described in any one of claims 1 to 7 is implemented.

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