Adaptive integration method of flexible circuit board in smart home environment

Abstract

The invention relates to the technical field of flexible circuit board integration, and discloses a self-adaptive integration method of a flexible circuit board in a smart home environment, and the method comprises the steps: carrying out the thermal analysis between a to-be-processed module and a data processor, and analyzing the data processing time of the data processor about the to-be-processed module; selecting a target device, a target module and a target processor from the household device, the to-be-processed module and the data processor based on the thermal analysis result and the data processing duration; simulating the bending form of the flexible circuit board relative to the target module at the installation position, calculating the bending curvature of the bending form, and selecting the final position of the flexible circuit board in the installation position through the bending curvature; configuring a magnetic attraction device of the flexible circuit board; and after the magnetic attraction device is notified to control the module connection end of the flexible circuit board to be connected with the target module, the flexible circuit board is instructed to perform adaptive integration on the target module by using the control operation. According to the invention, the communication connection between the flexible circuit board and the idle device can be released.

Description

Technical Field

[0001] The invention relates to a self-adaptive integration method of a flexible circuit board in a smart home environment, belonging to the technical field of flexible circuit board integration. Background Art

[0002] Flexible circuit boards are based on polyimide or polyester films, and have the characteristics of light weight, thin thickness, free bending and folding, etc. They can be arranged arbitrarily according to spatial layout requirements, and can be moved and stretched arbitrarily in three-dimensional space. They can adapt to various complex shapes and narrow spaces in smart home devices, and realize the integration of component assembly and wire connection. Although the one-time initial cost of flexible circuit boards is relatively high, in the case of large-scale production and complex design, the overall cost will gradually decrease because it can reduce the number of hardware, reduce assembly hours, and improve production efficiency, which is conducive to cost control and market promotion of smart home products.

[0003] At present, in the smart home environment, the control core of the smart home is generally integrated into the flexible circuit board, while the external detection device, control device, etc. of the smart home are not integrated into the flexible circuit board, that is, the external detection device, control device and the control core on the flexible circuit board are connected to achieve functional integration between the external detection device, control device and the control core on the flexible circuit board. For example, the mobile wheel, environmental detection sensor, cleaning device, etc. of the smart sweeping robot are not integrated into the flexible circuit board. Only the control core of the smart sweeping robot will be integrated on the flexible circuit board. The control core is used to receive and process the control information sent by the user through the mobile phone, so as to control the operation of the mobile wheel, environmental detection sensor and cleaning device, thereby realizing the joint intelligent machine of the mobile wheel, environmental detection sensor, cleaning device and the control core on the flexible circuit board. Device control, this process of combined intelligent machine control is called integration between various functions. For the existing technology, in the same home appliance, in addition to the control core, there are many functions that will not be integrated into the flexible circuit board. If the flexible circuit board is required to control all these functions at the same time, the control core on the flexible circuit board needs to be connected to other functions at the same time. If the smart home device is a large device and has many connected functions, a sufficiently large flexible circuit board is required to connect with other devices. For example, a flexible circuit board of sufficient width needs to connect the device on the extreme left and the device on the extreme right at the same time. Secondly, even when some devices are not frequently called by the flexible circuit board, it is necessary to keep the flexible circuit board connected to the device, which requires the flexible circuit board to maintain connection with the device when it does not need to communicate with the device.

[0004] Therefore, a solution is urgently needed to release the communication connection between the flexible circuit board and the idle device. Summary of the invention

[0005] The present invention provides an adaptive integration method of a flexible circuit board in a smart home environment, the main purpose of which is to release the communication connection between the flexible circuit board and the idle device.

[0006] To achieve the above object, the present invention provides a method for adaptively integrating a flexible circuit board in a smart home environment, comprising: Querying home appliances in a smart home environment, dividing the home appliances into modules to be processed and data processors, performing thermal analysis between the modules to be processed and the data processors, obtaining thermal analysis results, and analyzing the data processing time of the data processors on the modules to be processed; Based on the thermal analysis result and the data processing time, a target device, a target module and a target processor are selected from the household device, the module to be processed and the data processor, and the target processor is installed on a preset flexible board to obtain a flexible circuit board, wherein the flexible circuit board includes a device connection end and a module connection end; Simulating the installation position of the flexible circuit board in the target device, simulating the bending shape of the flexible circuit board at the installation position with respect to the target module, calculating the bending curvature of the bending shape, and selecting the final position of the flexible circuit board at the installation position according to the bending curvature; After the flexible circuit board is installed at the final position, a magnetic device of the flexible circuit board is configured, and after the device connection end of the flexible circuit board is connected to the magnetic device, control information sent by the user in the smart home environment is received in the flexible circuit board; The control target and control operation corresponding to the control information are analyzed in the flexible circuit board. Based on the control target, the magnetic attraction device is notified to control the module connection end of the flexible circuit board to connect with the target module. Then, the control operation is used to instruct the flexible circuit board to adaptively integrate the target module to obtain an adaptive integration result.

[0007] Optionally, performing thermal analysis between the module to be processed and the data processor to obtain a thermal analysis result includes: Obtaining a connecting wire between the module to be processed and the data processor; Cutting off the exposed wires in the connecting wires; Query the resistance, current, length, and cross-sectional radius of the exposed wire; Calculating the resistivity of the exposed wire using the resistance, the current, the cross-sectional radius and the length; measuring the surface temperature of the exposed wire and the ambient temperature; Calculating the thermal conductivity of the exposed wire according to the length, the cross-sectional radius and the surface temperature; Calculating the convection heat transfer coefficient of the exposed wire according to the surface temperature and the ambient temperature; Create a thermoelectric analysis system in the preset thermoelectric analysis software; In the thermoelectric analysis system, a material model of the exposed wire is created based on the resistivity, the thermal conductivity and the convection heat transfer coefficient; constructing a geometric model corresponding to the material model using the length and the cross-sectional radius; Setting boundary conditions of the geometric model; After taking the current as input data of the geometric model and the material model, determining a temperature cloud map corresponding to the geometric model and the material model; Taking the temperature cloud map as a thermal analysis result; The boundary conditions include end surface voltage and end surface current.

[0008] Optionally, analyzing the data processing time of the data processor on the module to be processed includes: querying the data processor about the single module duration of the module to be processed; Obtaining a module processing order of the data processor with respect to the module to be processed; According to the single module duration and the module processing order, the data processing duration of the data processor for the module to be processed is calculated using the following formula: in, Indicates the data processing time. Indicates the first The number of pending modules to wait for The single module duration of the modules to be processed, n represents the number of modules to be processed.

[0009] Optionally, the selecting a target device, a target module and a target processor from the household device, the module to be processed and the data processor based on the thermal analysis result and the data processing time includes: Setting a temperature threshold of the thermal analysis result and a duration threshold of the data processing duration; identifying a maximum temperature in the thermal analysis results; When the maximum temperature is lower than the temperature threshold and the data processing time is greater than the time threshold, the household equipment, the module to be processed and the data processor corresponding to the thermal analysis result and the data processing time are obtained to obtain the target device, the target module and the target processor.

[0010] Optionally, simulating a bending state of the flexible circuit board relative to the target module at the installation position includes: Connecting the output wire of the flexible circuit board to the receiving wire of the target module; querying a fixed-output distance between a fixed end of the flexible circuit board and the output wire; querying a fixing-receiving distance between a fixing end of the flexible circuit board and the receiving wire; When the fixed-output distance is greater than the fixed-receiving distance, determining that the flexible printed circuit board needs to be bent when connecting the output wire and the receiving wire; When the flexible circuit board needs to be bent, identifying a bendable space between the flexible circuit board and the target module; The flexible circuit board is bent for a preset number of times in the bendable space to obtain a bent shape.

[0011] Optionally, the calculating the curvature of the curved shape includes: Meshing the curved surface corresponding to the curved shape to obtain a mesh; Extracting the center point of the grid divided into the grids; Calculating the grid curvature of the divided grid according to the grid center point; The curvature of the curved shape is calculated according to the grid curvature.

[0012] Optionally, the magnetic attraction device configured with the flexible circuit board includes: Get the target module; Based on the module processing order corresponding to the target modules, a magnet loop is constructed between each target module; Obtaining a spare magnet corresponding to the magnet loop; A sliding control device is provided when the spare magnet slides on the magnet loop; Calculating the adsorption force of the spare magnet on the flexible circuit board; When the adsorption force is less than the traction force of the sliding control device on the magnet, selecting a target magnet on the magnet loop from the spare magnets; After the target magnet is installed on the magnet loop, the magnet loop on which the target magnet is installed and the sliding control device are used as magnetic attraction devices for the flexible circuit board.

[0013] Optionally, the calculating the adsorption force of the spare magnet on the flexible circuit board includes: The adsorption force of the spare magnet on the flexible circuit board is calculated using the following formula: Where F represents the adsorption force, represents the magnetic permeability of vacuum, V represents the magnetic energy volume of the spare magnet, M represents the magnetic moment of the spare magnet, and d represents the distance between the spare magnet and the exposed wire of the flexible circuit board.

[0014] Optionally, the notifying the magnetic attraction device to control the module connection end of the flexible circuit board to connect with the target module based on the control target includes: Obtaining a magnet loop and a sliding control device for installing a target magnet in the magnetic attraction device; transmitting the control target to the sliding control device; comparing, in the sliding control device, whether the control target is consistent with a current target corresponding to the target magnet; When the control target is consistent with the current target corresponding to the target magnet, connecting the module connection end of the flexible circuit board with the target module by using the target magnet; When the control target is inconsistent with the current target corresponding to the target magnet, querying the relative position of the control target relative to the current target in the sliding control device; Using the sliding control device to pull the target magnet to slide on the magnet loop to the relative position; At the relative position, the module connection end of the flexible circuit board is connected to the target module using the target magnet.

[0015] Optionally, the using the control operation to instruct the flexible circuit board to adaptively integrate the target module to obtain an adaptive integration result includes: transmitting the control operation from the flexible circuit board to the target module; In the target module, receiving the control operation; According to the control operation, running the module functions in the target module; The operating data of the target module regarding the module function is returned to the flexible circuit board to complete the adaptive integration of the target module by the flexible circuit board and obtain an adaptive integration result.

[0016] Compared with the problem described in the background technology, the embodiment of the present invention performs thermal analysis between the module to be processed and the data processor to analyze the heat condition of the wire caused by the current flowing when the module to be processed and the data processor are connected through exposed wires, so as to avoid the safety hazard caused by excessive heat of the wire. Furthermore, the embodiment of the present invention analyzes the data processing time of the data processor on the module to be processed to analyze the waiting time before each current module is connected to the flexible circuit board in turn. The longer the waiting time, the longer the flexible circuit board needs to process the previous module and will not quickly call the current module for processing. In other words, the flexible circuit board will not frequently switch between the previous module and the current module. Therefore, the combination of the previous module and the current module can be selected as the subsequent target module, because this can reduce the different forms of the flexible circuit board due to switching between different modules. The number of bendings can extend the service life of the flexible circuit board. The embodiment of the present invention selects the target device, target module and target processor from the household device, the module to be processed and the data processor based on the thermal analysis result and the data processing time, so as to select the functional module in the same device with low heat and long data processing time. Furthermore, the embodiment of the present invention calculates the bending curvature of the bending shape to use the bending curvature to evaluate the bending degree of the flexible circuit board at a random installation position, so as to select the installation positions that minimize the bending degree. The embodiment of the present invention configures the magnetic suction device of the flexible circuit board, so as to use the magnetic suction device to make the flexible circuit board disconnect the communication connection with the target module when it does not need to communicate with the target module and process data, and communicate with other target modules, so as to release the communication connection between the flexible circuit board and the idle device. Therefore, the adaptive integration method of the flexible circuit board in the smart home environment provided by the embodiment of the present invention can release the communication connection between the flexible circuit board and the idle device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic flow chart of a method for adaptively integrating a flexible circuit board in a smart home environment provided by an embodiment of the present invention; Figure 2 A schematic diagram of a magnetic suction device for implementing the adaptive integration method of the flexible circuit board in a smart home environment provided by an embodiment of the present invention; Figure 3 A schematic diagram of a module for implementing a method for adaptively integrating a flexible circuit board in a smart home environment provided by an embodiment of the present invention.

[0018] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments. DETAILED DESCRIPTION

[0019] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0020] The embodiment of the present application provides a method for adaptively integrating a flexible circuit board in a smart home environment. The execution subject of the method for adaptively integrating a flexible circuit board in a smart home environment includes but is not limited to at least one of the electronic devices such as a server and a terminal that can be configured to execute the method provided by the embodiment of the present application. In other words, the method for adaptively integrating a flexible circuit board in a smart home environment can be executed by software or hardware installed in a terminal device or a server device. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc.

[0021] Embodiment 1: Reference Figure 1 FIG. 1 is a flow chart of a method for adaptively integrating a flexible circuit board in a smart home environment provided by an embodiment of the present invention. In this embodiment, the method for adaptively integrating a flexible circuit board in a smart home environment includes: S1. Query household devices in a smart home environment, divide the modules to be processed and the data processors of the household devices, perform thermal analysis between the modules to be processed and the data processors, obtain thermal analysis results, and analyze the data processing time of the data processor on the modules to be processed.

[0022] In an embodiment of the present invention, the household appliances are, for example, intelligent sweeping robots, lighting control devices, and audio display devices, etc. Furthermore, the modules to be processed refer to various functions in the same household appliance, such as the mobile wheels, environmental detection sensors, and cleaning devices of the intelligent sweeping robot, and the data processor refers to the data processing center and data control center responsible for various functions in the same household appliance.

[0023] Furthermore, the embodiment of the present invention performs thermal analysis between the module to be processed and the data processor to analyze the heat condition of the wire caused by the flow of current when the module to be processed and the data processor are connected through exposed wires, thereby avoiding safety hazards caused by excessive wire heat.

[0024] In one embodiment of the present invention, the thermal analysis between the module to be processed and the data processor is performed to obtain the thermal analysis result, including: obtaining the connecting wire between the module to be processed and the data processor; intercepting the exposed wire in the connecting wire; querying the resistance, current, length, and cross-sectional radius of the exposed wire; calculating the resistivity of the exposed wire using the resistance, the current, the cross-sectional radius, and the length; measuring the surface temperature and the ambient temperature of the exposed wire; and calculating the thermal conductivity of the exposed wire according to the length, the cross-sectional radius, and the surface temperature using the following formula: in, Indicates thermal conductivity , Indicates the cross-sectional area calculated from the cross-sectional radius , Indicates heat flow , Represents the gradient of surface temperature , represents the inverse of the gradient of the surface temperature, represents the differential length on the bare conductor, Indicates the length of the exposed wire, Indicates temperature value; According to the surface temperature and the ambient temperature, the convective heat transfer coefficient of the exposed wire is calculated using the following formula: in, represents the convective heat transfer coefficient, Indicates the area of ​​exposed wire in contact with air fluid , Indicates heat flow , Indicates the temperature difference between the surface temperature of the bare conductor solid and the ambient temperature of the air fluid ; A thermoelectric analysis system is created in a preset thermoelectric analysis software; in the thermoelectric analysis system, a material model of the exposed wire is created based on the resistivity, the thermal conductivity and the convection heat transfer coefficient; a geometric model corresponding to the material model is constructed using the length and the cross-sectional radius; boundary conditions of the geometric model are set; after using the current as input data of the geometric model and the material model, a temperature cloud map corresponding to the geometric model and the material model is determined; and the temperature cloud map is used as a thermal analysis result; wherein the boundary conditions include end surface voltage and end surface current.

[0025] The exposed wire refers to a wire without a protective layer, the current refers to the current flowing through the exposed wire in a historical period, the cross-sectional radius refers to the bottom radius of the cylinder of the exposed wire, and the thermoelectric analysis software is, for example, ANSYS WORKBENCH.

[0026] Optionally, the process of calculating the resistivity of the bare wire using the resistance, the current, the cross-sectional radius and the length refers to: multiplying the resistance by the cross-sectional area corresponding to the cross-sectional radius to obtain a product result; dividing the product result by the length to obtain the resistivity. Furthermore, the process of measuring the surface temperature and the ambient temperature of the bare wire is implemented by a temperature sensor, the process of creating a thermoelectric analysis system in a preset thermoelectric analysis software is implemented by clicking the "Thermo-Electric Analysis System" item in the ANSYS WORKBENCH, the process of creating a material model of the bare wire is implemented by clicking the "engineering data" item in the ANSYS WORKBENCH, and the process of constructing a geometric model corresponding to the material model is implemented by clicking the ANSYS The process of setting the boundary conditions of the geometric model refers to setting the end voltage and end current on the bare wire, the end voltage refers to the end point experienced by the bare wire when the voltage flows through it and the voltage with a value of 0 at the end point, the end current refers to the starting point experienced by the bare wire when the current flows through it and the current value input at the starting point, and the temperature cloud map corresponding to the geometric model and the material model is determined by calculating and analyzing the temperature data of the surface of the constructed bare wire model by using the "solve" in the ANSYS WORKBENCH.

[0027] Furthermore, an embodiment of the present invention analyzes the waiting time required for each current module to be connected to the flexible circuit board in turn by analyzing the data processing time of the data processor on the module to be processed. The longer the waiting time, the longer the flexible circuit board needs to process the previous module and will not quickly call the current module for processing. In other words, the flexible circuit board will not frequently switch between the previous module and the current module. In this way, the combination of the previous module and the current module can be selected as the subsequent target module, because this can reduce the number of times the flexible circuit board bends in different forms due to switching between different modules, thereby extending the service life of the flexible circuit board.

[0028] In one embodiment of the present invention, the analyzing the data processing time of the data processor for the module to be processed includes: querying the single module time of the data processor for the module to be processed; obtaining the module processing order of the data processor for the module to be processed; and calculating the data processing time of the data processor for the module to be processed according to the single module time and the module processing order using the following formula: in, Indicates the data processing time. Indicates the first The number of pending modules to wait for The single module duration of the modules to be processed, n represents the number of modules to be processed.

[0029] The single module duration refers to the duration of data communication and data connection between the data processor and a single module to be processed in the modules to be processed. The module processing order refers to the order in which the data processor sequentially schedules the modules to be processed and sequentially processes the modules to be processed. For example, a single module to be processed in the modules to be processed includes A (cleaning function), B detection function, and C (movement function). If the data processor sequentially runs A, B, and C, the order of A, B, and C is the module processing order. The actual value is The single module duration of the modules to be processed.

[0030] S2. Based on the thermal analysis results and the data processing time, select a target device, a target module and a target processor from the household appliance, the module to be processed and the data processor, install the target processor on a preset flexible board, and obtain a flexible circuit board, wherein the flexible circuit board includes a device connection end and a module connection end.

[0031] The embodiment of the present invention selects a target device, a target module and a target processor from the household appliance, the module to be processed and the data processor based on the thermal analysis result and the data processing time, so as to select a functional module in the same device with low heat and long data processing time.

[0032] It should be noted that the target module and the target processor need to be in the same target device.

[0033] In one embodiment of the present invention, the target device, target module and target processor are selected from the household appliances, the modules to be processed and the data processor based on the thermal analysis results and the data processing time, including: setting a temperature threshold of the thermal analysis results and a time threshold of the data processing time; identifying the maximum temperature in the thermal analysis results; when the maximum temperature is lower than the temperature threshold and the data processing time is greater than the time threshold, obtaining the household appliances, modules to be processed and data processors corresponding to the thermal analysis results and the data processing time, and obtaining the target device, target module and target processor.

[0034] Among them, the temperature threshold is used to screen target devices, target modules and target processors with low temperatures, and the duration threshold is used to screen target devices, target modules and target processors with long durations. It should be noted that the temperature threshold and duration threshold are obtained based on test data from a large number of actual scenarios, and the values ​​are different in different scenarios, which will not be further elaborated here.

[0035] Optionally, the process of installing the target processor on a preset flexible board to obtain a flexible circuit board refers to attaching wires, electronic components, etc. required for the target processor to the preset flexible board.

[0036] Among them, the preset flexible board is a predecessor of a flexible circuit board without circuit installed, the device connection end refers to the end of the flexible circuit board connected to the magnetic suction device, and the module connection end refers to the end of the flexible circuit board connected to the target module.

[0037] S3. Simulate the installation position of the flexible circuit board in the target device, simulate the bending shape of the flexible circuit board at the installation position relative to the target module, calculate the bending curvature of the bending shape, and select the final position of the flexible circuit board in the installation position according to the bending curvature.

[0038] In the embodiment of the present invention, the installation position refers to any random position in the target device where the flexible circuit board can be placed.

[0039] In one embodiment of the present invention, the simulation of the bending shape of the flexible circuit board with respect to the target module at the installation position includes: connecting the output wire of the flexible circuit board with the receiving wire of the target module; querying the fixed-output distance between the fixed end of the flexible circuit board and the output wire; querying the fixed-receiving distance between the fixed end of the flexible circuit board and the receiving wire; when the fixed-output distance is greater than the fixed-receiving distance, determining that the flexible circuit board needs to be bent when connecting the output wire and the receiving wire; when the flexible circuit board needs to be bent, identifying the bendable space between the flexible circuit board and the target module; and bending the flexible circuit board for a preset number of times within the bendable space to obtain a bending shape.

[0040] Among them, the output wire refers to the wire at the output end of the flexible circuit board, the receiving wire refers to the wire at the data receiving end of the target module, the fixed end of the flexible circuit board refers to the end of the flexible circuit board fixed at the installation position, the fixed-output distance refers to the distance of the path on the flexible circuit board from the fixed end to the output wire, the fixed-receiving distance refers to the straight-line distance between the fixed end and the receiving wire, the bendable space refers to the space area in which the flexible circuit board can be bent and folded in various forms after the flexible circuit board is placed at the installation position, and the preset number of bending times refers to 1 time, that is, only one position of the flexible circuit board is bent, and multiple positions of the flexible circuit board are not bent (bending multiple positions requires multiple bendings).

[0041] Furthermore, the embodiment of the present invention calculates the bending curvature of the bending shape to evaluate the bending degree of the flexible circuit board at a random installation position by using the bending curvature, so as to select the installation positions that minimize the bending degree.

[0042] In one embodiment of the present invention, the calculating of the curvature of the curved shape includes: meshing the curved surface corresponding to the curved shape to obtain a mesh; extracting the mesh center point of the mesh; and calculating the mesh curvature of the mesh according to the mesh center point using the following formula: in, represents the mesh curvature, represents the normal vector perpendicular to the tangent plane at the center point of the mesh, represents the tangent vector of the tangent plane at the center point of the grid, represents the independent variable, express The second-order derivative of express The first derivative of express The curvature in the direction, hour is the maximum curvature, hour is the maximum curvature, express The differential of express The differential of , Represents mutually orthogonal vectors on the tangent plane at the center point of the grid; According to the grid curvature, the curvature of the curved shape is calculated using the following formula: in, represents the bending curvature, Indicates The curvature of the mesh of the mesh, Indicates the number of grid divisions.

[0043] The divided grids refer to a plurality of rectangular grids of the same size obtained after the curved surface is divided.

[0044] Optionally, the process of selecting the final position of the flexible circuit board in the installation position through the bending curvature can be carried out by selecting the installation position corresponding to the minimum bending curvature as the final position, or setting a threshold of the bending curvature and taking the installation position corresponding to the bending curvature below the threshold as the final position.

[0045] S4. After installing the flexible circuit board at the final position, configure a magnetic device for the flexible circuit board, connect the device connection end of the flexible circuit board to the magnetic device, and receive control information sent by the user in the smart home environment in the flexible circuit board.

[0046] The embodiment of the present invention configures a magnetic attraction device for the flexible circuit board, so that the flexible circuit board can use the magnetic attraction device to disconnect the communication connection with the target module and communicate with other target modules when there is no need to communicate or process data with the target module, thereby releasing the communication connection between the flexible circuit board and the idle device.

[0047] In one embodiment of the present invention, the magnetic attraction device configured for the flexible circuit board includes: obtaining a target module; constructing a magnet loop between each target module based on the module processing order corresponding to the target module; obtaining a spare magnet corresponding to the magnet loop; configuring a sliding control device when the spare magnet slides on the magnet loop; and calculating the adsorption force of the spare magnet on the flexible circuit board using the following formula: Where F represents the adsorption force, represents the vacuum magnetic permeability, V represents the magnetic energy volume of the spare magnet, M represents the magnetic moment of the spare magnet, and d represents the distance between the spare magnet and the exposed wire of the flexible circuit board; When the adsorption force is less than the traction force of the sliding control device on the magnet, a target magnet on the magnet loop is selected from the spare magnets; after the target magnet is installed on the magnet loop, the magnet loop on which the target magnet is installed and the sliding control device are used as magnetic attraction devices for the flexible circuit board.

[0048] Among them, the spare magnet refers to a magnet of different materials, and the sliding control device is used to receive information from the flexible circuit board on which target module needs to be connected, and to pull the magnet to slide on the magnet loop through other tools such as a traction rope, and finally slide to the position of the target module. It should be noted that in order to attract the flexible circuit board with the magnet, it is necessary to install a magnetically attracted material, such as an iron block, on the output wire of the flexible circuit board. When there is a magnet on the target module, the magnet will attract the output end of the flexible circuit board to connect with the receiving end of the target module. The traction force refers to the traction force applied to the magnet by the sliding control device when pulling the magnet to slide on the magnet loop, so that the magnet moves from the previous target module to the next target module.

[0049] See also Figure 2 FIG. 1 is a schematic diagram of a magnetic device for implementing the adaptive integration method of the flexible circuit board in a smart home environment provided by an embodiment of the present invention. Figure 2 , 1 represents the first target module in the module processing order corresponding to the target module, 2 represents the second target module, 3 represents the third target module, 4 represents a magnet, 5 represents a flexible circuit board, 6 represents a fixed end of the flexible circuit board. It should be noted that the fixed end is connected to both the installation position and the traction control center of the sliding control device. Therefore, the fixed end of the flexible circuit board is also the device connection end, 7 represents a magnet loop, 4 can slide on 7, and thus flow through 1, 2, and 3 in sequence.

[0050] S5. Analyze the control target and control operation corresponding to the control information in the flexible circuit board, and based on the control target, notify the magnetic attraction device to control the module connection end of the flexible circuit board to connect with the target module, and then use the control operation to instruct the flexible circuit board to adaptively integrate the target module to obtain an adaptive integration result.

[0051] Optionally, the process of analyzing the control target and control operation corresponding to the control information in the flexible circuit board refers to using the data processing center in the flexible circuit board to analyze which target module of the device the user wants to manipulate (control target) and the content of the manipulation (control operation). For example, in the process of viewing the data collected by the sensor of the smart sweeping robot, the control target is the sensor module of the smart sweeping robot, and the control operation is data return, that is, returning the environmental data collected by the sensor to the flexible circuit board.

[0052] In one embodiment of the present invention, based on the control target, notifying the magnetic attraction device to control the module connection end of the flexible circuit board to connect with the target module includes: obtaining the magnet loop and the sliding control device in which the target magnet is installed in the magnetic attraction device; transmitting the control target to the sliding control device; comparing in the sliding control device whether the control target is consistent with the current target corresponding to the target magnet; when the control target is consistent with the current target corresponding to the target magnet, connecting the module connection end of the flexible circuit board to the target module by using the target magnet; when the control target is inconsistent with the current target corresponding to the target magnet, querying in the sliding control device the relative position of the control target relative to the current target; using the sliding control device to pull the target magnet to slide on the magnet loop to the relative position; at the relative position, connecting the module connection end of the flexible circuit board to the target module by using the target magnet.

[0053] The relative position refers to the position of the control target relative to the current target on the magnet loop.

[0054] In one embodiment of the present invention, the use of the control operation to instruct the flexible circuit board to adaptively integrate the target module to obtain an adaptive integration result includes: transmitting the control operation from the flexible circuit board to the target module; receiving the control operation in the target module; running the module function in the target module according to the control operation; returning the operating data of the target module about the module function to the flexible circuit board to complete the adaptive integration of the target module by the flexible circuit board to obtain an adaptive integration result.

[0055] Compared with the problem described in the background technology, the embodiment of the present invention performs thermal analysis between the module to be processed and the data processor to analyze the heat condition of the wire caused by the current flowing when the module to be processed and the data processor are connected through exposed wires, so as to avoid the safety hazard caused by excessive heat of the wire. Furthermore, the embodiment of the present invention analyzes the data processing time of the data processor on the module to be processed to analyze the waiting time before each current module is connected to the flexible circuit board in turn. The longer the waiting time, the longer the flexible circuit board needs to process the previous module and will not quickly call the current module for processing. In other words, the flexible circuit board will not frequently switch between the previous module and the current module. Therefore, the combination of the previous module and the current module can be selected as the subsequent target module, because this can reduce the different forms of the flexible circuit board due to switching between different modules. The number of bendings can extend the service life of the flexible circuit board. The embodiment of the present invention selects the target device, target module and target processor from the household device, the module to be processed and the data processor based on the thermal analysis result and the data processing time, so as to select the functional module in the same device with low heat and long data processing time. Furthermore, the embodiment of the present invention calculates the bending curvature of the bending shape to use the bending curvature to evaluate the bending degree of the flexible circuit board at a random installation position, so as to select the installation positions that minimize the bending degree. The embodiment of the present invention configures the magnetic suction device of the flexible circuit board, so as to use the magnetic suction device to make the flexible circuit board disconnect the communication connection with the target module when it does not need to communicate with the target module and process data, and communicate with other target modules, so as to release the communication connection between the flexible circuit board and the idle device. Therefore, the adaptive integration method of the flexible circuit board in the smart home environment provided by the embodiment of the present invention can release the communication connection between the flexible circuit board and the idle device.

[0056] Embodiment 2: like Figure 2 The figure shows a functional module diagram of an adaptive integrated system of a flexible circuit board in a smart home environment according to the present invention.

[0057] The adaptive integration system 300 of a flexible circuit board in a smart home environment described in the present invention can be installed in an electronic device. According to the functions implemented, the adaptive integration system of the flexible circuit board in the smart home environment can include a duration analysis module 301, a processor installation module 302, a location selection module 303, an information receiving module 304 and an adaptive integration module 305. The module described in the present invention can also be called a unit, which refers to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, which are stored in the memory of the electronic device.

[0058] In the embodiment of the present invention, the functions of each module / unit are as follows: The duration analysis module 301 is used to query the home appliances in the smart home environment, divide the modules to be processed and the data processors of the home appliances, perform thermal analysis between the modules to be processed and the data processors, obtain thermal analysis results, and analyze the data processing duration of the modules to be processed by the data processors; The processor installation module 302 is used to select a target device, a target module and a target processor from the household device, the module to be processed and the data processor based on the thermal analysis result and the data processing time, and install the target processor on a preset flexible board to obtain a flexible circuit board, wherein the flexible circuit board includes a device connection end and a module connection end; The position selection module 303 is used to simulate the installation position of the flexible circuit board in the target device, simulate the bending shape of the flexible circuit board with respect to the target module at the installation position, calculate the bending curvature of the bending shape, and select the final position of the flexible circuit board in the installation position according to the bending curvature; The information receiving module 304 is used to configure a magnetic device of the flexible circuit board after installing the flexible circuit board at the final position, connect the device connection end of the flexible circuit board to the magnetic device, and receive control information sent by the user in the smart home environment in the flexible circuit board; The adaptive integration module 305 is used to analyze the control target and control operation corresponding to the control information in the flexible circuit board, and based on the control target, notify the magnetic attraction device to control the module connection end of the flexible circuit board to connect with the target module, and then use the control operation to instruct the flexible circuit board to adaptively integrate the target module to obtain an adaptive integration result.

[0059] In detail, the modules in the adaptive integrated system 200 of the flexible circuit board in the smart home environment in the embodiment of the present invention are used in the same manner as described above. Figure 1 The adaptive integration method of flexible circuit boards in smart home environments described in the specification has the same technical means and can produce the same technical effects, which will not be repeated here.

[0060] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A method for adaptive integration of flexible circuit boards in a smart home environment, characterized in that: The method comprises: Querying home appliances in a smart home environment, dividing the home appliances into modules to be processed and data processors, performing thermal analysis between the modules to be processed and the data processors, obtaining thermal analysis results, and analyzing the data processing time of the data processors on the modules to be processed; Based on the thermal analysis result and the data processing time, a target device, a target module and a target processor are selected from the household device, the module to be processed and the data processor, and the target processor is installed on a preset flexible board to obtain a flexible circuit board, wherein the flexible circuit board includes a device connection end and a module connection end; Simulating the installation position of the flexible circuit board in the target device, simulating the bending shape of the flexible circuit board at the installation position with respect to the target module, calculating the bending curvature of the bending shape, and selecting the final position of the flexible circuit board at the installation position according to the bending curvature; After the flexible circuit board is installed at the final position, a magnetic device of the flexible circuit board is configured, and after the device connection end of the flexible circuit board is connected to the magnetic device, control information sent by the user in the smart home environment is received in the flexible circuit board; The control target and control operation corresponding to the control information are analyzed in the flexible circuit board. Based on the control target, the magnetic attraction device is notified to control the module connection end of the flexible circuit board to connect with the target module. Then, the control operation is used to instruct the flexible circuit board to adaptively integrate the target module to obtain an adaptive integration result.

2. The method for adaptively integrating a flexible circuit board in a smart home environment as claimed in claim 1, characterized in that: The step of performing thermal analysis between the module to be processed and the data processor to obtain a thermal analysis result includes: Obtaining a connecting wire between the module to be processed and the data processor; Cutting off the exposed wires in the connecting wires; Query the resistance, current, length, and cross-sectional radius of the exposed wire; Calculating the resistivity of the exposed wire using the resistance, the current, the cross-sectional radius and the length; measuring the surface temperature of the exposed wire and the ambient temperature; Calculating the thermal conductivity of the exposed wire according to the length, the cross-sectional radius and the surface temperature; Calculating the convection heat transfer coefficient of the exposed wire according to the surface temperature and the ambient temperature; Create a thermoelectric analysis system in the preset thermoelectric analysis software; In the thermoelectric analysis system, a material model of the exposed wire is created based on the resistivity, the thermal conductivity and the convection heat transfer coefficient; constructing a geometric model corresponding to the material model using the length and the cross-sectional radius; Setting boundary conditions of the geometric model; After taking the current as input data of the geometric model and the material model, determining a temperature cloud map corresponding to the geometric model and the material model; Taking the temperature cloud map as a thermal analysis result; The boundary conditions include end surface voltage and end surface current.

3. The method for adaptively integrating a flexible circuit board in a smart home environment as claimed in claim 1, characterized in that: The analyzing the data processing time of the data processor on the module to be processed includes: querying the data processor about the single module duration of the module to be processed; Obtaining a module processing order of the data processor with respect to the module to be processed; According to the single module duration and the module processing order, the data processing duration of the data processor for the module to be processed is calculated using the following formula: in, Indicates the data processing time. Indicates the first The pending modules need to wait for The single module duration of the modules to be processed, n represents the number of modules to be processed.

4. The method for adaptively integrating a flexible circuit board in a smart home environment as claimed in claim 1, characterized in that: The selecting a target device, a target module and a target processor from the household device, the module to be processed and the data processor based on the thermal analysis result and the data processing time includes: Setting a temperature threshold of the thermal analysis result and a duration threshold of the data processing duration; identifying a maximum temperature in the thermal analysis results; When the maximum temperature is lower than the temperature threshold and the data processing time is greater than the time threshold, the household equipment, the module to be processed and the data processor corresponding to the thermal analysis result and the data processing time are obtained to obtain the target device, the target module and the target processor.

5. The method for adaptively integrating a flexible circuit board in a smart home environment as claimed in claim 1, characterized in that: The simulating a bending state of the flexible circuit board at the installation position with respect to the target module includes: Connecting the output wire of the flexible circuit board to the receiving wire of the target module; querying a fixed-output distance between a fixed end of the flexible circuit board and the output wire; querying a fixing-receiving distance between a fixing end of the flexible circuit board and the receiving wire; When the fixed-output distance is greater than the fixed-receiving distance, determining that the flexible printed circuit board needs to be bent when connecting the output wire and the receiving wire; When the flexible circuit board needs to be bent, identifying a bendable space between the flexible circuit board and the target module; The flexible circuit board is bent for a preset number of times in the bendable space to obtain a bent shape.

6. The method for adaptively integrating a flexible circuit board in a smart home environment as claimed in claim 1, characterized in that: The calculating the curvature of the curved shape comprises: Meshing the curved surface corresponding to the curved shape to obtain a mesh; Extracting the center point of the grid divided into the grids; Calculating the grid curvature of the divided grid according to the grid center point; The curvature of the curved shape is calculated according to the grid curvature.

7. The method for adaptively integrating a flexible circuit board in a smart home environment as claimed in claim 1, characterized in that: The magnetic attraction device configured with the flexible circuit board includes: Get the target module; Based on the module processing order corresponding to the target modules, a magnet loop is constructed between each target module; Obtaining a spare magnet corresponding to the magnet loop; A sliding control device is provided when the spare magnet slides on the magnet loop; Calculating the adsorption force of the spare magnet on the flexible circuit board; When the adsorption force is less than the traction force of the sliding control device on the magnet, selecting a target magnet on the magnet loop from the spare magnets; After the target magnet is installed on the magnet loop, the magnet loop on which the target magnet is installed and the sliding control device are used as magnetic attraction devices for the flexible circuit board.

8. The method for adaptively integrating a flexible circuit board in a smart home environment as claimed in claim 7, characterized in that: The calculating the adsorption force of the spare magnet on the flexible circuit board includes: The adsorption force of the spare magnet on the flexible circuit board is calculated using the following formula: Where F represents the adsorption force, represents the magnetic permeability of vacuum, V represents the magnetic energy volume of the spare magnet, M represents the magnetic moment of the spare magnet, and d represents the distance between the spare magnet and the exposed wire of the flexible circuit board.

9. The method for adaptively integrating a flexible circuit board in a smart home environment as claimed in claim 1, characterized in that: The method of notifying the magnetic attraction device to control the module connection end of the flexible circuit board to connect with the target module based on the control target includes: Obtaining a magnet loop and a sliding control device for installing a target magnet in the magnetic attraction device; transmitting the control target to the sliding control device; comparing, in the sliding control device, whether the control target is consistent with a current target corresponding to the target magnet; When the control target is consistent with the current target corresponding to the target magnet, connecting the module connection end of the flexible circuit board with the target module by using the target magnet; When the control target is inconsistent with the current target corresponding to the target magnet, querying the relative position of the control target relative to the current target in the sliding control device; Using the sliding control device to pull the target magnet to slide on the magnet loop to the relative position; At the relative position, the module connection end of the flexible circuit board is connected to the target module using the target magnet.

10. The method for adaptively integrating a flexible circuit board in a smart home environment as claimed in claim 1, characterized in that: The step of using the control operation to instruct the flexible circuit board to adaptively integrate the target module to obtain an adaptive integration result includes: transmitting the control operation from the flexible circuit board to the target module; In the target module, receiving the control operation; According to the control operation, running the module functions in the target module; The operating data of the target module regarding the module function is returned to the flexible circuit board to complete the adaptive integration of the target module by the flexible circuit board and obtain an adaptive integration result.

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