A processing method for combining a soft and hard board and a soft and hard board

Abstract

The invention discloses a processing method for combining a soft and hard board and a soft and hard combined board, the processing method comprising: coating a high temperature resistant glue on the soft and hard bonding area of ​​the soft board; aligning the soft and hard bonding area of ​​the soft board and the soft and hard bonding area of ​​the hard board according to the positioning holes of the soft board and the hard board, and bonding them through the high temperature resistant glue; printing solder paste on the patch pads of the soft board, the patch pads of the hard board, and the pads of the soft and hard bonding areas of the soft board and the hard board at one time; performing a one-time patch on the patch pads of the soft board and the patch pads of the hard board at the same time; completing reflow soldering on the patch pads of the soft board, the patch pads of the hard board, and the pads of the soft and hard bonding areas of the soft board and the hard board at one time; using a glue dispensing process to perform glue dispensing sealing protection on the surface and edge of the soft and hard bonding areas of the soft board and the hard board. Using this processing method, the combination of the soft board and the hard board can be completed with only one patch operation and welding operation.

Description

Technical Field

[0001] The present application belongs to the technical field of circuit board assembly, and specifically refers to a processing method for combining a soft and hard board and a soft and hard board. Background Art

[0002] In the current circuit board assembly and processing technology field, usually after the hard board is soldered or the soft board is soldered, the soft board and the hard board are bonded together. Therefore, multiple bonding operations and multiple welding operations are required, the steps are complicated, the process time is relatively long, and the production efficiency is relatively low. Summary of the invention

[0003] In order to overcome the shortcomings of the prior art, the present application provides a processing method for combining a soft and hard board and a soft and hard combined board, which can complete the combination of the soft board and the hard board with only one patch operation and welding operation.

[0004] The present invention provides a method for processing a combination of a soft and a hard board, the method comprising:

[0005] Apply high temperature resistant glue to the soft and hard bonding area of ​​the soft board;

[0006] Align the soft and hard bonding area of ​​the soft board and the hard board with each other according to the positioning holes, and bond them together using the high temperature resistant glue;

[0007] Solder paste is printed at one time on the patch pads of the flexible board, the patch pads of the rigid board, and the pads of the rigid-flexible bonding area of ​​the flexible board and the rigid board;

[0008] Performing one-time patching on the patch pads of the soft board and the patch pads of the hard board at the same time;

[0009] At the same time, reflow soldering is completed at one time for the patch pads of the soft board, the patch pads of the hard board, and the pads of the soft-hard bonding area of ​​the soft board and the hard board;

[0010] The glue dispensing process is used to perform glue dispensing sealing protection on the surface and edge of the soft-hard bonding area of ​​the soft board and the hard board.

[0011] According to the processing method for combining a soft board with a hard board provided in the present application, the soft board is a flexible circuit board, and the hard board is a printed circuit board.

[0012] According to the processing method for combining a soft and hard board provided in the present application, before the step of coating the high temperature resistant glue on the soft and hard bonding area of ​​the soft board, the method further includes:

[0013] Positioning holes are opened at corresponding positions of the soft-hard bonding area of ​​the soft board and the soft-hard bonding area of ​​the hard board.

[0014] According to the processing method for combining a soft and hard board provided in the present application, the soft and hard bonding area of ​​the soft board is provided with a plurality of soft board pads, the soft and hard bonding area of ​​the hard board is provided with a plurality of hard board pads, and the soft board pads on the soft and hard bonding area of ​​the soft board correspond to the hard board pads on the soft and hard bonding area of ​​the hard board one by one;

[0015] Wherein, a tin penetration hole is arranged on the soft board pad on the soft-hard bonding area of ​​the soft board.

[0016] According to the processing method for combining a soft and hard board provided in the present application, the tin penetration hole is a single elliptical hole or a single circular hole or a plurality of circular holes.

[0017] According to the processing method for combining a soft and hard board provided in the present application, the step of coating the soft and hard bonding area of ​​the soft board with a high temperature resistant adhesive comprises:

[0018] Coating a layer of high temperature resistant glue on the soft and hard bonding area of ​​the soft board;

[0019] The high temperature resistant glue on the soft board pads in the soft and hard bonding area of ​​the soft board is removed, and only the high temperature resistant glue around the soft board pads in the soft and hard bonding area of ​​the soft board is retained.

[0020] According to the processing method for combining a soft and hard board provided in the present application, the step of coating the high temperature resistant glue on the soft and hard bonding area of ​​the soft board is:

[0021] The high temperature resistant glue is applied around the soft board pads in the soft and hard bonding area of ​​the soft board by the glue dispensing process to prevent the high temperature resistant glue from being applied on the soft board pads in the soft and hard bonding area of ​​the soft board.

[0022] According to the processing method for combining a soft and hard board provided in the present application, the area of ​​the soft board pad on the soft-hard bonding area of ​​the soft board is smaller than the area of ​​the hard board pad on the soft-hard bonding area of ​​the hard board.

[0023] According to the processing method for combining a soft and hard board provided in the present application, the step of printing solder paste on the patch pads of the soft board, the patch pads of the hard board, and the pads of the soft and hard bonding areas of the soft board and the hard board at one time includes:

[0024] Applying solder paste on the patch pad of the flexible circuit board;

[0025] Applying solder paste on the patch pad of the rigid board;

[0026] In the soft-hard bonding area of ​​the soft board and the hard board, injecting solder paste through the soldering holes on the soft board pads in the soft-hard bonding area of ​​the soft board;

[0027] Through the polyimide films on both sides of the soft board pads in the soft and hard bonding area of ​​the soft board, detect whether the hard board pads in the soft and hard bonding area of ​​the hard board below the soft board pads in the soft and hard bonding area of ​​the soft board are tinned;

[0028] If the tin creeping phenomenon occurs, the hard board pads in the hard-soft bonding area of ​​the hard board are subjected to tin creeping treatment.

[0029] The present application also provides a hard-soft combined board processed based on the hard-soft combined board processing method provided in the present application, wherein the hard-soft combined board comprises a soft board and a hard board, and the hard-soft bonding area of ​​the soft board and the hard-soft bonding area of ​​the hard board are bonded by high temperature resistant glue;

[0030] The soft-hard bonding area of ​​the soft board is provided with a plurality of soft board pads, the soft-hard bonding area of ​​the hard board is provided with a plurality of hard board pads, and the soft board pads on the soft-hard bonding area of ​​the soft board correspond to the hard board pads on the soft-hard bonding area of ​​the hard board one by one; the area of ​​the soft board pads on the soft-hard bonding area of ​​the soft board is smaller than the area of ​​the hard board pads on the soft-hard bonding area of ​​the hard board; a high temperature resistant adhesive layer is formed around the soft board pads to separate the soft board pads and avoid creepage between the soft board pads;

[0031] A tin penetration hole is provided on the soft board pad on the soft-hard bonding area of ​​the soft board, and solder paste is injected through the tin penetration hole to weld the soft board pad and the hard board pad; wherein the tin penetration hole is a single elliptical hole or a single circular hole or multiple circular holes.

[0032] The beneficial effects of the present invention are as follows: according to the processing method for combining soft and hard boards provided in this application, the patching and welding of the devices of the soft board, the patching and welding of the devices of the hard board, and the bonding welding of the soft board and the hard board are all completed at one time, which can effectively reduce the production process and greatly shorten the production cycle. The bonding welding of the soft board and the hard board adopts the reflow soldering process, which is mature and stable, has a high yield rate, and does not require additional welding equipment. A high-temperature resistant adhesive layer is coated around the pads of the welding area of ​​the soft board and the hard board, which can effectively prevent water vapor from invading the welding area of ​​the soft board and the hard board. At the same time, the high-temperature resistant adhesive layer can also physically separate the pads, thereby avoiding the formation of gap creepage between the pads and increasing the electrical strength of the welding area of ​​the soft board and the hard board. Insulating glue is also used to cover the welding area of ​​the soft board and the hard board for protection, and the surface of the welding area of ​​the soft board and the hard board is insulated and protected, and the effects of moisture-proof, dust-proof and anti-fouling can also be achieved. The soft and hard board produced by the processing method for combining soft and hard boards provided in this application also has the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0034] Figure 1 A schematic flow chart of the method for processing a combination of a soft and hard board provided in this application.

[0035] Figure 2 This is a schematic diagram of the structures of the soft board and the hard board in the soft and hard board combined processing method provided in this application.

[0036] Figure 3 This is a schematic diagram of the structure of the soft board pad and the hard board pad in the soft and hard board combination processing method provided in this application.

[0037] Figure 4 This is a cross-sectional view of the combination of a soft and hard board in the processing method of combining a soft and hard board provided in this application.

[0038] Figure 5 This is a schematic diagram of the structure of the tin penetration hole of the soft board pad in the soft and hard board combination processing method provided in this application.

[0039] Figure 6 This is a schematic diagram of the structures of the soft board patch and the hard board patch in the soft and hard board combined processing method provided in this application. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0041] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0042] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0043] The present invention will now be further described with reference to the accompanying drawings and specific implementation methods.

[0044] Figure 1 A schematic flow chart of the method for processing a rigid-flex board combined with a flexible board provided in this embodiment.

[0045] like Figure 1 As shown, the processing method for combining a soft and hard board provided in this embodiment includes:

[0046] S1. Apply high temperature resistant glue on the soft and hard bonding area of ​​the soft board;

[0047] S2, aligning the soft and hard bonding area of ​​the soft board and the soft and hard bonding area of ​​the hard board according to the positioning holes, and bonding them with the high temperature resistant glue;

[0048] S3, printing solder paste on the patch pads of the flexible board, the patch pads of the rigid board, and the pads of the rigid-soft bonding area of ​​the flexible board and the rigid board at one time;

[0049] S4, performing one-time patching on the patch pads of the flexible board and the patch pads of the rigid board at the same time;

[0050] S5, simultaneously completing reflow soldering of the patch pads of the soft board, the patch pads of the hard board, and the pads of the soft-hard bonding area of ​​the soft board and the hard board;

[0051] S6. Use a glue dispensing process to perform glue dispensing sealing protection on the surface and edge of the soft-hard bonding area of ​​the soft board and the hard board.

[0052] In the present application, the soft board may be a flexible printed circuit board (FPC), and the hard board may be a printed circuit board (PCB). Alternatively, the soft board may be other flexible soft boards, and the hard board may be other hard boards, which are not limited here.

[0053] Specifically, Figure 2-Figure 6 As shown, in one embodiment, before the step of coating the high temperature resistant glue on the soft and hard bonding area of ​​the soft board, the method further includes:

[0054] S0. Positioning holes are opened at corresponding positions of the soft-hard bonding area of ​​the soft board and the soft-hard bonding area of ​​the hard board.

[0055] There are two or three positioning holes, and different numbers of positioning holes can match the hard board and the soft board of different lengths for bonding. The positioning holes on the soft board and the positioning holes on the hard board can be punched simultaneously or separately.

[0056] In another embodiment, the step S1 of coating the high temperature resistant adhesive on the soft and hard bonding area of ​​the soft board specifically includes:

[0057] S11, coating a layer of high temperature resistant glue on the soft and hard bonding area of ​​the soft board;

[0058] S12, removing the high temperature resistant glue on the soft board pads in the soft and hard bonding area of ​​the soft board, and only retaining the high temperature resistant glue around the soft board pads in the soft and hard bonding area of ​​the soft board.

[0059] Or in another embodiment, the step S1, coating the high temperature resistant glue on the soft and hard bonding area of ​​the soft board, is as follows:

[0060] S11, coating high temperature resistant glue around the soft board pads in the hard-soft bonding area of ​​the soft board by using a glue dispensing process to prevent the high temperature resistant glue from being coated on the soft board pads in the hard-soft bonding area of ​​the soft board.

[0061] That is, by coating the high temperature resistant glue around the soft board pads in the soft and hard bonding area of ​​the soft board, a high temperature resistant glue layer is formed around the soft board pads, thereby isolating the soft board pads in the soft and hard bonding area of ​​the soft board. The high temperature resistant glue needs to be removed from the soft board pads to prevent the high temperature resistant glue from affecting the welding quality of the soft board pads and avoiding desoldering. It can effectively prevent water vapor from invading the welding area of ​​the soft board and the hard board; at the same time, the high temperature resistant glue layer can also physically separate the pads, thereby avoiding the formation of gap creepage between the pads and increasing the electrical strength of the welding area of ​​the soft board and the hard board.

[0062] Specifically, Figure 2As shown, in the processing method for combining a soft board and a hard board provided in this embodiment, the upper left area of ​​the soft board is the soft and hard bonding area of ​​the soft board. The lower right area of ​​the hard board is the soft and hard bonding area of ​​the hard board. A plurality of soft board pads are arranged in the soft and hard bonding area of ​​the soft board, and a plurality of hard board pads are arranged in the soft and hard bonding area of ​​the hard board, and the soft board pads on the soft and hard bonding area of ​​the soft board correspond to the hard board pads on the soft and hard bonding area of ​​the hard board. The soft board pads and the hard board pads are both arranged between the positioning holes.

[0063] like Figure 3 As shown, the area of ​​the soft board pad on the soft-hard bonding area of ​​the soft board is smaller than the area of ​​the hard board pad on the soft-hard bonding area of ​​the hard board. The soft board pads on the soft-hard bonding area of ​​the soft board are all provided with tin penetration holes. Preferably, the length and width of the hard board pad can be 0.5mm to 1mm larger than the length and width of the soft board pad.

[0064] like Figure 4 As shown, the part of the hard board pad that is larger than the soft board pad can be used as the tin creeping area. And after the welding is completed, the polyimide film on both sides of the soft board pad in the soft and hard bonding area of ​​the soft board can be used to detect whether there is tin creeping on the hard board pad in the soft and hard bonding area of ​​the hard board below the soft board pad in the soft and hard bonding area of ​​the soft board to confirm the welding quality.

[0065] like Figure 5 As shown, the tin penetration hole can be an elliptical hole, and the size of the elliptical hole is preferably 0.2mm to 0.8mm in short axis width and 0.5mm to 2mm in long axis width. The tin penetration hole can also be one circular hole or multiple circular holes or multiple elliptical holes.

[0066] like Figure 4 and Figure 6 As shown, in another embodiment, the step S3, printing solder paste on the patch pads of the soft board, the patch pads of the hard board, and the pads of the soft-hard bonding area of ​​the soft board and the hard board at one time specifically includes:

[0067] S31, coating solder paste on the patch pad of the flexible circuit board;

[0068] S32, coating solder paste on the patch pad of the rigid board;

[0069] S33, injecting solder paste into the hard-soft bonding area of ​​the soft board and the hard board through the soldering holes on the soft board pads in the hard-soft bonding area of ​​the soft board;

[0070] S34, detecting whether the hard board pads in the hard-soft bonding area of ​​the hard board below the soft board pads in the hard-soft bonding area of ​​the soft board have solder creep through the polyimide films on both sides of the soft board pads in the hard-soft bonding area of ​​the soft board.

[0071] Specifically, since solder paste is printed on the patch pads of the flexible board and the patch pads of the rigid board at the same time, the components of the flexible board and the components of the rigid board can be patched on the patch pads of the flexible board and the patch pads of the rigid board respectively at the same time. The flexible board and the rigid board are patched at one time, which can improve the patch efficiency of the flexible board and the rigid board and save the process flow and time.

[0072] And printed solder paste is injected through the tin infiltration holes to fill the solder paste between the soft-hard bonding area of ​​the soft board and the soft-hard bonding area of ​​the hard board, and the polyimide film on both sides of the soft board pads in the soft-hard bonding area of ​​the soft board can be used to detect whether tin is creeping on the hard board pads in the soft-hard bonding area of ​​the hard board below the soft board pads in the soft-hard bonding area of ​​the soft board.

[0073] Since solder paste is printed on the patch pads of the soft board and the patch pads of the hard board at the same time, the components of the soft board and the components of the hard board can be patched on the patch pads of the soft board and the patch pads of the hard board respectively at the same time. The soft board and the hard board are patched at one time, which can improve the patch efficiency of the soft board and the hard board and save the process flow and time.

[0074] like Figure 2-Figure 6 As shown, the present application also provides a hard-soft combined board processed by the hard-soft combined board processing method provided in the application, the hard-soft combined board includes a soft board and a hard board, the upper left area of ​​the soft board is the hard-soft bonding area of ​​the soft board. The lower right area of ​​the hard board is the hard-soft bonding area of ​​the hard board. The hard-soft bonding area of ​​the soft board and the hard-soft bonding area of ​​the hard board are bonded by high temperature resistant glue.

[0075] The soft-hard bonding area of ​​the soft board is provided with a plurality of soft board pads, and the soft-hard bonding area of ​​the hard board is provided with a plurality of hard board pads, and the soft board pads on the soft-hard bonding area of ​​the soft board correspond to the hard board pads on the soft-hard bonding area of ​​the hard board. In addition, a high temperature resistant adhesive layer is formed around the soft board pads to separate the soft board pads and avoid creepage between the soft board pads.

[0076] like Figure 3 and Figure 4As shown, the area of ​​the soft board pad on the hard-soft bonding area of ​​the soft board is smaller than the area of ​​the hard board pad on the hard-soft bonding area of ​​the hard board. Preferably, the length and width of the hard board pad may be 0.5mm to 1mm larger than the length and width of the soft board pad. The portion of the hard board pad that is larger than the soft board pad can be used as a tin creeping area. And after the welding is completed, the polyimide film on both sides of the soft board pad in the hard-soft bonding area of ​​the soft board can be used to detect whether there is tin creeping on the hard board pad in the hard-soft bonding area of ​​the hard board below the soft board pad in the hard-soft bonding area of ​​the soft board to confirm the welding quality.

[0077] like Figure 5 As shown, a tin infiltration hole is provided on the soft board pad on the soft-hard bonding area of ​​the soft board, and solder paste is injected through the tin infiltration hole to weld the soft board pad and the hard board pad. The tin infiltration hole can be an elliptical hole, and the size of the elliptical hole is preferably 0.2mm to 0.8mm in short axis width and 0.5mm to 2mm in long axis width. The tin infiltration hole can also be one circular hole or multiple circular holes or multiple elliptical holes.

[0078] According to the processing method of the combination of soft and hard boards provided in this application, the patch and welding of the devices of the soft board, the patch and welding of the devices of the hard board, and the bonding welding of the soft board and the hard board are all completed at one time, which can effectively reduce the production process and greatly shorten the production cycle. The reflow soldering process is used for the bonding welding of the soft board and the hard board. The process is mature and stable, with a high yield rate, and no additional welding equipment is required. A high-temperature resistant adhesive layer is coated around the pads of the welding area of ​​the soft board and the hard board, which can effectively prevent water vapor from invading the welding area of ​​the soft board and the hard board. At the same time, the high-temperature resistant adhesive layer can also physically separate the pads, thereby avoiding the formation of gap creepage between the pads and increasing the electrical strength of the welding area of ​​the soft board and the hard board. Insulating glue is also used to cover the welding area of ​​the soft board and the hard board for protection, and the surface of the welding area of ​​the soft board and the hard board is insulated and protected, and moisture-proof, dust-proof and anti-fouling effects can also be achieved. The soft and hard board produced by the processing method of the combination of soft and hard boards provided in this application also has the above advantages.

[0079] Although the preferred embodiments of the embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they are aware of the basic creative concepts. Therefore, the attached claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention. Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or terminal device including a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0080] The above is a detailed introduction to a processing method for combining a soft and hard board and a soft and hard board provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of ​​the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the present application.

Claims

1. A method for processing a combination of a soft and hard board, characterized in that: The processing method for combining a soft and hard board includes: Apply high temperature resistant glue to the soft and hard bonding area of ​​the soft board; Align the soft and hard bonding area of ​​the soft board and the hard board with each other according to the positioning holes, and bond them together using the high temperature resistant glue; Solder paste is printed at one time on the patch pads of the flexible board, the patch pads of the rigid board, and the pads of the rigid-flexible bonding area of ​​the flexible board and the rigid board; Performing one-time patching on the patch pads of the soft board and the patch pads of the hard board at the same time; At the same time, reflow soldering is completed at one time for the patch pads of the soft board, the patch pads of the hard board, and the pads of the soft-hard bonding area of ​​the soft board and the hard board; The glue dispensing process is used to perform glue dispensing sealing protection on the surface and edge of the soft-hard bonding area of ​​the soft board and the hard board.

2. The method for processing a combination of a soft and a hard board according to claim 1, characterized in that: The soft board is a flexible circuit board, and the hard board is a printed circuit board.

3. The method for processing a combination of a soft and a hard board according to claim 1, characterized in that: Before the step of coating the high temperature resistant adhesive on the soft and hard bonding area of ​​the soft board, the method further includes: Positioning holes are opened at corresponding positions of the soft-hard bonding area of ​​the soft board and the soft-hard bonding area of ​​the hard board.

4. The method for processing a combination of a soft and a hard board according to claim 1, characterized in that: The soft-hard bonding area of ​​the soft board is provided with a plurality of soft board pads, and the soft-hard bonding area of ​​the hard board is provided with a plurality of hard board pads, and the soft board pads on the soft-hard bonding area of ​​the soft board correspond to the hard board pads on the soft-hard bonding area of ​​the hard board one by one; Wherein, a tin penetration hole is arranged on the soft board pad on the soft-hard bonding area of ​​the soft board.

5. The method for processing a combination of a soft and a hard board according to claim 4, characterized in that: The tin penetration hole is a single elliptical hole or a single circular hole or a plurality of circular holes.

6. The method for processing a combination of a soft and a hard board according to claim 4, characterized in that: The step of coating the high temperature resistant adhesive on the soft and hard bonding area of ​​the soft board comprises: Coating a layer of high temperature resistant glue on the soft and hard bonding area of ​​the soft board; The high temperature resistant glue on the soft board pads in the soft and hard bonding area of ​​the soft board is removed, and only the high temperature resistant glue around the soft board pads in the soft and hard bonding area of ​​the soft board is retained.

7. The method for processing a combination of a soft and a hard board according to claim 4, characterized in that: The step of coating the high temperature resistant glue on the soft and hard bonding area of ​​the soft board is: The high temperature resistant glue is applied around the soft board pads in the soft and hard bonding area of ​​the soft board by the glue dispensing process to prevent the high temperature resistant glue from being applied on the soft board pads in the soft and hard bonding area of ​​the soft board.

8. The method for processing a combination of a soft and a hard board according to claim 4, characterized in that: The area of ​​the soft board pad on the soft-hard bonding area of ​​the soft board is smaller than the area of ​​the hard board pad on the soft-hard bonding area of ​​the hard board.

9. The method for processing a combination of a soft and a hard board according to claim 8, characterized in that: The step of printing solder paste on the patch pads of the soft board, the patch pads of the hard board, and the pads of the soft-hard bonding area of ​​the soft board and the hard board at one time comprises: Applying solder paste on the patch pad of the flexible circuit board; Applying solder paste on the patch pad of the rigid board; In the soft-hard bonding area of ​​the soft board and the hard board, injecting solder paste through the soldering holes on the soft board pads in the soft-hard bonding area of ​​the soft board; Whether the hard board pads in the hard and soft bonding area of ​​the hard board below the soft board pads in the hard and soft bonding area of ​​the soft board are soldered is detected through the polyimide films on both sides of the soft board pads in the hard and soft bonding area of ​​the soft board.

10. A hard-flex board processed by the hard-flex board processing method according to any one of claims 1 to 9, characterized in that: The hard-flex board comprises a soft board and a hard board, and the hard-flex bonding area of ​​the soft board and the hard-flex bonding area of ​​the hard board are bonded by high temperature resistant glue; The soft-hard bonding area of ​​the soft board is provided with a plurality of soft board pads, the soft-hard bonding area of ​​the hard board is provided with a plurality of hard board pads, and the soft board pads on the soft-hard bonding area of ​​the soft board correspond to the hard board pads on the soft-hard bonding area of ​​the hard board one by one; the area of ​​the soft board pads on the soft-hard bonding area of ​​the soft board is smaller than the area of ​​the hard board pads on the soft-hard bonding area of ​​the hard board; a high temperature resistant adhesive layer is formed around the soft board pads to separate the soft board pads and avoid creepage between the soft board pads; A tin penetration hole is provided on the soft board pad on the soft-hard bonding area of ​​the soft board, and solder paste is injected through the tin penetration hole to weld the soft board pad and the hard board pad; wherein the tin penetration hole is a single elliptical hole or a single circular hole or multiple circular holes.

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