Soldering paste jet printing equipment capable of preventing tin splashing

Abstract

The invention, which relates to the technical field of circuit board assembly manufacturing, discloses a tin-splash-proof solder paste jet printing device comprising a jet printing device body, a solder paste nozzle assembly arranged in the jet printing device body, a welding slag receiving frame slidably connected to the inner wall of the jet printing device body, and a mounting frame arranged between the welding slag receiving frame and the solder paste nozzle assembly. A brush plate is arranged below the mounting frame, two splash-proof door shafts are rotatably connected to the inner wall of the spray printing equipment body, splash-proof doors are fixedly connected to the shaft walls of the two splash-proof door shafts, a mounting part is arranged on the mounting frame, the spray printing equipment further comprises two sets of turnover parts, the two sets of turnover parts are arranged in the spray printing equipment body, so that the mounting frame vertically moves downwards firstly, and then the spray printing equipment body is turned over. According to the invention, through the mutual cooperation of the above structures, when the circuit board is subjected to solder paste jet printing, the effects of improving the operation convenience and facilitating the use are achieved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board assembly manufacturing, in particular to an anti-splash solder paste printing device. Background Art

[0002] The SMT production process refers to an electronic mounting technology that uses a solder paste printer to assemble electronic components on the surface of a circuit board and directly solders them to the surface of the circuit board through soldering. It is also widely used in the production of integrated circuit boards. Integrated circuit boards are the foundation and core of electronic equipment, and they bear important functions such as connecting and supporting electronic components, transmitting signals, and providing power. In the welding and installation process of integrated circuit boards, two-sided welding is required. When traditional printing equipment is spraying welding on circuit boards, it is necessary to remove the circuit board from the positioning device, flip it over and install it, and then weld it. Such an operation is undoubtedly very troublesome, and the efficiency of solder paste spraying on circuit boards is low;

[0003] The existing soldering device, such as the published patent, patent number: CN202210073606.2, patent name: an intelligent soldering device for the production of integrated circuit boards for liquid crystal display screens, in which the "rotating drive disk" is controlled to flip the circuit board after soldering is completed on one side, so that the welding working surface is converted, which solves the problem of low efficiency of solder paste printing in the traditional method. However, the device has many inconveniences in actual use. For example, when the operator makes actual adjustments to the flip, it is difficult to ensure the horizontal state after flipping, and it is necessary to observe and adjust while rotating to ensure that no tilt occurs. At the same time, when the device is actually used to deal with a large number of integrated circuit boards, a large amount of solder slag will be stained on its "brush", which makes it difficult to achieve the designed ideal effect in actual use. It can be seen that in the soldering of a circuit board once, the operator needs to intervene many times. For example, in dealing with the assembly line-style multi-batch circuit board solder paste printing work, the negative impact brought by this defect will continue to amplify. Therefore, the traditional device is inconvenient to use in practice, and the convenience needs to be improved when the operator performs multi-batch printing. Summary of the invention

[0004] The purpose of the present invention is to provide a tin-splashing-proof solder paste printing device, which has the effect of improving the convenience of operation and facilitating use when printing solder paste on a circuit board, and solves the problems mentioned in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an anti-splash solder paste printing device, comprising a printing device body, a solder paste nozzle assembly is arranged in the printing device body, a welding slag collecting frame is slidably connected to the inner wall of the printing device body, a mounting frame is arranged between the welding slag collecting frame and the solder paste nozzle assembly, a brush plate is arranged below the mounting frame, the inner wall of the printing device body is rotatably connected to two anti-splash door shafts, the shaft walls of the two anti-splash door shafts are fixedly connected to the anti-splash doors, and a mounting component is arranged on the mounting frame;

[0006] It also includes two groups of flipping components, both of which are arranged in the body of the printing device, so that the installation frame first moves vertically downward, and then moves vertically upward after flipping;

[0007] It also includes a cleaning component, which is in driving connection with the two groups of the flipping components, so that the brush plate moves horizontally while following the vertical displacement of the installation frame, and deflects at the end of the displacement path;

[0008] It also includes two groups of self-locking components and two groups of driving components. The two groups of self-locking components are respectively connected to the two groups of flipping components in a transmission manner so as to control the state of the splash-proof door through the movement of the installation frame.

[0009] Optionally, the mounting component includes two clamping blocks, opposite sides of the two clamping blocks are fixedly connected with clamping rods, the two clamping rods are slidably connected to the inner wall of the mounting frame, the rod walls of the two clamping rods are sleeved with mounting springs, the two ends of the two mounting springs are respectively fixedly connected to the opposite sides of the two clamping blocks and the surface of the mounting frame, and the inner wall of the mounting frame is provided with a mounting groove.

[0010] The cam is connected with the rotation axis of the control lever, and the end portion of the rotation lever is rotatably connected to the rotation axis, and the inner wall of the control lever is rotatably connected to the rotation axis, and the shaft wall of the rotation axis is rotatably connected to the limit block, and the limit block is slidably connected to the inner wall of the printing device body, and the shaft wall of the rotation shaft is fixedly connected to the functional disk, and the surface of the functional disk is fixedly connected to two fixed shafts, and the shaft wall of the rotation shaft is fixedly connected to the rotating rod, and the end portion of the rotating rod is rotatably connected to the connecting block 1, and the bottom surface of the control lever is fixedly connected to the flip rod, and the rod wall of the flip rod is rotatably connected to the connecting block 2, and the connecting block 1 and the opposite side of the connecting block 2 are jointly fixedly connected to a flip spring, and the surface of the control lever is fixedly connected to two blocking rods, and the shaft wall of the rotation shaft is fixedly connected to the surface of the mounting frame, and the surface of the connecting block 1 is fixedly connected to a plastic rod, and the plastic rod is slidably connected to the inner wall of the connecting block 2;

[0011] The inner wall of the printing device body is fixedly connected with a limit rod, the bottom surface of the limit rod is slidably connected with a displacement frame, the inner wall of the displacement frame is fixedly connected with two flip shafts, and the inner wall of the displacement frame is fixedly connected with a triangular block.

[0012] Optionally, the cleaning component includes a driving rod, the rod wall of the driving rod is fixedly connected to the end of the transmission rod, the inner wall of the printing equipment body is provided with a vertical groove for the displacement of the driving rod, the bottom surface of the driving rod is fixedly connected to a limiting frame, the inner wall of the limiting frame is slidably connected with a slider, the inner wall of the slider is rotatably connected with a cleaning rod, the cleaning rod is a two-section type, the end of the cleaning rod is fixedly connected to the end of the brush plate, the inner wall of the printing equipment body is provided with a cleaning groove for the displacement of the cleaning rod, the rod wall of the cleaning rod is fixedly connected with a gear, the inner wall of the printing equipment body is fixedly connected with two slides, the lower end of the slide located at the top is fixedly connected with a rack, and the shaft wall of the rotating shaft located on one side of the rack is fixedly connected with a knocking frame.

[0013] Optionally, the self-locking component includes three plug rods, which are fixedly connected to one side of the displacement frame close to the splash-proof door axis, the shaft wall of the splash-proof door axis is fixedly connected with three plug disks, the inner walls of the three plug disks are slidably connected with plug cylinders, the surfaces of the three plug cylinders are fixedly connected with self-locking springs, and the ends of the three self-locking springs are respectively fixedly connected to the inner walls of the three plug disks.

[0014] Optionally, the driving component includes a motor, which is fixedly connected to the inner wall of the printing device body, and the output end of the motor is fixedly connected to a reciprocating threaded rod, and the inner wall of the driving rod is provided with a reciprocating threaded opening for the reciprocating threaded rod to pass through and be threadedly connected thereto.

[0015] Optionally, the sliding block and the opposite side of the brush plate are jointly and fixedly connected with a warning spring, and the warning spring is sleeved on the rod wall of the cleaning rod.

[0016] Optionally, a transparent window is provided on the surface of the splash-proof door, and a size of the transparent window is adapted to a size of the splash-proof door.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. When the back of the circuit board needs to be printed, the present invention can drive the circuit board to move downward first, away from the printing area where the solder paste nozzle assembly is located, and then self-flip, and then move upward after the flip is completed, so that the function of self-flipping the circuit board can be achieved without manual control by the operator. At the same time, through the setting of two blocking rods, it can automatically ensure that the circuit board remains in a horizontal state after flipping, ensuring the high quality after printing, and the convenience of use is greatly improved;

[0019] At the same time, during the flipping process, the circuit board will flip over near the collection area where the bottom solder slag collecting frame is located after moving down, and then move closer to the solder paste nozzle assembly after flipping, so that sufficient flipping space can be provided between the solder paste nozzle assembly and the circuit board, so that when facing a wider circuit board, the flipping is not affected, making the device more applicable and further improving the convenience of use;

[0020] Moreover, due to the elastic effect of the flip spring, the flipping speed of the second half of the present invention will be relatively fast, that is, after the circuit board is flipped, due to the characteristics of the structure, it will produce a small vibration when the flipping is completed. In the state of flipping, the side that has just completed spray welding faces downward, and this vibration can shake off part of the welding slag thereon, providing assistance for the cleaning of the brush plate. When the brush plate processes this side again, a large amount of welding slag will not be attached to it. At the same time, since it is flipped in the bottom area, the position of the circuit board is relatively low when the vibration occurs, close to the bottom area, so the welding slag that is shaken off is not easy to splash in the device, and will be directly collected, which is more convenient to use.

[0021] Second, the present invention cooperates with the limit frame, the cleaning rod and the gear structure, so that when the circuit board is moved upward, the brush plate will move horizontally along the bottom surface of the circuit board, so that a small amount of solder slag remaining on the surface of the side where the solder spraying has been completed can be brushed off, which can provide assistance to the operator and reduce the process required by the operator;

[0022] At the same time, when the circuit board is turned over, the knocking frame will be driven to perform a relatively fast circular displacement. At this stage, the brush plate is located below the knocking frame. The knocking frame can knock on the surface of the brush plate through rapid deflection to make it vibrate, so that the welding slag attached to the brush plate can be shaken off and fall into the welding slag collecting frame, thus starting the periodic self-cleaning effect of the brush plate, and the operator does not need to clean the brush plate again;

[0023] Through the setting of gears and racks, the bristles of the brush plate can face downward when it is subjected to percussive vibration, making it easier for the welding slag to fall into the welding slag collecting frame below, with better self-cleaning effect and no large amount of splashing, making it more operator-friendly.

[0024] Third, the present invention cooperates with the structures such as the insert plate, the anti-splash door shaft and the self-locking spring, so that when the other side of the circuit board is ready to be sprayed, the anti-splash component of the device, that is, the anti-splash door, is limited and difficult to open, so that the operator can be prompted by providing resistance that the spray welding has not been completed, so as to avoid the situation where the operator mistakenly thinks that both sides of the circuit board have been sprayed and mistakenly opens the anti-splash door;

[0025] At the same time, by adding a self-locking spring instead of directly locking the plug-in disc, the splash-proof door can also act as a buffer when subjected to external forces generated by uncontrollable factors, and the splash-proof components will not be structurally damaged, thereby further improving practicality and ease of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is an axonometric diagram of the present invention in a front view state;

[0027] Figure 2 It is a cross-sectional isometric view of the present invention in a front view state;

[0028] Figure 3 It is a back view of the mounting frame of the present invention in the body of the printing device from a top view perspective;

[0029] Figure 4 This is a schematic diagram of the cooperation between the mounting frame and the brush plate of the present invention;

[0030] Figure 5 For the present invention Figure 4 A magnified view of the structure at center A;

[0031] Figure 6 It is a cross-sectional view of the present invention from a left-side viewing angle;

[0032] Figure 7 It is a transmission schematic diagram of the fixed axis to the displacement frame in the right viewing angle of the present invention;

[0033] Figure 8 For the present invention Figure 7 A magnified view of the structure at B in the middle;

[0034] Fig. 9 For the present invention Figure 7 Axonometric drawing from left perspective;

[0035] Fig.10 It is a front cross-sectional view of the connection part of the limit frame of the present invention;

[0036] Fig.11 For the present invention Fig.10 A magnified view of the structure at C in the middle;

[0037] Fig.12 It is a top sectional view of the plug-in plate connection portion of the present invention. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] Embodiment 1:

[0040] See also Figures 1 to 12 The present invention provides a tin-splashing-proof solder paste printing device, comprising a printing device body 1, a solder paste nozzle assembly 2 is arranged in the printing device body 1, a welding slag collecting frame 3 is slidably connected to the inner wall of the printing device body 1, a mounting frame 4 is arranged between the welding slag collecting frame 3 and the solder paste nozzle assembly 2, a brush plate 5 is arranged below the mounting frame 4, two splash-proof door shafts 6 are rotatably connected to the inner wall of the printing device body 1, and the shaft walls of the two splash-proof door shafts 6 are fixedly connected with splash-proof doors 7, and mounting components are arranged on the mounting frame 4.

[0041] The printing device also includes two groups of flipping components, two groups of self-locking components, two groups of driving components, and cleaning components. The flipping components are arranged in the printing device body 1, the cleaning components are transmission connected to the two groups of flipping components, and the two groups of self-locking components are transmission connected to the two groups of flipping components respectively.

[0042] The installation parts include:

[0043] There are two clamping blocks 8, and clamping rods 9 are fixedly connected to the opposite sides of the two clamping blocks 8. The two clamping rods 9 are slidably connected to the inner wall of the installation frame 4. The rod walls of the two clamping rods 9 are sleeved with installation springs 10. The two ends of the two installation springs 10 are respectively fixedly connected to the opposite sides of the two clamping blocks 8 and the surface of the installation frame 4. The inner wall of the installation frame 4 is provided with a mounting groove.

[0044] The flipping component includes a transmission rod 11, the end of the transmission rod 11 is fixedly connected to a flip block 12, the inner wall of the flip block 12 is rotatably connected to a rotating shaft 13, the shaft wall of the rotating shaft 13 is rotatably connected to a limit block 14, the limit block 14 is slidably connected to the inner wall of the printing device body 1, the shaft wall of the rotating shaft 13 is fixedly connected to a functional disk 15, the surface of the functional disk 15 is fixedly connected to two fixed shafts 16, the shaft wall of the rotating shaft 13 is fixedly connected to a rotating rod 17, the end of the rotating rod 17 is rotatably connected to a connecting block 18, the bottom surface of the flip block 12 is fixedly connected to a flip rod 19, the rod wall of the flip rod 19 is rotatably connected to a connecting block 20, the connecting block 18 is connected to the connecting block 2 The opposite sides of 20 are commonly fixedly connected with a flip spring 21, the surface of the flip block 12 is fixedly connected with two blocking rods 22, the shaft wall of the rotating shaft 13 is fixedly connected to the surface of the mounting frame 4, the surface of the connecting block 18 is fixedly connected with a plastic rod 43, the plastic rod 43 is slidably connected to the inner wall of the connecting block 20, the inner wall of the printing device body 1 is fixedly connected with a limit rod 23, the bottom surface of the limit rod 23 is slidably connected with a displacement frame 24, the inner wall of the displacement frame 24 is fixedly connected with two flip shafts 25, the inner wall of the displacement frame 24 is fixedly connected with a triangular block 42, and a transparent window is provided on the surface of the splash-proof door 7, and the size of the transparent window is adapted to the size of the splash-proof door 7.

[0045] More specifically, in this embodiment, splash protection is as follows: when the operator is preparing to spray-weld the circuit board, he first places the circuit board on the mounting frame 4, opens the two clamping blocks 8, allows the two clamping rods 9 to slide on the inner wall of the mounting frame 4, compresses the two mounting springs 10, places the circuit board in the middle area of ​​the two clamping blocks 8, and inserts the ends of the circuit board into the mounting grooves provided on the mounting frame 4, thereby completing the full fixation of the circuit board. After preparation is completed, close the splash protection door 7, start the solder paste nozzle assembly 2, and print the solder paste on the side of the circuit board facing upward in this state. During the printing process, the splash protection door 7 is used to block the splash of solder paste during the printing process to prevent splashing outside and causing harm to the operator. After printing the outer wall on one side, the operator can start the driving component to drive the circuit board to turn over. When the driving component is started, the transmission rod 11 will move back and forth in the vertical direction.

[0046] When the transmission rod 11 moves vertically downward, the flip block 12 will be synchronously driven to move vertically downward. The vertical downward movement of the flip block 12 can make the rotating shaft 13 move vertically downward, so that the mounting frame 4 and the circuit board mounted thereon are moved vertically downward, so that the circuit board is first away from the printing area where the solder paste nozzle assembly 2 is located. In this process, the limit block 14 is synchronously driven to move, so that the limit block 14 slides along the inner wall of the printing device body 1, and in the downward movement of the rotating shaft 13, the function plate 15 is synchronously driven to move vertically downward, so that The two fixed shafts 16 connected thereto move vertically downward. As the downward movement continues, the fixed shaft 16 at the bottom will first contact the flip shaft 25 at one side. Since the vertical height of the flip shaft 25 remains unchanged, the flip shaft 25 will push the fixed shaft 16 at the bottom in this state during the subsequent downward movement, driving the function disk 15 to deflect. When the function disk 15 deflects, it will synchronously drive the rotating shaft 13 to rotate, thereby causing the circuit board to flip. During the flipping process, the rotating shaft 13 remains in the downward movement state. At the same time, during the flipping, the rotation rod 17 will be driven by the transmission of the rotating shaft 13. The turning rod 17 is rotated at a relatively fast speed until it contacts with the blocking rod 22 and is blocked by the blocking rod 22. In this way, the turning is completed. After the turning is completed, the two fixed shafts 16 are no longer located here. The vertical position of the flip shaft 25 on one side is not the same, but relatively close to the flip shaft 25 on the other side, but not in contact with it at this time. Then the transmission rod 11 moves vertically upward, driving the flipped circuit board to move upward again. At the end of the upward movement, due to the change in the vertical position of the two fixed shafts 16, when it moves upward, it will contact the inclined surface of the triangular block 42, and will push the triangular block 42 to move horizontally, so that the displacement frame 24 is horizontally displaced along the rod wall of the limit rod 23, so that the two flip shafts 25 are horizontally displaced, so that the flip shaft 25 on the other side moves to the bottom of the two fixed shafts 16.

[0047] Through the above method, when it is necessary to print on the back of the circuit board, the circuit board is driven to move down first, away from the printing area where the solder paste nozzle assembly 2 is located, and then flipped over, and then moved up after the flipping is completed. In this way, the function of self-flipping the circuit board can be achieved. At the same time, through the setting of the two blocking rods 22, it can automatically ensure that the circuit board remains in a horizontal state after flipping, ensuring the high quality after printing, and the convenience of use is greatly improved.

[0048] By adopting this method, during the flipping process, the circuit board moves downward and flips close to the collecting area where the bottom solder slag collecting frame 3 is located. After flipping, it moves upward and close to the solder paste nozzle assembly 2, thereby providing sufficient flipping space between the solder paste nozzle assembly 2 and the circuit board, so that when facing a circuit board with a larger width, the flipping is not affected, making the device more applicable and further improving the convenience of use.

[0049] At the same time, it can be seen from the above that in the second half of the flipping path, due to the elastic effect of the flipping spring 21, the speed will be relatively fast until the rotating rod 17 contacts the blocking rod 22, and the rotating rod 17 is forced to remain horizontal. Therefore, after the two are in contact, the rotating rod 17 will be regarded as being struck and vibrating, that is, after the circuit board is flipped, due to the characteristics of the structure, it will produce a small amplitude vibration when the flipping is completed. In the state of flipping, the side that has just completed spray welding faces downward, and this vibration can shake off part of the welding slag on it, providing assistance for the operation of the cleaning component, and this vibration position is relatively low, close to the bottom area, so a large amount of welding slag is not easy to splash in the device, and it is more convenient to use.

[0050] Embodiment 2, based on the above embodiment:

[0051] See also Figures 1 to 12 The cleaning component includes a driving rod 26, the rod wall of the driving rod 26 is fixedly connected to the end of the transmission rod 11, the inner wall of the printing device body 1 is provided with a vertical groove for the displacement of the driving rod 26, the bottom surface of the driving rod 26 is fixedly connected to a limit frame 27, the inner wall of the limit frame 27 is slidably connected with a slider 28, the inner wall of the slider 28 is rotatably connected with a cleaning rod 29, the cleaning rod 29 is a two-stage type, the end of the cleaning rod 29 is fixedly connected to the end of the brush plate 5, the inner wall of the printing device body 1 is provided with a cleaning groove 30 for the displacement of the cleaning rod 29, the rod wall of the cleaning rod 29 is fixedly connected with a gear 31, the inner wall of the printing device body 1 is fixedly connected with two slides 32, the lower end of the slide 32 located at the top is fixedly connected with a rack 33, and the shaft wall of the rotating shaft 13 on one side of the rack 33 is fixedly connected with a knocking frame 34.

[0052] The driving component includes a motor 39, which is fixedly connected to the inner wall of the printing device body 1. The output end of the motor 39 is fixedly connected to a reciprocating threaded rod 40. The inner wall of the driving rod 26 is provided with a reciprocating threaded opening for the reciprocating threaded rod 40 to pass through and be threadedly connected thereto.

[0053] The slider 28 and the opposite side of the brush plate 5 are fixedly connected with a warning spring 41 , and the warning spring 41 is sleeved on the rod wall of the cleaning rod 29 .

[0054] More specifically, in this embodiment: the operator can start the motor 39 to rotate the reciprocating threaded rod 40, so that the driving rod 26 can be reciprocated in the vertical direction, and then the transmission rod 11 can be reciprocated in the vertical direction through the reciprocating movement of the driving rod 26. In the process of the driving rod 26 moving downward, the limit frame 27 will also be driven to move vertically downward. When it moves downward, the slider 28 will be moved downward, thereby driving the cleaning rod 29 to move vertically downward. When the cleaning rod 29 moves downward, it will slide along the groove wall of the cleaning groove 30, so that when the slider 28 follows the downward movement, it will move along the inner wall of the limit frame 27. Horizontal sliding can make the brush plate 5 slide horizontally, that is, in the process of moving down or up, the brush plate 5 will perform a horizontal displacement along the bottom surface of the circuit board. Through this displacement, when the circuit board moves down, the dust on the bottom surface ready to be sprayed can be brushed off, and when the circuit board moves up, the solder slag on the surface of the side that has been sprayed with solder will be brushed off. This can provide assistance to the operator and reduce the process required by the operator. It is worth noting that when the circuit board is flipped, the brush plate 5 has been horizontally displaced to the flipping area away from the circuit board, that is, it will be located at the rotating shaft 13 on one side, so it will not hinder the flipping of the circuit board.

[0055] From the above, it can be seen that when the circuit board is flipped, the speed of the second half of the path will be faster. At this stage, the rotating shaft 13 will rotate at a faster speed, so that the knocking frame 34 will also perform a faster circular displacement. At this stage, the brush plate 5 is located below the knocking frame 34. Through the rapid deflection of the knocking frame 34, the surface of the brush plate 5 can be knocked to cause it to vibrate, so that the welding slag attached to the brush plate 5 can be shaken off and fall into the welding slag collecting frame 3, thereby starting the periodic self-cleaning effect of the brush plate 5, and the operator does not need to clean the brush plate 5 again.

[0056] At the same time, in the process of the cleaning rod 29 moving along the groove wall of the cleaning groove 30, the gear 31 will be driven to move synchronously. When the gear 31 is meshed with the rack 33, the displacement of the gear 31 will produce self-rotation, that is, the cleaning rod 29 will produce self-rotation at this time, so that the brush plate 5 in this process will produce self-deflection, so that the bristles can be deflected downward, so that when it is subjected to percussive vibration, the welding slag is easier to fall off, and the self-cleaning effect is better. At the same time, it can be seen from the structural layout that during vibration self-cleaning, the brush plate 5 is also located in the lower area of ​​the device, and the welding slag can fall directly into the welding slag collecting frame 3 without generating a large amount of splashing, which is more user-friendly for the operator.

[0057] It is worth noting that when the cleaning rod 29 is displaced, the teeth of the gear 31 will be limited by the slide seat 32 and will not rotate, thereby ensuring that the bristles of the brush plate 5 will not be separated from the circuit board when the brush plate 5 is working. By setting the early warning spring 41, the state of the brush plate 5 can be further limited to ensure that it will not self-deviate when not driven by external force.

[0058] It is also worth noting that after the other side of the circuit board is printed, the device is driven again so that the initially upward side faces upward again, and only then can the entire process of solder paste printing on the circuit board be completed. In this way, the product can be kept consistent with the state when it was placed, making it convenient for the operator to load and unload materials.

[0059] Embodiment 3, based on the above embodiment:

[0060] See also Figures 1 to 12 The self-locking component includes three plug rods 35, and the three plug rods 35 are fixedly connected to one side of the displacement frame 24 close to the splash-proof door shaft 6. The shaft wall of the splash-proof door shaft 6 is fixedly connected with three plug disks 36. The inner walls of the three plug disks 36 are slidably connected with plug cylinders 37. The surfaces of the three plug cylinders 37 are fixedly connected with self-locking springs 38. The ends of the three self-locking springs 38 are fixedly connected to the inner walls of the three plug disks 36 respectively.

[0061] More specifically, in the present embodiment: during the horizontal displacement of the displacement frame 24, the insertion rod 35 will be synchronously driven to perform horizontal displacement, and after the soldering and spray printing is completed on one side of the circuit board, the other side is flipped and displaced upward until it is located below the solder paste nozzle assembly 2. At this time, the horizontal displacement of the displacement frame 24 will cause the insertion rod 35 to be inserted into the insertion tube 37, so that in this state, if the splash-proof door 7 is opened, the splash-proof door shaft 6 needs to rotate, and the rotation of the splash-proof door shaft 6 will require the insertion plate 36 to deflect. Since the insertion tube 37 is limited and cannot follow the deflection, only the self-locking spring 38 will be compressed at this time, that is, the opening of the splash-proof door 7 will require overcoming a very large force.

[0062] By the above method, when the other side of the circuit board is ready to be printed, the splash-proof component of the device, that is, the splash-proof door 7, can be restricted to make it difficult to open. In this way, the operator can be reminded that the spray welding has not been completed by providing resistance, thereby avoiding the operator from mistakenly thinking that both sides of the circuit board have been printed and mistakenly opening the splash-proof door 7. At the same time, by adding a self-locking spring 38 instead of directly locking the insert tray 36, this method makes it possible for the splash-proof door 7 to play a buffering role when subjected to external forces generated by uncontrollable factors, and the splash-proof component will not be structurally damaged, thereby further improving the practicality and convenience of use.

[0063] Working principle: When the anti-splash solder paste printing device is used, the operator first places the circuit board on the mounting frame 4, opens the two clamping blocks 8, makes the two clamping rods 9 slide on the inner wall of the mounting frame 4, makes the two mounting springs 10 compressed, places the circuit board in the middle area of ​​the two clamping blocks 8, and inserts the ends of the circuit board into the mounting grooves opened on the mounting frame 4, so that the circuit board can be fully fixed. After the preparation is completed, close the anti-splash door 7, start the solder paste nozzle assembly 2, and print the solder paste on the upward side of the circuit board in this state. During the printing process, the anti-splash door 7. The splashing of solder paste during printing is shielded to prevent splashing outside and causing harm to the operator. After printing the outer wall on one side, the operator can start the motor 39 to drive the circuit board to move down first, away from the printing area where the solder paste nozzle assembly 2 is located, and then flip it. After the flip is completed, it moves up again. In this way, the function of self-flipping the circuit board can be achieved, and then the other side of the circuit board can be printed. During the flipping process, the two blocking rods 22 can be set to automatically ensure that the circuit board remains horizontal after flipping, ensuring the quality after printing;

[0064] When the circuit board moves down, the brush plate 5 will also move horizontally while moving downward. In this way, through the movement of the brush plate 5, when the circuit board moves up, the solder slag on the surface of the side where the solder spraying has been completed can be brushed off. This can provide assistance to the operator and reduce the process required by the operator. It is worth noting that when the circuit board is turned over, the brush plate 5 has been horizontally displaced to the turning area away from the circuit board, that is, it will be located at the rotating shaft 13 on one side, so it will not hinder the turning of the circuit board. When the circuit board is turned over, the knocking frame 34 also performs a relatively fast circumferential displacement. At this stage, the brush plate 5 is located below the knocking frame 34. Through the rapid deflection of the knocking frame 34, the surface of the brush plate 5 can be knocked to make it vibrate, so that the solder slag attached to the brush plate 5 can be shaken off and dropped into the solder slag receiving frame 3, thereby starting the periodic self-cleaning effect of the brush plate 5, and the operator does not need to clean the brush plate 5 again.

[0065] When the other side of the circuit board is ready for printing, the insertion rod 35 on the displacement frame 24 will be inserted into the insertion tube 37, so that in this state, if the splash-proof door 7 is opened, the elastic force of the three self-locking springs 38 must be overcome, thereby providing resistance to remind the operator that the spray welding has not been completed, thereby preventing the operator from mistakenly thinking that both sides of the circuit board have been printed and mistakenly opening the splash-proof door 7.

[0066] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A tin-splash-proof solder paste printing device, comprising a printing device body (1), characterized in that: A solder paste nozzle assembly (2) is arranged in the printing device body (1); a solder slag collecting frame (3) is slidably connected to the inner wall of the printing device body (1); a mounting frame (4) is arranged between the solder slag collecting frame (3) and the solder paste nozzle assembly (2); a brush plate (5) is arranged below the mounting frame (4); two splash-proof door shafts (6) are rotatably connected to the inner wall of the printing device body (1); the shaft walls of the two splash-proof door shafts (6) are fixedly connected to splash-proof doors (7); and mounting components are arranged on the mounting frame (4); The solder paste printing device also includes: Two groups of flipping components, both groups of flipping components are arranged in the printing device body (1), so that the installation frame (4) first moves vertically downward, and then moves vertically upward after flipping; A cleaning component, the cleaning component is drivingly connected to the two groups of the flipping components, so that the brush plate (5) moves horizontally while following the vertical displacement of the mounting frame (4), and deflects at the end of the displacement path; Two groups of self-locking components and two groups of driving components, the two groups of self-locking components are respectively connected in driving connection with the two groups of flipping components, so as to control the state of the splash-proof door (7) through the movement of the installation frame (4).

2. The anti-splash solder paste printing device according to claim 1, characterized in that: The installation components include: Two clamping blocks (8), opposite sides of the two clamping blocks (8) are fixedly connected with clamping rods (9), the two clamping rods (9) are slidably connected to the inner wall of the installation frame (4), the rod walls of the two clamping rods (9) are sleeved with installation springs (10), the two ends of the two installation springs (10) are respectively fixedly connected to the opposite sides of the two clamping blocks (8) and the surface of the installation frame (4), and the inner wall of the installation frame (4) is provided with a mounting groove.

3. The anti-splash solder paste printing device according to claim 2, characterized in that: The flipping component comprises: A transmission rod (11), the end of which is fixedly connected to a flip block (12), the inner wall of which is rotatably connected to a rotating shaft (13), the shaft wall of which is rotatably connected to a limit block (14), the limit block (14) being slidably connected to the inner wall of the printing device body (1), the shaft wall of which is fixedly connected to a functional disk (15), the surface of which is fixedly connected to two fixed shafts (16), the shaft wall of which is fixedly connected to a rotating rod (17), the end of which is rotatably connected to a connecting block (11), and the rotating rod (17) being rotatably connected to a connecting block (11). 18), the bottom surface of the flip block (12) is fixedly connected with a flip rod (19), the rod wall of the flip rod (19) is rotatably connected with a connecting block 2 (20), the connecting block 1 (18) and the opposite side of the connecting block 2 (20) are commonly fixedly connected with a flip spring (21), the surface of the flip block (12) is fixedly connected with two blocking rods (22), the shaft wall of the rotating shaft (13) is fixedly connected with the surface of the mounting frame (4), the surface of the connecting block 1 (18) is fixedly connected with a plastic rod (43), and the plastic rod (43) is slidably connected with the inner wall of the connecting block 2 (20); The inner wall of the printing device body (1) is fixedly connected to a limit rod (23), the bottom surface of the limit rod (23) is slidably connected to a displacement frame (24), the inner wall of the displacement frame (24) is fixedly connected to two flip shafts (25), and the inner wall of the displacement frame (24) is fixedly connected to a triangular block (42).

4. The anti-splash solder paste printing device according to claim 3, characterized in that: The cleaning component comprises: A driving rod (26), the rod wall of the driving rod (26) is fixedly connected to the end of the transmission rod (11), the inner wall of the printing device body (1) is provided with a vertical groove for displacement of the driving rod (26), the bottom surface of the driving rod (26) is fixedly connected to a limit frame (27), the inner wall of the limit frame (27) is slidably connected to a slider (28), the inner wall of the slider (28) is rotatably connected to a cleaning rod (29), the cleaning rod (29) is a two-stage type, and the end of the cleaning rod (29) The inner wall of the printing device body (1) is provided with a cleaning groove (30) for the displacement of the cleaning rod (29), the rod wall of the cleaning rod (29) is fixedly connected with a gear (31), the inner wall of the printing device body (1) is fixedly connected with two slide seats (32), the lower end of the slide seat (32) located at the top is fixedly connected with a rack (33), and the shaft wall of the rotating shaft (13) located on one side of the rack (33) is fixedly connected with a knocking frame (34).

5. The anti-splash solder paste printing device according to claim 4, characterized in that: The self-locking component comprises: Three insertion rods (35), the three insertion rods (35) are fixedly connected to one side of the displacement frame (24) close to the splash-proof door shaft (6), the shaft wall of the splash-proof door shaft (6) is fixedly connected with three insertion plates (36), the inner walls of the three insertion plates (36) are slidably connected with insertion tubes (37), the surfaces of the three insertion tubes (37) are fixedly connected with self-locking springs (38), and the ends of the three self-locking springs (38) are respectively fixedly connected to the inner walls of the three insertion plates (36).

6. The anti-splash solder paste printing device according to claim 5, characterized in that: The driving component comprises: A motor (39) is fixedly connected to the inner wall of the printing device body (1); a reciprocating threaded rod (40) is fixedly connected to the output end of the motor (39); and a reciprocating threaded opening is provided on the inner wall of the driving rod (26) for the reciprocating threaded rod (40) to pass through and be threadedly connected thereto.

7. The anti-splash solder paste printing device according to any one of claims 4 to 6, characterized in that: The slider (28) and the brush plate (5) are fixedly connected to a warning spring (41) on their opposite sides, and the warning spring (41) is sleeved on the rod wall of the cleaning rod (29).

8. The anti-splash solder paste printing device according to any one of claims 2 to 6, characterized in that: A transparent window is provided on the surface of the splash-proof door (7), and the size of the transparent window is adapted to the size of the splash-proof door (7).

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