Method for manufacturing multilayer circuit board, multilayer circuit board and electronic equipment

Abstract

The present application relates to a method for manufacturing a multilayer circuit board, a multilayer circuit board and an electronic device, the method for manufacturing the multilayer circuit board comprising: manufacturing a multilayer board; obtaining through-hole data of a heat dissipation through-hole according to a circuit layout diagram; silk-screening heat dissipation ink on a first surface of the multilayer board according to the through-hole data to form a heat dissipation ink layer; opening a heat dissipation through-hole on the multilayer board according to the through-hole data, the heat dissipation through-hole penetrating the multilayer board along the thickness direction of the multilayer board; welding the welding pins of the electronic component to the welding position on the second surface of the multilayer board, so that the heat dissipation pins of the electronic component pass through the heat dissipation through-hole and are connected to the heat dissipation ink layer, wherein the second surface and the first surface are arranged opposite to each other in the thickness direction of the multilayer board. The method for manufacturing the multilayer circuit board can effectively increase the direct contact area between the electronic component and the heat dissipation ink layer, thereby improving the heat transfer efficiency between the electronic component and the heat dissipation ink layer, and improving the heat dissipation efficiency of the multilayer circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a method for manufacturing a multi-layer circuit board, a multi-layer circuit board and an electronic device. Background Art

[0002] Generally, electronic components are mounted on circuit boards. They will generate a lot of heat during use. The performance of electronic components will decline and become damaged at too high a temperature. Overheating and failure of electronic components will affect the stability and reliability of the entire system. Therefore, heat dissipation has always been a focus of attention in circuit board production.

[0003] In the related art, an effective solution to the heat dissipation problem of the circuit board is to print heat dissipation ink locally on a large area of ​​the circuit board. However, since the heat dissipation ink has insulating properties, the heat dissipation ink cannot be used as a mounting surface for mounting electronic components. Therefore, the heat dissipation ink and the electronic components need to conduct heat through the circuit board, which is not conducive to improving the heat dissipation efficiency of the circuit board. Summary of the invention

[0004] Based on this, it is necessary to provide a method for manufacturing a multilayer circuit board, a multilayer circuit board and an electronic device to address the problem of low heat dissipation efficiency of the circuit board when the heat dissipation ink and electronic components are respectively arranged on both sides of the circuit board.

[0005] The technical solution is as follows:

[0006] In a first aspect, the present application provides a method for manufacturing a multilayer circuit board, comprising the following steps:

[0007] Making multilayer boards;

[0008] Acquire through-hole data of a heat dissipation through-hole according to a circuit layout diagram, wherein the heat dissipation through-hole corresponds to a non-welding position of a multilayer board;

[0009] Screen printing heat dissipation ink on the first surface of the multilayer board according to the through hole data to form a heat dissipation ink layer;

[0010] Opening the heat dissipation through hole on the multilayer board according to the through hole data, wherein the heat dissipation through hole penetrates the multilayer board along the thickness direction of the multilayer board;

[0011] The soldering pins of the electronic components are soldered to the soldering positions on the second surface of the multilayer board, so that the heat dissipation pins of the electronic components pass through the heat dissipation through holes and are connected to the heat dissipation ink layer, wherein the second surface and the first surface are arranged opposite to each other in the thickness direction of the multilayer board.

[0012] In the above-mentioned method for manufacturing a multi-layer circuit board, the heat dissipation ink layer is arranged on the first surface of the multi-layer board, the soldering pins of the electronic components are soldered to the second surface of the multi-layer board, and the heat dissipation pins of the electronic components can be connected to the heat dissipation ink layer through the heat dissipation through holes, so that the electronic components can be reliably loaded on the circuit board, and the generated heat can be directly transferred to the heat dissipation ink layer through the heat dissipation pins. In this way, the direct contact area between the electronic components and the heat dissipation ink layer can be effectively increased. Therefore, compared with the solution of heat transfer through the circuit board as a medium, this design can effectively improve the heat transfer efficiency between the electronic components and the heat dissipation ink layer, which is conducive to fully utilizing the heat dissipation performance of the heat dissipation ink, improving the heat dissipation performance of the multi-layer circuit board, and ensuring the heat dissipation efficiency of the multi-layer circuit board.

[0013] The technical solution is further described below:

[0014] In one embodiment, the step of opening the heat dissipation through hole on the multilayer board according to the through hole data includes the following steps:

[0015] Designing a first gong belt according to the through hole data;

[0016] The first gong tape is used to perform gong processing on the multilayer board to form the heat dissipation through hole.

[0017] In one embodiment, in the step of screen printing heat dissipation ink on the first surface of the multilayer board according to the through hole data to form a heat dissipation ink layer, the following steps are included:

[0018] Designing a printed film according to the through-hole data, wherein the printed film can cover a position corresponding to the heat dissipation through-hole in the first surface of the multilayer board;

[0019] A screen tool is made using the printing film, and heat dissipation ink is screen-printed on the first surface using the screen tool to form a heat dissipation ink layer.

[0020] In one embodiment, the steps of making a multilayer board include the following steps:

[0021] Making multi-layer laminates;

[0022] The multilayer laminate is divided to form a plurality of the multilayer boards.

[0023] In one embodiment, the step of dividing the multilayer laminate to form a plurality of multilayer laminates includes the following steps:

[0024] Acquire frame data of a plurality of the multilayer boards;

[0025] Designing a second gong belt according to the frame data;

[0026] The multilayer laminate is gonged using the second gong belt to gong away the frames of the plurality of multilayer laminates to obtain the plurality of multilayer laminates.

[0027] In one embodiment, the step of making a multilayer laminate includes the following steps:

[0028] respectively manufacturing a plurality of laminated layers;

[0029] The plurality of laminated sheets are stacked and laminated to form the multi-layer laminated sheet.

[0030] In one embodiment, the step of stacking and pressing the plurality of pressed sheets to form the multi-layer pressed sheet includes the following steps:

[0031] A prepreg is arranged between two adjacent laminated sheets;

[0032] The plurality of laminated sheets and the prepreg sheet disposed between two adjacent laminated sheets are laminated together at a preset temperature and a preset pressure to form the multi-layer laminated sheet.

[0033] In one embodiment, the step of making the laminated board includes the following steps:

[0034] Divide bulk materials into substrates of preset sizes;

[0035] Manufacturing circuit layers on both sides of the substrate;

[0036] The circuit layer is roughened.

[0037] In the second aspect, the present application provides a multilayer circuit board, comprising a multilayer board and an electronic component, the multilayer board comprising a first surface and a second surface arranged opposite to each other in the thickness direction of the multilayer board, the multilayer board is provided with a heat dissipation through-hole extending through the thickness direction of the multilayer board, the first surface is provided with a heat dissipation ink layer, in the thickness direction of the multilayer board, the heat dissipation ink layer and the heat dissipation through-hole are staggered, the welding pins of the electronic component are welded to the welding positions of the second surface, the heat dissipation pins of the electronic component pass through the heat dissipation through-hole and are connected to the heat dissipation ink layer.

[0038] In the above-mentioned multi-layer circuit board, the heat dissipation ink layer is arranged on the first surface of the multi-layer board, the soldering pins of the electronic components are soldered on the second surface of the multi-layer board, and the heat dissipation pins of the electronic components can be connected to the heat dissipation ink layer through the heat dissipation through holes, so that the electronic components can be reliably loaded on the circuit board, and the generated heat can be directly transferred to the heat dissipation ink layer through the heat dissipation pins. In this way, the direct contact area between the electronic components and the heat dissipation ink layer can be effectively increased. Therefore, compared with the solution of heat transfer through the circuit board as the medium, this design can effectively improve the heat transfer efficiency between the electronic components and the heat dissipation ink layer, which is conducive to fully utilizing the heat dissipation performance of the heat dissipation ink, improving the heat dissipation performance of the multi-layer circuit board, and ensuring the heat dissipation efficiency of the multi-layer circuit board.

[0039] In a third aspect, the present application also provides an electronic device, comprising the above-mentioned multi-layer circuit board.

[0040] In the above-mentioned electronic device, the heat dissipation ink layer is arranged on the first surface of the multilayer board, the soldering pins of the electronic components are soldered to the second surface of the multilayer board, and the heat dissipation pins of the electronic components can be connected to the heat dissipation ink layer through the heat dissipation through holes, so that the electronic components can be reliably loaded on the circuit board, and the generated heat can be directly transferred to the heat dissipation ink layer through the heat dissipation pins. In this way, the direct contact area between the electronic components and the heat dissipation ink layer can be effectively increased. Therefore, compared with the solution of heat transfer through the circuit board as the medium, this design can effectively improve the heat transfer efficiency between the electronic components and the heat dissipation ink layer, which is conducive to fully utilizing the heat dissipation performance of the heat dissipation ink, improving the heat dissipation performance of the multilayer circuit board, and ensuring the heat dissipation efficiency of the multilayer circuit board, thereby helping to improve the stability and reliability of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 Schematic diagram of the structure of a multi-layer circuit board in one embodiment.

[0042] Figure 2 The present invention is a flow chart of a method for manufacturing a multilayer circuit board in one embodiment.

[0043] Figure 3 Schematic diagram of the structure of a pressing plate in one embodiment.

[0044] Description of reference numerals:

[0045] 100, multilayer circuit board; 110, multilayer board; 110a, first surface; 110b, second surface; 101, laminated board; 101a, substrate; 101b, circuit layer; 102, prepreg; 103, heat dissipation via; 120, heat dissipation ink layer; 130, electronic component; 131, heat dissipation pin. DETAILED DESCRIPTION

[0046] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0047] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0048] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0049] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0050] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0051] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0052] Specifically, electronic components will generate heat during use, and since electronic components are easily damaged at high temperatures, so effectively dissipating heat from electronic components has always been a focus of attention in the production of circuit boards. As a carrier of electronic components, there are many electronic components on the circuit board. For some electronic components with large heat generation, it is difficult to achieve the heat dissipation effect by relying solely on the heat dissipation capacity of the circuit board itself. Therefore, in some related technologies, heat dissipation ink is printed locally and in large areas on the heat dissipation surface of the circuit board to improve the heat dissipation capacity of the circuit board using the heat dissipation ink. However, since the heat dissipation ink has insulating properties, the surface printed with the heat dissipation ink cannot be used as the mounting surface for mounting electronic components, which means that the electronic components need to be mounted on the surface of the circuit board opposite to the heat dissipation ink to ensure the connection reliability between the electronic components and the circuit board. Therefore, the heat conduction between the heat dissipation ink and the electronic components requires the circuit board to act as a medium, but since the thermal conductivity of the circuit board is poorer than that of the heat dissipation ink, when the circuit board is used as a medium for heat conduction, the heat dissipation capacity of the heat dissipation ink is easily wasted, affecting the actual heat dissipation efficiency of the heat dissipation ink, which is not conducive to fully improving the heat dissipation efficiency of the circuit board.

[0053] Based on this, a method for manufacturing a multilayer circuit board 100 provided in an embodiment of the present application is as follows: Figure 1 and Figure 2 , a method for manufacturing a multilayer circuit board 100 according to an embodiment includes the following steps:

[0054] S10: manufacturing a multilayer board 110;

[0055] Specifically, the multilayer board 110 includes a circuit board for loading electronic components 130 .

[0056] S20: Obtaining through-hole data of the heat dissipation through-hole 103 according to the circuit layout diagram, where the heat dissipation through-hole 103 corresponds to a non-welding position of the multilayer;

[0057] Specifically, the position and size of the heat dissipation through hole 103 in the multilayer circuit board 100 product to be formed are determined according to the circuit layout diagram, so as to ensure that the heat dissipation ink can be accurately coated on the multilayer board 110 and the heat dissipation through hole 103 can be opened according to the through hole data of the heat dissipation through hole 103. Among them, the heat dissipation through hole 103 corresponding to the non-welding position means that the position of the heat dissipation through hole 103 is opened at the non-welding position on the surface of the multilayer board 110, rather than that each non-welding position is opened with a heat dissipation through hole 103. Opening the heat dissipation through hole 103 at the non-welding position is conducive to ensuring that the opening of the through hole does not affect the communication function of the circuit board.

[0058] S30 : Screen-printing heat dissipation ink on the first surface 110 a of the multilayer board 110 according to the through-hole data to form a heat dissipation ink layer 120 .

[0059] Specifically, the heat dissipation ink layer 120 can partially cover the soldering heat dissipation position of the electronic component 130 in a large area, so that the heat dissipation ink layer can effectively accelerate the heat dissipation efficiency of the circuit board and ensure that the electronic component 130 is not damaged by high temperature. Schematically, in one embodiment, the heat dissipation ink layer 120 can cover the position corresponding to the heat dissipation through hole 103 in the first surface 110a; in other embodiments, the heat dissipation ink layer 120 may not cover the position corresponding to the heat dissipation through hole 103 in the first surface 110a.

[0060] S40 : opening a heat dissipation through hole 103 on the multilayer board 110 according to the through hole data, and the heat dissipation through hole 103 penetrates the multilayer board 110 along the thickness direction of the multilayer board 110 .

[0061] Illustratively, in one embodiment, the heat dissipation through hole 103 can be formed by forming a groove on the multilayer board 110. In other embodiments, the heat dissipation through hole 103 can also be formed in other ways. Among them, since the heat dissipation through hole 103 passes through the multilayer board 110 and the heat dissipation ink layer 120 does not cover the heat dissipation through hole 103, a through hole is formed on the multilayer board 110 and the heat dissipation ink layer 120. Compared with the solution of first opening the heat dissipation through hole 103 and then screen printing the heat dissipation ink layer 120, this design is conducive to preventing the heat dissipation ink from flowing into the heat dissipation through hole 103 when screen printing the heat dissipation ink, thereby helping to reduce the amount of heat dissipation ink used and reduce costs.

[0062] S50: Weld the soldering pins of the electronic component 130 to the soldering positions of the second surface 110b of the multilayer board 110, so that the heat dissipation pins 131 of the electronic component 130 pass through the heat dissipation through-holes 103 and are connected to the heat dissipation ink layer 120, wherein the second surface 110b and the first surface 110a are arranged opposite to each other in the thickness direction of the multilayer board 110.

[0063] Specifically, a soldering pad is provided on the second surface 110b. When the electronic component 130 is mounted on the second surface 110b, the soldering pins of the electronic component 130 are soldered to the soldering positions on the soldering pads to ensure electrical conduction between the electronic component 130 and the circuit board, thereby ensuring communication between the electronic component 130 and the circuit board. The heat dissipation pins 131 of the electronic component 130 penetrate to the side of the heat dissipation ink layer 120 away from the multilayer board 110 through the heat dissipation through-holes 103, and are directly attached and fixed to the heat dissipation ink layer 120 through the fixing parts, so that the heat generated by the electronic component 130 can be directly transferred to the heat dissipation ink layer 120 through the heat dissipation pins 131, thereby improving the heat transfer efficiency between the electronic component 130 and the heat dissipation ink layer 120, and effectively improving the heat dissipation effect of the circuit board.

[0064] In the above-mentioned method for manufacturing the multilayer circuit board 100, the heat dissipation ink layer 120 is disposed on the first surface 110a of the multilayer circuit board 110, the soldering pins of the electronic component 130 are soldered to the second surface 110b of the multilayer circuit board 110, and the heat dissipation pins 131 of the electronic component 130 can be connected to the heat dissipation ink layer 120 through the heat dissipation through hole 103, so that the electronic component 130 can be reliably loaded on the circuit board, and the generated heat can be directly transferred to the heat dissipation ink layer 120 through the heat dissipation pins 131. In this way, the direct contact area between the electronic component 130 and the heat dissipation ink layer 120 can be effectively increased. Therefore, compared with the solution of heat transfer through the circuit board as a medium, this design can effectively improve the heat transfer efficiency between the electronic component 130 and the heat dissipation ink layer 120, which is conducive to fully utilizing the heat dissipation performance of the heat dissipation ink, improving the heat dissipation performance of the multilayer circuit board 100, and ensuring the heat dissipation efficiency of the multilayer circuit board 100.

[0065] Optionally, in one embodiment, in step S40: the step of opening the heat dissipation through hole 103 on the multilayer board 110 according to the through hole data, the following steps are included:

[0066] S41: designing the first gong belt according to the through hole data;

[0067] Specifically, the parameters of the first heat dissipation belt are set according to the position and aperture size of the heat dissipation through hole 103 to ensure that the heat dissipation through hole 103 can be effectively formed according to the first heat dissipation belt subsequently.

[0068] S42: Utilize a first reaming tape to perform reaming processing on the multilayer board 110 to form heat dissipation through holes 103 .

[0069] Specifically, the first gong belt is introduced into the gong machine system, the multilayer board 110 is placed on the gong machine, and the gong machine is started so that the gong machine can open the heat dissipation through hole 103 on the multilayer board 110 under the control of the first gong belt.

[0070] Optionally, in one embodiment, in step S30: screen printing heat dissipation ink on the first surface 110a of the multilayer board 110 according to the through-hole data to form the heat dissipation ink layer 120, the following steps are included:

[0071] S31: Designing a printed film according to the through-hole data, the printed film being able to cover the position corresponding to the heat dissipation through-hole 103 in the first surface 110a of the multilayer board 110;

[0072] S32: using a printing film to make a screen tool, and using the screen tool to screen print heat dissipation ink on the first surface 110 a to form a heat dissipation ink layer 120 ;

[0073] Specifically, since the printed film can cover the position corresponding to the heat dissipation through hole 103 in the first surface 110a, when the screen tool made of the printed film is used to partially screen-print the heat dissipation ink on the first surface 110a, the heat dissipation ink will not cover the position corresponding to the heat dissipation through hole 103 in the first surface 110a. Therefore, when screen-printing the heat dissipation ink, the position corresponding to the heat dissipation through hole 103 does not need to be printed with heat dissipation ink, that is, there is no need to print the heat dissipation ink on a large area at the complete welding heat dissipation position, which is conducive to reducing the amount of heat dissipation ink used and saving manufacturing costs.

[0074] In one embodiment, in step S10: the step of manufacturing the multilayer board 110, the following steps are included:

[0075] S11: making multi-layer laminated boards;

[0076] S12 : Segment the multi-layer laminate to form a plurality of multi-layer boards 110 .

[0077] Illustratively, in one embodiment, a portion of the structure of a large integrated multilayer laminate is gonged away by a gong machine as required to divide the integrated multilayer laminate into a plurality of small units, each of which forms a multilayer board 110.

[0078] In one embodiment, in step S12: the step of dividing the multilayer laminate to form a plurality of multilayer boards 110, the following steps are included:

[0079] S121: Acquire frame data of multiple multilayer boards 110;

[0080] Specifically, the position and size of the frame of each multilayer board 110 in the multilayer laminated board are determined according to the design requirements of the drawing, thereby obtaining the frame data of the plurality of multilayer boards 110 .

[0081] S122: designing a second gong belt according to the frame data;

[0082] Specifically, the parameters of the second gong belt are set according to the position and size of each frame to ensure that the frames of each multilayer board 110 can be effectively gonged according to the second gong belt to cut the multilayer laminate into multiple multilayer boards 110.

[0083] S123: Utilize a second gong belt to gong the multi-layer laminate to gong away frames of the plurality of multi-layer laminates 110 , thereby obtaining the plurality of multi-layer laminates 110 .

[0084] Specifically, the second gong belt is introduced into the gong machine system, the multi-layer laminated board is placed on the gong machine, and the gong machine is started so that the gong machine can perform gong processing on the multi-layer laminated board under the control of the second gong belt to gong away the frame of each multi-layer board 110 to obtain multiple multi-layer boards 110.

[0085] In one embodiment, see Figure 1 In step S11: the step of making a multilayer laminate, the following steps are included:

[0086] S111: manufacturing a plurality of laminated layers 101 respectively;

[0087] Specifically, the laminated plate 101 may be formed by laminating a plurality of circuit boards, or may be a single circuit board.

[0088] S112: stacking and laminating a plurality of laminated sheets 101 to form a multi-layer laminated sheet.

[0089] Specifically, a plurality of laminated plates 101 are stacked in sequence along the thickness direction and laminated together on a laminating machine.

[0090] Further, in one embodiment, see Figure 1 In step S112: stacking and pressing a plurality of pressed sheets 101 to form a multi-layer pressed sheet, the following steps are included:

[0091] S1121: placing a prepreg 102 between two adjacent laminated sheets 101;

[0092] Specifically, the prepreg 102 is also called a "PP sheet". The prepreg 102 mainly includes resin and reinforcing materials. The reinforcing materials are divided into several types such as glass fiber cloth, paper base, and composite materials. The prepreg 102 can effectively bond the laminated boards 101.

[0093] S1122: Pressing a plurality of laminated sheets 101 and a prepreg sheet 102 disposed between two adjacent laminated sheets 101 together at a preset temperature and a preset pressure to form a multi-layer laminated sheet.

[0094] Specifically, under a preset temperature and a preset pressure, the prepreg 102 melts to bond two adjacent laminated sheets 101. The two adjacent laminated sheets 101 and the prepreg 102 disposed therebetween are laminated into an integrated structure to form a multi-layer laminated sheet.

[0095] Optionally, in one embodiment, after step S1122: laminating a plurality of laminated sheets 101 and a prepreg sheet 102 disposed between two adjacent laminated sheets 101 at a preset temperature and a preset pressure to form a multi-layer laminate, the following steps are further included:

[0096] S1123: Remove burrs from the periphery of the multi-layer laminate.

[0097] Specifically, the burrs on the periphery of the multilayer laminate can be removed by gong, milling or grinding, so that the edges of the multilayer laminate are smooth and flat.

[0098] Optionally, in one embodiment, the following steps are also included:

[0099] S1124: grinding the surface of the multi-layer laminate to roughen the surface of the multi-layer laminate.

[0100] Specifically, by grinding the surface of the multilayer laminate, the surface flash of the multilayer laminate can be removed, the surface of the multilayer laminate is roughened, and the contact area is increased, which is convenient for the subsequent attachment of an outer copper foil on the surface of the multilayer laminate.

[0101] Optionally, in one embodiment, the following steps are also included:

[0102] S1125: removing excess copper material on the surface of the multi-layer laminate, so that the thickness of the multi-layer laminate reaches a preset thickness.

[0103] Specifically, excess copper material on the surface of the multi-layer laminated board can be removed by chemical etching or the like, so that the thickness of the multi-layer laminated board reaches a preset thickness.

[0104] See also Figure 3 Optionally, in one embodiment, the laminated board 101 includes a substrate 101a and two circuit layers 101b formed on both sides of the substrate 101a. Specifically, the steps of making the laminated board 101 include the following steps:

[0105] S1111: dividing the bulk material into substrates 101a of a preset size;

[0106] Specifically, the bulk material may be a large-sized copper-clad laminate, and the substrate 101 a may be obtained by cutting the large-sized copper-clad laminate into designed sizes.

[0107] S1112: manufacturing circuit layers 101b on both sides of the substrate 101a;

[0108] Specifically, the steps of making the circuit layer 101b on the substrate 101a are as follows: covering the substrate 101a with a photosensitive film, irradiating the substrate 101a covered with the photosensitive film with ultraviolet light through the master sheet in a vacuum state, so as to project the pattern on the master sheet onto the photosensitive film. Then, the photosensitive film on the light-blocking part (unexposed part) of the substrate 101a blocked by the master sheet is washed off with alkaline water, and the exposed copper is etched off with a chemical solution, so that the circuit layer 101b can be formed on the substrate 101a. Finally, the substrate 101a is scanned by an optical instrument to check whether there are any defects.

[0109] S1113: performing a roughening process on the circuit layer 101b.

[0110] Exemplarily, the circuit layer 101b can be roughened by browning it. Specifically, the copper on the circuit layer 101b is oxidized to make the circuit layer 101b rough, which can enhance the bonding strength between the circuit layer 101b and the semi-cured sheet 102 during lamination and avoid delamination or board explosion.

[0111] like Figure 1 As shown, an embodiment of the present application further provides a multilayer circuit board 100, which includes a multilayer board 110 and an electronic component 130. The multilayer board 110 includes a first surface 110a and a second surface 110b which are arranged opposite to each other in the thickness direction of the multilayer board 110. The multilayer board 110 is provided with a heat dissipation through-hole 103 which penetrates along the thickness direction of the multilayer board 110. The first surface 110a is provided with a heat dissipation ink layer 120. In the thickness direction of the multilayer board 110, the heat dissipation ink layer 120 and the heat dissipation through-hole 103 are staggered. The welding pins of the electronic component 130 are welded to the welding positions of the second surface 110b. The heat dissipation pins of the electronic component 130 pass through the heat dissipation through-hole 103 and are connected to the heat dissipation ink layer 120.

[0112] In the above-mentioned multilayer circuit board 100, the heat dissipation ink layer 120 is arranged on the first surface 110a of the multilayer circuit board 110, the soldering pins of the electronic component 130 are soldered to the second surface 110b of the multilayer circuit board 110, and the heat dissipation pins 131 of the electronic component 130 can be connected to the heat dissipation ink layer 120 through the heat dissipation through hole 103, so that the electronic component 130 can be reliably loaded on the circuit board, and the generated heat can be directly transferred to the heat dissipation ink layer 120 through the heat dissipation pins 131. In this way, the direct contact area between the electronic component 130 and the heat dissipation ink layer 120 can be effectively increased. Therefore, compared with the solution of heat transfer through the circuit board as the medium, this design can effectively improve the heat transfer efficiency between the electronic component 130 and the heat dissipation ink layer 120, which is conducive to fully utilizing the heat dissipation performance of the heat dissipation ink, improving the heat dissipation performance of the multilayer circuit board 100, and ensuring the heat dissipation efficiency of the multilayer circuit board 100.

[0113] An embodiment of the present application further provides an electronic device, comprising the multilayer circuit board 100 in the above embodiment.

[0114] In the above-mentioned electronic device, the heat dissipation ink layer 120 is arranged on the first surface 110a of the multilayer board 110, the soldering pins of the electronic component 130 are soldered to the second surface 110b of the multilayer board 110, and the heat dissipation pins 131 of the electronic component 130 can be connected to the heat dissipation ink layer 120 through the heat dissipation through hole 103, so that the electronic component 130 can be reliably loaded on the circuit board, and the generated heat can be directly transferred to the heat dissipation ink layer 120 through the heat dissipation pins 131. In this way, the direct contact area between the electronic component 130 and the heat dissipation ink layer 120 can be effectively increased. Therefore, compared with the solution of heat transfer through the circuit board as the medium, this design can effectively improve the heat transfer efficiency between the electronic component 130 and the heat dissipation ink layer 120, which is conducive to fully utilizing the heat dissipation performance of the heat dissipation ink, improving the heat dissipation performance of the multilayer circuit board 100, and ensuring the heat dissipation efficiency of the multilayer circuit board 100, thereby helping to improve the stability and reliability of the electronic device.

[0115] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0116] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A method for manufacturing a multilayer circuit board, characterized in that: The following steps are involved: Making multilayer boards; Acquire through-hole data of a heat dissipation through-hole according to a circuit layout diagram, wherein the heat dissipation through-hole corresponds to a non-welding position of a multilayer board; Screen printing heat dissipation ink on the first surface of the multilayer board according to the through hole data to form a heat dissipation ink layer; Opening the heat dissipation through hole on the multilayer board according to the through hole data, wherein the heat dissipation through hole penetrates the multilayer board along the thickness direction of the multilayer board; The soldering pins of the electronic components are soldered to the soldering positions on the second surface of the multilayer board, so that the heat dissipation pins of the electronic components pass through the heat dissipation through holes and are connected to the heat dissipation ink layer, wherein the second surface and the first surface are arranged opposite to each other in the thickness direction of the multilayer board.

2. The method for manufacturing a multilayer circuit board according to claim 1, characterized in that: The step of opening the heat dissipation through hole on the multilayer board according to the through hole data includes the following steps: Designing a first gong belt according to the through hole data; The first gong tape is used to perform gong processing on the multilayer board to form the heat dissipation through hole.

3. The method for manufacturing a multilayer circuit board according to claim 1, characterized in that: In the step of screen printing heat dissipation ink on the first surface of the multilayer board according to the through hole data to form a heat dissipation ink layer, the following steps are included: Designing a printed film according to the through-hole data, wherein the printed film can cover a position corresponding to the heat dissipation through-hole in the first surface of the multilayer board; A screen tool is made using the printing film, and heat dissipation ink is screen-printed on the first surface using the screen tool to form a heat dissipation ink layer.

4. The method for manufacturing a multilayer circuit board according to claim 1, characterized in that: In the process of making a multilayer board, the following steps are included: Making multi-layer laminates; The multilayer laminate is divided to form a plurality of the multilayer boards.

5. The method for manufacturing a multilayer circuit board according to claim 4, characterized in that: In the step of dividing the multilayer laminate to form a plurality of the multilayer laminates, the following steps are included: Acquire frame data of a plurality of the multilayer boards; Designing a second gong belt according to the frame data; The multilayer laminate is gonged using the second gong belt to gong away the frames of the plurality of multilayer laminates to obtain the plurality of multilayer laminates.

6. The method for manufacturing a multilayer circuit board according to claim 4, characterized in that: The steps of making a multi-layer laminate include: respectively manufacturing a plurality of laminated layers; The plurality of laminated sheets are stacked and laminated to form the multi-layer laminated sheet.

7. The method for manufacturing a multilayer circuit board according to claim 6, characterized in that: The step of stacking and pressing the plurality of pressed sheets to form the multi-layer pressed sheet includes the following steps: A prepreg is arranged between two adjacent laminated sheets; The plurality of laminated sheets and the prepreg disposed between two adjacent laminated sheets are laminated together at a preset temperature and a preset pressure to form the multi-layer laminated sheet.

8. The method for manufacturing a multilayer circuit board according to claim 6, characterized in that: The steps of making the laminated board include: Divide bulk materials into substrates of preset sizes; Manufacturing circuit layers on both sides of the substrate; The circuit layer is roughened.

9. A multilayer circuit board, characterized in that: It includes a multilayer board and an electronic component, the multilayer board includes a first surface and a second surface arranged opposite to each other in the thickness direction of the multilayer board, the multilayer board is provided with a heat dissipation through hole penetrating along the thickness direction of the multilayer board, the first surface is provided with a heat dissipation ink layer, in the thickness direction of the multilayer board, the heat dissipation ink layer and the heat dissipation through hole are staggered, the welding pins of the electronic component are welded to the welding position of the second surface, and the heat dissipation pins of the electronic component pass through the heat dissipation through hole and are connected to the heat dissipation ink layer.

10. An electronic device, characterized in that: Including the multilayer circuit board as described in claim 9.

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