A magnetic device heat dissipation structure and method
By setting up rubber stopper grooves and thermal conduction mud on the PCB board, the problems of high cost and difficulty in sealing in the existing magnetic device heat dissipation structure are solved, and effective heat dissipation and high protection levels are achieved.
Patent Information
- Application Number
- CN202411817903.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-04-04
AI Technical Summary
In the existing thermal dissipation structure of magnetic devices, the use of fully-filled thermally conductive silicone is not only costly, but may also lead to waste and interference problems, and it is difficult to achieve sealing and high protection levels of power devices.
A magnetic device heat dissipation structure is designed. By setting a rubber stopper groove on the PCB board, the magnetic device is surrounded and thermally conductive mud is installed at the bottom of the magnetic device. The thermally conductive mud comes into contact with the magnetic device, and heat conduction is carried out with the water-cooled plate through the thermally conductive seal in the rubber stopper groove.
Effective heat dissipation of magnetic devices is achieved, the dependence on thermally conductive silicone is reduced, and the cost is reduced. Due to the local heat dissipation method, a high level of protection with good sealing can be achieved.
Smart Images
Figure CN119767624A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of PCB boards, and in particular to a heat dissipation structure and method for a magnetic device. Background Art
[0002] With the development of society, electrical components have become an indispensable tool in life. PCB boards are a very important component of electrical components. The operation of electrical appliances will cause the heating of magnetic components. Good heat dissipation is an important prerequisite for ensuring the stable operation of electrical components. In existing devices, air cooling and water cooling are generally used for heat dissipation. In the future, water-cooled and liquid-cooled power supplies will become the mainstream because they have the advantages of good adjustment, no wind, no dust, no noise, and good working conditions, so that the working time and life will be longer, the maintenance cost will be low, and it is more suitable for places where labor is expensive. Most water-cooled power supplies conduct heat through thermal conductive silicone. However, the price of thermal conductive silicone with high thermal conductivity is not low. Blindly filling the whole glue will not only cause waste, but also may cause interference problems.
[0003] Therefore, it is necessary to provide a magnetic device heat dissipation structure and method to perform local glue filling on the heat-generating device, which can greatly reduce costs and interference problems, facilitate production and subsequent maintenance, and the power device in the glue blocking groove cavity can be completely sealed, thereby achieving a high protection level. Summary of the invention
[0004] The invention discloses a magnetic device heat dissipation structure and method, which can effectively solve the technical problems involved in the background technology.
[0005] To achieve the above object, the technical solution of the present invention is:
[0006] A heat dissipation structure for a magnetic device, the magnetic device is used on a PCB board, the heat dissipation structure includes a glue blocking groove, the glue blocking groove is fixed on the top surface of the PCB board, the glue blocking groove is a vertical through-type, the magnetic device is located in the glue blocking groove and is installed on the PCB board, the PCB board is provided with an opening, the opening is located below the magnetic device, thermal conductive mud is provided at the opening, the thermal conductive mud is in contact with the magnetic device, a heat dissipation device for dissipating the thermal conductive mud is provided below the PCB board, and a thermal conductive seal is provided in the glue blocking groove.
[0007] The bottom PCB of the magnetic device is hollowed out, and thermal mud is placed in the hollowed-out part of the bottom of the PCB. The magnetic device is surrounded by a rubber blocking groove, and the pins of the magnetic device are welded on the PCB. The magnetic core sinks through the hollowed-out part of the PCB to contact the thermal mud. The rubber blocking groove cavity is filled with thermal conductive silicone (thermal conductive seal) material to make the magnetic device fully contact with the bottom thermal mud. The magnetic device is insulated and heat-conducted with the water-cooled plate through the thermal mud. The thermal mud is close to the bottom water-cooled plate radiator (heat dissipation device), and the heat is taken away by the water flow in the water-cooled plate to dissipate the heat. Through this heat dissipation method, the power device can achieve good heat dissipation and production in tight space applications, while saving costs. In addition, the power device in the rubber blocking groove cavity can be completely sealed, thereby achieving a high level of protection.
[0008] As a preferred improvement of the present invention: the glue blocking groove is welded to the PCB board.
[0009] As a preferred improvement of the present invention: the glue retaining groove is in a rectangular parallelepiped shape.
[0010] As a preferred improvement of the present invention: the magnetic device includes but is not limited to an inductor and a transformer.
[0011] As a preferred improvement of the present invention: the pins of the magnetic device are welded to the PCB board, and the magnetic core of the magnetic device is in contact with the thermal conductive mud.
[0012] As a preferred improvement of the present invention: the thermal conductive mud seals the opening.
[0013] As a preferred improvement of the present invention: the thermally conductive sealing member is thermally conductive silicone, and the thermally conductive silicone seals the magnetic device.
[0014] As a preferred improvement of the present invention: the heat dissipation device is a water-cooling plate, and the water-cooling plate is in contact with the thermal conductive mud.
[0015] As a preferred improvement of the present invention: the water-cooling plate includes a lower plate, a middle plate, an upper plate and a liquid tank, the lower plate, the middle plate and the upper plate are sealed and connected in sequence, the middle plate is provided with a liquid channel, the liquid channel includes an inlet and an outlet, the upper plate is provided with through holes at positions corresponding to the inlet and the outlet, the liquid tank is connected to the through holes, the liquid tank is used to store water-cooling liquid, and is provided with a refrigeration device and a liquid conveying device.
[0016] A method for dissipating heat from a magnetic device comprises the following steps:
[0017] S1, drilling holes in the PCB to form openings;
[0018] S2. Set a glue blocking groove at the position corresponding to the opening;
[0019] S3, install magnetic components in the rubber retaining groove;
[0020] S4. Heat-conducting mud is set at the opening, and heat-conducting sealing parts are set in the rubber retaining groove;
[0021] S5. Install a heat dissipation device and dissipate the heat from the thermal mud.
[0022] The beneficial effects of the present invention are as follows:
[0023] The structure is simple and the cost is low. The magnetic device is surrounded by the glue blocking groove and sealed with thermal conductive mud at the bottom, which can save thermal conductive silicone and at the same time meet the heat conduction of the power device to the water cooling plate. This local heat dissipation method can achieve good heat dissipation and tight connection, reduce the volume, have good sealing, and is easy to produce. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:
[0025] Figure 1 It is a top schematic diagram of a heat dissipation structure of a magnetic device of the present invention;
[0026] Figure 2 This is a bottom exploded schematic diagram of a heat dissipation structure of a magnetic device according to the present invention;
[0027] Figure 3 This is a schematic diagram of installing the heat-conducting seal of the present invention.
[0028] In the figure: 1-PCB board, 101-opening, 2-magnetic device, 3-glue blocking groove, 4-heat dissipation device, 401-lower plate, 402-middle plate, 403-upper plate, 404-liquid box, 5-thermal mud, 6-thermal sealing member. DETAILED DESCRIPTION
[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in combination with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0030] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0031] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0032] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0033] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.
[0034] See also Figure 1-Figure 3 As shown, the present invention provides a heat dissipation structure and method for a magnetic device. The magnetic device 2 is used on a PCB board 1. The heat dissipation structure includes a glue blocking groove 3. The glue blocking groove 3 is fixed on the top surface of the PCB board 1. The glue blocking groove 3 is a vertical through-type. The magnetic device 2 is located in the glue blocking groove 3 and is installed on the PCB board 1. The PCB board 1 is provided with an opening 101. The opening 101 is located below the magnetic device 2. A thermal conductive mud 5 is provided at the opening 101. The thermal conductive mud 5 is in contact with the magnetic device 2. A heat dissipation device 4 for dissipating the thermal conductive mud 5 is provided below the PCB board 1. A thermal conductive seal 6 is provided in the glue blocking groove 3. The glue blocking groove 3 is welded to the PCB board 1. The glue blocking groove 3 is in a rectangular parallelepiped shape (circular or other shapes). The magnetic device 2 includes but is not limited to an inductor and a transformer (any device that needs heat dissipation). The pins of the magnetic device 2 are welded to the PCB board 1, and the magnetic core of the magnetic device 2 is in contact with the thermal conductive mud 5. The thermal conductive mud 5 seals the opening 101 , the thermal conductive seal 6 is thermal conductive silicone, the thermal conductive silicone seals the magnetic device 2 , the heat dissipation device 4 is a water cooling plate (it can also be a fan cooling), and the water cooling plate is in contact with the thermal conductive mud 5 .
[0035] A structural method for local heat dissipation of magnetic devices, which is applied to local heat dissipation of magnetic devices. The bottom PCB of the magnetic device is hollowed out, and thermal mud is placed at the bottom of the PCB. The magnetic device is surrounded by a rubber stop groove. The pins of the magnetic device are welded on the PCB. The magnetic core sinks through the hollowed-out part of the PCB to contact the thermal mud. The cavity of the rubber stop groove is filled with thermal conductive silicone material so that the magnetic device is fully in contact with the bottom thermal mud. The magnetic device is insulated and heat-conducted with a water-cooled plate through the rubber stop groove, thermal conductive silicone and thermal conductive mud. The thermal conductive mud is close to the bottom water-cooled plate radiator, and the water flow in the water-cooled plate takes away the heat for heat dissipation. This local heat dissipation method can achieve good heat dissipation and tight connection, reduce volume, reduce costs, and is easy to produce. The rubber stop groove is made of metal thermal conductive material, the middle cavity of the rubber stop groove can surround the magnetic device, the cavity is filled with thermal conductive silicone material so that the magnetic device is fully in contact with the bottom thermal conductive mud, the magnetic device is surrounded by the rubber stop groove, and the bottom thermal conductive mud is sealed, which can save thermal conductive silicone and meet the heat conduction of power devices to the water-cooled plate.
[0036] As an embodiment, the water-cooled plate includes a lower plate 401, a middle plate 402, an upper plate 403 and a liquid tank, wherein the lower plate 401, the middle plate 402 and the upper plate 403 are sealed and connected in sequence, the middle plate 402 is provided with a liquid channel, the liquid channel includes an inlet and an outlet, the upper plate 403 is provided with through holes at positions corresponding to the inlet and the outlet, the liquid tank is connected to the through holes, the liquid tank is used to store water-cooled liquid, and is provided with a refrigeration device (semiconductor refrigeration plate) and a liquid delivery device (water pump). It should be further explained that the use of other components to achieve the above-mentioned effects should all fall within the inventive concept of the present invention and should fall within the protection scope of the present invention.
[0037] Working principle:
[0038] A method for dissipating heat from a magnetic device comprises the following steps:
[0039] S1, drilling a hole in the PCB board 1 to form an opening 101;
[0040] S2, setting a glue blocking groove 3 at a position corresponding to the opening 101;
[0041] S3, installing the magnetic device 2 in the rubber retaining groove 3;
[0042] S4, a heat-conducting mud 5 is arranged at the opening 101, and a heat-conducting sealing member 6 is arranged in the rubber retaining groove 3;
[0043] S5, installing the heat dissipation device 4, and dissipating the heat of the thermal conductive mud 5.
[0044] The magnetic device is surrounded by a rubber blocking groove and sealed with thermal conductive mud at the bottom, which can save thermal conductive silicone and at the same time meet the heat conduction requirements of the power device to the water cooling plate. This local heat dissipation method can achieve good heat dissipation and tight connection, reduce volume, have good sealing, and is easy to produce.
[0045] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the embodiments. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the illustrations shown and described herein.
Claims
1. A magnetic device heat dissipation structure, wherein the magnetic device (2) is used on a PCB board (1), characterized in that: The heat dissipation structure comprises a glue blocking groove (3), wherein the glue blocking groove (3) is fixed on the top surface of the PCB board (1), the glue blocking groove (3) is a through-type, the magnetic device (2) is located in the glue blocking groove (3) and is installed on the PCB board (1), the PCB board (1) is provided with an opening (101), the opening (101) is located below the magnetic device (2), a thermal conductive mud (5) is provided at the opening (101), the thermal conductive mud (5) is in contact with the magnetic device (2), a heat dissipation device (4) for dissipating heat from the thermal conductive mud (5) is provided below the PCB board (1), and a thermal conductive sealing component (6) is provided in the glue blocking groove (3).
2. A magnetic device heat dissipation structure according to claim 1, characterized in that: The glue blocking groove (3) is welded to the PCB board (1).
3. The magnetic device heat dissipation structure according to claim 1, characterized in that: The glue blocking groove (3) is in the shape of a rectangular parallelepiped.
4. The magnetic device heat dissipation structure according to claim 1, characterized in that: The magnetic device (2) includes but is not limited to an inductor and a transformer.
5. The magnetic device heat dissipation structure according to claim 1, characterized in that: The pins of the magnetic device (2) are welded to the PCB board (1), and the magnetic core of the magnetic device (2) is in contact with the thermal conductive mud (5).
6. The magnetic device heat dissipation structure according to claim 1, characterized in that: The thermal conductive mud (5) seals the opening (101).
7. The magnetic device heat dissipation structure according to claim 1, characterized in that: The heat-conductive sealing member (6) is heat-conductive silica gel, and the heat-conductive silica gel seals the magnetic device (2).
8. The magnetic device heat dissipation structure according to claim 1, characterized in that: The heat dissipation device (4) is a water-cooling plate, and the water-cooling plate is in contact with the heat-conducting mud (5).
9. The magnetic device heat dissipation structure according to claim 8, characterized in that: The water-cooling plate comprises a lower plate (401), a middle plate (402), an upper plate (403) and a liquid tank. The lower plate (401), the middle plate (402) and the upper plate (403) are sealed and connected in sequence. The middle plate (402) is provided with a liquid channel, and the liquid channel comprises an inlet and an outlet. The upper plate (403) is provided with through holes at positions corresponding to the inlet and the outlet. The liquid tank is connected to the through holes. The liquid tank is used to store water-cooling liquid and is provided with a refrigeration device and a liquid conveying device.
10. A method for heat dissipation of a magnetic device according to the heat dissipation structure of claim 1, characterized in that: The following steps are involved: S1, drilling a hole in a PCB board (1) to form an opening (101); S2, setting a glue blocking groove (3) at a position corresponding to the opening (101); S3, installing a magnetic device (2) in the rubber retaining groove (3); S4, a heat-conducting mud (5) is arranged at the opening (101), and a heat-conducting sealing member (6) is arranged in the rubber retaining groove (3); S5, installing a heat dissipation device (4) and dissipating heat from the thermal conductive mud (5).