Liquid oxygen supply device with high vacuum interlayer and vacuum brazing method and device thereof

Abstract

The present invention relates to the technical field of liquid oxygen supply devices, and discloses a liquid oxygen supply device with a high vacuum interlayer, including an oxygen supply device body, an outer liner and an inner liner are arranged in the oxygen supply device body, a high vacuum interlayer is formed between the outer liner and the inner liner, a bowl-shaped pit is arranged on the top of the oxygen supply device body, a plurality of exhaust holes are arranged at the bottom of the pit, the exhaust holes are connected to the high vacuum interlayer, and solder is welded on the exhaust holes to seal them. The present invention also discloses a vacuum brazing method and device for a liquid oxygen supply device with a high vacuum interlayer. The liquid oxygen supply device with a high vacuum interlayer of the present invention and the vacuum brazing method and device thereof, by providing a high vacuum interlayer, greatly reduce the heat exchange inside and outside the liquid oxygen supply device, and achieve a better welding effect.

Description

Technical Field

[0001] The invention relates to the technical field of liquid oxygen supply devices, and in particular to a liquid oxygen supply device with a high vacuum interlayer and a vacuum brazing method and device thereof. Background Art

[0004] At present, the main oxygen supply devices on the market use gaseous oxygen bags or air concentration to supply oxygen. The disadvantages of these two methods are that they take up a lot of space, have a small oxygen capacity, require an additional power supply, and are not convenient to carry around in the field for a long time. Using a liquid oxygen supply can meet the needs of lightness and large capacity.

[0005] However, liquid oxygen has a low boiling point of -183°C under normal pressure. When liquid oxygen accumulates in a closed system, pressure collapse may occur if it cannot be effectively kept warm. When the temperature rises to -118.4°C without increasing the pressure, the liquid oxygen cannot maintain a liquid state. If the pressure is not released in time, it will also cause a physical explosion.

[0006] Therefore, how to maintain the low temperature in the liquid oxygen supply device for a long time is an urgent problem to be solved. Summary of the invention

[0007] The purpose of the present invention is to address the deficiencies of the above-mentioned technology and provide a liquid oxygen supply device with a high vacuum interlayer and a vacuum brazing method and device thereof. By setting a high vacuum interlayer, the heat exchange inside and outside the liquid oxygen supply device is greatly reduced, and the welding effect is better.

[0008] To achieve the above-mentioned purpose, the liquid oxygen supply device with a high vacuum interlayer designed in the present invention comprises an oxygen supply device body, wherein an outer liner and an inner liner are arranged in the oxygen supply device body, a high vacuum interlayer is formed between the outer liner and the inner liner, a bowl-shaped pit is arranged on the top of the oxygen supply device body, a plurality of exhaust holes are arranged at the bottom of the pit, the exhaust holes are connected to the high vacuum interlayer, and solder is welded on the exhaust holes to seal them.

[0009] Preferably, a layer of reflective copper foil is applied on the outer wall of the inner container. During the heat exchange process, the reflective copper foil can reflect the heat radiation back, thereby reducing the heat loss.

[0010] Preferably, the diameter of the exhaust hole is 1-1.5 mm to prevent the solder from flowing into the high vacuum interlayer when it melts, and the maximum diameter of the pit is 6-8 mm to facilitate the placement of the solder.

[0011] Preferably, the solder is glass based.

[0012] A vacuum brazing method for a liquid oxygen supply device with a high vacuum interlayer comprises the following steps:

[0013] A) preparing the oxygen supply body to be welded;

[0014] B) placing a plurality of oxygen supply bodies in a material frame, and placing a solder in a recess of each of the oxygen supply bodies;

[0015] C) Place the material frame into a heating furnace and seal it;

[0016] D) Use a low vacuum unit to evacuate the heating furnace;

[0017] E) Heat the heating furnace and use a high vacuum unit to evacuate the heating furnace until the solder melts and blocks the exhaust holes, and then cool naturally until the solder solidifies;

[0018] F) Fill the heating furnace with argon gas;

[0019] G) After vacuum brazing is completed, the oxygen supply device body is taken out of the furnace.

[0020] Preferably, in step D), the air is pumped to 10 0 Pa.

[0021] Preferably, in step E), the air is pumped to 10 -3 Pa, further increase the vacuum degree and reduce heat exchange.

[0022] Preferably, in the step E), when the heating furnace is heated, the temperature is first raised to 300-350°C within 40-60 minutes, kept warm for 10-20 minutes, then raised to 350-400°C within 10-20 minutes, kept warm for 40-60 minutes, and finally raised to 500-520°C within 40-60 minutes, kept warm for 20-30 minutes, and the heating is stopped and naturally cooled to 150°C. By stepwise heating, the solder is better melted and the exhaust hole is sealed.

[0023] A vacuum brazing device for a liquid oxygen supply device with a high vacuum interlayer comprises a heating furnace connected to a low vacuum unit and a high vacuum unit, and is also provided with an argon filling valve connected to an argon gas bottle, to implement a vacuum brazing method for a liquid oxygen supply device with a high vacuum interlayer.

[0024] Compared with the prior art, the present invention has the following advantages:

[0025] 1. By setting up a high vacuum interlayer, the heat exchange inside and outside the liquid oxygen supply device is greatly reduced;

[0026] 2. By setting up the reflective copper foil, during the heat exchange process, the reflective copper foil can reflect the heat radiation back, thereby reducing the heat loss.

[0027] 3. Through the combination of pits, exhaust holes and solder, automatic welding at high temperature is realized without the need for additional manual intervention, ensuring the airtightness of the heating furnace and improving the vacuum degree;

[0028] 4. It can continuously evacuate during high-temperature welding without affecting the air tightness of the heating furnace, further improving the vacuum degree;

[0029] 5. Raise the temperature in steps to allow the solder to melt better and seal the evacuation holes. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic structural diagram of a liquid oxygen supply device with a high vacuum interlayer according to the present invention;

[0031] Figure 2 for Figure 1 Enlarged view of part A in the middle.

[0032] The components in the figure are numbered as follows:

[0033] Oxygen supply device body 1, outer liner 2, inner liner 3, high vacuum interlayer 4, pit 5, reflective copper foil 6. DETAILED DESCRIPTION

[0034] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0036] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] Example 1

[0038] like Figure 1 As shown, a liquid oxygen supply device with a high vacuum interlayer comprises an oxygen supply device body 1, wherein an outer liner 2 and an inner liner 3 are arranged inside the oxygen supply device body 1, a high vacuum interlayer 4 is formed between the outer liner 2 and the inner liner 3, a bowl-shaped pit 5 is arranged on the top of the oxygen supply device body 1, an exhaust hole is arranged at the bottom of the pit 5, the exhaust hole is connected with the high vacuum interlayer 4, and solder is welded on the exhaust hole to seal it.

[0039] In this embodiment, the diameter of the exhaust hole is 1 mm, the maximum diameter of the pit is 6 mm, and the solder is glass-based.

[0040] The vacuum brazing of the liquid oxygen supply device with a high vacuum interlayer in this embodiment includes the following steps:

[0041] A) preparing an oxygen supply device body 1 to be welded;

[0042] B) placing a plurality of oxygen supply body 1 in the material frame, and placing a solder in the pit of each oxygen supply body 1. Since the solder is solid at this time, it will not block the air extraction hole;

[0043] C) Place the material frame into a heating furnace and seal it;

[0044] D) Use the low vacuum unit to evacuate the heating furnace. At this time, the vacuum is evacuated to 10 0 Pa;

[0045] E) heating the heating furnace and simultaneously using a high vacuum unit to evacuate the heating furnace until the solder melts and blocks the evacuation holes, and then naturally cools until the solder solidifies. Specifically, in this step, the temperature is further increased and the evacuation can be increased to 10 -3 Pa, when heating the heating furnace, first heat it to 300°C within 40 minutes, keep it warm for 10 minutes, then heat it to 350°C within 10 minutes, keep it warm for 40 minutes, and finally heat it to 500°C within 40 minutes, keep it warm for 20 minutes, stop heating, and naturally cool it to 150°C. In this process, the solder gradually dissolves. Due to the small diameter of the exhaust hole, under the action of liquid tension, the solder will not enter the high vacuum interlayer 4, but will cover the entire exhaust hole. When heating is stopped and naturally cooled, the solder solidifies to complete the sealing welding of the exhaust hole;

[0046] F) Argon is flushed into the heating furnace to further reduce the temperature and balance the gas pressure in the heating furnace;

[0047] G) After vacuum brazing is completed, the oxygen supply device body is taken out of the furnace.

[0048] The vacuum brazing device used in this embodiment includes a heating furnace, which is connected to a low vacuum unit and a high vacuum unit, and is also provided with an argon filling valve connected to an argon gas bottle.

[0049] Example 2

[0050] like Figure 1 As shown, a liquid oxygen supply device with a high vacuum interlayer comprises an oxygen supply device body 1, wherein an outer liner 2 and an inner liner 3 are arranged inside the oxygen supply device body 1, a high vacuum interlayer 4 is formed between the outer liner 2 and the inner liner 3, a bowl-shaped pit 5 is arranged on the top of the oxygen supply device body 1, an exhaust hole is arranged at the bottom of the pit 5, the exhaust hole is connected with the high vacuum interlayer 4, and solder is welded on the exhaust hole to seal it.

[0051] In this embodiment, the diameter of the exhaust hole is 1.5 mm, the maximum diameter of the pit is 8 mm, and the solder is glass-based.

[0052] In addition, in this embodiment, a layer of reflective copper foil 6 is applied on the outer wall of the inner container 3. During the heat exchange process, the reflective copper foil 6 can reflect the heat radiation back, thereby reducing the heat loss.

[0053] The vacuum brazing of the liquid oxygen supply device with a high vacuum interlayer in this embodiment includes the following steps:

[0054] A) preparing an oxygen supply device body 1 to be welded;

[0055] B) placing a plurality of oxygen supply body 1 in the material frame, and placing a solder in the pit of each oxygen supply body 1. Since the solder is solid at this time, it will not block the air extraction hole;

[0056] C) Place the material frame into a heating furnace and seal it;

[0057] D) Use the low vacuum unit to evacuate the heating furnace. At this time, the vacuum is evacuated to 10 0 Pa;

[0058] E) heating the heating furnace and simultaneously using a high vacuum unit to evacuate the heating furnace until the solder melts and blocks the evacuation holes, and then naturally cools until the solder solidifies. Specifically, in this step, the temperature is further increased and the evacuation can be increased to 10 -3 Pa, when heating the heating furnace, first heat it to 350°C within 60 minutes, keep it warm for 20 minutes, then heat it to 400°C within 20 minutes, keep it warm for 60 minutes, and finally heat it to 520°C within 60 minutes, keep it warm for 30 minutes, stop heating, and naturally cool it to 150°C. In this process, the solder gradually dissolves. Due to the small diameter of the exhaust hole, under the action of liquid tension, the solder will not enter the high vacuum interlayer 4, but will cover the entire exhaust hole. When heating is stopped and naturally cooled, the solder solidifies to complete the sealing welding of the exhaust hole;

[0059] F) Argon is flushed into the heating furnace to further reduce the temperature and balance the gas pressure in the heating furnace;

[0060] G) After vacuum brazing is completed, the oxygen supply device body is taken out of the furnace.

[0061] The vacuum brazing device used in this embodiment includes a heating furnace, which is connected to a low vacuum unit and a high vacuum unit, and is also provided with an argon filling valve connected to an argon gas bottle.

[0062] The liquid oxygen supply device with a high vacuum interlayer and the vacuum brazing method and device thereof of the present invention greatly reduce the heat exchange inside and outside the liquid oxygen supply device by providing a high vacuum interlayer 4; by providing a reflective copper foil 6, during the heat exchange process, the reflective copper foil 6 can reflect the heat radiation back, thereby reducing the heat loss; through the cooperation of the pit 5, the exhaust hole and the solder, automatic welding under high temperature conditions is realized without the need for additional human intervention, thereby ensuring the air tightness of the heating furnace and improving the vacuum degree; vacuuming can be continuously performed during the high-temperature welding process without affecting the air tightness of the heating furnace, thereby further improving the vacuum degree; through the step-by-step heating, the solder can be better melted to seal the exhaust hole.

[0063] At the same time, it should be noted that the description of the above technical solutions is exemplary, and this specification can be embodied in different forms and should not be construed as being limited to the technical solutions set forth herein. On the contrary, providing these descriptions will make the disclosure of the present invention thorough and complete, and will fully convey the scope disclosed in this specification to those skilled in the art. In addition, the technical solutions of the present invention are limited only by the scope of the claims. The features of the various embodiments of the present invention may be partially or completely combined or spliced ​​with each other, and may be performed in various different configurations as those skilled in the art may fully understand. The embodiments of the present invention may be performed independently of each other, or may be performed together in a mutually dependent relationship.

[0064] For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, and the above structures should be regarded as belonging to the protection scope of the present invention.

Claims

1. A liquid oxygen supply device with a high vacuum interlayer, comprising an oxygen supply device body (1), characterized in that: The oxygen supply device body (1) is provided with an outer liner (2) and an inner liner (3), a high vacuum interlayer (4) is formed between the outer liner (2) and the inner liner (3), a bowl-shaped recess (5) is provided on the top of the oxygen supply device body (1), a plurality of exhaust holes are provided at the bottom of the recess (5), the exhaust holes are connected to the high vacuum interlayer (4), and solder is welded on the exhaust holes to seal them.

2. The liquid oxygen supply device with a high vacuum interlayer according to claim 1, characterized in that: A layer of reflective copper foil (6) is laid on the outer wall of the inner container (3).

3. The liquid oxygen supply device with a high vacuum interlayer according to claim 1, characterized in that: The diameter of the air extraction hole is 1 to 1.5 mm, and the maximum diameter of the pit is 6 to 8 mm.

4. The liquid oxygen supply device with a high vacuum interlayer according to claim 1, characterized in that: The solder is glass based.

5. A vacuum brazing method for a liquid oxygen supply device with a high vacuum interlayer as claimed in claim 1, characterized in that: The steps include: A) preparing an oxygen supply device body (1) to be welded; B) placing a plurality of oxygen supply body (1) in a material frame, and placing a solder in a recess of each oxygen supply body (1); C) Place the material frame into a heating furnace and seal it; D) Use a low vacuum unit to evacuate the heating furnace; E) Heat the heating furnace and use a high vacuum unit to evacuate the heating furnace until the solder melts and blocks the exhaust holes, and then cool naturally until the solder solidifies; F) Argon gas is flushed into the heating furnace; G) After vacuum brazing is completed, the oxygen supply device body is taken out of the furnace.

6. The vacuum brazing method for a liquid oxygen supply device with a high vacuum interlayer according to claim 5, characterized in that: In the step D), the air is pumped to 10 0 Pa.

7. The vacuum brazing method of the liquid oxygen supply device with a high vacuum interlayer according to claim 5, characterized in that: In the step E), the air is pumped to 10 -3 Pa.

8. The vacuum brazing method for a liquid oxygen supply device with a high vacuum interlayer according to claim 5, characterized in that: In the step E), when heating the heating furnace, the temperature is first raised to 300-350° C. within 40-60 minutes, kept warm for 10-20 minutes, then raised to 350-400° C. within 10-20 minutes, kept warm for 40-60 minutes, and finally raised to 500-520° C. within 40-60 minutes, kept warm for 20-30 minutes, and then the heating is stopped and naturally cooled to 150° C.

9. A vacuum brazing device for a liquid oxygen supply device with a high vacuum interlayer, characterized in that: It comprises a heating furnace, which is connected to a low vacuum unit and a high vacuum unit, and is also provided with an argon filling valve connected to an argon gas bottle, and performs the vacuum brazing method of a liquid oxygen supply device with a high vacuum interlayer as claimed in claim 5.

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