Wafer grinding sheet and manufacturing process

Abstract

The invention discloses a wafer grinding sheet and a manufacturing process. The wafer grinding sheet comprises a grinding turntable, and a grinding sheet body is detachably arranged at the bottom of the grinding turntable; the limiting and stabilizing device comprises a nut for splicing the grinding sheet body and the grinding turntable, a threaded column, a limiting block arranged at the top of the grinding sheet body, a limiting groove formed in the bottom of the grinding turntable and a check block arranged on the inner side face of the limiting groove, and when the limiting block is inserted into the limiting groove, the limiting block abuts against the check block; the fastening seat is detachably arranged at the center of the top of the grinding turntable; the wafer grinding disc has the beneficial effects that the replacement efficiency of the grinding disc body and the mounting precision of the grinding rotary disc are improved, so that the higher and higher requirements of the semiconductor manufacturing field on the wafer grinding disc are met, the production cost can be reduced, the production efficiency can be improved, the wafer polishing quality and stability can be further improved, and the product quality is improved. And powerful support is provided for development of the semiconductor manufacturing field.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer grinding sheets, and in particular relates to a wafer grinding sheet and a manufacturing process thereof. Background Art

[0002] Wafer grinding sheets are made by using ultra-precision coating technology to evenly disperse micron or nano-level grinding powders with high-performance adhesives, coating them on the surface of high-strength PET polyester film, and then undergoing high-precision cutting technology; they are mainly used for polishing the wafer surface to improve the flatness, smoothness and dimensional accuracy of the wafer surface, thereby improving the quality and performance of the chip.

[0003] A fast-flow-conducting and heat-dissipating silicon grinding disc with publication number CN219767859U is disclosed, which includes a grinding turntable, a grinding disc body is fixedly provided at the bottom of the grinding turntable, and the grinding turntable is connected to a driving structure through a fastening mechanism.

[0004] The existing wafer grinding sheets have the following problems when used:

[0005] First, the grinding sheet body needs to be replaced regularly due to wear and performance degradation during use; however, existing wafer grinding sheets often lack effective definition and fixation when replacing the grinding sheet body, resulting in a cumbersome and inefficient replacement process, which not only increases production costs, but also may affect the continuity and stability of wafer polishing;

[0006] The grinding turntable is usually connected to the driving structure through a fastening mechanism to achieve rotation and drive during the grinding process; however, the existing fastening mechanism often lacks effective calibration during installation, and the installation position of the fastening seat is usually located at the top center of the grinding turntable, which also increases the complexity and difficulty of installation. Summary of the invention

[0007] The purpose of the present invention is to provide a wafer grinding sheet and a manufacturing process to improve the replacement efficiency of the grinding sheet body and the installation accuracy of the grinding turntable, so as to meet the increasingly high requirements for wafer grinding sheets in the semiconductor manufacturing field.

[0008] To achieve the above object, the present invention provides the following technical solution: a wafer grinding sheet, comprising

[0009] A grinding turntable, wherein a grinding sheet body is detachably provided at the bottom of the grinding turntable;

[0010] A limiting and stabilizing device, the limiting and stabilizing device includes a nut and a threaded column for splicing the grinding sheet body and the grinding turntable, a limiting block arranged on the top of the grinding sheet body, a limiting groove provided at the bottom of the grinding turntable, and a stopper arranged on the inner side of the limiting groove, and when the limiting block is inserted into the limiting groove, the limiting block abuts against the stopper;

[0011] The fastening seat is detachably arranged at the top center of the grinding turntable.

[0012] As a preferred technical solution of the present invention, the height of the stopper is smaller than the depth of the limiting groove, and a receiving groove for the threaded column to pass through is provided at the bottom of the grinding sheet body.

[0013] As a preferred technical solution of the present invention, it also includes a positioning ring arranged at the bottom of the fastening seat, and a slot for inserting the positioning ring is opened at the top of the grinding turntable.

[0014] As a preferred technical solution of the present invention, it also includes a fastening ring, a first stopper bar, and a second stopper bar which are arranged inside the slot, and the fastening ring, the first stopper bar, and the second stopper bar can abut against the positioning ring.

[0015] As a preferred technical solution of the present invention, a first fastening ear is provided at one end of the first baffle, and a second fastening ear is provided at one end of the second baffle.

[0016] As a preferred technical solution of the present invention, it also includes a connecting piece for fixing the first fastening ear and the second fastening ear, and a fixing hole is opened inside the connecting piece.

[0017] As a preferred technical solution of the present invention, it also includes a connecting column arranged on the top of the fastening seat, and a flange plate arranged on the top of the connecting column and connected to the driving structure.

[0018] The present invention also discloses a process for manufacturing a wafer grinding sheet, comprising the following steps:

[0019] Select silicon carbide grinding powder;

[0020] Mix the selected micronized powder with a high-performance binder to ensure that the micronized powder is evenly dispersed in the binder;

[0021] The mixed mixture of ground micro powder and adhesive is coated on the surface of high-strength PET polyester film;

[0022] After coating, the abrasive sheet is cured;

[0023] The cured abrasive sheets are cut to meet the size requirements of different wafer polishers.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] The designed limiting and stabilizing device can realize the disassembly of the worn grinding sheet body. When replacing, pick up the grinding sheet body and insert it into the limiting groove along the relative stopper, which increases the limitation of the splicing of the grinding sheet body and the grinding turntable, making it more convenient to splice the grinding sheet body and the grinding turntable through nuts and threaded columns;

[0026] The addition of positioning rings and slots increases the positioning when the fastening seat and the grinding turntable are spliced;

[0027] It helps to improve the replacement efficiency of the grinding sheet body and the installation accuracy of the grinding turntable, thereby meeting the increasingly high requirements for wafer grinding sheets in the semiconductor manufacturing field. It can not only reduce production costs and improve production efficiency, but also further improve the quality and stability of wafer polishing, providing strong support for the development of the semiconductor manufacturing field. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural schematic diagram of the present invention;

[0029] Figure 2 It is a schematic diagram of the splicing structure of the grinding sheet body and the grinding turntable of the present invention;

[0030] Figure 3 It is a schematic diagram of the three-dimensional structure of the fastening seat of the present invention;

[0031] Figure 4 It is a schematic diagram of the top view of the grinding turntable of the present invention;

[0032] Figure 5 For the present invention Figure 4 Schematic diagram of the enlarged structure of the H region;

[0033] In the figure: 1, grinding turntable; 11, limiting groove; 110, stopper; 12, slot; 2, grinding plate body; 21, limiting block; 3, fastening seat; 31, positioning ring; 4, connecting column; 5, flange; 6, nut; 7, threaded column; 81, fastening ring; 82, first stopper; 820, first fastening ear; 83, second stopper; 830, second fastening ear; 9, connecting plate. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Example 1

[0036] See also Figure 1-Figure 5 , is a first embodiment of the present invention, which provides a wafer grinding sheet, comprising

[0037] The grinding turntable 1 has a grinding sheet body 2 which can be disassembled and installed at the bottom of the grinding turntable 1. When the grinding sheet body 2 is worn, it can be disassembled and replaced to ensure the normal grinding work;

[0038] A limiting and stabilizing device, the limiting and stabilizing device includes a nut 6 and a threaded column 7 for splicing the grinding sheet body 2 and the grinding turntable 1. The nut 6 and the threaded column 7 are used to cooperate to achieve the stable splicing of the grinding sheet body 2 and the grinding turntable 1. The limiting block 21 arranged on the top of the grinding sheet body 2 realizes the addition of the limiting block 21. The limiting groove 11 provided at the bottom of the grinding turntable 1 realizes the opening of the limiting groove 11. The stopper 110 provided on the inner side of the limiting groove 11 realizes the addition of the stopper 110. When the limiting block 21 is inserted into the limiting groove 11, the limiting block 21 abuts against the stopper 110. When the grinding sheet body 2 is worn, the nut 6 is loosened, the threaded column 7 is removed, and the grinding sheet body 2 is pulled down, so that the worn grinding sheet body 2 can be disassembled. When replacing, the grinding sheet body 2 is picked up and inserted into the limiting groove 11 along the relative stopper 110, thereby increasing the limitation of the splicing of the grinding sheet body 2 and the grinding turntable 1, making it more convenient to splice the grinding sheet body 2 and the grinding turntable 1 through the nut 6 and the threaded column 7.

[0039] The fastening seat 3 is detachably arranged at the top center of the grinding turntable 1, which can realize the disassembly and assembly of the fastening seat 3 and the grinding turntable 1, thereby increasing the convenience of use.

[0040] In this embodiment, preferably, the height of the stopper 110 is smaller than the depth of the limiting groove 11 , and a receiving groove for the threaded column 7 to pass through is provided at the bottom of the grinding sheet body 2 , so as to facilitate the installation of additional threaded columns 7 .

[0041] In the present embodiment, preferably, a positioning ring 31 is further included at the bottom of the fastening seat 3, so that the positioning ring 31 is added, and a slot 12 is opened at the top of the grinding turntable 1 for the positioning ring 31 to be inserted, thereby increasing the positioning of the fastening seat 3 and the grinding turntable 1 when they are spliced ​​by screws.

[0042] In the present embodiment, preferably, a fastening ring 81, a first baffle 82, and a second baffle 83 are also included which are arranged inside the slot 12, and the fastening ring 81, the first baffle 82, and the second baffle 83 can abut against the positioning ring 31, which helps to further increase the performance of the splicing and positioning of the fastening seat 3 and the grinding turntable 1, and can reinforce the positioned fastening seat 3, so that the fastening seat 3 and the grinding turntable 1 can be fixed more conveniently by screws.

[0043] In the present embodiment, preferably, a first fastening ear 820 is provided at one end of the first baffle 82, thereby realizing the addition of the first fastening ear 820, and a second fastening ear 830 is provided at one end of the second baffle 83, thereby realizing the addition of the second fastening ear 830; and a connecting piece 9 is also included for fixing the first fastening ear 820 and the second fastening ear 830, and a fixing hole is provided inside the connecting piece 9. The connecting piece 9 uses the cooperation of screws and the fixing holes to realize the fixation of the first fastening ear 820 and the second fastening ear 830, thereby helping to realize the stable splicing of the first baffle 82 and the second baffle 83.

[0044] In the present embodiment, preferably, it also includes a connecting column 4 arranged on the top of the fastening seat 3, so that the connecting column 4 is added, and a flange 5 arranged on the top of the connecting column 4 and connected to the driving structure can be spliced ​​with the driving structure and the flange 5, so that the rotation of the grinding turntable 1 can be realized, and when the grinding turntable 1 rotates, it drives the grinding sheet body 2 to rotate.

[0045] Example 2

[0046] See also Figure 1-Figure 5 , which is a second embodiment of the present invention, provides a process for manufacturing a wafer grinding sheet, comprising the following steps:

[0047] Selection of grinding powder:

[0048] Abrasive powder is the core component of wafer grinding discs. Its type and particle size directly affect the grinding effect and the quality of the wafer surface. Abrasive powder includes diamond, silicon carbide, aluminum oxide, etc. The specific choice of abrasive powder depends on the characteristics of the wafer material and the required polishing effect.

[0049] Mix the selected abrasive powder with a high-performance binder to ensure that the abrasive powder is evenly dispersed in the binder. This step is the key to making wafer grinding sheets, because the uniform distribution of the abrasive powder will directly affect the polishing performance of the grinding sheet and the flatness of the wafer surface.

[0050] The mixture of the mixed abrasive powder and the adhesive is coated on the surface of the high-strength PET polyester film. The coating process requires precise control of the thickness and uniformity of the coating to ensure that the abrasive sheet can provide a stable grinding effect during the polishing process;

[0051] After coating, the abrasive sheet needs to be cured. Curing is to cure the adhesive by heating, so that the abrasive powder is firmly fixed on the PET polyester film. The curing process requires strict control of temperature and time to avoid affecting the performance and stability of the abrasive sheet.

[0052] The cured abrasive sheets need to be cut to meet the size requirements of different wafer polishers. The cutting process requires high-precision equipment and processes to ensure the dimensional accuracy and edge quality of the abrasive sheets.

[0053] Finally, the cut abrasive sheets are inspected, including appearance inspection, size measurement and performance testing, to ensure that the quality of the abrasive sheets meets the standards. The qualified abrasive sheets will be packaged for storage and transportation.

[0054] Although the embodiments of the present invention have been shown and described, as detailed above, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer grinding sheet, characterized in that: include A grinding turntable (1), wherein a grinding sheet body (2) is detachably provided at the bottom of the grinding turntable (1); A limiting and stabilizing device, the limiting and stabilizing device comprising a nut (6) and a threaded column (7) for splicing a grinding sheet body (2) and a grinding turntable (1), a limiting block (21) arranged at the top of the grinding sheet body (2), a limiting groove (11) provided at the bottom of the grinding turntable (1), and a stopper (110) arranged on the inner side of the limiting groove (11); when the limiting block (21) is inserted into the limiting groove (11), the limiting block (21) abuts against the stopper (110); A fastening seat (3), wherein the fastening seat (3) is detachably arranged at the top center of the grinding turntable (1).

2. The wafer grinding sheet according to claim 1, characterized in that: The height of the stopper (110) is smaller than the depth of the limiting groove (11), and a receiving groove for the threaded column (7) to pass through is provided at the bottom of the grinding sheet body (2).

3. The wafer grinding sheet according to claim 1, characterized in that: It also includes a positioning ring (31) arranged at the bottom of the fastening seat (3), and a slot (12) provided at the top of the grinding turntable (1) for the positioning ring (31) to be inserted.

4. The wafer grinding sheet according to claim 3, characterized in that: It also includes a fastening ring (81), a first stopper (82), and a second stopper (83) which are arranged inside the slot (12), and the fastening ring (81), the first stopper (82), and the second stopper (83) can abut against the positioning ring (31).

5. The wafer grinding sheet according to claim 4, characterized in that: One end of the first baffle (82) is provided with a first fastening ear (820), and one end of the second baffle (83) is provided with a second fastening ear (830).

6. The wafer grinding sheet according to claim 5, characterized in that: It also includes a connecting piece (9) for fixing the first fastening ear (820) and the second fastening ear (830), and a fixing hole is provided inside the connecting piece (9).

7. The wafer grinding sheet according to claim 1, characterized in that: It also includes a connecting column (4) arranged on the top of the fastening seat (3), and a flange (5) arranged on the top of the connecting column (4) and connected to the driving structure.

8. A process for manufacturing a wafer grinding sheet according to any one of claims 1 to 7, characterized in that: The steps include: Select silicon carbide grinding powder; Mix the selected micronized powder with a high-performance binder to ensure that the micronized powder is evenly dispersed in the binder; The mixed mixture of ground micro powder and adhesive is coated on the surface of high-strength PET polyester film; After coating, the abrasive sheet is cured; The cured abrasive sheets are cut to meet the size requirements of different wafer polishers.

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