Pressurized sintering equipment for semiconductor connection and application method and sintering process thereof

Abstract

The invention discloses a pressure sintering device for semiconductor connection and a using method and a sintering process thereof, and relates to the technical field of semiconductor production, the pressure sintering device comprises a frame, the frame is provided with an upper fixing plate and a lower mounting platform which can perform mold closing action, and the close ends of the upper fixing plate and the lower mounting platform are respectively provided with a pressurizing structure and a heating structure; an opening cavity used for containing the heating structure is formed in the upper fixing plate, a heating part is arranged in the opening cavity, so that when the upper fixing plate and the lower mounting platform are in a closed mode, a to-be-sintered workpiece is placed in the closed opening cavity, and the pressurizing structure is used for pressurizing the to-be-sintered workpiece; the heating component and the heating structure are used for heating the top end and the bottom end of the to-be-sintered workpiece correspondingly. The pressurizing structure and the heating structure are arranged on the upper fixing plate and the lower mounting platform correspondingly, and the open cavity is ingeniously used for containing the heating structure, so that effective pressure applying and uniform heating on the workpiece to be sintered are achieved, and the sintering efficiency and quality are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and in particular to a pressure sintering device for semiconductor connection, a use method thereof and a sintering process. Background Art

[0002] Semiconductor sintering technology is widely used in electronics, machinery, chemical industry and other fields, especially in semiconductor packaging, power devices and other fields. However, semiconductor sintering technology also faces some challenges, such as precise control of sintering temperature and time, prevention of material oxidation, and improvement of material density. In order to solve these challenges, it is necessary to adopt advanced sintering technologies and processes, such as hot pressing sintering, spark plasma sintering, etc., and continuously optimize process parameters and process flow.

[0003] With the continuous advancement of the new energy revolution, the operating environment in the high-power field has put forward higher requirements on the chip junction temperature, power density, reliability, etc. of the power module. Low-temperature connection technology represented by nanosilver sintering is the main trend of power devices towards high-temperature resistant and high-reliability applications. Because nanosilver paste or nanosilver film needs to be heated and pressurized during sintering to achieve high-reliability connection. When sintering the workpiece, the sintering equipment in the prior art is based on its conventional heating and pressurizing method, and thus cannot evenly heat and evenly pressurize the sintered workpiece, which can easily reduce the reliability of the sintered product. In the actual sintering process, the conventional heating and pressurizing method will cause the workpiece to be sintered to reach the required target temperature and target pressure, and it will continue to heat and pressurize for a period of time, that is, over-temperature and over-pressure will occur. In this case, the temperature and pressure need to be slowly reduced to the target temperature and target pressure before sintering can be carried out. Summary of the invention

[0004] The purpose of the present invention is to solve the problems in the prior art and to propose a pressurized sintering device for semiconductor connection. The sintering device applies balanced pressure to the workpiece to be sintered through a pressurized structure, and at the same time, a heating component and a heating structure are used to heat the top and bottom ends of the workpiece to be sintered respectively, thereby achieving uniform heating of the workpiece to be sintered. Under the joint action of the two, the workpiece to be sintered is quickly placed in a target temperature and target pressure atmosphere.

[0005] To solve the above problems, the present invention provides the following technical solutions:

[0006] A pressure sintering device for semiconductor connection includes a frame, wherein the frame is provided with an upper fixed plate and a lower mounting platform capable of performing a mold closing action, a pressure structure and a heating structure are respectively provided at the adjacent ends of the upper fixed plate and the lower mounting platform, and an open cavity for accommodating the heating structure is provided at the upper fixed plate, and a heating component is provided at the open cavity, so that when the upper fixed plate and the lower mounting platform are in a mold closing state, a workpiece to be sintered is placed in the closed open cavity, and the pressure structure is used to apply pressure to the workpiece to be sintered, and the heating component and the heating structure are respectively used to heat the top and bottom ends of the workpiece to be sintered.

[0007] As a further solution of the present invention: the heating structure includes a heating plate, a heating tube and a temperature sensor, all of which are arranged on the top of the lower mounting platform, and a groove for carrying the workpiece to be sintered is opened on the top of the heating plate; the heating tube is arranged on the peripheral side of the heating plate and is used to supply heat to the heating plate; the temperature sensor is used to detect the temperature of the heating plate.

[0008] As a further solution of the present invention: the pressurizing structure includes a connecting cylinder fixedly arranged at the bottom of the upper fixed plate, a piston box fixedly arranged at the bottom of the connecting cylinder, the piston box is used to seal the bottom end of the connecting cylinder to form a sealed cavity inside the connecting cylinder, a plurality of pistons are movably arranged in the vertical direction in the piston box, and the top ends of the plurality of pistons can extend into the sealed cavity, an assembly rack is fixedly arranged at the bottom of the piston box, and the bottom surface of the assembly rack is used to match with the top surface of the heating plate, so that when the upper fixed plate and the lower mounting platform are in a mold closing action, the bottom surface of the assembly rack is in a sealed contact state with the top surface of the heating plate.

[0009] As a further solution of the present invention: a mounting hole is provided on the assembly frame, a pressure block is movably provided on the mounting hole in the vertical direction, and the top of the pressure block is fixedly connected to the bottom ends of multiple pistons. When the pressure block moves toward the sealing cavity on the mounting hole, the open cavity is formed between the bottom end of the pressure block and the mounting hole.

[0010] As a further solution of the present invention: the equipment also includes an atmosphere control structure, which includes a vacuum pump and a vacuum gauge arranged at the bottom of the assembly frame, so that when the bottom surface of the assembly frame and the top surface of the heating plate are in a sealed contact state and the workpiece to be sintered is placed in the closed open cavity, the vacuum pump is used to vacuum the closed open cavity.

[0011] As a further solution of the present invention: the heating component is arranged on the assembly frame and / or the pressing block.

[0012] As a further solution of the present invention: the pressure blocks are provided in plurality and are respectively installed at the bottom ends of a plurality of pistons, and the diameter of each piston is different.

[0013] As a further solution of the present invention: the upper fixed plate is fixedly arranged at the upper position of the frame, the lower mounting platform is slidably arranged at the lower position of the frame, and a driving source is arranged on the frame, and the driving source is used to drive the lower mounting platform to move towards or away from the upper fixed plate.

[0014] Furthermore, the present invention also provides a method for using a pressure sintering device for semiconductor connection, comprising the following steps:

[0015] Step 1: Place the workpiece to be sintered on the groove of the heating plate. At this time, the workpiece to be sintered will be higher than the groove. Then drive the lower mounting platform to drive the heating plate upward, so that the workpiece to be sintered pushes the pressure block upward until the top surface of the heating plate and the bottom surface of the assembly frame are sealed and abutted, so that the workpiece to be sintered is placed in the closed opening cavity;

[0016] Step 2: Use a booster valve to increase the pressure in the sealed chamber so that the piston and the pressing block have a downward movement tendency. Under the aforementioned pressure of the workpiece to be sintered by the deadweight of the pressing block, this movement tendency will increase the pressure effect of the pressing block on the workpiece to be sintered;

[0017] Step 3: Use a vacuum pump to evacuate the closed opening cavity so that the oxygen content or vacuum degree in the opening cavity meets the requirements;

[0018] Step 4: Use the heating plate located below and the heating component located above to heat the workpiece to be sintered, so that the top and bottom ends of the workpiece to be sintered are heated at the same time;

[0019] Step 5: Keep the workpiece to be sintered in the above-mentioned state for a set time to complete sintering.

[0020] Furthermore, the present invention also proposes a sintering process for semiconductor connection, comprising the following steps:

[0021] Step 1: placing the workpiece to be sintered in a sealed space and evacuating the sealed space;

[0022] Step 2: Apply pressure to the workpiece to be sintered in the sealed space so that it withstands a pressure between 10-25 MPa;

[0023] Step 3: Heat the workpiece to be sintered in the sealed space at a temperature between 200-250°C;

[0024] Step 4: Maintain the vacuum, pressure and temperature between 3-15 minutes to complete sintering.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. The advantage of the sintering equipment of the present application lies in the rationality of the structural design. By respectively arranging a pressure structure and a heating structure on the upper fixed plate and the lower mounting platform, and cleverly using the open cavity to accommodate the heating structure, effective pressure and uniform heating of the sintered workpiece are achieved, thereby improving the sintering efficiency and quality.

[0027] 2. Through the setting of the heating structure, the combined use of the heating plate, heating tube and temperature sensor not only provides a stable heat source, but also can monitor the heating temperature in real time to ensure the accuracy and controllability of the sintering process.

[0028] 3. Through the detailed design of the pressurizing structure and the ingenious cooperation of the connecting cylinder, piston box and piston, the pressure in the sealing chamber is precisely controlled, so that appropriate pressure can be applied to the sintered workpiece as needed to improve the sintering density and strength.

[0029] 4. The arrangement of the pressing block and the opening cavity at the assembly stand has the advantages of compact structure and diverse functions. The movable arrangement of the pressing block not only realizes the closing and opening of the opening cavity, but also can dynamically pressurize the workpiece to be sintered by the up and down movement of the piston. The workpiece to be sintered has been pressed against the pressing block during the upward process, that is, the workpiece to be sintered will be subjected to an initial downward pressing force, and then the downward pressure of these multiple pistons can increase the downward pressing force of the pressing block on the workpiece to be sintered. In this process, the force on the workpiece to be sintered gradually increases, which ensures the integrity of the workpiece to be sintered and the stability of the pressure, and no overpressure will occur.

[0030] 5. The advantage of setting up the atmosphere control structure is the precise control of the sintering environment. By using the vacuum pump and the vacuum gauge together, the vacuum degree in the closed opening can be precisely adjusted, thereby effectively eliminating oxygen and other impurities during the sintering process and improving the sintering quality.

[0031] 6. The advantage of the setting position of the heating component is the flexibility and adaptability of the heating method. The heating component can be set on the assembly frame and / or the pressing block. The appropriate heating method can be selected according to actual needs to ensure that the workpiece to be sintered can be heated evenly and improve the sintering effect.

[0032] 7. The pressing blocks are provided in plurality and are respectively installed at the bottom ends of the plurality of pistons. The diameter of each piston is different. The advantage is that the corresponding pressing blocks can be adapted to press the workpiece to be sintered, ensuring that each workpiece to be sintered is subjected to different pressing effects, thereby realizing synchronous sintering processing of different workpieces to be sintered, and having a wide range of adaptability.

[0033] 8. The setting mode of the upper fixed plate and the lower mounting platform and the function of the driving source have the advantages of structural stability and convenient operation. Through the combination of fixed setting and sliding setting, as well as the driving action of the driving source, precise control and stable movement of the upper and lower templates are achieved, thereby improving the reliability and stability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present invention will be further described below in conjunction with the accompanying drawings.

[0035] Figure 1 It is a three-dimensional structural schematic diagram of the present invention;

[0036] Figure 2 It is a three-dimensional schematic diagram of the heating structure and the pressurizing structure in the present invention;

[0037] Figure 3 This is a schematic cross-sectional view of the pressurized structure in the present invention. Figure 1 ;

[0038] Figure 4 This is a schematic cross-sectional view of the pressurized structure in the present invention. Figure 2 ;

[0039] Figure 5 It is a three-dimensional schematic diagram of the heating structure in the present invention.

[0040] In the figure: 101, frame; 110, heating structure; 111, heating plate; 112, heating tube; 113, temperature sensor; 114, lower mounting platform; 115, groove; 120, pressurizing structure; 121, opening cavity; 122, connecting tube; 124, pressing block; 125, upper fixing plate; 126, assembly frame; 127, piston box; 129, piston; 131, sealing chamber; 142, crank; 143, driving motor. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] Embodiment 1:

[0043] like Figure 1-Figure 5As shown, a pressure sintering device for semiconductor connection includes a frame 101, an upper fixing plate 125 is fixedly arranged at the upper position of the frame 101, and a lower mounting platform 114 is slidably arranged at the lower position of the frame 101, and the lower mounting platform 114 can be driven to move toward the upper fixing plate 125 until the two are in close contact. Among them, a heating structure 110 is arranged on the lower mounting platform 114, and a pressurizing structure 120 and an atmosphere control structure are arranged on the upper fixing plate 125. The three structures are described as follows:

[0044] (1) A heating structure 110, which includes a heating plate 111, a heating tube 112 and a temperature sensor 113, all of which are arranged on the top of a lower mounting platform 114. A groove 115 is provided on the top of the heating plate 111, and the groove 115 is used to carry the workpiece to be sintered. The heating tube 112 is arranged on the peripheral side of the heating plate 111 and is used to supply heat to the heating plate 111 so that the workpiece to be sintered can reach a specified sintering temperature. The temperature sensor 113 is used to detect the temperature of the heating plate 111 so that the temperature of the heating plate 111 can be feedback controlled.

[0045] (2) A pressurizing structure 120. The pressurizing structure 120 includes a connecting tube 122 fixedly arranged at the bottom of an upper fixing plate 125. A piston box 127 is fixedly arranged at the bottom of the connecting tube 122. The piston box 127 is used to seal the bottom end of the connecting tube 122 so that a sealed cavity 131 is formed inside the connecting tube 122. At the same time, a plurality of pistons 129 are movably arranged in the vertical direction in the piston box 127, and the top ends of the plurality of pistons 129 can extend into the sealed cavity 131. An assembly frame 126 is fixedly arranged at the bottom of the piston box 127. The assembly frame 126 is provided with a mounting hole. A pressure block 124 is movably arranged in the vertical direction on the mounting hole, and the top end of the pressure block 124 is fixedly connected to the bottom ends of the plurality of pistons 129. A boost valve is provided on the assembly frame 126 , and an electric proportional valve is provided on the connecting tube 122 . The boost valve can increase the pressure in the sealing chamber 131 to drive the multiple pistons 129 to drive the pressure block 124 to move downward. The electric proportional valve is used to control the outflow and closing of the gas in the sealing chamber 131 .

[0046] In the initial state, the pressing block 124 itself will be completely placed in the mounting hole. At this time, the state of the pressing block 124 can be Figure 3To illustrate, when the workpiece to be sintered is placed in the groove 115 on the heating plate 111, the lower mounting platform 114 can be driven to move upward. Since the workpiece to be sintered is higher than the groove 115, the workpiece to be sintered will first collide with the pressing block 124. As the lower mounting platform 114 continues to move upward, the workpiece to be sintered will drive the pressing block 124 and the plurality of pistons 129 to move upward until the top surface of the heating plate 111 is sealed against the bottom surface of the assembly frame 126. During this process, an open cavity 121 is formed between the bottom end of the pressing block 124 and the mounting hole. The position of the open cavity 121 can be determined by Figure 4 In the case where the top surface of the heating plate 111 is in sealing contact with the bottom surface of the assembly frame 126, the open cavity 121 will be closed, and the workpiece to be sintered will be located in the closed open cavity 121. At the same time, the pressure in the sealed cavity 131 is increased, so that the multiple pistons 129 drive the pressing block 124 to have a downward movement trend. Since the workpiece to be sintered has been pressed against the pressing block 124 during the upward process, the workpiece to be sintered will be subjected to an initial downward pressing force, and then the downward pressure of the multiple pistons 129 can increase the downward pressing force of the pressing block 124 on the workpiece to be sintered. In this process, the force on the workpiece to be sintered gradually increases, which ensures the integrity of the workpiece to be sintered and the stability of the pressure, and there will be no overpressure.

[0047] (3) Atmosphere control structure. The atmosphere control structure includes a vacuum pump and a vacuum gauge disposed at the bottom of the assembly frame 126. Based on the existence of the above-mentioned open cavity 121, the vacuum pump and the vacuum gauge are located in the open cavity 121. When the top surface of the heating plate 111 and the bottom surface of the assembly frame 126 are in a sealed contact state, the vacuum pump can evacuate the closed open cavity 121, and the vacuum gauge can detect the vacuum degree of the closed open cavity 121 to ensure that the oxygen content in the closed open cavity 121 is ≤200PPM, or the vacuum degree is ≤50Pa, so that the workpiece to be sintered is not oxidized during the subsequent sintering process.

[0048] Combining the above three structural designs, when the lower mounting platform 114 is driven upward and is in a mold closing state with the upper fixed plate 125, the workpiece to be sintered on the heating plate 111 will be located in the closed open cavity 121, and then the closed open cavity 121 can be evacuated to make the oxygen content and vacuum degree in the closed open cavity 121 meet the corresponding sintering requirements, and then the heating plate 111 can be used to heat the workpiece to be sintered.

[0049] Furthermore, in this embodiment, several heating tubes 112 are arranged in a plug-in manner so that the heating tubes 112 are symmetrically installed on both sides of the heating plate 111. This will divide the heating plate 111 into several areas, and the power output of the heating tubes 112 is controlled by feedback through several temperature sensors 113, thereby ensuring the controllability of the temperature of each area of ​​the heating plate 111.

[0050] Furthermore, in order to ensure that the workpiece to be sintered is heated uniformly, a heating component identical to the heating plate 111 may be fixedly provided on the bottom surface of the assembly frame 126 and / or the pressing block 124. The heating component is a conventional technical means. Accordingly, the assembly frame 126 and / or the pressing block 124 is also provided with a temperature sensor 113 connected to the heating component. When the workpiece to be sintered on the heating plate 111 is located in the closed opening 121, the above-mentioned heating component can not only press the top of the workpiece to be sintered, but also heat the top thereof. In conjunction with the heating of the bottom of the workpiece to be sintered by the heating plate 111 on the lower mounting platform 114, the workpiece to be sintered can be heated uniformly as a whole. This not only ensures that the workpiece to be sintered is heated to a specified temperature in a relatively short time, but also prevents over-temperature.

[0051] In order to extend the service life of the lower mounting platform 114, a heat insulation board is arranged on the top of the lower mounting platform 114, and the heating plate 111 is arranged on the heat insulation board; in order to quickly cool down the lower mounting platform 114 and the upper fixing plate 125, water cooling pipelines can be arranged on both.

[0052] Preferably, the pressing block 124 can be provided in plurality, and the plurality of pressing blocks 124 are respectively fixedly connected to the bottom ends of the plurality of pistons 129, instead of Figure 3 As shown in the figure, the entire pressing block 124 is fixedly connected to the bottom ends of multiple pistons 129. Under this arrangement, there are two working states:

[0053] 1) The diameter of each piston 129 is the same, that is, each pressing block 124 is subjected to the same gas pressure. By placing multiple workpieces of the same batch to be sintered in the groove 115 on the heating plate 111, the processing consistency of the multiple workpieces to be sintered is achieved.

[0054] 2) The diameters of the pistons 129 are different and are evenly arranged, that is, each pressing block 124 is subjected to a different gas pressure. A plurality of different types of workpieces to be sintered are placed in the grooves 115 on the heating plate 111, and each workpiece to be sintered is adapted to the position of the corresponding type of piston 129, so that the corresponding pressing block 124 can be adapted to press the workpiece to be sintered, ensuring that each workpiece to be sintered is subjected to a different pressing effect, thereby achieving synchronous sintering processing of different workpieces to be sintered.

[0055] In order to conveniently drive the lower mounting platform 114 to move upward, a driving source is provided on the frame 101, and the driving source includes a driving motor 143 and a crank 142 both provided at the bottom of the frame 101, and the two ends of the crank 142 are respectively connected to the output shaft of the driving motor 143 and the lower mounting platform 114, so that when the driving motor 143 is working, its output shaft can drive the crank 142 to extend and drive the lower mounting platform 114 to move upward. It should be noted that the driving source used to drive the lower mounting platform 114 to move in this embodiment is not provided in the above-mentioned design, and can also be provided as a cylinder, oil cylinder or electric telescopic rod in the prior art.

[0056] Embodiment 2:

[0057] A method for using a pressure sintering device for semiconductor connection comprises the following steps:

[0058] Step 1: Place the workpiece to be sintered on the groove 115 of the heating plate 111. At this time, the workpiece to be sintered will be higher than the groove 115. Then drive the lower mounting platform 114 to drive the heating plate 111 upward, so that the workpiece to be sintered pushes the pressing block 124 upward until the top surface of the heating plate 111 and the bottom surface of the assembly frame 126 are sealed and abutted, so that the workpiece to be sintered is placed in the closed opening cavity 121.

[0059] Step 2: Use the booster valve to increase the pressure in the sealed chamber 131, so that the piston 129 and the pressing block 124 have a downward movement tendency. Under the aforementioned pressure of the workpiece to be sintered by the self-weight of the pressing block 124, this movement tendency will increase the pressure effect of the pressing block 124 on the workpiece to be sintered;

[0060] Step 3: Using a vacuum pump to evacuate the closed opening cavity 121 so that the oxygen content or vacuum degree in the opening cavity 121 meets the requirements;

[0061] Step 4: using the heating plate 111 located below and the heating component located above to heat the workpiece to be sintered, so that the top and bottom ends of the workpiece to be sintered are heated at the same time;

[0062] Step 5: Keep the workpiece to be sintered in the above-mentioned state for a set time to complete sintering.

[0063] Embodiment three:

[0064] A sintering process for semiconductor connection, comprising the following steps:

[0065] Step 1: placing the workpiece to be sintered in a sealed space and evacuating the sealed space;

[0066] Step 2: Apply pressure to the workpiece to be sintered in the sealed space so that it withstands a pressure between 10-25 MPa;

[0067] Step 3: Heat the workpiece to be sintered in the sealed space at a temperature between 200-250°C;

[0068] Step 4: Maintain the vacuum, pressure and temperature between 3-15 minutes to complete sintering.

[0069] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A pressure sintering device for semiconductor connection, characterized in that: The invention comprises a frame (101), wherein the frame (101) is provided with an upper fixing plate (125) and a lower mounting platform (114) capable of performing a mold closing action, and the adjacent ends of the upper fixing plate (125) and the lower mounting platform (114) are respectively provided with a pressurizing structure (120) and a heating structure (110), and the upper fixing plate (125) is provided with an open cavity (121) for accommodating the heating structure (110), and the open cavity (121) is provided with a heating component, so that when the upper fixing plate (125) and the lower mounting platform (114) are in a mold closing state, the workpiece to be sintered is placed in the closed open cavity (121), and the pressurizing structure (120) is used to pressurize the workpiece to be sintered, and the heating component and the heating structure (110) are respectively used to heat the top and bottom ends of the workpiece to be sintered.

2. A pressure sintering device for semiconductor connection according to claim 1, characterized in that: The heating structure (110) comprises a heating plate (111), a heating tube (112) and a temperature sensor (113) all arranged on the top of a lower mounting platform (114); a groove (115) for carrying a workpiece to be sintered is provided on the top of the heating plate (111); the heating tube (112) is arranged on the peripheral side of the heating plate (111) and is used to supply heat to the heating plate (111); and the temperature sensor (113) is used to detect the temperature of the heating plate (111).

3. A pressure sintering device for semiconductor connection according to claim 2, characterized in that: The pressurizing structure (120) comprises a connecting tube (122) fixedly arranged at the bottom of an upper fixed plate (125); a piston box (127) fixedly arranged at the bottom of the connecting tube (122); the piston box (127) is used to seal the bottom end of the connecting tube (122) so as to form a sealed cavity (131) inside the connecting tube (122); a plurality of pistons (129) are movably arranged in a vertical direction in the piston box (127); and the top ends of the plurality of pistons (129) can extend into the sealed cavity (131); an assembly frame (126) is fixedly arranged at the bottom of the piston box (127); the bottom surface of the assembly frame (126) is used to match the top surface of the heating plate (111) so that when the upper fixed plate (125) and the lower mounting platform (114) perform a mold closing action, the bottom surface of the assembly frame (126) and the top surface of the heating plate (111) are in a sealed contact state.

4. The pressure sintering equipment for semiconductor connection according to claim 3, characterized in that: The assembly frame (126) is provided with a mounting hole, on which a pressure block (124) is movably provided in a vertical direction, and the top of the pressure block (124) is fixedly connected to the bottom ends of a plurality of pistons (129). When the pressure block (124) moves toward the sealing cavity (131) on the mounting hole, the open cavity (121) is formed between the bottom end of the pressure block (124) and the mounting hole.

5. The pressure sintering equipment for semiconductor connection according to claim 4, characterized in that: The device also includes an atmosphere control structure, which includes a vacuum pump and a vacuum gauge arranged at the bottom of the assembly frame (126), so that when the bottom surface of the assembly frame (126) and the top surface of the heating plate (111) are in a sealed contact state and the workpiece to be sintered is placed in the closed open cavity (121), the vacuum pump is used to evacuate the closed open cavity (121).

6. A pressure sintering device for semiconductor connection according to claim 4 or 5, characterized in that: The heating component is arranged on the assembly frame (126) and / or the pressing block (124).

7. The pressure sintering equipment for semiconductor connection according to claim 4, characterized in that: The pressure blocks (124) are arranged in plurality and are respectively installed at the bottom ends of a plurality of pistons (129), and the diameter of each piston (129) is different.

8. A pressure sintering device for semiconductor connection according to any one of claims 1 to 5, characterized in that: The upper fixed plate (125) is fixedly arranged at an upper position of the frame (101), the lower mounting platform (114) is slidably arranged at a lower position of the frame (101), and a driving source is arranged on the frame (101), the driving source is used to drive the lower mounting platform (114) to move towards or away from the upper fixed plate (125).

9. A method for using a pressure sintering device for semiconductor connection according to claim 1, characterized in that: The steps include: Step 1: placing the workpiece to be sintered on the groove (115) of the heating plate (111), at which time the workpiece to be sintered is higher than the groove (115), and then driving the lower mounting platform (114) to drive the heating plate (111) upward, so that the workpiece to be sintered pushes the pressing block (124) upward until the top surface of the heating plate (111) and the bottom surface of the assembly frame (126) are in sealing contact, so that the workpiece to be sintered is placed in the closed opening cavity (121); Step 2: Using a pressure-boosting valve to increase the pressure in the sealed chamber (131), so that the piston (129) and the pressing block (124) have a downward movement tendency. When the workpiece to be sintered is pressed by the weight of the pressing block (124), the movement tendency increases the pressing effect of the pressing block (124) on the workpiece to be sintered. Step 3: using a vacuum pump to evacuate the closed open cavity (121) so that the oxygen content or vacuum degree in the open cavity (121) meets the requirements; Step 4: using the heating plate (111) located below and the heating component located above to heat the workpiece to be sintered, so that the top and bottom ends of the workpiece to be sintered are heated at the same time; Step 5: Keep the workpiece to be sintered in the above-mentioned state for a set time to complete sintering.

10. A sintering process for semiconductor connection using the method of claim 1, characterized in that: The steps include: Step 1: placing the workpiece to be sintered in a sealed space and evacuating the sealed space; Step 2: Apply pressure to the workpiece to be sintered in the sealed space so that it withstands a pressure between 10-25 MPa; Step 3: Heat the workpiece to be sintered in the sealed space at a temperature between 200-250°C; Step 4: Maintain the vacuum, pressure and temperature between 3-15 minutes to complete sintering.

Images