Semiconductor heating plate surface deformation detection device and method

Abstract

The invention relates to the technical field of surface deformation detection, and discloses a semiconductor heating plate surface deformation detection device and method. Under the driving of the mobile driving mechanism, the bearing platform drives the to-be-detected semiconductor heating disc to move below the detection groove, in the moving process of the bearing platform, the shielding mechanism can shield the mobile driving mechanism, and under the common shielding effect of the fixed frame, the mounting platform and the shielding baffle, the to-be-detected semiconductor heating disc can be detected. The movable driving mechanism can be isolated from the external environment, external dust and other impurities can be effectively prevented from entering the moving space of the movable driving mechanism, and the accuracy of the movable driving mechanism for driving the bearing platform to move can be effectively guaranteed; each probe detection mechanism and the microscopic detection mechanism traverse the to-be-detected plane of the semiconductor heating disc and jointly carry out deformation detection on the to-be-detected plane of the semiconductor heating disc, so that the accuracy degree of deformation detection is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of surface deformation detection, and in particular to a device and method for detecting surface deformation of a semiconductor heating plate. Background Art

[0002] In semiconductor manufacturing, the heating plate is a commonly used device used to provide a high temperature environment to promote chemical reactions or physical processes. Specifically, the heating plate not only provides stable and precise temperature control to ensure the smooth progress of the etching process, but also promotes uniform heat transfer, improves the accuracy and efficiency of etching, and effectively prevents material defects caused by temperature fluctuations. In addition, the heating plate also assumes the function of mechanical support to ensure that the semiconductor material remains stable throughout the entire processing process, thereby improving the overall process reliability and product quality.

[0003] However, the surface of the heating plate may deform during use. Slight deformation of the surface of the heating plate may trigger a series of chain reactions, seriously affecting the quality and production efficiency of semiconductor products. Among them, slight deformation of the surface of the heating plate will cause changes in the heat conduction path, which will cause uneven temperature distribution. This temperature difference may produce different degrees of thermal stress in different areas of the wafer, which will eventually be reflected in the quality of the finished product.

[0004] The unevenness of the heating plate surface will be directly transmitted to the wafer, especially in the high-temperature processing stage. The increased wafer warpage not only increases the difficulty of subsequent processes, but may also cause wafer breakage in some cases. Wafer warpage will also interfere with the alignment accuracy of the lithography machine and reduce the yield rate. The long-term accumulated deformation of the heating plate surface will affect the overall performance of the heating plate. As the deformation increases, the heating plate may not be able to maintain the required temperature accuracy, resulting in a decrease in the thermal management efficiency of the entire system, increased energy consumption, and higher operating costs. In some special processes, such as plasma enhanced chemical vapor deposition (PECVD), the uneven surface of the heating plate may lead to the formation of local hot spots, which may trigger unexpected chemical reactions and even cause safety hazards.

[0005] Therefore, before the semiconductor heating disk is put into use, it is necessary to perform surface deformation detection on the semiconductor heating disk to prevent the heating disk from affecting the production process of semiconductor products. Summary of the invention

[0006] In view of the deficiencies in the prior art, the present invention provides a device and method for detecting surface deformation of a semiconductor heating plate.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: A semiconductor heating plate surface deformation detection device comprises a bearing support and a fixed frame, wherein the fixed frame is fixed to the top of the bearing support, a mounting platform is arranged at the top of the fixed frame, and a bearing platform is arranged inside the fixed frame and below the mounting platform; a detection groove is opened on one side of the surface of the mounting platform, a shielding baffle is arranged on the top of the fixed frame and on the side of the mounting platform close to the detection groove, and a moving drive mechanism is arranged at the bottom of the bearing platform, and the moving drive mechanism can drive the bearing platform to move inside the space surrounded by the fixed frame, the mounting platform and the shielding baffle; the bearing platform A shielding mechanism is also provided on the outer side of the platform, and during the movement of the carrying platform, the shielding mechanism can shield the moving drive mechanism; a plurality of probe detection mechanisms are provided on the upper surface of the mounting platform and located on the outer side of the detection slot, and a microscopic detection mechanism is provided on the upper surface of the mounting platform and on the side away from the detection slot; the interior of the carrying platform can carry a semiconductor heating disk, and under the drive of the moving drive mechanism, the carrying platform moves with the semiconductor heating disk, and each of the probe detection mechanisms and the microscopic detection mechanism traverses the plane to be detected of the semiconductor heating disk, and jointly performs deformation detection on the plane to be detected of the semiconductor heating disk.

[0008] Preferably, the supporting platform includes a supporting shell, and the top of the supporting shell is provided with an end supporting groove, a base supporting circular groove and an external supporting ring, the external supporting ring is arranged on the outside of the base supporting circular groove, and the external supporting ring can rotate on the top of the supporting shell, and the end and the base of the semiconductor heating plate are respectively placed in the end supporting groove and the base supporting circular groove.

[0009] Preferably, a plurality of substrate positioning units are provided at the top of the external support ring and outside the substrate bearing circular groove, and a supporting sandbag is provided at the bottom end of the substrate bearing circular groove; the substrate of the semiconductor heating disk can slide on the surface of the supporting sandbag, and each of the substrate positioning units can cooperate to drive the substrate axis of the semiconductor heating disk to be colinear with the axis of the substrate bearing circular groove; each of the substrate positioning units can cooperate to press the planes to be tested of semiconductor heating disks of different thicknesses onto the same measuring plane, and when each of the substrate positioning units jointly presses the semiconductor heating disk, the supporting sandbag can be deformed to fit the bottom shape of the semiconductor heating disk.

[0010] Preferably, a rotation driving cylinder is provided at the bottom end of the external support collar, and the movable end of the rotation driving cylinder is connected to the external support collar via a driving connecting rod, and the driving connecting rod is rotationally connected to the external support collar and the rotation driving cylinder; the movable end of the rotation driving cylinder can be extended and retracted to drive the external support collar through the driving connecting rod to drive each of the base positioning units to rotate around the axis of the base bearing circular groove.

[0011] Preferably, the base positioning unit includes a positioning drive cylinder and a pressing splint, a pushing support plate is provided at the bottom end of the pressing splint, the movable end of the positioning drive cylinder is fixed between the pressing splint, and the positioning drive cylinder can drive the pressing splint and the pushing support plate to move together in the axial direction of the base bearing circular groove; a plurality of sliding balls are embedded in the side of the pressing splint and the pushing support plate close to the semiconductor heating plate, and each of the sliding balls can rotate independently.

[0012] Preferably, each of the positioning drive cylinders extends synchronously, driving each of the propulsion support plates to move synchronously toward the axial direction of the substrate bearing circular groove, jointly driving the semiconductor heating disk to slide on the surface of the supporting sandbag, driving the substrate axis of the semiconductor heating disk and the axis of the substrate bearing circular groove to be colinear; during the detection process of the probe detection mechanism and the microscopic detection mechanism, the rotation drive cylinder drives each of the pressing clamps and each of the propulsion support plates to rotate around the axis of the semiconductor heating disk, exposing the partially obscured surface of the semiconductor heating disk to be detected.

[0013] Preferably, the mobile driving mechanism includes a transverse driving motor, a transverse limiting rail, a mobile mounting plate, a longitudinal driving motor and a longitudinal limiting rail; the transverse driving motor and the transverse limiting rail are fixed to the inner bottom end of the fixed frame, the bottom end of the mobile mounting plate is matched with the transverse limiting rail, the driving end of the transverse driving motor is coaxially fixed to a transverse driving rod, and the transverse driving rod is threadedly connected to the mobile mounting plate; the longitudinal driving motor and the longitudinal limiting rail are fixed to the top end of the mobile mounting plate, the bottom end of the bearing shell is matched with the longitudinal limiting rail, the driving end of the longitudinal driving motor is coaxially fixed to the longitudinal driving rod, and the longitudinal driving rod is threadedly connected to the bearing shell.

[0014] Preferably, the shielding baffle includes a fixed baffle and a sliding baffle, sliding tracks are provided on both sides of the fixed baffle, the sliding baffle fits with the sliding track, and the sliding baffle can slide under the limit of the sliding track; the shielding mechanism includes two transverse shielding curtains and two longitudinal shielding curtains, a transverse connecting plate is provided at one end of the transverse shielding curtain, and the end of the transverse shielding curtain away from the transverse connecting plate is rolled up inside the transverse winding box, and a longitudinal connecting plate is provided at one end of the longitudinal shielding curtain, and the end of the longitudinal shielding curtain away from the longitudinal connecting plate is rolled up inside the longitudinal winding box.

[0015] Preferably, the two horizontal connecting plates are respectively fixed on both sides of the movable mounting plate, and when the movable mounting plate moves, the horizontal winding box on one side unwinds the corresponding horizontal shielding curtain, and the horizontal winding box on the other side rolls up the corresponding horizontal shielding curtain; the two vertical connecting plates are respectively fixed on both sides of the bearing shell, and when the bearing shell moves, the vertical winding box on one side unwinds the corresponding vertical shielding curtain, and the vertical winding box on the other side rolls up the corresponding vertical shielding curtain.

[0016] A method for detecting surface deformation of a semiconductor heating plate, using the above-mentioned device for detecting surface deformation of a semiconductor heating plate, comprises the following steps: Open the shielding baffle, place the semiconductor heating plate to be tested with the surface to be tested facing upward inside the carrying platform, and close the shielding baffle; The mobile driving mechanism drives the carrying platform to drive the semiconductor heating plate to be tested to move under the testing tank; During the movement of the semiconductor heating disk, each probe detection mechanism and the microscopic detection mechanism traverse the plane to be detected of the semiconductor heating disk, and jointly perform deformation detection on the plane to be detected of the semiconductor heating disk; Open the shielding baffle, take out the semiconductor heating plate that has been tested from the inside of the carrying platform, and then put the next semiconductor heating plate to be tested into the inside of the carrying platform.

[0017] Compared with the prior art, the present invention provides a semiconductor heating plate surface deformation detection device and method, which has the following beneficial effects: 1. This semiconductor heating plate surface deformation detection device, driven by a mobile driving mechanism, drives the semiconductor heating plate to be detected to move under the detection groove through the carrying platform. During the movement of the carrying platform, the shielding mechanism can shield the mobile driving mechanism, and the fixed frame, the mounting platform and the shielding baffle can jointly shield the mobile driving mechanism from the external environment, and can effectively prevent dust and other impurities from entering the activity space of the mobile driving mechanism, and can effectively ensure the accuracy of the mobile driving mechanism driving the carrying platform to move. During the movement of the semiconductor heating plate, each probe detection mechanism and the microscopic detection mechanism traverse the plane to be detected of the semiconductor heating plate, and jointly perform deformation detection on the plane to be detected of the semiconductor heating plate to ensure the accuracy of deformation detection.

[0018] 2. In the device for detecting the surface deformation of a semiconductor heating disk, in the process that each positioning driving cylinder synchronously drives each pressing clamp to move toward the axial direction of the substrate bearing circular groove, due to the action of the inclined surface at the bottom end of the pressing clamp, during the movement of the pressing clamp, a downward pressing force is provided to the semiconductor heating disk through the inclined surface, and the semiconductor heating disk is driven to press the supporting sandbag downward to deform to match the bottom shape of the semiconductor heating disk, so that when the semiconductor heating disk moves to the plane at the bottom end of the pressing clamp, since the planes at the bottom ends of each pressing clamp are coplanar, the supporting sandbag can be deformed to press the planes to be detected of semiconductor heating disks of different thicknesses into the same measuring plane, and in the process that the positioning driving cylinder synchronously drives each pushing support plate to move toward the axial direction of the substrate bearing circular groove, the semiconductor heating disk can be pushed to move toward the center position of the substrate bearing circular groove, so that the substrate axis of the semiconductor heating disk and the axis of the substrate bearing circular groove are colinear, and the semiconductor heating disk can be accurately positioned to ensure the validity of the detection result.

[0019] 3. This semiconductor heating plate surface deformation detection device can drive the external support ring to drive each base positioning unit to rotate around the axis of the base bearing circular groove through the rotation of the movable end of the driving cylinder to drive the connecting rod to drive the external support ring to drive each base positioning unit to rotate around the axis of the base bearing circular groove, so that each pressing clamp and each pushing support plate can be rotated around the axis of the semiconductor heating plate to expose the surface to be detected of the partially obscured semiconductor heating plate, and can avoid damage to the semiconductor heating plate during the relative movement of the pressing clamp and the pushing support plate and the surface to be detected of the semiconductor heating plate through the action of the sliding balls embedded in the sides of the pressing clamp and the pushing support plate close to the semiconductor heating plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of a semiconductor heating plate surface deformation detection device of the present invention; Figure 2This is one of the schematic diagrams of the installation structure of the fixed frame and the installation platform of a semiconductor heating plate surface deformation detection device of the present invention; Figure 3 This is a second schematic diagram of the installation structure of a fixed frame and an installation platform of a semiconductor heating plate surface deformation detection device of the present invention; Figure 4 This is one of the three-dimensional structural schematic diagrams of a carrying platform, a moving driving mechanism and a shielding mechanism of a semiconductor heating plate surface deformation detection device of the present invention; Figure 5 This is a second schematic diagram of the three-dimensional structure of a carrying platform, a moving driving mechanism and a shielding mechanism of a semiconductor heating plate surface deformation detection device of the present invention; Figure 6 The present invention provides a three-dimensional structure of a moving driving mechanism and a shielding mechanism of a semiconductor heating plate surface deformation detection device; Figure 7 It is a schematic diagram of the assembly structure of a bearing platform of a semiconductor heating plate surface deformation detection device of the present invention; Figure 8 This is one of the three-dimensional structural schematic diagrams of an external support ring and each base positioning unit of a semiconductor heating plate surface deformation detection device of the present invention; Fig. 9 This is a second schematic diagram of the three-dimensional structure of an external support ring and each base positioning unit of a semiconductor heating plate surface deformation detection device of the present invention; Fig.10 For the present invention Fig. 9 A magnified view of part A.

[0021] In the figure: 1, bearing support; 2, fixed frame; 21, shielding baffle; 211, fixed baffle; 212, sliding baffle; 213, sliding track; 3, mounting platform; 31, detection groove; 4, bearing platform; 41, bearing shell; 42, end bearing groove; 43, base bearing circular groove; 44, external support ring; 441, rotating drive cylinder; 442, driving connecting rod; 45, base positioning unit; 451, positioning drive cylinder; 452, pressing splint; 453, pushing support plate; 454, sliding ball; 46, support Sandbag; 5. Mobile drive mechanism; 51. Horizontal drive motor; 52. Horizontal limit track; 53. Mobile mounting plate; 54. Longitudinal drive motor; 55. Longitudinal limit track; 56. Horizontal drive rod; 57. Longitudinal drive rod; 6. Shielding mechanism; 61. Horizontal shielding curtain; 62. Longitudinal shielding curtain; 63. Horizontal connecting plate; 64. Horizontal winding box; 65. Longitudinal connecting plate; 66. Longitudinal winding box; 7. Probe detection mechanism; 71. Probe fixing plate; 72. Probe extension plate; 73. Detection probe; 8. Microscopic detection mechanism. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] As introduced in the background technology, there are deficiencies in the prior art. In order to solve the above technical problems, the present application proposes a semiconductor heating plate surface deformation detection device and method.

[0024] Embodiment 1 See also Figure 1-Figure 10 A semiconductor heating plate surface deformation detection device comprises a bearing support 1 and a fixed frame 2, the fixed frame 2 is fixed on the top of the bearing support 1, a mounting platform 3 is arranged on the top of the fixed frame 2, a bearing platform 4 is arranged inside the fixed frame 2 and below the mounting platform 3; a detection groove 31 is opened on one side of the surface of the mounting platform 3, a shielding baffle 21 is arranged on the top of the fixed frame 2 and on the side of the mounting platform 3 close to the detection groove 31, a moving driving mechanism 5 is arranged at the bottom of the bearing platform 4, and the moving driving mechanism 5 can drive the bearing platform 4 to move inside the space surrounded by the fixed frame 2, the mounting platform 3 and the shielding baffle 21; the bearing A shielding mechanism 6 is also provided on the outside of the platform 4. During the movement of the carrying platform 4, the shielding mechanism 6 can shield the moving driving mechanism 5; a number of probe detection mechanisms 7 are provided on the upper surface of the mounting platform 3 and located on the outside of the detection groove 31, and a microscopic detection mechanism 8 is provided on the upper surface of the mounting platform 3 and on the side away from the detection groove 31; the interior of the carrying platform 4 can carry a semiconductor heating disk, and under the drive of the moving driving mechanism 5, the carrying platform 4 carries the semiconductor heating disk to move, and each probe detection mechanism 7 and microscopic detection mechanism 8 traverses the plane to be detected of the semiconductor heating disk, and jointly performs deformation detection on the plane to be detected of the semiconductor heating disk.

[0025] When in use, first open the shielding baffle 21, place the semiconductor heating disk to be detected with the plane to be detected facing upward inside the carrying platform 4, then close the shielding baffle 21, and under the drive of the mobile drive mechanism 5, the carrying platform 4 drives the semiconductor heating disk to be detected to move under the detection slot 31. During the movement of the carrying platform 4, the shielding mechanism 6 can shield the mobile drive mechanism 5, and under the shielding effect of the fixed frame 2, the mounting platform 3 and the shielding baffle 21, the mobile drive mechanism 5 can be isolated from the external environment, and the dust and other impurities from the outside can be effectively prevented from entering the mobile drive mechanism 5. The movable space effectively ensures the accuracy of the movement of the mobile driving mechanism 5 driving the carrying platform 4 to move, so that in the process of the movement of the semiconductor heating disk, each probe detection mechanism 7 and the microscopic detection mechanism 8 traverses the plane to be detected of the semiconductor heating disk, and jointly performs deformation detection on the plane to be detected of the semiconductor heating disk, so as to ensure the accuracy of the deformation detection. After the detection is completed, the shielding baffle 21 is opened, and the semiconductor heating disk that has been detected is taken out from the inside of the carrying platform 4, and then the next semiconductor heating disk to be detected is placed in the inside of the carrying platform 4, so that the deformation detection of multiple semiconductor heating disks to be detected can be carried out continuously.

[0026] Among them, the microscopic detection mechanism 8 can use laser plane interferometer measurement method, reflection illumination method, image analysis method and the like. Among them, the specific principle of the reflection illumination method is: a detection light source is used to provide directional uniform intensity light illumination to the plane to be detected, and the reflected light receiver can receive the light reflected from the plane to be detected. The reflected light receiver receives the reflected light intensity reflected from multiple points on the plane to be detected, and after taking the average value, it judges the degree of deviation between the reflected light intensity of each point and the average reflected light intensity, so as to determine the flatness of the plane to be detected according to the range of the deviation degree.

[0027] The detection principle of the probe detection mechanism 7 is a common probe detection scheme in the prior art, specifically: using a three-coordinate measuring machine as a representative, using the probe to contact the sampling points of the plane to obtain a limited number of coordinate data; using the probe to contact the sampling points of the plane to obtain a limited number of coordinate data, after preprocessing such as noise reduction and calibration, select the ISO12781 flatness evaluation tool, select the least squares method or the minimum area method, and set the filtering parameters to obtain the flatness result.

[0028] Embodiment 2 See also Figure 1-Figure 2 , Figure 4-Figure 10The difference from the above embodiment is that the carrying platform 4 includes a carrying shell 41, and the top of the carrying shell 41 is provided with an end bearing groove 42, a base bearing circular groove 43 and an external support ring 44, the external support ring 44 is arranged on the outside of the base bearing circular groove 43, and the external support ring 44 can rotate on the top of the carrying shell 41, and the end and the base of the semiconductor heating plate are respectively placed in the end bearing groove 42 and the base bearing circular groove 43.

[0029] A plurality of substrate positioning units 45 are arranged at the top of the external support ring 44 and outside the substrate bearing circular groove 43, and a supporting sandbag 46 is arranged at the bottom end of the substrate bearing circular groove 43; the substrate of the semiconductor heating disk can slide on the surface of the supporting sandbag 46, and each substrate positioning unit 45 can cooperate to drive the substrate axis of the semiconductor heating disk and the axis of the substrate bearing circular groove 43 to be colinear; each substrate positioning unit 45 can cooperate to press the planes to be tested of semiconductor heating disks of different thicknesses onto the same measuring plane, and when each substrate positioning unit 45 jointly presses the semiconductor heating disk, the supporting sandbag 46 can be deformed to fit the bottom shape of the semiconductor heating disk.

[0030] A rotating driving cylinder 441 is provided at the bottom end of the external support ring 44, and the movable end of the rotating driving cylinder 441 is connected to the external support ring 44 through a driving connecting rod 442, and the driving connecting rod 442 is rotatably connected to the external support ring 44 and the rotating driving cylinder 441; the movable end of the rotating driving cylinder 441 can be extended and retracted to drive the external support ring 44 through the driving connecting rod 442 to drive each base positioning unit 45 to rotate around the axis of the base bearing circular groove 43.

[0031] The base positioning unit 45 includes a positioning drive cylinder 451 and a pressing clamp 452 (the bottom end of the pressing clamp 452 is an inclined surface and a flat surface, and the side close to the pushing support plate 453 is a flat surface), and a pushing support plate 453 is arranged at the bottom end of the pressing clamp 452. The movable end of the positioning drive cylinder 451 is fixed to the pressing clamp 452, and the positioning drive cylinder 451 can drive the pressing clamp 452 and the pushing support plate 453 to move together in the axial direction of the base bearing circular groove 43; a plurality of sliding balls 454 are embedded in the side of the pressing clamp 452 and the pushing support plate 453 close to the semiconductor heating plate, and each sliding ball 454 can rotate independently.

[0032] Each positioning drive cylinder 451 extends synchronously, driving each push support plate 453 to move synchronously toward the axial direction of the substrate bearing circular groove 43, and jointly driving the semiconductor heating disk to slide on the surface of the supporting sandbag 46, driving the substrate axis of the semiconductor heating disk and the axis of the substrate bearing circular groove 43 to be colinear; during the detection process of the probe detection mechanism 7 and the microscopic detection mechanism 8, the rotation drive cylinder 441 drives each pressing clamp 452 and each push support plate 453 to rotate around the axis of the semiconductor heating disk, revealing the surface to be detected of the partially obscured semiconductor heating disk.

[0033] When in use, the end and base of the semiconductor heating plate to be tested are first placed in the end bearing groove 42 and the base bearing circular groove 43 respectively. By setting the supporting sandbag 46, the base of the semiconductor heating plate can slide on the surface of the supporting sandbag 46. In the process of each positioning drive cylinder 451 synchronously driving each pressing clamping plate 452 to move in the axial direction of the base bearing circular groove 43, due to the inclined surface of the bottom end of the pressing clamping plate 452, during the movement of the pressing clamping plate 452, the inclined surface provides a downward pressing force for the semiconductor heating plate, and drives the semiconductor heating plate to press the supporting sandbag 46 downward to produce a deformation that fits the bottom shape of the semiconductor heating plate, thereby being able to When the semiconductor heating disk moves to the plane at the bottom end of the pressing clamp 452, since the planes at the bottom ends of the pressing clamps 452 are coplanar, the supporting sandbag 46 can be deformed to press the planes to be tested of the semiconductor heating disks of different thicknesses onto the same measuring plane, and in the process of the positioning driving cylinder 451 synchronously driving the pushing support plates 453 to move toward the axial direction of the substrate bearing circular groove 43, the semiconductor heating disk can be pushed to move toward the center position of the substrate bearing circular groove 43, so that the substrate axis of the semiconductor heating disk and the axis of the substrate bearing circular groove 43 are colinear, and the semiconductor heating disk can be accurately positioned to ensure the validity of the detection result; In the process of the positioning drive cylinder 451 driving the pressing clamping plate 452 and the pushing support plate 453 to move together in the axial direction of the substrate bearing circular groove 43, due to the independent rotation of a plurality of sliding balls 454 at the bottom end of the pressing clamping plate 452, the friction between the pressing clamping plate 452 and the surface to be detected of the semiconductor heating disk can be avoided to damage the surface to be detected of the semiconductor heating disk. At the same time, the influence of friction on the precise positioning of the semiconductor heating disk can also be reduced. Since the pressing clamping plate 452 shields part of the surface to be detected of the semiconductor heating disk, the movable end of the rotating drive cylinder 441 can be extended and retracted. The external support ring 44 is driven by the driving connecting rod 442 to drive each base positioning unit 45 to rotate around the axis of the base bearing circular groove 43, so that each pressing clamp 452 and each pushing support plate 453 can be rotated around the axis of the semiconductor heating disk to expose the surface to be tested of the partially obscured semiconductor heating disk, and the sliding ball 454 embedded in the side of the pressing clamp 452 and the pushing support plate 453 close to the semiconductor heating disk can avoid damage to the semiconductor heating disk during the relative movement of the pressing clamp 452 and the pushing support plate 453 and the surface to be tested of the semiconductor heating disk.

[0034] Embodiment 3 See also Figure 1-Figure 6 , which is different from the above-mentioned embodiment, is that the mobile driving mechanism 5 includes a transverse driving motor 51, a transverse limiting rail 52, a mobile mounting plate 53, a longitudinal driving motor 54 and a longitudinal limiting rail 55; the transverse driving motor 51 and the transverse limiting rail 52 are fixed to the inner bottom end of the fixed frame 2, the bottom end of the mobile mounting plate 53 is matched with the transverse limiting rail 52, the driving end of the transverse driving motor 51 is coaxially fixed with the transverse driving rod 56, and the transverse driving rod 56 is threadedly connected to the mobile mounting plate 53; the longitudinal driving motor 54 and the longitudinal limiting rail 55 are fixed to the top end of the mobile mounting plate 53, the bottom end of the bearing shell 41 is matched with the longitudinal limiting rail 55, the driving end of the longitudinal driving motor 54 is coaxially fixed with the longitudinal driving rod 57, and the longitudinal driving rod 57 is threadedly connected to the bearing shell 41.

[0035] The shielding baffle 21 includes a fixed baffle 211 and a sliding baffle 212. Sliding rails 213 are arranged on both sides of the fixed baffle 211. The sliding baffle 212 fits with the sliding rails 213, and the sliding baffle 212 can slide under the limit of the sliding rails 213; the shielding mechanism 6 includes two transverse shielding curtains 61 and two longitudinal shielding curtains 62. A transverse connecting plate 63 is arranged at one end of the transverse shielding curtain 61, and the end of the transverse shielding curtain 61 away from the transverse connecting plate 63 is rolled up inside the transverse winding box 64. A longitudinal connecting plate 65 is arranged at one end of the longitudinal shielding curtain 62, and the end of the longitudinal shielding curtain 62 away from the longitudinal connecting plate 65 is rolled up inside the longitudinal winding box 66.

[0036] The two transverse connecting plates 63 are respectively fixed on both sides of the movable mounting plate 53. When the movable mounting plate 53 moves, the transverse winding box 64 on one side unwinds the corresponding transverse shielding curtain 61, and the transverse winding box 64 on the other side winds up the corresponding transverse shielding curtain 61; the two longitudinal connecting plates 65 are respectively fixed on both sides of the bearing shell 41. When the bearing shell 41 moves, the longitudinal winding box 66 on one side unwinds the corresponding longitudinal shielding curtain 62, and the longitudinal winding box 66 on the other side winds up the corresponding longitudinal shielding curtain 62.

[0037] Therefore, when in use, the driving end of the transverse driving motor 51 is coaxially fixed to the transverse driving rod 56, and the transverse driving rod 56 is threadedly connected to the movable mounting plate 53, so that the power output by the transverse driving motor 51 can drive the movable mounting plate 53 and the bearing shell 41 to move horizontally. Similarly, the driving end of the longitudinal driving motor 54 is coaxially fixed to the longitudinal driving rod 57, and the longitudinal driving rod 57 is threadedly connected to the bearing shell 41, so that the power output by the longitudinal driving motor 54 can drive the bearing shell 41 to move longitudinally, so as to stably drive the bearing shell 41 and the semiconductor heating plate to be detected to move, and during the movement, when the movable mounting plate 53 moves The horizontal winding box 64 on one side unwinds the corresponding horizontal shielding curtain 61, and the horizontal winding box 64 on the other side rolls up the corresponding horizontal shielding curtain 61; the two longitudinal connecting plates 65 are respectively fixed on both sides of the bearing shell 41. When the bearing shell 41 moves, the longitudinal winding box 66 on one side unwinds the corresponding longitudinal shielding curtain 62, and the longitudinal winding box 66 on the other side rolls up the corresponding longitudinal shielding curtain 62, so as to cooperate with the shielding effect of the fixed baffle 211 and the sliding baffle 212 as well as the fixed frame 2 and the mounting platform 3, and can effectively prevent external dust and other impurities from entering the activity space of the mobile driving mechanism 5, and can effectively ensure the accuracy of the mobile driving mechanism 5 driving the bearing platform 4 to move.

[0038] Embodiment 4 See also Figure 1-Figure 3 , which is different from the above-mentioned embodiment, is that the probe detection mechanism 7 includes a probe fixing plate 71, a probe extension plate 72 and a detection probe 73. The probe fixing plate 71 is fixed to the mounting platform 3, one end of the probe extension plate 72 is fixed to the probe fixing plate 71, and the other end of the probe extension plate 72 extends to the inside of the detection slot 31. The detection probe 73 is arranged at one end of the probe extension plate 72 located inside the detection slot 31; the microscopic detection mechanism 8 includes a magnifying electron microscope and a display screen. In the process of the carrying platform 4 carrying the semiconductor heating disk to move, each detection probe 73 and the magnifying electron microscope traverses the plane to be detected of the semiconductor heating disk, and jointly performs deformation detection on the plane to be detected of the semiconductor heating disk.

[0039] Therefore, probe detection can be performed through each detection probe 73. In this embodiment, the microscopic detection mechanism 8 adopts image analysis method to analyze the flatness of the plane to be detected. It can be magnified by the magnifying electron microscope and the display screen together, and the deformation detection of the plane to be detected of the semiconductor heating plate can be performed through image comparison algorithm, brightness detection algorithm, etc.

[0040] Embodiment 5 A method for detecting surface deformation of a semiconductor heating plate, using a semiconductor heating plate surface deformation detection device as described in any one of Embodiments 1 to 4, comprises the following steps: Open the shielding baffle 21, place the semiconductor heating plate to be tested with the plane to be tested facing upward inside the carrying platform 4, and close the shielding baffle 21; The moving driving mechanism 5 drives the carrying platform 4 to drive the semiconductor heating plate to be tested to move below the testing slot 31; During the movement of the semiconductor heating disk, each probe detection mechanism 7 and the microscopic detection mechanism 8 traverses the plane to be detected of the semiconductor heating disk, and jointly performs deformation detection on the plane to be detected of the semiconductor heating disk; The shielding baffle 21 is opened, the semiconductor heating disk that has been inspected is taken out from the inside of the carrying platform 4 , and then the next semiconductor heating disk to be inspected is placed in the inside of the carrying platform 4 .

[0041] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor heating plate surface deformation detection device, comprising a bearing support and a fixed frame, wherein the fixed frame is fixed on the top of the bearing support, characterized in that: A mounting platform is provided at the top of the fixed frame, and a bearing platform is provided inside the fixed frame and below the mounting platform; A detection groove is provided on one side of the surface of the mounting platform, a shielding baffle is provided on the top of the fixed frame and on the side of the mounting platform close to the detection groove, and a mobile driving mechanism is provided at the bottom of the carrying platform, and the mobile driving mechanism can drive the carrying platform to move within the space surrounded by the fixed frame, the mounting platform and the shielding baffle; A shielding mechanism is also provided on the outer side of the carrying platform, and during the movement of the carrying platform, the shielding mechanism can shield the moving driving mechanism; A plurality of probe detection mechanisms are arranged on the upper surface of the installation platform and outside the detection slot, and a microscopic detection mechanism is arranged on the upper surface of the installation platform and on a side away from the detection slot; The carrying platform can carry a semiconductor heating disk inside. Under the drive of the mobile driving mechanism, the carrying platform moves with the semiconductor heating disk. Each of the probe detection mechanisms and the microscopic detection mechanism traverses the plane to be detected of the semiconductor heating disk, and jointly performs deformation detection on the plane to be detected of the semiconductor heating disk.

2. A semiconductor heating plate surface deformation detection device according to claim 1, characterized in that: The supporting platform includes a supporting shell, the top of which is provided with an end supporting groove, a base supporting circular groove and an external supporting ring, the external supporting ring is arranged on the outside of the base supporting circular groove, and the external supporting ring can rotate on the top of the supporting shell, and the end and the base of the semiconductor heating plate are respectively placed in the end supporting groove and the base supporting circular groove.

3. A semiconductor heating plate surface deformation detection device according to claim 2, characterized in that: A plurality of base positioning units are arranged at the top of the external support collar and outside the base bearing circular groove, and a supporting sandbag is arranged at the bottom of the base bearing circular groove; The substrate of the semiconductor heating plate can slide on the surface of the supporting sandbag, and each of the substrate positioning units can cooperate to drive the substrate axis of the semiconductor heating plate and the axis of the substrate bearing circular groove to be collinear; Each of the base positioning units can cooperate to press the planes to be tested of semiconductor heating disks of different thicknesses onto the same measuring plane, and when each of the base positioning units jointly presses the semiconductor heating disk, the supporting sandbag can be deformed to fit the bottom shape of the semiconductor heating disk.

4. A semiconductor heating plate surface deformation detection device according to claim 3, characterized in that: A rotation drive cylinder is provided at the bottom end of the external support collar, and the movable end of the rotation drive cylinder is connected to the external support collar via a driving connecting rod, and the driving connecting rod is rotationally connected to the external support collar and the rotation drive cylinder; The movable end of the rotary drive cylinder can be extended and retracted to drive the external support ring through the drive connecting rod to drive each of the base positioning units to rotate around the axis of the base bearing circular groove.

5. A semiconductor heating plate surface deformation detection device according to claim 4, characterized in that: The base positioning unit includes a positioning drive cylinder and a pressing clamp, the bottom end of the pressing clamp is provided with a push support plate, the movable end of the positioning drive cylinder is fixed between the pressing clamp, and the positioning drive cylinder can drive the pressing clamp and the push support plate to move together toward the axial direction of the base bearing circular groove; A plurality of sliding balls are embedded in the side of the pressing clamp and the pushing support plate close to the semiconductor heating plate, and each of the sliding balls can rotate independently.

6. A semiconductor heating plate surface deformation detection device according to claim 5, characterized in that: Each of the positioning drive cylinders extends synchronously, driving each of the propulsion support plates to synchronously move toward the axis direction of the substrate bearing circular groove, and jointly driving the semiconductor heating disk to slide on the surface of the supporting sandbag, driving the substrate axis of the semiconductor heating disk to be collinear with the axis of the substrate bearing circular groove; During the detection process of the probe detection mechanism and the microscopic detection mechanism, the rotation drive cylinder drives each of the pressing clamps and each of the pushing support plates to rotate around the axis of the semiconductor heating disk to expose the surface to be detected of the partially shielded semiconductor heating disk.

7. A semiconductor heating plate surface deformation detection device according to claim 2, characterized in that: The mobile driving mechanism includes a transverse driving motor, a transverse limiting rail, a mobile mounting plate, a longitudinal driving motor and a longitudinal limiting rail; The transverse drive motor and the transverse limit track are fixed to the inner bottom end of the fixed frame, the bottom end of the movable mounting plate is matched with the transverse limit track, the driving end of the transverse drive motor is coaxially fixed with the transverse drive rod, and the transverse drive rod is threadedly connected with the movable mounting plate; The longitudinal drive motor and the longitudinal limit rail are fixed on the top of the movable mounting plate, the bottom end of the bearing shell is matched with the longitudinal limit rail, the driving end of the longitudinal drive motor is coaxially fixed with the longitudinal drive rod, and the longitudinal drive rod is threadedly connected with the bearing shell.

8. A semiconductor heating plate surface deformation detection device according to claim 7, characterized in that: The shielding baffle includes a fixed baffle and a sliding baffle, and sliding tracks are arranged on both sides of the fixed baffle. The sliding baffle fits with the sliding track, and the sliding baffle can slide under the limit of the sliding track; The shielding mechanism includes two transverse shielding curtains and two longitudinal shielding curtains. A transverse connecting plate is provided at one end of the transverse shielding curtain, and the end of the transverse shielding curtain away from the transverse connecting plate is rolled up inside the transverse rolling box. A longitudinal connecting plate is provided at one end of the longitudinal shielding curtain, and the end of the longitudinal shielding curtain away from the longitudinal connecting plate is rolled up inside the longitudinal rolling box.

9. A semiconductor heating plate surface deformation detection device according to claim 8, characterized in that: The two transverse connecting plates are respectively fixed on both sides of the movable mounting plate, and when the movable mounting plate moves, the transverse winding box on one side unwinds the corresponding transverse shielding curtain, and the transverse winding box on the other side winds up the corresponding transverse shielding curtain; The two longitudinal connecting plates are respectively fixed on both sides of the bearing shell. When the bearing shell moves, the longitudinal winding box on one side unwinds the corresponding longitudinal shielding curtain, and the longitudinal winding box on the other side winds up the corresponding longitudinal shielding curtain.

10. A method for detecting surface deformation of a semiconductor heating plate, characterized in that: A semiconductor heating plate surface deformation detection device as claimed in any one of claims 1 to 9 is used, comprising the following steps: Open the shielding baffle, place the semiconductor heating plate to be tested with the surface to be tested facing upward inside the carrying platform, and close the shielding baffle; The mobile driving mechanism drives the carrying platform to drive the semiconductor heating plate to be tested to move under the testing tank; During the movement of the semiconductor heating disk, each probe detection mechanism and the microscopic detection mechanism traverse the plane to be detected of the semiconductor heating disk, and jointly perform deformation detection on the plane to be detected of the semiconductor heating disk; Open the shielding baffle, take out the semiconductor heating plate that has been tested from the inside of the carrying platform, and then put the next semiconductor heating plate to be tested into the inside of the carrying platform.

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