Alignment system and method of semiconductor production equipment and semiconductor production equipment

Abstract

The invention provides an alignment system and method of semiconductor production equipment and the semiconductor production equipment. The alignment system comprises a mounting table, a first central shaft, a first driving mechanism and an alignment module, the mounting table is positioned on the XY plane; the first central shaft extends in the Z direction and is connected with the mounting table; the first driving mechanism is connected with the first central shaft and is used for driving the central shaft to rotate; the alignment module comprises a lens assembly, the lens assembly comprises a second driving mechanism and a lens unit, the second driving mechanism is arranged on the mounting table and connected with the lens unit, and the second driving mechanism can drive the lens unit to move in the X direction and / or the Y direction; and the X direction, the Y direction and the Z direction are vertical pairwise. When the alignment system is used for carrying out alignment operation on the substrate carried on the workpiece table of the semiconductor production equipment, the alignment efficiency is high, and the productivity of the semiconductor production equipment is effectively improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor equipment, and in particular relates to an alignment system and method for semiconductor production equipment, and semiconductor production equipment. Background Art

[0002] The substrate alignment subsystem is one of the key subsystems of the substrate exposure equipment. It mainly provides the pixel coordinate positions of the substrate marks and reference marks in the imaging field of view for the realization of precise exposure function, and converts the coordinates of the substrate marks and reference marks into the coordinate system of the whole machine through the object-image conversion relationship, so that the upper-level components can solve the position information of each alignment mark on the substrate in the coordinate system of the whole machine according to the substrate alignment model, and then establish the relative position relationship between the mask coordinates, the workpiece stage coordinates, and the substrate coordinates to achieve a certain overlay accuracy requirement.

[0003] The substrate alignment operation in the prior art is completed by the movement of the workpiece stage that carries the substrate. Specifically, the exposure device has an alignment lens that remains relatively still with the housing of the entire device. When performing the alignment operation on the substrate, the workpiece stage is used to carry the substrate, and the substrate mark on the substrate is made to correspond one by one with the reference mark on the workpiece stage. Then, the movement of the workpiece stage is controlled so that each substrate mark on the substrate is successively located under the alignment lens, thereby obtaining the pixel coordinate position of each substrate mark in the imaging field of view, and then a series of photoelectric signal conversions are performed to obtain the physical coordinates of each alignment mark under the entire device.

[0004] However, the size of the materials produced by the substrate exposure equipment is relatively large, such as 404mm×515mm, 510mm×515mm, 600mm×600mm, etc. In actual operation, the substrate is divided into multiple exposure areas, and multiple alignment marks are set on each exposure area. The distance between the multiple alignment marks is relatively far. This results in that when the workpiece stage moves so that each alignment mark arrives under the alignment lens in turn to complete the alignment operation of each alignment mark of the substrate, the movement distance and movement time of the workpiece stage are long, and the alignment efficiency is low. Summary of the invention

[0005] The object of the present invention is to provide an alignment system and method for semiconductor production equipment, and semiconductor production equipment, aiming to improve the efficiency of the alignment operation on the substrate, thereby improving the productivity of the semiconductor production equipment.

[0006] To achieve the above object, the present invention provides an alignment system for semiconductor production equipment, comprising:

[0007] The mounting table is located on the XY plane;

[0008] A first central axis extending along the Z direction and connected to the mounting platform;

[0009] a first driving mechanism connected to the first central shaft and used to drive the first central shaft to rotate; and

[0010] an alignment module, the alignment module comprising a lens assembly, the lens assembly comprising a second driving mechanism and a lens unit, the second driving mechanism being disposed on the mounting platform and connected to the lens unit, the second driving mechanism being configured to drive the lens unit to move along the X direction and / or the Y direction;

[0011] The X direction, the Y direction, and the Z direction are perpendicular to each other;

[0012] The alignment system of the semiconductor production equipment is configured to achieve an alignment operation on an alignment mark on a substrate by rotating the first central axis and moving the lens unit along the X direction and / or the Y direction.

[0013] Optionally, the mounting platform is rectangular, and one of two adjacent sides of the mounting platform extends along the X direction, and the other extends along the Y direction; the first central axis is connected to a vertex corner of the mounting platform, or the first central axis is connected to the midpoint of one side of the mounting platform.

[0014] Optionally, the mounting platform includes a first platform, a second platform, a second central axis and a third driving mechanism; the first platform and the second platform are both located on an XY plane, the second central axis extends along the Z direction, and the axis of the second central axis passes through the center of the second platform; one end of the second central axis is rotatably connected to the first platform, and the other end is connected to the second platform; the third driving mechanism is connected to the second central axis, and is configured to drive the second central axis to rotate relative to the first platform;

[0015] The first platform is connected to the first central axis, and the alignment module is arranged on a side of the second platform away from the first platform.

[0016] Optionally, the first platform is rectangular, and one of two adjacent sides of the first platform extends along the X direction, and the other extends along the Y direction, and the center of the first platform is located on the axis of the second central axis; the first central axis is connected to a vertex of the first platform;

[0017] The second platform is rectangular, and one of two adjacent sides of the second platform extends along the X direction, and the other extends along the Y direction.

[0018] Optionally, the alignment system includes one alignment module; or, the alignment system includes two alignment modules, and the two lens alignment modules are arranged on the mounting platform along the X direction or the Y direction.

[0019] Optionally, the alignment module includes one or more of the lens assemblies.

[0020] Optionally, when the second driving mechanism is capable of driving the lens unit to move along the X direction or the Y direction, the second driving mechanism includes a first driving part, a first guide rail and a first slider, the first guide rail is connected to the mounting platform and extends along the moving direction of the lens unit, the first slider is movably arranged on the first guide rail and connected to the first driving part; the lens unit is connected to the first slider.

[0021] Optionally, the first guide rail is a mechanical guide rail, and the alignment system further includes a first brake, wherein the first brake is configured to brake the slider; alternatively, the first guide rail is an air-floating guide rail; alternatively, the first guide rail is a magnetically suspended guide rail.

[0022] Optionally, when the second driving mechanism is capable of driving the lens unit to move along the X direction and the Y direction, the second driving mechanism includes a first driving part, a first guide rail, a first slider, a second driving part, a second guide rail and a second slider; the first guide rail is arranged on the mounting table and extends along one of the X direction and the Y direction, the first slider is movably arranged on the first guide rail and connected to the first driving part; the second guide rail is arranged on the first slider and extends along the other of the X direction and the Y direction, the second slider is arranged on the second guide rail and connected to the second driving part; the lens unit is connected to the second slider.

[0023] Optionally, the first guide rail is one of a mechanical guide rail, an air-floating guide rail, and a magnetic suspension guide rail; the second guide rail is one of a mechanical guide rail, an air-floating guide rail, and a magnetic suspension guide rail;

[0024] When the first guide rail is a mechanical guide rail, the alignment system further includes a first brake configured to brake the first slider; when the second guide rail is a mechanical guide rail, the alignment system further includes a second brake configured to brake the second slider.

[0025] Optionally, the second driving mechanism is further configured to drive the lens unit to move along the Z direction.

[0026] To achieve the above-mentioned object, the present invention further provides a semiconductor production equipment, comprising an alignment system for the semiconductor production equipment as described in any of the preceding items.

[0027] To achieve the above-mentioned purpose, the present invention further provides an alignment method for performing an alignment operation on an alignment mark of a substrate carried on a workpiece stage; the substrate comprises a plurality of exposure areas sequentially arranged around a reference axis, and a plurality of alignment marks are provided on the exposure areas; the number of the exposure areas on the substrate is greater than the number of the alignment modules of the alignment system; the alignment method is performed based on the alignment system of the aforementioned semiconductor production equipment, and the alignment module is arranged on the lower surface of the mounting table; the alignment method comprises:

[0028] Controlling the workpiece stage to move until the substrate is partially located below the mounting stage, and aligning the reference axis with the axis of the first central axis, and each alignment module is located above one of the exposure areas; and,

[0029] Using the alignment module to perform an alignment operation on the alignment marks of each of the exposure areas;

[0030] wherein, at least when performing an alignment operation on the alignment mark of the exposure area firstly located below the alignment module, the second driving mechanism of the lens assembly is controlled to drive the lens unit to move along the X direction and / or the Y direction; and,

[0031] At least by controlling the first driving mechanism to drive the first central axis to rotate by a preset angle, each alignment module is switched from above the exposure area where the alignment operation has been completed to above the exposure area where the alignment operation has not been performed.

[0032] Optionally, the substrate includes m exposure regions, and the m exposure regions are evenly distributed in a direction around the reference axis;

[0033] The alignment system includes an alignment module; the preset angle is 360° / m, where m is a positive integer greater than 1.

[0034] Optionally, the substrate includes four exposure areas;

[0035] The mounting platform is divided into two mounting areas by a dividing line; the alignment system includes two alignment modules, which are respectively arranged on the two mounting areas; the first center axis is arranged at an intersection of the edge of the mounting platform and the dividing line; the preset angle is 180°.

[0036] Optionally, the number of the exposure areas is four, and one of two adjacent exposure areas can be aligned with the other when rotating 90° around the reference axis and 90° around its own axis;

[0037] The mounting platform includes a first platform, a second platform, a second central axis and a third driving mechanism; the first platform and the second platform are both located on an XY plane, the second central axis extends along the Z direction, and the axis of the second central axis passes through the center of the second platform; one end of the second central axis is rotatably connected to the first platform, and the other end is fixedly connected to the second platform; the third driving mechanism is connected to the second central axis and is configured to drive the second central axis to rotate relative to the first platform; the first platform is connected to the first central axis, and the number of the alignment module is one and is arranged on the second platform;

[0038] The step of driving the mounting platform to rotate around the first central axis by a preset angle at least by the first driving mechanism so that the alignment module switches from above one exposure area to above another exposure area comprises:

[0039] controlling the first driving mechanism to drive the first platform to rotate 90° around the first central axis; and,

[0040] The third driving mechanism is controlled to drive the second central axis to rotate 90° relative to the first platform.

[0041] Compared with the prior art, the alignment system and method of semiconductor production equipment and the semiconductor production equipment of the present invention have the following advantages:

[0042] The alignment system of the aforementioned semiconductor production equipment includes a mounting table, a first central axis, a first driving mechanism, and at least one alignment module; the mounting table is located on an XY plane; the first central axis extends along the Z direction and is connected to the mounting table; the first driving mechanism is connected to the first central axis and is used to drive the central axis to rotate; the alignment module includes a lens assembly, the lens assembly includes a second driving mechanism and a lens unit, the second driving mechanism is arranged on the mounting table and connected to the lens unit, and the second driving mechanism is configured to be able to drive the lens unit to move along the X direction and / or the Y direction; the X direction, the Y direction, and the Z direction are perpendicular to each other. The alignment system can be used to perform an alignment method on a substrate carried on a workpiece stage of a semiconductor production device to complete the alignment of alignment marks on the substrate; the substrate includes a plurality of exposure areas arranged in sequence around a reference axis, and a plurality of alignment marks are provided on the exposure areas; the number of the exposure areas on the substrate is greater than the number of alignment modules of the alignment system; in actual operation, the alignment modules are located on the lower surface of the mounting table, and the alignment method includes: controlling the workpiece stage to move until the substrate is partially located below the mounting table, and aligning the reference axis with the first central axis, and each alignment module is located above one of the exposure areas; and performing an alignment operation on the alignment marks of each of the exposure areas using the alignment modules; wherein, at least when performing the alignment operation on the alignment mark of the exposure area that is first located below the alignment module, the second driving mechanism of the lens assembly is controlled to drive the lens unit to move; and at least the first driving mechanism is used to drive the first central axis to rotate by a preset angle, so that each alignment module is switched from being located above the exposure area where the alignment operation has been completed to being located above the exposure area where the alignment operation has not yet been performed. By rotating the alignment module to change its position and switch it to above the exposure area to be aligned, the movement amount and movement time of the motion mechanism in the alignment operation can be shortened, thereby improving the efficiency of the alignment operation on the substrate, and further improving the working efficiency of the semiconductor production equipment including the alignment system and increasing production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The accompanying drawings are used to better understand the present invention and shall not constitute improper limitations of the present invention.

[0044] Figure 1 It is a schematic diagram of an application scenario of an alignment system for semiconductor production equipment provided by the first embodiment of the present invention.

[0045] Figure 2 The present invention is a flowchart of an alignment method performed on a substrate by an alignment system of a semiconductor manufacturing device provided in accordance with a first embodiment of the present invention.

[0046] Figure 3 It is a schematic diagram of an application scenario of an alignment system for semiconductor production equipment provided according to the second embodiment of the present invention.

[0047] Figure 4 1 is a flow chart of an alignment method performed on a substrate by an alignment system of a semiconductor manufacturing device provided according to a second embodiment of the present invention.

[0048] Figure 5 It is a schematic structural diagram of an alignment system for semiconductor production equipment provided according to a third embodiment of the present invention.

[0049] Figure 6 It is a schematic diagram of an application scenario of an alignment system for semiconductor production equipment provided according to the fourth embodiment of the present invention.

[0050] Figure 7 It is a schematic structural diagram of an alignment system for semiconductor production equipment provided according to a fifth embodiment of the present invention.

[0051] Figure 8 Schematic diagram of the structure of the first substrate.

[0052] Fig. 9 Schematic diagram of the structure of the second substrate.

[0053] Fig.10 It is a schematic diagram of the structure of the third substrate.

[0054] Fig.11 It is a schematic diagram of the structure of the fourth substrate.

[0055] Fig.12 It is a schematic diagram of the structure of the fifth substrate.

[0056] Fig.13 It is a schematic diagram of an optional structure of a lens assembly of an alignment system of a semiconductor production equipment provided in some embodiments of the present invention.

[0057] Fig.14 This is another optional structural schematic diagram of a lens assembly of an alignment system of a semiconductor production equipment provided in some embodiments of the present invention.

[0058] Fig.15 It is a position fluctuation curve in the X direction of a lens unit of an alignment system of a semiconductor production device provided by the present invention according to an example when the workpiece stage moves.

[0059] Fig.16 It is a position fluctuation curve of the lens unit of the alignment system provided by an example of the present invention in the Y direction when the tool stage moves.

[0060] Fig.17 The present invention provides a position fluctuation table of a lens unit of an alignment system of a semiconductor production device when a tool stage moves according to an example.

[0061] [Description of the accompanying drawings is as follows]: 10-mounting table, 11-first table body, 12-second table body, 13-second center axis, 20-first center axis, 31-lens assembly, 311-second driving mechanism, 3111-first driving unit, 3112-first guide rail, 3113-first slider, 3114-second driving unit, 3115-second guide rail, 3116-second slider, 3117-first brake, 3118-second brake, 312-lens unit, 01-substrate, 011-exposure area, 0101-alignment mark, DETAILED DESCRIPTION

[0062] The following is an explanation of the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in the present embodiment only illustrate the basic concept of the present invention in a schematic manner, and only the components related to the present invention are shown in the figure instead of being drawn according to the number, shape and size of the components in the actual implementation. The type, quantity and proportion of each component in the actual implementation can be a random change, and the component layout type may also be more complicated.

[0063] In addition, each embodiment of the following description has one or more technical features, but this does not mean that the user of the present invention must implement all the technical features in any embodiment at the same time, or can only implement part or all of the technical features in different embodiments separately. In other words, under the premise that implementation is possible, those skilled in the art can selectively implement part or all of the technical features in any embodiment according to the disclosure of the present invention and according to the design specifications or implementation requirements, or selectively implement a combination of part or all of the technical features in multiple embodiments, thereby increasing the flexibility of the implementation of the present invention.

[0064] As used in this specification, the singular forms "one", "an" and "the" include plural objects, and the plural form "multiple" includes more than two objects, unless the content clearly indicates otherwise. As used in this specification, the term "or" is usually used in the sense of including "and / or", unless the content clearly indicates otherwise, and the terms "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. Relational terms such as the terms "first", "second", etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly indicate the number of technical features indicated. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0065] The object of the present invention is to provide an alignment system and method for semiconductor production equipment, and semiconductor production equipment, aiming to improve the working efficiency of the semiconductor production equipment by improving the alignment efficiency of the substrate, thereby improving the production capacity of the semiconductor production equipment.

[0066] In order to make the purpose, advantages and features of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings. It should be noted that the drawings are all in very simplified form and in non-precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. The same or similar reference numerals in the drawings represent the same or similar components.

[0067] like Figure 1 , Figure 3 , Figure 5 , Figure 6 and Figure 7As shown, the alignment system of the semiconductor production equipment provided by the embodiment of the present invention includes a mounting table 10, a first central axis 20, a first driving mechanism (not shown in the figure), and an alignment module (not marked in the figure). The mounting table 10 is located on the XY plane. The first central axis 20 extends along the Z direction and is connected to the mounting table 10. The first driving mechanism is connected to the first central axis 20 and is configured to drive the first central axis 20 to rotate, so as to drive the mounting table 10 to revolve around the first central axis 20. The alignment module is arranged on the mounting table 20, and the number of the alignment modules is at least one. Each alignment module includes at least one lens assembly 31, and the lens assembly 31 includes a second driving mechanism 311 and a lens unit 312, and the second driving mechanism 311 is arranged on the mounting table 10, and is connected to the lens unit 312, and is configured to drive the lens unit 312 to move along the X direction and / or the Y direction. The X direction, the Y direction, and the Z direction are perpendicular to each other.

[0068] In actual application, the X direction and the Y direction are both horizontal directions, the Z direction is a vertical direction, and the alignment module is arranged on the lower surface of the mounting platform 10. For the convenience of description, the following description will be based on this orientation.

[0069] The alignment system is applied to semiconductor production equipment and is used to perform an alignment method on the alignment marks 0101 on the substrate 01 that meets condition 1 and is carried by the workpiece stage (not shown in the figure) of the semiconductor production equipment, so as to obtain the pixel coordinates of each alignment mark 0101 on the substrate 01 within the imaging field of view. It should be understood that a plurality of the reference marks are arranged on the workpiece stage, and when the substrate 01 is carried on the workpiece stage, the plurality of alignment marks 0101 on the substrate 01 correspond one-to-one to the reference marks on the workpiece stage.

[0070] The condition 1 is that the substrate 01 includes a plurality of exposure regions 011 sequentially arranged around a reference axis S0.

[0071] In the embodiment of the present invention, the exposure regions 011 of the substrate 01 may be the same or different, and preferably, a plurality of alignment marks 0101 are disposed on the exposure region 011. It should be understood that the reference axis S0 is perpendicular to the substrate 01.

[0072] Figures 8 to 12 Schematic diagrams of some substrates 01 meeting condition 1 are shown. Figures 8 to 10 In the figure, the reference axis S0 is shown as a point. Figure 8The substrate 01 shown is rectangular and includes four exposure areas 011. The four exposure areas 011 are identical and intersect at the reference axis S0. Figure 8 In the figure, the exposure area 011 is a square, and two adjacent exposure areas 011 in the direction around the reference axis S0 share a side, and four alignment marks 0101 are provided on the exposure area 011. The four alignment marks 0101 are respectively arranged at the four vertices of a square, and the square where the alignment mark 0101 is located is concentric and parallel to the exposure area 011. Fig. 9 The substrate 01 shown in FIG. Figure 8 The difference of the substrate 01 shown is that Fig. 9 The exposure area 011 is a rectangle, and four alignment marks 0101 are set on the exposure area 011. The four alignment marks 0101 are respectively arranged on the four vertices of a rectangle, and the rectangle where the alignment marks 0101 are located is concentric and parallel to the exposure area 011. Fig.10 The substrate 01 shown is circular and includes four exposure areas 011 that are fan-shaped and intersect the reference axis S0. The four exposure areas 011 are identical, and two adjacent exposure areas 011 in the direction around the reference axis S0 share a side. Four alignment marks 0101 are provided on the exposure area 011, and the four alignment marks 0101 are respectively arranged at the four vertices of a square. Fig.11 The substrate 01 shown is rectangular and includes two identical exposure areas 011. The exposure areas 011 are rectangular, and the two exposure areas 011 share a side. The midpoint of the side shared by the two exposure areas 011 is on the reference axis S0. Four alignment marks 0101 are set on the exposure area 011, and the four alignment marks 0101 are respectively arranged on the four vertices of a rectangle that is concentric and parallel to the exposure area 011. Fig.12 The substrate 01 shown includes three exposure areas 011. Fig.12 In the orientation shown, one of the three exposure areas 011 is arranged on the left, another is arranged at the upper right corner, and another is arranged at the lower right corner, and the three exposure areas 011 intersect the reference axis S0. It should be understood that the substrate 01 that meets the condition 1 is not limited thereto, and more substrates 01 that meet the condition 1 are not shown.

[0073] When the alignment system performs the alignment method on the alignment mark 0101 of the substrate 01 that meets the condition 1 and is carried on the worktable, the number of the alignment modules included in the alignment system is preferably less than the number of the exposure areas 011 included in the substrate 01. In this way, the alignment system realizes the alignment operation of the alignment mark 0101 on the substrate by rotating the first central axis 20 and moving the lens unit 312 along the X direction and / or the Y direction.

[0074] Specifically, the alignment method includes: controlling the workpiece stage to move until the substrate 01 is partially located below the mounting table 10, and aligning the reference axis S0 with the axis of the first center axis 20, and each of the alignment modules is located above one of the exposure areas 011; and using the alignment module to perform alignment operations on the alignment marks 0101 of each of the exposure areas 011.

[0075] Wherein, at least when performing the alignment operation on the alignment mark 0101 of the exposure area 011 first located below the alignment module, the second driving mechanism 311 of the lens assembly 31 is controlled to drive the lens unit 312 to move along the X direction and / or the Y direction. And, at least by controlling the first driving mechanism to drive the first central axis 20 to rotate by a preset angle, each alignment module is switched from above one exposure area 011 to above another exposure area 011.

[0076] It should be noted that the "alignment" mentioned herein includes both the coincidence and the substantial coincidence. That is, "the reference axis is aligned with the axis of the first central axis 20" includes the coincidence of the reference axis and the substantial coincidence of the axis of the first central axis 20, and also includes the coincidence of the reference axis and the axis of the first central axis 20 being parallel and the distance between the reference axis and the axis of the first central axis 20 being within a preset range.

[0077] At least by controlling the first central axis 20 to rotate, the alignment module is moved and switched to the exposure area 011 to be aligned, so that the movement amount and movement time of the motion mechanism (including the lens unit 312) in the alignment operation can be shortened, thereby improving the efficiency of the alignment operation on the substrate 01, and further improving the working efficiency and production capacity of the semiconductor production equipment. The semiconductor equipment production equipment can be an exposure equipment or a detection equipment.

[0078] In some optional embodiments, the substrate 01 includes m exposure areas 011, and the m exposure areas 011 are evenly distributed in the direction around the reference axis S0. In this way, when the alignment module switches the positions of the exposure areas 011 of the same substrate 01, the preset angle of each rotation of the first central axis 20 is the same, which is 360° / m, and m is a positive integer greater than 1. Optionally, m is 2 or 4. For example, 8 to Fig.10 The central angle of each exposure area 011 on the circle with the reference axis S0 as the axis is 90°. Fig.11 The central angle of each exposure area 011 on the circle with the reference axis S0 as the axis is 180°. The preset angle of rotation of the first central axis 20 is 90° or 180°, which will be described in detail in conjunction with the embodiments below.

[0079] In an alternative embodiment, the m exposure regions 011 are unevenly distributed in a direction around the reference axis S0, for example Fig.12 In the substrate shown in , the exposure areas 011 located at the upper right and lower right have a central angle of 90° on a circle with the reference axis S0 as the axis, while the exposure area 011 located on the left has a central angle of 180° on a circle with the reference axis S0 as the axis. Thus, when the alignment module switches positions of different exposure areas 011 of the same substrate 01, the rotation angle of the first central axis 20 may be different, which is specifically determined according to the setting position of the exposure area 011 located on the left. For example, in Fig.12 When the alignment mark 0101 on the exposure area 011 on the left side is located in the upper half, when the alignment module is switched from above the exposure area 011 at the upper right corner to above the exposure area 011 at the left side, the first center axis 20 can rotate 90°, and when the alignment module is switched from the exposure area 011 at the left side to above the exposure area 011 at the lower right corner, the first center axis 20 rotates 180°.

[0080] In the embodiment of the present invention, it is also preferred that the second driving mechanism 311 can drive the corresponding lens unit 312 to move along the Z direction. In this way, when the alignment module is used to perform an alignment operation on the alignment mark 0101 on the substrate 01, the lens unit 312 can be controlled to move in the Z direction according to the thickness of the substrate 01 or the state of the substrate 01, such as whether it is warped, so that the lens unit 312 can focus on the substrate 01, thereby improving the alignment accuracy.

[0081] When the second driving mechanism 311 can only drive the lens unit 312 to move along the X direction or the Y direction, the structure of the second driving mechanism 311 is as follows: Fig.13 As shown, it includes a first driving part 3111, a first guide rail 3112 and a first slider 3113. The first guide rail 3112 is arranged on the mounting platform 10 and extends along the moving direction of the lens unit 312, that is, if the second driving mechanism 311 can drive the lens unit 312 to move along the X direction, the first guide rail 3112 extends along the X direction; if the second driving mechanism 311 can drive the lens unit 312 to move along the Y direction, the first guide rail 3112 extends along the Y direction. The first slider 3113 includes a first connecting part and a first adapter part (not marked in the figure) connected to each other. The first connecting part is movably arranged on the first guide rail 3112 and is also connected to the first driving part 3111 so as to be able to move along the first guide rail 3112 under the drive of the first driving part 3111. The lens unit 312 is connected to the first adapter part.

[0082] When the second driving mechanism 311 is capable of driving the lens unit 312 to move along the X direction or the Y direction, and is also capable of driving the lens unit 312 to move along the Z direction, the second driving mechanism 311 includes the first driving part 3111, the first guide rail 3112, and the first slider 3113, and further includes a third driving part, a third guide rail, and a third slider (not shown in the figure). The arrangement of the first driving part 3111, the first guide rail 3112, and the first slider 3113 is referred to above and will not be repeated here. The third guide rail is arranged on the first slider 3113, specifically, on the transition part of the first slider 3113, and extends along the Z direction. The third slider includes a third connecting part and a third transition part connected to each other, and the third connecting part is movably arranged on the third guide rail and is also connected to the third driving part so as to be able to move along the third guide rail under the drive of the third driving part. The lens unit 312 is connected to the third transition part.

[0083] When the second driving mechanism 311 can drive the lens unit 312 to move in the X direction as well as in the Y direction, the structure of the second driving mechanism 311 is as follows: Fig.14As shown, it includes a first driving part 3111, a first guide rail 3112, a first slider 3113, a second driving part 3114, a second guide rail 3115, and a second slider 3116. The first guide rail 3112 is arranged on the mounting table 10 and extends along one of the X direction and the Y direction. The first slider 3113 includes a first connecting part and a first transition part (not marked in the figure) connected to each other, and the first connecting part is movably arranged on the first guide rail 3112 and connected to the first driving part 3111 so as to be able to move along the first guide rail 3112 under the drive of the first driving part 3111. The second guide rail 3115 is arranged on the first transition part of the first slider 3113 and extends along the other of the X direction and the Y direction. The second slider 3116 includes a second connecting portion and a second adapter portion (not marked in the figure) connected to each other, and the second connecting portion is movably arranged on the second guide rail 3115 and connected to the second driving portion 3114 so as to be able to move along the second guide rail 3115 under the drive of the second driving portion 3114. The lens unit 312 is connected to the second adapter portion. Optionally, the number of the first guide rails 3112 is two, and accordingly, the first slider 3113 includes two first connecting portions, each of which is movably arranged on one of the first guide rails 3112.

[0084] When the second driving mechanism 311 is capable of driving the lens unit 312 to move along the X direction and the Y direction, and can also drive the lens unit 312 to move along the Z direction, the second driving mechanism 311 includes the first driving part 3111, the first guide rail 3112, the first slider 3113, the second driving part 3114, the second guide rail 3115, and the second slider 3116, and further includes a third driving part, a third guide rail, and a third slider (not shown in the figure). The arrangement of the first driving part 3111, the first guide rail 3112, the first slider 3113, the second driving part 3114, the second guide rail 3115, and the second slider 3116 is referred to the above description, and will not be repeated here. The third guide rail is arranged on the second slider 3116 and extends along the Z direction. The third slider includes a third connecting portion and a third adapter portion connected to each other, wherein the third connecting portion is movably disposed on the second guide rail 3115 and is also connected to the third driving portion so as to be able to move along the third guide rail under the driving of the third driving portion. The lens unit 312 is connected to the third adapter portion.

[0085] It is understood that when the second driving mechanism 311 is in state maintenance, it is expected that the lens unit 312 remains relatively still relative to the mounting table 10, and does not move abnormally due to interference from other structures of the semiconductor manufacturing equipment. Fig.13 and Fig.14 As shown, when the first rail 3112 is a mechanical rail, the lens assembly 31 preferably further includes a first brake 3117, and the first brake 3117 is, for example, a clamp, and the first brake 3117 is configured to brake the first connection portion, thereby braking the first slider 3113. It should be understood that when the number of the first rails 3112 is two, and the first slider 3112 includes two first connection portions, the number of the first brake 3117 is also two, so as to correspond to the two first connection portions. Fig.14 As shown, when the second guide rail 3115 is a mechanical guide rail, the lens assembly 31 preferably further includes a second brake 3118, and the second brake 3118 is, for example, a clamp, which is configured to brake the second slider 3115. Similarly, when the second driving mechanism 311 includes the third guide rail and the third guide rail is a mechanical guide rail, the alignment system further includes a third brake, and the third brake is, for example, a clamp, which is configured to brake the third slider.

[0086] Of course, in alternative embodiments, all guide rails can be air-floating guide rails or magnetic suspension guide rails, so there is no need to set brakes to brake the corresponding sliders. However, the solution of mechanical guide rails with clamps has better stability. Figures 15 to 17It can be seen that when all guide rails are set as mechanical guide rails and the corresponding sliders are braked by the clamp, during the acceleration and deceleration of the workpiece stage, the maximum fluctuation value of the lens unit 312 in the positive direction of the X direction is 596nm, the maximum fluctuation value in the negative direction is 651nm, and the average fluctuation value is 362nm, and the maximum fluctuation value in the positive direction of the Y direction is 595nm, the maximum fluctuation value in the negative direction is 508nm, and the average fluctuation value is 387nm; during the stable movement of the workpiece stage, the maximum fluctuation value of the lens unit 312 in the positive direction of the X direction is 23nm, the maximum fluctuation value in the negative direction is 11nm, and the average fluctuation value is 22nm, the maximum fluctuation value in the positive direction of the Y direction is 27nm, the maximum fluctuation value in the negative direction is 31nm, and the average fluctuation value is 40nm; during the exposure process, the maximum fluctuation value of the lens unit 312 in the positive direction of the X direction is 10nm, the maximum fluctuation value in the negative direction is 15nm, and the average fluctuation value is 13nm, and the maximum fluctuation value in the positive direction of the Y direction is 29nm, the maximum fluctuation value in the negative direction is 20nm, and the average fluctuation value is 31nm. This indicates that the use of a mechanical guide rail plus a clamp structure can effectively reduce the impact on the lens unit 22 caused by the movement of other moving parts such as the workpiece table, and improve the vertical stability of the lens unit 22.

[0087] Next, the alignment system and the alignment method performed based on the alignment system are further introduced through several embodiments. It should be understood that the following only describes the optional structure of the alignment system and the corresponding optional process of the alignment method by enumeration, and it is impossible to exhaustively list all possible structures of the alignment system and possible processes of the alignment method. Therefore, the following should not constitute an improper limitation on the present invention.

[0088] Figure 1 FIG. 2 is a schematic diagram showing an application scenario of the alignment system provided by the first embodiment of the present invention. Figure 1 As shown, in this embodiment, the mounting platform 10 is preferably a rectangular structure, and one of the two adjacent sides of the mounting platform 10 extends along the X direction, and the other extends along the Y direction. The first central axis 20 is preferably arranged at a vertex of the mounting platform 10. Such an arrangement can improve the compactness of the alignment system, which is conducive to reducing the overall size of the semiconductor production equipment.

[0089] In this embodiment, the number of the alignment module is one, and the alignment module includes one lens assembly 31. Therefore, the second driving mechanism 311 of the lens assembly 31 can drive the lens unit 312 to move along the X direction and the Y direction. Optionally, the lens unit 312 can be driven to move along the Z direction.

[0090] The alignment system provided in this embodiment can be applied to the substrate 01 that meets condition 1-1, and the condition 1-1 is: on the basis of condition 1, the substrate 01 includes at least three exposure areas 011, and at least three exposure areas 011 intersect the reference axis S0. The substrate 01 that meets condition 1-1 includes but is not limited to Figures 8 to 10 ,as well as Fig.12 The substrate 01 is shown.

[0091] The process of using the alignment system provided in this embodiment to perform an alignment operation on the substrate 01 that meets the condition 1-1 is as follows: Figure 2 As shown, the following steps S11 to S14 are included. In the following, an example is taken in which n alignment marks 0101 are arranged on the exposure area 011 for description, where n is a positive integer greater than 1.

[0092] Step S11 includes: controlling the workpiece stage to move until the substrate 01 is partially located below the mounting table 10, and aligning the reference axis S0 with the axis of the first center axis 20 (i.e., coinciding or substantially coinciding), and locating one of the exposure areas 011 below the alignment module.

[0093] Step S12 includes: controlling the second driving mechanism 311 of the lens assembly 31 to drive the lens unit 312 to move along the X direction and / or the Y direction, so that the lens unit 312 passes in sequence directly above the n alignment marks 0101 on the exposure area 011 currently under the lens module, so as to complete the alignment operation of each alignment mark 0101 of the current exposure area 011.

[0094] Step S13 includes: controlling the first driving mechanism to drive the first central axis 20 to rotate in a clockwise direction or a counterclockwise direction by the preset angle, so that the alignment module is switched to above another exposure area 011 .

[0095] If the lens unit 312 is located just above one of the alignment marks 0101 of the exposure area 011 currently located below the alignment module when the step 13 is completed, then step S14 includes: controlling the second driving mechanism 311 to drive the lens unit 312 to move along the X direction and / or the Y direction, so that the lens unit 312 sequentially passes through the remaining n-1 alignment marks 0101 on the exposure area 011 currently located below the alignment module, so as to complete the alignment operation of each alignment mark 0101 of the current exposure area 011.

[0096] If, upon completion of step S13, the lens unit 312 is located obliquely above an alignment mark 0101 (the alignment mark 0101 is referred to as a target alignment mark) of the exposure area 011 currently located below the alignment module, and the distance between the lens unit 312 and the target alignment mark in the horizontal plane is small, step S14 includes: first controlling the second driving mechanism 311 to drive the lens unit 312 to move along the X direction and / or the Y direction so that the lens unit 312 moves to be located directly above the target alignment mark, and then controlling the second driving mechanism 311 to drive the lens unit 312 to move along the X direction and / or the Y direction so that the lens unit 312 passes in sequence directly above the remaining n-1 alignment marks 0101 of the exposure area 011 currently located below the alignment module, so as to complete the alignment operation on each alignment mark 0101 of the current exposure area 011.

[0097] Wherein, the step S13 and the step S14 are respectively performed three times.

[0098] It can be understood that in step S12 and step S14, the second driving mechanism 311 can be controlled to drive the lens unit 312 to move along the Z direction according to actual needs, so that the lens unit 312 is focused on the substrate 01.

[0099] It is worth noting that if one of the two exposure areas 011 adjacent to each other on the substrate 01 in the direction around the reference axis S0 can overlap with the other when rotated around the reference axis S0 by the preset angle, and the reference axis S0 overlaps with the axis of the first center axis S20 when the step S11 is completed, then when the step 13 is completed, the lens unit 312 is located exactly above one of the alignment marks 0101 of the exposure area 011 currently located below the alignment module.

[0100] If one of the two exposure areas 011 adjacent to each other on the substrate 01 in the direction around the reference axis S0 can be overlapped with the other when rotated around the reference axis S0 by the preset angle, and the reference axis S0 and the axis of the first center axis S20 basically overlap when the step S11 is completed; or, if one of the two exposure areas 011 adjacent to each other on the substrate 01 in the direction around the reference axis S0 can be basically overlapped with the other when rotated around the reference axis S0 by the preset angle, then when the step 13 is completed, the lens unit 312 is located obliquely above an alignment mark 0101 (the alignment mark 0101 is called a target alignment mark) of the exposure area 011 currently located below the alignment module, and the distance between the lens unit 312 and the target alignment mark in the horizontal plane is small.

[0101] The substrate 01 that meets the requirement of “one of the two exposure regions 011 adjacent to each other in the direction around the reference axis S0 can overlap with the other when rotating around the reference axis S0 by the preset angle” includes but is not limited to Figure 8 and Fig.10 Substrate 01 shown.

[0102] when Fig. 9 When the difference between the long side and the short side of the rectangle where the alignment mark 0101 is located is small, the substrate 01 that meets the requirement of "one of the two exposure regions 011 adjacent to each other in the direction around the reference axis S0 can substantially overlap with the other when rotated around the reference axis S0 by the preset angle" may include Fig. 9 The substrate 01 shown. Of course, the substrate 01 that satisfies the condition that “one of the two exposure regions 011 adjacent to each other in the direction around the reference axis S0 can substantially overlap with the other when rotated around the reference axis S0 by the preset angle” is not limited thereto.

[0103] In addition, it should be understood that when the alignment system of this embodiment is used to align Figures 8 to 10 When the alignment method is performed on the substrate 01 shown, the preset angle is 90°, and in the step S11, the common edge of two adjacent exposure regions 011 in the direction around the reference axis S0 is preferably extended along the X direction or the Y direction.

[0104] Figure 3 FIG. 2 is a schematic diagram showing an application scenario of the alignment system provided by the second embodiment of the present invention. Figure 3As shown, the alignment system of this embodiment is basically the same in structure as the alignment system of the first embodiment, and the only difference is that the lens module includes a plurality of lens assemblies 31, and the second driving mechanism 311 of at least one of the lens assemblies 31 is allowed to drive the corresponding lens unit 312 to move along the X direction or the Y direction.

[0105] The alignment system provided in this embodiment can also be applied to perform alignment operation on the alignment mark 0101 of the substrate 01 that meets the condition 1-1. Preferably, the number of the lens assemblies 31 included in the alignment module of the alignment system of this embodiment is the same as the number of the alignment marks 0101 on the exposure area 011, so that one lens assembly 31 can perform alignment operation on one alignment mark 0101 of the exposure area 011 currently located below the lens module, further improving alignment efficiency.

[0106] Figure 4 The alignment system provided by this embodiment is shown Figures 8 to 10 , Fig.12 Flow chart of an alignment method performed on the substrate 01 shown. Figure 4 As shown, the alignment method at least includes steps S21 to S23.

[0107] Step S21 includes: controlling the workpiece stage to move until the substrate 01 is partially located below the mounting table 10, and aligning the reference axis S0 with the axis of the first central axis 20, and placing one of the exposure areas 011 below the alignment module.

[0108] Step S22 includes: controlling the second driving mechanism 311 of each lens assembly 31 to drive the corresponding lens unit 312 to move along the X direction and / or the Y direction, so that each lens unit 312 arrives directly above an alignment mark 0101 of the exposure area 011 currently located under the alignment module, so as to complete the alignment operation of each alignment mark 0101 of the current exposure area 011.

[0109] Step S23 includes: controlling the first driving mechanism to drive the first central axis 20 to rotate in a clockwise direction or a counterclockwise direction by the preset angle, so that the alignment module is switched to above another exposure area 011 .

[0110] If, when step S23 is completed, the lens unit 312 of each lens assembly 31 of the alignment module is located just above one alignment mark 0101 of the exposure area 011 currently located below the alignment module, then, when step S23 is completed, the alignment operation of another exposure area 011 is completed. This further improves the alignment efficiency of the alignment system.

[0111] If, after the execution of step S23, the lens unit 312 of each lens assembly 31 of the alignment module is located obliquely above an alignment mark 0101 of the exposure area 011 currently located below the alignment module, each alignment mark 0101 corresponds to the lens unit 312 located obliquely above it. In this case, the alignment method further includes step S24 (not shown in the figure), and the step S24 includes controlling each second driving mechanism 311 to drive the lens unit 312 to move to the top of the corresponding alignment mark 0101. It can be understood that after the execution of step S23, the distance between each alignment mark 0101 and the lens unit 312 located obliquely above it on the horizontal plane is small, so in step S24, the movement stroke and movement time of each lens unit 312 are both short, which can still effectively improve the alignment efficiency.

[0112] In the embodiment of the present invention, step S23 is executed three times in total, and when step S24 is executed, the number of executions of step S24 does not exceed three times.

[0113] It is worth noting that if one of the two exposure areas 011 adjacent to each other on the substrate 01 in the direction around the reference axis S0 can overlap with the other when rotated around the reference axis S0 by the preset angle, and the reference axis S0 overlaps with the axis of the first center axis S20 when the step S11 is executed, then when the step S23 is executed, the lens unit 312 of each lens assembly 31 of the alignment module is located exactly above one of the alignment marks 0101 of the exposure area 011 currently located below the alignment module. If one of the two exposure areas 011 adjacent to each other on the substrate 01 in the direction around the reference axis S0 can be overlapped with the other when rotated around the reference axis S0 by the preset angle, and the reference axis S0 is basically overlapped with the axis of the first center axis S20 when the step S11 is completed; or, if one of the two exposure areas 011 adjacent to each other on the substrate 01 in the direction around the reference axis S0 can be basically overlapped with the other when rotated around the reference axis S0 by the preset angle, then when the step S23 is completed, the lens unit 312 of each lens assembly 31 of the alignment module is located obliquely above one of the alignment marks 0101 of the exposure area 011 currently located below the alignment module.

[0114] In addition, when the alignment system of this embodiment is used for Figures 8 to 10When the substrate 01 shown in the figure performs the alignment method, the preset angle is also 90°, and in the step S21, the common edge of the two adjacent exposure areas 011 in the direction around the reference axis S0 is preferably extended in the X direction or the Y direction. In the step S22, preferably one of the lens assemblies 31 is used as the target lens assembly, and the second driving mechanism 311 of one of the target lens assemblies is first controlled to drive the corresponding lens unit 312 to move along the X direction and / or the Y direction, so that the lens unit 312 arrives directly above one of the alignment marks 0101, and the alignment operation of one of the alignment marks 0101 is completed. Then, the position of the lens unit 31 of the target lens assembly is used as the reference position, and based on the reference position, the known relative position relationship between the alignment mark directly below the lens unit 312 of the target lens assembly and the other alignment marks 0101, the corresponding target positions of the other alignment marks 0101 that have not yet been aligned are obtained. Afterwards, each of the target positions is matched to each of the other lens assemblies 31 one by one, and the second driving mechanism 311 of each lens assembly 31 is controlled to drive the corresponding lens unit 312 to move to the corresponding target position. In this way, the movement stroke and movement duration of the lens units 312 other than the first lens unit 312 can be shortened, further improving the alignment efficiency.

[0115] The specific execution process of step S24 may refer to step S22.

[0116] In addition, in step S22 and step S24, each lens unit 312 may be controlled to move along the Z direction according to actual conditions.

[0117] Figure 5 : is a schematic diagram of the structure of the alignment system provided in the third embodiment of the present invention. The difference between this embodiment and the alignment system provided in the first embodiment or the second embodiment is that the first central axis 20 is not arranged at the top corner of the rectangular mounting platform 10, but is arranged on one side of the rectangular mounting platform 10, for example, at the midpoint of one side of the mounting platform 10.

[0118] The alignment system provided in this embodiment can be applied to the substrate 01 that meets conditions 1-2, and the conditions 1-2 include: on the basis of condition 1, the substrate 01 includes two exposure areas, and the two exposure areas 011 share a common edge, and the reference axis S0 passes through the midpoint of the common edge of the two exposure areas 011.

[0119] Further preferably, the condition 1-2 further includes: one of the two exposure areas 011 of the substrate 01 can be aligned with the other when rotating 180° around the reference axis S0, that is, overlap (so that the two exposure areas 011 are arranged symmetrically) or substantially overlap. The substrate 01 that meets the condition 1-2 includes but is not limited to Fig.11 Substrate 01 shown.

[0120] When the alignment module in this embodiment includes only one lens assembly 31, when the alignment method is performed on the substrate 01 that meets the conditions 1-2 using the alignment system provided in this embodiment, the process of the alignment method can refer to Figure 2 In the step S11, the common side of the two exposure areas 011 is made parallel to the side of the rectangular mounting table 10 on which the first central axis 20 is provided, and in the step S13, the rotation angle of the first central axis 20 is 180°.

[0121] When the alignment module in this embodiment includes a plurality of lens assemblies 31, and preferably the number of the lens assemblies 31 included in the alignment module is equal to the number of the alignment marks 0101 on the exposure area 011, the alignment system provided in this embodiment is used to align the lens assemblies 31 of the exposure area 011. Figure 7 When the substrate 01 shown in the figure performs the alignment method, the process of the alignment method can refer to Figure 5 , at least includes steps S21 to S23, and may also include step S24, wherein in step S21, the common side of the two exposure areas 011 is made parallel to the side of the rectangular mounting table 10 on which the first central axis 20 is provided, and in step S23, the rotation angle of the first central axis 20 is 180°.

[0122] Figure 6 is a schematic diagram of an application scenario of an alignment system provided by a fourth embodiment of the present invention, Figure 6 The alignment system is shown in bold in FIG. Figure 6 As shown, one of the differences between this embodiment and the first embodiment or the second embodiment is that the alignment system includes two alignment modules, and the two alignment modules are arranged along the X direction or the Y direction. That is, the mounting table 10 is divided into a first mounting area and a second mounting area by a dividing line S1, and the first mounting area and the second mounting area are arranged along the X direction or the Y direction. One of the two alignment modules is arranged in the first mounting area, and the other is arranged in the second mounting area.

[0123] The second difference between this embodiment and the first embodiment or the second embodiment is that the first central axis 20 is arranged at an intersection of the edge of the mounting platform 10 and the boundary line S1.

[0124] The alignment system provided in this embodiment can be applied to the substrate 01 that meets conditions 1-3, and the conditions 1-3 include: on the basis of condition 1, the substrate 01 includes four exposure areas 011, and the four exposure areas 011 intersect at the reference axis S0.

[0125] Further preferably, the conditions 1-3 also include: two of the four exposure areas 011 are arranged along a first straight line, and the other two are arranged along a second straight line, the second straight line, the first straight line, and the reference axis S0 intersect at a point, and one of the two exposure areas 011 arranged along the first straight line can overlap or substantially overlap with the other when rotated 180° around the reference axis S0, and one of the two exposure areas 011 arranged along the second straight line can overlap or substantially overlap with the other when rotated 180° around the reference axis S0. The substrate 01 that meets the conditions 1-3 includes but is not limited to Figures 8 to 10 Substrate 01 shown.

[0126] When the alignment module in this embodiment includes only one lens assembly 31, when the alignment method is performed on the substrate 01 that meets the conditions 1-3 using the alignment system provided in this embodiment, the process of the alignment method is similar to Figure 2 , including steps S11 to S14, wherein: in step S11, one of the two exposure areas 011 adjacent to each other in the direction around the reference axis S0 is located below one alignment module, and the other is located below the other alignment module; in step S12, the second driving mechanisms 311 of the lens assemblies 31 of the two alignment modules are respectively controlled to operate to drive the corresponding lens units 312 to move, so as to simultaneously perform alignment operations on the alignment marks 0101 of the two exposure areas 011 currently located below the two alignment modules; in step S13, the rotation angle of the first central axis 20 is 180°; in step S14, the second driving mechanisms 311 of the lens assemblies 31 of the two alignment modules are respectively controlled to operate to drive the corresponding lens units 312 to move.

[0127] When the number of the lens assemblies 31 included in the alignment module in this embodiment is the same as the number of the alignment marks 0101 on the exposure area 011, when the alignment method is performed on the substrate 01 that meets the conditions 1-3 using the alignment system provided by this embodiment, the process of the alignment method is similar to Figure 4, at least includes steps S21 to S23, and may also include step S24, wherein: in step S21, one of the two exposure areas 011 adjacent to each other in the direction around the reference axis S0 is located below one alignment module, and the other is located below the other alignment module; in step S22, the second driving mechanism 311 of each lens assembly 31 of the two alignment modules is controlled to operate respectively; in step S23, the rotation angle of the first central axis 20 is 180°; in step S24, the second driving mechanism 311 of each lens assembly 31 of the two alignment modules is controlled to operate respectively.

[0128] Figure 7 FIG. 5 is a schematic diagram of the structure of an alignment system provided by the fifth embodiment of the present invention. Figure 7 As shown, the difference between this embodiment and the first embodiment or the second embodiment is that the mounting platform 10 is a double-layer structure, including a first platform 11, a second platform 12, a second central axis 13 and a third driving mechanism (not shown in the figure). The first platform 11 and the second platform 12 are both located on the XY plane, and the second central axis 13 extends along the Z direction. One axial end of the second central axis 13 is rotatably connected to the first platform 11, and the other axial end is fixedly connected to the second platform 12, and the axis of the second central axis 13 passes through the center of the second platform 12. The third driving mechanism is connected to the second central axis and is configured to drive the second central axis 13 to rotate relative to the first platform 11, so as to drive the second platform 12 to rotate relative to the first platform 11. The first central axis 20 is connected to the first platform 11, and the alignment module is arranged on the side of the second platform 12 away from the first platform 11.

[0129] Preferably, the first platform 11 is a rectangular structure. One of the two adjacent sides of the first platform 11 extends along the X direction, and the other extends along the Y direction, and the center of the first platform 11 is located on the axis of the second central axis 13. The first central axis 20 is set at a vertex of the first platform 11. Preferably, the second platform 12 is also a rectangular structure, and one of the two adjacent sides of the second platform 12 extends along the X direction, and the other extends along the Y direction. In this way, the compactness of the alignment system can be improved.

[0130] The alignment system provided in this embodiment can be applied to the substrate 01 that meets conditions 1-4, and the conditions 1-4 include: on the basis of condition 1, the substrate 01 includes four exposure areas 011, and one of the two exposure areas 011 adjacent to each other in the direction around the reference axis S0 can be aligned with the other (i.e., overlap or substantially overlap) after rotating 90° around the reference axis S0 and around its own axis. The substrate 01 that meets conditions 1-4 includes but is not limited to Fig. 9 Substrate 01 shown.

[0131] When the alignment module includes only one lens assembly 31, the alignment method performed by the alignment system provided in this embodiment on the substrate 01 meeting the conditions 1-4 is similar to the following process: Figure 2 , including steps S11 to S14, the only difference is that in step S13, not only the first driving mechanism is controlled to drive the first central axis 20 to rotate 90°, but also the third driving mechanism is controlled to drive the second central axis 13 to rotate 90°.

[0132] When the number of the lens assemblies 31 included in the alignment module is equal to the number of the alignment marks 0101 on the exposure area 011, the alignment method performed by the alignment system provided in this embodiment on the substrate 01 meeting the conditions 1-4 is similar to the following process: Figure 4 , including steps S21 to S23, and may include step S24, the only difference being that in step S23, not only the first driving mechanism is controlled to drive the first central axis 20 to rotate 90°, but the third driving mechanism is also controlled to drive the second central axis 13 to rotate 90°.

[0133] Although the present invention is disclosed as above, it is not limited thereto. Those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. An alignment system for semiconductor production equipment, characterized in that: The alignment system comprises: The mounting table is located on the XY plane; A first central axis extending along the Z direction and connected to the mounting platform; a first driving mechanism connected to the first central shaft and used to drive the first central shaft to rotate; and an alignment module, the alignment module comprising a lens assembly, the lens assembly comprising a second driving mechanism and a lens unit, the second driving mechanism being disposed on the mounting platform and connected to the lens unit, the second driving mechanism being configured to drive the lens unit to move along the X direction and / or the Y direction; The X direction, the Y direction, and the Z direction are perpendicular to each other; The alignment system of the semiconductor production equipment is configured to achieve an alignment operation on an alignment mark on a substrate by rotating the first central axis and moving the lens unit along the X direction and / or the Y direction.

2. The alignment system for semiconductor production equipment according to claim 1, characterized in that: The mounting platform is rectangular, and one of two adjacent sides of the mounting platform extends along the X direction, and the other extends along the Y direction; the first central axis is connected to a vertex of the mounting platform, or the first central axis is connected to the midpoint of one side of the mounting platform.

3. The alignment system of semiconductor production equipment according to claim 1, characterized in that: The mounting platform includes a first platform, a second platform, a second central axis and a third driving mechanism; the first platform and the second platform are both located on an XY plane, the second central axis extends along the Z direction, and the axis of the second central axis passes through the center of the second platform; one end of the second central axis is rotatably connected to the first platform, and the other end is connected to the second platform; the third driving mechanism is connected to the second central axis and is configured to drive the second central axis to rotate relative to the first platform; The first platform is connected to the first central axis, and the alignment module is arranged on a side of the second platform away from the first platform.

4. The alignment system for semiconductor production equipment according to claim 3, characterized in that: The first platform is rectangular, one of two adjacent sides of the first platform extends along the X direction, the other extends along the Y direction, and the center of the first platform is located on the axis of the second central axis; the first central axis is connected to a vertex of the first platform; The second platform is rectangular, and one of two adjacent sides of the second platform extends along the X direction, and the other extends along the Y direction.

5. The alignment system for semiconductor production equipment according to claim 1 or 2, characterized in that: The alignment system includes one alignment module; or, the alignment system includes two alignment modules, and the two lens alignment modules are arranged on the mounting platform along the X direction or the Y direction.

6. The alignment system for semiconductor production equipment according to claim 1, characterized in that: The alignment module includes one or more lens assemblies.

7. The alignment system for semiconductor production equipment according to claim 1, characterized in that: When the second driving mechanism is capable of driving the lens unit to move along the X direction or the Y direction, the second driving mechanism includes a first driving part, a first guide rail and a first slider, the first guide rail is connected to the mounting platform and extends along the moving direction of the lens unit, the first slider is movably arranged on the first guide rail and connected to the first driving part; the lens unit is connected to the first slider.

8. The alignment system for semiconductor production equipment according to claim 7, characterized in that: The first guide rail is a mechanical guide rail, and the alignment system further includes a first brake, and the first brake is configured to brake the slider; or, the first guide rail is an air-floating guide rail; or, the first guide rail is a magnetic suspension guide rail.

9. The alignment system for semiconductor production equipment according to claim 1, characterized in that: When the second driving mechanism is capable of driving the lens unit to move along the X direction and the Y direction, the second driving mechanism includes a first driving part, a first guide rail, a first slider, a second driving part, a second guide rail and a second slider; the first guide rail is arranged on the mounting table and extends along one of the X direction and the Y direction, the first slider is movably arranged on the first guide rail and connected to the first driving part; the second guide rail is arranged on the first slider and extends along the other of the X direction and the Y direction, the second slider is arranged on the second guide rail and connected to the second driving part; the lens unit is connected to the second slider.

10. The alignment system for semiconductor production equipment according to claim 9, characterized in that: The first guide rail is one of a mechanical guide rail, an air-floating guide rail, and a magnetic suspension guide rail; the second guide rail is one of a mechanical guide rail, an air-floating guide rail, and a magnetic suspension guide rail; When the first guide rail is a mechanical guide rail, the alignment system further includes a first brake configured to brake the first slider; when the second guide rail is a mechanical guide rail, the alignment system further includes a second brake configured to brake the second slider.

11. The alignment system for semiconductor production equipment according to claim 1, characterized in that: The second driving mechanism is further configured to drive the lens unit to move along the Z direction.

12. A semiconductor production equipment, characterized in that: An alignment system for semiconductor production equipment comprising the apparatus described in any one of claims 1 to 11.

13. An alignment method, for performing an alignment operation on an alignment mark of a substrate carried on a workpiece stage; the substrate comprises a plurality of exposure areas sequentially arranged around a reference axis, and a plurality of alignment marks are provided on the exposure areas; the number of the exposure areas on the substrate is greater than the number of the alignment modules of the alignment system; characterized in that: The alignment method is performed based on the alignment system of the semiconductor production equipment according to claim 1, wherein the alignment module is arranged on the lower surface of the mounting table; the alignment method comprises: Controlling the workpiece stage to move until the substrate is partially located below the mounting stage, and aligning the reference axis with the axis of the first central axis, and each alignment module is located above one of the exposure areas; and, Using the alignment module to perform an alignment operation on the alignment marks of each of the exposure areas; wherein, at least when performing an alignment operation on the alignment mark of the exposure area firstly located below the alignment module, the second driving mechanism of the lens assembly is controlled to drive the lens unit to move along the X direction and / or the Y direction; and, At least by controlling the first driving mechanism to drive the first central axis to rotate by a preset angle, each alignment module is switched from above the exposure area where the alignment operation has been completed to above the exposure area where the alignment operation has not been performed.

14. The alignment method according to claim 13, characterized in that: The substrate includes m exposure regions, and the m exposure regions are evenly distributed in a direction around the reference axis; The alignment system includes an alignment module; the preset angle is 360° / m, where m is a positive integer greater than 1.

15. The alignment method according to claim 13, characterized in that: The substrate comprises four exposure areas; The mounting platform is divided into two mounting areas by a dividing line; the alignment system includes two alignment modules, which are respectively arranged on the two mounting areas; the first center axis is arranged at an intersection of the edge of the mounting platform and the dividing line; the preset angle is 180°.

16. The alignment method according to claim 13, characterized in that: The number of the exposure areas is four, and one of two adjacent exposure areas can be aligned with the other when rotating 90° around the reference axis and 90° around its own axis; The mounting platform includes a first platform, a second platform, a second central axis and a third driving mechanism; the first platform and the second platform are both located on an XY plane, the second central axis extends along the Z direction, and the axis of the second central axis passes through the center of the second platform; one end of the second central axis is rotatably connected to the first platform, and the other end is fixedly connected to the second platform; the third driving mechanism is connected to the second central axis and is configured to drive the second central axis to rotate relative to the first platform; the first platform is connected to the first central axis, and the number of the alignment module is one and is arranged on the second platform; The step of driving the mounting platform to rotate around the first central axis by a preset angle at least by the first driving mechanism so that the alignment module switches from above one exposure area to above another exposure area comprises: Controlling the first driving mechanism to drive the first platform to rotate 90° around the first central axis; as well as, The third driving mechanism is controlled to drive the second central axis to rotate 90° relative to the first platform.

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