Layout metal hole arrangement method and system, equipment and storage medium

Abstract

The invention provides a layout metal hole arrangement method and system, equipment and a storage medium. The method comprises the following steps: dividing a layout into a plurality of areas to be processed; the metal density of the to-be-processed area is obtained; according to the metal density, the size, spacing and setting position of metal holes in a to-be-processed area are determined; and setting the metal holes in the to-be-processed area according to the sizes, the intervals and the setting positions of the metal holes. According to the method, the metal holes can be automatically formed in the layout, and the metal density of each area in the layout is adjusted.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductors, and in particular relates to a layout metal hole arrangement method and system, equipment and storage medium. Background Art

[0002] In the process of manufacturing semiconductor devices, a patterning technology is often used to pattern the film layer of the semiconductor device, for example, to form metal holes, grooves, etc.

[0003] Graphical technology usually includes steps such as coating photoresist, exposure, development, and etching. When etching the metal layer, a photoresist layer will first be formed on the surface of the metal layer. Subsequently, the photoresist layer is exposed through the photolithography pattern, and the area of ​​the photoresist layer exposed to light will be removed in the subsequent development step, and the area of ​​the photoresist layer blocked by the photolithography pattern will be retained in the subsequent development step. Finally, through the etching step, the metal layer not blocked by the photoresist layer is etched to form a graphic area (such as metal holes, grooves, etc.) on the surface of the metal layer.

[0004] The metal layer in a semiconductor device is generally formed by electroplating. Due to the defects of the electroplating process itself, the thickness of the metal layer is uneven. For example, the thickness of the metal layer in the edge area is thicker, and the thickness of the metal layer in the center area is thinner. Therefore, after the patterning technology is used to form a pattern on the metal layer, the metal layer needs to be polished to make the surface of the metal layer uniform.

[0005] However, due to the influence of the photolithography pattern, after the metal layer is patterned, the metal portion of the metal layer that remains will not be evenly distributed. For example, in some areas, more metal layers are retained (that is, less metal layers are etched in these areas), resulting in local large pieces of metal, while in some areas, less metal layers are retained (more metal layers are etched in these areas). In the case of local large pieces of metal, when the metal layer is planarized (that is, the surface of the metal layer is polished using a chemical mechanical polishing process), the polishing effect will be relatively poor, and the surface of the large piece of metal layer cannot be polished flat enough. If the surface of the metal layer is not flat enough, it will affect the subsequent process, which is not conducive to the yield of the subsequent process, and is not conducive to the performance of the semiconductor device finally formed. Summary of the invention

[0006] The present invention provides a layout metal hole arrangement method and system, equipment and storage medium, which can automatically arrange metal holes in the layout and adjust the metal density of each area in the layout.

[0007] In one aspect, a method for arranging metal holes in a layout is provided, and the method for arranging metal holes in a layout comprises: Divide the map into multiple areas to be processed; Obtaining the metal density of the area to be treated; Determine the size, spacing and location of the metal holes in the area to be processed according to the metal density; The metal holes are arranged in the area to be processed according to the size, spacing and arrangement position of the metal holes.

[0008] Optionally, the step of obtaining the metal density of the area to be processed includes: The area of ​​the metal layer in the area to be processed and the area of ​​the area to be processed are obtained, and the metal density of the area to be processed is equal to the ratio of the area of ​​the metal layer in the area to be processed to the area of ​​the area to be processed.

[0009] Optionally, the step of determining the size, spacing and setting position of the metal holes in the area to be processed according to the metal density includes: When the metal density in the area to be processed exceeds a metal density threshold, determining that a metal hole needs to be provided in the area to be processed; According to the preset size range of the metal holes, the spacing range of the metal holes and the size of the metal layer in the area to be processed, determine the area to be holed in the area to be processed as the area to set the metal holes; Determine the metal density that needs to be reduced in the area to be processed according to the metal density of the area to be processed and the metal density threshold; According to the size of each hole-laying area in the area to be processed, determine the size of the metal density that needs to be reduced in each hole-laying area; The size, spacing and setting position of the metal holes in each area to be holed are determined based on the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes.

[0010] Optionally, the step of determining the size, spacing and setting position of the metal holes in each area to be holed according to the size of the metal density to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes includes: Using formula , , taking the minimum number of metal holes and the array distribution of metal holes as the design principle, determine the size, spacing and location of the metal holes; in, Indicates the width of the area to be holed. Indicates the length of the area to be holed; Indicates the number of rows of metal holes, Indicates the number of columns of metal holes; Indicates The maximum width of the row metal hole, Indicates The maximum length of the metal hole in the column; Indicates Row and The spacing between rows of metal holes, Indicates Column metal holes and The spacing between the rows of metal holes; Indicates the distance between the first and last rows of metal holes and the edge of the area to be holed. Indicates the distance between the first and last columns of metal holes and the edge of the area to be holed.

[0011] Optionally, the step of determining the size, spacing and setting position of the metal holes in each area to be holed according to the size of the metal density to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes includes: According to the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes, the largest metal hole that can be set in each area to be holed is determined as the first metal hole; Calculate the metal density of the area to be processed after the first metal hole is filled in the area to be holed; After the first metal hole is filled in the area to be processed, when the metal density of the area to be processed is higher than the metal density threshold, the size of the metal density that needs to be reduced in each area to be holed is determined again according to the size of each area to be holed in the area to be processed; According to the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes, the largest metal hole that can be set in each area to be holed is determined as the second metal hole; After setting the second metal hole in the area to be holed, the density of the area to be holed is calculated again. If the density of the area to be holed does not meet the requirements, the new metal density reduction threshold and the maximum metal hole that can be set in the area to be holed are determined again until the metal density in the area to be processed is lower than the metal density threshold, and the determined size, spacing and setting position of the metal holes are output.

[0012] Optionally, the step of determining the size, spacing and location of the metal holes in the area to be processed further includes: A movable window is used to scan and determine the metal density of all positions in the layout; if the metal density under the area covered by the movable window is higher than the metal density threshold, the area covered by the movable window is determined to be the area to be processed; Determine the metal density that needs to be reduced in the area to be processed according to the metal density of the area to be processed and the metal density threshold; According to the size of each hole-laying area in the area to be processed, determine the size of the metal density that needs to be reduced in each hole-laying area; The size, spacing and setting position of the metal holes in each area to be holed are determined based on the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes.

[0013] Optionally, the layout metal hole arrangement method further includes: Perform a design rule check on the layout to determine whether the size, spacing and setting position of the metal holes meet the design rules; when the size, spacing and setting position of the metal holes do not meet the design rules, redetermine the size, spacing and setting position of the metal holes in each area to be processed in the layout.

[0014] On the other hand, a layout metal hole arrangement system is provided, and the layout metal hole arrangement system comprises: A layout division module, used for dividing the layout into a plurality of areas to be processed; A metal density acquisition module is used to acquire the metal density of the area to be processed; A metal hole determination module, used to determine the size, spacing and setting position of the metal holes in the area to be processed according to the metal density; The metal hole setting module is used to set the metal holes in the area to be processed according to the size, spacing and setting position of the metal holes.

[0015] On the other hand, an electronic device is provided, comprising the layout metal hole arrangement system as described above.

[0016] On the other hand, a computer-readable storage medium is provided, wherein at least one program code is stored in the computer-readable storage medium, and the program code is executed by a processor to implement the layout metal hole arrangement method as described in any one of the above items.

[0017] The unexpected technical effects of the technical solution provided by the present invention are: In an embodiment of the present disclosure, a method for arranging metal holes in a layout is provided, and the method automatically sets the metal holes according to the metal density of the area to be processed. The unexpected technical effect is to set the metal holes according to the metal density of the area to be processed, which can ensure that the metal density of the entire layout meets the requirements on the one hand, and ensure that the metal density of the local area of ​​the layout meets the requirements on the other hand, thereby ensuring that the metal distribution in the layout is relatively uniform, and the metal density of each area in the layout is relatively uniform. Setting the metal holes by this method can ensure the uniformity of the metal density in the layout while ensuring the layout efficiency. When the metal layer of the semiconductor device is subsequently patterned using a layout with relatively uniform metal density in each area, it can be ensured that after the metal layer is patterned, the metal distribution in the metal layer is relatively uniform, and there will be no local large pieces of metal. The uniform distribution of the metal layer will be conducive to the flattening of the metal layer, so that it can be ensured that after the metal layer is flattened, the surface of the metal layer can be relatively flat, so as to ensure the yield of the subsequent process and the performance of the semiconductor device finally formed. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A method flow chart of a layout metal hole arrangement method provided by an embodiment of the present disclosure; Figure 2 A method flow chart of another layout metal hole arrangement method provided by an embodiment of the present disclosure; Figure 3 A schematic diagram of a layout provided in an embodiment of the present disclosure; Figure 4 A schematic diagram of another layout provided for an embodiment of the present disclosure; Figure 5 A schematic diagram of another layout provided for an embodiment of the present disclosure; Figure 6 A schematic diagram of a region to be holed provided in an embodiment of the present disclosure; Figure 7 A schematic diagram of another area to be processed provided in an embodiment of the present disclosure; Figure 8 A schematic diagram of another area to be holed provided in an embodiment of the present disclosure; Fig. 9 A schematic diagram of a movable window provided in an embodiment of the present disclosure; Fig.10A schematic diagram of another movable window provided in an embodiment of the present disclosure; Fig.11 A schematic diagram of another movable window provided in an embodiment of the present disclosure; Fig.12 A structural block diagram of a layout metal hole arrangement system provided in an embodiment of the present disclosure; Fig.13 A structural block diagram of an electronic device provided in an embodiment of the present disclosure.

[0020] The reference numerals are as follows: 1: layout; 11: metal layer; 110: metal layer selected as the area to be holed; 111: first metal area; 112: second metal area; 113: third metal area; 12: area to be processed; 13: area to be holed; 131: first area to be holed; 132: second area to be holed; 133: third area to be holed; 14: metal hole; 141: first metal hole; 142: second metal hole; 143: third metal hole; 144: fourth metal hole; 15: movable window; 301: layout division module; 302: metal density acquisition module; 303: metal hole determination module; 304: metal hole setting module; 401: processor; 402: memory. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Figure 1 A method flow chart of a layout metal hole arrangement method provided by an embodiment of the present disclosure. Figure 1 The method steps include: S101, dividing the layout into a plurality of areas to be processed.

[0023] S102, obtaining the metal density of the area to be processed.

[0024] S103, determining the size, spacing and location of the metal holes in the area to be processed according to the metal density.

[0025] S104, setting metal holes in the area to be processed according to the size, spacing and setting position of the metal holes.

[0026] In an embodiment of the present disclosure, a method for arranging metal holes in a layout is provided, and the method automatically sets the metal holes according to the metal density of the area to be processed. The unexpected technical effect is to set the metal holes according to the metal density of the area to be processed, which can ensure that the metal density of the entire layout meets the requirements on the one hand, and the metal density of the local area of ​​the layout meets the requirements on the other hand, thereby ensuring that the metal distribution in the layout is relatively uniform, and the metal density of each area in the layout is relatively uniform. Setting the metal holes by this method can ensure the uniformity of the metal density in the layout while ensuring the layout efficiency. When the metal layer of the semiconductor device is subsequently patterned using a layout with relatively uniform metal density in each area, it can be ensured that the metal layer is distributed relatively uniformly after the patterning process, and there will be no local large pieces of metal. The uniform distribution of the metal layer will be conducive to the flattening of the metal layer, so that it can be ensured that after the metal layer is flattened, the surface of the metal layer can be relatively flat, so as to ensure the yield of the subsequent process and the performance of the semiconductor device finally formed.

[0027] Figure 2 A flowchart of another method for arranging metal holes in a layout provided by an embodiment of the present disclosure. Figure 2 The method steps include: S201, dividing the layout into a plurality of areas to be processed.

[0028] In step S201, the layout may be divided into a plurality of rectangular areas of the same size, the layout may be divided into a plurality of rectangular areas of different sizes, or the layout may be divided into a plurality of areas of other shapes, which is not limited in the present disclosure.

[0029] Figure 3 A schematic diagram of a layout provided in an embodiment of the present disclosure. Figure 1 There are multiple metal layers 11 of different sizes, and gap areas (that is, areas where the metal layers are etched) are between the metal layers 11.

[0030] Figure 4 A schematic diagram of another layout provided by an embodiment of the present disclosure. Figure 4 ,exist Figure 4 The schematic diagram after the layout is divided is shown in FIG. Figure 1 The area 12 to be processed is divided into 9 rectangles by dotted lines.

[0031] S202, obtaining the metal density of the area to be processed.

[0032] In one example, step S202 includes: The area of ​​the metal layer in the area to be processed and the area of ​​the area to be processed are obtained, and the metal density of the area to be processed is equal to the ratio of the area of ​​the metal layer in the area to be processed to the area of ​​the area to be processed.

[0033] In this embodiment, the metal density in a certain region is determined according to the ratio of the metal area in the region to the area of ​​the region.

[0034] Figure 5 A schematic diagram of another layout provided by an embodiment of the present disclosure. Figure 5 Taking the to-be-processed area 12 in the upper left corner of the layout as an example, the metal layer 11 in the to-be-processed area 12 in the upper left corner includes three metal areas, namely, a first metal area 111, a second metal area 112 and a third metal area 113. The areas of the first metal area 111 are The area of ​​the second metal region 112 is The area of ​​the third metal region 113 is , the area of ​​the to-be-processed region 12 in the upper left corner is , then the metal density of the area to be processed 12 in the upper left corner is .

[0035] S203, determining the size, spacing and location of the metal holes in the area to be processed according to the metal density.

[0036] In an example provided by the present invention, step S203 includes: Step 1: When the metal density in the area to be processed exceeds a metal density threshold, it is determined that a metal hole needs to be provided in the area to be processed.

[0037] The metal density threshold can be set as needed, for example, the metal density threshold can be 50%, 40%, etc.

[0038] Step 2: According to the preset size range of the metal holes, the spacing range of the metal holes and the size of the metal layer in the area to be processed, determine the area to be holed in the area to be processed as the area to set the metal holes.

[0039] The area to be processed includes multiple metal areas. By determining the area size of each metal area, it is determined whether each metal area can accommodate a metal hole. If it can, the metal area is determined to be the area to be holed.

[0040] In one example, whether the metal area can accommodate the metal hole can be determined in the following manner: Use the smallest metal hole size (i.e. the smallest length) in the preset metal hole size range. , minimum width ), the minimum boundary spacing in the preset metal hole spacing range (that is, the minimum vertical spacing , the minimum horizontal spacing ), fill a minimum metal hole into the metal area. If the metal area can accommodate a minimum metal hole, the metal area is determined to be the area to be holed.

[0041] Step 3: Determine the metal density that needs to be reduced in the area to be processed according to the metal density of the area to be processed and the metal density threshold.

[0042] In step 3, the metal density to be reduced is greater than or equal to the difference between the metal density of the area to be processed and the metal density threshold.

[0043] Step 4: Determine the metal density that needs to be reduced in each hole-forming area according to the size of each hole-forming area in the area to be processed.

[0044] In one example, the proportion of metal density that needs to be reduced in each area to be holed is determined based on the area ratio of each area to be holed, and the size of the metal density that needs to be reduced in the area to be processed and the proportion of the metal density that needs to be reduced in each area to be holed is determined.

[0045] Step 5: Determine the size, spacing and location of the metal holes in each area to be holed according to the metal density to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes.

[0046] In an example provided by the present invention, step 5 includes: Using formula , , taking the minimum number of metal holes and the array distribution of metal holes as the design principle, determine the size, spacing and location of the metal holes; in, Indicates the width of the area to be holed. Indicates the length of the area to be holed; Indicates the number of rows of metal holes, Indicates the number of columns of metal holes; Indicates The maximum width of the row metal hole, Indicates The maximum length of the metal hole in the column; Indicates Row and The spacing between rows of metal holes, Indicates Column metal holes and The spacing between the rows of metal holes; Indicates the distance between the first and last rows of metal holes and the edge of the area to be holed. Indicates the distance between the first and last columns of metal holes and the edge of the area to be holed.

[0047] In this embodiment, the size and spacing of the metal holes in each area to be arranged are determined according to the size of each area to be arranged with the principle of metal hole array distribution and the minimum number of metal holes. This is helpful to ensure that the metal holes are distributed more evenly in each area to be arranged and the efficiency of arranging the metal holes is higher.

[0048] When the above formula is used to determine the size and spacing of the metal holes, the minimum spacing between the metal holes (i.e. , , and The minimum value is used), the metal hole size is the largest (in , , and When the minimum value is adopted for both, the width and length of the metal hole are determined accordingly. The size and spacing of the metal holes are determined based on the principle of ( ). The larger the metal holes are, the fewer metal holes are required in the end, which is beneficial to the efficiency of metal hole arrangement.

[0049] In this embodiment, in order to further simplify the layout rules and speed up the layout efficiency of metal holes, the size and spacing of the metal holes in the same area to be arranged can be further set to the same size, for example, the length and width of each metal hole are the same, the spacing between each row of metal holes is the same, and the spacing between each column of metal holes is the same.

[0050] See also Figure 6 and 7 The situation shown in , where Figure 6 To set the layout structure before the metal hole, Figure 7 The structure of the layout after array-distributed metal holes are set in the metal layer using the above formula and design principles.

[0051] In another example provided by the present invention, step 5 includes: The first step is to determine the largest metal hole that can be set in each area to be holed as the first metal hole based on the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes.

[0052] See also Figure 8 In the situation shown in Figure 8The middle area to be processed 12 includes a first area to be holed 131, a second area to be holed 132 and a third area to be holed 133, and first metal holes 141 are determined for the first area to be holed 131, the second area to be holed 132 and the third area to be holed 133 respectively.

[0053] In this embodiment, after the first metal hole is filled in the area to be holed, the metal density reduced in the area to be holed is exactly equal to the metal density that needs to be reduced at the area to be holed. Figure 8 In the case of the second area to be holed, at this time, the area to be holed only needs to be arranged with the first metal hole, and the first metal hole can be set at the center of the second area to be holed.

[0054] If the metal density of the area to be holed is reduced after the first metal hole is filled in the area to be holed, which is less than the metal density to be reduced at the area to be holed, that is, Figure 8 At this time, the first metal hole is set at the edge of the first area to be holed and the second area to be holed, and the size and position of the second metal hole that can be set in the first area to be holed and the second area to be holed are further determined.

[0055] The second step is to calculate the metal density of the area to be processed after the first metal hole is filled in the area to be holed.

[0056] If the metal density of the area to be processed is equal to the metal density threshold after the first metal hole is filled in the area to be processed, the first metal hole is determined to be the metal hole to be filled in the area to be processed. Otherwise, the second metal hole needs to be further determined to further reduce the metal density of the area to be processed.

[0057] Step 3: After the first metal hole is filled in the area to be processed, when the metal density of the area to be processed is higher than the metal density threshold, the size of the metal density that needs to be reduced in each area to be processed is determined again according to the size of each area to be processed.

[0058] See also Figure 8 In the case of filling the first metal hole, after filling the first metal hole, the metal density reduced in the first area to be holed is still greater than the metal density that needs to be reduced in the first area to be holed, and the metal density reduced in the second area to be holed is still greater than the metal density that needs to be reduced in the second area to be holed. At this time, the size of the metal density that needs to be further reduced in the first area to be holed and the second area to be holed is further determined.

[0059] The fourth step is to determine the largest metal hole that can be set in each area to be holed as the second metal hole based on the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes.

[0060] See also Figure 8 In the case where the maximum size (maximum width and maximum length) in the preset size range of the metal hole is used as the size of the second metal hole, after the second metal hole is filled in the area to be holed, the size of the metal density reduced in the area to be holed is greater than the size of the metal density that needs to be reduced in the area to be holed, then the size of the second metal hole can be determined according to the size of the metal density that needs to be reduced in the area to be holed (such as the situation in the second area to be holed), so that after the second metal hole is filled in the area to be holed, the size of the metal density reduced in the area to be holed is just equal to the size of the metal density that needs to be reduced in the area to be holed.

[0061] Step 5. After setting the second metal hole in the area to be holed, calculate the density of the area to be holed again. If the density of the area to be holed does not meet the requirements, determine the new metal density reduction threshold and the largest metal hole that can be set in the area to be holed again, until the metal density in the area to be processed is lower than the metal density threshold, output the determined size, spacing and setting position of the metal hole.

[0062] See also Figure 8 In the situation in which, after the first metal hole 141 and the second metal hole 142 are filled into the first area 131 to be holed, the metal density reduced in the first area 131 to be holed still does not meet the size of the metal density that needs to be reduced in the first area 131 to be holed, the size of the third metal hole 143 in the first area 131 to be holed is further determined.

[0063] In another example provided by the present invention, step 5 may also include: The first step is to use a movable window to scan and determine the metal density of all positions in the layout; if the metal density under the area covered by the movable window is higher than the metal density threshold, the area covered by the movable window is determined to be the area to be processed.

[0064] See also Fig. 9 In the case of the movable window 15 from the version Figure 1 The upper left corner of the image is scanned in sequence to determine the metal density of each area in the layout. The dotted arrow in the figure indicates the moving direction of the movable window.

[0065] See also Fig.10 In the case of FIG. 1 , after the movable window 15 moves from the upper left corner of the layout to the upper right corner of the layout, the moving direction of the movable window changes to moving downward.

[0066] See also Fig.11In the case of , the movable window moves down by half the width of the movable window and then starts to move from the rightmost side of the layout to the leftmost side of the layout. Among them, the movable window moves down by half the width of the movable window to avoid missing detection in some areas of the layout. For details, please refer to Figure 4 In the situation in FIG, part of the metal area is divided into two parts by the dotted line, which will cause the larger metal block to be divided into two smaller metal blocks, so that the two small metal blocks may be ignored or the size of the metal holes filled in the two small metal blocks is small. The above situation can be avoided by using a movable window.

[0067] The movable window determines the metal density of each area in the layout in turn by adopting the above-mentioned moving method.

[0068] Of course, the above moving method of the movable window is only an example provided by the present invention. In actual situations, other moving methods may be used, and the present invention is not limited to this.

[0069] The second step is to determine the metal density that needs to be reduced in the area to be processed based on the metal density of the area to be processed and the metal density threshold.

[0070] The third step is to determine the metal density that needs to be reduced in each hole-forming area according to the size of each hole-forming area in the area to be processed.

[0071] The fourth step is to determine the size, spacing and setting position of the metal holes in each area to be holed according to the size of the metal density to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes.

[0072] In this embodiment, the method of dynamically determining the metal density of each area in the layout using a movable window can be used after setting the metal holes, so as to further check the areas in the layout where the local metal density is too large, or the method of dynamically determining the metal density of each area in the layout using a movable window can be directly used to arrange metal holes for the layout.

[0073] S204, setting metal holes in the area to be processed according to the size, spacing and setting position of the metal holes.

[0074] After the size, spacing and location of the metal holes are determined in step S203, the metal holes can be arranged.

[0075] In one example, step S204 includes: According to the size and spacing of the metal holes, set the metal holes from left to right and from top to bottom, starting from the upper left corner of the area to be holed; Alternatively, according to the size and spacing of the metal holes, the metal holes are arranged from the lower left corner of the area to be arranged, from left to right and from bottom to top; Alternatively, according to the size and spacing of the metal holes, the metal holes are arranged from the upper right corner of the area to be arranged, from right to left and from top to bottom in sequence; Alternatively, according to the size and spacing of the metal holes, the metal holes are arranged starting from the lower right corner of the area to be arranged, from right to left and from bottom to top.

[0076] It is worth noting that, in the present embodiment, the metal hole is a rectangular metal hole, and in other embodiments, the metal hole may also be a circular, polygonal or irregular hole, and the present invention is not limited thereto.

[0077] S205, performing a design rule check on the layout to determine whether the size, spacing and setting position of the metal holes comply with the design rules; when the size, spacing and setting position of the metal holes do not comply with the design rules, re-determine the size, spacing and setting position of the metal holes in each area to be processed in the layout.

[0078] In summary, the layout metal hole arrangement method provided by the present application is used to arrange the metal holes to balance the metal density of each area in the layout. The unexpected technical effect is: the metal holes are arranged by the metal density of the area to be processed, which can ensure that the metal density of the entire layout meets the requirements on the one hand, and ensure that the local metal density of the layout meets the requirements on the other hand, thereby ensuring that the metal distribution in the layout is relatively uniform, and the metal density of each area in the layout is relatively uniform. The arrangement of metal holes by this method can ensure the uniformity of the metal density in the layout while ensuring the layout efficiency. When the metal layer of the semiconductor device is subsequently patterned using a layout with relatively uniform metal density in each area, it can be ensured that after the metal layer is patterned, the metal distribution in the metal layer is relatively uniform, and there will be no local large pieces of metal. The uniform distribution of the metal layer will be conducive to the flattening of the metal layer, so that it can be ensured that after the metal layer is flattened, the surface of the metal layer can be relatively flat, so as to ensure the yield of the subsequent process and the performance of the semiconductor device finally formed.

[0079] Fig.12 This is a structural block diagram of a layout metal hole arrangement system provided by an embodiment of the present disclosure. Fig.12 , the layout metal hole arrangement system includes: A layout division module 301 is used to divide the layout into a plurality of areas to be processed; A metal density acquisition module 302 is used to acquire the metal density of the area to be processed; A metal hole determination module 303 is used to determine the size, spacing and setting position of the metal holes in the area to be processed according to the metal density; The metal hole setting module 304 is used to set metal holes in the area to be processed according to the size, spacing and setting position of the metal holes.

[0080] Fig.13 This is a structural block diagram of an electronic device provided by an embodiment of the present disclosure. Fig.13 The electronic device may include a layout metal hole arrangement system. Generally, the electronic device includes: a processor 401 and a memory 402 .

[0081] The processor 401 may include one or more processing cores, such as a 4-core processor, an 8-core processor, etc. The processor 401 may be implemented in at least one hardware form of DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), and PLA (Programmable Logic Array). The processor 401 may also include a main processor and a coprocessor. The main processor is a processor for processing data in the awake state, also known as a CPU (Central Processing Unit); the coprocessor is a low-power processor for processing data in the standby state.

[0082] The memory 402 may include one or more computer-readable storage media, which may be non-transitory. The memory 402 may also include a high-speed random access memory, and a non-volatile memory, such as one or more disk storage devices, flash memory storage devices. In some embodiments, the non-transitory computer-readable storage medium in the memory 402 is used to store at least one instruction, which is used to be executed by the processor 401 to implement the layout metal hole arrangement method performed by the electronic device provided in the method embodiment of the present application.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for arranging metal holes in a layout, characterized in that: The layout metal hole arrangement method comprises: Divide the map into multiple areas to be processed; Obtaining the metal density of the area to be treated; Determine the size, spacing and location of the metal holes in the area to be processed according to the metal density; The metal holes are arranged in the area to be processed according to the size, spacing and arrangement position of the metal holes.

2. The layout metal hole arrangement method according to claim 1, characterized in that: The steps for obtaining the metal density of the area to be treated include: The area of ​​the metal layer in the area to be processed and the area of ​​the area to be processed are obtained, and the metal density of the area to be processed is equal to the ratio of the area of ​​the metal layer in the area to be processed to the area of ​​the area to be processed.

3. The layout metal hole arrangement method according to claim 1, characterized in that: The step of determining the size, spacing and location of the metal holes in the area to be processed according to the metal density comprises: When the metal density in the area to be processed exceeds a metal density threshold, determining that a metal hole needs to be provided in the area to be processed; According to the preset size range of the metal holes, the spacing range of the metal holes and the size of the metal layer in the area to be processed, determine the area to be holed in the area to be processed as the area to set the metal holes; Determine the metal density that needs to be reduced in the area to be processed according to the metal density of the area to be processed and the metal density threshold; According to the size of each hole-laying area in the area to be processed, determine the size of the metal density that needs to be reduced in each hole-laying area; The size, spacing and setting position of the metal holes in each area to be holed are determined based on the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes.

4. The layout metal hole arrangement method according to claim 3, characterized in that: The step of determining the size, spacing and setting position of the metal holes in each area to be holed according to the size of the metal density to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes includes: Using formula , , taking the minimum number of metal holes and the array distribution of metal holes as the design principle, determine the size, spacing and location of the metal holes; in, Indicates the width of the area to be holed. Indicates the length of the area to be holed; Indicates the number of rows of metal holes, Indicates the number of columns of metal holes; Indicates The maximum width of the row metal hole, Indicates The maximum length of the metal hole in the column; Indicates Row and The spacing between rows of metal holes, Indicates Column metal holes and The spacing between the rows of metal holes; Indicates the distance between the first and last rows of metal holes and the edge of the area to be holed. Indicates the distance between the first and last columns of metal holes and the edge of the area to be holed.

5. The layout metal hole arrangement method according to claim 3, characterized in that: The step of determining the size, spacing and setting position of the metal holes in each area to be holed according to the size of the metal density to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes includes: According to the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes, the largest metal hole that can be set in each area to be holed is determined as the first metal hole; Calculate the metal density of the area to be processed after the first metal hole is filled in the area to be holed; After the first metal hole is filled in the area to be processed, when the metal density of the area to be processed is higher than the metal density threshold, the size of the metal density that needs to be reduced in each area to be holed is determined again according to the size of each area to be holed in the area to be processed; According to the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes, the largest metal hole that can be set in each area to be holed is determined as the second metal hole; After setting the second metal hole in the area to be holed, the density of the area to be holed is calculated again. If the density of the area to be holed does not meet the requirements, the new metal density reduction threshold and the maximum metal hole that can be set in the area to be holed are determined again until the metal density in the area to be processed is lower than the metal density threshold, and the determined size, spacing and setting position of the metal holes are output.

6. The layout metal hole arrangement method according to claim 4 or 5, characterized in that: The step of determining the size, spacing and location of the metal holes in the area to be processed also includes: A movable window is used to scan and determine the metal density of all positions in the layout; if the metal density under the area covered by the movable window is higher than the metal density threshold, the area covered by the movable window is determined to be the area to be processed; Determine the metal density that needs to be reduced in the area to be processed according to the metal density of the area to be processed and the metal density threshold; According to the size of each hole-laying area in the area to be processed, determine the size of the metal density that needs to be reduced in each hole-laying area; The size, spacing and setting position of the metal holes in each area to be holed are determined based on the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes.

7. The method for arranging metal holes in a layout according to any one of claims 1 to 5, characterized in that: The layout metal hole arrangement method further includes: Perform a design rule check on the layout to determine whether the size, spacing and setting position of the metal holes meet the design rules; when the size, spacing and setting position of the metal holes do not meet the design rules, redetermine the size, spacing and setting position of the metal holes in each area to be processed in the layout.

8. A layout metal hole arrangement system, characterized in that: The layout metal hole arrangement system includes: A layout division module, used for dividing the layout into a plurality of areas to be processed; A metal density acquisition module is used to acquire the metal density of the area to be processed; A metal hole determination module, used to determine the size, spacing and setting position of the metal holes in the area to be processed according to the metal density; The metal hole setting module is used to set the metal holes in the area to be processed according to the size, spacing and setting position of the metal holes.

9. An electronic device, characterized in that: The electronic device comprises the layout metal hole arrangement system as claimed in claim 8.

10. A computer-readable storage medium, characterized in that: At least one program code is stored in the computer-readable storage medium, and the program code is executed by a processor to implement the layout metal hole arrangement method according to any one of claims 1 to 7.

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