Wafer high-temperature cleaning and etching equipment

Abstract

The invention discloses wafer high-temperature cleaning and etching equipment, which comprises a frame body, the cleaning cavity is arranged in the frame body; the rotating platform is arranged in the cleaning cavity, and a wafer is arranged on the rotating platform; the protection part is arranged above the wafer in a lifting and rotating mode, and a liquid inlet hole is formed in the protection part; the at least two liquid medicine nozzles are arranged above the protection part in a position-adjustable mode, and the liquid medicine nozzles spray high-temperature liquid medicine to the wafer through the liquid inlet hole by means of transmission of the high-temperature liquid medicine transmission module; the at least one washing nozzle is arranged above the protection component in a position-adjustable manner; when the flushing nozzle is used for spraying flushing liquid, a water film is formed on the surface of the wafer, and when the protection component descends to a certain position, the protection component cleans the lower surface of the protection component through the water film, so that the situation of cross contamination of dropping liquid and liquid medicine is prevented; the secondary heating part is additionally arranged close to the terminal of the liquid medicine nozzle, so that the heating efficiency is high; and a double-tube quartz tube is additionally arranged outside the heating quartz, so that the safety is high.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer cleaning, and in particular relates to a high-temperature wafer cleaning and etching device. Background Art

[0002] Wafers need to go through multiple steps in the production process, among which cleaning and etching on the wafer is an important process. Currently, high-temperature liquid crystal wafers are required for cleaning and etching when cleaning and etching the wafers.

[0003] At present, in order to keep the temperature of the chemical liquid warm, an insulation part is added above the wafer for insulation, and a protective plate can also be added to prevent the chemical liquid from splashing; however, it is found in actual use that after adding the insulation plate or the protective plate, residual chemical liquid will remain on its lower surface, which will cause dripping and cross-contamination of chemical liquid, resulting in the cleaning and etching failing to meet the set requirements.

[0004] In addition, there are high requirements for the temperature of the wafer high-temperature cleaning and etching solution. The temperature will affect the etching rate, surface uniformity, etc. In order to ensure that the temperature of the solution can immediately reach the desired temperature, it is necessary to use an efficient heating device. At present, it is common to add a quartz coating heating device to the outer space of the cavity for secondary heating. However, in actual use, it is found that due to the long transmission distance of the solution, the temperature loss is large, and the temperature of the solution cannot be accurately controlled, resulting in its high-temperature cleaning and etching efficiency and quality not meeting the due needs, which has brought many adverse effects on actual production and processing. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a high-temperature wafer cleaning and etching device with high cleaning efficiency, rapid and stable temperature rise of the chemical solution, and high cleaning and etching quality.

[0006] To achieve the above object, the technical solution adopted by the present invention is: a wafer high temperature cleaning and etching device, comprising:

[0007] Frame;

[0008] A cleaning chamber is disposed in the frame;

[0009] A rotating platform is arranged in the cleaning chamber, and a wafer is clamped on the rotating platform;

[0010] A protective component is disposed above the wafer and can be raised and lowered and rotated, and a liquid inlet hole is provided on the protective component;

[0011] At least two liquid medicine nozzles are adjustable in position and arranged above the protected component, and the liquid medicine nozzles spray the high-temperature liquid medicine onto the wafer through the liquid inlet hole via the transmission of the high-temperature liquid medicine transmission module;

[0012] At least one flushing nozzle, which is adjustable in position and arranged above the protective component, and is used to transmit the flushing liquid through the liquid inlet hole and spray it onto the wafer;

[0013] Among them, when any one of the liquid medicine nozzles sprays high-temperature liquid medicine onto the wafer, the liquid medicine nozzle is reset, and the flushing nozzle sprays the flushing liquid onto the wafer to form a water film. At the same time, the wafer rotates to drive the water film to move spirally from the center to the outer edge and be thrown out. At this time, the flushing nozzle is always in an open state to ensure the presence of a water film on the wafer. Then, after the protective component is lowered, it moves up and down and rotates within the height of the water film to achieve oscillation washing of the lower surface of the protective component.

[0014] In one embodiment, the protective component is a heat preservation plate or a splash plate.

[0015] In one embodiment, the protective component is rotatably disposed above the wafer via a hollow rotating mechanism; the hollow rotating mechanism is disposed on the lifting mechanism, and the lifting mechanism drives the hollow rotating mechanism to move up and down.

[0016] In one embodiment, when the protective component is lowered to a height of 1-2 mm between the lower surface of the protective component and the wafer, a water film is formed between the protective component and the wafer when the flushing nozzle sprays the flushing liquid into the upper surface of the wafer.

[0017] In one embodiment, the liquid medicine nozzle and the flushing nozzle are adjustable in position above the liquid inlet via corresponding multi-axis robotic arms.

[0018] In one embodiment, the high-temperature liquid medicine transmission module includes a liquid medicine tank, a heating rod, a liquid delivery channel, a liquid return channel, a valve body control box, a secondary heating part and a nitrogen filling part; the liquid medicine tank is arranged on the outside of the frame; the liquid medicine tank contains liquid medicine that can be heated by the heating rod; when the liquid medicine in the liquid medicine tank is transported through the liquid delivery channel, it is secondary heated by the secondary heating part located in the valve body control box in the frame and then transported to the liquid medicine nozzle; the liquid return channel is connected to the end of the liquid delivery channel, and is used for the liquid medicine to return to the liquid medicine tank.

[0019] In one embodiment, the liquid delivery channel includes a liquid delivery pipeline, on which are sequentially distributed a liquid delivery pump connected to the liquid in the liquid tank, a first liquid delivery air-controlled valve, a liquid delivery manual valve, a second liquid delivery manual valve, a liquid delivery temperature sensor and a second liquid delivery air-controlled valve.

[0020] In one embodiment, the liquid return channel includes a liquid return pipeline; one end of the liquid return pipeline is connected to the liquid tank, and the other end is located between the liquid delivery temperature sensor and the third liquid delivery air-controlled valve; a flow regulating manual valve, a back pressure valve and a liquid return air-controlled valve are distributed in sequence on the liquid return pipeline.

[0021] In one embodiment, the secondary temperature rising part includes a temperature rising part and a nitrogen filling part; the temperature rising part includes a heating quartz tube, and a nano coating is provided on the heating quartz tube; a heating coil is provided on the nano coating; a double quartz tube is also provided outside the heating quartz tube; one end of the double quartz tube is connected to the nitrogen filling part, and the other end leads out a cable from the heating coil and is connected to an external power supply, wherein the cable passes through a quartz seal at the point where it passes through the double quartz tube.

[0022] In one embodiment, the nitrogen charging part includes a nitrogen pipeline connected to nitrogen, and a nitrogen manual valve, a nitrogen pressure reducing valve, a nitrogen pressure gauge, a nitrogen solenoid valve, and a nitrogen flow meter are sequentially arranged on the nitrogen pipeline. An overflow valve is also connected in parallel at the front end of the nitrogen flow meter on the nitrogen pipeline; a monitoring pressure gauge is also provided at the front end after the nitrogen flow meter and the overflow are connected in parallel.

[0023] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0024] It is arranged above the wafer and is used to flush the flushing liquid onto the wafer through the liquid inlet hole.

[0025] The wafer high-temperature cleaning and etching equipment of the present invention is provided with a protective component that can rotate and rise and fall, so that a water film is formed when a rinse nozzle sprays a rinse liquid onto a wafer, and then the surface of the protective component opposite to the wafer is oscillated and washed by the water film, thereby avoiding residual liquid medicine on the surface of the protective component opposite to the wafer, preventing the occurrence of dripping and cross contamination of liquid medicine, improving the cleaning quality, and at the same time, cleaning the liquid medicine on the upper surface of the wafer.

[0026] Secondly, a secondary heating unit is added to the liquid delivery channel, and the secondary heating unit is located inside the frame, so that the secondary heating unit can be closer to the terminal liquid nozzle outlet, reducing temperature loss while ensuring high heating efficiency.

[0027] In addition, a double quartz tube is added outside the hot quartz tube in the secondary temperature rising part, so as to avoid the risk of the nano coating and the heating coil falling off due to heat and corrosion. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The technical solution of the present invention is further described below in conjunction with the accompanying drawings:

[0029] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;

[0030] Figure 2 for Figure 1 A partial schematic diagram of the

[0031] Figure 3 It is a schematic diagram of the structure of the protective component and the rotating platform adapted to each other in another embodiment of the present invention;

[0032] Figure 4 Schematic diagram of the structure of the protective component in different positions above the wafer in one embodiment of the present invention;

[0033] Figure 5 It is a partial schematic diagram of a liquid medicine nozzle and a flushing nozzle located above a protective component in an embodiment of the present invention;

[0034] Figure 6 It is a structural schematic diagram of a high-temperature liquid medicine transmission device in one embodiment of the present invention;

[0035] Figure 7 It is a structural schematic diagram of a nitrogen charging part connected to a secondary temperature rising part in one embodiment of the present invention;

[0036] Figure 8 It is a structural schematic diagram of a secondary temperature rising portion in one embodiment of the present invention;

[0037] Among them: 1. frame; 2. cleaning chamber; 3. rotating platform; 4. protective component; 5. liquid nozzle; 6. flushing nozzle; 7. high-temperature liquid transmission module; 8. wafer; 40. liquid inlet hole; 41. hollow rotating mechanism; 42. lifting mechanism; 70. liquid tank; 71. heating rod; 72. liquid delivery channel; 73. liquid return channel; 74. valve body control box; 75. secondary heating part; 720. liquid delivery pipeline; 721. liquid delivery pump; 722. first liquid delivery air-controlled valve; 723. liquid delivery manual valve; 724. second liquid delivery manual valve; 725. second liquid delivery air-controlled valve; 726. liquid delivery temperature sensor; 727. third liquid delivery air-controlled valve; 730, liquid return pipeline; 731, manual valve with flow regulation; 732, back pressure valve; 733, liquid return gas control valve; 750, heating unit; 751, nitrogen charging unit; 752, secondary temperature sensor; 752, secondary gas control valve; 7501, hot quartz tube; 7502, nano coating; 7503, heating coil; 7504, double quartz tube; 7505, quartz; 7506, cable; 7510, nitrogen pipeline; 7511, nitrogen manual valve; 7512, nitrogen pressure reducing valve; 7513, nitrogen pressure gauge; 7514, nitrogen solenoid valve; 7515, nitrogen flow meter; 7516, overflow valve; 7517, monitoring pressure gauge. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0039] The present invention provides a wafer high-temperature cleaning and etching device to solve the problem that in the prior art, a protective plate is added in order to increase the temperature of the chemical solution or prevent the chemical solution from splashing, but chemical solution will remain on the lower surface of the protective plate after the chemical solution is sprayed, resulting in the problem of dripping and cross-talk of the chemical solution during cleaning, and at the same time, the existing chemical solution has a poor heating effect and low temperature control accuracy, which cannot meet the existing use.

[0040] For ease of understanding, the specific process in the embodiments of the present application is described below. Figures 1 to 5 A wafer high-temperature cleaning and etching device in an embodiment of the present application comprises a frame 1, a cleaning chamber 2, a rotating platform 3, a protective component 4, a liquid medicine nozzle 5, a rinsing nozzle 6 and a high-temperature liquid medicine transmission module 5; the cleaning chamber 2 is arranged in the frame 1; the rotating platform 3 is arranged in the cleaning chamber 2; a wafer 8 is clamped on the rotating platform 3; the protective component 4 is arranged above the wafer so as to be able to be raised and lowered and rotated, and a liquid inlet hole 40 is opened on the protective component 4; at least two liquid medicine nozzles 5 are adjustable in position and are arranged above the protective component 4, and the liquid medicine nozzle 5 sprays the high-temperature liquid medicine onto the wafer through the liquid inlet hole 40 after being transmitted by the high-temperature liquid medicine transmission module 7, and at least one rinsing nozzle 6 is adjustable in position and is arranged above the protective component 4 to rinse the rinsing liquid onto the wafer through the liquid inlet hole 40.

[0041] The wafer high-temperature cleaning and etching equipment of the present invention is provided with a protective component 4 that is rotatable and can be raised and lowered. When any liquid medicine nozzle sprays high-temperature liquid medicine onto the wafer, the liquid medicine nozzle 5 is reset, and the flushing nozzle 6 sprays the flushing liquid onto the wafer to form a water film. At the same time, the wafer 8 rotates to drive the water film to move spirally from the center to the outer edge. At this time, the flushing nozzle 6 is always in an open state to ensure the existence of the water film. Then the protective component 4 moves up and down and rotates within the height of the water film, thereby realizing oscillating washing of the protective component 4 relative to the wafer surface to prevent liquid medicine from remaining on the surface of the protective component 4 relative to the wafer 8 during the high-temperature liquid medicine cleaning and etching process, effectively avoiding cross contamination and dripping problems during the cleaning and etching process, and ensuring the efficiency and quality of the wafer high-temperature cleaning and etching.

[0042] In one embodiment, the protective component 4 is lowered to a very close distance to wafer 8, where the distance is the height between the surface of the protective component 4 and wafer 8, which is approximately between 1 and 2 mm. When at this height, after the flushing liquid is sprayed from the flushing nozzle 6 onto the upper surface of wafer 8, a water film will be formed between the upper surfaces of wafer 8. In this way, when the protective component 4 is close to wafer 8, it can rotate at a low speed on the water film for cleaning.

[0043] In one embodiment, the protective component 4 can be a heat-insulating plate, which can keep the temperature of the liquid medicine warm; in addition, the protective component 4 can also be a splash-proof plate, which can avoid splashing of high-temperature liquid medicine and further improve the cleaning efficiency.

[0044] In one embodiment, see Figure 3 The lower surface of the protective component 4 in this embodiment is a sloped surface, so that when the liquid flows to the surrounding edges, it is conducive to drying and is less likely to have residual liquid, thereby improving the cleaning efficiency.

[0045] In one embodiment, see Figure 1 and Figure 2 The protective component 4 is rotatably arranged above the wafer 8 through a hollow rotating mechanism 41. The hollow rotating mechanism 41 is arranged on the lifting mechanism 42. The lifting mechanism 42 is used to drive the hollow rotating mechanism 41 to move up and down. In this way, the protective component 4 can be rotated and lifted above the wafer under the drive of the hollow rotating mechanism 41 and the lifting mechanism 42.

[0046] The lifting mechanism 42 in this embodiment can be a cylinder or a screw drive mechanism. The lifting mechanism 42 drives the protective component 4 to move up and down. Figure 3 The lifting mechanism 42 can drive the protective component 4 to rise to the positions S1 and S2 respectively, and of course it can also be other positions, which can be adjusted according to actual needs; and the hollow rotating mechanism 41 can be a rotating motor, which drives the protective component 4 to rotate 360°.

[0047] In one embodiment, the present embodiment includes two liquid medicine nozzles 5 and one flushing nozzle 6, and the two liquid medicine nozzles 5 and one flushing nozzle 6 are respectively arranged above the liquid inlet hole 40 in an adjustable position through corresponding multi-axis mechanical arms. Figure 5, one liquid medicine nozzle 5 is rotated to the top of the liquid inlet 40 by the multi-axis robot arm, and its standby position is indicated by the dotted line P1. At this time, the other liquid medicine nozzle 5 and the flushing nozzle 6 are in the standby positions P2 and P3 respectively. When the other liquid medicine nozzle 5 and the flushing nozzle 6 are working, the corresponding dotted lines are their working positions, so that when each nozzle sprays liquid through the liquid inlet 40, there will be no interference problem. In addition, the flushing liquid sprayed by the flushing nozzle 6 is deionized water or ultrapure water (UPW).

[0048] A cleaning process is described below. In this embodiment, two liquid nozzles 5 for liquid A and liquid B are included, and a flushing nozzle 6 for flushing out ultrapure water (UPW).

[0049] S1. First, the liquid nozzle passes liquid A to the liquid inlet hole 40 and sprays it onto the wafer for cleaning. At this time, liquid A will condense on the lower surface of the protective component 4, and then the liquid nozzle returns to its position;

[0050] S2. The rinse nozzle 6 is moved to the top of the wafer, and then UPW is sprayed to rinse the A solution on the wafer surface through the liquid inlet hole 40 to rinse the A solution away;

[0051] S3. At this time, the wafer is in a rotating state, and the water film is thrown out, so the flushing nozzle 6 is always in an open state to ensure that a layer of water film is always formed on the surface of the wafer;

[0052] S4. The lifting mechanism drives the protective component 4 to move up and down within a certain range above the water film, and rotates at a low speed at the same time, which is equivalent to using the water film to vibrate and wash the lower surface of the protective component 4; at the same time, the wafer rotates, and the water film moves spirally from the center to the outer edge;

[0053] S5. After the protective component 4 is lifted to a certain height, it is separated from the water film, and the UPW sprayed from the washing nozzle 6 remains on the surface of the wafer. After the wafer rotates at high speed, the water is spun off, and the protective component 4 is also spun off at high speed, thereby completing the washing of the lower surface of the protective component 4, and no liquid remains on the lower surface of the protective component 4;

[0054] S6. Continue cleaning with the B solution, and then perform a cycle of steps S2-S5, thereby completing the high-temperature cleaning of the wafer with the A solution and the B solution.

[0055] In summary, in the present high-temperature cleaning and etching equipment, during the switching process between different chemical solutions in the chamber, before the switching, the lower surface of the protective component 4 is effectively cleaned by the water film between the protective component and the wafer, thereby avoiding the cross-contamination of dripping liquid and chemical solutions during the cleaning and etching process.

[0056] As a further preferred embodiment, see Figure 1and Figure 6 The high-temperature liquid medicine transmission module 7 includes a liquid medicine tank 70, a heating rod 71, a liquid delivery channel 72, a liquid return channel 73, a valve body control box 74, a secondary temperature rising part 75 and a nitrogen filling part 751; the liquid medicine tank 70 is arranged outside the frame 1; the liquid medicine tank 70 contains liquid medicine that can be heated by the heating rod 71, and the liquid medicine is heated by the heating rod 71 and delivered to the corresponding liquid medicine nozzle 5 through the liquid delivery channel 72.

[0057] The valve body control box 74 is arranged inside the frame 1, and the valve body control box 74 is located at the front end where the liquid delivery channel 72 is connected to the liquid medicine nozzle 5; a secondary heating part 75 is provided in the valve body control box 74, and the secondary heating part 75 heats the liquid medicine heated by the heating rod 71 for a second time, and the secondary heating part 75 is located inside the frame 1, so as to be closer to the spray port position of the liquid medicine nozzle 5, so that the temperature of the liquid medicine can be more accurate, and the temperature of the liquid medicine will not fail to meet the requirements due to long-distance transmission.

[0058] The liquid return channel 73 is connected to the end of the liquid delivery channel 72 and is used for the liquid medicine to return to the liquid medicine tank.

[0059] In one embodiment, see Figure 6 The liquid delivery channel 72 includes a liquid delivery pipeline 720, on which are sequentially distributed a liquid delivery pump 721 connected to the liquid in the liquid tank 70, a first liquid delivery air-controlled valve 722, a first liquid delivery manual valve 723, a second liquid delivery air-controlled manual valve 724, a second liquid delivery manual air-controlled valve 725, a liquid delivery temperature sensor 726 and a third liquid delivery air-controlled valve 727; the liquid passes through the first liquid delivery air-controlled valve 722, the first liquid delivery manual valve 723, the second liquid delivery manual air-controlled valve 724, the second liquid delivery manual air-controlled valve 725, the liquid delivery temperature sensor 726 and the third liquid delivery air-controlled valve 727; the liquid passes through the liquid delivery pump 721 in sequence through the first liquid delivery air-controlled valve 722, the first liquid delivery manual valve 723, the second liquid delivery manual air-controlled valve 725, the liquid delivery temperature sensor 726 and the third liquid delivery air-controlled valve 727. The second liquid delivery air-controlled manual valve 724, the third liquid delivery air-controlled valve 725 and the third liquid delivery air-controlled valve 727 are transmitted to the secondary temperature rising part 75 in the valve body control box 74 in the frame 1, wherein the liquid delivery temperature sensor 726 is located between the second liquid delivery air-controlled valve 725 and the third liquid delivery air-controlled valve 727, and is used to detect the temperature of the liquid after the liquid is heated. Because there will definitely be temperature loss during the long-distance transmission process, the temperature of the liquid can be accurately controlled to meet the actual high-temperature cleaning needs.

[0060] In one embodiment, see Figure 6The liquid return channel 73 includes a liquid return pipeline 730; one end of the liquid return pipeline 730 is connected to the liquid medicine tank 70, and the other end is located between the liquid delivery temperature sensor 726 and the third liquid delivery air control valve 727; a flow regulating manual valve 731, a back pressure valve 732 and a liquid return air control valve 733 are sequentially distributed on the liquid return pipeline 730, and the above valves all control the flow of liquid medicine into the liquid return channel 73. The liquid return channel 73 plays the role of returning the liquid medicine to the liquid medicine tank 70, thereby realizing the internal liquid medicine circulation.

[0061] In one embodiment, see Figure 7 and Figure 8 The secondary temperature rising part 75 includes a temperature rising part 750 and a nitrogen filling part 751; the temperature rising part 750 includes a heating quartz tube 7501, and the heating quartz tube 7501 is coated with a nano coating 7502; a heating coil 7503 is provided on the nano coating 7502; a double quartz tube 7504 is also provided outside the heating quartz tube 7501; one end of the double quartz tube 7504 is communicated with the nitrogen filling part, and the other end leads out a cable 7506 from the heating coil and is connected to an external power supply, and the cable 7506 is sealed by a quartz 7505.

[0062] Specifically, the secondary heating unit 75 is arranged in the cleaning chamber 2, so that it is close to the wafer 8, thereby reducing the temperature loss of the high-temperature liquid during transmission, ensuring that the temperature of the liquid after heating is high, and meeting the actual use requirements. At the same time, in order to avoid the risk of the nano coating 7502 and the heating coil 7503 falling off due to corrosion by the liquid, corrosive gas, etc., a double quartz tube 7504 is also arranged outside the heating quartz tube 7501 to improve the heat resistance, thereby avoiding the failure caused by the falling off of the nano coating 7502 or the corrosion of the heating coil 7503.

[0063] In addition, a secondary temperature sensor 752 and a secondary air control valve 753 are provided at the front end of the heating part 750, so that the temperature of the liquid medicine after the secondary heating and the opening and closing of the liquid medicine can be detected in real time, and the temperature of the liquid medicine can be detected in real time to meet actual cleaning needs.

[0064] For further information, see Figure 6 and Figure 7 The nitrogen charging part 751 includes a nitrogen pipeline 7510 connected to N2, and a nitrogen manual valve 7511, a nitrogen pressure reducing valve 7512, a nitrogen pressure gauge 7513, a nitrogen solenoid valve 7514 and a nitrogen flow meter 7515 are sequentially provided on the nitrogen pipeline 7510. A relief valve 7516 is also connected in parallel to the front end of the nitrogen flow meter 7515 on the nitrogen pipeline; a monitoring pressure gauge 7517 is also provided at the front end of the nitrogen flow meter 7515 and the relief valve 7516 in parallel.

[0065] In this embodiment, the nitrogen filling part 751 is used to provide nitrogen, and its functions are as follows:

[0066] 1. Fill N2 into the interlayer between the double quartz tube 7504 and the heating quartz tube 7501 to place the hot quartz tube 7501 in an anaerobic environment to prevent oxidation and aging of the heating coil 7503 and the electrode.

[0067] 2. Used to detect whether the heating quartz tube 7501 is broken or damaged. When starting, fill the interlayer of the double quartz tube 7504 and the heating quartz tube 7501 with nitrogen at a constant pressure at room temperature, and close the nitrogen solenoid valve 7514. During the pressure holding period, as the heater heats up, the nitrogen expands, the pressure of the quartz interlayer increases, and the nitrogen is released by the overflow valve 7516 to ensure safety and constant pressure.

[0068] If the pressure P2 detected by the monitoring pressure gauge 7517 does not decrease, it indicates safety; if the pressure P2 detected by the monitoring pressure gauge 7517 decreases significantly, it indicates a leak and the machine needs to be shut down for inspection to manually check whether the quartz tube is broken or the joint is leaking.

[0069] In summary, in the wafer high-temperature cleaning and etching equipment of the present invention, the secondary heating is closer to the terminal liquid nozzle outlet and is installed inside the frame 1, so the heating efficiency is high and the temperature loss is small.

[0070] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer high temperature cleaning and etching equipment, characterized in that: include: Frame (1); A cleaning chamber (2) is arranged in the frame (1); A rotating platform (3) is arranged in the cleaning chamber (2), and a wafer (8) is clamped on the rotating platform (3); A protective component (4) is disposed above the wafer (8) and is capable of being raised and lowered and rotated, and a liquid inlet hole (40) is provided on the protective component (4); At least two liquid medicine nozzles (5) are arranged above the protective component (4) in an adjustable position, and the liquid medicine nozzles (5) are used to spray the high-temperature liquid medicine through the liquid inlet hole (40) onto the wafer (8) via the transmission of the high-temperature liquid medicine transmission module (7); at least one flushing nozzle (6), which is adjustable in position and is disposed above the protective component (4), and is used to spray flushing liquid onto the wafer (8) through the liquid inlet hole (40); When any one of the liquid medicine nozzles (5) sprays the high-temperature liquid medicine onto the wafer (8), the liquid medicine nozzle (5) is reset, and the flushing nozzle (6) sprays the flushing liquid onto the wafer (8) to form a water film. At the same time, the wafer (8) rotates to drive the water film to move spirally from the center to the outer edge and be thrown out. At this time, the flushing nozzle (6) is always in an open state to ensure that there is a water film on the wafer (8). Then, after the protective component (4) is lowered, it moves up and down and rotates within the height where the water film exists to achieve oscillating washing of the lower surface of the protective component (4).

2. The wafer high temperature cleaning and etching equipment according to claim 1, characterized in that: The protective component (4) is a heat-insulating plate or a splash-proof plate.

3. The wafer high temperature cleaning and etching equipment as claimed in claim 1, characterized in that: The protective component (4) is rotatably arranged above the wafer (8) via a hollow rotating mechanism (41); the hollow rotating mechanism (41) is arranged on the lifting mechanism (42), and the lifting mechanism (42) drives the hollow rotating mechanism to move up and down.

4. The wafer high temperature cleaning and etching equipment as claimed in claim 1, characterized in that: When the protective component (4) is lowered to a height of 1-2 mm between the lower surface of the protective component (4) and the wafer (8), the flushing nozzle (6) sprays the flushing liquid onto the wafer (8) through the liquid inlet hole (40), and a water film is formed between the protective component (4) and the wafer (8).

5. The wafer high temperature cleaning and etching equipment as claimed in claim 1, characterized in that: The liquid medicine nozzle (5) and the flushing nozzle (6) are arranged above the liquid inlet hole (40) in an adjustable manner via corresponding multi-axis mechanical arms.

6. The wafer high temperature cleaning and etching equipment as claimed in claim 1, characterized in that: The high-temperature liquid medicine transmission module (7) comprises a liquid medicine tank (70), a heating rod (71), a liquid delivery channel (72), a liquid return channel (73), a valve body control box (74) and a secondary heating unit (75); the liquid medicine tank (70) is arranged outside the frame (1); the liquid medicine tank (70) contains liquid medicine that can be heated by the heating rod (71); when the liquid medicine in the liquid medicine tank (70) is transported via the liquid delivery channel (72), it is secondary heated by the secondary heating unit (75) in the valve body control box (74) in the frame (1) and then transported to the liquid medicine nozzle (5); the liquid return channel (73) is connected to the end of the liquid delivery channel (72) and is used for the liquid medicine to return to the liquid medicine tank (70).

7. The wafer high temperature cleaning and etching equipment as claimed in claim 6, characterized in that: The liquid delivery channel (72) comprises a liquid delivery pipeline (720), on which are sequentially arranged a liquid delivery pump (721) connected to the liquid medicine in the liquid medicine tank (70), a first liquid delivery air-controlled valve (722), a liquid delivery manual valve (723), a second liquid delivery manual valve (724), a second liquid delivery air-controlled valve (725) and a liquid delivery temperature sensor (726).

8. The high temperature wafer cleaning and etching equipment according to claim 7, characterized in that: The liquid return channel (73) comprises a liquid return pipeline (730); one end of the liquid return pipeline (730) is in communication with the liquid medicine tank (70), and the other end is located between the liquid delivery temperature sensor (725) and the third liquid delivery air control valve (726); a flow regulating manual valve (731), a back pressure valve (732) and a liquid return air control valve (733) are sequentially arranged on the liquid return pipeline (730).

9. The wafer high temperature cleaning and etching equipment as claimed in claim 6, characterized in that: The secondary temperature rising part (75) comprises a temperature rising part (750) and a nitrogen filling part (751); the temperature rising part (750) comprises a heating quartz tube (7501), and a nano coating (7502) is provided on the heating quartz tube (7501); a heating coil (7503) is provided on the nano coating (7502); a double quartz tube (7504) is further provided outside the heating quartz tube (7501); one end of the double quartz tube (7504) is connected to the nitrogen filling part (751), and the other end of the cable (7506) led out from the heating coil (7503) is connected to an external power supply, wherein the cable (7506) is sealed by quartz (7505) at the place where it passes through the double quartz tube (7504).

10. The high temperature wafer cleaning and etching equipment according to claim 9, characterized in that: The nitrogen charging part (751) comprises a nitrogen pipeline (7510) in communication with nitrogen, and the nitrogen pipeline (7510) is provided with a nitrogen manual valve (7511), a nitrogen pressure reducing valve (7512), a nitrogen pressure gauge (7513), a nitrogen solenoid valve (7514), and a nitrogen flow meter (7515) in sequence; an overflow valve (7516) is also connected in parallel to the front end of the nitrogen flow meter (7515) on the nitrogen pipeline (7510); and a monitoring pressure gauge (7517) is also provided at the front end after the nitrogen flow meter (7515) and the overflow valve (7516) are connected in parallel.

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