Chip packaging device with precise positioning structure and method

Abstract

The invention relates to the technical field of chip processing, and discloses a chip packaging device with a precise positioning structure, which comprises a positioning box, an operation box arranged in the positioning box, an extrusion assembly arranged at the top of the operation box, an edge grinding assembly arranged in the operation box, a slag removal assembly arranged in the operation box, and a control assembly arranged in the operation box, through cooperative use of an operation box and an extrusion assembly, the operation box takes a chip, then a driving air cylinder is started, the driving air cylinder drives a supporting plate to move through a telescopic column, the supporting plate drives a movable barrel to move through a fixed barrel, then the operation box is driven to descend, and meanwhile, the operation box extrudes a first spring through the movable barrel; and when the first spring is compressed by half by the moving cylinder, the chip at the bottom of the operation box is tightly attached to the substrate, so that the gel between the chip and the substrate does not have bubbles, and the effect of preventing bubbles is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing, and in particular to a chip packaging device and method with a precise positioning structure. Background Art

[0002] A chip, also known as an integrated circuit, refers to a large number of microelectronic devices integrated on a small semiconductor substrate to perform specific electronic functions. Chip packaging is the process of connecting the manufactured semiconductor chip and the substrate through gel and providing electrical connection and physical support. Packaging not only protects the fragile chip from environmental factors (such as moisture, dust, etc.), but also ensures that the chip can be properly connected to the external circuit.

[0003] Publication No. CN116895599B discloses a chip packaging structure, a chip packaging device and a chip packaging method, including: a workbench, two first motors are fixedly connected to the inside of the workbench, the output ends of the two first motors are fixedly connected to a first reciprocating screw rod, the outer sides of the first reciprocating screw rod are threadedly connected to two first threaded plates, and the two ends of the two first threaded plates are fixedly connected to a first rack. By arranging a first motor, a first reciprocating screw rod, a first threaded plate, a first rack rod, a first fixed plate, a first gear, a driving column, a return plate, a first roller, a second limit rod, a first spring and a second roller, the second roller can be easily moved out to move the position of the present invention according to the needs of use, and then the second roller can be retracted into the workbench.

[0004] Although the above application and the prior art can prevent the workbench from moving when the workers are performing packaging work, thereby providing protection for the packaging work, air bubbles will appear at the gel adhesion between the substrate and the chip when the device and the prior art are packaging and connecting the chip. The formation of air bubbles will reduce the service life of the chip, and the gel will overflow when the chip is connected to the substrate. The overflowed gel will affect the packaging quality of the chip. Therefore, the excess gel needs to be processed, and when the excess gel is processed, the residue of the processed gel will adhere to the top of the substrate, thereby affecting the subsequent packaging inspection. Therefore, we propose a chip packaging device and method with a precise positioning structure. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] In view of the deficiencies in the prior art, the present invention provides a chip packaging device and method with a precise positioning structure, which has the advantages of preventing bubbling, overflow cleaning and preventing residue, etc., and solves the problem that air bubbles will appear at the gel adhesion between the substrate and the chip when the chip is packaged and connected in the above-mentioned application and the prior art, and the formation of air bubbles will reduce the service life of the chip, and when the chip is connected to the substrate, the gel will overflow, and the overflowed gel will affect the packaging quality of the chip. Therefore, the excess gel needs to be processed, and when the excess gel is processed, the residue of the processed gel will adhere to the top of the substrate, thereby affecting the subsequent packaging inspection.

[0007] (II) Technical solution

[0008] In order to achieve the above-mentioned purposes of preventing bubbling, overflow cleaning and preventing residue, the present invention provides the following technical solutions: a chip packaging device with a precise positioning structure, comprising: a positioning box and an operating box arranged inside the positioning box,

[0009] A communication groove is provided at the bottom of the operation box;

[0010] A reciprocating groove is provided at the bottom of the operation box;

[0011] An extrusion assembly is arranged on the top of the operation box and is used to squeeze the chip and the substrate so that the chip and the gel on the top of the substrate are adhered;

[0012] An edge grinding assembly is arranged inside the operation box and is used to perform template processing on the gel solidified around the chip so that the periphery of the chip is not covered by the gel;

[0013] The slag cleaning component is arranged inside the operation box and is used to clean the gel particles polished by the edge grinding component to prevent the gel particles from remaining on the top of the substrate and affecting the subsequent measurement of the chip appearance.

[0014] Furthermore, the extrusion assembly includes a driving cylinder arranged inside the positioning box, the output end of the driving cylinder is differentially connected to a telescopic column, the bottom of the telescopic column is fixedly connected to a support plate, the bottom of the support plate is fixedly connected to a fixed cylinder, the interior of the fixed cylinder is fixedly connected to a first spring, the interior of the fixed cylinder is slidably connected to a moving cylinder via a key groove, one end of the moving cylinder is fixedly connected to one end of the first spring, and the end of the moving cylinder away from the first spring is fixedly connected to the top of the operating box.

[0015] Furthermore, the edge grinding assembly includes a drive motor fixedly connected to one side of the operating box through a support frame, the output end of the drive motor is fixedly connected to a drive rod, the end of the drive rod away from the drive motor is fixedly connected to a drive disk, and the end of the drive disk away from the drive rod is fixedly connected to a push rod.

[0016] Furthermore, the edge grinding assembly also includes a main push inclined plate and a secondary push inclined plate arranged inside the operating box, a push groove is opened on one side of the main push inclined plate, the push rod is arranged inside the push groove, the bottom of the main push inclined plate and the secondary push inclined plate are fixedly connected with a telescopic rod, the bottom of the telescopic rod is fixedly connected with a grinding plate, and the main push inclined plate and the secondary push inclined plate are squeezed and matched with each other.

[0017] Furthermore, the tops of the main push inclined plate and the auxiliary push inclined plate are fixedly connected with a plurality of power-assisting sliders, the interiors of the plurality of power-assisting sliders are fixedly connected with rotating rods, the surfaces of the rotating rods are rotatably connected with rollers, and the plurality of power-assisting sliders are slidably connected inside the operating box.

[0018] Furthermore, a connecting box is fixedly connected to the bottom of the operating box, one end of the connecting box is fixedly connected to a blowing frame, the slag cleaning assembly includes an active sprocket fixedly connected to the surface of the driving rod and a first rotating rod rotatably connected to the inside of the connecting box, a driven sprocket and a plurality of main fan blades are fixedly connected to the surface of the first rotating rod, and the driven sprocket and the active sprocket are transmitted by a chain.

[0019] Furthermore, the slag cleaning assembly also includes a plurality of driving teeth fixedly connected to the surface of the auxiliary push inclined plate and three second rotating rods rotatably connected to the inside of the operating box. The surfaces of the three second rotating rods are fixedly connected with driving gears and active bevel gears, and the driving gears are meshed with the plurality of driving teeth for transmission.

[0020] Furthermore, the slag cleaning assembly also includes a third rotating rod rotatably connected to the inside of the connecting box, and a driven bevel gear and a plurality of auxiliary fan blades are fixedly connected to the surface of the third rotating rod, and the driven bevel gear is meshed with the driving bevel gear for transmission.

[0021] Furthermore, a control panel is provided on the surface of the positioning box, a positioning adjustment component is provided inside the positioning box, and the positioning adjustment component can adjust the position of the extrusion component; a suction component is provided at the bottom of the operating box, and the suction component can take the chip; a glue squeezing component is provided inside the positioning box, and the glue squeezing component can lay gel on the top position of the substrate so that the chip can adhere to the substrate.

[0022] The present invention also provides a chip packaging method with a precise positioning structure, and the chip packaging method specifically comprises the following steps:

[0023] Step 1: Place the chip on top of the substrate through the operating box so that the substrate and the chip fit together;

[0024] Step 2, start the extrusion component to apply pressure to the chip, so that the chip and the substrate are closely attached;

[0025] Step 3: When excess solid gel appears around the substrate and the chip, the edge grinding component is started to grind the solid gel around the substrate and the chip;

[0026] Step 4: When the edge grinding component is in operation, the slag cleaning component is also driven to operate, so that the slag cleaning component cleans the gel particles polished out by the edge grinding component, thereby preventing the gel particles from remaining on the top of the substrate.

[0027] (III) Beneficial effects

[0028] Compared with the prior art, the present invention provides a chip packaging device and method with a precise positioning structure, which has the following beneficial effects:

[0029] 1. The chip packaging device and method with a precise positioning structure, through the coordinated use of an operating box and an extrusion assembly, the operating box takes the chip, and then starts the driving cylinder, the driving cylinder drives the support plate to move through the telescopic column, so that the support plate drives the moving cylinder to move through the fixed cylinder, and then drives the operating box to descend, when the chip and the substrate are in contact with each other, the operating box continues to move, at the same time, the operating box squeezes the first spring through the moving cylinder, so that the moving cylinder is gradually stored in the fixed cylinder, when the first spring is compressed by half by the moving cylinder, the chip at the bottom of the operating box is tightly fitted with the substrate, so that no bubbles will appear in the gel between the chip and the substrate, thereby achieving the effect of preventing bubbling.

[0030] 2. The chip packaging device and method with a precise positioning structure, through the coordinated use of the operating box and the edge grinding assembly, starts the driving motor, the driving motor drives the driving disk to rotate through the driving rod, the driving disk drives the main push inclined plate to move back and forth through the pushing rod and the pushing groove, the main push inclined plate drives the auxiliary push inclined plate to move through extrusion, so that the main push inclined plate and the auxiliary push inclined plate drive the grinding plate to move through the telescopic rod, and then the grinding plate rubs and cleans the excess solid gel, so that the excess solid gel no longer contacts the substrate or the chip, thereby achieving the effect of overflow cleaning.

[0031] 3. The chip packaging device and method with a precise positioning structure, through the coordinated use of the edge grinding component and the slag cleaning component, the driving rod rotates and at the same time drives the active sprocket to rotate, the active sprocket drives the driven sprocket to rotate through the chain, so that the first rotating rod drives the main fan blade to rotate, at the same time, the secondary push inclined plate drives a number of driving teeth to move when moving, so that the driving gear drives the second rotating rod to rotate, the second rotating rod drives the driven bevel gear to rotate through the active bevel gear, so that the third rotating rod drives the secondary fan blade to rotate, the wind blown out by the main fan blade and the secondary fan blade will blow away the gel particles polished by the grinding sand plate, thereby avoiding the gel particles from remaining on the top of the substrate, thereby achieving the effect of preventing residue.

[0032] Other features and advantages of the present invention will be described in the following description, and part of them will become obvious from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the three-dimensional structure of the positioning box of the present invention;

[0034] Figure 2 It is a schematic diagram of the cross-sectional three-dimensional structure of the positioning box of the present invention;

[0035] Figure 3 It is a three-dimensional schematic diagram of the internal structure of the positioning box of the present invention;

[0036] Figure 4 It is a schematic diagram of the cross-sectional three-dimensional structure of the fixing tube of the present invention;

[0037] Figure 5 This is a schematic diagram of the three-dimensional structure of the operating box of the present invention;

[0038] Figure 6 This is a schematic diagram of the three-dimensional structure of the operating box of the present invention from another perspective;

[0039] Figure 7 This is a schematic diagram of the cutaway three-dimensional structure of the operating box of the present invention;

[0040] Figure 8 It is a three-dimensional schematic diagram of the internal structure of the operating box of the present invention;

[0041] Fig. 9 It is a schematic diagram of the three-dimensional structure of the main push inclined plate and the auxiliary push inclined plate of the present invention;

[0042] Fig.10 This is a schematic diagram of the three-dimensional structure of the main push inclined plate of the present invention;

[0043] Fig.11 It is a schematic diagram of the three-dimensional structure of the driving motor of the present invention;

[0044] Fig.12 It is a schematic diagram of the three-dimensional structure of the operating box of the present invention;

[0045] Fig.13 It is a schematic diagram of the three-dimensional structure of the first rotating rod of the present invention;

[0046] Fig.14 It is a schematic diagram of the three-dimensional structure of the second rotating rod and the third rotating rod of the present invention.

[0047] In the figure: 1, positioning box; 11, control panel; 12, operation box; 121, connecting slot; 122, reciprocating slot; 123, connecting box; 124, blowing frame; 2, extrusion assembly; 21, driving cylinder; 211, telescopic column; 22, support plate; 221, fixed cylinder; 222, first spring; 223, moving cylinder; 3, edge grinding assembly; 31, driving motor; 311, driving rod; 312, driving disk; 313, pushing rod; 32, main push inclined plate; 32 1. Pushing groove; 33. Auxiliary push inclined plate; 34. Power-assisting slider; 341. Rotating rod; 342. Roller; 35. Telescopic rod; 351. Grinding plate; 4. Slag cleaning assembly; 41. Driving sprocket; 411. Chain; 42. First rotating rod; 421. Driven sprocket; 422. Main blade; 43. Driving teeth; 44. Second rotating rod; 441. Driving gear; 442. Driving bevel gear; 45. Third rotating rod; 451. Driven bevel gear; 452. Auxiliary blade. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] In the embodiments of the present application, the devices or elements referred to or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise precisely and specifically specified.

[0050] For specific embodiment 1, please refer to Figures 1 to 4 A chip packaging device with a precise positioning structure comprises: a positioning box 1 and an operating box 12 arranged inside the positioning box 1,

[0051] The connecting groove 121 is provided at the bottom of the operation box 12. The surface of the positioning box 1 is provided with a control panel 11. The interior of the positioning box 1 is provided with a position adjustment component, which can adjust the position of the extrusion component 2. The bottom of the operation box 12 is provided with a suction component, which can take the chip. The interior of the positioning box 1 is provided with a glue squeezing component, which can lay gel on the top position of the substrate so that the chip can be adhered to the substrate.

[0052] A reciprocating groove 122 is provided at the bottom of the operation box 12;

[0053] The extrusion assembly 2 is arranged on the top of the operation box 12, and is used for extruding the chip and the substrate so that the chip and the gel on the top of the substrate are adhered. The extrusion assembly 2 includes a driving cylinder 21 arranged inside the positioning box 1, and the output end of the driving cylinder 21 is differentially connected with a telescopic column 211, and the bottom of the telescopic column 211 is fixedly connected with a support plate 22, and the bottom of the support plate 22 is fixedly connected with a fixed cylinder 221, and the interior of the fixed cylinder 221 is fixedly connected with a first spring 222, and the interior of the fixed cylinder 221 is slidably connected with a moving cylinder 223 through a key groove, and one end of the moving cylinder 223 is fixedly connected with one end of the first spring 222, and the end of the moving cylinder 223 away from the first spring 222 is fixedly connected with the top of the operation box 12;

[0054] The edge grinding assembly 3 is arranged inside the operation box 12 and is used to perform template processing on the gel solidified around the chip so that the periphery of the chip is not covered by the gel;

[0055] The slag cleaning component 4 is arranged inside the operating box 12 and is used to clean the gel particles polished by the edge grinding component 3 to prevent the gel particles from remaining on the top of the substrate and affecting the subsequent measurement of the chip appearance;

[0056] It should be noted that the positioning assembly includes a driving motor fixedly connected to the interior of the positioning box 1, the output end of the driving motor is fixedly connected to a first screw, the surface of the first screw is threadedly connected to a connecting block, the connecting block is slidably connected to the interior of the positioning box 1, the bottom of the connecting block is fixedly connected to a connecting box, the interior of the connecting box is fixedly connected to a first cylinder, the output end of the first cylinder is differentially connected to a telescopic strip, the surface of the telescopic strip is fixedly connected to a fixed block, the bottom of the fixed block is fixedly connected to a driving cylinder 21, the driving motor drives the connecting block to move through the first screw, so that the connecting block drives the connecting box to move, and then drives the extrusion assembly 2 to move horizontally, and the first cylinder drives the connecting block through the telescopic strip The fixed block moves, so that the fixed block drives the extrusion assembly 2 to move longitudinally, so as to ensure that the chip can be accurately moved to the top of the substrate. Two conveyor belts are arranged inside the positioning box 1, and the substrate and the chip are arranged on the top of the two conveyor belts respectively. The suction assembly includes a suction pump fixedly connected to the inside of the operation box 12, and a suction cup is arranged at the bottom of the suction pump. The suction cup is used to take the chip. The glue squeezing assembly includes a second motor and a fixed tube arranged inside the positioning box 1. The output end of the second motor is fixedly connected to an auger, and the auger is arranged inside the fixed tube. A glue squeezing frame is arranged at one end of the fixed tube. The deformation force of the first spring 222 is smaller than the strength of the chip itself.

[0057] When the substrate and the chip need to be closely fitted, the suction assembly takes the chip and then starts the driving cylinder 21. The driving cylinder 21 drives the support plate 22 to move through the telescopic column 211, so that the support plate 22 drives the moving cylinder 223 to move through the fixed cylinder 221, thereby driving the operation box 12 to descend. When the chip and the substrate are closely fitted, the operation box 12 continues to move. At the same time, the operation box 12 squeezes the first spring 222 through the moving cylinder 223, so that the moving cylinder 223 is gradually stored in the fixed cylinder 221. When the first spring 222 is compressed by half by the moving cylinder 223, the chip at the bottom of the operation box 12 is closely fitted to the substrate, so that the gel between the chip and the substrate is closely fitted without bubbles.

[0058] For specific embodiment 2, please refer to Figures 1 to 12 According to a chip packaging device with a precise positioning structure provided in the first specific embodiment, this embodiment provides a further technical solution:

[0059] The edge grinding assembly 3 includes a driving motor 31 fixedly connected to one side of the operating box 12 through a supporting frame, the output end of the driving motor 31 is fixedly connected to a driving rod 311, the end of the driving rod 311 away from the driving motor 31 is fixedly connected to a driving disk 312, and the end of the driving disk 312 away from the driving rod 311 is fixedly connected to a pushing rod 313. The edge grinding assembly 3 also includes a main push inclined plate 32 and an auxiliary push inclined plate 33 arranged inside the operating box 12. One side of the main push inclined plate 32 is provided with a pushing groove 321, and the pushing rod 313 is arranged on the pushing groove 321. Inside the movable groove 321, the bottom of the main push inclined plate 32 and the auxiliary push inclined plate 33 are fixedly connected with a telescopic rod 35, the bottom of the telescopic rod 35 is fixedly connected with a grinding plate 351, the main push inclined plate 32 and the auxiliary push inclined plate 33 are pressed and matched with each other, the top of the main push inclined plate 32 and the auxiliary push inclined plate 33 are fixedly connected with a plurality of power-assisting sliders 34, the inside of the plurality of power-assisting sliders 34 are fixedly connected with a rotating rod 341, the surface of the rotating rod 341 is rotatably connected with a roller 342, and the plurality of power-assisting sliders 34 are slidably connected to the inside of the operating box 12;

[0060] It should be noted that the reciprocating groove 122 facilitates the movement of the telescopic rod 35, and the telescopic rod 35 can be electrically controlled to extend and retract. The shape of the grinding plate 351 can be set according to the shape of the chip, and is not limited here.

[0061] When the overflowed solidified gel needs to be cleaned, the driving motor 31 is started, and the driving motor 31 drives the driving disk 312 to rotate through the driving rod 311, and the driving disk 312 drives the main push inclined plate 32 to move back and forth through the pushing rod 313 and the pushing groove 321, and the main push inclined plate 32 drives the auxiliary push inclined plate 33 to move by squeezing, so that the main push inclined plate 32 and the auxiliary push inclined plate 33 drive the grinding plate 351 to move through the telescopic rod 35, and then the grinding plate 351 rubs and cleans the excess solid gel, so that the excess solid gel no longer contacts the substrate or the chip;

[0062] For specific embodiment 3, please refer to Figures 1 to 14 According to a chip packaging device with a precise positioning structure provided in the second specific embodiment, this embodiment provides a further technical solution:

[0063] The bottom of the operating box 12 is fixedly connected to a connecting box 123, one end of the connecting box 123 is fixedly connected to a blowing frame 124, the slag cleaning component 4 includes a driving sprocket 41 fixedly connected to the surface of the driving rod 311 and a first rotating rod 42 rotatably connected to the inside of the connecting box 123, the surface of the first rotating rod 42 is fixedly connected to a driven sprocket 421 and a plurality of main blades 422, the driven sprocket 421 and the driving sprocket 41 are driven by a chain 411, the slag cleaning component 4 also includes a driving sprocket 41 fixedly connected to the surface of the auxiliary push inclined plate 33 The slag cleaning component 4 further comprises a plurality of driving teeth 43 and three second rotating rods 44 rotatably connected to the inside of the operating box 12, the surfaces of the three second rotating rods 44 are fixedly connected with driving gears 441 and active bevel gears 442, the driving gears 441 and the plurality of driving teeth 43 are meshed for transmission, the slag cleaning component 4 further comprises a third rotating rod 45 rotatably connected to the inside of the connecting box 123, the surface of the third rotating rod 45 is fixedly connected with a driven bevel gear 451 and a plurality of auxiliary blades 452, the driven bevel gear 451 and the active bevel gear 442 are meshed for transmission;

[0064] It should be noted that the connecting groove 121 facilitates the operation of the chain 411, and the blowing frame 124 is tilted so that the wind blown by the main blades 422 and the auxiliary blades 452 can be blown toward the top of the substrate. When the main blades 422 and the auxiliary blades 452 rotate forward, the solid gel particles can be blown away, and when the main blades 422 and the auxiliary blades 452 rotate reversely, the solid gel particles can be sucked to keep the solid gel particles away from one end of the chip.

[0065] When the solid gel particles on the top of the substrate need to be cleaned, the driving rod 311 rotates while driving the active sprocket 41 to rotate, and the active sprocket 41 drives the driven sprocket 421 to rotate through the chain 411, so that the first rotating rod 42 drives the main fan blade 422 to rotate. At the same time, the secondary push inclined plate 33 drives a plurality of driving teeth 43 to move when moving, so that the driving gear 441 drives the second rotating rod 44 to rotate, and the second rotating rod 44 drives the driven bevel gear 451 to rotate through the active bevel gear 442, so that the third rotating rod 45 drives the secondary fan blade 452 to rotate, and the wind blown by the main fan blade 422 and the secondary fan blade 452 will blow away the gel particles polished by the sanding plate 351, thereby preventing the gel particles from remaining on the top of the substrate;

[0066] Specific embodiment 4, the present invention also provides a chip packaging method with a precise positioning structure, the chip packaging method specifically comprises the following steps:

[0067] Step 1: Place the chip on top of the substrate through the operation box 12 so that the substrate and the chip are attached to each other;

[0068] Step 2, start the extrusion component 2, so that the extrusion component 2 applies pressure to the chip, thereby making the chip and the substrate fit tightly;

[0069] Step 3: when excess solid gel appears around the substrate and the chip, start the edge grinding component 3 to grind the solid gel around the substrate and the chip;

[0070] Step 4: When the edge grinding component 3 is in operation, the slag cleaning component 4 is driven to operate, so that the slag cleaning component 4 cleans the gel particles polished by the edge grinding component 3, thereby preventing the gel particles from remaining on the top of the substrate.

[0071] Working principle: When in use, the glue squeezing component attaches the gel to the top of the substrate, and then the chip is picked up by the suction component, and then the extrusion component 2 is moved to the top of the substrate by the positioning component. When the substrate and the chip need to be closely fitted, the suction component picks up the chip, and then the driving cylinder 21 is started. The driving cylinder 21 drives the support plate 22 to move through the telescopic column 211, so that the support plate 22 drives the moving cylinder 223 to move through the fixed cylinder 221, and then drives the operation box 12 to descend. When the chip and the substrate are fitted together, the operation box 12 is held. At the same time, the operating box 12 squeezes the first spring 222 through the moving cylinder 223, so that the moving cylinder 223 is gradually stored in the fixed cylinder 221. When the first spring 222 is half compressed by the moving cylinder 223, the chip at the bottom of the operating box 12 is tightly fitted with the substrate, so that the gel between the chip and the substrate is tightly fitted without bubbles. Then the liquid gel is naturally cooled. When it is necessary to clean the overflowed solidified gel, the driving motor 31 is started, and the driving motor 31 drives the driving disk 31 through the driving rod 311. 2 rotates, the driving disc 312 drives the main push inclined plate 32 to reciprocate through the pushing rod 313 and the pushing groove 321, and the main push inclined plate 32 drives the auxiliary push inclined plate 33 to move by squeezing, so that the main push inclined plate 32 and the auxiliary push inclined plate 33 drive the grinding plate 351 to move through the telescopic rod 35, and then the grinding plate 351 rubs and cleans the excess solid gel, so that the excess solid gel no longer contacts the substrate or chip. When it is necessary to clean the solid gel particles on the top of the substrate, the driving rod 311 rotates and drives the driving sprocket 41 to rotate, and the driving sprocket 41 rotates. The chain 411 drives the driven sprocket 421 to rotate, so that the first rotating rod 42 drives the main fan blades 422 to rotate. At the same time, the auxiliary push inclined plate 33 drives a number of driving teeth 43 to move when moving, so that the driving gear 441 drives the second rotating rod 44 to rotate, and the second rotating rod 44 drives the driven bevel gear 451 to rotate through the active bevel gear 442, so that the third rotating rod 45 drives the auxiliary fan blades 452 to rotate, and the wind blown out by the main fan blades 422 and the auxiliary fan blades 452 will blow away the gel particles polished by the sanding plate 351, thereby preventing the gel particles from remaining on the top of the substrate.

[0072] The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0073] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0074] Parallel: The parallelism defined in this application is not limited to absolute parallelism. This definition of parallelism can be understood as basic parallelism, which allows for non-absolute parallelism due to factors such as assembly tolerance, design tolerance, and the influence of structural flatness. Small angular errors are allowed. For example, an assembly error range of less than 10 degrees can be understood as a parallel relationship.

[0075] Vertical: The verticality defined in this application is not limited to an absolute vertical intersection relationship (angle of 90 degrees). It allows for non-absolute vertical intersection relationships caused by factors such as assembly tolerance, design tolerance, and influence of structural flatness. It also allows for errors in a small angle range. For example, the assembly error range of 80 to 100 degrees can be understood as a vertical relationship.

[0076] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip packaging device with a precise positioning structure, comprising: The positioning box (1) and the operating box (12) arranged inside the positioning box (1) are characterized in that: A communication groove (121) is provided at the bottom of the operation box (12); A reciprocating groove (122) is provided at the bottom of the operation box (12); An extrusion assembly (2) is arranged on the top of the operation box (12) and is used to extrude the chip and the substrate so that the chip and the gel on the top of the substrate are adhered to each other; An edge grinding assembly (3) is arranged inside the operation box (12) and is used to perform template processing on the gel solidified around the chip so that the periphery of the chip is not covered by the gel; The slag cleaning component (4) is arranged inside the operating box (12) and is used to clean the gel particles polished by the edge grinding component (3) to prevent the gel particles from remaining on the top of the substrate and affecting the subsequent measurement of the chip appearance.

2. The chip packaging device with a precise positioning structure according to claim 1, characterized in that: The extrusion assembly (2) comprises a driving cylinder (21) arranged inside the positioning box (1); the output end of the driving cylinder (21) is differentially connected to a telescopic column (211); the bottom of the telescopic column (211) is fixedly connected to a support plate (22); the bottom of the support plate (22) is fixedly connected to a fixed cylinder (221); the interior of the fixed cylinder (221) is fixedly connected to a first spring (222); the interior of the fixed cylinder (221) is slidably connected to a moving cylinder (223) via a keyway; one end of the moving cylinder (223) is fixedly connected to one end of the first spring (222); and one end of the moving cylinder (223) away from the first spring (222) is fixedly connected to the top of the operating box (12).

3. The chip packaging device with a precise positioning structure according to claim 1, characterized in that: The edge grinding assembly (3) comprises a driving motor (31) fixedly connected to one side of the operating box (12) via a supporting frame, the output end of the driving motor (31) is fixedly connected to a driving rod (311), the end of the driving rod (311) away from the driving motor (31) is fixedly connected to a driving disk (312), and the end of the driving disk (312) away from the driving rod (311) is fixedly connected to a pushing rod (313).

4. The chip packaging device with a precise positioning structure according to claim 3, characterized in that: The edge grinding assembly (3) also includes a main push inclined plate (32) and an auxiliary push inclined plate (33) arranged inside the operating box (12); a push groove (321) is opened on one side of the main push inclined plate (32); the push rod (313) is arranged inside the push groove (321); the bottoms of the main push inclined plate (32) and the auxiliary push inclined plate (33) are fixedly connected with a telescopic rod (35); the bottoms of the telescopic rod (35) are fixedly connected with a grinding plate (351); the main push inclined plate (32) and the auxiliary push inclined plate (33) are pressed and matched with each other.

5. The chip packaging device with a precise positioning structure according to claim 4, characterized in that: The tops of the main push inclined plate (32) and the auxiliary push inclined plate (33) are fixedly connected with a plurality of power-assisting sliding blocks (34), the interiors of the plurality of power-assisting sliding blocks (34) are fixedly connected with rotating rods (341), the surfaces of the rotating rods (341) are rotatably connected with rollers (342), and the plurality of power-assisting sliding blocks (34) are slidably connected to the interior of the operating box (12).

6. The chip packaging device with a precise positioning structure according to claim 4, characterized in that: The bottom of the operation box (12) is fixedly connected to a connecting box (123), one end of the connecting box (123) is fixedly connected to a blowing frame (124), the slag cleaning assembly (4) comprises a driving sprocket (41) fixedly connected to the surface of the driving rod (311) and a first rotating rod (42) rotatably connected to the inside of the connecting box (123), the surface of the first rotating rod (42) is fixedly connected to a driven sprocket (421) and a plurality of main blades (422), and the driven sprocket (421) and the driving sprocket (41) are driven by a chain (411).

7. The chip packaging device with a precise positioning structure according to claim 6, characterized in that: The slag cleaning assembly (4) further comprises a plurality of driving teeth (43) fixedly connected to the surface of the auxiliary push inclined plate (33) and three second rotating rods (44) rotatably connected to the inside of the operating box (12); the surfaces of the three second rotating rods (44) are all fixedly connected with driving gears (441) and active bevel gears (442); the driving gear (441) is meshed with the plurality of driving teeth (43) for transmission.

8. The chip packaging device with a precise positioning structure according to claim 7, characterized in that: The slag cleaning assembly (4) also includes a third rotating rod (45) rotatably connected to the inside of the connecting box (123); a driven bevel gear (451) and a plurality of auxiliary blades (452) are fixedly connected to the surface of the third rotating rod (45); and the driven bevel gear (451) is meshed with the driving bevel gear (442) for transmission.

9. The chip packaging device with a precise positioning structure according to claim 1, characterized in that: A control panel (11) is arranged on the surface of the positioning box (1), a positioning adjustment component is arranged inside the positioning box (1), and the positioning adjustment component is capable of adjusting the position of the extrusion component (2); a suction component is arranged at the bottom of the operation box (12), and the suction component is capable of taking the chip; a glue squeezing component is arranged inside the positioning box (1), and the glue squeezing component is capable of laying gel on the top position of the substrate so that the chip and the substrate can be adhered to each other.

10. A chip packaging method with a precise positioning structure, using a chip packaging device with a precise positioning structure as claimed in any one of claims 1 to 9, the chip packaging method specifically comprising the following steps: Step 1: placing the chip on top of the substrate through the operating box (12) so that the substrate and the chip are attached to each other; Step 2, starting the extrusion component (2) to apply pressure to the chip, thereby making the chip and the substrate fit tightly together; Step 3: when excess solid gel appears around the substrate and the chip, start the edge grinding component (3), and the edge grinding component (3) performs edge grinding on the solid gel around the substrate and the chip; Step 4: When the edge grinding component (3) is in operation, the slag cleaning component (4) is driven to operate, so that the slag cleaning component (4) cleans the gel particles polished by the edge grinding component (3), thereby preventing the gel particles from remaining on the top of the substrate.

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